[go: up one dir, main page]

TW350863B - Liquid, radiation-curable composition, especially for stereolithography - Google Patents

Liquid, radiation-curable composition, especially for stereolithography

Info

Publication number
TW350863B
TW350863B TW086110701A TW86110701A TW350863B TW 350863 B TW350863 B TW 350863B TW 086110701 A TW086110701 A TW 086110701A TW 86110701 A TW86110701 A TW 86110701A TW 350863 B TW350863 B TW 350863B
Authority
TW
Taiwan
Prior art keywords
weight
methyl
formula
liquid
hydrogen atom
Prior art date
Application number
TW086110701A
Other languages
English (en)
Inventor
Bettina Steinmann
Aderian Schulthess
Original Assignee
Cida Specialty Chemicals Holding Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25688916&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW350863(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Cida Specialty Chemicals Holding Inc filed Critical Cida Specialty Chemicals Holding Inc
Application granted granted Critical
Publication of TW350863B publication Critical patent/TW350863B/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00Materials specially adapted for additive manufacturing
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/022Polycondensates containing more than one epoxy group per molecule characterised by the preparation process or apparatus used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • C08G59/621Phenols
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037Production of three-dimensional images
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Epoxy Resins (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Paints Or Removers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW086110701A 1996-07-29 1997-07-28 Liquid, radiation-curable composition, especially for stereolithography TW350863B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH188596 1996-07-29
CH220196 1996-09-05

Publications (1)

Publication Number Publication Date
TW350863B true TW350863B (en) 1999-01-21

Family

ID=25688916

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086110701A TW350863B (en) 1996-07-29 1997-07-28 Liquid, radiation-curable composition, especially for stereolithography

Country Status (10)

Country Link
US (1) US5972563A (zh)
EP (1) EP0822445B2 (zh)
JP (1) JP3564650B2 (zh)
KR (1) KR100491736B1 (zh)
AT (1) ATE191090T1 (zh)
AU (1) AU716984B2 (zh)
CA (1) CA2211628C (zh)
DE (1) DE59701299D1 (zh)
ES (1) ES2144836T3 (zh)
TW (1) TW350863B (zh)

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6287745B1 (en) 1998-02-18 2001-09-11 Dsm N.V. Photocurable liquid resin composition comprising an epoxy-branched alicyclic compound
US6136497A (en) * 1998-03-30 2000-10-24 Vantico, Inc. Liquid, radiation-curable composition, especially for producing flexible cured articles by stereolithography
US6100007A (en) * 1998-04-06 2000-08-08 Ciba Specialty Chemicals Corp. Liquid radiation-curable composition especially for producing cured articles by stereolithography having high heat deflection temperatures
US6287748B1 (en) 1998-07-10 2001-09-11 Dsm N.V. Solid imaging compositions for preparing polyethylene-like articles
US6762002B2 (en) 1998-07-10 2004-07-13 Dsm Desotech, Inc. Solid imaging compositions for preparing polypropylene-like articles
US6379866B2 (en) * 2000-03-31 2002-04-30 Dsm Desotech Inc Solid imaging compositions for preparing polypropylene-like articles
US20060154175A9 (en) * 1998-07-10 2006-07-13 Lawton John A Solid imaging compositions for preparing polypropylene-like articles
ES2345031T3 (es) * 2000-02-08 2010-09-14 Huntsman Advanced Materials (Switzerland) Gmbh Composicion liquida curable por radiacion, especialmente para estereolitografia.
JP4837187B2 (ja) * 2001-06-06 2011-12-14 株式会社クラレ 活性エネルギー線硬化性樹脂組成物
US6811937B2 (en) * 2001-06-21 2004-11-02 Dsm Desotech, Inc. Radiation-curable resin composition and rapid prototyping process using the same
US20030149124A1 (en) * 2001-11-27 2003-08-07 Thommes Glen A. Radiation curable resin composition for making colored three dimensional objects
US20030198824A1 (en) * 2002-04-19 2003-10-23 Fong John W. Photocurable compositions containing reactive polysiloxane particles
CN100576069C (zh) * 2002-05-03 2009-12-30 Dsm;Ip财产有限公司 可辐射固化树脂组合物及利用该组合物的快速成型方法
GB0212977D0 (en) * 2002-06-06 2002-07-17 Vantico Ag Actinic radiation curable compositions and their use
US20040054025A1 (en) * 2002-06-20 2004-03-18 Lawton John A. Compositions comprising a benzophenone photoinitiator
US6989225B2 (en) * 2002-07-18 2006-01-24 3D Systems, Inc. Stereolithographic resins with high temperature and high impact resistance
US6833231B2 (en) * 2002-07-31 2004-12-21 3D Systems, Inc. Toughened stereolithographic resin compositions
US20040077745A1 (en) * 2002-10-18 2004-04-22 Jigeng Xu Curable compositions and rapid prototyping process using the same
US20040087687A1 (en) * 2002-10-30 2004-05-06 Vantico A&T Us Inc. Photocurable compositions with phosphite viscosity stabilizers
US20040137368A1 (en) * 2003-01-13 2004-07-15 3D Systems, Inc. Stereolithographic resins containing selected oxetane compounds
US20040170923A1 (en) * 2003-02-27 2004-09-02 3D Systems, Inc. Colored stereolithographic resins
US6856283B2 (en) * 2003-02-28 2005-02-15 Raytheon Company Method and apparatus for a power system for phased-array radar
DE10328302A1 (de) * 2003-06-23 2005-01-27 Dreve Otoplastik Gmbh Niedrigviskose, strahlungshärtbare Formulierung, insbesondere für die Stereolithographie, zum Einsatz in der Medizintechnik, insbesondere zur Herstellung von Ohrstücken
US20050040562A1 (en) * 2003-08-19 2005-02-24 3D Systems Inc. Nanoparticle-filled stereolithographic resins
US7244793B2 (en) * 2003-09-26 2007-07-17 Illinois Tool Works Inc. Adhesive compositions
US7232850B2 (en) * 2003-10-03 2007-06-19 Huntsman Advanced Materials Americas Inc. Photocurable compositions for articles having stable tensile properties
US20070149667A1 (en) * 2003-10-16 2007-06-28 Dsm Ip Assets B.V. Curable compositions and rapid prototyping process using the same
US20050101684A1 (en) * 2003-11-06 2005-05-12 Xiaorong You Curable compositions and rapid prototyping process using the same
US20050165127A1 (en) * 2003-12-31 2005-07-28 Dsm Desotech, Inc. Solid imaging compositions for preparing polyethylene-like articles
GB0413366D0 (en) 2004-06-15 2004-07-21 Heeschen Andreas Binder-free photopolymerizable compositions
DE102004030019A1 (de) * 2004-06-22 2006-01-19 Xetos Ag Photopolymerisierbare Zusammensetzung
US20060078638A1 (en) * 2004-10-08 2006-04-13 3D Systems, Inc. Stereolithographic apparatus
JP4753601B2 (ja) * 2005-03-23 2011-08-24 旭化成イーマテリアルズ株式会社 感光性組成物
JP5306814B2 (ja) * 2005-09-13 2013-10-02 スリーディー システムズ インコーポレーテッド Abs類似物品製造を目的とした光硬化性組成物
US20070075461A1 (en) * 2005-09-30 2007-04-05 3D Systems, Inc. Rapid prototyping and manufacturing system and method
US7690909B2 (en) * 2005-09-30 2010-04-06 3D Systems, Inc. Rapid prototyping and manufacturing system and method
US7585450B2 (en) * 2005-09-30 2009-09-08 3D Systems, Inc. Rapid prototyping and manufacturing system and method
US20070077323A1 (en) * 2005-09-30 2007-04-05 3D Systems, Inc. Rapid prototyping and manufacturing system and method
US7520740B2 (en) * 2005-09-30 2009-04-21 3D Systems, Inc. Rapid prototyping and manufacturing system and method
US7621733B2 (en) * 2005-09-30 2009-11-24 3D Systems, Inc. Rapid prototyping and manufacturing system and method
US20070092733A1 (en) * 2005-10-26 2007-04-26 3M Innovative Properties Company Concurrently curable hybrid adhesive composition
JP5084461B2 (ja) * 2007-11-16 2012-11-28 東邦化学工業株式会社 光重合性不飽和化合物
EP2215525B1 (en) * 2007-11-27 2018-01-10 3D Systems Incorporated Photocurable resin composition for producing three dimensional articles having high clarity
US20110135561A1 (en) * 2008-07-31 2011-06-09 Sony Corporation Adsorbent, cleansing agent, renal disease drug, and functional food
US20100190881A1 (en) 2009-01-28 2010-07-29 3D Systems, Incorporated Radiation Curable Compositions Useful in Solid Freeform Fabrication Systems
CN102272227B (zh) 2009-03-13 2014-03-12 帝斯曼知识产权资产管理有限公司 可辐射固化树脂组合物以及使用这种组合物的快速三维成像方法
CN102665402B (zh) * 2009-12-22 2014-09-10 亨斯迈石油化学有限责任公司 含有柔性片段和刚性片段的醚胺及其作为用于聚合物合成的中间体的用途
JP5680108B2 (ja) 2009-12-22 2015-03-04 ハンツマン ペトロケミカル エルエルシーHuntsman Petrochemical LLC エーテルアミンおよびそれらを重合体合成時に中間体として用いる使用
KR20170091788A (ko) 2009-12-23 2017-08-09 메르크 파텐트 게엠베하 중합체성 결합제를 포함하는 조성물
EP2468789A1 (de) 2010-12-24 2012-06-27 Sika Technology AG Klebstoff für Rotorblätter für Windkraftanlagen
EP2814802B1 (en) 2012-02-17 2020-12-16 Huntsman Advanced Materials Americas LLC Mixture of benzoxazine, epoxy and anhydride
AR098050A1 (es) 2013-10-18 2016-04-27 Huntsman Petrochemical Llc Eteraminas con mayor estabilidad térmica y su uso como curativos o intermediarios para la síntesis de polímeros
JP6056032B2 (ja) 2013-11-05 2017-01-11 ディーエスエム アイピー アセッツ ビー.ブイ. 付加造形用の安定化マトリックス充填液状放射線硬化性樹脂組成物
US10513578B2 (en) 2013-11-05 2019-12-24 Huntsman Petrochemical Llc Etheramines and their use as curatives or intermediates for polymer synthesis
US10414855B2 (en) 2014-05-14 2019-09-17 Huntsman Advanced Materials Americas Llc Multifunctional polyamides for protective coatings
CN114734628A (zh) 2014-06-23 2022-07-12 卡本有限公司 由具有多重硬化机制的材料制备三维物体的方法
MX2017015276A (es) 2016-01-12 2018-02-19 Huntsman Petrochemical Llc Preparacion simultanea de polieteraminas y alquilenaminas.
US20190153226A1 (en) 2016-04-08 2019-05-23 Solvay Specialty Polymers Usa, Llc Photocurable polymers, photocurable polymer compositions and lithographic processes including the same
US11198756B2 (en) 2016-06-16 2021-12-14 Huntsman Petrochemical Llc Blend for curing epoxy resin composistions
US11650498B2 (en) 2016-06-30 2023-05-16 3M Innovative Properties Company Printable compositions including highly viscous components and methods of creating 3D articles therefrom
AU2017312122A1 (en) 2016-08-19 2019-02-28 Huntsman Advanced Materials Americas Llc Adducts and uses thereof
US11542364B2 (en) 2017-02-06 2023-01-03 Huntsman Petrochemical Llc Curing agent for epoxy resins
ES2945162T3 (es) 2017-02-06 2023-06-28 Huntsman Petrochemical Llc Agente de curado para resinas epoxi
ES2685280B2 (es) 2017-03-31 2019-06-21 Centro Tecnologico De Nanomateriales Avanzados S L Composición de resina curable por radiación y procedimiento para su obtención
US10316213B1 (en) 2017-05-01 2019-06-11 Formlabs, Inc. Dual-cure resins and related methods
EP3758916A4 (en) * 2018-03-02 2021-10-27 Formlabs, Inc. LATENT CURING RESINS AND RELATED PROCESSES
CN108822122A (zh) * 2018-08-23 2018-11-16 广州康瑞泰药业有限公司 一种高效制备4,4-二甲基-3,5,8-三氧杂双环[5,1,0]辛烷的方法
KR102780988B1 (ko) 2020-02-04 2025-03-17 캐보트 코포레이션 액체-기반 적층 제조를 위한 조성물
EP3909747A1 (en) 2020-05-12 2021-11-17 TIGER Coatings GmbH & Co. KG Thermosetting material for use in a 3d printing process
BR112023017181A2 (pt) 2021-02-25 2023-09-26 Huntsman Adv Mat Licensing Switzerland Gmbh Composição polimerizável monocomponente para impregnação por gotejamento
EP4094942A1 (en) 2021-05-26 2022-11-30 TIGER Coatings GmbH & Co. KG Radiation curable composition for additive manufacturing suitable for electronic applications

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3708296A (en) * 1968-08-20 1973-01-02 American Can Co Photopolymerization of epoxy monomers
US4091223A (en) * 1976-08-04 1978-05-23 Ciba-Geigy Corporation Unsaturated hydantoin coagents
US4156035A (en) * 1978-05-09 1979-05-22 W. R. Grace & Co. Photocurable epoxy-acrylate compositions
US4339567A (en) * 1980-03-07 1982-07-13 Ciba-Geigy Corporation Photopolymerization by means of sulphoxonium salts
US4383025A (en) * 1980-07-10 1983-05-10 Ciba-Geigy Corporation Photopolymerization by means of sulfoxonium salts
US4398014A (en) * 1980-11-04 1983-08-09 Ciba-Geigy Corporation Sulfoxonium salts and their use as polymerization catalysts
EP0094914B1 (de) * 1982-05-19 1986-09-24 Ciba-Geigy Ag Photopolymerisation mittels organometallischer Salze
DE3369398D1 (en) * 1982-05-19 1987-02-26 Ciba Geigy Ag Curable compositions containing metallocen complexes, activated primers obtained therefrom and their use
US4874798A (en) * 1983-02-07 1989-10-17 Union Carbide Corporation Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials and substituted cycloaliphatic monoepoxide reactive diluents
US4818776A (en) * 1983-02-07 1989-04-04 Union Carbide Corporation Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials having primary hydroxyl content
US4599401A (en) * 1983-10-27 1986-07-08 Union Carbide Corporation Low viscosity adducts of poly(active hydrogen) organic compounds and a polyepoxide
EP0153904B1 (de) * 1984-02-10 1988-09-14 Ciba-Geigy Ag Verfahren zur Herstellung einer Schutzschicht oder einer Reliefabbildung
GB8414525D0 (en) * 1984-06-07 1984-07-11 Ciba Geigy Ag Sulphoxonium salts
US4694029A (en) * 1985-04-09 1987-09-15 Cook Paint And Varnish Company Hybrid photocure system
US4772530A (en) * 1986-05-06 1988-09-20 The Mead Corporation Photosensitive materials containing ionic dye compounds as initiators
EP0223587B1 (en) * 1985-11-20 1991-02-13 The Mead Corporation Photosensitive materials containing ionic dye compounds as initiators
US4772541A (en) * 1985-11-20 1988-09-20 The Mead Corporation Photohardenable compositions containing a dye borate complex and photosensitive materials employing the same
US4751102A (en) * 1987-07-27 1988-06-14 The Mead Corporation Radiation-curable ink and coating compositions containing ionic dye compounds as initiators
JPH01110507A (ja) * 1987-10-22 1989-04-27 Sunstar Giken Kk 光硬化性組成物
JP2632961B2 (ja) * 1988-09-13 1997-07-23 旭電化工業株式会社 樹脂の光学的造形方法
JPH07103218B2 (ja) * 1988-09-13 1995-11-08 旭電化工業株式会社 光学的造形用樹脂組成物
JP2612484B2 (ja) * 1988-11-18 1997-05-21 ディーエスエム・エヌヴィ 光学的立体造形用樹脂組成物
JP3197907B2 (ja) * 1991-02-15 2001-08-13 旭電化工業株式会社 エネルギー線を用いた注型成型方法
JP2873126B2 (ja) * 1991-04-17 1999-03-24 日本ペイント株式会社 体積ホログラム記録用感光性組成物
TW269017B (zh) * 1992-12-21 1996-01-21 Ciba Geigy Ag
TW259797B (zh) * 1992-12-23 1995-10-11 Ciba Geigy
JPH07128856A (ja) * 1993-04-30 1995-05-19 Japan Synthetic Rubber Co Ltd 感光性樹脂組成物および感光性樹脂レジスト
EP0646580B1 (de) * 1993-09-16 2000-05-31 Ciba SC Holding AG Vinyletherverbindungen mit zusätzlichen von Vinylethergruppen verschiedenen funktionellen Gruppen und deren Verwendung zur Formulierung härtbarer Zusammensetzungen
US5707780A (en) * 1995-06-07 1998-01-13 E. I. Du Pont De Nemours And Company Photohardenable epoxy composition
US5665792A (en) * 1995-06-07 1997-09-09 E. I. Du Pont De Nemours And Company Stabilizers for use with photoacid precursor formulations
JPH09268205A (ja) * 1996-03-29 1997-10-14 Asahi Denka Kogyo Kk 光学的立体造形用樹脂組成物および光学的立体造形法

Also Published As

Publication number Publication date
AU716984B2 (en) 2000-03-16
AU3157997A (en) 1998-02-05
CA2211628A1 (en) 1998-01-29
ATE191090T1 (de) 2000-04-15
EP0822445A1 (de) 1998-02-04
KR980009381A (ko) 1998-04-30
US5972563A (en) 1999-10-26
JPH1087791A (ja) 1998-04-07
JP3564650B2 (ja) 2004-09-15
EP0822445B1 (de) 2000-03-22
DE59701299D1 (de) 2000-04-27
KR100491736B1 (ko) 2005-09-09
EP0822445B2 (de) 2005-02-09
CA2211628C (en) 2007-03-13
ES2144836T3 (es) 2000-06-16

Similar Documents

Publication Publication Date Title
TW350863B (en) Liquid, radiation-curable composition, especially for stereolithography
NO20044847L (no) Epoxy modifisert organpolysiloxan resin basert sammensetninger anvendbare som beskyttende belegg
TW354328B (en) Epoxy resin composition comprising a bipohenol-type epoxy resin and a polyhydric phenol resin curing agent, process for the preparation of said composition and articles comprising said composition
EP0370464A3 (en) Curable resin composition
AU4773997A (en) No-compounds for pseudo-living radical polymerization
DE59914754D1 (de) Verwendung von dispersionen silylterminierter polymerer als dichtmassen
JPS5610529A (en) Curable resin composition
AU2001269905A1 (en) Novel photoinitiators and applications therefor
KR970021135A (ko) 폴리알콕시실록산 및 그의 제조 방법
EP0921417A3 (en) Epoxy/episulfide resin compositions for optical materials
JPH039954A (ja) (メタ)アクリロキシアルケニレン官能性プレポリマーの架橋
JPH06256568A (ja) 水硬化性樹脂組成物
IL114504A0 (en) Photoactive benzene monomers and preparation polymers and photoresist compositions thereof
DE60005364D1 (de) Zusammensetzung von Kabelfüllmassen
CN108314912A (zh) 一种uvled光固化组合物及其在地坪涂料中的应用
WO2019214121A1 (zh) 聚丙烯酸酯类大分子光引发剂及其合成方法与应用
GB2079297A (en) Dental filling material
EP1640392A4 (en) HARDENING COMPOSITION WITH FORM SEPARABILITY
RU2213748C2 (ru) Композиция для перегородки тонкой индикаторной панели
EP0795765A3 (en) Photopolymerizable composition and transparent cured product thereof
TW353674B (en) Prereacted surfactant composition and water borne curing agent composition for self-curing epoxy resins at ambient or sub-ambient temperatures, comprising said surfactant composition
US5408026A (en) Curable and cured organosilicon compositions, and process for making same
JPS5531874A (en) Curable composition
JPS5534228A (en) Polysiloxane composition
KR950014169A (ko) 폴리아미노폴리아미드

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent