TW595303B - Frame structure of electronic device - Google Patents

Abstract

This invention relates to a frame structure of an electronic device, which comprises a metal frame, a printed circuit board and a plurality conductive side walls. The printed circuit board is disposed into the metal frame with a plurality of electronic elements and a plurality of conductive side walls installed thereon. The electronic elements are enclosed in a sealed space through the individual conductive side walls, the printed circuit board and a shielding face of the metal frame to prevent the electronic elements in the electronic device from electromagnetic interference (EMI).

Description

595303 V. Description of the invention (l) The present invention relates to a frame structure of an electronic device, and particularly relates to a frame structure that can avoid external electromagnetic radiation interference. With the popularization of mobile communication systems, consumers are afraid of mobile phones to endure the situation. In addition to requiring mobile phones to have good communication quality, simple operation interface, light and short, power saving, but also more To be exchangeable or to have various shapes, etc., each mobile phone factory has made every effort to meet consumer needs. Please refer to Fig. 1. Fig. 1 is a combination diagram of a conventional mobile phone. A general mobile phone 10 usually has a frame 12a, a main circuit board 12, and upper and lower casings 14, 14. The material of the frame 13 is mainly metal or plastic 'for fixing the main circuit board 12, the upper and lower casings n, 14 or the battery. The main circuit board 12 is provided with a liquid crystal display module 丨 2 1. Key module 丨 2 3. Radio frequency module and other electronic components (not shown). When the user presses the button, the key module 1 2 3 is known. The metal contacts 1 2 3 1 are turned on, and after the microprocessor (not shown) on the main circuit board 12 executes various commands, it performs corresponding actions, such as displaying text on the LCD module 121, or controlling The RF module receives or sends signals. / For an electronic system, a metal sheet is usually used to cover the outside of the electronic system to prevent external electromagnetic radiation interference (Electromagnetic Interference, EMI), or to block electromagnetic radiation generated by electronic devices, reducing the Human body or electronic device.胄 Refer to the heading, Figure 2 is a combined view of the main circuit board from another perspective in Figure i. The chip ma, 127b,% of the same function is shown on the main circuit board 12 of the mobile phone. ： The control chip of the group, etc., for the production of each module, port module 127a, 127b

5953〇3

The generated electromagnetic light emission will not interfere with each other, so the conventional practice is to set a plurality of metal side walls 125a, 125b on the main circuit board to separate each module, and then use a metal outer cover 16a, 16b to snap in The metal side walls 125a, 12 讣 j prevent electromagnetic radiation from escaping, and then the main circuit board 12 is mounted on the frame 13 to complete the assembly. From the above, there can be multiple pieces on each module to make the mobile electrons of the mobile ^ dagger in view of the interference of the frame on the circuit board 12 to achieve the upper structure, including a frame circuit board mounted on the parts and a plurality of conductive metals. It is in one of the frames to avoid electricity. It is based on a conductive foam embodiment. It is a metal cover 16 a in the conventional technology. Add some weight for details. Multi-devices for telephones were added to the present invention with an additional gold structure, a purpose frame, and a metal electrical side wall shielding surface sub-component printed electrical seal. This said the clear purpose is an outer cover to reduce the 'invented printed electrical frame' And by receiving this, the frame board is provided in 16a, and the electronic board is provided with the board, and it is better to have the electromagnetic frame and the various guides in the conductive sub-element boundary. To prevent 16b, the pair needs to be provided with a plurality of electrical types that can be placed on 6b. Electrical sidewall members are provided to cover the radiant dry conductive side electrical sidewall covers. Avoid extraneous. Sub-device Conductive side has plural

The electromagnetic wheel emits interference, but it adds a little more to the direction of very light weight improvement. A kind of poor wall that does not need to be in the main frame. The Bj electrical j and printed circuit are interfering with a closed space. The material of the wall is named

595303 V. Description of the invention (3) Please refer to FIG. 3 and FIG. 4. FIG. 3 is a combination diagram of the main circuit board of the mobile phone according to the embodiment of the present invention, and FIG. 4 is another perspective of the main circuit board in FIG. Combination chart. For example, the mobile phone 10 in the conventional technology generally has a frame 13, a main circuit board 12, and upper and lower casings 丨, u. The main circuit board 12 is provided with a liquid crystal display module 1 2 1 and a key module 1 2 3 on the front side, and two chips 127a and 127b and conductive side walls 1 2 5 surrounding the chips 127a and 127b or other electronic components on the back side. a, 1 2 5 b, the conductive sidewalls 1 2 5 a, 1 2 5 b are made of metal or other conductive materials. The frame of the embodiment of the present invention is a metal plate, and the two conductive foams 135a, i35b are pasted on the frame 13 in a shape corresponding to the conductive sidewalls 125a, 125b on the main circuit board 12, and the conductive foam 135a is formed on the frame 13. The surface surrounded by 135b forms two metal shielding surfaces 133a, 133b to block electromagnetic waves. As shown in Figs. 3 and 4, when a mobile phone according to an embodiment of the present invention is to be combined, it is directly fixed to the frame 13 by the main circuit board 12, and then the upper and lower cases 11, 14 can be installed. Since the frame of the mobile phone according to the embodiment of the present invention is made of metal, when the main circuit board 12 is engaged or fixed with screws, the main circuit board 12, the conductive side walls 1258, 125b, and the shielding surface 133a of the frame 13, 133b respectively covers the wafers 127a and 127b in an enclosed space to block electromagnetic waves. In addition to the conductive foams 135a, 135b can be bonded to the conductive sidewalls 125a, 125b and the frame 13, the conductive foams 135a, 135b have the effect of blocking electromagnetic waves, so that electromagnetic waves will not be caused by the conductive sidewalls 25a, 1 2 5 b and the frame Escape between 1 and 3. From the above, it can be known that the mobile phone according to the embodiment of the present invention 丨 0 uses the shield surfaces 133a and 133b of the frame 丨 3 as the conductive side walls 125a and 125b.

0535-7762TWF (n); A91046; Jimy.ptd 595303 V. The frame structure of the invention description (4) on the one hand provides sufficient support strength for mobile phones, on the other hand, the metal cover 1 6 a, 1 6 b is omitted, It can also achieve the need to reduce the weight of mobile phones. In addition, the frame structure of the present invention is not limited to mobile phones, and can also be used in other electronic devices, such as digital personal assistants, notebook computers, digital cameras, etc., which can effectively reduce the weight of the entire electronic device. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and retouching without departing from the spirit and scope of the present invention. The scope of protection shall be determined by the scope of the attached patent application.

0535-7762TWF (n); A91046; Jimy.ptd Page 7 595303 The diagram briefly illustrates that in order to make the above and other objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is given below, and With the accompanying drawings, the detailed description is as follows: Brief description of the drawings: Figure 1 is a combination diagram of a mobile phone of the conventional technology. Figure 2 is a combined view of the main circuit board from another perspective in Figure 1. FIG. 3 is a combination diagram of a main circuit board of a mobile phone according to an embodiment of the present invention. Figure 4 is a combined view of the main circuit board from another perspective in Figure 3. Symbol Description:

1 0 to mobile phone 1 1 to upper case 1 2 to main circuit board 1 2 1 to liquid crystal display module 1 2 3 to key module 125a, 125b to conductive side wall 127a, 127b to chip 1 3 to frame 1 3 1 ~ Through hole 133a, 133b ~ shield surface

135a, 135b ~ Conductive foam 1 4 ~ Lower case 16a, 16b ~ Metal cover

0535-7762TWF (n); A91046; J imy.ptd p. 8

Claims (1)

595303, patent application scope1. A frame structure of an electronic device, including a frame having a conductive shielding surface; a printed circuit board provided with a plurality of electronic components, wherein the printed circuit board is mounted on the frame; and A plurality of conductive side walls are disposed on the fast brush circuit board, wherein the conductive side walls, the printed circuit board and the shielding surface of the frame enclose the electronic components in a closed space. 2. The frame structure as described in item 1 of the scope of patent application, further comprising: a conductive foam provided on the frame so that the conductive side edges and the joint of the frame are in close contact. Soil ~ 3. The frame structure as described in item 1 of the patent application scope, wherein the frame is made of metal. The frame structure described in item 1 of the scope of patent application, wherein the material of the conductive side walls is metal. ^ 5 · —A frame structure of a mobile phone, including: ’The printed circuit board A frame having a conductive shielding surface; a printed circuit board provided with a plurality of electronic components mounted on the frame; and a plurality of conductive side walls provided on the printed circuit board, wherein the conductive side walls and the printed circuit board And the shielding surface of the frame encloses the equal electronic components in a closed space. Ⅹ, 6 · The frame structure as described in item 5 of the scope of patent application, further comprising: a conductive foam 'set on the frame' so that the conductive side walls and the joint of the frame are in close contact. 0535-7762TWF (n); A91046; Jimy.ptd Page 9 595303 6. Scope of patent application The material of the frame is metal. Among them 8. The frame structure according to item 5 of the scope of patent application The material of the conductive side wall is metal. 0535-7762TWF (n); A91046; Jimy.ptd p. 10