TW312826B

TW312826B - Contact carriers (tiles) for populating larger substrates with spring contacts

Info

Publication number: TW312826B
Application number: TW85114230A
Authority: TW
Inventors: Y Khandros Igor; N Eldridge Benjamin; L Mathieu Gaetan; H Dozier Thomas; D Smith William
Original assignee: Formfactor Inc
Priority date: 1996-02-21
Filing date: 1996-11-20
Publication date: 1997-08-11

Abstract

A plurality of contact elements, such as contact bumps or free-standing spring contacts including both monolithic and composite interconnection elements, are mounted to relatively small tile substrates which, in turn, are mounted and connected to a relatively large electronic component substrate, thereby populating the electronic component with a plurality of contact elements while avoiding the necessity of yielding the contact elements directly upon the electronic component. The relatively large electronic component is suitably a space transformer component of a probe card assembly. In this manner, pressure connections can be made to an entire semiconductor wafer, at once, to provide for wafer-level burn-in, and the like. Solder balls, z-axis conductive adhesive, or compliant connections are suitably employed for making electrical connections between the tile substrates and the electronic component. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the tiles can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described. Techniques for maintaining a prescribed x-y and z-axis alignment of the tiles to the relatively large substrate are disclosed.

Description

更正日期：100年8月12日六、申請專利麵 14·根據中請專利範圍帛1項之方法，其特徵在於：該具有究塊基材經裝载至其上之大基材，係被裝載至探測插件，並藉插入物連接至探測插件。 -種探測插件組裝’其包括一個探測插件及多個探測元件，其特徵在於：一個空間變換器基材，其具有頂部表面、底部表面、第一組多個末端經配置在頂部表面上及第二組多個末端經配置在底部表面上；至少兩個瓷塊基材，各具有頂部表面、底部表面；用以在瓷塊基材與空間變換器基材之間達成電連接之裝置；及多個探測元件經配置在瓷塊基材之頂部表面上。 16·根據申請專利範圍第15項之探測插件組裝其特徵在於： ^ 該探測元件為自由站立彈簧接點。 17. 根據申請專利範圍第16項之探測插件組裝，其特徵在於： '、尖端結構係經裝載至多個自由站立彈簧接點之末端。 18. 根據申請專利範圍第16項之探測插件組裝，盆 312826 更正曰期·· 100年8月12曰六、申請專利範圍特徵在於：該自由站立彈簧接點為複合互連元件。Date of correction: August 12, 100 6. The patent application surface 14. According to the method of claim 1 in the patent application, it is characterized by: the large substrate with the research block substrate loaded on it is Loaded into the probe card and connected to the probe card by the insert. -A kind of probe plug-in assembly, which includes a probe plug-in and a plurality of probe elements, characterized by: a space transformer base material, which has a top surface, a bottom surface, a first set of multiple ends arranged on the top surface and Two sets of multiple ends are arranged on the bottom surface; at least two ceramic block substrates, each having a top surface and a bottom surface; a device for achieving an electrical connection between the ceramic block substrate and the space transformer substrate; and A plurality of detection elements are arranged on the top surface of the ceramic block substrate. 16. The probe card assembly according to item 15 of the patent application is characterized by: ^ The probe element is a free-standing spring contact. 17. The probe card assembly according to item 16 of the patent application scope is characterized by: ', the tip structure is loaded to the end of a plurality of free standing spring contacts. 18. According to the assembly of the probe plug-in in the 16th range of the patent application, the correction date of the basin 312826 is August 12, 100. Sixth, the scope of the patent application is characterized by: the free standing spring contact is a composite interconnection element.