1248538 九、發明說明： 【發明所屬之技術領域】 本發明係提供一種光源組裝結構，尤指一種應用於一液 晶顯示器背光模組之發光二極體光源組裝結構。 【先前技術】 近年來，各種顯示技術不斷的蓬勃發展，經過持續的研 九開發之後，如液晶顯示器、電漿顯示器、有機發光二極 體顯示器等新產品，已逐漸的商業化並應用於各種尺寸以 及各種面積的顯示裝置。目前整個顯示器業界，無不朝向 而壳度以及高效率化發展，以期能製作出更具商業價值的 顯示器產品。而在液晶顯示器的各種關鍵零組件當中，用 來供應光源的背光模組，對液晶顯示器整體的發光效率有 舉足輕重的影響力，當背光模組本身具有優良的發光效率 時，不僅可以提昇液晶顯示器的亮度，也提供了液晶顯示 器中其他組件設計以及製造上的彈性，但是當背光模組本 身的發光效率不佳時，所能提供的光源有限，往往限制了 液晶顯示器產品的亮度表現。 在提高背光模組之發光效率的同時，提昇發光元件的發 光效率疋一項常用的改善方案。然而，在提昇發光元件的 1248538 損。因此，習知技術中係以螺絲18以及螺帽22來將金屬 基板14固定至背板16，藉由螺絲18鎖附至螺帽22時的 力量，來緊密挾持住金屬基板14以及背板16，使上述散 熱途徑中金屬基板14以及背板16的接觸面完整良好，所 以只要是當發光二極體光源12與金屬基板14間之焊接良 好時，發光二極體光源組裝結構10之整體散熱能力便可以 達到要求。 然而，這樣的設計雖然足以緊密挾持住金屬基板14以 及背板16，以使發光二極體光源組裝結構10的散熱能力 達到預期，但是卻必需使用螺絲18與螺帽22來做組裝， 於組裝時過於繁複，造成各種人力以及物力成本的增加。 而螺絲與螺帽的數量，依照實際需要，雖然會有所不同， 但卻不可能只有寥寥幾個，尤其是在一些大型背光模組 中，動辄裝設有數十或數百個發光二極體光源的情況下， 所使用的螺絲與螺帽的數量，必定甚為可觀，更加突顯了 這樣的問題。 因此，如何能發展出一種新的發光二極體光源組裝結 構，其不僅能夠將金屬基板緊密挾持至背板，使散熱途徑 中之各接觸面接觸良好，進而使發光二極體光源組裝結構 1248538 ^散熱犯力達到預期，又易於組裝，不至於有組裝過於繁 〜1題同蚪又具有低成本，便成為十分重要的課題。 【發明内容】 本么明之目的係提供一種背光模組中之發光二極 體光源組裝結構，以解決上述問題。 一 ° 在本發明之較佳實施例中，係提供一種背光模組之光源 組襄結構’該結構包含有至少—光源組以及-背板，該光 :組具有至少—發光元件以及-基板，該背板具有至少— 突出部。其中該基板係以可抽取的方式設置於該背板之 上，且該基板係被該背板以及該突出部所緊密挾持。 由於本發明之背光模組中之發光二極體光源組裝結 冓月板之至父大·出部與背板之間距係小於基板的厚 度’而因為背板本身之材w具㈣性，基板因此可以以可 抽取的方式被設置於背板之上，同時基板之至少一邊角或 是至少-側邊係被背板以及至少—突出部所緊密挾持。利 用背板以及突出部對於基板所施加的挾持力，基板不僅可 2緊密固定至背板之上，基板與背板_接觸面也將十 刀70正良好戶斤以，、要疋當發光二極體光源與基板間的焊 接良好時’光線自發光二極體光源發射出來時所伴隨產生 1248538 的…、將迅速經由基板傳導耸 到充分散熱的目的。同時由 —至空氣中，達 裝結構，完全免除 、、本^之發光二極體光源組 【實施方式】 請參考第2圖盥笫3 r 咕 4 3圖，4 2圖為本發明第-實施例之 U、之發光二極體光源組裝結構1GG的剖面示意 二3圖為第2圖之背光模組中之發光二極體光源組裝 100的上不圖。如第2圖與第3圖所示，本發明之發 光-極體光源組裝結構刚係包含有至少一發光二極體光 源1〇2 ’ 一用來承載發光二極體光源102之基板104，以及 月板106 °發光二極體光源102係被焊接至基板104之 表面基板1〇4係為一由金屬材質所製作而成的基板，以 便能傳導由發光二極體光源102所發散出來的熱，而基板 之材貝係可為|呂、銅、銘合金或是銅合金。背板1〇6亦由 金屬材質所製作而成，且背板106之材質係可為不銹鋼、 鋁、鋁合金、或是鍍鋅鋼板。 背板106之上具有至少—沖壓突出部108，沖壓突出部 108於經過特別的設計之後，可能會具有不同的形狀，例 如其突出部112可能為V字型、平面变、弧型、鋸齒型等。 1248538 但不論其形狀為何，沖壓突出部108之至少一突出部112 與背板106之間距，係小於基板104之厚度。且由於背板 106本身的金屬材質具有弹性’基板1 〇4因此將可以可抽 取的方式被設置於背板106之上，同時基板104之至少一 侧邊114係被背板106以及至少一沖壓突出部108所緊密 挾持。除此之外，因為實際上基板104與背板106有可能 非完全接觸，使其間有空氣層存在，而空氣的熱傳導效果 很差，因此，為了降低基板1〇4及背板1〇6之間空氣層存 在的機會，常加上導熱材質116，如導熱膠或導熱膏等， 以減少空氣層，進而增加熱傳導效果。而是否加上導電材 質Π6，或是否整面塗佈，完全視實際的需要，第2圖中 係以加上導電材質116並且整面塗佈為例。在這樣的情況 之下，不僅可以將基板104固定至背板106之上，更由於 背板106以及沖壓突出部108對於基板1〇4所施加的挾持 力’基板104與背板1〇6的接觸面將會十分完整良好。所 以只要是當發光二極體光源102與基板104間的焊接良好 時，光線自發光二極體光源102發射出來時伴隨而產生的 熱，將迅速經由基板104以及導電材質116傳導至背板 106，再傳導至空氣中，達到充分散熱的目的。且由於製作 沖壓突出部108時，係利用沖壓的方式來對背板1〇6加工， 故背板106與沖壓突出部108係一體成型，因此在能夠達 1248538 • 到緊密固定基板104的前提之下，可以儘量選擇將沖壓突 ‘ 出部108製作於背板106的外緣，完全不至於影響到背板 106的散熱能力。 此外’基板104的功用除了係用來承載發光二極體光源 102以及導熱之外，由於其上還設置有各種線路（未顯示）， 也具有提供發光二極體光源1〇2電性連接至其他組件的功 用。也正是因為如此，發光二極體光源組裝結構1〇〇之散春 熱問題必需被妥善處理，因為當散熱處理不良時，不僅會 k成基板104以及背板1〇6上之電路（未顯示）的損傷，亦 容易使發光二極體光源1〇2受損。由於本實施例中所提供 的結構完全未使用到螺絲，因此不會衍生組裝過於繁複、 成本被提南等問題。 請參考第4圖，第4圖為本發明第二實施例之一背光模鲁 組中之發光二極體光源組裝結構2〇〇的上示意圖。如第4 圖所示’本發明之發光二極體光源組裝結構200係包含有 至少一發光二極體光源202，一用來承載發光二極體光源 202之基板204，以及一背板2〇6。發光二極體光源2〇2係 被焊接至基板204之表面，基板204以及背板206均由金 屬材質所製作而成，以便能傳導由發光二極體光源202所 發散出來的熱。背板206之上具有至少一沖壓突出部208， 11 1248538 沖壓突出部208於經過特別的設計之後，可能會具有不同 的形狀。但不論其形狀為何，沖壓突出部208之至少一突 出部212與背板206之間距，係小於基板204之厚度。且 由於背板206本身的金屬材質具有彈性，基板2〇4因此將 可以可抽取的方式被設置於背板206之上，同時基板2〇4 之至y 邊角214係被背板206以及至少一沖壓突出部208 所緊密挾持。 除此之外’因為實際上基板204與背板206有可能非完籲 全接觸，使其間有空氣層存在，空氣的熱傳導效果很差， 因此，為了降低基板204及背板206之間空氣層存在的機 會，常加上導熱材質216，如導熱膠或導熱膏等，以減少 空氣層，進而增加熱傳導效果。而是否加上導電材質216， 或是否整面塗佈，完全視實際的需要’第4圖中係以加上 導電材質216並且整面塗佈為例。在這樣的情況之下，不 僅可以將基板204固定至背板206之上，更由於背板施# 以及沖壓突出部施對於基板2G4所施加的挾持力，基板 204與背板206的接觸面將會十分完整良好。所以只要是 當發光二極體光源202與基板204間的焊接良好時，光線 自發光二極體光源202發射出來時伴隨而產生的敎，將迅 速經由基板204以及導電材質216傳導至背板2〇6，再傳 導至空氣中’達到充分散熱的目的。此外’本實施例中的 其他部分與第一實施例相同。 12 1248538 值得注意的是，本發明中亦可同時應用沖壓突出部以及 背板來緊密挾持基板的側邊與邊角，來達到同樣的目的， 且設置於背板上之基板數量，以及設置於基板上之發光二 極體光源數量，均可以視實際情況來做調整，並沒有特別 的限制。除此之外，本發明亦可同時應用螺絲、螺帽以及 沖壓突出部來將基板固定至背板，並同時達到減少螺絲、 螺帽使用數量的目的。請參考第5圖，第5圖為本發明第 三實施例之一背光模組中之發光二極體光源組裝結構3〇〇 的剖面示意圖。如第5圖所示，本發明之發光二極體光源 組裝結構300係包含有一發光二極體光源302，一用來承 載發光二極體光源302之基板304，以及一背板306。發光 一極體光源302係被焊接至基板304之表面，基板3 04以 及背板306均由金屬材質所製作而成，以便能傳導由發光 二極體光源302所發散出來的熱。為了降低基板304及背 板306之間空氣層存在的機會，可選擇性地將導熱材質加 在基板304及背板306之間，進而增加熱傳導效果，而第 5圖中係以未加上導電材質為例。 背板306之上除了具有至少一沖壓突出部308之外，還 同時具有至少一螺孔312，因此，基板304不僅是被背板 306以及沖壓突出部308所緊密挾持，也同時被螺絲314 以及螺帽316固定至背板306。在這種情況之下，藉由背 13 1248538 •板306以及沖壓突出部308對於基板3〇4所施加的挟持 力，以及螺絲M4鎖附至螺帽316時的力量，基板3〇4與 背板306的接觸面將會十分完整良好。所以只要是當發光 二極體光源302與基板斯間的焊接良好時，光線^發光 二極體光源302發射出來時伴隨而產生的熱，將迅速經由 基板3〇4傳導至背板306,再傳導至空氣中達到充分散 熱的目的。雖絲實施例中仍然使用了部份的螺絲與螺 帽’但由於部份的螺絲與螺帽已經被沖壓突出部所取代，# 所以將會有效改善習知技術中因螺絲、螺帽數量太多，所 衍生的組裝過於繁複、成本被提高等問題。此外，本實施 例的其他部分與第一實施例相同。 請參考第6圖，第6圖為本發明第四實施例之一背光模 組中之發光二極體光源組裝結構33〇的剖面示意圖。如第 6圖所示，在本發明第四實施例之背光模組中之發光二極春 體光源組褒結構330中，螺帽也可以被換成埋入背板336 的螺4銅柱348，再加上沖壓突出部338對於基板334所 她加的挾持力，將基板334固定至背板336。請參考第7 圖第7圖為本發明第五實施例之一背光模組中之發光二 極體光源組裝結構36〇的剖面示意圖。如第7圖所示，本 孓月之毛光—極體光源組裝結構中亦可使用鉚釘 14 1248538 378 ’再加上沖壓突出冑施對於基板364所施加的挟持 力’將基板364固定至背板366。 、 請參考第8圖，帛8圖為本發明之背光模組中之發光二 極體光源組裝結構應用於液晶顯示器4〇〇時之運作示音 圖。如第8圖所示，液晶顯示器4〇〇之中包含有一背光模 組搬以及-设置於其上方之液晶面板4〇4,背光模組術 之中除了包含有發光二極體光源組裝結構406之外，還包 含有至少一導光板408，而發光二極體光源組裝結構4〇6 可以為本發明巾所揭露的任何-種發光二極體光源組裝結 構。從發光二極體光源組裝結構4〇6所發射出來的光線， 將會射入導光板侧之内，然後經由導光板侧内部之光 學機制（未顯示）成為均勻的面光源，再 _，經過液晶*板辦液晶分子412的連續折射 最後產生影像。 由於本發明之背光模組之發光二極體光源組裝結構，係 利用月板]^及大出部對於基板所施加的挾持力，來將基板 緊被固疋至背板之上，使基板與背板的接觸面十分完整良 好所以只要是當發光二極體光源與基板間的焊接良好 夺光線自發光二極體光源發射出來時伴隨而產生的熱， 將迅H由基板傳導至背板，再傳導至空氣中，達到充分 15 1248538 政熱的目的。當應用本發明之背光模組之發光二極體光源 組裝結構於一實際生產線時，將可以製作出合乎散熱規 格、便於組裝以及低成本的產品。 相較於習知之背光模組之發光二極體光源組裝結構，本 發明之背光模組之發光二極體光源組裝結構，背板之至少 一突出部與背板之間距，係小於基板的厚度。又因為背板 本身之材質具有彈性，如此一來，基板將可以可抽取的方 式被設置於背板之上，同時基板之至少一邊角或是至少一 側邊係被背板以及至少一突出部所緊密挾持。利用背板以 及突出部對於基板所施加的挾持力，基板不僅可以被緊密 固定至背板之上，基板與背板間的接觸面也將十分完整良 好。所以只要是當發光二極體光源與基板間的焊接良好 時，光線自發光二極體光源發射出來時所伴隨產生的熱， 將迅速經由基板傳導至背板，再傳導至空氣中，達到充分 散熱的目的。同時由於本發明之發光二極體光源組裝結 構，完全免除或部份免除掉螺絲的使用，因此不會衍生組 裝過於繁複，以至於提高成本的問題。 以上所述僅為本發明之較佳實施例，凡依本發明申請專 利範圍所做之均等變化與修飾，皆應屬本發明專利之涵蓋 範圍。 16 1248538 【圖式簡單說明】 第1圖為習知技術之一背光模組中之發光二極體光源組 裝結構的剖面示意圖。 第2圖為本發明第一實施例之一背光模組中之發光二極 體光源組裝結構的剖面示意圖。 第3圖為第2圖之背光模組中之發光二極體光源組裝結 構的上不圖。 第4圖為本發明第二實施例之一背光模組中之發光二極 體光源組裝結構的上示意圖。 第5圖為本發明第三實施例之一背光模組中之發光二極 體光源組裝結構的剖面示意圖。 第6圖為本發明第四實施例之一背光模組中之發光二極 體光源組裝結構的剖面不意圖。 第7圖為本發明第五實施例之一背光模組中之發光二極 體光源組裝結構的剖面示意圖。 第8圖為本發明之背光模組中之發光二極體光源組裝結 構應用於液晶顯示器時之運作示意圖。 【主要元件符號說明】 10、100、200、300、406、330、360 發光二極體光源 組裝結構 17 1248538 12、102、202、302 發光二極體光源 14 金屬基板 16、106、206、306、336、366 背板 18、314 螺絲 22、316 螺帽 104、204、304、334、364 基板 108、208、308、338、368 沖壓突出部1248538 IX. Description of the Invention: [Technical Field] The present invention provides a light source assembly structure, and more particularly to an LED diode light source assembly structure applied to a liquid crystal display backlight module. [Prior Art] In recent years, various display technologies have continued to flourish. After continuous research and development, new products such as liquid crystal displays, plasma displays, and organic light-emitting diode displays have been gradually commercialized and applied to various products. Dimensions and display devices of various sizes. At present, the entire display industry is moving toward the shell and high efficiency, in order to produce more commercially valuable display products. Among the various key components of the liquid crystal display, the backlight module for supplying the light source has a significant influence on the overall luminous efficiency of the liquid crystal display. When the backlight module itself has excellent luminous efficiency, the liquid crystal display can be improved. The brightness also provides flexibility in the design and manufacture of other components in the liquid crystal display. However, when the backlight module itself has poor luminous efficiency, the limited light source can be provided, which often limits the brightness performance of the liquid crystal display product. In order to improve the luminous efficiency of the backlight module, it is a common improvement solution to improve the light-emitting efficiency of the light-emitting element. However, the 1248538 loss of the light-emitting element is increased. Therefore, in the prior art, the metal substrate 14 is fixed to the back plate 16 by the screw 18 and the nut 22, and the metal substrate 14 and the back plate 16 are tightly held by the force when the screw 18 is locked to the nut 22. Therefore, the contact surface of the metal substrate 14 and the back plate 16 in the heat dissipation path is intact, so that the heat dissipation of the LED assembly structure 10 is good as long as the soldering between the LED source 12 and the metal substrate 14 is good. The ability can meet the requirements. However, such a design is sufficient to closely hold the metal substrate 14 and the back plate 16 so that the heat dissipation capability of the LED light source assembly structure 10 is expected, but it is necessary to use the screw 18 and the nut 22 for assembly and assembly. It is too complicated, resulting in an increase in various human and material costs. The number of screws and nuts, according to actual needs, although it will be different, but it is impossible to have only a few, especially in some large backlight modules, there are dozens or hundreds of light-emitting two In the case of a polar light source, the number of screws and nuts used must be considerable, which further highlights such problems. Therefore, how to develop a new LED light source assembly structure, which not only can hold the metal substrate tightly to the back plate, so that the contact surfaces of the heat dissipation path are in good contact, and thus the light-emitting diode light source assembly structure 1248538 ^The heat sinking force is expected to be expected, and it is easy to assemble. It is not too complicated to assemble. It is a very important issue. SUMMARY OF THE INVENTION The purpose of the present invention is to provide an LED diode light source assembly structure in a backlight module to solve the above problems. In a preferred embodiment of the present invention, a light source group structure of a backlight module is provided. The structure includes at least a light source group and a back plate, the light group having at least a light emitting element and a substrate. The backing plate has at least a projection. The substrate is detachably disposed on the backing plate, and the substrate is tightly held by the backing plate and the protruding portion. Because the light-emitting diode source in the backlight module of the present invention is assembled, the distance between the parent and the moon is smaller than the thickness of the substrate, and because the material of the back plate itself is (four), the substrate Therefore, it can be disposed on the backboard in an extractable manner, and at least one corner or at least a side of the substrate is tightly held by the backboard and at least the protrusion. By using the backing plate and the holding force exerted on the substrate by the protruding portion, the substrate can be tightly fixed not only to the backing plate, but also the substrate and the backing plate _ the contact surface is also good for the ten knives, and the illuminating two When the welding between the polar body light source and the substrate is good, the light emitted from the light-emitting diode light source is accompanied by 1248538, which will quickly pass through the substrate to fully dissipate heat. At the same time - from the air to the air, the structure is completely exempted, and the light-emitting diode source group of the present invention [implementation] Please refer to Figure 2 盥笫3 r 咕4 3 diagram, 4 2 diagram is the first of the invention - FIG. 5 is a schematic cross-sectional view of the LED light source assembly structure 1GG of FIG. 2 and FIG. 3 is a top view of the LED assembly 100 of the backlight module of FIG. As shown in FIG. 2 and FIG. 3, the illuminating-pole source assembly structure of the present invention comprises at least one illuminating diode source 1 〇 2 ′, a substrate 104 for carrying the illuminating diode source 102, And the moon plate 106 ° light-emitting diode light source 102 is soldered to the surface substrate of the substrate 104 1 〇 4 is a substrate made of metal material, so as to be able to conduct the light emitted by the light-emitting diode light source 102 Heat, and the base material of the substrate can be | Lu, copper, Ming alloy or copper alloy. The back plate 1〇6 is also made of a metal material, and the material of the back plate 106 may be stainless steel, aluminum, aluminum alloy, or galvanized steel. There is at least a stamped protrusion 108 above the backing plate 106. The stamped protrusion 108 may have a different shape after being specially designed. For example, the protrusion 112 may be V-shaped, flat, curved, and serrated. Wait. 1248538 However, regardless of its shape, the distance between the at least one protrusion 112 of the stamped protrusion 108 and the backing plate 106 is less than the thickness of the substrate 104. And because the metal material of the backing plate 106 itself has an elastic 'substrate 1 〇 4, it can be detachably disposed on the backing plate 106, while at least one side 114 of the substrate 104 is backed by the backing plate 106 and at least one stamping. The protrusion 108 is tightly held. In addition, since the substrate 104 and the backing plate 106 may in fact be incomplete contact, there is an air layer between them, and the heat conduction effect of the air is poor. Therefore, in order to lower the substrate 1〇4 and the backing plate 1〇6 The opportunity for the presence of an air layer is often combined with a thermally conductive material 116, such as a thermal paste or a thermal paste, to reduce the air layer and thereby increase the heat transfer. Whether or not the conductive material Π6 is added or whether the entire surface is coated is completely dependent on the actual needs. In Fig. 2, the conductive material 116 is added and the entire surface is coated as an example. Under such circumstances, not only the substrate 104 can be fixed to the backing plate 106, but also the holding force of the backing plate 106 and the stamping protrusion 108 to the substrate 1〇4, the substrate 104 and the backing plate 1〇6. The contact surface will be very complete. Therefore, as long as the soldering between the LED source 102 and the substrate 104 is good, the heat generated when the light is emitted from the LED source 102 will be quickly transmitted to the backing plate 106 via the substrate 104 and the conductive material 116. Then, it is conducted to the air to achieve the purpose of sufficient heat dissipation. Moreover, since the backing plate 1 is processed by stamping when the stamping protrusion 108 is formed, the backing plate 106 and the stamping protrusion 108 are integrally formed, so that it can reach 1248538 • to firmly fix the substrate 104. Next, the stamping protrusion 'outlet 108 can be selected as far as possible to the outer edge of the backing plate 106, so as not to affect the heat dissipation capability of the backing plate 106. In addition, the function of the substrate 104 is not only used to carry the light-emitting diode light source 102 but also heat conduction, and since various lines (not shown) are also disposed thereon, the light-emitting diode light source 1 2 is also electrically connected to The function of other components. It is precisely because of this that the problem of the spring heat of the assembled structure of the light-emitting diode source must be properly handled, because when the heat dissipation process is poor, not only the circuit on the substrate 104 and the back plate 1〇6 will be formed (not The damage shown is also easy to damage the light-emitting diode source 1〇2. Since the structure provided in this embodiment does not use the screw at all, there is no problem that the assembly is too complicated and the cost is raised. Please refer to FIG. 4, which is a top view of the assembled structure of the LED light source in the backlight module of the second embodiment of the present invention. As shown in FIG. 4, the LED light source assembly structure 200 of the present invention includes at least one light emitting diode light source 202, a substrate 204 for carrying the light emitting diode light source 202, and a back plate 2 6. The light-emitting diode light source 2〇2 is soldered to the surface of the substrate 204, and the substrate 204 and the back plate 206 are both made of a metal material so as to be able to conduct heat radiated by the light-emitting diode light source 202. Above the backing plate 206 there is at least one stamped projection 208, 11 1248538 stamped projections 208 which may have different shapes after being specially designed. However, regardless of its shape, the distance between the at least one projection 212 of the stamped projection 208 and the backing plate 206 is less than the thickness of the substrate 204. And because the metal material of the back plate 206 itself is elastic, the substrate 2〇4 will thus be detachably disposed on the back plate 206, while the substrate 2〇4 to the y corner 214 is backed by the back plate 206 and at least A stamped projection 208 is tightly held. In addition, because the substrate 204 and the back plate 206 may be incomplete contact with each other, there is an air layer between them, and the heat conduction effect of the air is poor. Therefore, in order to reduce the air layer between the substrate 204 and the back plate 206, The opportunity exists, often with a thermal conductive material 216, such as thermal adhesive or thermal paste, to reduce the air layer, thereby increasing the heat transfer effect. Whether or not the conductive material 216 is added, or whether the entire surface is coated, depends entirely on the actual needs. In the fourth drawing, the conductive material 216 is added and the entire surface is coated as an example. Under such circumstances, not only can the substrate 204 be fixed to the backing plate 206, but also the contact surface of the substrate 204 and the backing plate 206 will be due to the holding force applied by the backing plate and the stamping protrusion to the substrate 2G4. Will be very complete and good. Therefore, as long as the soldering between the LED source 202 and the substrate 204 is good, the enthalpy generated when the light is emitted from the LED source 202 will be quickly transmitted to the backplane 2 via the substrate 204 and the conductive material 216. 〇 6, and then conduct into the air to achieve the purpose of full heat dissipation. Further, the other portions in this embodiment are the same as those in the first embodiment. 12 1248538 It should be noted that in the present invention, the stamping protrusion and the back plate can be simultaneously applied to closely hold the side edges and the corners of the substrate to achieve the same purpose, and the number of substrates disposed on the back board is set and The number of light-emitting diode light sources on the substrate can be adjusted according to actual conditions, and there is no particular limitation. In addition, the present invention can also simultaneously apply screws, nuts, and stamping protrusions to fix the substrate to the backing plate, and at the same time achieve the purpose of reducing the number of screws and nuts used. Referring to FIG. 5, FIG. 5 is a cross-sectional view showing a light-emitting diode light source assembly structure 3〇〇 in a backlight module according to a third embodiment of the present invention. As shown in FIG. 5, the LED assembly structure 300 of the present invention comprises a light emitting diode source 302, a substrate 304 for carrying the LED source 302, and a backing plate 306. The light-emitting one-pole light source 302 is soldered to the surface of the substrate 304, and the substrate 304 and the back plate 306 are both made of a metal material so as to be able to conduct heat radiated from the light-emitting diode light source 302. In order to reduce the chance of the air layer between the substrate 304 and the backing plate 306, a thermally conductive material may be selectively applied between the substrate 304 and the backing plate 306 to increase the heat conduction effect, and in FIG. 5, the conductive layer is not added. The material is an example. The back plate 306 has at least one screw hole 312 in addition to at least one punching protrusion 308. Therefore, the substrate 304 is not only closely held by the back plate 306 and the punching protrusion 308, but also by the screw 314 and The nut 316 is secured to the backing plate 306. In this case, by the back 13 1248538 • the plate 306 and the stamping protrusion 308 exert a holding force on the substrate 3〇4, and the force when the screw M4 is locked to the nut 316, the substrate 3〇4 and the back The contact surface of the plate 306 will be very intact. Therefore, as long as the soldering between the light-emitting diode source 302 and the substrate is good, the heat generated when the light-emitting diode light source 302 is emitted will be quickly transmitted to the backing plate 306 via the substrate 3〇4, and then Conducted into the air for the purpose of sufficient heat dissipation. Although some screws and nuts are still used in the wire embodiment, but some screws and nuts have been replaced by stamped protrusions, # will effectively improve the number of screws and nuts in the prior art. More, the resulting assembly is too complicated and the cost is increased. Further, other parts of the embodiment are the same as those of the first embodiment. Please refer to FIG. 6. FIG. 6 is a cross-sectional view showing a light-emitting diode light source assembly structure 33A in a backlight module according to a fourth embodiment of the present invention. As shown in FIG. 6, in the light-emitting diode spring light source group structure 330 in the backlight module of the fourth embodiment of the present invention, the nut can also be replaced with the screw 4 copper pillar 348 buried in the back plate 336. In addition, the stamping protrusion 338 is attached to the backing plate 336 for the holding force of the substrate 334. Please refer to FIG. 7 and FIG. 7 for a cross-sectional view of a light emitting diode light source assembly structure 36 in a backlight module according to a fifth embodiment of the present invention. As shown in Fig. 7, this month's hair-polar body light source assembly structure can also be used to fix the substrate 364 to the back using rivets 14 1248538 378 'plus the stamping force applied to the substrate 364. Board 366. Please refer to FIG. 8 , which is a schematic diagram of the operation of the LED light source assembly structure of the backlight module of the present invention applied to a liquid crystal display. As shown in FIG. 8, the liquid crystal display 4 includes a backlight module and a liquid crystal panel 4〇4 disposed thereon, and the backlight module includes a light emitting diode assembly structure 406. In addition, at least one light guide plate 408 is included, and the light emitting diode light source assembly structure 4〇6 can be any light-emitting diode light source assembly structure disclosed in the invention. The light emitted from the LED light source assembly structure 4〇6 will be incident into the side of the light guide plate, and then become a uniform surface light source through an optical mechanism (not shown) inside the light guide plate side, and then The continuous refraction of the liquid crystal molecules 412 of the liquid crystal* board finally produces an image. Because of the assembly structure of the LED light source of the backlight module of the present invention, the substrate is tightly fixed to the back plate by using the holding force applied to the substrate by the moon plate and the large portion, so that the substrate and the substrate are The contact surface of the back plate is very complete, so as long as the heat generated by the light-emitting diode light source and the substrate is good when the light is emitted from the light-emitting diode light source, the fast H is transmitted from the substrate to the back plate. It is then conducted into the air to achieve the goal of 15 1248538 political heat. When the LED light source assembly structure of the backlight module of the present invention is applied to an actual production line, it is possible to produce a product that is compatible with heat dissipation specifications, is easy to assemble, and low in cost. Compared with the conventional LED light source assembly structure of the backlight module, the LED module assembly structure of the backlight module of the present invention, the distance between at least one protruding portion and the back plate of the back plate is less than the thickness of the substrate . Moreover, because the material of the backboard itself is elastic, the substrate can be detachably disposed on the backboard, and at least one corner or at least one side of the substrate is supported by the backboard and at least one protrusion. Closely held. The backing plate and the holding force exerted on the substrate by the protruding portion can not only be tightly fixed to the backing plate, but also the contact surface between the substrate and the backing plate can be completely intact. Therefore, as long as the soldering between the light emitting diode and the substrate is good, the heat generated when the light is emitted from the light emitting diode light source will be quickly transmitted to the backing plate via the substrate and then conducted to the air to reach sufficient The purpose of heat dissipation. At the same time, due to the assembled structure of the light-emitting diode source of the present invention, the use of the screw is completely eliminated or partially eliminated, so that the assembly is not complicated, so that the cost is increased. The above are only the preferred embodiments of the present invention, and all changes and modifications made to the patentable scope of the present invention should be covered by the present invention. 16 1248538 [Simple description of the drawings] Fig. 1 is a schematic cross-sectional view showing the assembled structure of the light-emitting diode source in a backlight module of one of the prior art. 2 is a cross-sectional view showing an assembly structure of a light emitting diode light source in a backlight module according to a first embodiment of the present invention. Fig. 3 is a top view of the assembled structure of the light-emitting diode light source in the backlight module of Fig. 2. Fig. 4 is a top plan view showing an assembly structure of a light-emitting diode light source in a backlight module according to a second embodiment of the present invention. Fig. 5 is a cross-sectional view showing the assembled structure of the light emitting diode light source in the backlight module of the third embodiment of the present invention. Fig. 6 is a cross-sectional view showing the assembly structure of the light-emitting diode light source in the backlight module of the fourth embodiment of the present invention. Figure 7 is a cross-sectional view showing the assembled structure of the light-emitting diode source in a backlight module according to a fifth embodiment of the present invention. FIG. 8 is a schematic view showing the operation of the LED light source assembly structure in the backlight module of the present invention applied to a liquid crystal display. [Description of main component symbols] 10, 100, 200, 300, 406, 330, 360 Light-emitting diode light source assembly structure 17 1248538 12, 102, 202, 302 Light-emitting diode light source 14 Metal substrate 16, 106, 206, 306 , 336, 366 back plate 18, 314 screws 22, 316 nuts 104, 204, 304, 334, 364 substrates 108, 208, 308, 338, 368 stamping protrusions
112 > 212 突出部 114 侧邊 214 邊角 116、216 導電材質 312 螺孔 348 螺絲銅柱 378 鉚釘 400 液晶顯不裔 402 背光模組 404 液晶面板 408 導光板 412 液晶分子112 > 212 Projection 114 Side 214 Corner 116,216 Conductive material 312 Screw hole 348 Screw copper column 378 Rivet 400 LCD display 402 Backlight module 404 LCD panel 408 Light guide 412 Liquid crystal molecules
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