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TWD200074S - Support pillars for thermal insulation components of semiconductor manufacturing equipment - Google Patents

Support pillars for thermal insulation components of semiconductor manufacturing equipment

Info

Publication number
TWD200074S
TWD200074S TW107302986F TW107302986F TWD200074S TW D200074 S TWD200074 S TW D200074S TW 107302986 F TW107302986 F TW 107302986F TW 107302986 F TW107302986 F TW 107302986F TW D200074 S TWD200074 S TW D200074S
Authority
TW
Taiwan
Prior art keywords
heat
manufacturing equipment
semiconductor manufacturing
thermal insulation
insulation components
Prior art date
Application number
TW107302986F
Other languages
Chinese (zh)
Inventor
Yusaku Okajima
Shuhei Saido
Hidenari Yoshida
Original Assignee
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司
Publication of TWD200074S publication Critical patent/TWD200074S/en

Links

Abstract

【物品用途】;本設計的物品是半導體製造裝置之隔熱組件用支柱，是設置在用來處理半導體晶圓等的基板之反應管內，用來將從基板處理區域朝爐口方向的熱能量傳播予以阻隔的隔熱組件用支柱，是設置於晶舟的下方來使用，該晶舟用來將基板保持為多層。在支柱的中空軸上形成的隔熱板保持架，在該保持架是形成有對應其所保持的數量的隔熱板所需要的層數。;【設計說明】;(無)[Use of article] The article of this design is a pillar for heat insulation components of semiconductor manufacturing equipment. It is installed in a reaction tube used to process substrates such as semiconductor wafers, and is used to transfer heat from the substrate processing area to the furnace mouth. The pillars for heat-insulating components that block energy propagation are used under the wafer boat that holds the substrate in multiple layers. A heat-insulating panel holder is formed on the hollow shaft of the pillar, and the holder is formed with the required number of layers corresponding to the number of heat-insulating panels held. ;[Design description];(none)

TW107302986F 2018-02-07 2018-05-28 Support pillars for thermal insulation components of semiconductor manufacturing equipment TWD200074S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2018-2488F JP1611561S (en) 2018-02-07 2018-02-07

Publications (1)

Publication Number Publication Date
TWD200074S true TWD200074S (en) 2019-10-01

Family

ID=63169008

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107302986F TWD200074S (en) 2018-02-07 2018-05-28 Support pillars for thermal insulation components of semiconductor manufacturing equipment

Country Status (3)

Country Link
US (1) USD928106S1 (en)
JP (1) JP1611561S (en)
TW (1) TWD200074S (en)

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USD770236S1 (en) * 2014-08-14 2016-11-01 Venkateswara Prasad Pattipati Wine bottle holder
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Also Published As

Publication number Publication date
JP1611561S (en) 2018-08-20
USD928106S1 (en) 2021-08-17

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