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TWD241950S - Sputtering target - Google Patents

Sputtering target

Info

Publication number
TWD241950S
TWD241950S TW113305954F TW113305954F TWD241950S TW D241950 S TWD241950 S TW D241950S TW 113305954 F TW113305954 F TW 113305954F TW 113305954 F TW113305954 F TW 113305954F TW D241950 S TWD241950 S TW D241950S
Authority
TW
Taiwan
Prior art keywords
design
sputtering target
view
enlarged view
left views
Prior art date
Application number
TW113305954F
Other languages
Chinese (zh)
Inventor
布克斐勒約瑟夫
約瑟夫 布克斐勒
愛樂瑞克
瑞克 愛樂
瑞瑟約翰
約翰 瑞瑟
特倫蘿拉
蘿拉 特倫
歐佛德蓋瑞
蓋瑞 歐佛德
Original Assignee
美商塔沙Smd公司 (美國)
美商塔沙Smd公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商塔沙Smd公司 (美國), 美商塔沙Smd公司 filed Critical 美商塔沙Smd公司 (美國)
Publication of TWD241950S publication Critical patent/TWD241950S/en

Links

Abstract

【物品用途】;本設計有關於一種濺鍍用靶。;【設計說明】;前視圖、後視圖及左側視圖皆為本設計右側視圖之鏡像,故在本設計中省略前視圖、後視圖及左側視圖。;局部放大圖為俯視圖之13-13剖面圖之局部放大圖。;虛線部分為不主張設計之部分。【Purpose of Item】; This design relates to a target for sputtering. ; 【Design Description】; The front, rear, and left views are all mirror images of the right view of this design; therefore, the front, rear, and left views are omitted in this design. ; The enlarged view is a partial enlarged view of section 13-13 of the top view. ; The dotted lines represent parts that are not part of the design.

Description

濺鍍用靶 Splashing target

本設計有關於一種濺鍍用靶。This design relates to a sputtering target.

前視圖、後視圖及左側視圖皆為本設計右側視圖之鏡像,故在本設計中省略前視圖、後視圖及左側視圖。The front view, rear view, and left view are all mirror images of the right view of this design; therefore, the front view, rear view, and left view are omitted in this design.

局部放大圖為俯視圖之13-13剖面圖之局部放大圖。The enlarged view is a partial enlarged view of section 13-13 of the top view.

虛線部分為不主張設計之部分。The dotted lines represent parts that are not part of the design.

TW113305954F 2023-07-07 2024-01-05 Sputtering target TWD241950S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/896,858 2023-07-07
US202329896858 2023-07-07

Publications (1)

Publication Number Publication Date
TWD241950S true TWD241950S (en) 2025-12-11

Family

ID=91896153

Family Applications (2)

Application Number Title Priority Date Filing Date
TW113300067F TWD237530S (en) 2023-07-07 2024-01-05 Sputtering target
TW113305954F TWD241950S (en) 2023-07-07 2024-01-05 Sputtering target

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW113300067F TWD237530S (en) 2023-07-07 2024-01-05 Sputtering target

Country Status (2)

Country Link
JP (2) JP1775440S (en)
TW (2) TWD237530S (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD981970S1 (en) 2021-03-04 2023-03-28 Kokusai Electric Corporation Substrate mounting plate for substrate processing apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD981970S1 (en) 2021-03-04 2023-03-28 Kokusai Electric Corporation Substrate mounting plate for substrate processing apparatus

Also Published As

Publication number Publication date
JP1775441S (en) 2024-07-16
TWD237530S (en) 2025-04-11
JP1775440S (en) 2024-07-16

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