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示χ光:極體之應用頗為廣泛，例如，可應用於光學顯 ^ ^ 田射二極體、交通號誌、資料儲存裝置、通訊裝 口番知明f置、以及醫療裝置。在此技藝中，目前技術人 貝要課題為如何提高發光元件之發光效率、縮小元件尺 寸及簡化製程。 先前技術 第一圖之剖面圖係顯示先前技術之另一發光二極體之 結構。在第一圖中，倒置之發光二極體晶粒31，係以焊料 4曰1、42 士別黏結於焊接框架4〇、43上。亦即，發光二極體 晶粒31藉連結墊9與歐姆電極1〇，分別電連接於導電框架 40之基部40a與導電框架43之基部43a上。 卞 前述發光二極體晶粒31，由於不需任何連接線，且發 光面31a上並未覆蓋不透明之歐姆電極或連結墊，'所以發 光面積不致減少。但因為在製造過程中，需藉由外力進^一 熔接，當外力有些微不均勻時，很容易經由焊料直接 ^ 至發光二極體晶粒31，造成發光二極體晶粒3〗受破壞。= 外發光二極體晶粒在倒置黏結時，需經過精確對準之^ 序，使發光疊層之連結墊與歐姆電極能夠準確的與$ 接合，並需保持發光疊層之水平，其困難度頗高，因而= 1241037 修正 先别技術之發光二極體於市面上雖有產品，然而產率及良 率偏低，以致製造成本較高。 發明内容 本案發明人於思考如何解決前述之問題時，產生一種 發光元件之構想，該發光元件係包含一透明基材，其中該 透月基材包έ一上表面及下表面，該透明基材具有一由上 表面向下延伸之凹槽，該凹槽之一開口部位於該透明基材 之上表面側；一發光二極體置於該凹槽中，其中該發光二 極體之一第一電極及一第二電極朝向凹槽之開口部；以 及一保護層覆蓋形成於該凹槽之部分開口部。 本發明之一種發光元件，其中於該透明基材上表面侧 可形成一第一導電薄膜與該第一電極電性相接。一第二導 電薄膜與該第二電極電性相接。 本發明之一種發光元件，其中該透明基材之上表面可 形成複數個凹槽，於該複數個凹槽中分別置入一發光二極 體。 本發明之一種發光元件之製造方法，包含··提供一透 明基材，其中該透明基材包含一上表面及下表面，該基材 具有一由上表面向下延伸之凹槽，該凹槽之一開口部位於 該透明基材之上表面側，放置一發光二極體於該凹槽中， 其中該發光二極體之一第一電極及一第二電極朝向凹槽之 開口部，形成一保護層覆蓋於該凹槽之部分開口部；以及X-ray: polar body is widely used. For example, it can be used in optical display field diodes, traffic signs, data storage devices, communication devices, and medical devices. In this technique, the current technicians are asking how to improve the luminous efficiency of light-emitting devices, reduce the size of components, and simplify the manufacturing process. Prior art The cross-sectional view of the first figure shows the structure of another light emitting diode of the prior art. In the first figure, the inverted light-emitting diode grains 31 are bonded to the welding frames 40 and 43 with solder 4: 1, 42+. That is, the light-emitting diode crystal grains 31 are electrically connected to the base portion 40a of the conductive frame 40 and the base portion 43a of the conductive frame 43 through the connection pad 9 and the ohmic electrode 10, respectively.卞 The aforementioned light-emitting diode die 31 does not require any connection wires, and the light-emitting surface 31a is not covered with an opaque ohmic electrode or connection pad, so the light-emitting area is not reduced. However, during the manufacturing process, external welding is required to perform welding. When the external force is slightly uneven, it is easy to directly reach the light-emitting diode grains 31 through solder, causing the light-emitting diode grains 3 to be damaged. . = When the outer light-emitting diode die is bonded upside down, it needs to undergo a precise alignment procedure so that the bonding pad of the light-emitting stack and the ohmic electrode can be accurately bonded to the $, and it is difficult to maintain the level of the light-emitting stack, which is difficult. The degree is quite high, so = 1241037 Although the light-emitting diode of the modified prior art has products on the market, the yield and yield are relatively low, resulting in higher manufacturing costs. SUMMARY OF THE INVENTION When thinking about how to solve the aforementioned problems, the inventor of the present case came up with a concept of a light-emitting element. The light-emitting element includes a transparent substrate, wherein the translucent substrate includes an upper surface and a lower surface. A groove extending downward from the upper surface, an opening of the groove is located on the upper surface side of the transparent substrate; a light emitting diode is placed in the groove, and one of the light emitting diodes is An electrode and a second electrode face the opening portion of the groove; and a protective layer covers a portion of the opening portion formed in the groove. In a light emitting device of the present invention, a first conductive film may be formed on the upper surface side of the transparent substrate to be electrically connected to the first electrode. A second conductive film is electrically connected to the second electrode. In the light emitting device of the present invention, a plurality of grooves may be formed on the upper surface of the transparent substrate, and a light emitting diode is respectively placed in the plurality of grooves. A method for manufacturing a light emitting device according to the present invention includes: providing a transparent substrate, wherein the transparent substrate includes an upper surface and a lower surface, the substrate has a groove extending downward from the upper surface, and the groove An opening is located on the upper surface side of the transparent substrate, and a light emitting diode is placed in the groove, wherein a first electrode and a second electrode of the light emitting diode face the opening of the groove to form A protective layer covering a portion of the opening of the groove; and
1241037 案號 9312fi8“ 年 修正 五、發明說明（3) 電性連接該第一電極及該第二電極。 本發明之發光元件中第一導電薄膜及第二導電薄膜係 以電鍍法、印刷法、金屬遮罩（metal mask)蒸鍍法或其他 圖形定義之方法形成。 本發明之發光元件中，利用射出成型或其他成型方式 將透明基材預先作出凹槽，再放置發光二極體於凹槽中。 本發明之發光元件，其中該保護層係完全覆蓋於該凹槽後 再經由蝕刻，蝕刻掉第一電極及第二電極上方之保護層， 露出部分第一電極及部分第二電極。 本發明之發光元件，其中該保護層係以一感光性材料覆蓋 於該部分凹槽，並露出部分第一電極及部分第二電極。 實施方式 請參閱第二C圖，依本發明一較佳實施例之一種發光 元件1包含一透明基材1〇，其中該透明基材1〇包含一上表 面及下表面，透明基材10具有一由上表面向下延伸之凹槽 11 ’凹槽11之一開口部位於該透明基材1 〇之上表面側；一 發光二極體12置於凹槽11中，其中發光二極體12之一第一 電極13及一第二電極14朝向凹槽10之開口部；一保護層 1 5覆蓋形成於凹槽1 〇之部分開口部；形成一第一導電薄膜 1 6及第二導電薄膜1 7分別電性連結該第一電極1 3及第二電 極1 4 〇 本發明較佳實施例之發光元件1之製造方法，其流程1241037 Case No. 9312fi8 "Annual amendment V. Description of the invention (3) The first electrode and the second electrode are electrically connected. The first conductive film and the second conductive film in the light-emitting element of the present invention are electroplated, printed, It is formed by metal mask evaporation method or other graphic definition method. In the light-emitting element of the present invention, the transparent substrate is made into a groove in advance by injection molding or other molding methods, and then a light-emitting diode is placed in the groove. In the light-emitting element of the present invention, the protective layer is completely covered in the groove and then is etched to etch away the protective layer above the first electrode and the second electrode, thereby exposing part of the first electrode and part of the second electrode. In the light-emitting device of the invention, the protective layer is covered with a photosensitive material on the part of the groove, and part of the first electrode and part of the second electrode are exposed. For an embodiment, please refer to FIG. 2C, according to a preferred embodiment of the present invention. An example of a light-emitting element 1 includes a transparent substrate 10, wherein the transparent substrate 10 includes an upper surface and a lower surface, and the transparent substrate 10 has a downward extension from the upper surface. One of the openings of the groove 11 ′ is located on the upper surface side of the transparent substrate 10; a light-emitting diode 12 is placed in the groove 11, and one of the light-emitting diodes 12 and the first electrode 13 and A second electrode 14 faces the opening of the groove 10; a protective layer 15 covers a part of the opening formed in the groove 10; a first conductive film 16 and a second conductive film 17 are electrically connected to the opening First electrode 13 and second electrode 1 4 〇 The manufacturing method of the light-emitting element 1 according to the preferred embodiment of the present invention, and the process
Τ241ΓΠ7 / 案號 93126843_年月 q 你，不 五、發明說明（4) 圖顯示於第二A-二C圖，包含：提供一透明基材1Q，其中 該透明基材10包含一上表面及下表面，該透明基材具有一 由上表面向下延伸之凹槽11，該凹槽i i之一開口部位於該 透明基材10之上表面側；放置一發光二極體12於該凹槽 中’其中該發光二極體之一第一電極13及一第二電極^朝 向凹槽之開口部；於該凹槽上形成一保護層1 5 ;利用韻刻 法，蝕刻掉第一電極13及第二電極14上方之保護層，露出 部分第一電極及第二電極；利用電鍍法形成一第一導電薄 膜16及第二導電薄膜17，分別電性連結該第一電極及第二 電極。 前述之發光元件1及其製法中亦可於該透明基材上形 成複數個凹槽，於該複數個凹槽中分別置入一發光二極 體，接著覆蓋保護層，再經由蝕刻部分保護層，露出部分 第一電極及部分第二電極，最後利用電鍍法分別形成第一 導電薄膜及第二導電薄膜，分別電性連結該第一電極及第 二電極，使其成為複數個發光元件之一發光元件陣列。 而前述之發光元件1之製法，亦可在上述之發光元件 陣列製法步驟最後再加上一分割步驟，將發光元件陣列上 之複數個發光元件分割成為獨立之發光元件。 前述之發光元件陣列中該複數個凹槽中之發光二極體 可分別發出不同色系之光線，經由混光後，克發出白光等 混色光線。 前述之發光元件陣列亦可應用於平面顯示器之背光光 源中，如此可減少單顆發光元件在組裝程序上之複雜度。Τ241ΓΠ7 / Case number 93126843_ 年月 q You, not five, description of the invention (4) The figure is shown in the second A-IIC diagram, including: providing a transparent substrate 1Q, wherein the transparent substrate 10 includes an upper surface and On the lower surface, the transparent substrate has a groove 11 extending downward from the upper surface, and an opening portion of the groove ii is located on the upper surface side of the transparent substrate 10; a light emitting diode 12 is placed in the groove. "Wherein one of the first electrode 13 and one second electrode of the light-emitting diode ^ faces the opening of the groove; a protective layer 15 is formed on the groove; the first electrode 13 is etched away by using the rhyme method And a protective layer over the second electrode 14 to expose part of the first electrode and the second electrode; a first conductive film 16 and a second conductive film 17 are formed by electroplating, and the first electrode and the second electrode are electrically connected to each other. In the aforementioned light-emitting element 1 and the manufacturing method thereof, a plurality of grooves may also be formed on the transparent substrate, and a light-emitting diode is respectively placed in the plurality of grooves, and then a protective layer is covered, and then a part of the protective layer is etched. , Exposing part of the first electrode and part of the second electrode, and finally forming a first conductive film and a second conductive film by electroplating, respectively, electrically connecting the first electrode and the second electrode to make it one of the plurality of light emitting elements Light emitting element array. In the above-mentioned manufacturing method of the light-emitting element 1, a division step may be added at the end of the above-mentioned light-emitting element array manufacturing method to divide a plurality of light-emitting elements on the light-emitting element array into independent light-emitting elements. The light-emitting diodes in the plurality of grooves in the aforementioned light-emitting element array can respectively emit light of different colors, and after mixing the light, it can emit mixed light such as white light. The aforementioned light emitting element array can also be applied to the backlight light source of a flat display, so that the complexity of the assembly process of a single light emitting element can be reduced.
1241037 案號 93126843_^ 五、發明說明（5) 前述之發光元件中第一導電薄膜及第二導電薄膜除了 以電鍍法形成之外，亦可以印刷法、金屬遮罩蒸鑛法或其 他圖形定義之方法形成。 、 前述之發光元件，其中該保護層亦可以一感光性材料 覆蓋於該部分凹槽後，直接露出部分第一電極及第二電 極。 前述之發光元件，其中該透明基材係包含選自壓克力 (Polymethymathacrylate，PMMA)、聚碳酸酯 (Polycarbonate, PC)、環狀烯烴共聚合物（Cyclci OlefinCopolymer，C0C)、玻璃及複合材料所構成材料组 群中之至少一種材料或其他可替代之材料。 、 然 透 準 種 雖然本發明之發光元件已 本發明之範圍並不限於上述 明導電基板取代之；應以下 。因此任何熟知本技藝者， 變更皆不脫離本發明之精神 以各較佳實施例揭露於上， 車又佳實施例，例如基板可以 述申請專利範圍所界定為 對該等較佳實施例所做的各 與範圍及。 1241037 案號 93126843 年月曰 修正 圖式簡單說明 圖式之簡單說明： 第一圖為一示意圖，顯示一習知技藝之覆晶式發光元 件。 第二A-二C圖為，顯示較佳實施例之發光元件之製造 流程，其中第二C圖顯示依本發明一較佳實施例之一種發 光元件。 符號說明 1 發光元件 10 透明基材 11 凹槽 12 發光二極體 13 第一電極 14 第二電極 15 保護層 16 第一導電薄膜 17 第二導電薄膜1241037 Case No. 93126843_ ^ V. Description of the invention (5) In addition to the first conductive film and the second conductive film formed by the electroplating method in the aforementioned light-emitting element, it can also be defined by printing method, metal mask evaporation method or other graphics. Method formation. For the aforementioned light-emitting element, the protective layer may also cover a part of the groove with a photosensitive material, and directly expose part of the first electrode and the second electrode. The aforementioned light emitting device, wherein the transparent substrate is selected from the group consisting of polymethymathacrylate (PMMA), polycarbonate (Polycarbonate, PC), cyclic olefin copolymer (Cyclci OlefinCopolymer, COC), glass and composite materials. At least one of the materials in the material group or other alternative materials. Although the light-emitting element of the present invention has been replaced by the conductive substrate described above, the scope of the present invention is not limited to the above; it should be as follows. Therefore, any person skilled in the art will not deviate from the spirit of the present invention and disclose the preferred embodiments on the basis of the preferred embodiments. For example, the substrate can be defined as the scope of the patent application for the scope of the patent application. Of each with the scope and. 1241037 Case No. 93126843 Amendment Brief description of the drawing Brief description of the drawing: The first picture is a schematic diagram showing a flip-chip light-emitting element of a known technique. The second A-C diagram shows the manufacturing process of the light-emitting element of the preferred embodiment, and the second C-picture C shows a light-emitting element according to a preferred embodiment of the present invention. DESCRIPTION OF SYMBOLS 1 Light-emitting element 10 Transparent substrate 11 Groove 12 Light-emitting diode 13 First electrode 14 Second electrode 15 Protective layer 16 First conductive film 17 Second conductive film
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