[go: up one dir, main page]

TWD235165S - Power module housing - Google Patents

Power module housing Download PDF

Info

Publication number
TWD235165S
TWD235165S TW113301063F TW113301063F TWD235165S TW D235165 S TWD235165 S TW D235165S TW 113301063 F TW113301063 F TW 113301063F TW 113301063 F TW113301063 F TW 113301063F TW D235165 S TWD235165 S TW D235165S
Authority
TW
Taiwan
Prior art keywords
design
power module
shell
module housing
appearance
Prior art date
Application number
TW113301063F
Other languages
Chinese (zh)
Inventor
黃元呈
許繼元
劉君愷
Original Assignee
財團法人工業技術研究院 新竹縣竹東鎮中興路四段195號 (中華民國)
財團法人工業技術研究院
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 財團法人工業技術研究院 新竹縣竹東鎮中興路四段195號 (中華民國), 財團法人工業技術研究院 filed Critical 財團法人工業技術研究院 新竹縣竹東鎮中興路四段195號 (中華民國)
Priority to TW113301063F priority Critical patent/TWD235165S/en
Priority to US29/938,184 priority patent/USD1090465S1/en
Publication of TWD235165S publication Critical patent/TWD235165S/en

Links

Images

Abstract

【物品用途】;;本設計物品，係為功率模組的外殼設計，該功率模組主要用於電力系統與動力系統之間的功率轉換。;【設計說明】;本設計之外觀主要以多個方形造型分佈於殼體表面上，並與主體的整體矩形外型相融合，以構成外觀協調且具科技感之獨特設計。;圖式所揭露之虛線部分，為本案不主張設計之部分。[Item Purpose];;This design item is the shell design of the power module, which is mainly used for power conversion between the electrical system and the power system.;[Design Description];The appearance of this design is mainly distributed on the surface of the shell with multiple square shapes, which are integrated with the overall rectangular shape of the main body to form a unique design with a coordinated appearance and a sense of technology.;The dotted line part revealed in the diagram is the part that this case does not advocate.

Description

功率模組外殼Power module housing

本設計物品，係為功率模組的外殼設計，該功率模組主要用於電力系統與動力系統之間的功率轉換。This design item is a shell design of a power module, which is mainly used for power conversion between an electric power system and a power system.

本設計之外觀主要以多個方形造型分佈於殼體表面上，並與主體的整體矩形外型相融合，以構成外觀協調且具科技感之獨特設計。The appearance of this design is mainly composed of multiple square shapes distributed on the surface of the shell, which are integrated with the overall rectangular shape of the main body to form a unique design with a coordinated appearance and a sense of technology.

圖式所揭露之虛線部分，為本案不主張設計之部分。The dotted line part in the diagram is not the design advocated by this case.

TW113301063F 2024-03-05 2024-03-05 Power module housing TWD235165S (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW113301063F TWD235165S (en) 2024-03-05 2024-03-05 Power module housing
US29/938,184 USD1090465S1 (en) 2024-03-05 2024-04-18 Power module housing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW113301063F TWD235165S (en) 2024-03-05 2024-03-05 Power module housing

Publications (1)

Publication Number Publication Date
TWD235165S true TWD235165S (en) 2024-12-01

Family

ID=93707195

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113301063F TWD235165S (en) 2024-03-05 2024-03-05 Power module housing

Country Status (2)

Country Link
US (1) USD1090465S1 (en)
TW (1) TWD235165S (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD212914S (en) 2020-09-30 2021-07-21 日商日本航空電子工業股份有限公司 Connector

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD556686S1 (en) 2006-04-27 2007-12-04 Hitachi, Ltd. Power module for power inverter
JP5041798B2 (en) * 2006-12-15 2012-10-03 三菱電機株式会社 Semiconductor device
JP5900610B2 (en) * 2012-04-16 2016-04-06 富士電機株式会社 Semiconductor device and cooler for semiconductor device
JP6112073B2 (en) * 2014-06-20 2017-04-12 株式会社豊田自動織機 Semiconductor device
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
JP1536191S (en) * 2014-08-19 2015-10-26
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
DE102014115847B4 (en) * 2014-10-30 2018-03-08 Infineon Technologies Ag Method for producing a power semiconductor module
USD748595S1 (en) 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
US9431311B1 (en) 2015-02-19 2016-08-30 Semiconductor Components Industries, Llc Semiconductor package with elastic coupler and related methods
JP6485257B2 (en) * 2015-07-01 2019-03-20 富士電機株式会社 Semiconductor device and manufacturing method of semiconductor device
CN109673166B (en) * 2017-02-06 2023-01-20 富士电机株式会社 Semiconductor module, electric vehicle, and power control unit
TWI762765B (en) 2019-02-20 2022-05-01 台達電子工業股份有限公司 Package structure of power module
JP1644633S (en) 2019-03-26 2019-11-05
TWI735249B (en) 2020-01-05 2021-08-01 財團法人工業技術研究院 Power module
TWD206651S (en) * 2020-04-24 2020-08-21 財團法人工業技術研究院 Power module
US11613159B2 (en) 2020-04-30 2023-03-28 Thermo King Llc Power protection system for a power module of a transport climate control system
KR102855222B1 (en) 2020-05-27 2025-09-04 주식회사 아모센스 Power module
JP7014871B1 (en) * 2020-09-04 2022-02-01 日立Astemo株式会社 Power converter
US11315859B1 (en) * 2020-10-22 2022-04-26 Semiconductor Components Industries, Llc Power module
US12349293B2 (en) * 2022-10-13 2025-07-01 Industrial Technology Research Institute Combined power module
JP2024095180A (en) * 2022-12-28 2024-07-10 富士電機株式会社 Electronic device and method for manufacturing the same
DE102023122872B3 (en) * 2023-08-25 2025-02-06 Infineon Technologies Ag POWER ELECTRONICS SYSTEM COMPRISING A POWER SEMICONDUCTOR MODULE AND A CURRENT SENSOR AND A POWER SEMICONDUCTOR MODULE
US20250149395A1 (en) * 2023-11-03 2025-05-08 Wolfspeed, Inc. Power modules having encapsulation stress and strain mitigating configurations

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD212914S (en) 2020-09-30 2021-07-21 日商日本航空電子工業股份有限公司 Connector

Also Published As

Publication number Publication date
USD1090465S1 (en) 2025-08-26

Similar Documents

Publication Publication Date Title
TWD231182S (en) Electric connector
TWD221195S (en) Ratchet housing
TWD221696S (en) Earbud
TWD237796S (en) Charging case with earbuds
TWD225278S (en) Earbud cap
TWD229664S (en) Electrical connector housing
TWD235165S (en) Power module housing
TWD238020S (en) High voltage electrical connector
TWD215388S (en) Electrical connector
TWD231825S (en) Housing of power module
TWD238538S (en) High voltage electrical connector
TWD238537S (en) High voltage electrical connector
TWD241532S (en) Case with earphones
TWD238583S (en) High voltage electrical connector
TWD237197S (en) Charging connector
TWD237384S (en) Terminal mating part
TWD227432S (en) Connector body
TWD230668S (en) Electrical connector
TWD238536S (en) Electrical connector with a latching mechanism
TWD240424S (en) Bus Condition Component
TWD237480S (en) Fixing case
TWD242093S (en) Electrical connector housing
TWD232404S (en) Portion of connector receptacle and housing set
TWD234860S (en) Power module
TWD229390S (en) Electrical connector housing