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TWD225667S - 拋光研磨裝置 - Google Patents

拋光研磨裝置 Download PDF

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Publication number
TWD225667S
TWD225667S TW111304473F TW111304473F TWD225667S TW D225667 S TWD225667 S TW D225667S TW 111304473 F TW111304473 F TW 111304473F TW 111304473 F TW111304473 F TW 111304473F TW D225667 S TWD225667 S TW D225667S
Authority
TW
Taiwan
Prior art keywords
polishing
grinding device
view
case
item
Prior art date
Application number
TW111304473F
Other languages
English (en)
Inventor
黃銘康
周智鵬
Original Assignee
大陸商杭州眾硅電子科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商杭州眾硅電子科技有限公司 filed Critical 大陸商杭州眾硅電子科技有限公司
Publication of TWD225667S publication Critical patent/TWD225667S/zh

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Abstract

【物品用途】;本設計物品是一種拋光研磨裝置。;【設計說明】;仰視圖為普通消費者於選購時或使用時不會注意之視面而不具設計特徵，故省略之。;本案係以灰階電腦繪圖表現，各視圖表面所呈現的濃淡僅係為表現本案之形狀，但並非主張如圖所示之灰階色彩。

Description

拋光研磨裝置
本設計物品是一種拋光研磨裝置。
仰視圖為普通消費者於選購時或使用時不會注意之視面而不具設計特徵，故省略之。
本案係以灰階電腦繪圖表現，各視圖表面所呈現的濃淡僅係為表現本案之形狀，但並非主張如圖所示之灰階色彩。
TW111304473F 2022-06-30 2022-09-07 拋光研磨裝置 TWD225667S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2022304103360 2022-06-30
CN202230410336 2022-06-30

Publications (1)

Publication Number Publication Date
TWD225667S true TWD225667S (zh) 2023-06-01

Family

ID=87200811

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111304473F TWD225667S (zh) 2022-06-30 2022-09-07 拋光研磨裝置

Country Status (3)

Country Link
US (1) USD1018613S1 (zh)
JP (1) JP1748953S (zh)
TW (1) TWD225667S (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1728449S (ja) * 2022-03-30 2022-10-27 基板処理装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD266520S (en) * 1979-08-20 1982-10-12 HDE Systems, Inc. Material machining device enclosure
USD544534S1 (en) * 2006-06-08 2007-06-12 Xerox Corporation Continuous feed printer
TWD125940S1 (zh) * 2007-05-16 2008-11-11 東京威力科創股份有限公司 晶圓搬出入機
JP4958300B2 (ja) * 2007-11-08 2012-06-20 株式会社森精機製作所 工作機械
USD614233S1 (en) * 2008-04-24 2010-04-20 Xerox Corporation Continuous feed printing system
USD616476S1 (en) * 2009-11-24 2010-05-25 Romanyszyn Michael T Bagger outer panels
USD650417S1 (en) * 2010-05-13 2011-12-13 Xerox Corporation Continuous feed printer
USD667031S1 (en) * 2011-03-28 2012-09-11 Trumpf Inc. Laser processing machine
USD676882S1 (en) * 2011-04-12 2013-02-26 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Machine tool unit with conveyor
USD753734S1 (en) * 2013-08-07 2016-04-12 Atotech Deutschland Gmbh Device for metal deposition
USD762748S1 (en) * 2014-05-14 2016-08-02 Trumpf Gmbh + Co. Kg Housing of a laser processing machine
USD780937S1 (en) * 2015-03-02 2017-03-07 Tecnologia Bancaria S.A. Automated teller machine enclosure
USD822724S1 (en) * 2016-03-24 2018-07-10 Atotech Deutschland Gmbh Device for metal deposition
USD865010S1 (en) * 2017-01-17 2019-10-29 Sugino Machine Limited Washing machine for machined parts
USD861745S1 (en) * 2017-04-20 2019-10-01 Oerlikon Surface Solutions Ag, Pfaffikon Machine for coating
USD873876S1 (en) * 2017-06-21 2020-01-28 Cama1 S.P.A. Packaging machine
JP1632017S (zh) * 2018-10-26 2019-05-20
USD916938S1 (en) * 2019-03-26 2021-04-20 Panotec S.R.L. Packing machine
JP1641848S (zh) * 2019-03-27 2019-09-24
JP1700172S (zh) * 2020-11-23 2021-11-22
USD976971S1 (en) * 2020-12-30 2023-01-31 Shenzhen Snapmaker Technologies Co., Ltd. Three-dimensional printer housing
USD989831S1 (en) * 2021-05-14 2023-06-20 Hitachi High-Tech Corporation Apparatus for evaluating semiconductor substrate
IT202100030653A1 (it) * 2021-12-03 2023-06-03 Blm Spa Alloggiamento per una macchina di lavorazione a laser e macchina di lavorazione a laser avente un alloggiamento

Also Published As

Publication number Publication date
USD1018613S1 (en) 2024-03-19
JP1748953S (ja) 2023-07-19

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