^4-8182 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種避免散熱片與銲線接觸的封裝結構及其製程， 特別是一種在晶片中央設置一支撐結構來避免散熱片壓迫到下方銲線 的封裝結構及其製程。 【先前技術】 隨著ic晶片内部線路積紐不斷攀升，如㈣熱有效且迅速的 排出已成為1C晶片封裝製程中所面臨的重要課題，因此具有高熱傳 導係數特性的金屬散刻就常被制在封裝製程中，並且在進行封膠 私序時’龜接將散熱#鮮在承載—“並處於預熱狀態下的基板 ,’、、後起置人-換具中’之後再將—縣的封裝膠體例如環氧樹 脂壓入模具，使其包封(enca_ate)模穴内的元件，並在冷卻後進行 封裝結構的f裁步驟。但是麵行__財，產生形變的散熱片 卻經常會魏到下方的銲線而導致銲線移位甚至斷裂，而第—A圖與 第-B圖即顯示進行封膠步驟時散熱片的形變情況。 參照第一 A圖，在進行封膠步驟前，—晶片”已藉銲線12(例 如金線)而電性連接於—基板13上，而散熱以職-黏綱15 例如銀細設於基板13上的承載區域⑽中未示），並將晶U 與鲜線罩於射；此時模具16係沿箭頭把方向移向基板13, 5 以期猎由形成於模且16 μ a 入的範圍。 ^ W果八彳61而定義出之後封裝膠體所能填^4-8182 IX. Description of the Invention: [Technical Field] The present invention relates to a package structure and a process for preventing contact between a heat sink and a bonding wire, and more particularly, a support structure is disposed in the center of the wafer to prevent heat sink compression The package structure and process of the lower bonding wire. [Prior Art] As the internal circuit of the ic chip continues to rise, such as (4) heat efficient and rapid discharge has become an important issue in the 1C chip packaging process, metal scattering with high thermal conductivity characteristics is often made. In the packaging process, and in the private order of the sealant, the turtle will heat up # fresh in the load--"the substrate in the preheated state, ', and then the person-replacement in the 'after' The encapsulant, such as epoxy resin, is pressed into the mold to enclose (enca_ate) the components in the cavity, and after cooling, the package structure is cut. However, the fins that generate the deformation often Wei to the lower wire bond causes the wire to be displaced or even broken, while the first-A and the -B images show the deformation of the heat sink during the sealing step. Referring to Figure A, before the sealing step , the "wafer" has been electrically connected to the substrate 13 by a bonding wire 12 (for example, a gold wire), and the heat dissipation is performed on the carrier-bonding region (10), for example, silver is finely disposed on the substrate 13 (not shown). Place the crystal U with the fresh wire cover; at this time, the mold 16 is along the line. The arrow moves the direction toward the substrate 13, 5 in order to hunt from the range formed by the mold and 16 μ a. ^ W fruit gossip 61 and defined after the encapsulation colloid can be filled
接者參照第一 B圖，當模具16塵合至散熱片14時，模穴161 則會與散熱片u結射最頂端的環狀凸起141貼合以防止之㈣ 膠體遍入散熱片14頂部的空間因而降低散熱的效果；但是當模穴W 7施予環彳㈣141 —伽㈣力場朗《合而如 •佳的_酬，何峨，此㈣靖卿^產生 形變而向下彎曲成一弧面 線12而鮮產納立其η 接壓迫到下方細微的銲 和位甚至斷裂’進而影響封裝成品的良率。 【發明内容】 ，有4^於上述發明背景中，散熱片經常屢迫到下方的銲線而導致其 驾供—崎編靖_的封裝結 α Γ肩75在賴觸祕爾[仍可在封膠過 呈避免放熱片壓迫到銲線，因而解決習知技術所面臨的問題。 社構mr目的，本發明提供—種避免散糾與銲線接觸的封裝 :二=程’本發明係在晶片上方設置—間隔物以及—可撞性結揭 :且广結構，因而當模具緊貼散熱片而導致散熱片產切變 時，可撓性結構的頂部則直接 迫到下方的銲線。 ”.、而不會讓散熱片壓 1248182 【實施方式】 本發明的一些實施例會詳細描述如下。然而，除了該詳細描述外， 本發明還可以廣泛地在其他的實施例施行。亦即，本發明的範圍不受 已提出之實施例的限制，而應以本發明提出之申請專利範圍為準。复 次，當本發明之實施例圖示中的各元件或結構以單一元件或結構描述 °兒明日守，不應以此做為有限定的認知，即如下之說明未特別強調數目 上的限制時，本發明之精神與應用範圍可推及多數個元件或結構並存 的結構與方法上。再者，在本說明書中，各元件之不同部分並沒有依 知尺寸繪®，某些尺度與其他相關尺餘比已經被誇張或是簡化，以 提供更清楚的描述和本發明的理解。而本發明所沿用的現有技藝，在 此僅作重點式的引用，以助本發明的闡述。Referring to FIG. B, when the mold 16 is dusted to the heat sink 14, the cavity 161 is attached to the top end annular projection 141 of the heat sink u to prevent the (4) colloid from entering the heat sink 14. The space at the top thus reduces the effect of heat dissipation; but when the cavity W 7 is applied to the ring (four) 141 - gamma (four) force field Lang "he is like a good _ reward, He Wei, this (four) Jingqing ^ produces deformation and bends down into an arc The upper thread 12 is freshly produced, and the η is pressed to the subtle weld and the bit is broken, which in turn affects the yield of the packaged product. SUMMARY OF THE INVENTION In the background of the above invention, the heat sink is often forced to the underlying bonding wire to cause its driving supply - the package of the 编 靖 _ α α 75 75 75 75 75 75 75 75 75 75 [ [ [ [ [ [ The sealant is overheated to prevent the heat release sheet from being pressed to the weld line, thus solving the problems faced by the prior art. For the purpose of the mechanism mr, the present invention provides a package for avoiding contact between the wire and the wire: the invention is provided above the wafer - spacers and - crashability: and the structure is wide, so when the mold is tight When the heat sink is attached to the heat sink and the heat sink is sheared, the top of the flexible structure is directly forced to the lower bonding wire. The embodiment of the present invention will be described in detail below. However, the present invention can be widely applied to other embodiments in addition to the detailed description. The scope of the invention is not limited by the scope of the present invention, but the scope of the invention as set forth in the present invention is the subject of the invention. The elements or structures in the embodiments of the invention are described as a single element or structure. The present invention should not be construed as limiting the scope of the invention. The spirit and scope of the present invention may be combined with the structure and method in which a plurality of elements or structures coexist. Moreover, in this specification, different parts of the various elements are not drawn to the dimensions, and certain dimensions and other related scales have been exaggerated or simplified to provide a clearer description and an understanding of the present invention. The prior art to which the present invention pertains is hereby incorporated by reference in its entirety to the extent of the disclosure.
依據本發明之-較佳具體實施_提供—種避免散熱片與鲜線接 觸之封裝結構及其製程。首先參照第二八圖，在尚未進行娜步驟前， 係先形成-半成品封裝結構，固定—晶片21於—基板23上，並且進 行打線接合程序，藉由複數條銲線22而完成晶片21絲板Μ之間 的電性連接。接著，藉由一黏著材料(圖中未示)而固定一間隔物 (spacer)27於日日片21中央，然後再藉由另—黏著材料(圖中未示)固 定-可撓性結構28於間隔物27上。最後則藉—黏著材料％固定一 散熱結構例如散熱片24於基板23上，並且籠罩住晶片21、_22、 間隔物27以及可棱性結構28。此時，具有模_的模具26就可沿箭 7 頭2B方向移向散熱片24 疋我出後績填充封裝膠體時的範圍。 接著參照第二B圖，進行 仃对膠步驟，移動模穴261使其緊貼散 熱片24頂部的環形凸起24 此時，雖然模具26所施予散熱片24 向下的壓力會導致散熱丨24產生形變，但本發騎提供固定在晶片 21中央上方的可撓性結構28其頂部則恰可抵靠住已形變的散熱片么 内側’使得散熱片24不致壓迫到下方的銲線22。 而本實施敎所以在_物27场設置—可舰結構28的目 的乃疋考里到若僅設置一間隔物27並且間隔物27與散熱片以之 間的接觸面献小時，綱_ 27卿即使可魏抗住散熱片Μ的 部分形變，但散熱片24仍有可能繼續形變而向下壓迫到銲線以，並 且間隔物27與晶片21之間過小的接觸面積也有可能造成晶片21的 破裂(crack);不過相反地，若是增加間隔物27的體積而增加與散熱 片24之間的接觸面積，雖舰具妓夠的支撐面積而能讓散熱片μ 不再往下產生形變，但介於間隔物27與晶片21之間的黏著材料(圖 中未示)卻可能會溢出而污染到晶片21上鄰近的銲墊(圖中未示)與鲜 線22。 因此，為了具有足夠的之支撐面積而能抵抗散熱片24的形變， 同時又可以防止黏著材料溢出而必須與晶片21上的銲墊保持一定距 離的兩項要求下，本實施例所提供的解決方式係在晶片21中央形成 戴面近似T七的支撐結構來滿足上述要求，也就是在間隔物上 再形成-具綠大抵靠_可紐結構28，餅可撓性結構28與散 熱片24接觸的面積大於間隔物27與晶片21的接觸面積；而可挽性 結構2S除了財硬質从等要斜，且其瓣服係數 (coefficient 〇Uhe「ma| expa_n; CTE)與間隔物27相近也是本實施 例在選擇可撓性輯28時財聽件，硬⑽雜猶或是 空白晶片（dummy die)都可作為可撓性結構28的選項之一。而在本實 施例中，可撓性結構28與散熱片24接觸的面積大約占了散熱片24 圓形頂部面積的五分之-到三分之—的範圍。 而當模具26已緊貼散熱片24的環狀凸起241 a夺，便可將一炼 24的模流開口 242壓 融狀態的封裝膠體29(例如環氧樹脂)從散熱片 入散熱片24所形成的容置空財，使其包封晶片21、銲線&間 物27以及可撓性結構28 ’並城蓋部分散熱片％而僅讓其頂部 暴露出來4紐在冷卻後糊财26 _麻第以騎示的封 裝結構。 在本實施财，間隔物以及可撓性結構均可選自—圓柱狀或是一 長方體的柯’織抑此躲，也可铺他㈣财其他角柱 狀的外型’只要符合可撓性結構與散熱片接觸的面積大於間隔物应晶 片的接觸面積即可’甚至僅具有_錐柄躲外型的間隔物 也可達到近似的效果。 1248182 以上所述鶴本發明德㈣關’並林發明之申請 專利範圍。在不脫離本發明之實質内容的範•内仍可予以變化而加以 實施，此等變化應仍屬本㈣之關。因此，本發明之辦係由下列 申請專利範圍所界定。 【圖式簡單說明】 第—A圖與第-B _顯示f知進行轉步驟時散熱片產生形變並 且壓迫到銲線的剖面示意圖； 苐-A _第二B _是依縣發明之_較佳具體實施例所提供在 行鱗步__觸㈣軸她蝴·，以及 ^ 應用本發明所提供進行封膠步驟時避免散熱片壓迫到銲 線的方法所__裝結動丨騎 Φ 11121314141151616121222324241242In accordance with the present invention, a preferred embodiment provides a package structure and process for preventing contact between the heat sink and the fresh wire. Referring first to FIG. 8 , before the step of performing the nano step, a semi-finished package structure is formed, the wafer 21 is fixed on the substrate 23, and a wire bonding process is performed, and the wafer 21 is completed by a plurality of bonding wires 22. Electrical connection between the plates. Next, a spacer 27 is fixed to the center of the day sheet 21 by an adhesive material (not shown), and then fixed by another adhesive material (not shown) - the flexible structure 28 On the spacer 27. Finally, a heat dissipating structure such as a heat sink 24 is attached to the substrate 23 by the adhesive material %, and the wafer 21, _22, the spacer 27 and the prismatic structure 28 are covered. At this time, the mold 26 having the mold _ can be moved in the direction of the arrow 2B toward the heat sink 24, and then the range in which the package is filled is displayed. Referring to Figure 2B, the squeezing step is performed to move the cavity 261 to the annular projection 24 at the top of the heat sink 24. At this time, although the downward pressure exerted by the die 26 on the heat sink 24 causes heat dissipation. 24 is deformed, but the present ride provides a flexible structure 28 that is secured over the center of the wafer 21 with the top portion just against the deformed fins inside so that the fins 24 are not forced to the underlying bond wires 22. However, in the present embodiment, the purpose of the ship-like structure 28 is to provide only a spacer 27 and the contact surface between the spacer 27 and the heat sink is provided for an hour. Even if the deformation of the heat sink fins is resisted, the heat sink 24 may continue to deform and press down to the bonding wire, and too small contact area between the spacers 27 and the wafer 21 may cause cracking of the wafer 21. (crack); but conversely, if the volume of the spacer 27 is increased to increase the contact area with the heat sink 24, although the support area of the ship can make the heat sink μ no longer deformed, The adhesive material (not shown) between the spacers 27 and the wafer 21 may overflow and contaminate adjacent pads (not shown) and fresh lines 22 on the wafer 21. Therefore, in order to have sufficient support area to resist the deformation of the heat sink 24, and at the same time prevent the adhesive material from overflowing and must maintain a certain distance from the pad on the wafer 21, the solution provided by the embodiment The method is to form a support structure with a surface similar to T7 in the center of the wafer 21 to meet the above requirements, that is, to form on the spacer - having a green large abutment _ 纽 结构 structure 28, the cake flexible structure 28 is in contact with the heat sink 24 The area of the spacer 27 is larger than the contact area of the spacer 27 and the wafer 21; and the flexible structure 2S is inclined except for the hard material, and the coefficient coUhe "ma| expa_n; CTE" is similar to the spacer 27 In the embodiment, when the flexible package 28 is selected, a hard (10) hybrid or a dummy die can be used as one of the options of the flexible structure 28. In the present embodiment, the flexible structure The area of contact with the heat sink 24 is approximately five- to three-thirds of the area of the circular top of the heat sink 24. When the mold 26 has been attached to the annular projection 241 of the heat sink 24, The mold flow opening 24 of a refining 24 can be 2 The encapsulating colloid 29 (for example, epoxy resin) in the melted state is filled from the heat sink into the heat sink 24 to enclose the wafer 21, the bonding wire & the spacer 27 and the flexible structure 28' And the part of the city cover part of the heat sink is only exposed to the top of the 4 New Zealand. After cooling, the package is sealed. In this implementation, the spacer and the flexible structure can be selected from the cylinder. Shape or a cuboid of the ko's woven to hide, can also lay him (four) financial other column-shaped appearance 'as long as the area of contact with the flexible structure and the heat sink is larger than the contact area of the spacer should be even A spacer having only a _ taper shank can also achieve an approximate effect. 1248182 The above-mentioned patent scope of the invention is the same as that of the present invention without departing from the essence of the present invention. It shall be implemented and changed, and such changes shall remain in the scope of this (4). Therefore, the operation of the present invention is defined by the following patent application scope. [Simplified description of the drawings] -A map and -B _ display f The heat sink is deformed during the transfer step and And pressing to the cross-sectional schematic of the bonding wire; 苐-A _ second B _ is according to the invention of the invention _ preferred embodiment provided in the row scale __ touch (four) axis her butterfly, and ^ application of the present invention Method for preventing the heat sink from being pressed to the bonding wire during the sealing step __装装动丨 Φ 11121314141151616121222324241242
主 rL 明 說 號 符 件 要 起料 起口 片ύ^你 片凸開 線板熱狀著具穴片線板熱形流 象基散環黏模模晶銲基散環模 ίο 1248182 . 25 黏著材料 26 模具 261 模穴 27 間隔物 28 可撓性結構 29 封裝膠體The main rL is said to be the starting part of the 起 ^ 你 片 你 你 你 你 你 你 你 你 你 你 你 你 你 你 你 你 你 你 你 你 你 你 你 你 你 你 48 48 48 48 48 48 48 48 48 48 48 48 48 48 48 48 48 48 1248182 . 26 Mold 261 Cavity 27 Spacer 28 Flexible Structure 29 Encapsulant