TW232051B - Measuring device of heating power of circuit module - Google Patents

Abstract

A heat power measuring device installed on the component of circuit board,which the radiation surface departs from the circuit board, includes: - a tubular body that can be placed on circuit component to orient thexis of the body approximately vertical to the plane of circuit board inttempt to build a heat conduction path to let most of the power of theomponent surface flow through this body; - a highly heat-conductive first separation board where is located in theody but some distance away from the radiation surface of the componenterving as the top of the first enclosed chamber and the bottom of theecond enclosed chamber; - a highly heat-conductive second separation board where is located inhe body serving as the top of the second enclosed chamber. - a heat conduction device where is located in the first enclosed chamberor providing better heat conduction path between the component and theirst separation board; - a heat conduction substance that is stuffed in the above-mentionedecond enclosed chamber to generate temperature difference between theirst and the second separation board when heat is passing through; - a device, which measures the temperature difference of theeat-conductive substance passing through the second enclosed chamber,onsisting of the first temperature sensing component for measuring theemperature of the first separation board and the second temperatureensing component for measuring the temperature of the second separationoard; Therefore, the temperature difference measured according to the heatresistance in the second enclosed chamber and temperature measuring devicecan be used to calculate the heat power arising from the circuit componentsurface.