1248874 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種基板之對位貼合方法，尤其是有關於一種使 用複合基板製程之基板之對位貼合方法。 【先前技術】 液晶顯不器在傳統上都是使用玻璃基板，先將薄膜電晶體(TFT) 和彩色濾光片（CF)製作於玻璃基板之上，未來大尺寸液晶顯示器將成 為市場上的主要需求。同時，另外一種新興的顯示器，即同時具備輕、 薄且方便攜帶性的可撓性液晶顯示器也將是未來市場上另一個主流， 所以開始有廠商使用可撓性基板來取代玻璃基板，製作成可以彎曲的 可撓性液晶顯示器。而最適合這種可撓性顯示器的生產設備為捲軸式 (roll_to-roll)製造設備，因為可撓性液晶顯示器的製造過程中，可撓性 基板係透過滾輪來進行傳送以及各種的相關製程。 一般捲軸式(roll-tdoll)製造設備最主要的關鍵技術有兩項，第一 在於如何針對生產線上的可撓性基板做張力控制，如果能夠精確的對 張力作控制，將可以保持可撓性基板内部張力的穩定性，因此可提升 最終的產品良率，使最終產品的幾何形狀能夠控制在所需要的精度範 圍内，反之，若沒有對可撓性基板的張力作監控與控制，結果可能導 致可撓性基板因張力太大而使得材料過度拉伸，最後導致外型和尺寸 與先前所規劃的產品外型相差甚遠。而針對可撓性液晶顯示器，因為 必須將上、下可撓基板必須做精密對位之後才能夠進行後續的貼合製 耘，當可撓性基板未受到任何外力作用的情況下，上、下可撓基板是 一致的幾何外型，並且可以根據可撓性基板表面的記號來作為貼 合疋位的基準。因此在生產的過程巾必須對上、下可撓基板做高精度 的張力控制，確保可撓性基板不會因為受到過大的張力而導致發生幾 1248874 何形狀的變形，或是因為張力過小使得可撓性基板產生皺折，所以可 撓性基板必須保持一個適當的工作張力，因為一旦沒有做好張力控制 將會使可撓性基板彼此間的記號將無法匹配，進而影響到可撓性基板 做精密定位的工作，所以會導致整個可撓性顯示器生產線的良率降低。 如圖一所示，在傳統之捲軸式製造設備的生產過程裡，如果只是 單純的將兩種(同樣材質或是不同材質)可撓性基板11與可撓性基板12 做貼合’只需透過滚輪組13即可將該可撓性基板11與該可撓性基板 12做貼合，一般係在該可撓性基板u與該可撓性基板12間塗佈黏著 物(圖中未示出），之後再透過滾輪組13施加一定的壓力即可將其貼和 在一起，但值得注意的一點是當滾輪組13加壓於該可撓性基板Η與 该可撓性基板12之後，因為滾輪組13本身轉動就會將該可撓性基板 U與該可撓性基板12捲進滾輪的後方，所以如果一旦在貼合的過程前 或是貼合的過程中有一可撓性基板(例如，該可撓性基板U)發生橫向 的偏移1時’如圖二所示，則後續的貼合精度將會因此而變得不理想， 所以必須要藉由導正的裝置來將可撓性基板做偏移量的導正工作，所 以在導正裝置修正可紐基板_正確的傳独置之前，這過程中的 ^品了能都已經是魏品或是£^能通過品保而需要被報廢。但這畢 竟^是單純的民生用品的貼合製程，材料本身的成本不高因此不會因 為這樣而導致過多的浪費。 但如果是_難式觀設備於可躲的生產過程中，不 可撓性基板的橫向偏移量做監控，此外在可撓性基板的表面 有κ情侧的記號’所財齡的過財 的記號作對位之後才能進行貼人m〜T/ 下了視基板 的其“ 如意的—點是可換性顯示器用 的基板表面有事絲作了 _電晶體(TFT)、 錫(ιτο)層，所以在成本上是相θ 〜片（）和乳化麵 門右減旦a ”的’當上、下可撓基板有彼此 間有偏移里衫_過導正裝置修正可撓縣板酬正確的傳送位 1248874 置，透過這種方式會導致成本上相當程度的耗費；而另外一個重點在 於’如圖三所示，針對上可撓基板12的對位記號121與下可撓基板η 的對位記號111作定位與導正，如果在生產的過程中因為馬達失步或 疋滾輪組13與可撓性基板η或可撓性基板12產生滑動，會造成可撓 I*生基板11與可挽性基板12彼此間的對位記號hi與對位記號I]〗無 法準確的定位，因為可撓性基板U與可撓性基板12已經分別被滚輪 組13夾住，所以要使上可撓基板12與下可撓基板u產生縱向的微調 是非常不容易的。 一般捲軸式製造設備於貼合過程中，無法有效達到高精密度之可 撓性基板對位貼合的功能，依照液晶顯示器的製造方式是必須將上、 下可撓基板做精密的對位工作後再進行貼合的工作，所以無論是以玻 璃基板或是可撓性基板製作液魏示器，精密_位工作都是整個貼 合製程的無J1作，因此如果要顧捲軸式製造設備來生產可挽性液 晶顯，器，如何有效且精密的達成對位方式是必須突破的。 错由捲軸式製造設備製作液晶顯示器的相關專利最早係由觸 年日本之Idermtsu K〇san Co·，Ltd公司所提出之美國專利第* 973 373 號，其内容係揭示-種利用可撓性基板來製作液的關 板做出有效的導正，主要的原因在 ^堇僅只是針對捲軸式這樣的製程所提出之專利 曰佈方 式亦需要在真空環境下進行。 予液曰曰塗佈方 其中’可撓性基板必須透過滾輪進 在進行可撓性基板的對社作中，上^^做程，所以 下可撓基板有對位不準確的情 1248874 況發生時’則勢必要對該可撓性基板作局部的平移或扭轉才能夠修正 的偏移量；然而’ -旦對可撓性基板作扭轉的動作時，將會產生嚴重 的問題’ m為可撓性基板具有可撓性的這雜性，_轉的動作會 造成可撓性基減生’這樣的縣會影響靡合的品質，所以於 貼合的過程中要將兩可撓性基板表_記號作對位而不產錄摺是盈 法同時兼顧的。 · 曰如圖四所示，假設在進行對位的範圍透過吸附式移動平台14 (或 疋二特疋的夾制具)使該可撓性基板n(或可撓性基板12)扭轉來進行 對位’此法僅可使局部(意即，對位區域⑷)不產生皺褶，但因為可挽 性基板ιι(或可撓性基板12)是連續性的在滾輪組13上進行傳送，因此 可f性基板ιι(或可撓性基板12)會因為這樣的扭轉動作而使得在對位 區& 141以外的部分產生皺褶15，因此會影響到後續的可撓性基板 11(或可撓性基板12)於滾輪組π上傳送的路徑，也就是說可撓性基板 11與可撓性基板12在對位區域141的偏移量經過導正之後係不會消 除，而是會轉移到下一次要進行對位的區段。 【發明内容】 本發明之主要目的係提供一種基板之對位貼合方法，其係利用一 載體基板來傳送上⑺可撓性基板，使其與下⑴可撓性基板對位後再 進行貼合之動作，故可達到精準對位且防止皺褶產生之目的。 本發明之次要目的係提供一種基板之對位貼合方法，其係在上下 可撓基板對位貼合前，進行液晶塗佈及/或框膝塗佈，故可達到製造可 撓性顯示器之目的。 為達上述目的，該基板之對位貼合方法係包括下列步驟： a) 提供一複合基板，係由載體基板與上可撓基板貼合成； b) 提供一切割模組，係用以切割上可撓基板； 1248874 c) 將該複合基板與該下可撓基板貼合對位； d) 將該複合基板與該下可撓基貼合抹平；以及 e) 將該載體基板與該上可撓基板相分離。 為達上述目的，該基板之另一對位貼合方法係包括下列步驟： a) 提供一複合基板，係由載體基板與上可撓基板貼合成； b) 將該複合基板與該下可撓基板貼合對位； c) 將該複合基板與該下可撓基貼合抹平；以及 d) 提供一切割模組，係用以切割上下可撓基板切割使其能將該載 體基板相分離。 較佳地，該複合基板係由載體基板與上可撓基板貼合成。 較佳地’該切割模組係可為固定間距雙刀切割與定間距單刀切割 中之一者。 車父佳地，該貼合抹平係可為括平與滚平中之一者。 較佳地，該複合基板上形成若干個第一定位標記，於該下可撓基 板上形成若干個第二定位標記，且該第一定位標記係可與該第二定位 標記互相配合。 較佳地，該互相對位乃係藉由該第一定位標記係與該第二定位標 記之互相配合。 較佳地’该基板之對位貼合方法中係實施液晶塗佈與框膠塗佈。 較佳地，該液晶塗佈與框膠塗佈係可在一般大氣下與真空環境中 之一者進行。 較佳地，該塗佈於該可撓基板之中央與一側中之一者。 較佳地，該複合基板係經由若干個滾輪傳送。 較佳地，該下可撓基板係經由若干個滾輪傳送。 較佳地，該載體基板係由可撓性材料所製成。 較佳地，該可撓性材料係選擇為聚乙烯(pE)、聚碳酸酯(pc)、聚對 1248874 苯二甲酸二 乙酯(PET)與耐熱透明樹脂(Art〇n)其中之一種。 較佳地’該可撓性材料係選擇為紙與金屬其中之一種。 一通=佳地’當該載體基板由不透明材料所製成時，其上係設有至少 為使貴審查委員對於本發明之結構、功效及 之了解與認同，茲配合圖示詳細說明如后。 /、 / ’y 【實施方式】 可撓·鋪示^之橫勤示意圖，可撓性液晶顯示器 f組3包含了上可撓基板31與下可撓基板32，_晶％被包 上I撓基板31鮮可撓紐32 π，_稍絲奸經事先在表 面/刀別製作薄膜電晶體（圖中未示出）和彩色遽光片（圖中未示出） =其上’之後再個躲薄難晶體和彩⑽光壯製作氧化銦錫(ιτ〇) 層（圖中未示出）。 圖六係為本發财複合基板之橫剖面料圖。該複合基板8係包 括該上可撓錄3丨與-倾紐81，該_餘81係射撓且且有 兩貼合面(®巾未示出）’其可藉由—黏著物82喊該上可撓基板Μ 之一貼合面相黏合。 該載體基板81係由透明材料所組成，例如：聚乙婦(ρΕ)、聚碳酸 酯(pc)、㈣苯=甲酸二乙酯(ΡΕΤ)或耐熱透明樹脂(Art—等高分子聚 合物’也可以是紙或是可撓之金屬薄板；而該上可撓基板31的材質可 以是聚乙婦(PE)、聚碳酸醋(PC)、聚對苯二甲酸二乙醋(ρΕτ)與耐教透 明樹脂(Arton)等高分子聚合物’然—料岐，上舰明僅用於示 例而非用於限制本發明之範圍。 1248874 相?上3可挽基板31之另一貼合面更可與一保護膜83相貼合，該保 疋用祕賴作在上可撓基板31之另—齡面上的元件或結 構(圖中未示出）。 圖七係為本發明中複合基板之貼合過程示意圖。其中，該上可挽 基板31之-貼合面(圖中未示出)係先與該保制83相貼合，而另外一 貼合面(®巾未示⑴上職財雜著物82，麟再職塗佈有黏著 物82之貼合面與該上可撓基板31相貼合，並藉由一滚輪組％施加壓 力使其緊费黏合，而形成該複合基板8。 系為本發明中複合基板之一變化實施例之橫剖面示意圖。其 中’當该上可撓基板31之兩貼合面(即上下表面)都已經貼有保護膜幻 時，則可以直接使用該保護膜83作為載體基板，因此就可以省略如圖 七中之複合基板的製作步驟。 圖九A和圖九B係分別為本發明中之上可撓基板與下可繞基板之 上視圖。其中該上可撓基板31與下可撓基板32已經事先在表面分別 製作薄膜電晶體（圖中未示出）和彩色濾光片（圖中未示出）於其上， 之後再分別於薄膜電晶體和彩色濾、光片上製作氧化銦錫層（圖中未示 出），當氧化銦錫層製作完成之後再塗佈配向膜（圖中未示出）並配向 (圖中未示出）。 於圖九A中，該上可撓基板31上係設有多個不同大小之矩型區域 311，而該矩型區域311係各自對應一個液晶顯示器模組（圖中未示 出），因此，可依照該上可撓基板31的尺寸而同時製作出各種不同^ 寸之液晶顯示器模組。在該上可撓基板31之表面係設有複數個對位標 記313，該等對位標記313主要係用來作為上可撓基板31與下可撓^ 板32對位用。 一 疋土 於圖九B中，該下可撓基板32上係設有多個不同大小之矩型區域 311，而該矩型區域311係各自對應一個液晶顯示器模組（圖中未示 1248874 出），因此，該下可撓基板32就包含了多個液晶顯示器模組的下基板， 在該下可撓基板32之表面係已事先設有複數個對位標記323，該等對 位標記323主要係用來作為上可撓基板31與下可撓基板32對位用。 需注意的是，只要可相互配合，該等對位所用的對位標記313與對位 標記323係可以為任意之幾何形狀，而非僅限於本發明圖式中所示形 狀〇 右K乍複a基板所使用的載體基板為不透明的材質時，在製作複 合基板的製程之前，該載體基板需要多一道挖孔的加工程序。圖十係 為本發明中之載體基板經過加工後與上可撓基板貼合成一複合基板之 上視圖。其中，-載體基板81係貼合於該上可撓基板31(圖中未示出） 之上方’若載體基板81為不透明的材質時，必須在對應上可撓基板 ^表面之對位標記313位置處開設複數個通孔811 ;按，此舉為 該上可撓基板31在貼合前必須和該下可撓基板32(圖中未示做 位’而對位的方式是藉由上可撓基板31和下可撓基板32表面的對位 標記313鋪位標記323做配對，所以為了能夠讓對位裝置(如··咖 ^ Charge-Coupled Device Video Camera ； ® 到該上可撓基板表面的對位標記313，所以必須在載體基板8i上對應 该等對位標記313的位置開設該等複數個通孔811。 圖十-係為本發明中之捲軸式製程設備之示意圖。該捲轴式製程 設備1係用於製造可撓性顯示器所需之定位與貼合製程，其中 基板收送齡2餘含祕輪2卜_ 22魏難23，該複合^ 8係放置於職合基減賴組2進行傳送，透過送料輪21和^ === 板Γ獅咖輪22細娜改變該^ 該複合基板收送模組2的頂部係連接一導正模組9，該導正模 係由滾珠螺桿(圖中未示出)與馬達(圖中未示出）彼此搭配所構成，用 12 1248874 於该複合基板8與該下可挽基板32之相互對位製程中，該導正模組9 係具有X方向、Y方向、Z方向和0方向之自由度調整機制，一旦複 合基板8 (上可撓基板)與下可撓基板32彼此間有偏移量存在時，該導 正模組9係可提供適當的導正’且於導正的過程中不會因導正的動作 而使複合基板8(上可撓基板)及/或下可撓基板32產生皺褶或是造成内 部張力之改變。 於貼合區域63之前段係具有一切割模組4,該切割模組4係用於 切割該複合基板8。此外，本發明基板之對位貼合方法係可應用於製 造液晶顯示器，故由此係衍生一對應之液晶塗佈方式，透過一刮板模 組5係可以將液晶均勻塗佈於複合基板8與下可撓基板％之間(將於 後描述）’而且此方式可允許於大氣狀態下填充液晶。而下可撓基板W 係透過下基板收送歡7進行傳送，該τ基減送 7係包括送料 輪71、收料輪72與真空吸附平台73，透過該送料輪71和該收料輪 72來收送該下可撓基板32，該真空吸附平台乃係於傳送路徑中，且 用於吸附該下可撓基板32，以助於提昇貼合過程之穩定性。 因為該下可撓基板32之表面亦設有複數個對位標記(圖中未示 出）’所以該真空吸附平台73在對應到該等對位標記處之區域也是有 挖複數個小孔(圖中未示出），使CCD攝影機62能夠拍攝到下可撓基板 φ =表面的對位標記。複合基板8和下可撓基板32的位置亦可互換， 意即，本發明巾之基板傳送與貼合对雜定該複合紐S —定要纟 該下可撓基板32的上方。 如圖十一所不，當複合基板8製作完成之後將其放置於複合基板 收运模組2傳送，該複合基板收送模組2係侧珊輪2卜般輪22 和收料輪23來傳送該複合基板8 ;此外，該下可撓基板％係透過下 基板收送模組7來進行傳送。 接著’以該CCD攝影機62擷取該下可撓基板32表面的對位標記 13 1248874 彡狀，纽戦咖攝影 停止傳i Hit 嫩錢’_板峨組7便會 、、Ή動該真空吸附平台73，使該下可#其d 該真空吸附平台73之表面上。 ^下了撓基板32破在 同時，該CCD攝影機61亦可清楚對隹日丑 的對位標記(圖中未，且摘取该複合基板8表面 質，所以可載基板(圖中未示出)為透明的材 表面的對位^己板8操取到上可挽基板(圖中未示出） I己，右該載體基板為非透明的材質時，亦不影 職’可顧絲餘上職赴稍 亇二丨(*圖十所朴再透過影像來狀該複合基板8表面之對位俨 且合Air當魏/基板8與該下可撓基板32都到i 基板收送模組2停止傳送兮複續板制8早疋(圖中未示出)會通知該複合 租4俜^ΑΓ針-巾之切賴_局做大示_。該切割模 板8 刀片41，該等切割刀片41侧於切割該複合基 =於該圖中，該切割模組4尚未對該複合基板8進行切判，叫 複5基板8定錄序完紅後，該複合基板8 = 切割刀片4i係對該複合基板8進行切割。 寻泛此時私 當切割進行時’如圖十二B所示，該等切割刀片41會切簡人美 的iZf31，細刪娜卩針：A所示i娜i 板3; = ; 傳送的方向垂直，而切割㈣度只有該上可撓基1248874 IX. Description of the Invention: [Technical Field] The present invention relates to a method of aligning a substrate, and more particularly to a method of aligning a substrate using a substrate of a composite substrate. [Prior Art] Liquid crystal display devices have traditionally used glass substrates. First, thin film transistors (TFTs) and color filters (CF) were fabricated on glass substrates. In the future, large-size liquid crystal displays will become available on the market. Main needs. At the same time, another emerging display, that is, a flexible liquid crystal display that is both light, thin and portable, will be another mainstream in the market. Therefore, manufacturers have begun to use flexible substrates instead of glass substrates. A flexible liquid crystal display that can be bent. The most suitable production equipment for such a flexible display is a roll-to-roll manufacturing apparatus in which a flexible substrate is transported through a roller and various related processes during the manufacture of the flexible liquid crystal display. There are two main key technologies for roll-tdoll manufacturing equipment. The first is how to control the tension of the flexible substrate on the production line. If the tension can be accurately controlled, the flexibility can be maintained. The stability of the internal tension of the substrate can improve the final product yield, so that the geometry of the final product can be controlled within the required accuracy range. Conversely, if the tension of the flexible substrate is not monitored and controlled, the result may be This causes the flexible substrate to be overstretched due to too much tension, and ultimately results in a shape and size that is far from the shape of the previously planned product. For a flexible liquid crystal display, since the upper and lower flexible substrates must be precisely aligned, the subsequent bonding can be performed. When the flexible substrate is not subjected to any external force, the upper and lower sides are The flexible substrate is a uniform geometric shape and can be used as a reference for the conformal clamping according to the marking of the surface of the flexible substrate. Therefore, in the production process towel, high-precision tension control must be performed on the upper and lower flexible substrates to ensure that the flexible substrate does not undergo deformation due to excessive tension, or because the tension is too small. The flexible substrate is wrinkled, so the flexible substrate must maintain a proper working tension, because if the tension control is not done, the marks on the flexible substrates will not match, which will affect the flexible substrate. The precision positioning work will result in a lower yield of the entire flexible display line. As shown in Fig. 1, in the production process of the conventional reel manufacturing equipment, if only two (same materials or different materials) flexible substrates 11 and the flexible substrate 12 are simply attached, The flexible substrate 11 and the flexible substrate 12 can be bonded to each other through the roller group 13 , and generally an adhesive is applied between the flexible substrate u and the flexible substrate 12 (not shown) And then applying a certain pressure through the roller set 13 to stick them together, but it is worth noting that after the roller set 13 is pressed against the flexible substrate Η and the flexible substrate 12, Because the roller set 13 itself rotates, the flexible substrate U and the flexible substrate 12 are wound into the rear of the roller, so if there is a flexible substrate before or during the bonding process ( For example, when the flexible substrate U) is laterally shifted by 1 'as shown in FIG. 2, the subsequent bonding accuracy will be unsatisfactory, so it is necessary to use a guiding device. The flexible substrate is used as a guide for the offset, so the correction device can be modified _ Right before the pass home alone, this process can have a ^ product is Wei products or £ ^ through quality assurance and needs to be scrapped. However, this is a simple process of bonding people's livelihood products. The cost of the materials themselves is not high, so it will not cause too much waste. However, if it is a difficult-to-see device in the process of being able to hide, the lateral offset of the non-flexible substrate is monitored, and on the surface of the flexible substrate, there is a sign of the κ emotion side. After the mark is aligned, it can be affixed to the m~T/ underlying substrate. "The point is that the surface of the substrate for the display of the interchangeability is made of _ transistor (TFT), tin (ιτο) layer, so In terms of cost, phase θ ~ sheet () and emulsifying surface gate right minus a "" when the upper and lower flexible substrates have offset between each other _ over-guiding device correction can be correct Bit 1248874, in this way, will result in considerable cost; and another important point is 'as shown in Figure 3, the alignment mark for the alignment mark 121 of the upper flexible substrate 12 and the lower flexible substrate η 111 for positioning and guiding, if the motor is out of step or the sliding roller group 13 and the flexible substrate η or the flexible substrate 12 slide during the production process, the flexible I* substrate 11 and the tractability are caused. The alignment mark hi and the alignment mark I] between the substrates 12 cannot be accurate Positioning, since the flexible substrate 13 are the U-12 have sandwiched roller assembly and the flexible substrate, the flexible substrate 12 to make the upper and the lower flexible substrate to longitudinal trim u is not easy. In general, the roll-type manufacturing equipment cannot effectively achieve the function of matching the high-precision flexible substrate in the bonding process. According to the manufacturing method of the liquid crystal display, the upper and lower flexible substrates must be precisely aligned. After the bonding work is carried out, the liquid dynamometer is made of the glass substrate or the flexible substrate, and the precision _ bit work is the J01 for the entire bonding process, so if you want to take care of the roll manufacturing equipment The production of a flexible liquid crystal display, how to effectively and precisely achieve the alignment method must be broken. The patent relating to the production of a liquid crystal display by a reel-type manufacturing equipment is the first in the U.S. Patent No. 973 373, which is issued by Idermtsu K〇san Co., Ltd. of the company of Japan. The main reason for the effective cutting of the closing plate of the production liquid is that the patented laying method only for the rolling type process needs to be carried out in a vacuum environment. In the liquid coating application, the flexible substrate must pass through the roller to perform the process of performing the flexible substrate, and the above flexible substrate has an inaccurate alignment of 1248874. At the time, it is necessary to locally shift or twist the flexible substrate to correct the offset; however, when the flexible substrate is twisted, serious problems will occur. The flexible substrate has the flexibility of flexibility, and the _ turn operation causes the flexibility of the flexible base to affect the quality of the splicing. Therefore, the two flexible substrates should be placed in the process of bonding. The _ mark is used for the opposite position, and the record is not taken at the same time.曰 As shown in FIG. 4, it is assumed that the flexible substrate n (or the flexible substrate 12) is twisted by the adsorption moving platform 14 (or the clamping device of the second embodiment) in the range of the alignment. The alignment 'this method can only make the local (that is, the alignment area (4)) no wrinkles, but because the removable substrate ι (or the flexible substrate 12) is continuous on the roller set 13, Therefore, the f-type substrate ιι (or the flexible substrate 12) may cause wrinkles 15 in portions other than the alignment region & 141 due to such a twisting action, thereby affecting the subsequent flexible substrate 11 (or The flexible substrate 12) is transported on the roller group π, that is, the offset between the flexible substrate 11 and the flexible substrate 12 in the alignment region 141 is not eliminated, but Move to the next section to be aligned. SUMMARY OF THE INVENTION The main object of the present invention is to provide a method for aligning a substrate by using a carrier substrate to transport the upper (7) flexible substrate to be aligned with the lower (1) flexible substrate. Combined with the action, it can achieve precise alignment and prevent wrinkles. A secondary object of the present invention is to provide a method for aligning a substrate by performing liquid crystal coating and/or frame coating before the upper and lower flexible substrates are aligned, thereby enabling the manufacture of a flexible display. The purpose. To achieve the above object, the substrate alignment method comprises the following steps: a) providing a composite substrate, which is formed by the carrier substrate and the upper flexible substrate; b) providing a cutting module for cutting a flexible substrate; 1248874 c) bonding the composite substrate to the lower flexible substrate; d) bonding the composite substrate to the lower flexible substrate; and e) bonding the carrier substrate to the substrate The substrate is phase separated. To achieve the above object, the other alignment method of the substrate comprises the following steps: a) providing a composite substrate which is laminated by the carrier substrate and the upper flexible substrate; b) flexing the composite substrate with the lower substrate The substrate is bonded to the alignment; c) the composite substrate is affixed to the lower flexible substrate; and d) a cutting module is provided for cutting the upper and lower flexible substrates to separate the carrier substrate . Preferably, the composite substrate is bonded by a carrier substrate and an upper flexible substrate. Preferably, the cutting module is one of a fixed pitch double knife cutting and a fixed pitch single knife cutting. The car father's good land, the fit smoothing system can be one of the flat and flat. Preferably, a plurality of first positioning marks are formed on the composite substrate, and a plurality of second positioning marks are formed on the lower flexible substrate, and the first positioning marks are compatible with the second positioning marks. Preferably, the mutual alignment is performed by the first positioning mark and the second positioning mark. Preferably, the liquid crystal coating and the sealant coating are carried out in the alignment bonding method of the substrate. Preferably, the liquid crystal coating and the sealant coating are carried out in one of a general atmosphere and a vacuum environment. Preferably, the coating is applied to one of the center and the side of the flexible substrate. Preferably, the composite substrate is conveyed via a plurality of rollers. Preferably, the lower flexible substrate is transported via a plurality of rollers. Preferably, the carrier substrate is made of a flexible material. Preferably, the flexible material is selected from the group consisting of polyethylene (pE), polycarbonate (pc), polypair 1248874 diethyl phthalate (PET) and heat resistant transparent resin (Art〇n). Preferably, the flexible material is selected from the group consisting of paper and metal. When the carrier substrate is made of an opaque material, it is provided with at least an understanding and approval of the structure, efficacy, and approval of the present invention by the reviewing committee. /, / 'y [Embodiment] The flexible and liquid crystal display f group 3 includes the upper flexible substrate 31 and the lower flexible substrate 32, and the _ crystal% is wrapped with I The substrate 31 is freshly smudged by the new 32 π, _ a little smear by previously making a thin film transistor (not shown) on the surface/knife and a color enamel sheet (not shown) = To avoid the hard crystals and color (10), make a layer of indium tin oxide (not shown). Figure 6 is a cross-sectional plan view of the composite substrate of the fortune. The composite substrate 8 includes the upper flexible 3 丨 and 倾 81, and the _ remaining 81 is slanted and has two affixing faces (® towel not shown), which can be shouted by the adhesive 82 One of the upper flexible substrates 贴 is bonded to the bonding surface. The carrier substrate 81 is composed of a transparent material, for example, polyethylene (ρΕ), polycarbonate (pc), (tetra) benzene = diethyl formate (yttrium) or heat-resistant transparent resin (Art-like polymer) It can also be paper or a flexible metal sheet; and the upper flexible substrate 31 can be made of polyethylene (PE), polycarbonate (PC), polyethylene terephthalate (ρΕτ) and resistant. The polymer of the transparent resin (Arton) is taught to be used as an example, and is not intended to limit the scope of the invention. 1248874 The other bonding surface of the 3 pullable substrate 31 is further It can be adhered to a protective film 83, which is used as an element or structure (not shown) on the other age of the upper flexible substrate 31. Figure 7 is a composite substrate of the present invention. A schematic diagram of the bonding process, wherein the bonding surface (not shown) of the upper removable substrate 31 is first bonded to the security 83, and the other bonding surface (the towel is not shown (1) The occupational miscellaneous material 82, Lin re-worked the adhesive surface coated with the adhesive 82 and the upper flexible substrate 31, and the pressure is applied by a roller group% to make it tightly bonded. The composite substrate 8 is formed as a cross-sectional view of a modified embodiment of the composite substrate of the present invention. [When the two bonding surfaces of the upper flexible substrate 31 (ie, the upper and lower surfaces) have been attached with a protective film illusion When the protective film 83 is directly used as the carrier substrate, the manufacturing process of the composite substrate as shown in FIG. 7 can be omitted. FIG. 9A and FIG. 9B are respectively the flexible substrate and the lower substrate in the present invention. A view from above the substrate, wherein the upper flexible substrate 31 and the lower flexible substrate 32 have previously formed thin film transistors (not shown) and color filters (not shown) on the surface, respectively. Then, an indium tin oxide layer (not shown) is separately formed on the thin film transistor and the color filter and the light sheet, and after the indium tin oxide layer is formed, the alignment film (not shown) is coated and aligned ( In the figure 9A, the upper flexible substrate 31 is provided with a plurality of rectangular regions 311 of different sizes, and the rectangular regions 311 are respectively corresponding to a liquid crystal display module (in the figure) Not shown), therefore, according to the A plurality of different liquid crystal display modules are simultaneously fabricated by sizing the substrate 31. The surface of the upper flexible substrate 31 is provided with a plurality of alignment marks 313, and the alignment marks 313 are mainly used as The upper flexible substrate 31 is aligned with the lower flexible plate 32. In the present invention, a plurality of rectangular regions 311 of different sizes are disposed on the lower flexible substrate 32, and the rectangular region 311 is provided. Each of the lower flexible substrates 32 includes a lower substrate of a plurality of liquid crystal display modules, and the surface of the lower flexible substrate 32 has been previously A plurality of alignment marks 323 are provided, and the alignment marks 323 are mainly used for aligning the upper flexible substrate 31 with the lower flexible substrate 32. It should be noted that the alignment mark 313 and the alignment mark 323 used for the alignment may be of any geometric shape as long as they can cooperate with each other, and are not limited to the shape shown in the drawing of the present invention. When the carrier substrate used for the substrate is an opaque material, the carrier substrate requires a further process of boring before the process of fabricating the composite substrate. Figure 10 is a top view of the carrier substrate of the present invention after being processed and bonded to the upper flexible substrate to form a composite substrate. Wherein, the carrier substrate 81 is attached to the upper flexible substrate 31 (not shown). If the carrier substrate 81 is opaque, the alignment mark 313 of the surface of the corresponding flexible substrate must be A plurality of through holes 811 are opened at the position; according to the above, the upper flexible substrate 31 must be aligned with the lower flexible substrate 32 (not shown as a bit in the figure). The alignment mark 313 of the surface of the flexible substrate 31 and the lower flexible substrate 32 is paired with the mark 323, so that the alignment device (such as the Charge-Coupled Device Video Camera; ® is applied to the surface of the upper flexible substrate) The alignment mark 313 is provided, so that the plurality of through holes 811 must be opened on the carrier substrate 8i corresponding to the position of the alignment mark 313. Fig. 10 is a schematic view of the scroll type process apparatus of the present invention. Process equipment 1 is used for the positioning and bonding process required for the manufacture of flexible displays, in which the substrate receiving age of 2 contains the secret wheel 2 _ 22 Wei difficult 23, the composite ^ 8 series placed in the job-based base Group 2 is transmitted through the feed wheel 21 and ^ === The top of the composite substrate receiving module 2 is connected to a guiding module 9, which is formed by a ball screw (not shown) and a motor (not shown). 12 1248874 is used in the mutual alignment process between the composite substrate 8 and the lower pull-down substrate 32, and the guiding module 9 has a degree of freedom adjustment mechanism in the X direction, the Y direction, the Z direction and the 0 direction, once the composite substrate When the (upper flexible substrate) and the lower flexible substrate 32 are offset from each other, the guiding module 9 can provide an appropriate guiding and does not cause a positive guiding action during the guiding process. The composite substrate 8 (the upper flexible substrate) and/or the lower flexible substrate 32 is wrinkled or the internal tension is changed. Before the bonding region 63, there is a cutting module 4, and the cutting module 4 It is used for cutting the composite substrate 8. In addition, the alignment bonding method of the substrate of the present invention can be applied to the manufacture of a liquid crystal display, so that a corresponding liquid crystal coating method is derived therefrom, and a squeegee module 5 can be used. The liquid crystal is uniformly coated between the composite substrate 8 and the lower flexible substrate % (described later) Moreover, this method can allow the liquid crystal to be filled in the atmospheric state, and the lower flexible substrate W is transported through the lower substrate receiving tray 7 including the feeding wheel 71, the receiving wheel 72 and the vacuum suction platform 73. Receiving the lower flexible substrate 32 through the feeding wheel 71 and the receiving wheel 72. The vacuum adsorption platform is in the conveying path and is used for adsorbing the lower flexible substrate 32 to facilitate lifting and fitting. The stability of the process. Because the surface of the lower flexible substrate 32 is also provided with a plurality of alignment marks (not shown), the vacuum adsorption platform 73 is also digging in the area corresponding to the alignment marks. A plurality of apertures (not shown) enable the CCD camera 62 to capture the alignment mark of the lower flexible substrate φ = surface. The positions of the composite substrate 8 and the lower flexible substrate 32 are also interchangeable, that is, the substrate transfer and bonding of the present invention is intended to be above the lower flexible substrate 32. As shown in FIG. 11 , after the composite substrate 8 is completed, it is placed on the composite substrate receiving module 2 for transmission. The composite substrate receiving module 2 is a side wheel 2 and a receiving wheel 23 The composite substrate 8 is transferred; and the lower flexible substrate % is transmitted through the lower substrate receiving module 7. Then, the CCD camera 62 captures the alignment mark 13 1248874 on the surface of the lower flexible substrate 32, and the neon photography stops transmitting i Hit the tender money '_ board group 7 will, and the vacuum adsorption is shaken. The platform 73 is such that it can be on the surface of the vacuum adsorption platform 73. ^ When the scratched substrate 32 is broken, the CCD camera 61 can also clearly mark the alignment mark of the ugly surface (the figure is not in the figure, and the surface quality of the composite substrate 8 is taken off, so the substrate can be carried (not shown in the figure) ) The alignment of the surface of the transparent material is taken up to the upper of the substrate (not shown). If the carrier substrate is a non-transparent material, it is not a shadow. I went to the second board (Figure 10) and then used the image to shape the surface of the composite substrate 8 and the Air Wei/substrate 8 and the lower flexible substrate 32 to the i substrate receiving module. 2 stop transmission 兮 re-spinning system 8 early 疋 (not shown in the figure) will inform the compound rent 4 俜 ^ ΑΓ - 巾 巾 巾 巾 局 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The blade 41 is side-cut to the composite base. In the figure, the cutting module 4 has not yet cut the composite substrate 8. After the substrate 5 is ordered to be finished, the composite substrate 8 = the cutting blade 4i The composite substrate 8 is cut. When the cutting is performed at a private time, as shown in FIG. 12B, the cutting blades 41 will cut the iZf31, and the fine needles are removed: A I i Na 3 shows plate; =; the vertical direction of transmission, and (iv) cleavage of only that the flexible substrate
兮m又因此該切割模組4係不會完全切斷該複合基板8，此時 f複:基板8 +的賴餘81與上可缝板31奴雜貼合的狀 恶4，切割該複合基板8的目的在於：當該上可撓基板31盘該下可 撓基板32貼合完成後，可利於後續將該上可挽基板31與載體基板μ 分離；當切割動作完成之後，該等切割刀片41會回復到如圖十二A 1248874 所示的情況。 圖十二係為本發明中之上可撓基板於切割時之相關位置示意圖。 該切割模組4之姻刀片41會沿著(該上可撓基㈣上之)切割線314 的位置做切割，麟割之方向係垂直於複合基板8的傳送方向。 此外亦可將切割複合基板之製程與複合基板之製造過程合併進 行，=圖十四A所示。將上可撓基板31(或載體基板81)之一貼合面塗 佈黏著物82，再藉由滾輪組91所施加的壓力將該上可撓基板31與該 載，基板81貼合，當載體基板81與上可撓基板32貼合之後，隨即依 固定之間距對該上可撓基板31做蝴，之後再職複合基板8放置於 複合基板收送模組(圖中未示出)做收送，因為切割的深度只有該上可挽 基板31的厚度，因此蝴裝置4不會完全靖賴合基板8，並且該 載體基板81與該上可撓基板31還是健在貼合狀態。 j者，可如圖十四B所示，直接將該上可撓基板31先依固定間距 ^割完成後，再無健紐81舰合紐合基板8，之後再將該複 合基板8放置於複合基板收送模組2做收送，因此不須切割模組*再 做切割的動作。 圖十五A與圖十五b係為下可撓基板進入貼合區域的示意圖。圖 十五A係表示只有一個顯示器模組之情況，圖十五B則表示有數麵 示器模組之情況。於本發明讀佳實細巾，在上可撓紐與下可挽 基板黏&釗，係可實施液晶塗佈與框膠塗佈之步驟，意即，將液晶與 框膠塗佈在,¾下可撓基板之—貼合面上，並係塗佈在顯示器模組 圍之内。 抑★於圖十五A中，框膠34係塗佈在下可撓基板32的表面上(於顯示 师模組區域311中)並圍繞成封閉之矩型，之後再將液晶％塗佈於該 下可撓基板32的中心部位；於圖十五6中，該下可撓基板32係具有 四個顯不器模組區域3U，於此情形下液晶33也是塗佈於該下可撓基 15 1248874 板32的中心部位，且係塗佈在框膠34的四個顯示器模組區域311中 較接近貼合區域(中央)之一側。按此舉是為了於後續的貼合過程中能夠 將液晶均勻分佈在上可撓基板與下可撓基板之間。 當液晶與框膠塗佈於該下可撓基板32之後，該下可撓基板32便 進入與該複合基板8對位之步驟，如圖十六a與圖十六B所示。其中， 該複合基板收送模組2因為搭配了導正模組9，所以具有χ方向、γ 方向、Ζ方向和0方向之自由度，當該複合基板8(意指該上可撓基板 31)與該下可撓基板32到達定位並完成切割(非必要)和液晶與框膠塗 佈製程(非必要)後，複合基板收送模組2將會使該複合基板8往該可撓 性基板32移動，如圖十六a至圖十六Β所示，因為該導正模組9係 具有Z方向之自由度，故可使該複合基板收送模組2下降且相對接近 於該下可撓基板32，註該複合基板8與該下可絲板32保持一距 離d，而不使該複合基板8與液晶33直接接觸(以利於後續之精確對 位）。此外，一真空吸附平台73係吸附住該下可撓基板32並固定之。 接下來開始進行該複合基板8與該下可撓基板32之精確對位，如 圖十六B所示。該複合基板8上面的CCD攝影機61係可擷取該上可 撓基板31之對位標記影像（圖中未示出）至一定位單元（圖中未示出） 以判定該上可撓基板31是達定位，同時㈣靖位標記影像傳送 至-對位單it (圖中未示幻，該對位料個來判定該複合基板8與 該下可撓基板32絲之對位標記是^已相互對位；按，賴該複合基 板8與該下可撓基板32已經到達該貼合區域63(表示彼此就定位），但 並不表示彼關之聽標記射相域雜位，_需要藉由對位單 元來做高精密度的對位工作。 因此當CCD攝影機61和CCD攝影機62所擷取到之對位標記影 像進入對位單元之後，如圖十七所示，透過影做理分職對位標記 313與對位標記323做相關位置的運算與分析後，經影像處理析後的 1248874 影像結果66中係包含了該(上可撓基板之卵立標記313與該(下可挽基 板之)對位標記323，經由中央處理單元(圖中未示出)計算出對位標記 3^3與對位標記323之間的偏移量Δχ、Δγ與角度差△ θ之後，偏移 =之值係由中央處理單元傳輸至該導正模組9，該導正模組9接著則 π動忒複a基板收送模組2做X方向、γ方向及0方向上之偏移量補 仏，使對位標記313與對位標記323可相互配對，進而使該複合基板 8與該下可撓基板32達到高精密的定位。 如圖十八A至圖十八；8所示，該上可撓基板31與該下可撓基板 32表面上的對位標記313和對位標記323係無法精確的對位，所以透 f導正模組(圖中未示出)做偏移量的修正後，可使對位標記313和對位 才示§己323能夠重合在一起，如對位標記333的狀態。 一當複合基板8與下可撓基板32已相互對位之後(如圖十六B所 示）’則開始進行貼合製程。請參照圖十九A，其中於該貼合區域幻 之中心處係設有一刮板模組5，該刮板模組5係包括刮板51與刮板 52 ’該到板模組5係位於該複合基板8之正上方且該刮板模組^(即， 刮板51與刮板52)之方向係與該複合基板8之傳送方向垂直。在該複 合基板8與該下可撓基板32進行貼合之前，刮板模組5會下降並與複 合基板8接觸，此係為了使複合基板8之中央(即，塗佈有液晶％之 區域)局部凹陷，如此，該複合基板8與該下可撓基板32在貼合時由 於先成一直線之接觸，故可有效防止在貼合過程中空氣殘留在該上可 撓基板31與該下可撓基板之32間。 少之後，如圖十九B所示，複合基板收送模組(圖中未示出）會開始 往下移動以進行貼合的製程。隨著該複合基板8下降的過程，刮板^ 與刮板52係由中央往左右兩側同步移動，故液晶33係會均勻的分佈 在該上可撓基板31與該下可撓基板32之間，因此不會有 ζ 於其中，按此齡式係適於在-般大氣環境下之液找填與貼合$ 17 1248874 =’該液晶域無合之步_可以在衫魏下進行。在此實施例 ，该載體基板81 _可作為保護該上可撓基板31之賴層，而避 免在棚板51與制板52的飾過針(即，液自33讀抹過程中) 該上可撓基板31受到傷害。 田棚板51與該刮板52由該複合基板8的中央往兩側移動後， 接下來會進行框顧化之步驟，於本實施财雜用料光源(uv; 圖中未示出)來騎轉(财未_)，框膠在料統的_下會開 始固化，使传该複合基板8中之上可撓基板31無下可撓基板η完 全貼合。 、待框膠完成固化之後，係進入複合基板分離製程，如圖二十所示， 複合基板收达模組(圖中未示出)係往上移動，進而帶動般輪22、到板 4莫組5與複合基板8-灿上移動。因為先前切割模組4已經事先對 複合基板8中之上可撓基板31做切割(請參見圖十二a至圖十二b所 示），固化後之框膠34又會緊密貼合該上可撓基板31與該下可撓基板 32 ’再加上框膠34的黏性係大於製作複合基板所用黏著撕即，圖六 中之黏著物82)之雜，且在轉34 的過程巾可以_複合基板 8做適當的加熱使該黏著物82之黏性降低，故有餅㈣將該上可挽 基板31與邊載體基板81分離，而該貼合後之上可撓基板31因此就轉 移到該下可撓基板32的麵上；之後就與該下可撓基板32 一起水平 傳送，而複合基板收送模組往上移動後即準備下一次之貼合對位工 作，如此反覆。 由上可知，於本發明基板之對位貼合方法中，上可撓基板係與該 載體基板一起移動作業，所以在對位過程中不會造成該上可撓基板發 生扭曲變形的情況，其最大的優點在於貼合前可輕易對偏移量做修 正，所以透過此方法係可以達到精密的對位貼合，故有效降低在貼合 過程中由於對位不精確所造成之瑕疵品，並可減少損耗以降低成本。 1248874 唯以上所述者，僅為本發明之較佳實施例而已，當不能以之阳— 本發明所實施之翻。即大凡依本發明申請專利細所作之均等變: 與修飾’皆應仍屬於本發明專利涵蓋之細内， 鑑，並祈惠准，是所至禱。 巧查委貝明 圖式簡單說明】 圖 圖， 圖一係為傳統捲軸式製造設備之生產過程的示意圖； 係為傳統捲軸式製造設備之生產過程的示意圖，· 係為傳統捲軸式製造設備之生產過程的示意圖,· 圖四係為傳統捲軸式製造設備之生產過程的示意圖； 圖五係為可撓性液晶顯示器之橫剖面示意圖； 圖六係為本發明中複合基板之橫剖面示意圖； 圖七係為本發明中複合基板之貼合過程示意圖； ^八係為本發财複合基板之—變化實施例之橫剖面示意圖； 圖九A係為本發明中上可撓基板之上視圖； 圖九B係為本發明中下可撓基板之上視圖； 合8种細絲、輯加工絲上可絲祕合成一複 係為本發明中複合基板之對位貼合裝置之示意圖，· =Α係為本發明中切割模組之局部放大示意圖； 圖十二B係為本發财切割模組之局部放大示意圖； 意圖 Z三係為本發财上可撓基板紛謂時之娜位置示意圖； 回四A係為本發明中製造與切割複合基板之一變化實施例的示 之另一變化實施例的 一立圖十四B係為本剌帽造與切割複合基板 不意圖； 1248874 圖十五A係為本發明中塗佈框膠與液晶之一實施例的示意圖； 圖十五B係為本發明中塗佈框膠與液晶之另一實施例的示意圖； 圖十六A係為本發明中上下可撓基板之對位貼合的示意圖； 圖十六B係為本發明中上下可撓基板之對位貼合的示意圖； 圖十七係為本發明中對位記號產生偏差之示意圖； 圖十八A係為本發明中修正對位記號偏差之示意圖； 圖十八B係為本發明中修正對位記號偏差之示意圖； 圖十九A係為本發明中液晶塗佈過程之示意圖； 圖十九B係為本發明中液晶塗佈過程之示意圖；以及 圖二十係為本發明中複合基板分離過程之示意圖。 【元件符號說明】 1- 捲軸式製程設備 11- 可撓性基板 12- 可撓性基板 13- 滾輪組 14- 吸附式移動平台 15- 皺褶 111-對位記號 121-對位記號 141-對位區域 2- 複合基板收送模組 21- 送料輪 22- 艇輪 23- 收料輪 3- 可撓性液晶顯示器模組 1248874 31- 上可撓基板 32- 下可撓基板 33- 液晶 34- 框膠 311-區域 313- 對位標記 314- 切割線 323-對位標記 333-對位標記 4- 切割模組 41-切割刀片 5- 刮板模組 51- 刮板 52- 刮板 61- CCD攝影機 62- CCD攝影機 63- 貼合區域 66-影像結果 7- 下基板收送模組 71- 送料輪 72- 收料輪 73- 真空吸附平台 8- 複合基板 81- 載體基板 82- 黏著物 83- 保護膜 1248874 811-通孔 9-導正模組 91-滾輪組 d-距離Therefore, the dicing module 4 does not completely cut the composite substrate 8, and at this time, the splicing 81 of the substrate 8+ and the upper slatable plate 31 are inferior to each other, and the composite is cut. The purpose of the substrate 8 is to facilitate the subsequent separation of the upper liftable substrate 31 from the carrier substrate μ after the upper flexible substrate 31 is bonded to the lower flexible substrate 32; when the cutting operation is completed, the cutting is performed. Blade 41 will revert to the situation shown in Figure 12A 1248874. Figure 12 is a schematic view showing the position of the flexible substrate on the cutting surface in the present invention. The cutting blade 41 of the cutting module 4 is cut along the position of the cutting line 314 (on the upper flexible base (4)), and the direction of the cutting is perpendicular to the conveying direction of the composite substrate 8. In addition, the process of cutting the composite substrate can be combined with the manufacturing process of the composite substrate, as shown in Fig. 14A. Applying the adhesive 82 to one of the upper flexible substrate 31 (or the carrier substrate 81), and attaching the upper flexible substrate 31 to the substrate 81 by the pressure applied by the roller set 91. After the carrier substrate 81 and the upper flexible substrate 32 are bonded together, the upper flexible substrate 31 is then spliced according to the fixed distance, and then the composite substrate 8 is placed on the composite substrate receiving module (not shown). Since the cutting depth is only the thickness of the upper liftable substrate 31, the butterfly device 4 does not completely conform to the substrate 8, and the carrier substrate 81 and the upper flexible substrate 31 are still in a bonded state. J, as shown in FIG. 14B, the upper flexible substrate 31 is directly cut at a fixed pitch, and then the hinge substrate 8 is not bonded, and then the composite substrate 8 is placed thereon. The composite substrate receiving module 2 performs the feeding, so that the cutting module is not required to perform the cutting operation. Figure 15A and Figure 15b are schematic views of the lower flexible substrate entering the bonding area. Figure 15A shows the case of only one display module, and Figure 15B shows the case of a number of display modules. In the present invention, the fine towel is applied, and the upper flexible layer and the lower removable substrate are adhered to the substrate, and the liquid crystal coating and the frame coating coating step are performed, that is, the liquid crystal and the sealant are coated. 3⁄4 under the flexible substrate - bonding surface, and coated in the display module enclosure. In Fig. 15A, the sealant 34 is applied on the surface of the lower flexible substrate 32 (in the display module area 311) and surrounds the closed rectangular shape, and then the liquid crystal% is applied to the frame. The bottom portion of the lower flexible substrate 32; in FIG. 15 and 6, the lower flexible substrate 32 has four display module regions 3U, in which case the liquid crystal 33 is also applied to the lower flexible substrate 15 1248874 The central portion of the plate 32 is coated on one side of the four display module areas 311 of the sealant 34 that is closer to the conforming area (center). This is to distribute the liquid crystal evenly between the upper flexible substrate and the lower flexible substrate during the subsequent bonding process. After the liquid crystal and the sealant are applied to the lower flexible substrate 32, the lower flexible substrate 32 enters a step of aligning with the composite substrate 8, as shown in FIG. 16a and FIG. The composite substrate receiving module 2 has the degrees of freedom of the χ direction, the γ direction, the Ζ direction, and the 0 direction because it is matched with the guiding module 9 , and the composite substrate 8 (refers to the upper flexible substrate 31 ) After the lower flexible substrate 32 reaches the positioning and completes the cutting (non-essential) and the liquid crystal and the sealant coating process (not necessary), the composite substrate receiving module 2 will cause the composite substrate 8 to be flexible. The substrate 32 is moved, as shown in FIG. 16a to FIG. 16 , because the guiding module 9 has a degree of freedom in the Z direction, the composite substrate receiving module 2 can be lowered and relatively close to the lower portion. The flexible substrate 32 is injected, and the composite substrate 8 is kept at a distance d from the lower wire plate 32 without directly contacting the composite substrate 8 with the liquid crystal 33 (to facilitate accurate subsequent alignment). In addition, a vacuum adsorption platform 73 adsorbs and fixes the lower flexible substrate 32. Next, the precise alignment of the composite substrate 8 and the lower flexible substrate 32 is started, as shown in Fig. 16B. The CCD camera 61 on the composite substrate 8 can capture an alignment mark image (not shown) of the upper flexible substrate 31 to a positioning unit (not shown) to determine the upper flexible substrate 31. It is the positioning, and (4) the position mark image is transmitted to the - alignment sheet it (not shown in the figure, the alignment material is used to determine that the alignment mark of the composite substrate 8 and the lower flexible substrate 32 is Aligning with each other; according to the fact that the composite substrate 8 and the lower flexible substrate 32 have reached the bonding area 63 (indicating that they are positioned with each other), but does not indicate the acoustic phase of the listening mark, _ need to borrow The high-precision alignment work is performed by the alignment unit. Therefore, after the alignment mark image captured by the CCD camera 61 and the CCD camera 62 enters the alignment unit, as shown in FIG. After the job registration mark 313 and the alignment mark 323 perform the calculation and analysis of the relevant position, the 1248874 image result 66 after the image processing is included in the image (the upper flexible substrate is marked 313 and the lower can be pulled The alignment mark 323 of the substrate is calculated via a central processing unit (not shown) After the offset Δχ, Δγ and the angular difference Δ θ between the alignment mark 3^3 and the alignment mark 323, the value of the offset= is transmitted from the central processing unit to the guiding module 9, which is a guiding mode The group 9 then π moves the a substrate receiving module 2 to make an offset in the X direction, the γ direction and the 0 direction, so that the alignment mark 313 and the alignment mark 323 can be paired with each other, thereby making the composite The substrate 8 and the lower flexible substrate 32 are positioned with high precision. As shown in FIGS. 18A to 18; 8 , the upper flexible substrate 31 and the alignment mark 313 on the surface of the lower flexible substrate 32 are The alignment mark 323 cannot be accurately aligned, so that after the offset correction is performed by the positive guide module (not shown), the alignment mark 313 and the alignment mark can be overlapped. Together, such as the state of the alignment mark 333. Once the composite substrate 8 and the lower flexible substrate 32 have been aligned with each other (as shown in FIG. 16B), the bonding process is started. Referring to FIG. 19A, A squeegee module 5 is disposed at the center of the splicing area, and the squeegee module 5 includes a squeegee 51 and a squeegee 52' Directly above the composite substrate 8 and the direction of the squeegee module (ie, the squeegee 51 and the squeegee 52) is perpendicular to the direction of transport of the composite substrate 8. The composite substrate 8 and the lower flexible substrate Before the bonding, the squeegee module 5 is lowered and brought into contact with the composite substrate 8, in order to partially recess the center of the composite substrate 8 (i.e., the region coated with the liquid crystal%), so that the composite substrate 8 and Since the lower flexible substrate 32 is in contact with the straight line at the time of bonding, air can be effectively prevented from remaining between the upper flexible substrate 31 and the lower flexible substrate 32 during the bonding process. As shown in the nineteenth B, the composite substrate receiving module (not shown) will start moving down to perform the bonding process. As the composite substrate 8 is lowered, the squeegee and the squeegee 52 are synchronously moved from the center to the left and right sides, so that the liquid crystal 33 is evenly distributed on the upper flexible substrate 31 and the lower flexible substrate 32. Between, so there is no ambiguity in it, according to this age is suitable for liquid filling in the general atmosphere and the fit $ 17 1248874 = 'The liquid crystal field has no step _ can be carried out under the shirt. In this embodiment, the carrier substrate 81_ can serve as a layer for protecting the upper flexible substrate 31, and avoids the styling of the gusset 51 and the board 52 (i.e., during the process of reading from the 33). The flexible substrate 31 is damaged. After the field slab 51 and the squeegee 52 are moved from the center of the composite substrate 8 to both sides, a step of aligning is performed in the present embodiment, and the light source (uv; not shown) is used in the present embodiment. When riding (turning the _), the sealant will start to solidify under the __, so that the flexible substrate 31 in the composite substrate 8 can be completely attached without the flexible substrate η. After the frame glue is cured, it enters the composite substrate separation process. As shown in FIG. 20, the composite substrate receiving module (not shown) moves upward, thereby driving the general wheel 22 and the plate 4 Group 5 and composite substrate 8-can move up. Since the previous cutting module 4 has previously cut the upper flexible substrate 31 in the composite substrate 8 (see FIG. 12a to FIG. 12b), the cured frame seal 34 will closely fit the upper portion. The adhesive substrate of the flexible substrate 31 and the lower flexible substrate 32' plus the sealant 34 is larger than the adhesive tape used for the composite substrate, the adhesive of the adhesive material 82 in FIG. 6, and the process towel of the turn 34 can be The composite substrate 8 is appropriately heated to lower the viscosity of the adhesive 82. Therefore, the upper (4) of the upper substrate 10 is separated from the side carrier substrate 81, and the flexible substrate 31 is transferred after the bonding. The surface of the lower flexible substrate 32 is then horizontally conveyed together with the lower flexible substrate 32, and the composite substrate receiving module is moved upward to prepare for the next bonding work. As can be seen from the above, in the alignment bonding method of the substrate of the present invention, the upper flexible substrate moves together with the carrier substrate, so that the upper flexible substrate does not be distorted during the alignment process, and The biggest advantage is that the offset can be easily corrected before the fitting, so the precise alignment can be achieved by this method, so that the defective product caused by the misalignment in the fitting process is effectively reduced, and Reduce losses to reduce costs. 1248874 It is only the above-described preferred embodiments of the present invention that are not exemplified by the present invention. That is to say, the average change made by the applicant in accordance with the patent application of the present invention: and the modification should still belong to the details covered by the patent of the present invention, and it is a prayer. Brief description of the simple description of the Beiming chart] Figure 1, Figure 1 is a schematic diagram of the production process of the traditional roll-type manufacturing equipment; is a schematic diagram of the production process of the traditional roll-type manufacturing equipment, · is a traditional roll-type manufacturing equipment Schematic diagram of the production process, Figure 4 is a schematic diagram of the production process of the conventional reel-type manufacturing equipment; Figure 5 is a schematic cross-sectional view of the flexible liquid crystal display; Figure 6 is a schematic cross-sectional view of the composite substrate of the present invention; 7 is a schematic view of the bonding process of the composite substrate in the present invention; ^ is a cross-sectional view of the modified embodiment of the eight-series-based composite substrate; FIG. 9A is a top view of the upper flexible substrate of the present invention; Nine B is a top view of the lower flexible substrate of the present invention; a combination of 8 kinds of filaments and a finely processed wire can be a schematic diagram of the alignment bonding device of the composite substrate in the present invention, ·=Α It is a partial enlarged schematic view of the cutting module in the present invention; Figure 12B is a partial enlarged schematic view of the cutting chip module of the present invention; Figure 4 is a schematic view of another variation of the embodiment of the manufacturing and cutting composite substrate of the present invention. Figure 14B is not intended for the manufacture and cutting of the composite substrate; 1248874 15A is a schematic view showing an embodiment of coating a sealant and a liquid crystal in the present invention; FIG. 15B is a schematic view showing another embodiment of coating a sealant and a liquid crystal in the present invention; The schematic diagram of the alignment of the upper and lower flexible substrates in the present invention; FIG. 16B is a schematic view of the alignment of the upper and lower flexible substrates in the present invention; FIG. 17 is a deviation of the alignment marks in the present invention. Figure 18 is a schematic diagram of the correction of the registration mark deviation in the present invention; Figure 18B is a schematic diagram of the correction of the alignment mark deviation in the present invention; Figure 19A is the liquid crystal coating process of the present invention. FIG. 19B is a schematic view showing a liquid crystal coating process in the present invention; and FIG. 20 is a schematic view showing a separation process of the composite substrate in the present invention. [Explanation of component symbols] 1-Rolling process equipment 11 - Flexible substrate 12 - Flexible substrate 13 - Roller set 14 - Adsorption type mobile platform 15 - Wrinkle 111 - Alignment mark 121 - Alignment mark 141 - Pair Bit Area 2 - Composite Substrate Receiving Module 21 - Feeding Wheel 22 - Boat Wheel 23 - Receiving Wheel 3 - Flexible LCD Module 1248874 31- Upper Flexible Substrate 32 - Lower Flexible Substrate 33 - LCD 34- Frame glue 311 - Area 313 - Alignment mark 314 - Cutting line 323 - Alignment mark 333 - Alignment mark 4 - Cutting module 41 - Cutting blade 5 - Scraper module 51 - Scraper 52 - Scraper 61 - CCD Camera 62- CCD Camera 63- Fitting Area 66-Image Results 7- Lower Substrate Receiving Module 71- Feeding Wheel 72- Receiving Wheel 73- Vacuum Adsorption Platform 8- Composite Substrate 81- Carrier Substrate 82- Adhesive 83- Protective film 1248874 811-through hole 9-conducting module 91-roller group d-distance