TWI242749B - Pressing type fingerprint sensor package - Google Patents

Abstract

A pressing type fingerprint sensor package includes a substrate, a pressure-transmitting film and a liquid compound. The substrate has a plurality of sensing electrodes protruded on its sensing surface. The pressure-transmitting film is attached to the sensing surface of the substrate and elastically touches the sensing electrodes. The periphery of the pressure-transmitting film is shaped into an annular flange toward the sensing surface so as to shorten the peripheral gap between the sensing surface and the annular flange of the pressure-transmitting film. The liquid compound is prevented from flowing to the sensing electrodes.

Description

1242749 V. Description of the invention 0) --- [Technical field to which the invention belongs] The present invention relates to a package structure of a fingerprint reader, and more particularly to a package structure of a press-type fingerprint reader. [Prior art] The conventional fingerprint reader is used to identify individuals and is installed in specific sub-products, such as a notebook computer, a personal digital assistant (PDA), or a mobile phone. The measurement methods can be divided into several types: optical sensing, shchng scanning and pressure ^ ⑽ ^ calling. Among them: Zhongyi finger sensing angle, force applied Both the change of the touch speed and the sliding speed will affect the fingerprint recognition judgment of the triggering light sensing type and the touch scanning type. The touch fingerprint reader is a plurality of densely arranged sensing electrodes connected with corresponding capacitors. When pressing on some of the sensing electrodes of the fingerprint sensor, the pressure difference generated by the finger pressure generates a voltage distribution to identify = fingerprint, so the fingerprint sensor with a fingerprint has better recognition ability, = patent a σ Nos. 424207 and 541503 both disclose related conventional pressure-contact fingerprint readers, but do not disclose the anti-static mechanism of the package structure on the sensing surface. Xing China Patent Bulletin No. 538380 "Semiconductor device for fingerprint identification revealed: a package structure of a press fingerprint reader, a substrate with a transistor ^ has a sensing surface, and the sensing surface is provided with a plurality of g storage electrode, electrically separating the charge storage electrodes with an electrostatic lead, and an insulating film covering the charge storage electrodes, and the substrate electrode at the edge of the sensing surface is connected to the lead of a lead frame with a wire. Feet with a piece of glue

Page 7 1242749

It covers the inner ends of the pins and the side, bottom, and periphery of the sensing surface of the substrate to expose the sensing surface for identification of fingerprints. The insulating film is made by sputtering or deposition without any The four elastic charge storage electrodes on the sensing surface are gap-gaped, which makes the pressure sensing performance worse. In addition, the 'electrostatic lead must be placed on the sensing surface of the substrate to electrically separate the ancient charges. The storage electrodes affect the distribution density of the charge storage electrodes. Please refer to FIG. 1. The package structure of another conventional fingerprint reader includes a glass substrate 110, the sensing surface 111 of the glass substrate 110, and a plurality of sensing electrodes 112 (generally referred to as the flexibility of Sylgard). Block), which is slightly raised on the sensing surface 111 to improve the pressure sensing efficiency, and a pressure transmission film 130 (generally called Mylar film) is attached to the sensing surface 1 of the substrate 11 11 and contact the sensing electrodes 11 2. When the sensing electrodes 112 are pressed through the capacitance and transistor of the glass substrate 110, they are converted into voltage differences and electrically transferred to the special application around the sensing surface 111. Integrated circuit chip 120 (ASIC chip) to identify fingerprints. A liquid sealant 140 is coated on the peripheral gap H 3 between the sensing surface 111 of the substrate UQ and the periphery of the pressure transmitting film 130 to prevent contamination of the sensing electrodes 112, but the liquid sealant 1 40 easily diffuses from the peripheral gap 11 3 into the gap between the pressure transmitting film 1 3 0 and the sensing surface 111, and even the liquid sealant 14 0 may contaminate part of the sensing electrode 11 2 and cause sensing Failure or degradation of sensing efficiency. In addition, since the pressure transmitting film 1 30 is very soft, the current forming method of the pressure transmitting film 130 is to first apply a larger size pressure transmitting film 13 0 to the sensing surface 111 of the substrate 110 to achieve an appropriate After positioning, the pressure is transmitted to the substrate 110 by manual cutting.

1242749 V. Description of the invention (3) The thin film 130 can easily damage the circuit structure of the substrate 110. [Content of the invention] The present invention is 53C㈡M goods, which is narrow—a kind of pressing type ^ package structure, which is provided on a substrate with a plurality of A convex, " test electrode,-a pressure transmitting film is attached to the sensor meter; a liquid sealant is diffused to the sensor electrodes, so that the pressure fingerprint reader package structure has a good pressure sensing efficiency . The contact electrodes are contacted, and the pressure transmitting sheet is formed as a ring flange on its periphery, and the return flange is directed toward the sensing surface to reduce the ring flange of the sensing shoulder surface and the pressure transmitting film. Peripheral clearance, which is used to prevent

The package structure of the press-type fingerprint reader according to the present invention mainly includes a substrate, a pressure transmitting film, and a liquid sealant. The substrate has a sensing surface, and a plurality of senses protruding from the sensing surface. Measuring electrode (such as

Sylgard elastic block), the pressure transmitting film (such as Myla: r polyester film) is attached above the sensing surface of the substrate and elastically contacts the sensing electrodes, and the periphery of the pressure transmitting film is formed into a ring convex Edge, the ring flange is directed toward the sensing surface of the substrate, preferably, the pressure transmission film includes a conductive layer to conduct static electricity, and the liquid sealant seals the ring flange of the pressure transmission film and Because the peripheral gap of the sensing surface is narrowed by the ring flange, the liquid sealant does not flow to the sensing electrodes. [Embodiment] With reference to the drawings, the present invention will be described by the following embodiments. According to a specific embodiment of the present invention, please refer to FIG. 2.

Page 9 1242749 V. Description of the invention (4) Type fingerprint reader package structure 2000 series mainly includes a substrate 2o, a plurality of special application integrated circuit chips 22o, a pressure transmission film 230 and a liquid seal Glue 240. The substrate 2 1 0 has a sensing surface 2 1 1, and a plurality of sensing electrodes 2 1 2 are convexly disposed on the sensing surface 2 丨 1. The sensing electrodes 2 丨 2 are, for example, Sylgard elastic blocks. It is connected to the corresponding capacitor and transistor (not shown) in the substrate 21, and the special application integrated circuit chip 220 for receiving the voltage difference and identifying the pressure position is bonded to the sensing surface 211 In this embodiment, the substrate 21 is a giass substrate. The sensing surface 211 of the substrate 21 is formed with a plurality of sink holes 2 1 3 for the sensing electrodes 2. The positioning of 12 is combined, and the sensing electrodes 21 2 can be partially embedded in the corresponding recesses 2 1 3 of the substrate 2 1 0 by printing and cured. The pressure-transmitting film 230 is attached above the sensing surface 211 of the substrate 210 and elastically contacts the sensing electrodes 2 丨 2. For example, when using My 丨 ar polyacetate film as a finger to press the sensing electrodes The pressure transmission of 2 丨 2, the periphery of the pressure transmission film 2 30 is formed into a ring flange 232, preferably it is a press-formed bevel, and the pressure transmission film 2 3 0 has a ring flange 2 3 2 The forming method will be described in detail later. The height of the ring flange 232 should preferably not exceed the height of the sensing electrodes 212 protruding on the sensing surface 211. The ring flange 232 faces the substrate 2 1 〇 the sensing surface 2 11 to reduce the peripheral gap 214 between the ring flange 232 of the pressure transmitting film 230 and the sensing surface 211, and the ring flange 232 is preferably in contact with the sensing surface 211, Preferably, the pressure transmission film 230 includes a conductive layer 231, such as indium tin oxide.

1242749 V. Description of the invention (5) Compound (I TO) to dissipate static electricity. The liquid sealant 240 seals the peripheral gap 214 of the ring flange 232 of the pressure transmission film 230 and the sensing surface 211. The gap 21 4 is narrowed by the ring flange 232, so that the liquid sealant 240 will not diffuse and pollute the sensing electrodes 21 2. The substrate 210 can be connected to an external circuit board or a carrier board by using conventional electrical connection components, such as cables and bonding wires. Please refer to FIGS. 3A to 3E, which disclose a process of assembling the pressure transmission film 230. Please refer to FIG. 3A. First, a large area of soft pressure transmission film 230 is provided, which includes a conductive layer 231; Please refer to FIG. 3B. One surface of the pressure-transmitting film 230 is covered with a peelable and relatively rigid shaped film 3 1 0. Refer to FIG. 3C and apply the pressure of the 1 shaped film 310. The transfer film 230 is placed on a jig 320 and stamped to form a ring flange 232 around the pressure transfer film 230: After that, referring to FIG. 3D, the pressure transfer film with the ring flange 232 formed 2 3 0 is placed on the sensing surface 2 11 of the substrate 2 without applying additional stress and tension so that the ring flange 232 reduces the peripheral gap 214 of the substrate 210. Preferably, the ring convex The edge 232 abuts the sensing surface 211 of the substrate 210; next, please refer to FIG. 3E. After peeling the shaping film 310, the peripheral gap 214 between the substrate 210 and the pressure transmitting film 230 is a little bit. The glue needle 330 provides the liquid sealant 240 to seal In the meal [peripheral gap 214 between the substrate 210 and the pressure-transmitting film 230, since the outer flange 2 3 2 has reduced the peripheral gap 2 1 4 of the substrate 2 1 0, the liquid sealant 2 4 0 The sensing electrodes 21 2 will not be diffused and contaminated, and then cured and formed to seal and protect the sensing electrodes 21 2.

Page 11 1242749 V. Description of the invention (6) Please refer to Figures 4A to 4C, which reveals another assembly process of the pressure transmission film 230, in which the substrate 2 1 0, the sensing electrode 21 2, and the special application product The circuit chip 220 and the liquid sealant 240 are the same as the foregoing structure, and will not be described in detail. Please refer to FIG. 4A. First, a large area of the pressure transmission film 230 is covered with a rigid setting film 410 that does not need to be peeled off. A rectangular or strip-shaped window; please refer to FIG. 4B, the pressure transmitting film 23 0 with the shaped film 41 0 is stamped and formed with a ring flange 232 on the periphery, and the ring flange 232 is The shape is limited by the shaping film 410: afterwards, please refer to FIG. 4C, the pressure transmitting film 230 is attached above the sensing surface 21 1 of the substrate 210, and the shaping film does not need to be removed.

410, so that the ring flange 232 of the pressure-transmitting film 230 reduces the peripheral gap 214 of the substrate 210, and the liquid point sealant 240 is provided by a little glue needle 420 in the peripheral gap 214 of the substrate 21 to seal the A peripheral gap 214 between the substrate 21 and the pressure transmitting film 230 is cured and formed to protect the sensing electrodes 2 1 2. # The protection scope of the present invention shall be subject to the scope of the attached patent application ’Any changes and modifications made by those skilled in the art without departing from the spirit of the present invention belong to the protection scope of the present invention = target

Page 12 1242749 Schematic description

[Brief description of the figure] Figure 1: Figure: Cross-section schematic diagram of the package structure of a conventional press fingerprint reader. Figure 2: Cross-section schematic diagram of the package structure of a press fingerprint reader according to a specific embodiment of the present invention. 9 Figures 3A to 3E: According to a specific embodiment of the present invention, the pressure-transmitting film of the press-type finger identifier package structure therein is a schematic cross-sectional view of an assembly process; and <Figures 4A to 4C: Basis According to a specific embodiment of the present invention, the pressure-transmitting film according to the package structure of the identifier is assembled in another way. ^ Brief description of component symbols: 1 0 0 Fingerprint reader 110 113 130 200 Fingerprint reader 111 Gap pressure transmitting film 111 Sensing surface 120 Special application product 140 Liquid sealant 11 2 Sensing electrode Circuit chip 21 2 Sensing electrode 丨232 ring flange 2 1 0 substrate 2 11 sensing surface 21 3 counterbore 214 peripheral gap 2 2 0 special application integrated circuit chip 230 pressure transmission film 231 conductive layer 240 liquid sealant 3 1 0 shaped film 3 2 0 fixture 3 3 0 dispensing needle

1242749 Schematic illustration 410 Shaped film 420 Dispensing needle # # 1 · Ιϋ Page 14

Claims (1)

1242749 6. Scope of patent application [Scope of patent application 1. Press a substrate, set it on a pressure transmitting side of the sensing meter and elastically form a sensing meter 2, such as structure, sensing meter 3, such as structure, 4, such as the structure '5, such as the structure, 6, such as the structure' 7, such as the structure, 8, such as the structure, the fingerprint reader package structure includes: it has a sensing surface, a plurality of sensing electrodes are convex; A thin film, which is placed on the sensing surface of the substrate to sexually contact the sensing electrodes, and the periphery of the pressure transmission film is a ring flange that faces the sensing surface of the substrate; and The sealant seals the gap between the ring flange of the pressure transmitting film and the periphery of the surface. The pressure-type fingerprint reader package described in item 1 of the patent application package, wherein the ring flange of the pressure transmission film is in contact with the current surface of the substrate. The package is a Mylar polyester film. The press-type fingerprint reader package described in item 1 of the patent application range, wherein the sensing electrodes are Sy 1 gard elastic blocks. The pressure-type fingerprint reader seal described in item 1 of the patent application range, wherein the pressure transmission film includes a conductive layer. The press-type fingerprint reader package described in item 5 of the patent application range, wherein the conductive layer is indium tin oxide (ITO). The pressure-type fingerprint reader package described in the first patent application range, wherein the ring flange is oblique. Press-fit fingerprint reader package as described in item 1 of the patent application range, wherein the height of the ring flange does not exceed the protrusions of the sensing electrodes Page 15 1242749 6. Scope of Patent Application Height. 9. The press-type fingerprint reader package structure according to item 1 of the scope of the patent application, wherein the sensing surface of the substrate has a plurality of sink holes for setting the sensing electrodes. 10. The press-type fingerprint reader package structure as described in item 1 of the scope of the patent application, wherein the substrate is a glass substrate. 11. The package structure of the press fingerprint fingerprint reader described in item 1 of the scope of the patent application, which further includes a plurality of special application integrated circuit chips (AS j C ch i ρ), which is provided on the substrate.测 表面。 Measurement surface. 1 2. The press-type fingerprint reader package structure as described in item 1 of the scope of the patent application, wherein the upper surface of the pressure transmission film is covered with a certain shape film. 1 1 3. A manufacturing method of a press-type fingerprint reader package structure, comprising: k for a substrate, the substrate has a sensing surface, and a plurality of sensing electrodes are convexly disposed on the sensing surface; Pressure transmitting film, which is attached above the sensing surface of the substrate and elastically contacts the sensing electrodes. Before mounting, the periphery of the pressure transmitting film is pre-formed into a ring flange. Toward the sensing surface of the substrate; and providing a liquid cancer sealant on the sensing surface of the substrate, the liquid sealant sealing a gap between a ring flange of the pressure transmitting film and a peripheral surface of the sensing surface. Lu 14 4. The manufacturing method of the press-type fingerprint reader closure structure described in item 13 of the scope of patent application, wherein the ring flange of the pressure transmitting film abuts the sensing surface of the substrate. 1 5. According to the pressing fingerprint fingerprint reader package picture described in item 13 of the scope of the patent application, page 16 1242749, the method of manufacturing the structure of the scope of the patent application, the pressure transmission film in the bean is My lar polyester 1 R, According to the manufacturing method of the press-type fingerprint reader package structure described in item 13 of the scope of the patent application, the sensing electrodes are Sy 1 gard elastic blocks. 17. The manufacturing method of the press-type fingerprint reader package structure 4 as described in item 3 of the patent application scope, wherein the pressure-transmitting film includes a conductive layer. -18. The manufacturing method of the press-type fingerprint reader package structure as described in item 7 of the patent application scope, wherein the conductive layer is indium tin oxide (τ). 19. The manufacturing method of the press-type fingerprint reader package structure described in item 13 of the scope of patent application, wherein the ring flange is beveled. 20. The manufacturing method of the seal structure of the press-type fingerprint reader as described in item 13 of the scope of patent application, wherein the height of the ring flange does not exceed the height of the protrusions of the sensing electrodes. 21. The manufacturing method of the press-type fingerprint reader package structure as described in item 丨 3 of the scope of the patent application, wherein the sensing surface of the substrate has a plurality of countersinks for providing the sensing electrodes. 22. The manufacturing method of the press-type fingerprint reader package structure as described in item 丨 3 of the scope of the patent application, wherein the substrate is a glass substrate. 23. The manufacturing method of the press-type fingerprint reader package structure as described in item 13 of the scope of the patent application, further comprising: installing a plurality of special application integrated circuit chips (ASIC ch i ρ) on the substrate. Sensing surface. 2 4.Press-press fingerprint reader package as described in item 13 of the scope of patent application 1242749_ VI. Scope of patent application Manufacturing method of structure, wherein the ring flange is formed by stamping. 25. The manufacturing method of the press-type fingerprint reader package structure as described in item 24 of the scope of patent application, wherein before the pressing, a certain shape film is pasted on the upper surface of the pressure transmission film. Page 18