1249221 案號 93140481 年狄妒28日 修正 五、發明說明（1) 【發明所屬之技術領域] 本發明係有關一種晶片挾持器之改良結構，特別係關 於一種利用斜面縮短間隙距離和圓形半徑方向對稱觀念來 校正中心和密閉效果之晶片袜持器改良結構。 【先前技術】 第一圖係習知晶片夾持器内部構造剖面圖。第二圖係 習知晶片夾持器結合後之剖面圖。請參照第一圖及第二 圖。 習知之晶片夾持裝置2〇包含有一用來放置並旋轉一半 導體晶片之晶片夾持平台21、一以緊配合方式設於晶片夾 持平台21的底面中央孔内的直筒襯套22，其係用來靜配合 置放在馬達主轴23頂部，馬達主轴23中心設有一通氣孔 24，直接通到抽真空泵浦（圖中未示）。 然而晶片夾持平台21之主轴直筒襯套22設計，其内孔 為圓筒式’在晶片夾持平台更換頻繁的環境下直筒襯套與 馬達主轴介面容易磨損，其卓要因素有三個··（1)為採取 的磨損，（2 )旋轉滑動磨損，j 3)高轉速之震動磨損。塑膠 内孔直筒襯套22磨損後，第二個問題為孔徑漸大且真圓度-下降，如此晶片夾持平台21之旋轉平面飄動將漸形明顯， 間隙造成晶片夾持平台21旋*慣性矩變大，導致振動頻 繁，影響製程的塗佈均勻度及平坦度，對製程效果大打折 扣。第二個問題是磨損產生的間隙，使得真空性能下降， 晶片夾持力自然降低，直到晶片高速旋轉飛出破裂，良率 •降低’使得光阻塗佈機信賴度降低，真筒轴設計的抽真空1249221 Case No. 93140481 Di Di 28th Amendment 5, Invention Description (1) Technical Field of the Invention The present invention relates to an improved structure of a wafer holder, and more particularly to a method for shortening a gap distance and a circular radius by using a slope The symmetry concept is to correct the center and the sealing effect of the wafer sock to improve the structure. [Prior Art] The first figure is a cross-sectional view of the internal structure of a conventional wafer holder. The second figure is a cross-sectional view of a conventional wafer holder. Please refer to the first figure and the second figure. The conventional wafer clamping device 2 includes a wafer clamping platform 21 for placing and rotating a semiconductor wafer, and a straight sleeve 22 disposed in a central hole of the bottom surface of the wafer clamping platform 21 in a tight fit manner. It is placed on the top of the motor main shaft 23, and a vent hole 24 is provided in the center of the motor main shaft 23, and is directly connected to a vacuum pump (not shown). However, the spindle straight bushing 22 of the wafer clamping platform 21 is designed to have a cylindrical bore. In the environment where the wafer clamping platform is frequently replaced, the straight bushing and the motor spindle interface are easily worn, and there are three main factors. (1) For wear taken, (2) Rotating sliding wear, j 3) High-speed vibration wear. After the plastic inner hole straight sleeve 22 is worn, the second problem is that the aperture is gradually enlarged and the roundness is decreased, so that the rotation plane of the wafer clamping platform 21 will gradually become obvious, and the gap causes the wafer clamping platform 21 to rotate. When the moment becomes large, the vibration is frequent, affecting the uniformity and flatness of the coating, and the process effect is greatly reduced. The second problem is the gap generated by the wear, which causes the vacuum performance to drop, the wafer clamping force is naturally reduced, until the wafer is rotated at high speed and the rupture occurs, and the yield reduction is reduced, so that the reliability of the photoresist coater is reduced. Vacuum
第5頁 1249221 五、發明說明（2) 也沒有晶片夾持的方向 更換時的拔取力，因為 佈完，晶片夾持平台21 光阻被抽入馬達主轴23 膜’在晶片夾持平台21 施加的剪切力逐漸變大 用壽命因此產生嚴重的 為此本發明提出 減少晶片挾持器震動 性。第三個間題為晶片夾持平台21 光阻黏滞而變大，這是因為晶片塗 之平面與晶片背面少許之間隙，使 之抽氣道，黏滯在主轴上形成薄 更換時，無論在推入或拔取，所需 ，影響操作性能，晶片夾持器的使 縮短。 種晶片挾持器之改良結構，其係可 以增加良率，並延長使用壽命。 【發明内容】 構 本發明之主要目的在提供一種晶片挾持器之改 其係改善光阻塗佈不均和良率降低等問 構 Ϊ發明之另—目#在提供一種晶片挟持器之改良结 可分離式晶片挾持器内部改良結構的壽命。 為達上述之目的，本發明之晶片挾持器 ，由下而上依序在旋轉主轴车套設錐軸襯套、錐二二套及 ^片挾持平台，藉由旋轉主年傳遞扭矩給晶片执持器套由 對應之錐面密合，大幅降2 = 係藉由二者間相 平面跳動，對於製程設計彈“很大的助 :信賴，並且提高可分離式f片挾持器内部改ΐ結構“ 底下藉由具體實施例配合所附的圖 容易瞭解本發明之目的、“内t、：】：加說明，當更 ----奋特！及其所達成之 1249221 案號 93140481 五、發明說明（3) 效0 【實施方式】 触从^ i圖係本毛明之結構分解圖。第四圖係本發明之立 體、纟口構圖。請參照第三圖及第四圖。 ϋ發明的最佳實例中，晶片挾持器之改良結構係以 可以力離方式設於旋塗機台（spin_〇n c〇ater)中，且包含 有晶/夾持器30 (晶片挾持平台32/錐孔襯套3“錐軸襯套 3下6疋轉主軸38)，詳細介紹本實施例中晶片夾持器30如 *彳：^挾ί平：32之底部内孔裝有錐孔襯套34，裝設之 ^ 1 ’錐孔概套34與晶片挾持平台32之緊密 配合公差尺寸範圍為直栌 〇 4〜η ς ^ 、、 與晶片挾持器之中心輛夾角範圍為4。〜：套3錐I: f34 可以選用聚合物材質(一咖 ，月:Tefoln)〆這些材料可防止光阻沾粘、耐壓、耐磨 相和^性絕，等功能性材料’目的在使材料不易與空氣中 的士份產生氧化反應’ > 此設計有利於去除夾頭；面的 機溶劑，如高附著性的光阻等。錐孔襯套34下係設錐 ，套36，錐孔襯套34之内錐孔與錐軸襯細之外錐斜 合時，整個錐面完全貼附，錐孔襯套。 及阳片挾持千。32的重量將落在錐軸襯套％上，可以 孔襯套34及錐軸襯套36互相緊密配合，另外在用來動曰 片夹持器30的旋轉主軸38之上安置有錐軸襯套36 : 與雜轴觀^36係以緊配合形式固定在旋轉主軸38之頂 1249221 五 ’錐轴襯套36與旋轉主紅Q0 Jf之°，〜〇.1%，錐轴之緊密配合公差尺寸範圍為 度相同並緊密配人 襯套36之錐度與錐孔襯套34之錐 :心轴失角Γ圍 金屬或不銹鋼， 角，錐軸襯套36之材料可以選用 例中係採用馬達主軸。更換清潔，旋轉主軸38在本實施 旋轉挟持穩度更高，在本實施例在 以抽取处裔 +/ +達軸）之貫穿透氣孔係連接抽氣裝置 空裝置可Μ ώ μ曰貫施例中係採用真空裝置抽取空氣，真 放置在曰二曰曰片挾持器内抽取空氣，舉例來說將晶片 錐軸襯；36、\走2軸二晶：挾持平台32、錐孔襯套34、 密合外，ρ^轉軸3 各接觸面除了本身的重量提供 力相同^此讓各接觸面因真空裝置抽取空氣的方向與重 ，、並且形成真空狀態，達到更好的效果。 間隙w ϋ本务明之各接觸面採錐面配合，利用斜面可縮短 和密Η ^方法和圓幵》半徑方向對稱觀念來形成校正中心 面k 可大幅降低一般晶片塗佈製程在高轉速的平 位曹 和維持真空壓在一定壓力而不會洩漏，在中心定Page 5 1249221 V. INSTRUCTIONS (2) There is also no extraction force when the wafer is clamped in the direction of replacement, because the wafer holding platform 21 photoresist is drawn into the motor spindle 23 film 'applied on the wafer clamping platform 21 The shear force is gradually increased and the service life is severe. Therefore, the present invention proposes to reduce the vibration of the wafer holder. The third problem is that the wafer clamping platform 21 is viscous and becomes larger because the wafer is coated with a small gap between the plane and the back of the wafer, so that it is sucked and adhered to the spindle to form a thin replacement. Pushing or pulling, required, affecting the performance of the operation, the wafer holder is shortened. An improved structure of a wafer holder that increases yield and extends service life. SUMMARY OF THE INVENTION The main object of the present invention is to provide a wafer holder that improves the photoresist coating unevenness and yield reduction, etc., and provides an improved junction of a wafer holder. The life of the improved structure inside the split wafer holder. In order to achieve the above purpose, the wafer holder of the present invention is provided with a tapered shaft bushing, a cone 22 sleeve and a clamping platform on the rotating spindle car from bottom to top, and the torque is transmitted to the wafer by rotating the main year. The holder sleeve is closely closed by the corresponding cone surface, and the large drop 2 = is caused by the phase plane jump between the two. For the process design projectile, "great help: trust, and improve the internal structure of the separable f-chip holder. "The purpose of the present invention is easily understood by the specific embodiments in conjunction with the attached drawings. "Inner t,:]: Add a description, when more - Fen Te! and its reached 1249221 Case No. 93340481 V. Invention Explanation (3) Effect 0 [Embodiment] The structure of the figure is shown in the figure below. The fourth picture shows the three-dimensional and mouth-shaped composition of the present invention. Please refer to the third and fourth figures. In a preferred embodiment, the improved structure of the wafer holder is detachably disposed in a spin-on machine (spin_〇nc〇ater) and includes a crystal/clamp 30 (wafer holding platform 32/taper lining) Set 3 "cone shaft bushing 3 down 6 turns spindle 38", detailing the wafer clip in this embodiment The device 30 is, for example, *彳:^挟ί平: the inner hole of the bottom of the hole 32 is provided with a tapered hole bushing 34, and the tight fitting tolerance range of the mounting hole 1 and the wafer holding platform 32 is straight. 4~η ς ^ , , and the center of the wafer holder is in the range of 4. ~: Set of 3 cones I: f34 can be selected from polymer materials (a coffee, month: Tefoln) 〆 These materials can prevent photoresist sticking, pressure, wear and phase, and other functional materials' purpose The material is not easy to oxidize with the air in the taxi' > This design is beneficial to remove the chuck; the surface of the machine solvent, such as high adhesion photoresist. The tapered bore bushing 34 is provided with a taper, a sleeve 36, and the inner tapered bore of the tapered bore bushing 34 is tapered with the tapered bushing. The entire tapered surface is completely attached, and the tapered bore bushing is completely attached. And the Yang film holds thousands. The weight of 32 will fall on the tapered shaft bushing %, and the hole bushing 34 and the tapered shaft bushing 36 can be closely fitted to each other, and a tapered bushing is placed on the rotating main shaft 38 for the movable jaw holder 30. Socket 36: Fixed to the top of the rotating spindle 38 in a tight fit with the misaligned shaft ^36. The five 'cone shaft bushing 36 and the rotating main red Q0 Jf°, ~〇.1%, tight fit tolerance of the tapered shaft The range of dimensions is the same and closely matches the taper of the bushing 36 and the taper of the tapered bore bushing 34: the mandrel is out of angle metal or stainless steel, the angle, the material of the tapered bushing 36 can be selected as the motor spindle . In the case of replacement and cleaning, the rotating main shaft 38 is more stable in the rotation of the present embodiment, and in the present embodiment, the venting device is connected to the venting device in the venting hole + / + axis. The middle system uses a vacuum device to extract air, and the air is placed in the cymbal holder to extract air, for example, the wafer cone bushing; 36, \2 axis 2 crystal: holding platform 32, tapered hole bushing 34, In addition to the tightness, each contact surface of the ρ^-axis 3 provides the same force in addition to its own weight. This allows the contact surfaces to extract the direction and weight of the air due to the vacuum device, and forms a vacuum state to achieve a better effect. The gap w ϋ ϋ 之 之 各 各 各 采 采 采 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各 各Cao and maintain the vacuum pressure at a certain pressure without leaking, at the center
定現j精準的良好條件下，機器手臂喷嘴則容易自動化 這種晶片夾持設計可承受大面積晶片及更高的轉速 程’對於製程設計彈性有很大的助益，品質良率亦可信 賴:失持器内襯材質採鐵氟龍，其本質具備耐磨、耐壓、 ，二/廉（1 5 0 c以下）、低磨擦係數、不易氣化及化學性穩 心等優點’非常符合半導體製程嚴荷的操作環境，晶片夾 f器3 0與旋轉主軸3 8結合之錐面的設計，促使夾頭之上拉 五、發明說明（5) 磨擦力為定值，操作 $成為一固定常數， 障問題。另外，失持 轉穩定性。這對於塗 質具有重大的改善。 唯以上所述者， 用來限定本發明實施 述之形狀、構造、特 應包括於本發明之申 修正 者或機器手臂八 可防止不當栋I離晶片夾持器30的力 力與抽真空方引起精度變差和故 同向性，可提高旋 仰丨“數材料層的表面均勻度品 僅，本發明之較佳實施例而已，並非 /之範圍、。故即凡依本發明申請範圍所 ，及精神所為之均等變化或修飾，均 請專利範圍内。Under the good conditions of accurate j, the robot nozzle is easy to automate. This wafer clamping design can withstand large-area wafers and higher speed range. It is very helpful for process design flexibility, and the quality yield can be trusted. : The material of the lining of the missing device is Teflon, which has the advantages of wear resistance, pressure resistance, second/low (less than 150 c), low friction coefficient, easy gasification and chemical stability. In the operating environment of the semiconductor process, the design of the tapered surface of the wafer holder 30 and the rotating spindle 38 promotes the upper pull of the chuck. The invention description (5) The friction force is constant, and the operation $ becomes a fixed Constant, obstacle problem. In addition, the loss of stability. This has a significant improvement in the coating. Only the above-mentioned shapes, configurations, and specialties to be included in the embodiments of the present invention are included in the present invention, or the robot arm 8 can prevent the force and vacuum of the improper holder I from the wafer holder 30. The accuracy and the homogeneity of the material are increased, and the surface uniformity of the number of material layers can be improved. However, the preferred embodiment of the present invention is not limited to the scope of the present invention. And the changes or modifications of the spirit are all within the scope of the patent.
1249221 囷式簡單說明 【圖式簡單說明】 第一圖係習知晶片挾持器之内部構造剖視圖 第二圖係習知晶片夾持器結合後之剖視圖。 第三圖係本發明之結構分解圖。 第四圖係本發明之立體結構剖視圖。 【主要元件符號說明】 2 1晶片夾持平台 22 直筒襯套 2 3 馬達主轴 2 4 通氣孔 30晶片挾持器 32晶片挾持平台 34錐孔襯套 36錐轴襯套 38旋轉主轴 第10頁 —一種晶片挾持器之改良結構，其係包含· 一錐轴襯套，係套設一旋轉主 一貫穿透氣孔； 这紅轉主轴上設有 一錐孔襯套，係位於該錐軸襯套上； 一晶片挾持平台，係位於該錐孔襯套上 轴襯套、該錐孔襯套與該晶片挾持平ί:;:主 晶片挾持裝置。 卞σ、、且σ成一 H請μ專利範圍第1項所述之晶片挾持器之改良姓構， 3 主軸係一馬達主轴，作為驅動旋轉用 申明專利範圍第1項所述之晶片挾持器 其中更可在該旋轉主軸下設一真空系统，藉由該m级 2:〒氣使位該晶片挾持器上之一晶片穩固依附於：晶片 4如器申上」直不會在旋轉時產生上下振幅與徑向震動。 4、如專利範圍幻項所述之晶片挾持器之改良 其中該錐軸襯套與該旋轉主軸之緊 直徑之0.05〜0.1%。 &差尺寸範圍為 5其、：:二專利範圍第1項所述之晶片挾持器之改良結構， 襯套之錐度與該錐孔襯套之錐度相同並緊密配 ，·〜：；轴襯套之錐度與該晶片挾持器中心軸夾角範圍為 v.如η專利範圍第1項所述之晶片挾持器之改良結構， 兵Τ該錐軸襯套之材料係金屬或不銹鋼。 7装由如丄清專利範圍第1項所述之晶片挾持器之改良結構， 其中該錐孔襯套與該晶片挾持器之緊密配合公差尺寸範圍1249221 Brief Description of the Drawings [Simplified Schematic Description] The first drawing is a cross-sectional view of the internal structure of a conventional wafer holder. The second drawing is a cross-sectional view of a conventional wafer holder. The third figure is an exploded view of the structure of the present invention. The fourth drawing is a cross-sectional view of a three-dimensional structure of the present invention. [Main component symbol description] 2 1 wafer clamping platform 22 straight bushing 2 3 motor spindle 2 4 vent hole 30 wafer holder 32 wafer holding platform 34 tapered hole bushing 36 tapered shaft bushing 38 rotating spindle page 10 - a kind The improved structure of the wafer holder includes a tapered shaft bushing sleeve which is provided with a rotating main through-venting hole; the red rotating main shaft is provided with a tapered hole bushing on the tapered shaft bushing; The wafer holding platform is located on the tapered bushing upper bushing, and the tapered hole bushing and the wafer are held flat:; main wafer holding device.卞σ, and σ becomes a H. Please improve the improved structure of the wafer holder described in the first item of the patent range, 3 spindle-based motor spindle, as the wafer holder of the first aspect of the patent application for driving rotation. Further, a vacuum system is disposed under the rotating main shaft, and the m-stage 2: helium gas securely attaches one of the wafers on the wafer holder to the wafer 4, and the wafer 4 does not rotate up and down. Amplitude and radial vibration. 4. The improvement of the wafer holder as described in the patent scope illusion wherein the diameter of the tapered shaft bushing and the rotating main shaft is 0.05 to 0.1%. And the difference size range is 5,:: 2, the improved structure of the wafer holder according to the first item, the taper of the bushing is the same as the taper of the tapered hole bushing, and is closely matched, and the bushing is The angle between the taper of the sleeve and the central axis of the wafer holder is v. The improved structure of the wafer holder according to the first aspect of the invention, the material of the tapered shaft bushing is metal or stainless steel. 7 is an improved structure of a wafer holder as described in claim 1, wherein the tapered hole bushing and the wafer holder are closely matched to each other in a tolerance range
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