[go: up one dir, main page]

TWD223375S - 靜電卡盤 - Google Patents

靜電卡盤 Download PDF

Info

Publication number
TWD223375S
TWD223375S TW110304948F TW110304948F TWD223375S TW D223375 S TWD223375 S TW D223375S TW 110304948 F TW110304948 F TW 110304948F TW 110304948 F TW110304948 F TW 110304948F TW D223375 S TWD223375 S TW D223375S
Authority
TW
Taiwan
Prior art keywords
mark
design
case
chip
electrostatic chuck
Prior art date
Application number
TW110304948F
Other languages
English (en)
Inventor
史全宇
Original Assignee
大陸商北京北方華創微電子裝備有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商北京北方華創微電子裝備有限公司 filed Critical 大陸商北京北方華創微電子裝備有限公司
Publication of TWD223375S publication Critical patent/TWD223375S/zh

Links

Images

Abstract

【物品用途】;用於對晶片進行承載和固定，避免晶片在製程中出現移位或錯位，並在連接射頻電源後，為晶片提供射頻偏壓和控制晶片表面的溫度;【設計說明】;本案設計係新穎獨特之樣式，藉由形狀和圖案的結合設計靜電卡盤，可顯現出現有技術所未有之視覺效果。;本案最能表明設計要點的圖片或照片為:立體圖1。本案省略無設計要點的後視圖。;A部放大圖中標記1為靜電卡盤上的凸起，凸起高度很小，在3至8微米之間；標記2為氣道；標記3為用於定位的槽；標記4為孔。B部放大圖中標記5為中心氣孔；標記6為C形塗層；標記7為長圓形槽。;圖式所揭露之文字，為本案不主張設計之部分。

Description

靜電卡盤
用於對晶片進行承載和固定，避免晶片在製程中出現移位或錯位，並在連接射頻電源後，為晶片提供射頻偏壓和控制晶片表面的溫度
本案設計係新穎獨特之樣式，藉由形狀和圖案的結合設計靜電卡盤，可顯現出現有技術所未有之視覺效果。
本案最能表明設計要點的圖片或照片為:立體圖1。本案省略無設計要點的後視圖。
A部放大圖中標記1為靜電卡盤上的凸起，凸起高度很小，在3至8微米之間；標記2為氣道；標記3為用於定位的槽；標記4為孔。B部放大圖中標記5為中心氣孔；標記6為C形塗層；標記7為長圓形槽。
圖式所揭露之文字，為本案不主張設計之部分。
TW110304948F 2021-03-29 2021-09-14 靜電卡盤 TWD223375S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202130170686.X 2021-03-29
CN202130170686 2021-03-29

Publications (1)

Publication Number Publication Date
TWD223375S true TWD223375S (zh) 2023-02-01

Family

ID=83059681

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110304948F TWD223375S (zh) 2021-03-29 2021-09-14 靜電卡盤

Country Status (3)

Country Link
US (1) USD984972S1 (zh)
JP (1) JP1723603S (zh)
TW (1) TWD223375S (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1072774S1 (en) * 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1066620S1 (en) * 2021-02-12 2025-03-11 Applied Materials, Inc. Patterned heater pedestal with groove extensions
USD1007449S1 (en) * 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1103948S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1104086S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
TWD228934S (zh) * 2021-09-08 2023-12-11 美商蘭姆研究公司 美國 除泡器元件
USD1054388S1 (en) * 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling
USD1071886S1 (en) * 2022-01-20 2025-04-22 Applied Materials, Inc. Substrate support for a substrate processing chamber
USD1071103S1 (en) * 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1085029S1 (en) * 2022-07-19 2025-07-22 Applied Materials, Inc. Gas distribution plate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD206653S (zh) 2019-07-18 2020-08-21 日商國際電氣股份有限公司 基板處理裝置用吸頂式加熱器的保持板

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2106325A (en) * 1981-09-14 1983-04-07 Philips Electronic Associated Electrostatic chuck
GB2147459A (en) * 1983-09-30 1985-05-09 Philips Electronic Associated Electrostatic chuck for semiconductor wafers
JPS6131636U (ja) * 1984-07-31 1986-02-26 株式会社 徳田製作所 静電チヤツク
JP2665242B2 (ja) * 1988-09-19 1997-10-22 東陶機器株式会社 静電チャック
USD363464S (en) * 1992-08-27 1995-10-24 Tokyo Electron Yamanashi Limited Electrode for a semiconductor processing apparatus
JPH09213777A (ja) * 1996-01-31 1997-08-15 Kyocera Corp 静電チャック
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
JP3983387B2 (ja) * 1998-09-29 2007-09-26 日本碍子株式会社 静電チャック
JP3551867B2 (ja) * 1999-11-09 2004-08-11 信越化学工業株式会社 シリコンフォーカスリング及びその製造方法
WO2001086717A1 (en) * 2000-05-10 2001-11-15 Ibiden Co., Ltd. Electrostatic chuck
JP4312394B2 (ja) * 2001-01-29 2009-08-12 日本碍子株式会社 静電チャックおよび基板処理装置
JP4094262B2 (ja) * 2001-09-13 2008-06-04 住友大阪セメント株式会社 吸着固定装置及びその製造方法
USD489739S1 (en) * 2002-12-20 2004-05-11 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD490093S1 (en) * 2002-12-20 2004-05-18 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD490096S1 (en) * 2002-12-20 2004-05-18 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD490094S1 (en) * 2002-12-20 2004-05-18 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD490827S1 (en) * 2002-12-20 2004-06-01 Ngk Spark Plug Co., Ltd. Electrostatic chuck
KR20040070008A (ko) * 2003-01-29 2004-08-06 쿄세라 코포레이션 정전척
US7430104B2 (en) * 2003-03-11 2008-09-30 Appiled Materials, Inc. Electrostatic chuck for wafer metrology and inspection equipment
US7697260B2 (en) * 2004-03-31 2010-04-13 Applied Materials, Inc. Detachable electrostatic chuck
USD553104S1 (en) * 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
CN100470756C (zh) * 2004-06-28 2009-03-18 京瓷株式会社 静电卡盘
US8525418B2 (en) * 2005-03-31 2013-09-03 Ngk Spark Plug Co., Ltd. Electrostatic chuck
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD548200S1 (en) * 2005-09-29 2007-08-07 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD546784S1 (en) * 2005-09-29 2007-07-17 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD548705S1 (en) * 2005-09-29 2007-08-14 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
JP2007173596A (ja) * 2005-12-22 2007-07-05 Ngk Insulators Ltd 静電チャック
TWD125773S1 (zh) * 2006-08-01 2008-11-01 東京威力科創股份有限公司 半導體製造用靜電吸盤用吸附板
US7619870B2 (en) * 2006-08-10 2009-11-17 Tokyo Electron Limited Electrostatic chuck
US8690135B2 (en) * 2006-12-18 2014-04-08 Camtek Ltd. Chuck and a method for supporting an object
US8422193B2 (en) * 2006-12-19 2013-04-16 Axcelis Technologies, Inc. Annulus clamping and backside gas cooled electrostatic chuck
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
TWD135511S1 (zh) * 2008-10-03 2010-06-21 日本碍子股份有限公司 靜電夾頭
US9494875B2 (en) * 2011-10-06 2016-11-15 Asml Netherlands B.V. Chuck, a chuck control system, a lithography apparatus and a method of using a chuck
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD723077S1 (en) * 2013-12-03 2015-02-24 Applied Materials, Inc. Chuck carrier film

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD206653S (zh) 2019-07-18 2020-08-21 日商國際電氣股份有限公司 基板處理裝置用吸頂式加熱器的保持板

Also Published As

Publication number Publication date
USD984972S1 (en) 2023-05-02
JP1723603S (ja) 2022-08-31

Similar Documents

Publication Publication Date Title
TWD223375S (zh) 靜電卡盤
TWI310730B (en) Technique for separating a mold from solidified imprinting material
TWI618185B (zh) 基板固持器、微影裝置及製造器件之方法
CN108169999B (zh) 掩模版及其制备方法、显示面板及其制备方法
WO2004062886A1 (ja) パターン形成装置、パターン形成方法、パターン形成システム
TW200606578A (en) Production method for mask blank-use translucent substrate, production method for mask blank, production method for exposing mask, production method for semiconductor device and production method for liquid crystal display unit...
TWD211363S (zh) 基板載具
TW200908073A (en) An apparatus of controlling temperature and a method of controlling the temperature of wafer
EP1491653A3 (en) Evaporative deposition methods and apparatus
WO2020009088A1 (ja) マスク及びその製造方法
JP7085827B2 (ja) テンプレートの形状を調整する方法、システム、インプリントリソグラフィ方法
TW200517772A (en) Method of making photomask blank substrates
TW202328827A (zh) 用於微影裝置的基板固持器
CN202210213U (zh) 一种用于整片晶圆纳米压印自适应承片台
CN113805296B (zh) 一种光学组件及其制作方法
CN109203808B (zh) 一种合成珠宝加工专用雕刻装置
CN105773853B (zh) 边薄镜片钻孔皿组件
TWD194954S (zh) Elastic film for semiconductor wafer polishing
TWD194953S (zh) Elastic film for semiconductor wafer polishing
TW202336827A (zh) 晶圓及晶圓的處理方法
JP2015063065A (ja) インプリントモールド用基板、インプリントモールド及びそれらの製造方法、並びにインプリントモールドの再生方法
TW202030831A (zh) 用於微影設備中的基板固持器及器件製造方法
TWI750948B (zh) 襯底支撐構件及其應用方法
CN211466119U (zh) 一种用于高频晶片的镀膜片
JP2011148143A (ja) シートチャックおよびそれを用いたマイクロコンタクトプリント法