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TW376556B - Semiconductor package, and semiconductor device and their manufacture - Google Patents

Semiconductor package, and semiconductor device and their manufacture

Info

Publication number
TW376556B
TW376556B TW087106056A TW87106056A TW376556B TW 376556 B TW376556 B TW 376556B TW 087106056 A TW087106056 A TW 087106056A TW 87106056 A TW87106056 A TW 87106056A TW 376556 B TW376556 B TW 376556B
Authority
TW
Taiwan
Prior art keywords
substrate
semiconductor
opening
package
manufacture
Prior art date
Application number
TW087106056A
Other languages
English (en)
Inventor
Takaaki Sasaki
Original Assignee
Oki Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Ind Co Ltd filed Critical Oki Electric Ind Co Ltd
Application granted granted Critical
Publication of TW376556B publication Critical patent/TW376556B/zh

Links

Classifications

    • H10W74/01—
    • H10W70/635—
    • H10W70/68—
    • H10W74/129—
    • H10W76/47—
    • H10W90/701—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/29—
    • H10W72/59—
    • H10W72/865—
    • H10W72/884—
    • H10W72/9445—
    • H10W72/951—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
TW087106056A 1997-07-16 1998-04-21 Semiconductor package, and semiconductor device and their manufacture TW376556B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9190818A JPH1140694A (ja) 1997-07-16 1997-07-16 半導体パッケージおよび半導体装置とその製造方法

Publications (1)

Publication Number Publication Date
TW376556B true TW376556B (en) 1999-12-11

Family

ID=16264275

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087106056A TW376556B (en) 1997-07-16 1998-04-21 Semiconductor package, and semiconductor device and their manufacture

Country Status (4)

Country Link
US (3) US6175159B1 (zh)
JP (1) JPH1140694A (zh)
KR (1) KR100368698B1 (zh)
TW (1) TW376556B (zh)

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JPH1140694A (ja) 1997-07-16 1999-02-12 Oki Electric Ind Co Ltd 半導体パッケージおよび半導体装置とその製造方法
JP2000156435A (ja) 1998-06-22 2000-06-06 Fujitsu Ltd 半導体装置及びその製造方法
JP3420706B2 (ja) * 1998-09-22 2003-06-30 株式会社東芝 半導体装置、半導体装置の製造方法、回路基板、回路基板の製造方法
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KR100319624B1 (ko) * 1999-05-20 2002-01-09 김영환 반도체 칩 패키지 및 그 제조방법
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DE10127010B4 (de) * 2001-06-05 2009-01-22 Infineon Technologies Ag Elektronisches Bauteil mit einem Halbleiterchip auf einem spannungsreduzierten Substrat
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US7462936B2 (en) * 2003-10-06 2008-12-09 Tessera, Inc. Formation of circuitry with modification of feature height
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US7833456B2 (en) * 2007-02-23 2010-11-16 Micron Technology, Inc. Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece
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KR101493701B1 (ko) 2008-09-18 2015-02-16 삼성전자주식회사 패키지 기판, 패키지 기판을 갖는 반도체 패키지, 및 반도체 패키지의 제조 방법
US8384228B1 (en) * 2009-04-29 2013-02-26 Triquint Semiconductor, Inc. Package including wires contacting lead frame edge
KR101078741B1 (ko) * 2009-12-31 2011-11-02 주식회사 하이닉스반도체 반도체 패키지 및 이를 갖는 적층 반도체 패키지
US8330272B2 (en) 2010-07-08 2012-12-11 Tessera, Inc. Microelectronic packages with dual or multiple-etched flip-chip connectors
US8580607B2 (en) 2010-07-27 2013-11-12 Tessera, Inc. Microelectronic packages with nanoparticle joining
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CN107002697B (zh) 2014-09-30 2020-03-27 安捷灯饰风扇公司 具有照明效果的吊扇和加热器的组合
CN107851940B (zh) 2015-05-12 2020-08-04 拉恩·罗兰·科恩 用于电气装置的智能快速连接设备
US9633971B2 (en) 2015-07-10 2017-04-25 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
US10886250B2 (en) 2015-07-10 2021-01-05 Invensas Corporation Structures and methods for low temperature bonding using nanoparticles
TWI822659B (zh) 2016-10-27 2023-11-21 美商艾德亞半導體科技有限責任公司 用於低溫接合的結構和方法
US10989400B2 (en) 2017-03-05 2021-04-27 Ran Roland Kohen Modular smart quick connect device for electrical fixtures
JP7332476B2 (ja) 2017-03-10 2023-08-23 スカイエックス プラットフォームズ コーポレーション 埋め込み式電気器具のためのクイック接続装置
US10826236B2 (en) 2017-04-17 2020-11-03 Ran Roland Kohen Disconnecting and supporting quick release electrical fixtures
US10845046B2 (en) 2017-05-01 2020-11-24 Ran Roland Kohen Connecting lighting to poles without tools
BR112021016361A2 (pt) 2019-02-20 2021-11-23 Roland Kohen Ran Dispositivo de conexão rápida com liberação transversa
CN110335850B (zh) * 2019-04-15 2021-02-02 中国科学院半导体研究所 一种光电芯片的封装结构
BR112022017091A2 (pt) 2020-02-28 2023-02-14 Skyx Platforms Corp Embutindo dispositivos inteligentes de conexão rápida
KR20230126736A (ko) 2020-12-30 2023-08-30 아데이아 세미컨덕터 본딩 테크놀로지스 인코포레이티드 전도성 특징부를 갖는 구조 및 그 형성방법
KR20230141792A (ko) 2021-01-07 2023-10-10 에스케이와이엑스 플랫폼 코포레이션 와이어 커버를 구비한 신속 접속 장치

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Also Published As

Publication number Publication date
KR100368698B1 (ko) 2003-04-08
KR19990013820A (ko) 1999-02-25
US20100140787A1 (en) 2010-06-10
US6175159B1 (en) 2001-01-16
US20080230924A1 (en) 2008-09-25
JPH1140694A (ja) 1999-02-12
US7663251B2 (en) 2010-02-16
US8018076B2 (en) 2011-09-13

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees