TWI240340B - Ball grid array package structure, package substrate and solder-ball pad structure thereon - Google Patents

Abstract

A solder-ball pad structure is described. The solder-ball pad structure is set on a substrate to carry a solder ball, wherein the substrate has a circuit layer and the solder-ball pad has electrical connection with the circuit layer. The solder-ball pad structure comprises a connecting pad and a protrusion, wherein the connecting pad set on the substrate is connected with the circuit layer electrically, and the protrusion is deposed on the connecting pad. The material of the protrusion is metal. In addition, a package substrate comprising the solder-ball pads mentioned above is also provided, and a ball grid array package structure comprising the package substrate mentioned above is also provided, too. As described above, the solder-ball pad structure and the solder ball has a larger connecting area so that the solder-ball pad structure and the solder ball have better connecting strength.

Description

1240340 Case No. 93111709 Revised V. Description of the Invention (1) U.S. Technical Field The invention relates to a packaging structure, a packaging substrate, and a solder-ball pad. ) Structure ', and more particularly, to a packaging substrate capable of improving bonding strength, a solder ball pad structure thereof, and a ball-foot grid array packaging structure. Previous technology> In recent years, with the continuous maturity and development of semiconductor process technology, various electronic products with constant performance have been continuously innovated, and the functions of electronic products have developed in terms of humanization and multi-function. Integrated circuit (IC) components with different functions. In the production of electronic components, private circuit packaging has played a very important role, and integrated circuit packaging types can be roughly divided into bilateral lead packages (Dual In_Hne

Package (DIP), ball array array package (BaH Grid Array package, BGA) and tape automatic joint (Tape Automatic TAB) package and other types, and each package has its own special =. As far as the ball array is concerned, this packaging technology uses solder balls (Γ Ball) to cover the entire bottom area of the substrate (substrate). ′ = Replaces the pins of traditional metal lead frames. Shun Yueguang's spherical array package uses wiring (W ire Β ο nding) or ΐ ^ ^ ϋ1 p 1 p), the contact points of the chip and the contact points of the substrate The layer is connected to the bottom surface of the substrate. The most (1 mUnt) process is to solder the balls to the contacts on the bottom surface of the substrate. Structure. Due to the spherical array sealing, the bottom area of the entire substrate can be used as the distribution of contacts.

1240340 _ Case No. 93111709_ Year Month Day _ Amendment V. Description of the Invention (2) Zone 'therefore has the advantage of high pin count (High Pin Count). In addition, during the reflow (ref 1 〇w) operation, the surface tension of the solder ball after melting can cause self-calibration (Sel f A1 ignment), so the positioning accuracy of the solder ball is not high, plus the joint strength Good and excellent electrical characteristics make the spherical array package one of the mainstream of integrated circuit packaging. Please refer to FIG. 1, which shows a cross-sectional view of a single solder ball of a conventional package substrate. The conventional package substrate includes a substrate, a circuit, a fresh ball 120, and a solder ball 130. Among them, the substrate 110 has a line ϋΐ 1 and the line 1 12 is located inside the substrate 1 10, and the solder ball pad 120 is located on the πI plane of the base and is electrically connected to the line 112. In addition, solder balls 130 are fitted. In order to measure the mechanical properties of the connection between the solder ball 130 and the solder ball 塾 120, push the :: push lever (not shown) =; the second test = and measure the feel of the push lever at the same time ... with the fresh ball The surface is 'so fresh balls f; welding process will affect the solder balls 1 30 and W pads! 3 Γ connected to 20 people face / large, there is no problem here' The purpose of the present invention is to provide a kind of solder ball knots Untitled page 9 1240340; _Case No. 93111709_Year Month and Day__ V. Description of the invention (3) structure, so that the joint area between the solder ball and the solder ball pad can be increased, and the joint between the solder ball and the fresh ball is improved strength. In addition, another object of the present invention is to provide a package substrate so that a bonding area between a solder ball and a solder ball pad can be increased. Based on the above or other objectives, the present invention proposes a solder ball pad structure, which is adapted to be disposed on a substrate to be electrically connected to a line in the substrate and to carry a fresh ball. It includes a connecting pin and a protrusion. Among them, the connection part is placed on the base material to be electrically connected to the line, and the convex part is arranged on the connection pad, and the material of the convex part is metal. According to the solder ball pad structure described in the preferred embodiment of the present invention, the material of the above-mentioned connection pad is the same as that of the convex portion. In addition, the material of the connection pad and the material of the protrusions include, for example, copper or aluminum. According to the solder ball pad structure described in the preferred embodiment of the present invention, the material of the above-mentioned connection pad is different from that of the protruding portion. In addition, the material of the connection pad includes, for example, copper, and the material of the convex portion includes, for example, aluminum. Alternatively, the material of the connection pad includes, for example, an inscription, and the material of the convex portion includes, for example, copper. According to the solder ball pad structure according to the preferred embodiment of the present invention, the protruding portion includes, for example, a columnar structure. Further, the columnar structure includes, for example, a circular columnar structure, an oval columnar structure, a polygonal columnar structure, or an irregular columnar structure. Based on the foregoing or other objectives, the present invention provides a packaging substrate, which includes, for example, a substrate, a plurality of fresh balls, and a plurality of fresh balls. The substrate has a circuit, and each solder ball pad is arranged on the substrate to communicate with

Untitled Page 10 Name 1240340 Case No. 931117 V. Description of the Invention (4) The circuit is electrically connected, and the connection pad is arranged on the substrate, and the convex portion is arranged on the connection pad. In addition, each solder ball is disposed on these solder balls. The material of the packaging pad according to the preferred embodiment of the present invention is the same as the material of the protrusions. Also includes copper or inscription. The material of the packaging potential according to the preferred embodiment of the present invention is not the same as the material of the bumps. In addition, if copper is included, and the material of the protruding portion is, for example, aluminum, the material of the protruding portion is, for example, aluminum, and the material of the protruding portion, for example, according to the preferred embodiment of the present invention, includes a columnar structure. In addition, there are a columnar knot structure, an oval columnar structure, and a polygonal columnar structure. The package base described in the preferred embodiment of the present invention further includes a solder mask layer (a solder mask layer) on the surface of the substrate other than the solder ball pads. Based on the foregoing or other purposes, the array packaging structure of the present invention, For example, it includes a packaging substrate. The packaging substrate is a ball pad and a plurality of solder balls. The base material is arranged on the base material in a ball-like manner, and is electrically arranged on the base material with the circuit. To be electrically connected to the line

| Also Ijrj JTL pad ’where the material of the protrusions is metal. In addition, the material of the bumps on the X-correction is one of the gold ridges. The material of the substrate, the above-mentioned connection pad is, for example, the material of the substrate, the above-mentioned connection, and the material of the connection pad. Alternatively, the connection pad includes steel. The substrate, the raised structure described above includes, for example, a circular pillar structure or an irregular pillar plate, and the package substrate example r) is configured to propose a ball-foot grid shape, a wafer and an adhesive such as a substrate, There is one more line, and each is connected, and the connection is configured for the transmission part, and each solder ball is configured

1240340: _Case No. 93111709_Year_Month__ Five, the description of the invention (5) on one of these solder ball pads. In addition, the chip is disposed on the first surface of the substrate and is electrically connected to the circuit. Furthermore, the sealant system covers the substrate and wafer. According to the ball-foot grid array packaging structure described in the preferred embodiment of the present invention, the material of the aforementioned connection pad is the same as that of the protrusion. In addition, the material of the connection pad includes, for example, copper or aluminum. According to the ball-foot grid array packaging structure described in the preferred embodiment of the present invention, the material of the aforementioned connection pads is different from that of the protrusions. In addition, the material of the connection pad includes, for example, copper, and the material of the convex portion includes, for example, aluminum. Alternatively, the material of the connection pad includes, for example, aluminum, and the material of the convex portion includes, for example, copper. According to the ball-foot grid array packaging structure according to the preferred embodiment of the present invention, the above-mentioned protruding portion includes, for example, a columnar structure. In addition, the columnar structure includes, for example, a circular columnar structure, an oval columnar structure, a polygonal columnar structure, or an irregular columnar structure. According to the ball-foot grid array packaging structure according to the preferred embodiment of the present invention, the packaging substrate further includes, for example, a solder mask layer disposed on the surface of the substrate other than the solder ball pads. In the ball-foot grid array packaging structure described in the preferred embodiment of the present invention, the ball-foot grid array packaging structure further includes, for example, a plurality of bumps disposed between the chip and the package substrate, and the chip passes these bumps. Electrically connected to the circuit of the package substrate. In the ball-foot grid array packaging structure according to the preferred embodiment of the present invention, the ball-foot grid array packaging structure further includes a plurality of bonding wires, for example.

Untitled page 12 1240340

The chip is electrically connected by these bonding wires and cases. Case No. 93111709 V. Description of the Invention (6) Bonding wire of the substrate. Based on the above, the solder ball pad joint of the present invention is compared with the conventional technology. The solderer of the present invention has bumps, so the contact area is' so the solder ball pad structure, the fresh J structure, and the solder ball have a larger In addition, the package substrate of the present invention has an increased strength of ϋ 塾 2 2. With this technology, the package substrate and structure of the present invention have better mechanical properties than conventional mounting substrates. ^ ^ = Joint strength, and the sealed ball-foot grid array packaging structure uses . In addition, the ball foot grid array seal of the present invention and the front ball pad structure have the advantages. In order to make the above and other objects of the present invention comprehensible, the following is a preferred embodiment, and a combination of == and advantages can be more clearly explained as follows. The figure of χ with β, please refer to Figure 2 for detailed implementation. The cross section of the basin end + # | shows the structure of the pad structure, said /, meaning ..., the solder ball of the preferred embodiment of the present invention is suitable for configuration In the present invention, a solder ball structure 3 0 0 is proposed, which is electrically connected and supported on 214 to connect with one of the substrates 2 0 2 10 1 3 1 and 1 = = 0. The Gan Erqiu ball 塾 structure 300 includes, for example, a substrate 200 and an AND line = :, and the connection 塾 310 is disposed on the connection pad 310. The road 210 is electrically connected, and the protrusions 3 and 20 are arranged in the circuit: ΐ 2 照 According to the external figure of J2, the substrate 20 is checked. For example, it is a printed circuit board or a flexible dagger. The material and protrusion of the above-mentioned connection pad 310 are Starting part

Page 13 1240340 said 93111709 V. Description of the invention (7) The material of __320 is the same, and the connection 塾 31〇 and copper or aluminum. Alternatively, the material of the connection pad 3 丨 〇 is the same as the material of $ 4 3 2 0, and the material of the connection pad 210 is, for example, 锜. The material of the starting portion 3 2 0 is not, for example, aluminum, or the material of the connection pad 31 is The material of the f raised portion 2 2 0 is, for example, copper. Of course, in this embodiment, σ is aluminum, and the material of the raised portion 320 and the raised portion 20 can also be selected according to other requirements. The other intermediate guides 塾 310 and the raised bearing are described above. The raised portion 3 20 includes, for example, a material. . The columnar structure includes, for example, a circular columnar knot-column = structure. In addition, columnar structures or irregular columnar structures. Phase structure, the polygon and the joint surface of the solder ball pad 120 is a plane phase ^ 130 conventional solder ball 130 examples of solder ball pad structure 3 (0 is shown in Figure 1), this embodiment 3 0 0 has a relatively The large joint area has a pound ball 400 and a solder ball pad structure 300 which has only one protrusion. The present invention is not limited to a solder ball having multiple types of the same or bear ball pad structure 3 0 0 With 4㈣ and fresh ball pad structure 300;;: nj convex = 0, to increase the joint strength of fresh ball pad structure 300. The & solder ball 400 and the solder ball package substrate will be described in detail later. Figure 8 has this solder ball pad structure 3 of 0. Refer to Figure 3 for a schematic cross-sectional view of the Fenqian / Six substrate. This; = this hair: the best product such as Xiao Kuoyi I η々S month out of a package substrate 5000, an example of which covers M 54 0. The two solder ball pads 5 2 0, multiple solder balls 5 3 0 in a soil ball are electrically connected to a welding line 512, and the ball t 2/20 is arranged on the substrate 51 0 to communicate with ^ ^ ^ , 521, i ； 5 " 2 ^ 2 ^ ^^ 522 翌 ^ 2 2 is arranged on the substrate 5 1 〇 to connect with the circuit 1240340

V. Description of the invention (8) 5 1 2 is electrically connected, and the protruding portion 5 2 4 is arranged on the connection 塾 5 2 2. Preferably, a plurality of solder balls 5 3 0 can be respectively disposed on the solder ball pad 5 2 0 for external electrical connection in subsequent processes. In addition, a solder mask layer 4 4 0 can also be disposed on these On the surface of the substrate 51o other than the solder ball pad 52o, to prevent soldering flux (lux) from remaining on the surface of the substrate 51o, and to protect the substrate ^ 5 1 0, preferably, for example, it is Mainly made of epoxy resin (ep〇xy Hin). Of course, this embodiment is not limited to the need to have 540 and the cup ball 5 3 0, that is, the fresh cover 5 4 0 and the solder ball 5 3 0 are selected as the I component. In addition, the manufacturing process of this package substrate 500 is described below. First of all, Sun Chengyi provided—the base material 51G, and the base material 510, and the second one had a line 512, and the connection pad 5 2 2 was connected by connection. After that, ‘will-gold ... two spears’ are attached to m m m λ, / covering the connection pad 5 2 2 and metal boxes such as copper collars, aluminum processes: ί ϊ ϋ material. Subsequently, the metal box was lithographically etched on the ball pad 52. Finally, the solder ball 530 is re-soldered to the solder ball pad 52 () through the re-soldering process. The package substrate 50 () is a good example. It is worth mentioning that this One of the circuits 512 in the package of the embodiment is not limited to the objective of the present invention. It is also possible to achieve the ball pad 52 with multiple circuit layers 5 1 2. It is not the same. This is part of the welding 丄 η :, the line 51 2 is electrically connected because: 疋 is designed to disperse stress and there is no signal transmission wheel

Untitled Page 15 1240340 Λ. Name Amendment No. 93111709 V. Function of Invention Description (9). The package substrate 500 of the present invention can also be used in a ball-foot grid array packaging structure (B G A), which will be described in detail later. FIG. 4 illustrates a ball-foot grid array package structure according to a first preferred embodiment of the present invention. If the reference numerals in FIG. 4 are the same as those in FIG. 3, it means that the components specified in FIG. 4 are the same as those specified in FIG. 3, and will not be repeated here. Referring to FIG. 4, the ball-foot grid array package structure 600 includes, for example, a mounting substrate 500, a wafer 610, a colloidal compound 62 and a plurality of bumps 630. The substrate 510 of the package substrate 500 includes a first surface 510a and a second surface 5 1 0 b parallel to one of the first surface & 51a. In addition, the chip 6 丨 0 is disposed on the first surface 5 丨 0 b of the substrate 5 丨 0 and is electrically connected to the line 5 丨 2. The sealant 5 2 0 is coated on the base Γ20Λν / 10. It is worth noting that the chip 610 is electrically connected by the line 512 of the bump 630, and this electrical connection method 2 array package structure 6 0 0 is not limited to the use of Jl 3 application bonding technology (Wlre Bondlng), which Detailed technical description also. With the oath, the ball-foot grid array is packaged and constructed according to the second preferred embodiment of the present invention. On the right, the reference numeral in FIG. 5 is the same as that in FIG. 4, and 1 is similar to the preferred embodiment. The difference between the preferred embodiment and the first preferred embodiment is that the second preferred embodiment adopts the operation, and the ball foot grid array package έ Use fresh wire bonding technology j clothes, .bouts bυυ more encapsulation of multiple welding wires 64〇, and

1240340 Case No. 93111709 V. Description of the invention (10) One piece 6 1 0 is electrically connected to the line 5 1 2 of the package substrate 5 0 0 by # 线 6 4 0 to form a ball-foot grid using wire bonding technology Array package structure 600. ′ As can be seen from FIG. 4 and FIG. 5, the ball-foot grid array packaging structure 6 of the present invention uses a solder ball pad 5 2 0 having a protruding portion 5 2 4. Therefore, the ball-foot grid array packaging structure 6 of the present invention 0 0 can provide better bonding strength, thereby increasing the degree of conjugation. In addition, the ball-foot grid array packaging structure of the present invention is not limited to 600 = using a single flip-chip bonding technology or a wire bonding technology, and both technologies can be used simultaneously, and the ball-foot grid array packaging structure of the present invention β 〇〇 is not limited to the use of a single wafer 6 i 0, can also use multiple wafer ° method. In summary, the ball-foot 袼 -shaped array packaging structure, solder ball pad, and structure of the present invention and its packaging substrate have the following advantages: The front ball pad structure of the present invention has protrusions, so the solder ball and solder S pad The bonding area is larger than that of the conventional technology, so the soldering pad structure of the present invention can provide higher bonding strength. In addition, since the bonding strength between the solder ball and the solder pad is high, the solder ball pad structure and solder ball of the present invention have better reliability than the conventional technology.俾 i 1. In the package substrate of the present invention, since the solder ball pad structure can improve the bonding strength, the package substrate has good mechanical properties and can be Λ degree. Structure 42. Compared with the conventional technology, the ball-foot grid array package of the present invention has a solder ball pad with a protruding portion, so the ball-foot grid array package structure can provide higher bonding reliability. . 6 t The present invention has been disclosed as above with a preferred embodiment, but it is not intended for anyone who is familiar with the art without departing from the spirit of the present invention.

1240340 Case No. 93111709 _η Amendment 5. Within the scope of (11) and the description of the invention, some modifications and retouching can be made. Therefore, the scope of protection of the present invention shall be determined by the scope of the attached patent application.

Untitled Page 18 1240340 _Case No. 93111709_Year_Month_Revision _ Brief Description of Drawings Figure 1 shows a cross-sectional view of a single solder ball of a conventional package substrate. FIG. 2 is a schematic cross-sectional view of a solder ball pad structure according to a preferred embodiment of the present invention. FIG. 3 is a schematic cross-sectional view of a package substrate according to a preferred embodiment of the present invention. FIG. 4 illustrates a ball-foot grid array package structure according to a first preferred embodiment of the present invention. FIG. 5 illustrates a ball-foot grid array package structure according to a second preferred embodiment of the present invention. [Explanation of diagrammatic symbols] 1 0 0: conventional package substrate 110 > 200 > 510: base material 112 > 21 0 > 512: wiring 1 2 0, 5 2 0: solder ball pad 3 0 0: Solder ball pad structure 3 1 0, 5 2 2: connection pads 320, 524: raised portions 130, 400 ^ 530: solder balls 5 0 0: package substrate 510a: first surface 510b: second surface 5 4 0: solder Cover layer 6 0 0: Ball-foot grid array packaging structure 6 1 0 · Wafer

Untitled Page 19 1240340 Simple illustration of the drawing 620 630 640 Case No. 93111709 Sealing body Bump Welding line Revision

BIB untitled page 20

Claims (1)

1240340 _ Case No. 93111709_ Year Month Date __ VI. Application Patent Scope 1. A solder ball pad structure is suitable for being disposed on a substrate to be electrically connected to a line in the substrate and for carrying a The solder ball, the solder ball pad structure includes: a connection pad disposed on the substrate to be electrically connected to the line; and a projection portion disposed on the connection pad, wherein the material of the projection portion is metal. 2. The solder ball pad structure described in item 1 of the scope of patent application, wherein the material of the connection pad is the same as that of the protrusion. 3. The solder ball pad structure according to item 2 of the scope of patent application, wherein the material of the connection pad includes one of copper and aluminum. 4. The solder ball pad structure described in item 1 of the scope of patent application, wherein the material of the connection pad is different from the material of the raised portion. 5. The solder ball pad structure as described in item 4 of the scope of patent application, wherein the material of the connection pad includes one of copper and aluminum. 6. The solder ball pad structure according to item 5 of the scope of patent application, wherein the material of the raised portion includes one of copper and aluminum. 7. The solder ball pad structure according to item 1 of the patent application scope, wherein the raised portion includes a columnar structure. 8. The solder ball pad structure according to item 7 in the scope of the patent application, wherein the columnar structure includes one of a circular columnar structure, an oval columnar structure, a polygonal columnar structure, and an irregular columnar structure. 9. A package substrate comprising: a substrate having a circuit; Untitled Page 21 1240340 _ Case No. 93111709_ Year Month Date _i ± i-_ VI. Patent application scope There are many solder ball pads, each of which is arranged on the substrate to communicate with the circuit. The solder ball pad includes: a connection pad disposed on the substrate to be electrically connected to the line; and a protrusion portion disposed on the connection pad, wherein the material of the protrusion portion is metal. I 0. The package substrate according to item 9 of the scope of patent application, further comprising a plurality of solder balls, which are respectively disposed on the solder ball pads. II. The package substrate according to item 9 of the scope of patent application, wherein the material of the connection pad is the same as that of the protrusion. 1 2. The package substrate according to item 11 of the scope of patent application, wherein the material of the connection pad includes one of copper and aluminum. 1 3. The package substrate according to item 9 of the scope of patent application, wherein the material of the connection pad is different from the material of the protrusion. 14. The package substrate according to item 13 of the scope of patent application, wherein the material of the connection pad includes one of copper and aluminum. 15. The package substrate according to item 14 of the scope of patent application, wherein the material of the raised portion includes one of copper and aluminum. 16. The package substrate according to item 9 of the scope of patent application, wherein the protrusion includes a columnar structure. 1 7. The package substrate according to item 16 of the scope of patent application, wherein the columnar structure includes one of a circular columnar structure, an oval columnar structure, a polygonal columnar structure, and an irregular columnar structure. 1 8. The package substrate as described in item 9 of the scope of patent application, further comprising a Untitled Page 22 1240340 _Case No. 93111709_Year Month Date__ VI. Scope of Patent Application The welding mask layer is arranged on the surface of the substrate other than the solder ball pads. 19. A ball-foot grid array package structure, comprising: a package substrate comprising: a substrate having a circuit, a first surface and a second surface parallel to the first surface; a plurality of solder ball pads, Each of the solder ball pads is disposed on the second surface of the substrate to be electrically connected to the circuit, and the solder ball pad includes: a connection pad disposed on the second surface of the substrate to It is electrically connected to the line; a protrusion is arranged on the connection pad, wherein the material of the protrusion is metal; a plurality of solder balls are respectively arranged on the solder ball pads; a wafer is arranged on the substrate The first surface is electrically connected to the circuit; and a colloid covers the substrate and the wafer. 2 〇 The ball-foot grid array packaging structure described in item 19 of the scope of patent application, wherein the material of the connection pad is the same as that of the protrusion. 2 h The ball-foot grid array package structure described in item 20 of the scope of the patent application, wherein the material of the connection pad includes one of copper and aluminum. 2 2. The ball-foot grid array packaging structure described in item 19 of the scope of patent application, wherein the material of the connection pad is different from the material of the protrusion. 2 3. The ball-foot grid array packaging structure described in item 22 of the scope of patent application, wherein the material of the connection pad includes one of copper and aluminum. 2 4. Ball-foot grid array package as described in item 23 of the scope of patent application Untitled Page 23 1240340 _Case No. 93111709_Year Month Date__ VI. Patent Application Structure, where the material of the raised portion includes one of copper and aluminum. 25. The ball-foot grid array packaging structure according to item 19 of the scope of patent application, wherein the raised portion includes a columnar structure. 26. The ball-foot grid array packaging structure according to item 25 of the scope of patent application, wherein the columnar structure includes a circular columnar structure, an oval columnar structure, a polygonal columnar structure, and an irregular columnar structure. One of the structures. 2 7. The ball-foot grid array packaging structure described in item 19 of the patent application scope, wherein the package substrate further comprises a solder mask layer disposed on the surface of the substrate other than the solder ball pads. 2 8. The ball-foot grid array package structure described in item 19 of the scope of patent application, further comprising a plurality of bumps, which are arranged between the chip and the package substrate, and the chip is connected by the bumps. It is electrically connected to the line of the package substrate. 29. The ball-foot grid array package structure described in item 19 of the patent application scope further includes a plurality of bonding wires, and the chip is electrically connected to the circuit of the packaging substrate through the bonding wires. Untitled Page 24