TWD220286S

TWD220286S - Part of cleaning jig for semiconductor manufacturing

Info

Publication number: TWD220286S
Application number: TW110303975F
Authority: TW
Inventors: 柴崎健太; 稲田博一; 新村聡; 高栁康治
Original assignee: 日商東京威力科創股份有限公司
Priority date: 2021-02-03
Filing date: 2021-07-30
Publication date: 2022-08-01
Also published as: JP1692866S

Abstract

【物品用途】;本設計的物品是半導體製造用清洗治具，為一種半導體製造中之清洗製程所用的治具。;【設計說明】;在製造半導體時，在位於旋轉塗佈裝置中的容器部之內側，具有將半導體晶圓安裝在旋轉體上，一邊使其旋轉、一邊將光阻劑等藥液塗佈到晶圓上面的製程，但在此時，藥液因半導體晶圓的旋轉而飛濺，因而附著在容器部的內壁面，因此必須將附著的藥液清洗去除。本物品是在該清洗製程中，安裝在旋轉體上進行旋轉，而將從噴嘴噴出的清洗液噴灑到容器部的內壁面。本物品是在其外周部，設有底部孔部，形成橫跨周緣頂部和周緣底部的空間之貫通流路。因此，在利用本物品進行清洗的時候，從噴嘴噴射出來的清洗液，除了會流到周緣底部的下方之外，還會經過底部孔部，流到周緣頂部和周緣底部的空間而吐出。如此一來，在利用本物品的清洗過程中，就能針對容器部的內壁面，涵蓋其上部的廣大範圍進行清洗。;圖式中所揭露之虛線部分，為本案不主張設計之部分；圖式中一點鏈線所圍繞者，係界定本案所欲主張之範圍，該一點鏈線本身為本案不主張設計之部分。[Use of article]; The article designed in this design is a cleaning jig for semiconductor manufacturing, which is a jig used in the cleaning process of semiconductor manufacturing. ;[Design Description];When manufacturing semiconductors, a semiconductor wafer is mounted on a rotating body inside a container part located in a spin coating device, and a chemical solution such as photoresist is applied while rotating the wafer. However, at this time, the chemical liquid is splashed due to the rotation of the semiconductor wafer and adheres to the inner wall surface of the container part. Therefore, the adhered chemical liquid must be cleaned and removed. This article is installed on the rotating body and rotates during the cleaning process, and the cleaning liquid sprayed from the nozzle is sprayed onto the inner wall surface of the container part. This article is provided with a bottom hole on its outer periphery to form a through flow path across the space between the top and bottom of the periphery. Therefore, when this article is used for cleaning, the cleaning liquid sprayed from the nozzle will not only flow below the bottom of the peripheral edge, but also flow through the bottom hole to the space between the top and bottom of the peripheral edge and be spit out. In this way, during the cleaning process using this article, the inner wall surface of the container part and the wide range of its upper part can be cleaned. ; The dotted line portion disclosed in the drawing is a part of the case that does not claim design; the one-point chain line in the drawing is surrounded by a dotted line that defines the scope of the claim, and the one-point chain line itself is a part of the case that does not claim design.

Description

Part of cleaning jig for semiconductor manufacturing

本設計的物品是半導體製造用清洗治具，為一種半導體製造中之清洗製程所用的治具。The designed article is a cleaning jig for semiconductor manufacturing, which is a jig used in the cleaning process in semiconductor manufacturing.

在製造半導體時，在位於旋轉塗佈裝置中的容器部之內側，具有將半導體晶圓安裝在旋轉體上，一邊使其旋轉、一邊將光阻劑等藥液塗佈到晶圓上面的製程，但在此時，藥液因半導體晶圓的旋轉而飛濺，因而附著在容器部的內壁面，因此必須將附著的藥液清洗去除。本物品是在該清洗製程中，安裝在旋轉體上進行旋轉，而將從噴嘴噴出的清洗液噴灑到容器部的內壁面。本物品是在其外周部，設有底部孔部，形成橫跨周緣頂部和周緣底部的空間之貫通流路。因此，在利用本物品進行清洗的時候，從噴嘴噴射出來的清洗液，除了會流到周緣底部的下方之外，還會經過底部孔部，流到周緣頂部和周緣底部的空間而吐出。如此一來，在利用本物品的清洗過程中，就能針對容器部的內壁面，涵蓋其上部的廣大範圍進行清洗。In the manufacture of semiconductors, there is a process in which a semiconductor wafer is mounted on a rotating body inside a container portion of a spin coater, and a chemical solution such as photoresist is applied to the wafer while rotating it. However, at this time, the chemical solution splashes due to the rotation of the semiconductor wafer and adheres to the inner wall surface of the container portion, so the adhered chemical solution must be cleaned and removed. In this cleaning process, this article is mounted on a rotating body and rotated, and the cleaning liquid ejected from the nozzle is sprayed on the inner wall surface of the container portion. This article is provided with a bottom hole on its outer peripheral portion, and forms a through flow path spanning the space between the peripheral top and the peripheral bottom. Therefore, when cleaning with this article, the cleaning liquid sprayed from the nozzle will not only flow below the bottom of the peripheral edge, but also flow into the space between the top of the peripheral edge and the bottom of the peripheral edge through the bottom hole to be discharged. In this way, in the cleaning process using this article, the inner wall surface of the container portion can be cleaned over a wide range covering the upper portion.

圖式中所揭露之虛線部分，為本案不主張設計之部分；圖式中一點鏈線所圍繞者，係界定本案所欲主張之範圍，該一點鏈線本身為本案不主張設計之部分。The part of the dotted line disclosed in the drawing is the part where the design is not claimed in this case; the dotted line in the drawing is the part that defines the scope of the claim in this case, and the one-point chain itself is the part where the design is not claimed in the case.