311270 at B7 五、發明説明（1 ) 發明背景 本發明係關於一種製造樹脂封裝之半導體裝置之方法 。更特別而言，本發明係關於將環氧樹脂化合物注入注射 成型模中以製造樹脂封裝半導體裝置之方法，其中半導體 已鍵結和接線結合之引線框乃固定的設置當成插入物在一 注射成型模中，並在該注射成型模中硬化該環氧樹脂化合 物。 相關技藝之說明 在例如I C和LS I之半導體裝置之封裝中，現今已 廣泛的使用利用環氧樹脂模製化合物之轉換模製方法，因 爲其成本低，可靠度高，且生產效率高。一般而言，在轉 換模製中，環氧樹脂模製化合物形成一片形，而此片在模 中充填成一壺，而此片*當在模中由熱熔化時，由一柱塞 加壓，因此，熔融模製化合物可流動而後硬化。 經濟部中央標準局員工消费合作社印製 (請先閲讀背面之注意事項再填寫本頁) 但是，以此模製方法，首先必需將環氧樹脂模製化合 物形成所需之構造（亦即，片形），且因此需要成形步驟 。依照半導體裝置之尺寸和形狀，片的形狀會廣泛的改變 ，因此需要許多的模製裝置以形成環氧樹脂模製化合物。 由於每個模製操作皆需要以熱充能片和熔融片，模製循環 之時間段無法降低至預定時間段，如此會限制了成本的降 低和生產率。再者，雜質可能會在預先處理步驟中（例如 成形步驟）導入模製化合物中·在轉換模製中，在模製化 合物充能成壺之流道中，殘留物流至模空腔，且在壺中完 本紙張尺度適用中國國家橾準（CNS ) A4規格（210X297公釐） 4 經濟部中央標準局男工消費合作社印製 A7 B7 五、發明説明（2 ) 全硬化，因此它們無法再使用。如此導致之問題爲會浪費 非使用以形成半導體構裝之大量樹脂。 另一方面，迄今已研究使用熱固樹脂模製化合物（例 如環氧樹脂）之注射成型方法。在此注射成型中，以粉末 或顆粒型式存在之環氧樹脂模製化合物供應至注射成型機 器中，並在一氣缸中保持熔融，且以一螺棒注入一模中。 因此，並不需要將環氧樹脂模製化合物形成一片之步驟， 此外，亦可連續的產生。因此可省略用於成形目的之裝置 和用於成形之時間。再者，由於在熔融狀態中之模製材料 比在轉換模製中短，因此，此方法適於大量生產。 但是，以環氧樹脂模製化合物之封裝之注射成型尙未 實際使用。其原因是，習知環氧樹脂模製化合物之熔融狀 態在氣缸中加熱至7 0°C - 1 1 0°C，當在模製化合物中 之樹脂硬化反應進行時，模製化合物之黏度增加。結果， 其流動性喪失5 - 1 0分鐘，且熔融模製化合物之熱穩定 性極低。因此，不可能在低壓中進行注射成型，也因此， 不需要高壓注射。結果，在半導體裝置上之結合接線會形 變或切斷，因此，會顯著的降低所產生半導體封裝之可靠 度。 習知技藝之另一問題爲，當中斷模製操作一段預定時 間後，（例如爲了清潔該模），環氧樹脂模製化合物會在 氣缸中硬化，因此無法再注射，也因此會逆向的影響連續 的生產。 本紙乐尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ----------1-----1------訂 l·-----線 - -(請先閱讀背面之注意事項再填寫本頁) A7 311270 B7 五、發明説明（3 ) 發明概要 本發明之目的乃在提供一種藉由注射成型使用環氧樹 脂化合物之半導體裝置封裝之製造方法，藉此，可有效的 執行長時間連續模製和大量生產· 因此，依照本發明之一觀點，本發明提供一種製造環 氧樹脂封裝之半導體裝置的方法，其將環氧樹脂模製化合 物注入注射成型模中，其中由半導體所鍵結和接線結合之 引線框固定的設置當成在注射成型模中之插入物，和使環 氧樹脂模製化合物在該注射成型膜中硬化，該方法包含之 步驟爲： 將環氧樹脂模製化合物注入該注射成型模中； 逐漸的增加注射成型機器之注射壓力，以使當欲注入 之環氧樹脂模製化合物之總量之8 0%至9 5%注入注射 成型模時，可達成30kg/cm2至300kg/cm2 之最大壓力；和 以2 0 k g/cm2至1 〇 〇 k g/cm2之注射壓力 注入剩餘的環氧樹脂模製化合物。 依照本發明之另一觀點，本發明提供一種製造環氧樹 脂封裝之半導體裝置之方法，其藉由一注射成型機器使環 氧樹脂模製化合物注入注射成型模中，其中安裝且接線結 合半導體元件之一引線框乃固定設定當成一插入物，該注 射成型機器包括提供在一端之一氣缸，該氣缸具有一漏斗 ，而環氧樹脂可經由該漏斗供應至該注射成型機器，和另 一端具有一噴嘴，該氣缸軸向的分割成多數部份，其中每 -----r--=1!嚷------訂------^線 - ί (请先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 本紙張尺度通用中國國家標準（CNS ) A4規格（210X297公釐） 6 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（4 ) 一部分之溫度受到獨立的控制，和最靠近該噴嘴之部份保 持在6 5 °C — 1 1 0°C，而最靠近漏斗之部份保持在室溫 —5 0 0C。 在本發明中使用之環氧樹脂模製化合物通常包含一環 氧樹脂，一硬化劑，一硬化加速劑和一無機過濾劑，當成 其主要元件。其逋常爲粉末或顆粒型式。當在轉換模製中 ，其無需形成一片。環氧樹脂模製化合物最好能在注射成 型機器之氣缸中展現良好的熱穩定性，和在空腔中良好的 流動性，且可迅速的硬化。有鑒於上述之說明，環氧樹脂 可爲具有低熔融黏性者，如酚醛清漆環氧樹脂和雙酚樹脂 ，且特別具有5 0°C — 8 0°C之軟化點。關於硬化劑方面 ，可使用例如酚醛清漆酚樹脂，伸對二甲苯基改質酚樹脂 和二環戊二烯改質酚樹脂等酚系樹脂，且特別爲具有6 0 —1 2 0°C之軟化點且含有單山核桃驗（monocaryon)和 低雙山核桃鹸（di car yon)內容之酚系樹脂。關於硬化加 速劑方面，可使用例如二氮雜二環十一碳烯（D B L )或 例如三苯膦之有機膦，且硬化加速劑最好爲在低溫時具有 展現低活性之高潛伏狀態。 在本發明中，可使用無澆道模製或無澆道流道模製。 更特別而言，模之澆道部份之溫度或澆道部份和流道部份 之溫度乃控制在模製化合物難以硬化之溫度，亦即，大致 等於在氣缸內之溫度。藉此，在模製產品（亦即，樹脂封 裝半導體裝置）移去或取出後之次一步驟上，殘留在殘道 部份或澆道流道部份之未硬化樹脂化合物可填入空腔中， 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -----r---1 1^------.^1------^ (請先閱讀背面之注意事項再填寫本頁) -7 - 311270 經濟部中央榡準局員工消費合作社印製 A7 B7 五、發明説明（5 ) 藉以作用該模製。因此，無法形成非模製產品之任何模製 化合物，且因此，可達成顯著降低樹脂之浪費。 在以一般轉換模製之封裝中，在流道部份中硬化樹脂 廢物和整個模製化合物之比例爲4 0%〜6 0%，但是在 以本發明之注射成型之封裝中，硬化樹脂廢物之比例些微 的降低至3 0% — 5 0%，且在無澆道模製中，此種比例 可更降低至2 5%〜3 5%，而在無澆道流道模製中，此 比例更降低至1 0 %〜3 0 %。 本發明之上述目的，構造和效果可由下述之說明更加 明顯》 圖式簡單說明 圖1爲介於注射成型機器之注射壓力和注射時間之關 係以及介於注射壓力和注射螺桿之位置間之關係圖： 圖2爲注射成型機器之加熱氣缸之分割區域之圖； 圖3爲在一箍模製中，一封閉模和其相關零件之橫截 面圖： 圖4爲沿圖3之線I V - I V所截取之橫截面圖； 圖5爲模之橫截面圖，其中顯示模製產品噴出和釋放 之情形； 圖6爲模之橫截面面圖，其中顯示引線框之轉換； 圖7爲在一模中，流道，澆口，和空腔之安排之擴大 平面圖，並顯示剛好在模製化合物填入空腔後之情形； 圖8爲沿圖7之線VI I I - VI I I所採取之橫截 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） . f I I n I I n I ^ t— - If - ~ (請先閱讀背面之注意事項再填寫本頁) 8 A7 311270 __ B7 五、發明説明丨6 ) 面圖；' 圖9爲旋轉注射成型機器之示意平面圓； (請先閱讀背面之注意事項男填寫本頁) 圖1 0爲旋轉注射成型機器之示意側視圖；和 圖1 1爲模製裝置之下模之平面圖，其中顯示設定在 模裝置中之引線框之情形，和一模製化合物充填在模製裝 置之空腔中之情形。 較佳實施例之說明 在本發明中使用之注射成型機器並不限於一特殊之型 式，亦即可使用任合適合的注射成型機器，如螺桿線上型 ，柱塞型，和一螺桿柱塞型：但是，爲了輕易的控制和均 勻的熔融，最好使用螺桿線上型》 經濟部中央標準局貝工消费合作社印製 本發明之一實施例之特徵在於注射成型機器之注射壓 力在環氧樹脂模製化合物之全部注射量之8 0% - 9 5% 注入模中時，增加至最大壓力，其介於3 0 k g/cm2 和3 0 0 k g/c m 2之間。剩餘的模製化合物以2 0 k g/cm2至1 0 0 k g/cm2之注射壓力注入。在此 例中，後者之壓力對前者最大壓力之比例最好爲1/4至 1 / 2。如果兩壓力分別高於上述值時，在半導體裝置上 之結合接線可能會形變成切斷》相反的，如果兩壓力分別 低於上述值時，則模製化合物無法適當的填入模空腔中。 較佳的，最大注射壓力在1 0 0 k g/cm2— 2 5 0 k g/cm2之範圍內，且後者的壓力在40kg/cm2 一 1 20kg/cm2之範圍內。和一般熱固樹脂之注射 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 9 經濟部中央標準局男工消費合作社印製 311270 A7 _ _B7_^_ 五、發明説明（7 ) 模製比較，此種注射壓力較低。由於注射壓力較低，且可 更輕易的執行溫度控制，因此可在低壓下作用連續的操作 。由於此模製可在低壓下作用，結合接線之形變程度較低 。因此，安裝有半導體之引線框可形成更細微之圖樣。 鍵結有半導體之引線框乃固定的設定成一插入物在模 中，而後此模關閉或受到箝夾。模製化合物注入模中。模 製化合物以一般困定的速率由充填開始時至達到最大注射 壓力時。如果模製化合物之充填不是連續的，最大壓力會 在充填作用1 0 0 %時到達，即使此最大壓力之值相當小 ，此種壓力亦會直接作用在模製部份上，在充填操作之最 後階段，如此會發生結合接線之形變或切斷。因此，依照 本發明，在充填完成前，注射壓力些微的降低，且因此， 充填可在低壓中持續。因此，可防止結合接線之形變或切 斷。 氣缸之設定溫度通常爲6 5°C至1 1 0°C，且在此範 圍中之溫度控制相當容易。但是，由於熔融黏性和熱穩定 性和考量，此設定溫度最好爲7 0°C至9 0°C。如果氣缸 溫度較低時，雖然熔融黏度較高，但是熱穗定性良好。在 本發明之環氧樹脂模製化合物中，特別當使用上述較佳組 成時，熔融黏性較低，且因此氣缸溫度可設定至相當低的 位準。但是，如果氣缸溫度設定低於6 5 °C時，模製化合 物之溫度控制變成相當困難。相反的，如果氣缸溫度高於 1 1 0°C時，此熔融黏性太低，因此有時雖以作用適當的 注射，此外，亦無法達成滿足的熱穩定性。 ^iT-------^I*— . * (請先閲讀背面之注意事項異填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 10 - A7 _B7_ 五、發明説明（8 ) 在本發明之實施例中*由於模製化合物之硬化時間等 ，模之設定溫度爲1 5 0°C至1 9 0°C ’且最好爲1 6 5 °〇至1 85°C。以此設定溫度，模製循環不會超過1 50 秒，且在較佳組成之模製化合物之例中，模製循環不超過 8 0秒。 例1 此處使用之環氧樹脂模製化合物之主要成份包含一原 甲酚酚醛清漆型環氧樹脂（環氧樹脂當量200)，酚系 酚醛清漆（羥基當量10 3)，二氮雜二環十一碳烯（硬 化加速劑）和熔融矽石，和另具有一模釋除劑，一染料等 〇 在此例中使用螺桿線上型注射成型機器（由Me iki Seisakusho 公司產製之 Μ — 3 2 )。 經濟部中央標準局貝工消費合作社印製 最靠近噴嘴之加熱氣缸之區域，其長度爲氣缸之總長 3 0%，保持在7 5°C，而氣缸之另一區域保持在3 0°C 。關於注射壓力方面，最大壓力爲2 0 0 k g/cm2。 注射壓力由注射啓始時以2 0秒上升至最大壓力。而後， 降低至5 0 k g/cm 2並保持5秒，而後操作澆口切銷 以關閉澆口。介於注射壓力和螺桿位置間之關係或注射壓 力時間圖如圖1所示。由模之關閉至模之間啓間之時間段 爲6 0秒，且整個模製循環爲8 0秒。模之溫度設定爲 17 5。。。 此模爲二十空腔模。以金線鍵結和接線結合之具有 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) -11 - A7 B7 經濟部中央標準局員工消費合作杜印製 311270 五、發明説明（9 ) 1 0 I C元件（1 6接腳雙排構裝）循序設置之兩引線框 自動的設定在模中，且此模製連績的執行。樹脂封裝半導 體裝置之外觀，充填能力，接線擺動，和表面硬度每小時 測量一次。結果如表1所示。 表 1 外觀 充填能力 接線擺動 表面硬度 最初狀態 良好 良好 不超過5¾ 74 5小時後 良好 良好 不超過5 % 74 1 0小時後 良好 良好 不超過5 % 74 1 5小時後 良好 良好 不超過5¾ 75 2 0小時後 良好 良好 不超過5¾ 76 (測量） (1 )外觀；充填能力：它們以目視檢査判斷，且特 別的’外觀之檢査係關於其是否具有光澤。 (2 )接線擺動：軟X射線應用至模製產品，並測量 本紙張尺度適用中國國家揉準（CNS ) A4規格（210X297公釐） 裝 訂------線-----1 ί (請先閲讀背面之注意事項-if填寫本頁) -12 - 經濟部中央標準局貝工消費合作社印製 A7 ___ __B7_ 五、發明説明（10) 結合接線之擺動量（半硬金線之直徑爲2 5 和長度爲 3mm) »接線擺動以最大接線擺動對介於結合接線間之 距離（500#m)之比例表示。 (3 )表面硬度：剛好在模打開後之模製產品之表面 硬度由—Barcol硬度測試機（# 9 3 5量測）。 如表1所示之結果和習知低壓轉換模製所得之結果相 似，且表示於此無任何問題。因此，可執行長時間，連續 模製。 _ 在本發明之另一實施例中，注射成型機器之加熱氣缸 在軸向方向上區分成多數之區域。此區域之數目至少爲兩 個，且區域之數目並不限於特定之數目。但是，最好爲四 或五個區域。這些區域之溫度獨立的控制。爲了作用比習 知模製更穩定的連續模製，最接近噴嘴之區域（以下稱爲 "^最近噴嘴側區域# )之溫度控制在6 5°C — 1 1 0°C， 而最接近漏斗之區域（以下稱爲'最近漏斗側區域)之 溫度控制在一般溫度至5 0°C間。前者之溫度最好爲 7 0°C至9 0°C，和後者之溫度最好爲3 0°C至4 0°C。 在此溫度範圍中，可完全達成具有低熔融黏性之環氧樹脂 模製化合物之特性，且熱穩定性並無問題，因此，可作用 穩定，長時間，連續模製》 在此例中，當加熱氣缸具有兩區域時，最近噴嘴側區 域之全長爲氣缸之全長之2 0%至4 0%。當加熱氣缸具 有3至5區域時，最近噴嘴側區域有具和上述兩區域氣缸 相同的溫度和長度。三個間隔區域之一之溫度爲介於最近 I I I ^ 1· I I I I I I I I 1-^ I i (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家揉準（CNS ) A4規格（210 X 297公釐） 13 經濟部中央標準局員工消费合作社印製 311270 A7 B7 五、發明説明（11 ) 噴嘴側區域之溫度和最近漏斗側區域之溫度間之中間值。 間隔區域之溫度愈高，則間隔區域愈靠近最近噴嘴側區域 。最近漏斗側區域之溫度和上述兩區域氣缸者相同。非最 近噴嘴側區域之區域之長度可視環氧樹脂模製化合物之熱 穩定性和熔融黏性而適當的決定。 如果氣缸溫度較低時，雖然熔融黏性較高，但是熱穩 定性仍是良好的。在本發明之環氧樹脂模製化合物，特別 當使用上述之較佳組成時，熔融黏性較低，且因此氣缸溫 度可設定在相當低的位準。但是*如果氣缸溫度變成小於 6 5 °C時，溫度控制變成相當困難。相反的。如果氣缸溫 度高於1 1 0°C，熔融黏性太低，如此有時雖以作用適當 的注射模製，此外，亦常常無法達成滿意的熱穩定性。 在本發明之此實施例中，相關於注射成型機器之注射 壓力，可總用和上述相同的狀況，且可獲得相同的優點。 在本發明之實施例中，有鑒於環氧樹脂模製化合物之 硬化時間等，模之設定溫度通常爲1 5 0°C至1 9 0°C， 且最好爲1 65 °C至1 85 °C。此此設定溫度，模製循環 無法超過1 7 0秒，且在較佳組成之模製化合物之例中， 模製循環不會超過100秒》 例2 此處使用之環氧樹脂模製化合物之主要成份包含一原 甲酚酚醛清漆型環氧樹脂（環氧樹脂當量2 0 0 )，酚系 酚醛清漆（羥基當量10 3)，二氮雜二環十一碳烯（硬 -----^----i — ^-----—IT-------0 〆 一 {請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）_ _ 經濟部中央標準局員工消費合作社印裝 Α7 Β7 五、發明説明（i2). 化加速劑）和熔融矽石，和另具有一模釋除劑，一染料等 0 在此例中使用螺桿線上型注射成型機器（由Me iki311270 at B7 5. Description of the invention (1) Background of the invention The present invention relates to a method of manufacturing a resin-encapsulated semiconductor device. More particularly, the present invention relates to a method of injecting an epoxy resin compound into an injection molding die to manufacture a resin-encapsulated semiconductor device, in which the lead frame where the semiconductor has been bonded and wired is fixedly set as an insert in an injection molding Mold and harden the epoxy resin compound in the injection mold. Description of Related Art In the packaging of semiconductor devices such as IC and LS I, conversion molding methods using epoxy resin molding compounds have been widely used because of their low cost, high reliability, and high production efficiency. Generally speaking, in conversion molding, the epoxy resin molding compound forms a piece, and this piece is filled into a pot in the mold, and this piece * is pressed by a plunger when it is melted by heat in the mold. Therefore, the molten molding compound can flow and then harden. Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling this page) Shape), and therefore requires a forming step. Depending on the size and shape of the semiconductor device, the shape of the sheet will vary widely, so many molding devices are needed to form the epoxy molding compound. Since each molding operation requires the hot-energized sheet and the molten sheet, the period of the molding cycle cannot be reduced to a predetermined period of time, which limits cost reduction and productivity. Furthermore, impurities may be introduced into the molding compound in a pre-processing step (such as a forming step). In the conversion molding, in the flow path where the molding compound is charged into a pot, the residual stream flows into the mold cavity, and in the pot The finished paper scale is applicable to the Chinese National Standard (CNS) A4 (210X297 mm). 4 The A7 B7 is printed by the Male Workers ’Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of the invention (2) is fully hardened, so they can no longer be used. The problem caused by this is that a large amount of resin that is not used to form a semiconductor package is wasted. On the other hand, injection molding methods using thermosetting resin molding compounds such as epoxy resins have been studied so far. In this injection molding, the epoxy resin molding compound in the form of powder or granules is supplied to an injection molding machine, kept molten in a cylinder, and injected into a mold with a screw rod. Therefore, the step of forming the epoxy resin molding compound into one piece is unnecessary, and it can also be continuously produced. Therefore, the apparatus for forming purposes and the time for forming can be omitted. Furthermore, since the molding material in the molten state is shorter than in the conversion molding, this method is suitable for mass production. However, injection molding of epoxy resin molding compound encapsulation is not actually used. The reason is that the molten state of the conventional epoxy resin molding compound is heated to 70 ° C-110 ° C in the cylinder, and when the resin hardening reaction in the molding compound proceeds, the viscosity of the molding compound increases. As a result, its fluidity is lost for 5 to 10 minutes, and the thermal stability of the molten molding compound is extremely low. Therefore, it is impossible to perform injection molding at low pressure, and therefore, high pressure injection is not required. As a result, the bonding wires on the semiconductor device will be deformed or cut, and therefore, the reliability of the resulting semiconductor package will be significantly reduced. Another problem with the conventional art is that when the molding operation is interrupted for a predetermined period of time (for example, to clean the mold), the epoxy molding compound will harden in the cylinder, so it can no longer be injected, and therefore will have a reverse effect Continuous production. This paper music standard is applicable to the Chinese National Standard (CNS) A4 specification (210X297mm) ---------- 1 ----- 1 ------ Subscribe l ------ line- -(Please read the precautions on the back before filling in this page) A7 311270 B7 5. Description of the invention (3) Summary of the invention The object of the present invention is to provide a method for manufacturing a semiconductor device package using an epoxy compound by injection molding In this way, long-term continuous molding and mass production can be effectively performed. Therefore, according to one aspect of the present invention, the present invention provides a method of manufacturing an epoxy resin-encapsulated semiconductor device in which an epoxy resin molding compound is injected In the injection molding mold, the arrangement in which the lead frame bonded by the semiconductor bonding and wiring is fixed as an insert in the injection molding mold, and the epoxy resin molding compound is hardened in the injection molding film, the method includes The steps are: inject the epoxy resin molding compound into the injection molding die; gradually increase the injection pressure of the injection molding machine, so that when the total amount of epoxy resin molding compound to be injected is 80% to 95% Inject into When the mold may be achieved maximum pressure 30kg / cm2 to 300kg / cm2 sum; and In 2 0 k g / cm2 to 1 billion billion injection k g / cm2 injection pressure of the remaining epoxy resin molding compound. According to another aspect of the present invention, the present invention provides a method of manufacturing an epoxy resin-encapsulated semiconductor device, which injects an epoxy resin molding compound into an injection molding mold by an injection molding machine, in which semiconductor components are mounted and wire bonded One of the lead frames is fixedly set as an insert, the injection molding machine includes a cylinder provided at one end, the cylinder has a funnel, and epoxy resin can be supplied to the injection molding machine through the funnel, and the other end has a Nozzle, the cylinder is divided into many parts in the axial direction, each of which is ----- r-= 1! Xuan ------ order ------ ^ line- ί (please read the back Note: Please fill out this page again.) The Central Standards Bureau of the Ministry of Economic Affairs prints the paper standard General Chinese National Standard (CNS) A4 (210X297mm) 6 The A7 B7 is printed by the Employees ’Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs Description (4) The temperature of a part is controlled independently, and the part closest to the nozzle is kept at 65 ° C — 1 1 0 ° C, and the part closest to the funnel is kept at room temperature — 50 ° C. The epoxy resin molding compound used in the present invention usually contains an epoxy resin, a hardener, a hardening accelerator and an inorganic filter as its main components. It is often in the form of powder or granules. When in conversion molding, it need not form a piece. The epoxy resin molding compound preferably exhibits good thermal stability in the cylinder of the injection molding machine, good fluidity in the cavity, and rapid hardening. In view of the above description, epoxy resins can be those with low melt viscosity, such as novolac epoxy resins and bisphenol resins, and especially have a softening point of 50 ° C-80 ° C. Regarding the hardener, phenolic resins such as novolac phenol resin, p-xylyl modified phenol resin and dicyclopentadiene modified phenol resin can be used, and especially those having a temperature of 60 to 120 ° C Phenolic resin that softens the point and contains the contents of monocaryon and di car yon. As for the hardening accelerator, for example, diazabicycloundecene (DBL) or organic phosphine such as triphenylphosphine can be used, and the hardening accelerator is preferably in a high latent state exhibiting low activity at low temperatures. In the present invention, runnerless molding or runnerless molding can be used. More specifically, the temperature of the runner portion of the mold or the temperature of the runner portion and runner portion is controlled to a temperature at which the molding compound is hard to harden, that is, approximately equal to the temperature in the cylinder. By this, the uncured resin compound remaining in the residual channel portion or the runner runner portion can be filled into the cavity at the next step after the molded product (ie, resin-encapsulated semiconductor device) is removed or taken out In this, the paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297mm) ----- r --- 1 1 ^ ------. ^ 1 ------ ^ (please first Read the precautions on the back and then fill out this page) -7-311270 A7 B7 printed by the Employee Consumer Cooperative of the Central Bureau of Economics of the Ministry of Economic Affairs V. Description of the invention (5) Used to effect the molding. Therefore, any molding compound that is not a molded product cannot be formed, and therefore, a significant reduction in resin waste can be achieved. In the package molded by general conversion, the ratio of the hardened resin waste and the entire molding compound in the flow channel portion is 40% ~ 60%, but in the injection molded package of the present invention, the hardened resin waste The ratio is slightly reduced to 30%-50%, and in non-runner molding, this ratio can be further reduced to 2 5% ~ 3 5%, and in runnerless runner molding, this The ratio is further reduced to 10% ~ 30%. The above-mentioned object, structure and effect of the present invention can be more obvious from the following description. The diagram briefly illustrates the relationship between the injection pressure and injection time of the injection molding machine and the relationship between the injection pressure and the position of the injection screw. Figure: Figure 2 is a diagram of the divided area of the heated cylinder of the injection molding machine; Figure 3 is a cross-sectional view of a closed mold and its related parts in a hoop molding: Figure 4 is along the line IV-IV of Figure 3 Cross-sectional view taken; Figure 5 is a cross-sectional view of the mold, which shows the ejection and release of the molded product; Figure 6 is a cross-sectional view of the mold, which shows the conversion of the lead frame; Figure 7 is a mold The enlarged plan view of the arrangement of the middle, runner, gate, and cavity, and shows the situation just after the molding compound is filled into the cavity; Figure 8 is a cross section taken along the line VI II-VI II of Figure 7 This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297mm). F II n II n I ^ t—-If-~ (Please read the precautions on the back before filling this page) 8 A7 311270 __ B7 5 、 Instructions of the Invention 丨 6) Surface view; 'Figure 9 is The schematic plane circle of the rotary injection molding machine; (please read the precautions on the back of the man to fill in this page first) Figure 10 is a schematic side view of the rotary injection molding machine; and Figure 11 is a plan view of the lower mold of the molding device, where The state of the lead frame set in the mold device and the case where a mold compound is filled in the cavity of the mold device are shown. DESCRIPTION OF THE PREFERRED EMBODIMENTS The injection molding machine used in the present invention is not limited to a specific type, that is, any suitable injection molding machine can be used, such as a screw-on-line type, a plunger type, and a screw-plunger type : However, for easy control and uniform melting, it is best to use the screw-on type. Printed by the Ministry of Economic Affairs, Central Standards Bureau, Beigong Consumer Cooperative. One embodiment of the present invention is characterized in that the injection pressure of the injection molding machine is When 80%-95% of the total injection volume of the compound is injected into the mold, it will increase to the maximum pressure, which is between 30 kg / cm2 and 300 kg / cm2. The remaining molding compound is injected at an injection pressure of 20 kg / cm2 to 100 kg / cm2. In this case, the ratio of the latter pressure to the former maximum pressure is preferably 1/4 to 1/2. If the two pressures are higher than the above values, the bonding wiring on the semiconductor device may be deformed and cut off. Conversely, if the two pressures are lower than the above values, the molding compound cannot be properly filled into the mold cavity . Preferably, the maximum injection pressure is in the range of 100 kg / cm2-250 kg / cm2, and the pressure of the latter is in the range of 40 kg / cm2-120 kg / cm2. The size of the paper used for injection of general thermosetting resin is applicable to the Chinese National Standard (CNS) A4 (210X297 mm). 9 Printed by the Central Bureau of Standards of the Ministry of Economic Affairs, 311270 A7 _ _B7 _ ^ _ V. Invention Description (7) For comparison, the injection pressure is lower. Since the injection pressure is low and temperature control can be performed more easily, continuous operation can be performed under low pressure. Since this molding can work under low pressure, the deformation degree of the combined wiring is low. Therefore, the lead frame mounted with semiconductors can form a finer pattern. The semiconductor-bonded lead frame is fixedly set so that an insert is in the mold, and then the mold is closed or clamped. The molding compound is injected into the mold. The molding compound is at a generally sleepy rate from the beginning of filling to reaching the maximum injection pressure. If the filling of the molding compound is not continuous, the maximum pressure will be reached at 100% of the filling effect. Even if the value of this maximum pressure is quite small, this pressure will directly act on the molded part during the filling operation. In the final stage, deformation or disconnection of the joint wiring will occur. Therefore, according to the present invention, the injection pressure is slightly reduced before the filling is completed, and therefore, the filling can be continued at a low pressure. Therefore, it is possible to prevent deformation or cutting of the joint wiring. The set temperature of the cylinder is usually 65 ° C to 110 ° C, and temperature control in this range is quite easy. However, due to melt viscosity and thermal stability and considerations, this setting temperature is preferably 70 ° C to 90 ° C. If the cylinder temperature is low, although the melt viscosity is high, the hot spike is well qualitative. In the epoxy resin molding compound of the present invention, especially when the above preferred composition is used, the melt viscosity is low, and therefore the cylinder temperature can be set to a relatively low level. However, if the cylinder temperature is set below 65 ° C, temperature control of the molded compound becomes quite difficult. Conversely, if the temperature of the cylinder is higher than 110 ° C, the melt viscosity is too low. Therefore, although proper injection is sometimes used, in addition, satisfactory thermal stability cannot be achieved. ^ iT ------- ^ I * —. * (Please read the notes on the back to fill in this page first) This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) 10-A7 _B7_ 5 2. Description of the invention (8) In the embodiment of the present invention, due to the curing time of the molding compound, etc., the set temperature of the mold is 150 ° C to 190 ° C and preferably 165 ° C to 1 85 ° C. With this temperature setting, the molding cycle does not exceed 150 seconds, and in the case of a molding compound of a preferred composition, the molding cycle does not exceed 80 seconds. Example 1 The main components of the epoxy resin molding compound used here include an original cresol novolac epoxy resin (epoxy equivalent 200), phenol novolac (hydroxyl equivalent 10 3), diazabicyclo Undecene (hardening accelerator) and fused silica, and another with a mold release agent, a dye, etc. In this example, a screw linear injection molding machine (M-3 produced by Me iki Seisakusho company) is used 2 ). The area of the heated cylinder closest to the nozzle, printed by the Beigong Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs, is 30% of the total length of the cylinder and is kept at 75 ° C, while the other area of the cylinder is kept at 30 ° C. Regarding injection pressure, the maximum pressure is 200 k g / cm2. The injection pressure rises to the maximum pressure in 20 seconds from the start of injection. Then, lower to 50 k g / cm 2 and hold for 5 seconds, and then operate the gate cut pin to close the gate. The relationship between injection pressure and screw position or injection pressure time is shown in Figure 1. The time period from the closing of the mold to the start of the mold is 60 seconds, and the entire molding cycle is 80 seconds. The temperature of the mold is set to 17 5. . . This mold is a twenty-cavity mold. This paper standard with gold wire bonding and wiring is applicable to the Chinese National Standard (CNS) A4 specification (210X297mm) (please read the precautions on the back before filling this page) -11-A7 B7 Central Bureau of Standards, Ministry of Economic Affairs Employee consumption cooperation Du Printing 311270 V. Description of invention (9) 1 0 IC components (16-pin double-row configuration) The two lead frames set in sequence are automatically set in the mold, and this mold is executed continuously. The appearance, filling capacity, wiring swing, and surface hardness of the resin-encapsulated semiconductor device are measured every hour. The results are shown in Table 1. Table 1 Appearance Filling capacity Wiring swing surface hardness Initially good and good not more than 5¾ 74 Good and good not more than 5% after 5 hours 74 1 10 hours and good and good not more than 5% 74 1 5 hours after good and good not more than 5¾ 75 2 0 After hours, good and good, no more than 5¾ 76 (measured) (1) Appearance; filling capacity: they are judged by visual inspection, and the special 'appearance inspection is about whether it has luster. (2) Wiring swing: Soft X-ray is applied to the molded product, and the paper size is measured. It is suitable for China National Standard (CNS) A4 specification (210X297mm). Binding ------ Line ----- 1 ί (Please read the precautions on the back first-if fill in this page) -12-A7 ___ __B7_ printed by the Beigong Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs V. Invention description (10) Swing amount of combined wiring (diameter of semi-hard gold wire 2 5 and length 3mm) »Wiring swing is expressed as the ratio of the maximum wiring swing to the distance (500 # m) between the bonding wires. (3) Surface hardness: The surface hardness of the molded product just after the mold is opened is measured by the -Barcol hardness testing machine (# 9 3 5 measurement). The results shown in Table 1 are similar to those obtained by conventional low-voltage conversion molding, and there is no problem here. Therefore, continuous molding can be performed for a long time. _ In another embodiment of the present invention, the heating cylinder of the injection molding machine is divided into a plurality of regions in the axial direction. The number of this area is at least two, and the number of areas is not limited to a specific number. However, it is better to have four or five zones. The temperature of these areas is controlled independently. For continuous molding which is more stable than conventional molding, the temperature of the area closest to the nozzle (hereinafter referred to as " ^ nearest nozzle side area #) is controlled at 6 5 ° C — 1 1 0 ° C, and the closest to the funnel The temperature of the area (hereinafter referred to as the 'nearest funnel side area') is controlled between the normal temperature and 50 ° C. The temperature of the former is preferably 70 ° C to 90 ° C, and the temperature of the latter is preferably 30 ° C to 40 ° C. In this temperature range, the characteristics of epoxy resin molding compounds with low melt viscosity can be fully achieved, and there is no problem with thermal stability, therefore, it can function stably, for a long time, continuous molding. In this example, When the heating cylinder has two regions, the total length of the nearest nozzle side region is 20% to 40% of the total length of the cylinder. When the heated cylinder has 3 to 5 zones, the closest nozzle side zone has the same temperature and length as the above two zone cylinders. The temperature of one of the three compartments is between the nearest III ^ 1 · IIIIIIII 1- ^ I i (please read the precautions on the back before filling this page) This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) 13 Printed 311270 A7 B7 by the Staff Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Invention description (11) The intermediate value between the temperature on the nozzle side area and the temperature on the nearest funnel side area. The higher the temperature of the spaced region, the closer the spaced region is to the closest nozzle side region. The temperature of the closest funnel side area is the same as that of the cylinders in the above two areas. The length of the area other than the area closest to the nozzle side may be appropriately determined depending on the thermal stability and melt viscosity of the epoxy resin molding compound. If the cylinder temperature is low, although the melt viscosity is high, the thermal stability is still good. In the epoxy resin molding compound of the present invention, especially when the above-mentioned preferred composition is used, the melt viscosity is low, and therefore the cylinder temperature can be set at a relatively low level. But * If the cylinder temperature becomes less than 65 ° C, temperature control becomes quite difficult. The opposite of. If the temperature of the cylinder is higher than 110 ° C, the melt viscosity is too low. In this case, although proper injection molding is sometimes used, in addition, satisfactory thermal stability is often not achieved. In this embodiment of the present invention, regarding the injection pressure of the injection molding machine, the same conditions as described above can always be used, and the same advantages can be obtained. In the embodiment of the present invention, in view of the hardening time of the epoxy resin molding compound, etc., the set temperature of the mold is usually 150 ° C to 190 ° C, and preferably 1 65 ° C to 1 85 ° C. With this setting temperature, the molding cycle cannot exceed 170 seconds, and in the case of the molding compound of the preferred composition, the molding cycle does not exceed 100 seconds. "Example 2 The epoxy resin molding compound used here The main components include a primary cresol novolac epoxy resin (epoxy equivalent of 200), phenolic novolac (hydroxyl equivalent of 103), diazabicycloundecene (hard ----- ^ ---- i — ^ -----— IT ------- 0 〆 一 (Please read the precautions on the back before filling in this page) This paper size is applicable to China National Standard (CNS) A4 specifications (210X297mm) _ _ Printed Α7 Β7 by the Employees ’Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy V. Description of the invention (i2). Chemical accelerator) and fused silica, with another mold release agent, a dye etc. 0 In this example, a screw in-line injection molding machine (by Me iki
Seisakusho公司產製之Μ — 3 2 )。如圓2所示，氣缸 2 0軸向且相等的分成區域A_-五_。最靠近噴嘴之加熱氣 缸之區域保持在75 °C。與區域ϋ目隔之區域保持在 6 5°C，而其它區域2_和分別保持在3 5°C。關於 注射壓力方面，最大壓力爲2 0 0 k g/cm2。注射壓 力由注射啓始時以2 0秒上升至最大壓力》而後，降低至 5 0 k g/cm 2並保持5秒，而後操作澆口切銷以關閉 澆口。介於注射壓力和螺桿位置間之關係或注射壓力時間 圖如圖1所示。由模之關閉至模之開啓間之時間段爲6 0 秒，且整個模製循環爲8 0秒。模之溫度設定爲1 7 5°C 〇 此模爲二十空腔模。以金線鍵結和接線結合之具有 1 0 I C元件（1 6接腳雙排構裝）循序設置之兩引線框 自動的設定在模中，且此模製連續的執行》樹脂封裝半導 體裝置之外觀，充填能力，接線擺動，和表面硬度每小時 測量一次。結果如表2所示。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -15 - t------訂-------線 丨 i (請先閣讀背面之注意事項再填寫本頁) A7 B7 311270 五、發明説明（13) 表 2 外觀 充填能力 接線擺動 表面硬度 最初狀態 良好 良好 不超過5¾ 74 5小時後 良好 良好 不超過5% 75 1 0小時後 良好 良好 不超過5¾ 74 1 5小時後 良好 良好 不超過5% 75 2 0小時後 良好 良好 不超過5% 76 (測量） (1 )外觀；充填能力：它們以目視檢査判斷，且特 別的，外觀之檢查係關於其是否具有光澤。 (2 )接線擺動：軟X射線應用至模製產品，並測量 結合接線之擺動量（半硬金線之直徑爲2 5 和長度爲 3mm)。接線擺動以最大接線擺動對介於結合接線間之 距離（5 0 〇 ym)之比例表示。 (3 )表面硬度：剛好在模打開後之模製產品之表面 硬度由一Bar col硬度測試機（#935量測）。 本紙張尺度適用中國國家橾準（CNS ) A4规格（210X297公釐）_ 16 _ -----„-----— 參-----------.^- -< · I (請先閲讀背面之注意事項-if填寫本覓) 經濟部中央標準局負工消費合作社印製 經濟部中央標準局貝工消費合作社印製 A7 ___B7 五、發明説明（14) 如表2所示之結果和習知低壓轉換模製所得之結果相 似，且表示於此無任何問題。因此，可執行長時間，連續 模製。 本發明之另一實施例之特徵在於使用箍模製。 參考圖3至8，具有一部份安裝著半導體之長引線框 由一捲軸（未顯示）供應或解開，且半導體裝置1 2結合 至引線框1 ，且接線結合至引線框1。引線框1由一饋送 引導1 0導引進入一模4，因此，已定長度之引線框1設 定在模4中。饋送引導1 0由轉回銷1 1所支持。轉回銷 1 1之下端由一支持板1 8支持，該支持板1 8由一驅動 氣缸1 6上下移動。模4包含上模2和下模3。上模2可 藉由驅動機構（未顯示）而向上移動離開下模3，因此， 可打開模4。眾所週知之注射銷6由下模3滑動的延伸進 入在模4中之空腔3 4。注射銷6之下端由注射銷操作板 1 7所支持。板1 7連接至板1 8，且由驅動氣缸1 6上 下移動。參考圖7和8，來自注射成型機器之一模製化合 物在模4中經由一流道14和一澆口15而填入每個空腔 34。澆口切銷7分別用以開關相關的澆口 1 5 ，澆口切 銷之下端由一銷支持板19所支持。銷支持板19由一驅 動機構（未顯示）以一距離大上下移動（見圓4)，因此 澆口切銷7可開關相關的澆口。 在右手邊（圖3 )用以移動另一饋送引導8之饋送機 構8提供在下模3和饋入引導8之間。 在圖3所示之狀況中，模製化合物在模4中注射入空 (請先閲讀背面之注意事項再填寫本頁) •裝. 訂 本紙張尺度適用中國國家橾準（CNS ) A4規格（210X297公釐） 17 五、發明説明（15) 腔3 4，且澆口切銷7受操作以關閉澆口 1 5，因此每個 模製產品（包含由樹脂模製化合物1 3所封裝之半導體 1 2 )和流道1 4隔離。在注入材料硬化後，上模向上移 動以打開模4，如圖6所示。而後，如圖5所示，驅動氣 缸16受驅動以移動支持板1 8向上。結果，由轉回銷 1 1支持之饋送引導1 0和8向上移動離開下模3。注射 銷操作板1 7亦向上移動，因此，注射銷6由在下模3中 之相關空腔3 4注射相關模製產品。相關的模製產品由下 模3中釋出。而後，操作饋送機構以移動饋送引導8在右 手方向，藉以移動模製引線框5在右手方向一段預定距離 〇 通當，同時作用模製引線框部份5和引線框部份5之 彎曲間之分離。由於形成在模製產品周邊上之主刺通常非 常薄，其可輕易的移除。 經濟部中央標準局貝工消費合作社印製 如圖6所示，在饋送引導由饋送機構9轉回至其初始 位置後，驅動氣缸1 6受操作以移動轉回銷1 1和注射銷 6向下。引線框1再度設定在下模3中，而後上模2向下 移動以關閉模4 »在接著前已模製引線框部份5之後之引 線框之非模製部份1上重覆上述之模製。 圖7和8爲在模中之流道，澆口和空腔之擴大圖，並 顯示剛好在模製化合物以填入空腔3 4後之狀況。注射模 製化合物經由澆道（未顯示），流道1 4和澆口 1 5而注 入相關的空腔3 4中。已鍵結半導體1 2之引線框1分別 再次設定在空腔3 4中。而後，每個澆口切銷7向上移動 18 - 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）_ 511270 A7 B7 五、發明説明（l6 ) 相當於澆口高度大之距離，藉以關閉澆口 1 5。在模製化 合物硬化後，模打開，且模製產品注射°在流道1 4中硬 化之模製產品和模製引線框部份5隔離。因此’模製引線 框部份5由饋送機構9平滑的傳送’也因此可執行後續的 模製操作。在無澆口切銷7之情形下，在產品注射後，必 需以一些機構切斷澆口，或是一澆口必需形成一銷點澆口 或模澆口之形狀，以便可自然輕易的切斷。 在本發明之實施例中，使用箍模製，且因此循序的模 製處理可自動的以無人操作之方式作用，此種處理包括解 澆引線框之步驟，鍵結半導體之步驟，接線結合，設定引 線框在模中之步驟，模製，移動模製品之步驟，將模製品 和'.引線框分離之步驟，和彎曲模製產品之引線之步驟。因 此，可在一系統中執行由引線框之解澆至模製產品之最後 處理間之循序步驟。 例3 經濟部中央樣準局貞工消費合作社印製 (請先閲讀背面之注意事項馮填寫本頁) 此處使用之環氧樹脂模製化合物之主要成份包含一原 甲酚酚醛清漆型環氧樹脂（環氧樹脂當量200) ’酚系 酚醛清漆（羥基當量10 3)，二氮雜二環十一碳烯（硬 化加速劑）和熔融矽石，和另具有一模釋除劑，一染料等 在此例中使用螺桿線上型注射成型機器（由Meiki Seisakusho公司產製之Μ — 3 2 )。如圖2所示，氣缸 2 0軸向且相等的分成區域互_»最靠近噴嘴之加熱氣 私紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） _ 19 _ 經濟部中央標準局貝工消費合作社印製 A7 B7 五、發明説明（17) 缸之區域I保持在75 °C。與區域i相隔之區域保持在 6 5°C，而其它區域_£_、£_和分別保持在3 5°C »關於 注射壓力方面，最大壓力爲2 0 0 k g/cm2。注射壓 力由注射啓始時以2 0秒上升至最大壓力。而後，降低至 5 0 k g/cm 2並保持5秒，而後操作澆口切銷以關閉 澆口。介於注射壓力和螺桿位置間之關係或注射壓力時間 圖如圖1所示。由模之關閉至模之間啓間之時間段爲6 0 秒，且整個模製循環爲8 0秒。模之溫度設定爲1 7 5°C 。一模具有兩例的空腔，每例具有1 〇個空腔，因此，該 模爲二十空腔膜。 長引線框由捲軸相關的解澆和供應。I C元件（1 6 接腳雙排構裝）鍵結至每個引線框，並以金線接線結合。 此兩此線框饋送至上述模中，且該模製在1 2 0秒之模製 循環上自動連續的作用。引線框之模製框部份分離，且引 線彎曲，同時，移去環澆模製產品之週邊之毛刺。此種毛 刺非常薄，且因此它們可在框部份之分離和引線之彎曲時 同時的移去。模製產品之外觀，充填能力，接線擺動，和 表面硬度每小時測量一次。每5小時所獲得之結果如表3 所示。 本紙張尺度適用中國國家標準（匚奶）八4規格（210父297公釐）_ -----_-------^-----------^ t m - i (請先閲讀背面之注意事項-ί填寫本頁) 311270 A7 _B7 五、發明説明（18) 表 3 外 觀 充填能力 接線 擺 動 表面硬度 最初 狀 態 良 好 良 好 不 超 迴 5¾ 74 5小時後 良 好 良 好 不 超 過 5¾ 75 1 0小 時 後 良 好 良 好 不 超 過 5¾ 74 15小 時 後 良 好 良 好 不 超 過 5¾ 75 2 0小 時 後 良 好 良 好 不 超 過 5¾ 76 -----^---.---參-- -- (請先閲讀背面之注意事項再填寫本貢) 訂 經濟部中央標準局員工消費合作社印製 (測量） (1 )外觀；充填能力：它們以目視檢査判斷，且特 別好，外觀之檢査係關於其是否具有光澤。 (2 )接線擺動：軟X射線應用至模製產品，並測量 結合接線之擺動量（半硬金線之直徑爲2 5 //m和長度爲 3mm) 9接線擺動以最大接線擺動對介於結合接線間之 距離（5 0 0 # m )之比側表示。 (3 )表面硬度：剛好在模打開後之模製產品之表面 硬度由一Barcol硬度測試機（#935量測）。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 21 經濟部中央標準局員工消費合作社印製 A7 ___B7 _ 五、發明説明（ig) 如表3所示之結果和習知低壓轉換模製所得之結果相 似，且表示於此無任何問題》因此，可執行長時間，連續 模製。 在本發明之實施例中，明顯的是由環氧樹脂模製化合 物而形成之半導體封裝可由箍模製之注射模製連續的作用 一段長時間，而無任何問題。在本發明之實施例中，使用 箍模製，且因此，循序的模製處理可利用無人方式自動的 作用，這些處理包括引線框之解澆，半導體之鍵結，在模 中之引線框之設定和接線結合，模製產品之移除和模製， 和模製產品之後續加工等步驟》 本發明之另一實施例之特徵在於其使用旋轉模製方法 〇 參考圖9至1 1，一旋轉注射模製裝置3 5包含一注 射成型機器2 0，其具有一漏斗2 3，和一旋轉台2 4相 關於注射成型機器2 0並列設置。四個模裝置2 5，2 6 ，27和28安裝在旋轉台24上，且互相以90°間隔 "在圖9中，注射成型機器2 0之噴嘴3 6和模裝置2 5 之澆道流道3 2相通（見圖1 1，和一模製化合物充填在 模裝置2 5中。因此，模製化合物充填在模裝置2 5中， 且保持在預定壓力，同時，模製化合物之硬化可在模裝置 2 6和2 7中進行，其中該模受關閉或箝夾。在模裝置 2 8中，模打開以移動模製產品（每個包含由模製化合物 30所封裝之半導體元件31)，且引線框29設定在模 中，而模關閉。 本紙張尺度適用中國國家標準（CNS > A4規格（2丨0X297公釐）_ _ -----r------餐-----------^ - m i i (請先閱讀背面之注意事項肩填寫本頁) 經濟部中央標準局負工消费合作社印製 A7 _B7____ 五、發明説明（20) 當四個模裝置轉回至原始位置時，可完成每個模裝置 之模製循環。因此，如果每個模裝置之模製循環爲1 2 0 秒，由於此旋轉注射模製裝置3 5具有四個級，此種模製 在3 0秒之循環上作用，且因此，可明顯的降低整個模製 循環。 特別的，使環氧樹脂模製化合物以熱硬化需要一段特 定的時間段，且相當難以降低由注射開始至模開啓間之時 間段。在本發明之實施例中，由於使用旋轉模製，因此時 間週期可顯著的降低。且因此，可顯著的降低模製循環。 再者，澆口切銷3 3提供在每個模中，且在模製化合 物注射且充填入模中後，操作澆口切銷3 3以關閉澆口， 以將模製產品和澆道流道3 2隔離，藉以利於模製產品之 移除和後續之處理。通常，模製產品由引線框中分離和模 製產品之引線之彎曲同時作用。此時，由於形成在模製產 品周邊之毛刺通常非常薄，其可輕易的移除。 藉由變化模裝置之空腔形狀和/或引線框之形狀，可 即時的封裝多種半導體》如果模製產品之移除和引線框之 設定以機器人自動的作用時，可作用連續的模製，而無需 手動的操作，且不同種類之模製產品可輕易的分類而不會 發生錯誤。 在本發明之實施例中，在模製產品由模中移去後，如 果引線框和模製產品之分離和模製產品之後續處理以關於 模製操作連績的作用時，可在一系統中執行在模中由引線 框之設定至模製產品之後績處理之循序步驟。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）_ 23 - -----：------^-----— ------^ ί ί (請先閱讀背面之注意事項男填寫本貰) 311270 A7 ____B7 五、發明説明（21 ) 例4 此處使用之環氧樹脂模製化合物之主要成份包含一原 甲酚酚醛清漆型環氧樹脂（環氧樹脂當量200)，酚系 酚醛清漆（羥基當量10 3)，二氮雜二環十一碳烯（硬 化加速劑）和熔融矽石，和另具有一模釋除劑，一染料等 〇 經濟部中央標準局貝工消費合作社印製 (請先閲讀背面之注意事項為填寫本頁) 在此例中使用螺桿線上型注射成型機器.（由Me iki Seisakusho公司產製之Μ — 3 2 )。如圖2所示，氣缸 2 0軸向且相等的分成區域1 一五_。最靠近噴嘴之加熱氣 缸之區域A_保持在7 5°C。與區域1相隔之區域保持在 6 5°C，而其它區域及_和分別保持在3 5 °C。關於 注射壓力方面，最大壓力爲2 0 0 k g/cm2»注射壓 力由注射啓始時以2 0秒上升至最大壓力》而後，降低至 5 0 k g/cm 2並保持5秒，而後操作澆口切銷以關閉 澆口。介於注射壓力和螺桿位置間之關係或注射壓力時間 圖如圖1所示。由模之關閉至模之開啓間之時間段爲6 0 秒，且整個模製循環爲8 0秒。 每個模裝置具有兩列空腔，每列具有1 〇個空腔，因 此，模裝置爲二十空腔膜。具有鍵結I C元件（1 6接腳 雙排構裝）之兩引線框乃由金線接線結合，並設定在模裝 置中。模溫度設定爲17 5°C。 四模裝置安裝在旋轉台上，且互相以9 0°分隔。 模製操作可參考圖9和上述相同的執行，且旋轉台旋 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）_ 24 - A7 B7 經濟部中央標隼局負工消费合作社印製 五、發明説明（22 ) 轉一週之時間爲1 2 0秒， 止時間爲3 0秒。在這些狀 線框之設定和模製產品之移 用。在兩例中，可毫無問題 每個引線框中分離，且引線 週邊之毛利亦即時的移除。 框部份之分離和引線之彎曲 觀，充填能力，接線擺動， 每5小時所獲得之結果如表 表 和在每一級上之模製裝置之停 況下，可作用連續的模製。引 除可由手動操作或由機器人作 的作用這些操作。模製產品由 彎曲。環澆在每個模製產品之 這些毛利非常薄，且因此可在 時，即時除去。封裝產品之外 和表面硬度每小時測量一次。 4所示。 4 外 觀 充 填能力 接 線 擺 動 表面硬度 最初狀態 良 好 良 好 不 超 過 5¾ 76 5小時後 良 好 良 好 不 超 過 5% 76 1 0小時後 良 好 良 好 不 超 過 5% 75 1 5小時後 良 好 良 好 不 超 過 5% 75 2 0小時後 良 好 良 好 不 超 過 5% 77 本紙浪尺度適用中國國家揉準（CNS ) A4規格（2丨0X297公着） I. m n IT I — J n I 1 - - - I I n T U3-s (請先閱讀背面之注意事項-s填寫本育) -25 - 經濟部中央梂準局貝工消费合作社印製 311270 A7 _B7_ 五、發明説明（23) (測量） (1 )外觀；充填能力：它們以目視檢査判斷，且特 別好，外觀之檢査係關於其是否具有光澤。 (2 )接線擺動：軟X射線應用至模製產品，並測量 結合接線之擺動量（半硬金線之直徑爲2 5 iim和長度爲 3mm)。接線擺動以最大接線擺動對介於結合接線間之 距離（5 0 0 #m)之比例表示。 (3 )表面硬度：剛好在模打開後之模製產品之表面 硬度由—Barcol硬度測試機（# 9 3 5量測）。 此種結果和習知以低壓轉換模製所得之結果相同，如 此表示此實施例並無問題。因此，包括由在模中引線框之 設定至模製產品之後續處理間之循序處理步驟之自動連'續 模製可作用一段長時間。 依煦本發明，藉由旋轉模製型之注射模製，而以環氧 樹脂模製化合物形成之半導體封裝可連續的作用一段長時 間而不會有任何問題。藉由自動的作用或以機器人作用引 線框之設定，模製產品之移除，模製產品之後續處理時， 即可自動的完成模製操作。 粉末或顆粒型式之模製化合物可供應至注射成型機器 中，且因此，不需要執行成如在轉換模製中之片形狀。因 此，可省略需用於形成片之裝置和時間。由於不需要例如 形成片之預先處理，因此雜質極不可能進入模製化合物中 。此外，可採用無澆道模製和無澆迨流道模製，因此，可 顯著的降低非模製產品之硬化材料（廢棄物）之比例。 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） (請先閲讀背面之注意事項声填寫本貫) 装· 訂M-3 2 produced by Seisakusho Company). As indicated by circle 2, the cylinder 20 is axially and equally divided into regions A_- 五 _. The area of the heated cylinder closest to the nozzle is kept at 75 ° C. The area separated from the area ϋ is kept at 65 ° C, while the other areas are kept at 35 ° C. Regarding injection pressure, the maximum pressure is 200 k g / cm2. The injection pressure rose from 20 seconds to the maximum pressure at the beginning of injection, then decreased to 50 k g / cm 2 and held for 5 seconds, and then the gate was operated to close the gate. The relationship between injection pressure and screw position or injection pressure time is shown in Figure 1. The time period from the closing of the mold to the opening of the mold is 60 seconds, and the entire molding cycle is 80 seconds. The temperature of the mold is set to 175 ° C. This mold is a twenty-cavity mold. The two lead frames with 10 IC components (16-pin double-row configuration) combined by gold wire bonding and wiring are automatically set in the mold, and this molding is continuously performed. Appearance, filling capacity, wiring swing, and surface hardness are measured every hour. The results are shown in Table 2. This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -15-t ------ order ------- line 丨 i (Please read the precautions on the back before filling in this Page) A7 B7 311270 V. Description of the invention (13) Table 2 Appearance Filling capacity Wiring swing surface hardness Initially good good not more than 5¾ 74 5 hours after good good not more than 5% 75 1 10 hours after good good not more than 5¾ 74 1 Good after 5 hours, not more than 5% 75 Good after 20 hours, not more than 5% 76 (Measurement) (1) Appearance; filling capacity: they are judged by visual inspection, and in particular, the appearance inspection is about whether it has luster. (2) Wiring swing: Soft X-rays are applied to the molded product, and the swing amount of the combined wiring is measured (the diameter of the semi-hard gold wire is 2 5 and the length is 3mm). Wiring swing is expressed as the ratio of the maximum wiring swing to the distance (500 ym) between bonding wires. (3) Surface hardness: The surface hardness of the molded product just after the mold is opened is measured by a Bar col hardness testing machine (# 935 measurement). This paper scale applies to China National Standards (CNS) A4 (210X297mm) _ 16 _ ----- „-----— Ref. -----------. ^--≪ I (please read the notes on the back-if you fill out this), print the A7 ___B7 printed by Beigong Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. Print the A7 ___B7. The result shown in 2 is similar to the result obtained by conventional low-voltage conversion molding, and there is no problem here. Therefore, continuous molding can be performed for a long time. Another embodiment of the present invention is characterized by using a hoop molding Referring to FIGS. 3 to 8, a long lead frame with a part of mounted semiconductors is supplied or unwound by a reel (not shown), and the semiconductor device 12 is bonded to the lead frame 1, and the wiring is bonded to the lead frame 1. The frame 1 is guided into a die 4 by a feed guide 10, so the lead frame 1 of a fixed length is set in the die 4. The feed guide 10 is supported by the return pin 1 1. The lower end of the return pin 1 1 Supported by a support plate 18, the support plate 18 is moved up and down by a drive cylinder 16. The mold 4 includes an upper mold 2 and a lower mold 3. The upper mold 2 can be moved upward away from the lower mold 3 by a driving mechanism (not shown), and therefore, the mold 4 can be opened. The well-known injection pin 6 is slidably extended from the lower mold 3 into the cavity 34 in the mold 4. The lower end of the injection pin 6 is supported by the injection pin operation plate 17. The plate 17 is connected to the plate 18 and is moved up and down by the drive cylinder 16. Referring to FIGS. 7 and 8, a molding compound from an injection molding machine is in the mold 4 through the first runner 14 and a gate 15 to fill each cavity 34. Gate cutting pin 7 is used to switch the gate 15, the lower end of the gate cutting pin is supported by a pin support plate 19 The pin support plate 19 is moved up and down at a distance by a driving mechanism (not shown) (see circle 4), so the gate cutting pin 7 can switch the relevant gate. On the right hand side (Figure 3) is used to move another The feeding mechanism 8 of the feeding guide 8 is provided between the lower mold 3 and the feeding guide 8. In the situation shown in Fig. 3, the molding compound is injected into the mold 4 into the air (please read the precautions on the back before filling this page ) • Packed. The size of the bound paper is applicable to China National Standard (CNS) A4 (210X297mm) 17 Five DESCRIPTION OF THE INVENTION (15) The cavity 34 and the gate cutting pin 7 are operated to close the gate 15 so that each molded product (including the semiconductor 1 2 encapsulated by the resin molding compound 13) and the runner 1 4. Isolation. After the injected material is hardened, the upper mold moves upward to open the mold 4, as shown in FIG. 6. Then, as shown in FIG. 5, the drive cylinder 16 is driven to move the support plate 18 upward. As a result, it is turned back The feed guides 10 and 8 supported by the pin 1 1 move upward away from the lower mold 3. The injection pin operating plate 17 also moves upward, so that the injection pin 6 injects the relevant molded product from the associated cavity 34 in the lower mold 3. The related molded products are released from the lower mold 3. Then, the feed mechanism is operated to move the feed guide 8 in the right-hand direction, thereby moving the molded lead frame 5 to a predetermined distance in the right-hand direction, and simultaneously acting between the bending of the molded lead frame portion 5 and the lead frame portion 5 Separate. Since the main thorn formed on the periphery of the molded product is usually very thin, it can be easily removed. Printed by Beigong Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs as shown in Figure 6, after the feed guide is turned back to its initial position by the feeding mechanism 9, the drive cylinder 16 is operated to move the return pin 11 and the injection pin 6 under. The lead frame 1 is set in the lower mold 3 again, and then the upper mold 2 is moved down to close the mold 4 »The above mold is repeated on the non-molded portion 1 of the lead frame after the lead frame portion 5 has been molded before system. Figures 7 and 8 are enlarged views of the runners, gates and cavities in the mold, and show the situation immediately after molding the compound to fill the cavity 34. The injection molding compound is injected into the associated cavity 3 4 through the runner (not shown), the runner 14 and the gate 15. The lead frames 1 of the bonded semiconductors 12 are set in the cavities 34, respectively. Then, each gate cutting pin 7 moves upward 18-This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) _ 511270 A7 B7 Fifth, the invention description (l6) is equivalent to the distance of the gate height, Use this to close the gate 15. After the molding compound is hardened, the mold is opened, and the molded product is injected. The molded product hardened in the runner 14 is separated from the molded lead frame portion 5. Therefore, the 'molded lead frame portion 5 is smoothly conveyed by the feeding mechanism 9' and therefore the subsequent molding operation can be performed. In the case of no gate cutting pin 7, after the product is injected, the gate must be cut by some mechanism, or a gate must form the shape of a pin point gate or mold gate, so that it can be cut naturally and easily Break. In the embodiment of the present invention, hoop molding is used, and therefore the sequential molding process can be automatically performed in an unmanned manner. This process includes the steps of de-leading the lead frame, the step of bonding the semiconductor, and the wire bonding. The steps of setting the lead frame in the mold, the step of molding and moving the molded product, the step of separating the molded product from the '. Lead frame, and the step of bending the lead of the molded product. Therefore, the sequential steps from the depouring of the lead frame to the final processing of the molded product can be performed in one system. Example 3 Printed by the Zhengong Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy Resin (Epoxy resin equivalent 200) 'Phenolic novolak (hydroxyl equivalent 10 3), diazabicycloundecene (hardening accelerator) and fused silica, and another with a mold release agent, a dye In this example, a screw linear injection molding machine (M-3 2 manufactured by Meiki Seisakusho) was used. As shown in Figure 2, the cylinder 20 is axially and equally divided into regions _ »The heated gas paper closest to the nozzle is compliant with the Chinese National Standard (CNS) Α4 specification (210X297 mm) _ 19 _ Central Standards Bureau of the Ministry of Economic Affairs A7 B7 printed by Beigong Consumer Cooperative V. Description of the invention (17) The area I of the tank is kept at 75 ° C. The area separated from area i is kept at 65 ° C, while the other areas are kept at 3 5 ° C. Regarding injection pressure, the maximum pressure is 200 k g / cm2. The injection pressure rises to the maximum pressure in 20 seconds from the start of injection. Then, lower to 50 k g / cm 2 and hold for 5 seconds, and then operate the gate cut pin to close the gate. The relationship between injection pressure and screw position or injection pressure time is shown in Figure 1. The time period from the closing of the mold to the start of the mold is 60 seconds, and the entire molding cycle is 80 seconds. The temperature of the mold is set at 175 ° C. A mold has cavities in two cases, and each case has 10 cavities. Therefore, the mold is a twenty-cavity film. The long lead frame is supplied and supplied by the reel. IC components (16-pin double-row configuration) are bonded to each lead frame and connected by gold wire connection. These two wire frames are fed into the above-mentioned mold, and the mold automatically and continuously acts on a mold cycle of 120 seconds. The molded frame part of the lead frame is separated, and the lead wire is bent, and at the same time, the burr around the periphery of the ring-cast molded product is removed. Such burrs are very thin, and therefore they can be removed at the same time when the frame portion is separated and the lead is bent. The appearance of the molded product, filling capacity, wiring swing, and surface hardness are measured every hour. The results obtained every 5 hours are shown in Table 3. This paper scale is applicable to the Chinese National Standard (匚 奶) 84 specifications (210 father 297 mm) _ -----_------- ^ ----------- ^ tm- i (Please read the precautions on the back-fill in this page) 311270 A7 _B7 V. Description of the invention (18) Table 3 Appearance filling capacity Wiring swing surface hardness Initially in good condition Good not exceeding 5¾ 74 After 5 hours Good not exceeding 5¾ 75 1 0 hours after good and good not more than 5¾ 74 15 hours after good and good not more than 5¾ 75 2 0 hours after good and good not more than 5¾ 76 ----- ^ ---.--- reference--( Please read the precautions on the back before filling in this tribute.) Printed (measured) by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (1) Appearance; filling capacity: they are judged by visual inspection and are particularly good. The appearance inspection is about Whether it has luster. (2) Wiring swing: Soft X-ray is applied to the molded product, and the amount of swing of the combined wiring is measured (the diameter of the semi-hard gold wire is 2 5 // m and the length is 3mm) 9 Wiring swing is between the maximum wiring swing pair The ratio of the distance between the connection lines (50 0 # m) is expressed on the ratio side. (3) Surface hardness: The surface hardness of the molded product just after the mold is opened is measured by a Barcol hardness testing machine (# 935 measurement). This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm). 21 Printed by the Employees ’Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. A7 ___B7 _ 5. Description of the invention (ig) The results shown in Table 3 and the conventional low voltage conversion The results obtained by molding are similar, and there is no problem here. Therefore, continuous molding can be performed for a long time. In the embodiment of the present invention, it is apparent that the semiconductor package formed by molding the compound with epoxy resin can be continuously operated for a long time without any problem by injection molding of the hoop molding. In an embodiment of the present invention, hoop molding is used, and therefore, sequential molding processes can be automated using unmanned methods. These processes include lead frame uncasting, semiconductor bonding, and lead frame in mold. Steps of combination of setting and wiring, removal and molding of molded products, and subsequent processing of molded products "Another embodiment of the present invention is characterized in that it uses a rotary molding method. Refer to FIGS. 9 to 11 1. The rotary injection molding device 35 includes an injection molding machine 20 having a funnel 23 and a rotary table 24 associated with the injection molding machine 20 in parallel. The four mold devices 25, 26, 27, and 28 are mounted on the rotary table 24 at 90 ° intervals to each other. In FIG. 9, the nozzle 36 of the injection molding machine 20 and the runner of the mold device 25 The flow channel 32 is in communication (see FIG. 11 and filled with a molding compound in the molding device 25. Therefore, the molding compound is filled in the molding device 25 and maintained at a predetermined pressure, and at the same time, the molding compound hardens This can be done in the mold devices 26 and 27, where the mold is closed or clamped. In the mold device 28, the mold is opened to move the molded products (each containing the semiconductor element 31 encapsulated by the molding compound 30 ), And the lead frame 29 is set in the mold, and the mold is closed. This paper scale is applicable to the Chinese national standard (CNS & A4 specifications (2 丨 0X297mm) _ _ ----- r ------ meal ----------- ^-mii (please read the precautions on the back and fill in this page) A7 _B7____ printed by the Consumer Labor Cooperative of the Central Standards Bureau of the Ministry of Economy V. Invention description (20) When four When the mold device is turned back to the original position, the molding cycle of each mold device can be completed. Therefore, if the molding cycle of each mold device is 120 seconds, Here, the rotary injection molding device 35 has four stages, and this type of molding acts on a 30-second cycle, and therefore, the entire molding cycle can be significantly reduced. In particular, the epoxy resin molding compound is Thermal hardening requires a certain period of time, and it is quite difficult to reduce the period from the start of injection to the opening of the mold. In the embodiment of the present invention, since rotary molding is used, the time period can be significantly reduced. Significantly reduce the molding cycle. Furthermore, a gate cut pin 3 3 is provided in each mold, and after the molding compound is injected and filled into the mold, the gate cut pin 3 3 is operated to close the gate to remove The molded product is separated from the runner runner 32 to facilitate the removal and subsequent processing of the molded product. Usually, the molded product is separated from the lead frame and the lead of the molded product is bent simultaneously. At this time, due to The burrs formed around the molded product are usually very thin and can be easily removed. By changing the cavity shape of the mold device and / or the shape of the lead frame, a variety of semiconductors can be packaged in real time. When the setting of the lead frame and the role of the robot are automatic, continuous molding can be used without manual operation, and different types of molded products can be easily classified without error. In the embodiment of the present invention, After the molded product is removed from the mold, if the separation of the lead frame and the molded product and the subsequent processing of the molded product have a continuous effect on the molding operation, the lead frame in the mold can be executed in a system The step-by-step process from the setting to the performance of the molded product. This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) _ 23------: ------ ^ ---- -— ------ ^ ί ί (please read the precautions on the back first and fill out this book) 311270 A7 ____B7 5. Description of the invention (21) Example 4 The main components of the epoxy resin molding compound used here include One original cresol novolac epoxy resin (epoxy equivalent 200), phenolic novolac (hydroxyl equivalent 10 3), diazabicycloundecene (hardening accelerator) and fused silica, and another With a mold release agent, a dye, etc. Central Bureau of Standards of the Ministry of Economic Affairs Co-op printing station (Read precautions to fill the back side of this page) using a screw type injection molding machine line in this example (from the production Me iki Seisakusho Company, Ltd. of Μ - 3 2).. As shown in Fig. 2, the cylinder 20 is divided into areas 1 to 5 axially and equally. The area A_ of the heated cylinder closest to the nozzle is kept at 75 ° C. The area separated from area 1 is kept at 65 ° C, while the other areas and _ are kept at 35 ° C, respectively. Regarding the injection pressure, the maximum pressure is 200 kg / cm2 »The injection pressure rises to the maximum pressure in 20 seconds from the start of injection, and then decreases to 50 kg / cm 2 and remains for 5 seconds, and then the gate is operated Cut the pin to close the gate. The relationship between injection pressure and screw position or injection pressure time is shown in Figure 1. The time period from the closing of the mold to the opening of the mold is 60 seconds, and the entire molding cycle is 80 seconds. Each mold device has two rows of cavities, and each row has 10 cavities, so the mold device is a twenty-cavity membrane. The two lead frames with bonded IC components (16-pin double-row configuration) are combined by gold wire wiring and set in the mold device. The mold temperature is set at 175 ° C. The four-mode device is installed on a rotating table and is separated from each other by 90 °. The molding operation can refer to Figure 9 and the same execution as above, and the paper size of the rotating table is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) _ 24-A7 B7 Printed by the Central Standard Falcon Bureau of the Ministry of Economic Affairs Consumer Cooperative System V. Description of the invention (22) The time for one revolution is 120 seconds and the end time is 30 seconds. The setting of these wireframes and the transfer of molded products. In both cases, there is no problem separating each lead frame, and the gross profit around the lead is also removed immediately. The separation of the frame part and the bending view of the lead, filling capacity, wiring swing, and the results obtained every 5 hours are shown in the table and the continuous molding can be applied when the molding device at each stage is stopped. These operations can be removed by manual operation or by robots. The molded product is bent by. These gross margins, which are ring cast on each molded product, are very thin and can therefore be removed instantly at the time. Outside the packaged product and the surface hardness is measured every hour. 4 is shown. 4 Appearance filling ability Wiring swing surface hardness is initially good and good not more than 5¾ 76 good and good not more than 5% after 5 hours 76 1 0 good and good not more than 5% after 75 hours 75 1 good and good not more than 5% after 75 hours 75 2 0 After hours, good and good no more than 5% 77 This paper wave scale is suitable for China National Standardization (CNS) A4 specifications (2 丨 0X297 public) I. mn IT I — J n I 1---II n T U3-s (please Read the precautions on the back first-s fill in this education) -25-311270 A7 _B7_ printed by Beigong Consumer Cooperative of the Central Bureau of Economic Affairs of the Ministry of Economy V. Description of the invention (23) (Measurement) (1) Appearance; filling capacity: Judging by visual inspection, and it is particularly good, the appearance inspection is about whether it has luster. (2) Wiring swing: Soft X-rays are applied to the molded product, and the swing amount of the combined wiring is measured (the diameter of the semi-hard gold wire is 25mm and the length is 3mm). Wiring swing is expressed as the ratio of the maximum wiring swing to the distance between the bonding wires (50 0 #m). (3) Surface hardness: The surface hardness of the molded product just after the mold is opened is measured by the -Barcol hardness testing machine (# 9 3 5 measurement). This result is the same as that obtained by conventional low-voltage conversion molding, which means that there is no problem with this embodiment. Therefore, the automatic continuous molding including the sequential processing steps from the setting of the lead frame in the mold to the subsequent processing of the molded product can take a long time. According to the present invention, by injection molding of a rotational molding type, a semiconductor package formed with an epoxy resin molding compound can continuously act for a long time without any problem. Through the automatic action or the setting of the lead frame by the robot action, the removal of the molded product and the subsequent processing of the molded product can automatically complete the molding operation. The molding compound in powder or granular form can be supplied to an injection molding machine, and therefore, it is not necessary to perform into a sheet shape as in conversion molding. Therefore, the equipment and time required for forming the sheet can be omitted. Since no pretreatment such as sheet formation is required, it is highly unlikely that impurities will enter the molding compound. In addition, non-runner molding and non-runner runner molding can be used. Therefore, the proportion of hardened material (waste) of non-molded products can be significantly reduced. The size of this paper is applicable to the Chinese National Standard (CNS) A4 (210 X 297mm) (please read the notes on the back and fill in the text).