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TW564971U - A heat dissipating assembly - Google Patents

A heat dissipating assembly

Info

Publication number
TW564971U
TW564971U TW092200439U TW92200439U TW564971U TW 564971 U TW564971 U TW 564971U TW 092200439 U TW092200439 U TW 092200439U TW 92200439 U TW92200439 U TW 92200439U TW 564971 U TW564971 U TW 564971U
Authority
TW
Taiwan
Prior art keywords
heat dissipating
dissipating assembly
assembly
heat
dissipating
Prior art date
Application number
TW092200439U
Other languages
English (en)
Inventor
Chun-Chi Chen
Chin-Hsien Lan
Meng Fu
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW092200439U priority Critical patent/TW564971U/zh
Publication of TW564971U publication Critical patent/TW564971U/zh
Priority to US10/756,734 priority patent/US6924982B2/en

Links

Classifications

    • H10W40/43
    • H10W40/641
TW092200439U 2003-01-10 2003-01-10 A heat dissipating assembly TW564971U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW092200439U TW564971U (en) 2003-01-10 2003-01-10 A heat dissipating assembly
US10/756,734 US6924982B2 (en) 2003-01-10 2004-01-12 Heat dissipation assembly including heat sink and fan

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092200439U TW564971U (en) 2003-01-10 2003-01-10 A heat dissipating assembly

Publications (1)

Publication Number Publication Date
TW564971U true TW564971U (en) 2003-12-01

Family

ID=32504054

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092200439U TW564971U (en) 2003-01-10 2003-01-10 A heat dissipating assembly

Country Status (2)

Country Link
US (1) US6924982B2 (zh)
TW (1) TW564971U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108135109A (zh) * 2017-12-20 2018-06-08 珠海英搏尔电气股份有限公司 风机总成、电机控制器和电动车

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM249098U (en) * 2003-10-28 2004-11-01 Hon Hai Prec Ind Co Ltd Fan retainer
CN2700943Y (zh) * 2004-04-24 2005-05-18 鸿富锦精密工业(深圳)有限公司 散热器扣具
US7040389B2 (en) * 2004-05-12 2006-05-09 Hul-Chun Hsu Integrated heat dissipation apparatus
US7365979B2 (en) * 2005-11-01 2008-04-29 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipating assembly with fan fastening device
CN100464278C (zh) * 2005-11-02 2009-02-25 富准精密工业(深圳)有限公司 散热装置
CN100574595C (zh) * 2006-04-14 2009-12-23 鸿富锦精密工业(深圳)有限公司 散热装置
TWM311065U (en) * 2006-09-06 2007-05-01 Aopen Inc Heat-sinking module and the combination of the heat-sinking module and a computer cover
US20080121369A1 (en) * 2006-11-28 2008-05-29 Foxconn Technology Co., Ltd. Heat dissipation assembly having fan duct
US7480146B2 (en) * 2007-03-26 2009-01-20 Newisys, Inc. Heat sink mounting systems and methods
CN102478924A (zh) * 2010-11-24 2012-05-30 富准精密工业(深圳)有限公司 散热模组
CN103186205A (zh) * 2011-12-28 2013-07-03 鸿富锦精密工业(深圳)有限公司 风扇模组固定装置
USD708591S1 (en) * 2012-09-22 2014-07-08 Apple Inc. Fan component
US10692798B2 (en) * 2014-04-10 2020-06-23 Advanced Thermal Solutions, Inc. Multiple flow entrance heat sink
US10095282B2 (en) * 2016-06-23 2018-10-09 Dell Products, Lp Cover for heat sink

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2749506B2 (ja) 1994-01-20 1998-05-13 山洋電気株式会社 電子部品冷却装置
US5590025A (en) 1995-06-07 1996-12-31 Thermalloy, Inc. Fan attachment clip for heat sink
US6407919B1 (en) 2000-12-18 2002-06-18 Fargo Chou Structure of computer CPU heat dissipation module
US6520250B2 (en) 2001-02-23 2003-02-18 Foxconn Precision Components Co., Ltd. Fan holder
WO2002071822A1 (en) * 2001-03-03 2002-09-12 Zalman Tech Co., Ltd. Heatsink and heatsink device using the heatsink
TW534377U (en) * 2002-01-31 2003-05-21 Delta Electronics Inc Heat-dissipating assembly and its used securing device
TW578946U (en) * 2002-06-06 2004-03-01 Hon Hai Prec Ind Co Ltd A heat dissipation device
TW587768U (en) * 2003-01-30 2004-05-11 Molex Inc Heat-dissipating device
US6798663B1 (en) * 2003-04-21 2004-09-28 Hewlett Packard Development Company, L.P. Heat sink hold-down with fan-module attach location

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108135109A (zh) * 2017-12-20 2018-06-08 珠海英搏尔电气股份有限公司 风机总成、电机控制器和电动车
CN108135109B (zh) * 2017-12-20 2024-03-29 珠海英搏尔电气股份有限公司 风机总成、电机控制器和电动车

Also Published As

Publication number Publication date
US20040145882A1 (en) 2004-07-29
US6924982B2 (en) 2005-08-02

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees