TW526111B - Cutting method for brittle non metallic materials - Google Patents

Abstract

A cutting method for brittle non-metallic materials is disclosed. The cutting method is featured in that a laser beam is used to heat along a cutting line on a workpiece surface without cutting through the workpiece and one or more elastic wave sources induces additional effect on the workpiece surface. The amplitude and frequency of the elastic wave are determined in accordance with cutting through the workpiece or not. To achieve the best result, the elastic wave is concentrated on the cutting path. This technique allows for cutting of both single-layered and multiple-layered workpieces and is of vital importance to the manufacture of liquid crystal display (LCD) and flat panel display (FPD). Another feature of the present invention is that right-angled cutting and cutting of different angles (inclined) can be performed, later being important to formation of circular or curved objects.

Description

526111 V. Description of the invention (l) [Scope of application of the present invention] Can the precision of the industry be used to perform various materials at high speeds and high cutting paths; cut through or half cut through the material. When cutting ', it is used in the present invention for cutting thick materials, and it can also cut fine seams of a certain depth. When glass is produced, 1 + 1 degree. Ι ™ 11 to 20 has a very good effect of deleting glass, including in 不, 彡 彡 彡 割. In addition, this technology can be used for cross cutting. [Summary of previous techniques] The method of cutting glass tubes, which is called Erji, is to cut greens first with diamond tools! J a line (Book f ^ _ glass tube toilet laser seat ^ seat j is then heated by a circular laser beam, at this time the beam should be relatively moved, and then locally cooled with a refrigerant (good cut quality f pN. 857025). This method has good efficiency, and the glass tube cutting (known as another) plane brittle non-metallic material (t) cutting method also relies on the above-mentioned methods, that is, first use and ,,,,,,; Strips, tables (scratches), and then add elliptical laser beams, & = and the chirped beam should be moved, and it is expected that "local cooling RU94 / 00276, international literature number WO 96/20062 :) The method can be used for straight and curved cutting of dry surface materials. However, profit = can not effectively cut through the material, and in order to cut the material = ^ out of the object, you need to use mechanical or other methods to follow up . This process does not guarantee that the product being cut is 1% ^ 此 'This time, you need to add equipment for the final opening. $ 开 The cutting process is more complicated and the cutting cost is increased. , The currently known flat brittle non-metallic method is used first The stone tool draws a kind of knife-cut square-shaped laser beam along the cutting line to heat the material. At this time, the material and Ray 2 well ϋ), and then use ellipsoid = local cooling with a cold rolling agent (PCT / GB93 / () () 6 Not only can you cut half but also cut through glass, which method is not good? To use the laser beam or other for the cutting line; the amount of gold:-secondary heating. But this kind of cutting line will be taught in addition to the eight order re-program There are considerable limitations.… The main limitations of the heat treatment of the material from the knife are as follows: ^. The one-step cutting line should be deep, which can be used to reduce the cut 2. Initiate the material to break (follow-up process D, and the other two .: When performing subsequent breaks) It is necessary to reduce the cutting force = power and expand the heating area. 3. The laser beam needs to be increased to increase the laser intensity. 3. It is not possible to perform cross cutting. In addition, there are currently known cutting methods for broken glass panels. Beam, make this method 应力 to the glass bending stress to make the glass cut along the other side of the glass _ Lee No. 41 90 1 84)., '' Progressive separation (refer to the United States specifically for brittle materials laser plus ff The cutting method for brittle non-metallic materials is First use laser light G:; :: Used: cutting method. The content of this method is to apply heat to the other side of the workpiece to cause it to crack, 9). &Quot;. (Russian Federation Patent No. 21 3977 but 'Whether it is to apply constant mechanical pressure to the other side of the material, 526111 V. Description of the invention (3) or click along the path of the laser light spot ^ ~~~ Click, these methods can only be contracted "2 -The surface is delayed by a provoked ball, tantalum cannot increase the cutting speed. =, The speed of the movement and the material cracking mainly depends on the glass and its f, laser thermal cutting through the material guide. Because the production efficiency is low, & In addition, the low heat transfer of non-metallic materials is not widely used. Low for broken glass or other brittle materials. Pressure, small balls or other clicks Pei Zhi pairs of materials. In addition to adding constant constant and properties, regular strong clicks are performed. , Language, surface, deformation area depending on the thickness of the material. The laser beam causes the material surface to appear wide. The deformation stress caused by the click causes a combination of stress and small ball control. In addition, because of the wide deformation zone and the edge stress zone of the material, various residual tension components and impurities in the material cannot be used, and the quality and accuracy of the cutting are not uniform due to the existence. This cutting device and cutting = edge conditions affect cutting can be applied to cutting synthetic plates, such as liquid crystal age 2 / Another disadvantage is that it does not have alpha solar panel display (LCT), display (FPD), because the laser beam only — U) and the force of one thousand faces only affect the next layer of material. Finally, cross-cutting is performed by using a layer material. Not possible with every cutting method [Overview of the present invention] The main task of the present invention is to improve the brittle non-metallic material: the possibility of cutting with one or several speeds and materials at the same working speed. Enter the parent and cut and multi-layer. The solution to this task is as follows: this cut to, soil 7 ... go is characterized by laser light

Page 6 V. Description of the invention (4) The wave source of the cutting wave on the surface of the heating material to the material table; produces: m and-one or several elastic waves are concentrated in the cutting material department, in order to achieve the best results 2 The main points can be explained with the following drawings: The main contents of the laser beam and elastic wave cutting method are as follows. j 沭 叼 ~ Large brittle non-metallic materials First observe the elasticity in solids ^ The principle of cracking and sowing occurs on the road under the influence of waves and mechanical transmission occurs when elastic waves in elastic solids propagate = j is partially disturbed by force or other reasons The mutated Bagu = propagates in a certain medium, and is accompanied by the transmission of energy; its =, in a solid with a large vibration limit, there can be two types of elastic waves. j is isotropic and the other is shear wave. When longitudinal waves propagate in a solid medium. : The species is a longitudinal wave, which has alternating compression and expansion, so the longitudinal wave is also called amine diet, which often makes solid body waves or shear waves. ) When shear waves propagate in a solid ^ wave. (Also known as an abnormal shear wave or a shear wave or a rotating wave. Elastic waves have changes in volume. Group velocity and phase velocity, wavelength, vibration, and vibration cycle #Column characteristics: These characteristics should be considered when frequency cutting lines ° 4 with bullets, wave depth in order to propagate the cutting line of the elastic ramp can use the wave waveguide). For example, cylindrical or flatware (waveguide-to propagate alternating longitudinal and shear waves, the three-piece rigid waveguide with boundary strips can have any mechanical stress. The waveguide head can be equipped with a concentrator / waveguide surface Without °, you can focus the elastic wave 526111. V. Description of the invention (5) Concentrate on a certain place in the material. Heat, Γ ”and elastic medium transfer material, which is caused by internal friction and the absorption of elastic waves by the guide. The fluctuation is After absorption, the period energy becomes and pumps: ί energy. The absorption of the wave decreases its energy. The reflection of the elastic wave and the elastic wave arrive at the interface, and part of it returns to the original elastic medium. Υ: Raw reflection phenomenon ... Partially enters through the interface to enter Refraction occurs in another medium following the adjacent mud. During the laser cutting process, the thermal stress generated by the laser beam (2) on the brittle non-metal material (1) can cause under certain conditions. If you break along the 22 diameter, you need to select the corresponding parameters: laser light intensity and workpiece moving speed U. In this way, a slit appears on the surface of the material, and it is deep. (Refer to Figure 1.) During the cutting process, Can use laser The groove method X (laser scribing) is to melt and remove the local material on the surface. It can also use the thermal stress caused by laser to make the material fine slits, so as not to melt the material. The most widely used cutting (3) method recently is to brittle The surface of the non-metallic material (1) is heated with a laser beam (2), and thereafter cooled with a refrigerant (4) locally. (Figure λ 〇Λ

However, as mentioned above, these cutting methods all require light pressure (or heating) to break the material along the cutting line. This has limited the effective application of this cutting method in modern industry ', which I have already emphasized. The main feature of the invention is that the elastic wave (5) passes through the waveguide (6) and the concentrator and is concentrated in the cutting line area (3) inside the material (1), such as the laser beam (^) application area (Fig. 3). It should be noted that this cutting method does not have any mechanical effect on the surface of the material. By adjusting and cutting parameters (cutting speed and cutting

526111 Description of the invention (6)--_____ 2 =) (Second Off :: Variables (vibration and frequency) of wave selection can be pre-predicted (Figure ... slot (7) in Figure 3. Adjust these parameters to cut through the material ( l) It can also be left out. Coolant can be used when cutting or grooving. The advantage of the shoe is that the elastic wave can be worn on the cutting line. Figure 5 is a fine Cut through and cut half on the same cutting line (3), that is, there is no P. There is no cut through at the beginning and end of a cutting line (8). First, with the action of elastic waves, the remaining part of the cutting line is cut at the point of cut. Pin Yijian ', this method can be used to cut and cross, without affecting the cross method can be tested 4: Also ^ need to scribe lines at the intersection first. Second, before this beam, I / 7 cut high precision and high quality, Because of the cutting process, all the knots maintain the original size and integrity. Feng Fang Fang Mu S. Another important advantage is that it can be used to cut the angle of the surface elastic wave incident on the workpiece. In order to achieve this The effect can make the plane a bit silly And the incident angle of the laser beam and the plane perpendicular to the surface of the material are as shown in Figure 6). As a result, the cutting line is perpendicular to the material or any cutting results in an angle of $ (/ Ph 1). This method is used for circular wire cutting. The material to be cut is very good, because it is easier to use it to cut off the parts, and it can also be cut with a slight angle, so the accuracy is almost °.. This method is not only good, sticky The sheet is used to cut single-layer materials, and it can also be cut from the sheet (1 0). Figure 7 ° Figure 7 shows the sheet (1) and its glue (11) (1 0) began to spread. Knife pair. In this case, the elastic wave (5) runs from the plate and cuts to the cutting line (3) to penetrate it until it cuts through

Page 9 526111 V. Description of Invention (8) 〇 ⑺

Apparent elastic waves can also make elastic waves propagate from sheet (1). The simplest application example of this method is as follows. A wave source is generated on day (13), and the slit is deepened with a percussive wave by a mechanical waveguide (6) and a set is penetrated (refer to FIG. 8). The propagating bomb can be straight or curved. Such as the strict mechanical waveguide (6): to avoid hitting the device ⑴) click on the straight-injection material; guide shape: the waveguide (6) is a curved metal rod, which is on 3. The graph is a cone whose apex is a concentrator.

This device ensures that the concentrator and the bill of materials use pressed iron balls). This is on the surface of the material. The position of the concentrator is vertical (ρ 1 is its strength) should be minimized to I. The mechanical action of the concentrator (, it should only be ensured that the concentrator is in contact with the end surface that causes any material to deform, the force is P2, which causes the elastic surface. The percussion device hits the waveguide to concentrate on the concentrator. Concentrator and material '. Elasticity The wave propagates in the waveguide and penetrates into the material, and propagates into the 2 surface contact points, and the elastic deformation energy can be cut through (8). The mouth apex 'transverse wave causes its deepening, sometimes it is difficult or 粞

Place on the other side of the material. Under this condition, the waveguide (2) and the coolant (4) that cannot be radiated by the waveguide and the concentrator cannot be injected under the ^ j, and the concentrator (12) is used to focus the two sides of the cutting line (3) at the time of lightning (Figure 9a) Surface, the two elastic waves (5) are induced by the tensile stress produced by rapid cooling '). The coolant (4) is an auxiliary slit (3) produced by a tight elastic wave concentrator in the heating zone. Both sides of the cutting line are deepened or penetrated (cut through) by two seams (8). Use bow to raise the tensile stress to make the cut

526111 V. Description of the invention (8). Similar results can be obtained if no coolant is used. For example, the laser beam (2) can be used to heat the material (1) (Fig. 10a, b), causing a slit (3). As in the above example, the auxiliary action produced by the two elastic wave (5) concentrators (I "deepens or penetrates (cuts through) the slit. ° Sometimes, the elastic wave concentrator (12) is cut from The material (1) works on both sides at the same time. Good results can be obtained (Figure 丨 This method is most effective when cutting thick plates. — The frequency range of the elastic wave from the knife J thickness to the deepening of the seam is very wide: from several Hz 3. It can use a variety of elastic wave sources. The types of elastic wave sources can be ίΓ:,: faces can also be placed on the opposite side depending on the types of elastic wave sources and the technical characteristics of the cutting equipment. Melt = is an application example of this cutting method. Cutting The material is a thickness of 0.8. The inspection equipment includes an output power of 85 watts CO2 laser, and 2 speeds ... seconds, the beam transmission: the light intensity is 2_. The reverse side of the fused quartz plate is made of leather and touches the village material. The mechanical wave concentrator is connected at the corresponding position of the laser beam incident area. 1 vertex θ: two f: the device is a cylinder with a diameter of 5 faces, and the end of the cylinder is a cone-centered mr hemisphere. The pressure of the concentrator on the surface of the molten glass is = End face strength is p2 = 4 ° h, frequency Shoot light ^ wave. The movement speed of the fossil central work piece is 350 legs / second. T First open the fine seam 'cutting depth is 0.99 coffee, the elastic wave on the cutting 526111 V. Description of the invention (9) The effect of the line makes the cutting The seam penetrates the material. The cutting and elastic wave side effects (up to eight away) are performed at the same time, with a speed of 350 faces per second. The blade is set by the elastic wave in a very limited cutting line area, and the distance between the lines can be close 4 can be cut into square or rectangular parts, ^ 2 5x? Inch parts, or cut from the thickness of 3 mm glass to the next 4 · 3 × 5 · 5ιηπ parts. Because the cutting can be opened, the finished product (Shang Lai , Knife-through materials, do not need to carry out semi-finished products 掰 Q 7 pieces) the quality and accuracy are greatly improved.

526111 Brief description of the drawings [Simplified description of the drawings] Fig. 1 is a schematic diagram of a slit with a laser beam. Fig. 2 is a schematic view of slitting with a laser beam and a refrigerant. Figure 3 is a schematic diagram of slits with a certain depth opened by elastic waves. Figure 4 is a schematic diagram of cutting through materials with elastic waves. Figure 5 is a perspective view of the cut-through and half-cut through materials on the same cutting line, and two crossed cutting lines (cut-through). Figure 6 is a schematic diagram of angle cutting. Figure 7 is a schematic diagram of the cutting method of two bonded sheets. Figure 8 is a schematic diagram of the cutting method using a mechanical waveguide and an elastic wave concentrator. Figures 9 a to 9 b are schematic diagrams of using a laser beam and a refrigerant to slit a thin slit and splitting it with two elastic waves: a-side , B — above. Figures 10a to 10b are schematic diagrams of material fracture using the action of two elastic wave concentrators located on one side of the laser beam focusing point: a-side, b-front (section). Figures 1 1 a to 1 1 b are schematic diagrams of cutting with three elastic wave concentrators: a — side, b — front (section). Figure 12 is a schematic diagram of the use of an elastic wave concentrator. Figures 1 3 a to 1 3 b are schematic diagrams of photos in polarized light.

Claims (1)

Sixth, the scope of patent application; a method of cutting metal materials (two), the next. The sub-cutting method is characterized in that the method does not cut through the material when the wire is used, and: the laser beam heats the surface of the material. Function: 2: The wave source of the elastic wave determines the vibration and frequency of the batch wave by cutting through the material or half-cutting the material. If necessary, cut through as required by the patent application] method (2), for y = brittle non-metallic materials on. The best effect of phase elastic wave is focused on cutting =, ^ please patent scope! Method (2), cutting-4b non-metallic materials cutting fire, using cold aerosol agent locally: after cutting the line, it needs to be quenched. For example, the scope of the patent application?? ’Elastic waves are concentrated in the cooling zone. J :) ’After the cutting process is over, the effect of the elastic wave is cut. This sound must be applied to the cutting line. The cutting process can be deepened or cut through. It can also realize the effect of cutting square waves of brittle non-metallic materials as described in the items obtained in different processing steps, such as adding elastic slits to a fixed area. a. Method of piercing material or grooving to a certain depth (: Γ Lee: J f 丄 Item: The brittle non-metallic material cuts the square, that is, the elastic wave makes: the angle 'needs to be observed-the direction and verticality of the strip agent Yu: material beam and / or cooling 6 field ill 'patent application scope 78 degrees). The first cut method focuses on the first two, which cannot be used. Item 1 'In addition to the secant, a certain gap is caused (the angle is as in the Patent Application Scope Method (II), and the elastic wave is cut. At the same time, as the Patent Application Scope Method (I)', sometimes the agent is acting on one side and acting on the other side. Utilizing this method, such as the scope of patent application (a) 'Sometimes, the internally and simultaneously the brittle non-metallic feature is that the brittle non-metallic located at the laser beam or coolant is used to gather the elastic wave at the laser beam focusing point, Place them on the waveguide and the concentrator to place the brittle non-metallic concentrator to cool the elastic waves. / The material is cut at two concentrated points on both sides of the square wire. The material-cut square and / or the cooling-cut wire are in the opposite material of the material The cutting side is focused on the material Page 15