TW202601159A - Optical laminate, method of manufacturing optical laminate and article - Google Patents
Optical laminate, method of manufacturing optical laminate and articleInfo
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Abstract
本發明提供一種光學積層體及該光學積層體之製造方法,上述光學積層體長期顯示出優異之耐鹼性。本發明之光學積層體具備基材、直接或介隔其他層而設置於基材上之高折射率層、形成於高折射率層上且包含SiO2作為主成分之低折射率層、及形成於低折射率層上之防污層;本發明之光學積層體之製造方法具有高折射率層形成步驟、於乾燥氛圍下形成低折射率層之低折射率層形成步驟、對低折射率層進行電漿處理之電漿處理步驟、及於表面形成防污層之防污層形成步驟,於電漿處理步驟中,於導入水蒸氣及氬氣之混合氣體之環境下,以4400 W/m2以上且18000 W/m2以下之電極功率密度對低折射率層進行電漿處理;且該光學積層體中,自防污層側藉由X射線光電子分析(ESCA)所測得之SiO2之結合能為103.25 eV以下。The present invention provides an optical laminate and a method for manufacturing the optical laminate, wherein the optical laminate exhibits excellent alkali resistance over a long period of time. The optical laminate of this invention comprises a substrate, a high refractive index layer disposed on the substrate directly or interposed of other layers, a low refractive index layer formed on the high refractive index layer and containing SiO2 as the main component, and an antifouling layer formed on the low refractive index layer. The manufacturing method of the optical laminate of this invention includes a high refractive index layer formation step, a low refractive index layer formation step of forming the low refractive index layer in a dry atmosphere, a plasma treatment step of plasma treating the low refractive index layer, and an antifouling layer formation step of forming an antifouling layer on the surface. In the plasma treatment step, in an environment where a mixture of water vapor and argon is introduced, the heat exchanger operates at a temperature of 4400 W/ m² or higher and 18000 W/m². The low refractive index layer is plasma-treated with an electrode power density of 2 or less; and the binding energy of SiO2 on the self-fouling layer side, as measured by X-ray photoelectron analysis (ESCA), is less than 103.25 eV.
Description
本發明係關於一種光學積層體、光學積層體之製造方法及物品。本案係基於2024年2月19日於日本提出申請之特願2024-023257號主張優先權,並將其內容援用至本文中。This invention relates to an optical laminate, a method for manufacturing an optical laminate, and an article thereof. This application is based on Japanese Patent Application No. 2024-023257 filed on February 19, 2024, the contents of which are incorporated herein by reference.
抗反射膜係應用於各種設備以防止表面反射。例如應用於抬頭顯示器等車載膜或智慧型手機之觸控面板等。具有代表性之抗反射膜係以如下方式形成之光學積層體,即,於透明基材上形成硬塗層,於硬塗層上交替形成高折射率層及低折射率層作為光學功能層,並於光學功能層上形成包含氟化合物之防污層。Anti-reflective films are used in various devices to prevent surface reflections. Examples include automotive films for head-up displays and touch panels for smartphones. A representative anti-reflective film is an optical laminate formed as follows: a hard coating is formed on a transparent substrate; high-refractive-index layers and low-refractive-index layers are alternately formed on the hard coating as optical functional layers; and an anti-fouling layer containing fluorine compounds is formed on the optical functional layers.
作為由光學積層體構成之抗反射膜之製造方法,例如已知如下方法,即,準備含有折射率不同之微粒子之樹脂溶液,對折射率不同之層依次塗佈上述樹脂溶液並使其乾燥而獲得積層體(例如專利文獻1)。又,已知藉由濺鍍、蒸鍍等於基材上形成光學功能層,進而藉由蒸鍍等形成防污層之方法(例如專利文獻2、專利文獻3、專利文獻4、專利文獻5)。於專利文獻2及專利文獻3中,光學功能層中距基材最遠之最外層係形成為低折射率層之包含SiO2作為主成分之層,該低折射率層係藉由濺鍍所形成,包含氟系化合物之防污層係藉由塗佈或蒸鍍於形成低折射率層後形成於該低折射率層上。As a method for manufacturing an antireflective film composed of an optical laminate, for example, the following method is known: a resin solution containing microparticles with different refractive indices is prepared, layers with different refractive indices are sequentially coated with the resin solution, and the layer is dried to obtain a laminate (e.g., Patent 1). Furthermore, methods are known for forming an optical functional layer on a substrate by sputtering, evaporation, etc., and then forming an antifouling layer by evaporation, etc. (e.g., Patents 2, 3, 4, 5). In patent documents 2 and 3, the outermost layer of the optical functional layer that is furthest from the substrate is formed as a low refractive index layer containing SiO2 as the main component. The low refractive index layer is formed by sputtering. The antifouling layer containing fluorine compounds is formed on the low refractive index layer by coating or evaporation after the low refractive index layer is formed.
又,於專利文獻2及專利文獻3中,揭示有如下內容:為形成防污層等有機層及無機層之密接性較高之光學積層體,於形成無機層時,進行將水蒸氣用作反應性氣體之反應性濺鍍。[先前技術文獻][專利文獻]Furthermore, Patent Documents 2 and 3 disclose the following: To form an optically laminate with high adhesion between organic and inorganic layers, such as an antifouling layer, reactive sputtering is performed during the formation of the inorganic layer, using water vapor as the reactive gas. [Prior Art Documents][Patent Documents]
[專利文獻1]日本專利特開2015-197634號公報[專利文獻2]日本專利特開2012-251193號公報[專利文獻3]日本專利特開2014-43600號公報[專利文獻4]日本專利特開2009-117569號公報[專利文獻5]國際公開第2015/097898號[Patent Document 1] Japanese Patent Application Publication No. 2015-197634 [Patent Document 2] Japanese Patent Application Publication No. 2012-251193 [Patent Document 3] Japanese Patent Application Publication No. 2014-43600 [Patent Document 4] Japanese Patent Application Publication No. 2009-117569 [Patent Document 5] International Publication No. 2015/097898
[發明所欲解決之問題]抗反射膜預計會被使用者接觸,此時,會有皮脂或粉塵等污垢附著之情形。尤其是皮脂所致之污垢會對視認性造成影響。構成防污層之氟系化合物與構成無機層之基材結合,發揮抑制此種污垢之作用。於污垢附著於抗反射膜表面之情形時,考慮藉由利用鹼性化學品來去除污垢之處理進行維護。應用抗反射膜之抬頭顯示器或智慧型手機之觸控面板會長期使用,因此需要長期具有耐鹼性。[Problem Solved by the Invention] Anti-reflective films are expected to be touched by users, during which time dirt such as sebum or dust may adhere. Sebum-induced dirt, in particular, can affect visibility. The fluorine-based compound constituting the anti-fouling layer combines with the substrate constituting the inorganic layer to inhibit this dirt buildup. When dirt adheres to the surface of the anti-reflective film, maintenance is considered using alkaline chemicals to remove the dirt. Since head-up displays or smartphone touch panels using anti-reflective films are used for extended periods, long-term alkalinity resistance is required.
此處,於如專利文獻1及專利文獻2之於水蒸氣環境下藉由濺鍍形成無機層之情形時,認為於無機層內部形成有羥基。已知包含SiO2等氧化物之無機層會因H2O之水解而溶解。隨著無機層之溶解之進行,會有折射率等光學特性發生變化之情形。又,無機層之溶解因鹼金屬取代羥基之H元素而容易進行。In cases where an inorganic layer is formed by sputtering in a steam environment, as described in Patents 1 and 2, it is assumed that hydroxyl groups are formed within the inorganic layer. It is known that inorganic layers containing oxides such as SiO₂ dissolve due to the hydrolysis of H₂O . As the inorganic layer dissolves, optical properties such as the refractive index change. Furthermore, the dissolution of the inorganic layer is facilitated by the substitution of hydroxyl groups by alkali metals with hydrogen elements.
本發明係鑒於上述情況而成之發明,目的在於提供一種長期顯示出優異之耐鹼性之光學積層體、光學積層體之製造方法及物品。The present invention is made in view of the above circumstances, and aims to provide an optical laminate that exhibits excellent alkali resistance over a long period of time, a method for manufacturing the optical laminate, and an article thereof.
[解決問題之技術手段]本發明者發現,藉由於無機層之最表面形成與無機層之基材結合之羥基,可使防污層之基材更易添加,且於在無機層內部形成過多羥基之情形時,有時無法獲得優異之耐鹼性。即,為了解決上述問題,本發明提供以下方法。[Technical Means for Solving the Problem] The inventors have discovered that by forming hydroxyl groups that bond with the substrate of the inorganic layer on the outermost surface of the inorganic layer, it is easier to add substrate to the antifouling layer. However, when too many hydroxyl groups are formed inside the inorganic layer, excellent alkali resistance is sometimes not obtained. Therefore, to solve the above problems, the present invention provides the following method.
(1)本發明之一形態之光學積層體之製造方法所製造之光學積層體具備:基材;直接或介隔其他層而設置於上述基材上之高折射率層;形成於上述高折射率層上且包含SiO2作為主成分之低折射率層;及形成於上述低折射率層上之防污層;上述光學積層體之製造方法具有形成高折射率層之高折射率層形成步驟、於乾燥氛圍下形成上述低折射率層之低折射率層形成步驟、對上述低折射率層進行電漿處理之電漿處理步驟、及於表面形成防污層之防污層形成步驟,且於上述電漿處理步驟中,於導入水蒸氣及氬氣之混合氣體之環境下,以度4400 W/m2以上且18000 W/m2以下之電極功率密對上述低折射率層進行電漿處理。(1) The optical laminate manufactured by the method of manufacturing an optical laminate of one form of the present invention comprises: a substrate; a high refractive index layer disposed on the substrate directly or interposed of other layers; and SiO2 formed on the high refractive index layer. 2. A low refractive index layer as the main component; and an antifouling layer formed on the low refractive index layer; the manufacturing method of the optical laminate includes a high refractive index layer forming step of forming a high refractive index layer, a low refractive index layer forming step of forming the low refractive index layer in a dry atmosphere, a plasma treatment step of plasma treatment of the low refractive index layer, and an antifouling layer forming step of forming an antifouling layer on the surface, wherein in the plasma treatment step, the low refractive index layer is plasma treated in an environment in which a mixture of water vapor and argon is introduced, and the electrode power density is 4400 W/ m² or higher and 18000 W/ m² or lower.
(2)上述(1)之光學積層體之製造方法中,於上述電漿處理步驟中,亦可將導入之水蒸氣及氬氣之混合氣體中水蒸氣之流量比率設為10%以上且90%以下。(2) In the manufacturing method of the optical laminate in (1) above, in the plasma processing step above, the flow rate ratio of water vapor in the mixed gas of water vapor and argon can also be set to 10% or more and 90% or less.
(3)上述(1)或(2)之上述電漿處理步驟中之電極功率密度亦可為7000 W/m2以上且14000 W/m2以下。(3) The electrode power density in the plasma treatment steps of (1) or (2) above can also be above 7000 W/m 2 and below 14000 W/m 2 .
(4)上述(1)至(3)之光學積層體之製造方法中,於上述低折射率層形成步驟中,亦可藉由濺鍍法形成上述低折射率層。(4) In the manufacturing method of the optical laminate in (1) to (3) above, the low refractive index layer can also be formed by sputtering in the step of forming the low refractive index layer.
(5)上述(1)至(4)之光學積層體之製造方法中,於上述防污層形成步驟中,亦可藉由蒸鍍法形成上述防污層,且上述防污層包含具有烷氧基矽烷基及氟改性有機基之化合物。(5) In the manufacturing method of the optical laminate in (1) to (4) above, the antifouling layer can also be formed by vapor deposition in the antifouling layer forming step, and the antifouling layer contains a compound having alkoxysilyl and fluorine-modified organic groups.
(6)上述(1)至(5)之光學積層體之製造方法中,於上述電漿處理步驟中,對上述低折射率層進行電漿處理之空間內之氛圍中H2O之比率亦可為6.5%以上且50%以下。(6) In the manufacturing method of the optical laminate in (1) to (5) above, in the plasma treatment step above, the ratio of H2O in the atmosphere in the space where the low refractive index layer is plasma treated can be 6.5% or more and 50% or less.
(7)本發明之一形態之光學積層體具備:基材;直接或介隔其他層而形成於上述基材上之高折射率層;形成於上述高折射率層上且包含SiO2作為主成分之低折射率層;及形成於上述低折射率層上之防污層;滴下0.1(mol/L)之NaOH水溶液後,於55℃下靜置4小時後,下述式(1)所表示之ΔE值為8以下。ΔE﹡ ab={(L﹡ 2-L﹡ 1)2+(a﹡ 2-a﹡ 1)2+(b﹡ 2-b﹡ 1)2}1/2・・・(1)(式中,L﹡ 1:滴下NaOH水溶液前之亮度,L﹡ 2:自滴下NaOH水溶液起經過特定時間後之亮度,a﹡ 1:滴下NaOH水溶液前之色度,a﹡ 2:自滴下NaOH水溶液起靜置特定時間後之色度,b﹡ 1:滴下NaOH水溶液前之色度,b﹡ 2:自滴下NaOH水溶液起靜置特定時間後之色度)(7) One form of optical laminate of the present invention comprises: a substrate; a high refractive index layer formed on the substrate directly or through other layers; a low refractive index layer formed on the high refractive index layer and containing SiO2 as the main component; and an antifouling layer formed on the low refractive index layer; after dropping 0.1 (mol/L) NaOH aqueous solution and standing at 55°C for 4 hours, the ΔE value expressed by the following formula (1) is 8 or less. ΔE * ab ={(L * 2 -L * 1 ) 2 +(a * 2 -a * 1 ) 2 +(b * 2 -b * 1 ) 2 } 1/2・・・(1)(where, L * 1 : brightness before the NaOH aqueous solution is added, L * 2 : brightness after a specific time has elapsed since the NaOH aqueous solution was added, a * 1 : chromaticity before the NaOH aqueous solution was added, a * 2 : chromaticity after a specific time has elapsed since the NaOH aqueous solution was added, b * 1 : chromaticity before the NaOH aqueous solution was added, b * 2 : chromaticity after a specific time has elapsed since the NaOH aqueous solution was added)
(8)上述(7)之光學積層體中,自上述防污層側藉由X射線光電子分析(ESCA)所測得之SiO2之結合能亦可為103.25 eV以下。(8) In the optical laminate described in (7) above, the binding energy of SiO2 measured by X-ray photoelectron analysis (ESCA) from the antifouling layer side can also be below 103.25 eV.
(9)於上述(7)及(8)之光學積層體中,亦可為上述高折射率層包含第一金屬之氧化物,上述低折射率層包含第二金屬之氧化物,且藉由利用ESCA之測定所檢測出之金屬元素僅為上述第一金屬元素及上述第二金屬元素。(9) In the optical laminates of (7) and (8) above, the high refractive index layer may contain an oxide of the first metal, the low refractive index layer may contain an oxide of the second metal, and the metal elements detected by the determination using ESCA may be only the first metal element and the second metal element.
(10)上述(7)及(8)之光學積層體亦可於上述基材與上述高折射率層之間進而具備密接層,上述高折射率層包含第一金屬之氧化物,上述低折射率層包含第二金屬之氧化物,上述密接層包含第三金屬之氧化物,且藉由利用ESCA之測定所檢測出之金屬元素僅為上述第一金屬元素、上述第二金屬元素及上述第三金屬元素。(11)本發明之一形態之物品具備如上述(7)至(9)中任一項之光學積層體。(10) The optical laminates of (7) and (8) above may also have a close-fitting layer between the substrate and the high refractive index layer, wherein the high refractive index layer contains an oxide of a first metal, the low refractive index layer contains an oxide of a second metal, the close-fitting layer contains an oxide of a third metal, and the metal elements detected by ESCA measurement are only the first metal element, the second metal element and the third metal element. (11) An article of one form of the present invention has an optical laminate as described in any one of (7) to (9) above.
[發明之效果]根據本發明,可提供一種長期顯示出優異之耐鹼性之光學積層體、光學積層體之製造方法及物品。[Effects of the Invention] According to the present invention, an optical laminate exhibiting excellent alkali resistance over a long period of time, a method for manufacturing the optical laminate, and an article thereof can be provided.
以下,適當參照圖式對本實施方式進行詳細說明。為使本發明之特徵易於理解,以下之說明中所使用之圖式存在方便起見而放大顯示特徵部分之情形,且各構成要素之尺寸比率等有時與實際情況不同。以下說明中所例示之材質、尺寸等為一例,本發明並不限定於其等,而可於發揮其效果之範圍內適當進行變更而實施。The present invention will now be described in detail with appropriate reference to the accompanying drawings. To facilitate understanding of the features of the invention, the drawings used in the following description may show enlarged portions of the features, and the dimensions and proportions of the constituent elements may sometimes differ from the actual situation. The materials and dimensions illustrated in the following description are examples only; the invention is not limited to these examples and may be appropriately modified and implemented within the scope of achieving its intended effect.
[光學積層體]圖1係表示本發明之一實施方式之光學積層體構成之一例的剖視圖。圖1所示之光學積層體101係依序積層透明基材11、硬塗層12、密接層13、包含高折射率層14a及低折射率層14b之光學功能層14、及防污層15而成者。於光學積層體101中,高折射率層14a位於靠近透明基材11一側,低折射率層14b較高折射率層14a遠離透明基材11。[Optical Laminate] FIG1 is a cross-sectional view showing an example of the configuration of an optical laminate according to an embodiment of the present invention. The optical laminate 101 shown in FIG1 is formed by sequentially laminating a transparent substrate 11, a hard coating layer 12, a bonding layer 13, an optical functional layer 14 including a high refractive index layer 14a and a low refractive index layer 14b, and an antifouling layer 15. In the optical laminate 101, the high refractive index layer 14a is located close to the transparent substrate 11, and the low refractive index layer 14b is farther away from the transparent substrate 11 than the high refractive index layer 14a.
圖2係圖1之另一例之光學積層體之剖視圖。圖2所示之光學積層體102具有交替地積層有複數個高折射率層14a及低折射率層14b之光學功能層14。於光學積層體102中,光學功能層14中於最靠近透明基材11之位置設置有高折射率層14a,於最遠離透明基材11之位置設置有低折射率層14b。即,於圖1及圖2之任一例中,防污層15均與光學功能層14所具有之低折射率層14b接觸。低折射率層14b為包含SiO2作為主成分之層。Figure 2 is a cross-sectional view of another example of the optical laminate shown in Figure 1. The optical laminate 102 shown in Figure 2 has an optical functional layer 14 with alternating layers of a plurality of high-refractive-index layers 14a and low-refractive-index layers 14b. In the optical laminate 102, the high-refractive-index layer 14a is disposed closest to the transparent substrate 11, and the low-refractive-index layer 14b is disposed furthest from the transparent substrate 11. That is, in either Figure 1 or Figure 2, the antifouling layer 15 is in contact with the low-refractive-index layer 14b of the optical functional layer 14. The low-refractive-index layer 14b is a layer containing SiO2 as the main component.
本發明之光學積層體具備基材(透明基材11)、及直接或介隔其他層而形成於基材上之高折射率層14a、形成於高折射率層14a上且包含SiO2作為主成分之低折射率層14b及形成於低折射率層14b上之防污層15,且於滴下0.1(mol/L)之NaOH水溶液並於55℃下靜置4小時後,下述式(1)所表示之ΔE值為8以下。光學積層體之亮度、色度等光學特性係如下文所述般藉由積分球分光測色計進行測定。The optical laminate of this invention comprises a substrate (transparent substrate 11), a high refractive index layer 14a formed on the substrate directly or intervening in other layers, a low refractive index layer 14b formed on the high refractive index layer 14a and containing SiO2 as the main component, and an antifouling layer 15 formed on the low refractive index layer 14b. After dropping 0.1 (mol/L) NaOH aqueous solution and standing at 55°C for 4 hours, the ΔE value expressed by the following formula (1) is 8 or less. The optical properties of the optical laminate, such as brightness and chromaticity, are measured by an integrating sphere spectrophotometer as described below.
ΔE﹡ ab={(L﹡ 2-L﹡ 1)2+(a﹡ 2-a﹡ 1)2+(b﹡ 2-b﹡ 1)2}1/2・・・(1)(式中,L﹡ 1:滴下NaOH水溶液前之亮度,L﹡ 2:自滴下NaOH水溶液起經過特定時間後之亮度,a﹡ 1:滴下NaOH水溶液前之色度,a﹡ 2:自滴下NaOH水溶液起靜置特定時間後之色度,b﹡ 1:滴下NaOH水溶液前之色度,b﹡ 2:自滴下NaOH水溶液起靜置特定時間後之色度)ΔE * ab ={(L * 2 -L * 1 ) 2 +(a * 2 -a * 1 ) 2 +(b * 2 -b * 1 ) 2 } 1/2・・・(1)(where, L * 1 : brightness before the NaOH aqueous solution is added, L * 2 : brightness after a specific time has elapsed since the NaOH aqueous solution was added, a * 1 : chromaticity before the NaOH aqueous solution was added, a * 2 : chromaticity after a specific time has elapsed since the NaOH aqueous solution was added, b * 1 : chromaticity before the NaOH aqueous solution was added, b * 2 : chromaticity after a specific time has elapsed since the NaOH aqueous solution was added)
於在光學積層體中介隔其他層而於基材上形成高折射率層14a情形時,例如於基材及高折射率層14a之間形成硬塗層12及密接層13。光學積層體101、102例如包含透明基材11、硬塗層12、密接層13、光學功能層14及防污層15。光學積層體中,例如自防污層15側藉由X射線光電子分析(ESCA)所測得之SiO2之結合能為103.25 eV以下。When a high-refractive-index layer 14a is formed on a substrate while other layers are interposed in the optical laminate, a hard coating layer 12 and a bonding layer 13 are formed between the substrate and the high-refractive-index layer 14a, for example. Optical laminates 101 and 102, for example, include a transparent substrate 11, a hard coating layer 12, a bonding layer 13, an optical functional layer 14, and an antifouling layer 15. In the optical laminate, for example, the binding energy of SiO₂ measured by X-ray photoelectron analysis (ESCA) from the antifouling layer 15 side is 103.25 eV or less.
透明基材11可由能透過可見光範圍之光之透明材料所形成。例如,可將塑膠膜較佳地用作透明基材11。作為塑膠膜之構成材料之具體例,可例舉:聚酯系樹脂、乙酸酯系樹脂、聚醚碸系樹脂、聚碳酸酯系樹脂、聚醯胺系樹脂、聚醯亞胺系樹脂、聚烯烴系樹脂、(甲基)丙烯酸系樹脂、聚氯乙烯系樹脂、聚偏二氯乙烯系樹脂、聚苯乙烯系樹脂、聚乙烯醇系樹脂、聚芳酯系樹脂、聚苯硫醚系樹脂。The transparent substrate 11 may be formed of a transparent material that allows light to pass through the visible light range. For example, a plastic film may preferably be used as the transparent substrate 11. Specific examples of materials constituting the plastic film include: polyester resins, acetate resins, polyether ether resins, polycarbonate resins, polyamide resins, polyimide resins, polyolefin resins, (meth)acrylic resins, polyvinyl chloride resins, polyvinylidene chloride resins, polystyrene resins, polyvinyl alcohol resins, polyarylate resins, and polyphenylene sulfide resins.
再者,本發明中所謂之「透明材料」係指於不損害本發明之效果之範圍內,使用波長區域之光透過率為80%以上之材料。又,於本實施方式中,「(甲基)丙烯酸」意指甲基丙烯酸及丙烯酸。Furthermore, the term "transparent material" in this invention refers to a material with a light transmittance of 80% or more in the wavelength range, without impairing the effectiveness of this invention. Also, in this embodiment, "(meth)acrylic acid" means methacrylic acid and acrylic acid.
只要不嚴重損害光學特性,透明基材11中亦可包含補強材料。補強材料例如為纖維素奈米纖維、奈米氧化矽等。尤其可將聚酯系樹脂、乙酸酯系樹脂、聚碳酸酯系樹脂、聚烯烴系樹脂較佳地用作補強材料。具體而言,可將三乙醯纖維素(TAC)基材較佳地用作補強材料。又,透明基材11亦可使用作為無機基材之玻璃膜。The transparent substrate 11 may also contain reinforcing materials, provided that the optical properties are not severely impaired. Reinforcing materials may include, for example, cellulose nanofibers or nano-silica. Polyester resins, acetate resins, polycarbonate resins, and polyolefin resins are particularly preferred as reinforcing materials. Specifically, triacetyl cellulose (TAC) substrates are preferred as reinforcing materials. Furthermore, the transparent substrate 11 can also be used as a glass film, which is an inorganic substrate.
若塑膠膜為TAC基材,則於在其一面側形成硬塗層12時,會形成構成硬塗層12之成分之一部分滲透而成之滲透層。其結果為,透明基材11與硬塗層12之密接性變得良好,並且可抑制由彼此之層間折射率差引起之干涉條紋之產生。If the plastic film is a TAC substrate, when the hard coating layer 12 is formed on one side, a permeation layer is formed by the partial permeation of one of the components constituting the hard coating layer 12. As a result, the adhesion between the transparent substrate 11 and the hard coating layer 12 becomes good, and the generation of interference fringes caused by the difference in refractive index between the layers can be suppressed.
透明基材11亦可為已賦予光學功能及/或物理功能之膜。作為具有光學功能及/或物理功能之膜之例,可例舉偏光板、相位差補償膜、熱線阻斷膜、透明導電膜、增亮膜、阻氣性提昇膜等。The transparent substrate 11 can also be a film that has been endowed with optical and/or physical functions. Examples of films with optical and/or physical functions include polarizing plates, phase difference compensation films, thermal line blocking films, transparent conductive films, brightness enhancement films, and gas barrier enhancement films.
透明基材11之厚度並無特別限定,例如較佳為25 μm以上。透明基材11之膜厚更佳為40 μm以上。若透明基材11之厚度為25 μm以上,則可確保基材本身之剛性,即便對光學積層體101、102施加應力,亦不易產生褶皺。又,若透明基材11之厚度為25 μm以上,則即便於透明基材11上連續地形成硬塗層12,亦不易出現褶皺,製造方面之擔憂較少,故而較佳。若透明基材11之厚度為40 μm以上,則更不易出現褶皺,故而較佳。The thickness of the transparent substrate 11 is not particularly limited, but is preferably 25 μm or more. The film thickness of the transparent substrate 11 is more preferably 40 μm or more. If the thickness of the transparent substrate 11 is 25 μm or more, the rigidity of the substrate itself can be ensured, and wrinkles are less likely to occur even when stress is applied to the optical laminates 101 and 102. Furthermore, if the thickness of the transparent substrate 11 is 25 μm or more, wrinkles are less likely to occur even when a hard coating layer 12 is continuously formed on the transparent substrate 11, reducing manufacturing concerns and thus being preferable. If the thickness of the transparent substrate 11 is 40 μm or more, wrinkles are even less likely to occur, and therefore is preferable.
於製造時利用輥來實施之情形時,透明基材11之厚度較佳為1000 μm以下,更佳為600 μm以下。若透明基材11之厚度為1000 μm以下,則易於將製造中途之光學積層體101、102及製造後之光學積層體101、102捲成輥狀,可高效地製造光學積層體101、102。又,若透明基材11之厚度為1000 μm以下,則可實現光學積層體101、102之薄膜化、輕量化。若透明基材11之厚度為600 μm以下,則可更高效地製造光學積層體101、102,並且可進一步薄膜化、輕量化,故而較佳。When using rollers during manufacturing, the thickness of the transparent substrate 11 is preferably 1000 μm or less, and more preferably 600 μm or less. If the thickness of the transparent substrate 11 is 1000 μm or less, it is easier to roll the optical laminates 101 and 102 during and after manufacturing into a roller shape, allowing for efficient manufacturing of the optical laminates 101 and 102. Furthermore, if the thickness of the transparent substrate 11 is 1000 μm or less, it is possible to achieve thin-film and lightweight optical laminates 101 and 102. If the thickness of the transparent substrate 11 is 600 μm or less, it is even more efficient to manufacture the optical laminates 101 and 102, and further thin-film and lightweight manufacturing is possible, which is therefore preferable.
亦可對透明基材11之表面預先實施濺鍍、電暈放電、紫外線照射、電子束照射、化學處理、氧化等蝕刻處理及/或底塗處理。藉由預先實施該等處理,可提高與形成於透明基材11上之硬塗層12之密接性。又,亦較佳為,於在透明基材11上形成硬塗層12之前,視需要藉由對透明基材11之表面進行溶劑清洗、超音波清洗等,而對透明基材11之表面除塵,使其淨化。Alternatively, the surface of the transparent substrate 11 can be pre-treated with etching processes such as sputtering, corona discharge, ultraviolet irradiation, electron beam irradiation, chemical treatment, oxidation, and/or primer treatment. By performing these treatments in advance, the adhesion to the hard coating layer 12 formed on the transparent substrate 11 can be improved. Furthermore, it is also preferable that, before forming the hard coating layer 12 on the transparent substrate 11, the surface of the transparent substrate 11 can be cleaned by solvent cleaning, ultrasonic cleaning, etc., as needed, to remove dust and purify the surface of the transparent substrate 11.
硬塗層12可使用公知之硬塗層。硬塗層12可為僅由黏合劑樹脂組成者,亦可為包含黏合劑樹脂及不損害透明性之範圍內之填料者。填料可使用由有機物組成者,可使用由無機物組成者,亦可使用由有機物及無機物組成者。The hard coating 12 can be any known hard coating. The hard coating 12 can be composed solely of adhesive resin, or it can include adhesive resin and fillers within the scope of not impairing transparency. The fillers can be composed of organic materials, inorganic materials, or a combination of organic and inorganic materials.
硬塗層12所使用之黏合劑樹脂較佳為具有透明性者,例如可使用作為藉由紫外線、電子束來硬化之樹脂之游離輻射硬化型樹脂、熱塑性樹脂、熱硬化性樹脂等。The adhesive resin used in the hard coating 12 is preferably transparent, such as free radiation-curing resin, thermoplastic resin, or thermosetting resin, which are resins that are cured by ultraviolet light or electron beams.
用於硬塗層12之黏合劑樹脂之游離輻射硬化型樹脂可例舉(甲基)丙烯酸乙酯、(甲基)丙烯酸乙基己酯、苯乙烯、甲基苯乙烯、N-乙烯基吡咯啶酮等。又,關於作為具有2個以上之不飽和鍵之游離輻射硬化型樹脂之化合物,例如可例舉:三羥甲基丙烷三(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、二丙二醇二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、二-三羥甲基丙烷四(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、三季戊四醇八(甲基)丙烯酸酯、四季戊四醇十(甲基)丙烯酸酯、異三聚氰酸三(甲基)丙烯酸酯、異三聚氰酸二(甲基)丙烯酸酯、聚酯三(甲基)丙烯酸酯、聚酯二(甲基)丙烯酸酯、雙酚二(甲基)丙烯酸酯、雙甘油四(甲基)丙烯酸酯、二(甲基)丙烯酸金剛烷酯、二(甲基)丙烯酸異𦯉酯、二環戊烷二(甲基)丙烯酸酯、三環癸烷二(甲基)丙烯酸酯、二-三羥甲基丙烷四(甲基)丙烯酸酯等多官能化合物等。其中,可較佳地使用季戊四醇三丙烯酸酯(PETA)、二季戊四醇六丙烯酸酯(DPHA)及季戊四醇四丙烯酸酯(PETTA)。再者,「(甲基)丙烯酸酯」係指甲基丙烯酸酯及丙烯酸酯。又,游離輻射硬化型樹脂亦可使用將上述化合物經PO(環氧丙烷)、EO(環氧乙烷)、CL(己內酯)等改性而成者。Examples of free radiation-curing resins used as adhesive resins in hard coating 12 include ethyl methacrylate, ethylhexyl methacrylate, styrene, methylstyrene, and N-vinylpyrrolidone. Furthermore, examples of compounds that are free radiation-curing resins having two or more unsaturated bonds include: trihydroxymethylpropane tri(meth)acrylate, tripropylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,6-hexanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, trihydroxymethylpropane tri(meth)acrylate, and di-trihydroxymethylpropane tetra(meth)acrylate. Multifunctional compounds such as pentaerythritol pentamethacrylate, pentaerythritol octamethacrylate, pentaerythritol decamethacrylate, trimethocyanate trimethacrylate, dimethocyanate dimethacrylate, polyester trimethacrylate, polyester dimethacrylate, bisphenol dimethacrylate, diglycerol tetramethacrylate, diamond dimethacrylate, isomethacrylate, dicyclopentane dimethacrylate, tricyclodecane dimethacrylate, and di-trihydroxymethylpropane tetramethacrylate are also mentioned. Among these, pentaerythritol triacrylate (PETA), pentaerythritol hexaacrylate (DPHA), and pentaerythritol tetraacrylate (PETTA) are preferred. Furthermore, "(meth)acrylate" refers to methacrylates and acrylates. Furthermore, free radiation-curing resins can also be made by modifying the above compounds with PO (propylene oxide), EO (ethylene oxide), CL (caprolactone), etc.
用於硬塗層12之黏合劑樹脂之熱塑性樹脂例如可例舉:苯乙烯系樹脂、(甲基)丙烯酸系樹脂、乙酸乙烯酯系樹脂、乙烯醚系樹脂、含鹵素樹脂、脂環式烯烴系樹脂、聚碳酸酯系樹脂、聚酯系樹脂、聚醯胺系樹脂、纖維素衍生物、矽酮系樹脂及橡膠或彈性體等。上述熱塑性樹脂較佳為非晶,且可溶於有機溶劑(尤其是可溶解複數種聚合物、硬化性化合物之公用溶劑)。尤其就透明性及耐候性之觀點而言,較佳為苯乙烯系樹脂、(甲基)丙烯酸系樹脂、脂環式烯烴系樹脂、聚酯系樹脂、纖維素衍生物(纖維素酯類等)等。Thermoplastic resins used as adhesive resins for hard coating 12 include, for example, styrene-based resins, (meth)acrylic resins, vinyl acetate resins, vinyl ether resins, halogenated resins, alicyclic olefin resins, polycarbonate resins, polyester resins, polyamide resins, cellulose derivatives, silicone resins, and rubber or elastomers. Preferably, the above-mentioned thermoplastic resins are amorphous and soluble in organic solvents (especially common solvents that can dissolve multiple polymers and curing compounds). In particular, from the perspective of transparency and weather resistance, styrene-based resins, (meth)acrylic resins, alicyclic olefin resins, polyester resins, and cellulose derivatives (cellulose esters, etc.) are preferred.
用於硬塗層12之黏合劑樹脂之熱硬化性樹脂例如可例舉:酚樹脂、脲樹脂、鄰苯二甲酸二烯丙酯樹脂、三聚氰胺樹脂、胍胺樹脂、不飽和聚酯樹脂、聚胺基甲酸酯樹脂、環氧樹脂、胺基醇酸樹脂、三聚氰胺-脲共縮合樹脂、矽樹脂、聚矽氧烷樹脂(包含籠狀、梯狀等之所有倍半矽氧烷等)等。Examples of thermosetting resins used as adhesive resins for hard coating 12 include: phenolic resins, urea resins, diallyl phthalate resins, melamine resins, guanidine resins, unsaturated polyester resins, polyurethane resins, epoxy resins, amino alkyd resins, melamine-urea cocondensate resins, silicone resins, and polysiloxane resins (including all sesquisiloxanes such as cage-like and ladder-like forms).
硬塗層12可包含有機樹脂及無機材料,亦可為有機無機混合材料。作為一例,可例舉利用溶膠凝膠法所形成者。無機材料例如可例舉氧化矽、氧化鋁、氧化鋯、氧化鈦。有機材料例如可例舉丙烯酸樹脂。關於硬塗層12所包含之填料,就防眩性、與下述光學功能層14之密接性、抗黏連性之觀點而言,可根據光學積層體101、102之用途選擇各種填料。具體而言,例如可使用氧化矽(Si之氧化物)粒子、氧化鋁(鋁之氧化物)粒子、有機微粒子等公知填料。The hard coating 12 may contain organic resins and inorganic materials, or a mixture of organic and inorganic materials. For example, it may be formed using a sol-gel method. Inorganic materials may include, for example, silicon oxide, aluminum oxide, zirconium oxide, and titanium oxide. Organic materials may include, for example, acrylic resins. Regarding the fillers contained in the hard coating 12, from the viewpoints of anti-glare properties, adhesion to the optical functional layer 14 described below, and anti-blocking properties, various fillers may be selected according to the intended use of the optical laminates 101 and 102. Specifically, known fillers such as silicon oxide (oxide of Si) particles, aluminum oxide (oxide of aluminum) particles, and organic microparticles may be used.
硬塗層12亦可為例如包含黏合劑樹脂、及作為填料之氧化矽粒子及/或氧化鋁粒子者。藉由使作為填料之氧化矽粒子及/或氧化鋁粒子分散於硬塗層12中,可於硬塗層12之表面形成細微之凹凸。該等氧化矽粒子及/或氧化鋁粒子亦可於硬塗層12之光學功能層14側之表面露出。於此情形時,硬塗層12之黏合劑樹脂與光學功能層14牢固地接合。因此,硬塗層12與光學功能層14之密接性提昇,硬塗層12之硬度變高,並且光學積層體101、102之耐擦傷性變良好。The hard coating layer 12 may also include, for example, an adhesive resin and silica particles and/or alumina particles as fillers. By dispersing the silica particles and/or alumina particles as fillers in the hard coating layer 12, fine irregularities can be formed on the surface of the hard coating layer 12. These silica particles and/or alumina particles may also be exposed on the surface of the hard coating layer 12 on the side of the optical functional layer 14. In this case, the adhesive resin of the hard coating layer 12 is firmly bonded to the optical functional layer 14. Therefore, the adhesion between the hard coating layer 12 and the optical functional layer 14 is improved, the hardness of the hard coating layer 12 becomes higher, and the scratch resistance of the optical laminates 101 and 102 becomes better.
作為硬塗層12之填料之氧化矽粒子及/或氧化鋁粒子之平均粒徑例如為800 nm以下,較佳為780 nm以下,進而較佳為100 nm以下。The average particle size of the silica particles and/or alumina particles used as fillers in the hard coating layer 12 is, for example, 800 nm or less, preferably 780 nm or less, and even more preferably 100 nm or less.
就提昇光學積層體101、102之防眩性之觀點而言,可使用有機微粒子作為硬塗層12所包含之填料。有機微粒子例如可例舉丙烯酸樹脂等。有機微粒子之粒徑較佳為10 μm以下,進而較佳為5 μm以下,尤佳為3 μm以下。為對硬塗層12賦予強韌性,可於不損害光學特性之範圍內使用各種補強材料作為硬塗層12所含有之填料。補強材料例如可例舉纖維素奈米纖維。From the viewpoint of improving the anti-glare properties of optical laminates 101 and 102, organic microparticles can be used as fillers contained in the hard coating layer 12. Examples of organic microparticles include acrylic resins. The particle size of the organic microparticles is preferably 10 μm or less, more preferably 5 μm or less, and particularly preferably 3 μm or less. To impart strength to the hard coating layer 12, various reinforcing materials can be used as fillers contained in the hard coating layer 12 without compromising its optical properties. Examples of reinforcing materials include cellulose nanofibers.
硬塗層12之厚度並無特別限定,例如較佳為0.5 μm以上,更佳為1 μm以上。硬塗層12之厚度較佳為100 μm以下。若硬塗層12之厚度為0.5 μm以上,則可獲得充分之硬度,製造時不易產生刮痕。又,若硬塗層12之厚度為100 μm以下,則可實現光學積層體101、102之薄膜化、輕量化。又,若硬塗層12之厚度為100 μm以下,則製造中途不易出現光學積層體101、102彎曲時所產生之硬塗層12之微裂痕,生產性變良好。The thickness of the hard coating layer 12 is not particularly limited, but it is preferably 0.5 μm or more, and more preferably 1 μm or more. The thickness of the hard coating layer 12 is preferably 100 μm or less. If the thickness of the hard coating layer 12 is 0.5 μm or more, sufficient hardness can be obtained, and scratches are less likely to occur during manufacturing. Furthermore, if the thickness of the hard coating layer 12 is 100 μm or less, thinner and lighter optical laminates 101 and 102 can be achieved. Also, if the thickness of the hard coating layer 12 is 100 μm or less, microcracks in the hard coating layer 12 caused by bending of the optical laminates 101 and 102 during manufacturing are less likely to occur, resulting in better manufacturability.
硬塗層12可為單一之層,亦可為將複數層積層而成者。又,亦可進而對硬塗層12賦予例如紫外線吸收性能、抗靜電性能、折射率調整功能、硬度調整功能等公知功能。又,對硬塗層12賦予之功能可賦予至單一之硬塗層中,亦可分開賦予至複數個層。The hard coating layer 12 can be a single layer or formed by stacking multiple layers. Furthermore, the hard coating layer 12 can be endowed with known functions such as ultraviolet absorption, antistatic properties, refractive index adjustment, and hardness adjustment. Moreover, the functions endowed to the hard coating layer 12 can be assigned to a single hard coating layer or separately to multiple layers.
密接層13係為了使作為有機膜之透明基材11或硬塗層12與作為無機膜之光學功能層14良好地密接而形成之層。於圖1及圖2所示之光學積層體101、102中,於硬塗層12與光學功能層14之間具備密接層13。密接層13具有使硬塗層12與光學功能層14密接之功能。密接層13較佳為包含氧缺陷狀態之金屬氧化物或金屬。氧缺陷狀態之金屬氧化物係指與化學計量組成相比氧數不足之狀態之金屬氧化物。氧缺陷狀態之金屬氧化物例如可例舉SiOx、AlOx、TiOx、ZrOx、CeOx、MgOx、ZnOx、TaOx、SbOx、SnOx、MnOx等。又,金屬可例舉Si、Al、Ti、Zr、Ce、Mg、Zn、Ta、Sb、Sn、Mn、In等。於本實施方式中,構成密接層13之上述金屬元素、金屬氧化物中之金屬元素有時被稱為第三金屬元素。密接層13例如亦可為SiOx中之x超過0且未達2.0者。又,密接層亦可由複數種金屬或金屬氧化物之混合物所形成。The bonding layer 13 is formed to ensure good adhesion between the transparent substrate 11 (organic film) or the hard coating layer 12 and the optical functional layer 14 (inorganic film). In the optical laminates 101 and 102 shown in Figures 1 and 2, a bonding layer 13 is provided between the hard coating layer 12 and the optical functional layer 14. The bonding layer 13 functions to ensure good adhesion between the hard coating layer 12 and the optical functional layer 14. Preferably, the bonding layer 13 is a metal oxide or metal containing oxygen vacancies. An oxygen vacancies metal oxide refers to a metal oxide with an insufficient number of oxygen atoms compared to its stoichiometric composition. Examples of oxygen-deficient metal oxides include SiOx, AlOx, TiOx, ZrOx, CeOx, MgOx, ZnOx, TaOx, SbOx, SnOx, and MnOx. Examples of metals include Si, Al, Ti, Zr, Ce, Mg, Zn, Ta, Sb, Sn, Mn, and In. In this embodiment, the metal elements constituting the bonding layer 13, and the metal elements in the metal oxides, are sometimes referred to as third metal elements. The bonding layer 13 may also be, for example, SiOx with x values exceeding 0 but not reaching 2.0. Furthermore, the bonding layer may also be formed from a mixture of multiple metals or metal oxides.
就維持基材與光學功能層14之密接性,獲得良好之光學特性之觀點而言,密接層13之厚度較佳為超過0 nm且為20 nm以下,尤佳為1 nm以上且10 nm以下。From the perspective of maintaining the adhesion between the substrate and the optical functional layer 14 and obtaining good optical properties, the thickness of the adhesion layer 13 is preferably greater than 0 nm and less than 20 nm, and more preferably greater than 1 nm and less than 10 nm.
光學功能層14係表現抗反射功能之積層體。光學功能層14係自透明基材11側起依序交替地積層高折射率層14a及低折射率層14b而成者,於圖1所示之例中合計包含2層,於圖2所示之例中合計包含4層。高折射率層14a及低折射率層14b之層數並無特別限定,可設為任意層數。The optical functional layer 14 is a laminate that exhibits anti-reflective properties. The optical functional layer 14 is formed by sequentially and alternately depositing a high-refractive-index layer 14a and a low-refractive-index layer 14b starting from the transparent substrate 11. In the example shown in Figure 1, it contains a total of 2 layers, and in the example shown in Figure 2, it contains a total of 4 layers. The number of high-refractive-index layers 14a and low-refractive-index layers 14b is not particularly limited and can be any number.
由於光學功能層14係由交替地積層低折射率層14b及高折射率層14a而成之積層體所構成者,故而自防污層15側入射之光因光學功能層14而相互干涉,藉此可降低反射光之強度,發揮抗反射功能。因此,可獲得防止自防污層15側入射之光朝單一方向反射之抗反射功能。Since the optical functional layer 14 is composed of alternating layers of low-refractive-index layer 14b and high-refractive-index layer 14a, light incident from the anti-fouling layer 15 interferes with each other due to the optical functional layer 14, thereby reducing the intensity of reflected light and exerting an anti-reflection function. Therefore, an anti-reflection function can be obtained to prevent light incident from the anti-fouling layer 15 from being reflected in a single direction.
低折射率層14b例如為以SiO2(Si之氧化物)作為主成分之層。SiO2單層膜為無色透明。於本實施方式中,低折射率層14b之主成分意指以50質量%以上包含於低折射率層14b中之成分。The low refractive index layer 14b is, for example, a layer with SiO2 (an oxide of Si) as the main component. The SiO2 monolayer film is colorless and transparent. In this embodiment, the main component of the low refractive index layer 14b means the component contained in the low refractive index layer 14b at a mass percentage of 50% or more.
於低折射率層14b為以Si之氧化物作為主成分之層之情形時,可包含未達50質量%之其他元素,亦可由Si之氧化物所構成。於本實施方式中,作為主成分包含於低折射率層14b之金屬氧化物之金屬元素即矽有時被稱為第二金屬元素。與Si之氧化物不同之元素之含量較佳為10%以下。作為其他元素,例如出於提昇耐久性之目的可含有Na,出於提昇硬度之目的可含有Zr、Al、或N,出於提昇耐鹼性之目的可含有Zr、Al。When the low-refractive-index layer 14b is a layer mainly composed of Si oxide, it may contain less than 50% by mass of other elements, and may also be composed of Si oxide. In this embodiment, the metal element contained in the metal oxide of the low-refractive-index layer 14b as a main component, namely silicon, is sometimes referred to as the second metal element. The content of elements different from Si oxide is preferably less than 10%. Other elements may be included, for example, for the purpose of improving durability, for the purpose of improving hardness, Zr, Al, or N may be included, and for the purpose of improving alkali resistance, Zr or Al may be included.
高折射率層14a之折射率較佳為2.00~2.60,更佳為2.10~2.45。高折射率層14a中所使用之介電體可例舉:五氧化鈮(Nb2O5、折射率2.33)、氧化鈦(TiO2、折射率2.33~2.55)、氧化鎢(WO3、折射率2.2)、氧化鈰(CeO2、折射率2.2)、五氧化鉭(Ta2O5、折射率2.16)、氧化鋅(ZnO、折射率2.1)、氧化銦錫(ITO、折射率2.06)、氧化鋯(ZrO2、折射率2.2)等。於本實施方式中,鈮、鈦、鎢、鈰、鉭、鋅、鋯等作為主成分包含於高折射率層之金屬氧化物之金屬元素有時被稱為第一金屬元素。於欲對高折射率層14a賦予導電特性之情形時,例如可選擇ITO、氧化銦氧化鋅(IZO)。The refractive index of the high refractive index layer 14a is preferably 2.00–2.60, and more preferably 2.10–2.45. Examples of dielectrics used in the high refractive index layer 14a include: niobium pentoxide ( Nb₂O₅ , refractive index 2.33), titanium oxide ( TiO₂ , refractive index 2.33–2.55), tungsten oxide ( WO₃ , refractive index 2.2), cerium oxide ( CeO₂ , refractive index 2.2), tantalum pentoxide ( Ta₂O₅ , refractive index 2.16), zinc oxide (ZnO, refractive index 2.1), indium tin oxide ( ITO , refractive index 2.06), and zirconia oxide ( ZrO₂ , refractive index 2.2). In this embodiment, metal elements such as niobium, titanium, tungsten, cerium, tantalum, zinc, and zirconium, which are included as main components in the metal oxide of the high refractive index layer, are sometimes referred to as the first metal element. When it is desired to impart conductive properties to the high refractive index layer 14a, ITO or indium zinc oxide (IZO) may be selected, for example.
光學功能層14較佳為例如使用包含五氧化鈮(Nb2O5、折射率2.33)者作為高折射率層14a,使用包含SiO2者作為低折射率層14b。The optical functional layer 14 is preferably , for example, a layer containing niobium pentoxide ( Nb₂O₅ , refractive index 2.33) as the high refractive index layer 14a, and a layer containing SiO₂ as the low refractive index layer 14b.
低折射率層14b之膜厚可處於1 nm以上且200 nm以下之範圍,並根據需要抗反射功能之波長區域來適當選擇。高折射率層14a之膜厚例如可為1 nm以上且200 nm以下,並根據需要抗反射功能之波長區域來適當選擇。高折射率層14a及低折射率層14b之膜厚可分別根據光學功能層14之設計來適當選擇。於光學積層體102中,例如可自密接層13側起依序形成5~50 nm之高折射率層14a、10~80 nm之低折射率層14b、20~200 nm之高折射率層14a、50~200 nm之低折射率層14b。於光學積層體101中,亦可自上述高折射率層14a、低折射率層14b之膜厚中進行選擇以成為任意膜厚。The thickness of the low-refractive-index layer 14b can be in the range of 1 nm or more and 200 nm or less, and can be appropriately selected according to the wavelength region where anti-reflection function is required. The thickness of the high-refractive-index layer 14a can be, for example, 1 nm or more and 200 nm or less, and can be appropriately selected according to the wavelength region where anti-reflection function is required. The thicknesses of the high-refractive-index layer 14a and the low-refractive-index layer 14b can be appropriately selected according to the design of the optical functional layer 14. In the optical laminate 102, for example, starting from the side of the close-packed layer 13, a high-refractive-index layer 14a of 5-50 nm, a low-refractive-index layer 14b of 10-80 nm, a high-refractive-index layer 14a of 20-200 nm, and a low-refractive-index layer 14b of 50-200 nm can be formed sequentially. In the optical laminate 101, the thickness of the high refractive index layer 14a and the low refractive index layer 14b can be selected to achieve any thickness.
形成光學功能層14之層中,於防污層15側配置有低折射率層14b。即,光學功能層14中,以與防污層15接觸之層為低折射率層14b之方式交替配置高折射率層14a及低折射率層14b。於光學功能層14之低折射率層14b與防污層15接觸之情形時,與高折射率層14a接觸防污層15之情形相比,光學功能層14之抗反射性能變良好。又,如下文所詳細說明,於光學積層體101、102中,低折射率層14b之位於防污層15側之最表面之Si元素經由氧原子與防污層15所包含之氟有機化合物結合。In the optical functional layer 14, a low refractive index layer 14b is disposed on the side of the antifouling layer 15. That is, in the optical functional layer 14, high refractive index layers 14a and low refractive index layers 14b are alternately disposed such that the layer in contact with the antifouling layer 15 is the low refractive index layer 14b. When the low refractive index layer 14b of the optical functional layer 14 is in contact with the antifouling layer 15, the anti-reflective performance of the optical functional layer 14 is better than when the high refractive index layer 14a is in contact with the antifouling layer 15. Furthermore, as explained in detail below, in the optical laminates 101 and 102, the Si element on the outermost surface of the low refractive index layer 14b located to the side of the antifouling layer 15 is bonded to the fluorine organic compound contained in the antifouling layer 15 via oxygen atoms.
防污層15形成於光學功能層14之最外表面,防止光學功能層14之污損。又,於應用於觸控面板等時,防污層15藉由耐磨耗性而抑制光學功能層14之損耗。本實施方式之防污層15係由蒸鍍防污性材料而成之蒸鍍膜所構成。於本實施方式中,防污層15係藉由於構成光學功能層14之低折射率層14b之一面真空蒸鍍氟系有機化合物作為防污性材料而形成。於本實施方式中,由於防污性材料包含氟系有機化合物,故而光學積層體101、102之耐摩擦性及耐鹼性更良好。An anti-fouling layer 15 is formed on the outermost surface of the optical functional layer 14 to prevent contamination of the optical functional layer 14. Furthermore, when applied to touch panels, the anti-fouling layer 15 suppresses wear on the optical functional layer 14 through its abrasion resistance. In this embodiment, the anti-fouling layer 15 is formed by vacuum-depositing a fluorine-based organic compound as the anti-fouling material on one side of the low-refractive-index layer 14b constituting the optical functional layer 14. In this embodiment, because the anti-fouling material contains a fluorine-based organic compound, the optical layers 101 and 102 exhibit better abrasion resistance and alkali resistance.
作為構成防污層15之氟系有機化合物,可較佳地使用包含氟改性有機基、及反應性矽烷基(例如烷氧基矽烷)之化合物。防污層15較佳為包含具有烷氧基矽烷基、及全氟聚醚基或氟烷基等氟改性有機基之化合物。市售品可例舉OPTOOL DSX(Daikin股份有限公司製造)、KY-100 Series(信越化學工業股份有限公司製造)等。As the fluorinated organic compound constituting the antifouling layer 15, compounds containing fluorinated modified organic groups and reactive silyl groups (such as alkoxysilanes) are preferred. The antifouling layer 15 is preferably a compound containing fluorinated modified organic groups such as alkoxysilyl groups, perfluoropolyether groups, or fluoroalkyl groups. Commercially available examples include OPTOOL DSX (manufactured by Daikin Co., Ltd.) and KY-100 Series (manufactured by Shin-Etsu Chemical Co., Ltd.).
於使用包含氟改性有機基、及反應性矽烷基(例如烷氧基矽烷)之化合物作為構成防污層15之氟系有機化合物,使用包含SiO2者作為與防污層15接觸之光學功能層14之低折射率層14b之情形時,自氟系有機化合物所具有之反應性矽烷基產生之矽烷醇基與存在於SiO2表面之羥基之間形成矽氧烷鍵。因此,光學功能層14與防污層15之密接性變良好,故而較佳。When a fluorinated organic compound containing fluorine-modified organic groups and reactive silyl groups (e.g., alkoxysilanes) is used as the fluorine-based organic compound constituting the antifouling layer 15, and a low-refractive-index layer 14b containing SiO2 is used as the optical functional layer 14 in contact with the antifouling layer 15, siloxane bonds are formed between the silanol groups generated from the reactive silyl groups of the fluorine-based organic compound and the hydroxyl groups present on the SiO2 surface. Therefore, the adhesion between the optical functional layer 14 and the antifouling layer 15 becomes better, which is preferable.
防污層15之光學厚度可處於1 nm以上且20 nm以下之範圍,較佳為3 nm以上且10 nm以下之範圍。若防污層15之厚度為1 nm以上,則於將光學積層體101、102應用於觸控面板用途等時,可充分確保耐磨耗性。又,若防污層15之厚度為3 nm以上,則光學積層體101、102之耐液性等提昇。又,若防污層15之厚度為20 nm以下,則蒸鍍所需之時間可為短時間,可高效地進行製造。The optical thickness of the anti-fouling layer 15 can be in the range of 1 nm or more and 20 nm or less, preferably 3 nm or more and 10 nm or less. If the thickness of the anti-fouling layer 15 is 1 nm or more, the wear resistance can be sufficiently ensured when the optical laminates 101 and 102 are applied to touch panels, etc. Furthermore, if the thickness of the anti-fouling layer 15 is 3 nm or more, the liquid resistance of the optical laminates 101 and 102 is improved. Furthermore, if the thickness of the anti-fouling layer 15 is 20 nm or less, the time required for evaporation can be short, allowing for efficient manufacturing.
於以上述方式構成之光學積層體101、102中,自光學積層體101、102之防污層15側藉由X射線光電子分析(ESCA)所測得之SiO2之結合能例如為103.25 eV以下。該結合能例如為103.00 eV以上,更佳為103.01 eV以上且103.15 eV以下。已知SiO2之結合能通常為103.6 eV,於光學積層體101、102中採用較該值低之值。In the optical laminates 101 and 102 constructed as described above, the binding energy of SiO2 measured by X-ray photoelectron analysis (ESCA) from the antifouling layer 15 side of the optical laminates 101 and 102 is, for example, 103.25 eV or less. This binding energy is, for example, 103.00 eV or more, more preferably 103.01 eV or more and 103.15 eV or less. It is known that the binding energy of SiO2 is typically 103.6 eV, and a lower value is used in the optical laminates 101 and 102.
又,關於耐鹼性之提昇,較理想為藉由自光學積層體101、102之防污層15側利用X射線光電子分析(ESCA)所測定之寬掃描,未檢測到除構成光學積層體中所使用之金屬氧化物之金屬以外的金屬元素。即,於高折射率層14a包含第一金屬之氧化物,低折射率層14b包含與上述第一金屬不同之第二金屬之氧化物時,藉由ESCA所檢測出之金屬元素較佳為僅為第一金屬元素及第二金屬元素,於光學積層體進而具備密接層13且密接層包含第三金屬之氧化物時,藉由ESCA所檢測出之金屬元素較佳為僅為第一金屬元素、第二金屬元素及第三金屬元素。例如,於密接層為SiOx,高折射率層為Nb2O5膜,低折射率層為SiO2膜之光學積層體中,較佳為未檢測出除Si及Nb以外之金屬元素。可混入至此種光學積層體的除構成光學積層體中所使用之金屬氧化物之金屬以外之金屬元素主要為電漿處理之電極中所使用之金屬,可例舉Al、Zr、Ti。Furthermore, regarding the improvement of alkali resistance, it is ideal to measure the width of the antifouling layer 15 of the optical laminates 101 and 102 using X-ray photoelectron analysis (ESCA), and to detect no metal elements other than the metal oxides used in the optical laminates. That is, when the high refractive index layer 14a contains an oxide of a first metal and the low refractive index layer 14b contains an oxide of a second metal different from the first metal, the metal elements detected by ESCA are preferably only the first and second metal elements. When the optical laminate further has a close-packed layer 13 and the close-packed layer contains an oxide of a third metal, the metal elements detected by ESCA are preferably only the first, second, and third metal elements. For example, in an optical laminate where the close-packed layer is SiOx, the high refractive index layer is an Nb₂O₅ film , and the low refractive index layer is a SiO₂ film, it is preferable that no metal elements other than Si and Nb are detected. The metal elements that can be incorporated into this optical laminate, apart from the metal oxides used in the optical laminate, are mainly the metals used in the plasma treatment electrodes, such as Al, Zr, and Ti.
如下文所詳細說明,於光學積層體101、102中,於形成低折射率層14b之後,藉由於導入水蒸氣及氬氣之環境下對低折射率層進行電漿處理,即藉由於存在H2O及Ar之環境下對低折射率層進行電漿處理,構成低折射率層14b之SiO2之位於最表面之Si及O之矽氧烷鍵的一部分被切斷,與電漿處理時之氛圍中之H2O進行反應而生成鍵結於Si之羥基,其後,與構成防污層15之氟系有機化合物結合。As explained in detail below, in optical laminates 101 and 102, after the formation of the low refractive index layer 14b, the low refractive index layer is subjected to plasma treatment in an environment with water vapor and argon. That is, by plasma treatment of the low refractive index layer in the presence of H2O and Ar, a portion of the siloxane bonds of Si and O on the outermost surface of SiO2 constituting the low refractive index layer 14b is cut off and reacts with H2O in the atmosphere during plasma treatment to generate hydroxyl groups bonded to Si. Subsequently, these groups combine with the fluorine-based organic compounds constituting the antifouling layer 15.
光學積層體101、102長期顯示出較高之耐鹼性。具體而言,於滴下0.1(mol/L)之NaOH水溶液之後,於55℃下靜置4小時後,ΔE值(參照下述式(1))係ΔE值為8以下,較佳為4以下。ΔE值若自滴下NaOH水溶液起4小時後無變化,則為0。光學積層體101、102之ΔE值為0以上,亦可為0.5以上。Optical laminates 101 and 102 exhibit high alkali resistance over a long period. Specifically, after adding 0.1 mol/L NaOH aqueous solution and allowing it to stand at 55°C for 4 hours, the ΔE value (refer to formula (1) below) is 8 or less, preferably 4 or less. If the ΔE value does not change after 4 hours from the addition of the NaOH aqueous solution, it is 0. The ΔE value of optical laminates 101 and 102 is 0 or more, or even 0.5 or more.
ΔE﹡ ab={(L﹡ 2-L﹡ 1)2+(a﹡ 2-a﹡ 1)2+(b﹡ 2-b﹡ 1)2}1/2・・・(1)(式(1)中,L﹡ 1:滴下NaOH水溶液前之亮度,L﹡ 2:自滴下NaOH水溶液起經過特定時間後之亮度,a﹡ 1:滴下NaOH水溶液前之色度,a﹡ 2:自滴下NaOH水溶液起靜置特定時間後之色度,b﹡ 1:滴下NaOH水溶液前之色度,b﹡ 2:自滴下NaOH水溶液起靜置特定時間後之色度)ΔE * ab ={(L * 2 -L * 1 ) 2 +(a * 2 -a * 1 ) 2 +(b * 2 -b * 1 ) 2 } 1/2・・・(1)(In formula (1), L * 1 : brightness before the NaOH aqueous solution is added, L * 2 : brightness after a specific time has elapsed since the NaOH aqueous solution was added, a * 1 : chromaticity before the NaOH aqueous solution is added, a * 2 : chromaticity after a specific time has elapsed since the NaOH aqueous solution was added, b * 1 : chromaticity before the NaOH aqueous solution is added, b * 2 : chromaticity after a specific time has elapsed since the NaOH aqueous solution was added)
[物品]圖3係表示應用有本發明之一實施方式之光學積層體的物品構成之一例之立體圖。關於本實施方式之光學積層體101、102,例如於液晶顯示面板、有機EL顯示面板等物品之圖像顯示部之顯示面具備上述光學積層體。圖3中為於物品200之被邊框201圍住之主要部分202設置有光學積層體101之例,但亦可為設置有光學積層體102之構成。又,物品並不限定於圖像顯示裝置,例如可為於表面設置有本實施方式之光學積層體之護目鏡、太陽電池之受光面、智慧型手機之畫面或個人電腦之顯示器、資訊輸入終端、平板終端、AR(擴增實境)裝置、VR(虛擬實境)裝置、電光顯示板、玻璃桌表面、遊戲機、航空器或電車等運行輔助裝置、導航系統、儀錶板、光學感測器之表面等可應用光學積層體者中之任一者。例如,亦可為於具有彎曲面之物品之該彎曲之面貼合有光學積層體者。本實施方式之物品較佳為於觸控面板之表面設置有光學積層體者。關於物品200中之主要部分202,於具有畫面之物品中具有代表性的為畫面所對應之顯示部,於不具有畫面之物品中例如為使光透過之透光部。本實施方式之物品藉由具有此種構成,即便於進行利用鹼性化學品等去除皮脂等酸性污垢之維護之情形時,亦可顯示出長期之耐久性。[Article] Figure 3 is a perspective view showing an example of the composition of an article using an optical laminate according to an embodiment of the present invention. Regarding the optical laminates 101 and 102 of the present embodiment, such optical laminates are provided on the display surface of the image display section of an article such as a liquid crystal display panel or an organic EL display panel. Figure 3 shows an example where the optical laminate 101 is provided on the main part 202 of the article 200 surrounded by the frame 201, but it could also be a configuration where the optical laminate 102 is provided. Furthermore, the article is not limited to image display devices. For example, it can be any of the following: goggles with the optical multilayer of this embodiment disposed on their surface; the light-receiving surface of a solar cell; the screen of a smartphone or the display of a personal computer; an information input terminal; a tablet terminal; an AR (augmented reality) device; a VR (virtual reality) device; an electro-optical display panel; a glass table surface; a game console; an aircraft or train operation aid device; a navigation system; an instrument panel; or the surface of an optical sensor. For example, it can also be an article with a curved surface on which the optical multilayer is attached. The article of this embodiment preferably has an optical layer on the surface of the touch panel. Regarding the main part 202 of the article 200, in an article with a display screen, it is typically the display portion corresponding to the screen; in an article without a display screen, it is, for example, the light-transmitting portion through which light passes. Because of this configuration, the article of this embodiment exhibits long-term durability even when subjected to maintenance using alkaline chemicals to remove acidic dirt such as sebum.
[光學積層體之製造方法]圖1及圖2所示之本實施方式之光學積層體101、102例如可藉由以下所示之方法進行製造。於本實施方式中,作為光學積層體101、102之製造方法之一例,例舉使用捲繞成輥狀之透明基材11來製造光學積層體101、102之情形進行說明。首先,將捲繞成輥狀之透明基材11捲出。繼而,藉由公知之方法於透明基材11上塗佈包含成為硬塗層12之材料之漿料,並藉由與成為硬塗層12之材料對應之公知之方法使其硬化。藉此,形成硬塗層12(硬塗層形成步驟)。其後,藉由公知之方法將表面形成有硬塗層12之透明基材11捲取成輥狀。[Manufacturing Method of Optical Laminates] The optical laminates 101 and 102 of this embodiment shown in Figures 1 and 2 can be manufactured, for example, by the method described below. In this embodiment, as an example of a manufacturing method for optical laminates 101 and 102, the case of manufacturing optical laminates 101 and 102 using a transparent substrate 11 wound into a roller shape will be explained. First, the transparent substrate 11 wound into a roller shape is unwound. Then, a slurry containing a material that forms a hard coating layer 12 is applied to the transparent substrate 11 using a known method, and then hardened using a known method corresponding to the material that forms the hard coating layer 12. In this way, a hard coating layer 12 is formed (hard coating layer formation step). Subsequently, the transparent substrate 11 on which the hard coating layer 12 is formed is rolled into a roller shape by a known method.
其次於硬塗層12上進行形成密接層13之密接層形成步驟、及形成光學功能層14之光學功能層形成步驟。光學功能層形成步驟具有形成高折射率層14a之高折射率層形成步驟及於乾燥氛圍下形成低折射率層14b之低折射率層形成步驟。於本實施方式中,乾燥氛圍下意指並非濕潤氛圍下,且意指無水蒸氣流動。其後,進行對低折射率層14b進行電漿處理之電漿處理步驟及於表面形成防污層15之防污層形成步驟。於電漿處理步驟中,於導入水蒸氣及氬氣之混合氣體之環境下對低折射率層14b進行電漿處理。即,電漿處理步驟係於存在H2O及Ar之氛圍下進行。電漿處理步驟中所導入之水蒸氣及氬氣之混合氣體中水蒸氣之流量比率例如可設為2%以上且100%以下,較佳為設為10%以上且90%以下。此處,上述電漿處理步驟中之混合氣體中H2O之流量比率意指H2O之流量(自總流量中減去氬氣流量所得之值)(sccm)相對於電漿處理中作為反應性氣體流動之氣體之總流量(sccm)的比率。Next, a bonding layer formation step of forming a bonding layer 13 and an optical functional layer formation step of forming an optical functional layer 14 are performed on the hard coating layer 12. The optical functional layer formation step includes a high refractive index layer formation step of forming a high refractive index layer 14a and a low refractive index layer formation step of forming a low refractive index layer 14b in a dry atmosphere. In this embodiment, a dry atmosphere means not a humid atmosphere and means no water vapor flow. Subsequently, a plasma treatment step of plasma treating the low refractive index layer 14b and an antifouling layer formation step of forming an antifouling layer 15 on the surface are performed. In the plasma treatment step, the low refractive index layer 14b is plasma treated in an environment containing a mixture of water vapor and argon. That is, the plasma treatment step is carried out in the presence of H₂O and Ar. The flow rate ratio of water vapor in the mixture of water vapor and argon introduced in the plasma treatment step can be set to, for example, 2% or more and 100% or less, preferably 10% or more and 90% or less. Here, the flow rate ratio of H₂O in the mixture in the above-mentioned plasma treatment step means the ratio of the H₂O flow rate (the value obtained by subtracting the argon flow rate from the total flow rate) (sccm) to the total flow rate (sccm) of the gases flowing as reactive gases in the plasma treatment.
電漿處理步驟中之電極功率密度為1400 W/m2以上且44200 W/m2以下,例如較佳為為4400 W/m2以上且18000 W/m2以下、7000 W/m2以上且14000 W/m2以下。The electrode power density in the plasma treatment step is above 1400 W/ m² and below 44200 W/ m² , preferably above 4400 W/ m² and below 18000 W/m², or above 7000 W/ m² and below 14000 W/ m² .
於低折射率層形成步驟中,藉由濺鍍法形成低折射率層。In the low refractive index layer formation step, a low refractive index layer is formed by sputtering.
於防污層形成步驟中,藉由蒸鍍法形成防污層15。防污層15較佳為包含具有烷氧基矽烷基及全氟聚醚基或氟烷基等氟改性有機基之化合物。於本實施方式中,較佳為於光學功能層形成步驟之前進行對硬塗層12之表面進行處理之表面處理步驟,其後進行密接層形成步驟及光學功能層形成步驟。In the antifouling layer formation step, the antifouling layer 15 is formed by vapor deposition. The antifouling layer 15 is preferably a compound containing fluorinated organic groups such as alkoxysilyl groups, perfluoropolyether groups, or fluoroalkyl groups. In this embodiment, it is preferable to perform a surface treatment step to treat the surface of the hard coating layer 12 before the optical functional layer formation step, followed by the adhesion layer formation step and the optical functional layer formation step.
作為可用於本實施方式之光學積層體之製造方法的製造裝置之例,可例舉圖4所示之製造裝置20。製造裝置20係輥對輥方式之製造裝置,其將基材自輥中捲出,並使基材連續地通過所連結之裝置(圖4中為預處理裝置2A、濺鍍裝置1、預處理裝置2B、蒸鍍裝置3)之後進行捲取,藉此於基材上連續地形成複數層。As an example of a manufacturing apparatus that can be used in the manufacturing method of the optical laminate of this embodiment, the manufacturing apparatus 20 shown in FIG4 can be cited. The manufacturing apparatus 20 is a roller-to-roll manufacturing apparatus that winds the substrate out of the roller and continuously passes the substrate through the connected devices (pretreatment device 2A, sputtering device 1, pretreatment device 2B, and evaporation device 3 in FIG4) and then winds it, thereby continuously forming multiple layers on the substrate.
於使用輥對輥方式之製造裝置來製造光學積層體101、102之情形時,製造中途之光學積層體101、102之搬送速度(線速)可適當設定。搬送速度例如較佳為設為0.5~20 m/min,更佳為設為0.5~10 m/min。When using a roller-to-roll fabrication apparatus to manufacture optical laminates 101 and 102, the conveying speed (linear speed) of the optical laminates 101 and 102 during manufacturing can be appropriately set. For example, the conveying speed is preferably set to 0.5 to 20 m/min, and more preferably to 0.5 to 10 m/min.
<輥捲出裝置>輥捲出裝置4具有:內部形成為特定之減壓氛圍之腔室34、將腔室34內之氣體排出而形成減壓氛圍之1個或複數個真空泵21(圖4中為1個)、及設置於腔室34內之捲出輥23及導輥22。如圖4所示,腔室34與濺鍍裝置1之腔室31連結。於捲出輥23上捲繞有表面形成有硬塗層12之透明基材11。捲出輥23以特定之搬送速度將表面形成有硬塗層12之透明基材11供給至預處理裝置2A。The roller winding device 4 includes: a chamber 34 with an internally formed depressurized atmosphere; one or more vacuum pumps 21 (one in Figure 4) that discharge gas from the chamber 34 to form a depressurized atmosphere; and a winding roller 23 and a guide roller 22 disposed within the chamber 34. As shown in Figure 4, the chamber 34 is connected to the chamber 31 of the sputtering apparatus 1. A transparent substrate 11 with a hard coating 12 formed on its surface is wound on the winding roller 23. The winding roller 23 feeds the transparent substrate 11 with the hard coating 12 formed on its surface to the pretreatment apparatus 2A at a specific conveying speed.
<預處理裝置2A>預處理裝置2A具有:內部形成為特定之減壓氛圍之腔室32、罐輥26、複數個(圖4中為2個)導輥22、及電漿放電裝置42。如圖4所示,罐輥26、導輥22、及電漿放電裝置42係設置於腔室32內。如圖4所示,腔室32與濺鍍裝置1之腔室31連結。<Pretreatment apparatus 2A> The pretreatment apparatus 2A includes: a chamber 32 with an internally formed depressurized atmosphere, a canister roller 26, a plurality of (two in Figure 4) guide rollers 22, and a plasma discharge device 42. As shown in Figure 4, the canister roller 26, the guide rollers 22, and the plasma discharge device 42 are disposed within the chamber 32. As shown in Figure 4, the chamber 32 is connected to the chamber 31 of the sputtering apparatus 1.
罐輥26及導輥22以特定之搬送速度搬送自輥捲出裝置4輸送之形成有硬塗層12之透明基材11,並將硬塗層12之表面已處理過之透明基材11送出至濺鍍裝置1。如圖4所示,電漿放電裝置42係隔開特定間隔地與罐輥26之外周面對向配置。電漿放電裝置42藉由輝光放電使氣體游離。氣體較佳為價格低廉且不影響光學特性之惰性氣體,例如可使用氬氣、氧氣、氮氣、氦氣等。氣體較佳為使用氬氣,原因在於其質量大、化學性穩定且容易獲取。於本實施方式中,電漿放電裝置42較佳為使用藉由高頻電漿使氬氣離子化之輝光放電裝置。The canister roller 26 and guide roller 22 convey the transparent substrate 11 with a hard coating 12, which is transported by the roller unwinding device 4, at a specific conveying speed, and deliver the transparent substrate 11 with the hard coating 12 already treated to the sputtering device 1. As shown in Figure 4, the plasma discharge device 42 is arranged opposite to the outer peripheral surface of the canister roller 26 at specific intervals. The plasma discharge device 42 ionizes the gas by fluorescent discharge. The gas is preferably an inexpensive inert gas that does not affect the optical properties, such as argon, oxygen, nitrogen, helium, etc. Argon is preferred because it has a large mass, is chemically stable, and is readily available. In this embodiment, the plasma discharge device 42 is preferably a luminescent discharge device that uses high-frequency plasma to ionize argon gas.
<濺鍍裝置>濺鍍裝置1具有:內部形成為特定之減壓氛圍之腔室31、將腔室31內之氣體排出而形成減壓氛圍之1個或複數個真空泵21(圖4中為2個)、成膜輥25、複數個(圖4中為2個)導輥22、及複數個(圖4所示之例中為4個)成膜部41。如圖4所示,成膜輥25、導輥22、及成膜部41係設置於腔室31內。如圖4所示,腔室31與預處理裝置2B之腔室32連結。<Splashing Apparatus> The splashing apparatus 1 includes: a chamber 31 with an internally formed depressurized atmosphere; one or more vacuum pumps 21 (two in FIG. 4) for venting gas from the chamber 31 to form the depressurized atmosphere; a film-forming roller 25; a plurality of guide rollers 22 (two in FIG. 4); and a plurality of film-forming sections 41 (four in the example shown in FIG. 4). As shown in FIG. 4, the film-forming roller 25, the guide rollers 22, and the film-forming sections 41 are disposed within the chamber 31. As shown in FIG. 4, the chamber 31 is connected to the chamber 32 of the pretreatment apparatus 2B.
成膜輥25及導輥22以特定之搬送速度搬送自預處理裝置2A輸送之形成有表面經處理之硬塗層12之透明基材11,並將於硬塗層12上形成有密接層13及光學功能層14之透明基材11供給至預處理裝置2B。於圖4所示之濺鍍裝置1中,於在成膜輥25上移行之透明基材11之硬塗層12上藉由濺鍍來積層密接層13,並於其上交替地積層高折射率層14a及低折射率層14b,藉此形成光學功能層14。The film-forming roller 25 and guide roller 22 transport the transparent substrate 11 with a surface-treated hard coating layer 12 from the pretreatment device 2A at a specific transport speed, and supply the transparent substrate 11 with a bonding layer 13 and an optical functional layer 14 formed on the hard coating layer 12 to the pretreatment device 2B. In the sputtering apparatus 1 shown in FIG4, the bonding layer 13 is deposited on the hard coating layer 12 of the transparent substrate 11 moving on the film-forming roller 25 by sputtering, and a high refractive index layer 14a and a low refractive index layer 14b are alternately deposited thereon, thereby forming the optical functional layer 14.
成膜部41係隔開特定間隔地與成膜輥25之外周面對向配置,且圍繞成膜輥25設置有複數個。成膜部41之數量係根據密接層13及形成光學功能層14之高折射率層14a與低折射率層14b之合計積層數來決定。於因密接層13及形成光學功能層14之高折射率層14a與低折射率層14b之合計積層數較多,而難以確保相鄰之成膜部41間之距離之情形時,亦可於腔室31內設置複數個成膜輥25,並於各成膜輥25之周圍配置成膜部41。於設置複數個成膜輥25之情形時,亦可視需要進而設置導輥22。亦可將複數個設置有成膜輥25及成膜部41之腔室31連結。又,為了易於確保相鄰之成膜部41間之距離,亦可適當地變更成膜輥25之直徑。The film-forming sections 41 are arranged facing the outer peripheral surface of the film-forming rollers 25 at specific intervals, and a plurality of them are arranged around the film-forming rollers 25. The number of film-forming sections 41 is determined based on the total number of layers of the close-packed layer 13 and the high-refractive-index layer 14a and low-refractive-index layer 14b forming the optical functional layer 14. When it is difficult to ensure the distance between adjacent film-forming sections 41 because the total number of layers of the close-packed layer 13 and the high-refractive-index layer 14a and low-refractive-index layer 14b forming the optical functional layer 14 is large, a plurality of film-forming rollers 25 may be arranged in the chamber 31, and film-forming sections 41 may be arranged around each film-forming roller 25. When multiple film-forming rollers 25 are provided, guide rollers 22 may also be provided as needed. Multiple chambers 31 equipped with film-forming rollers 25 and film-forming parts 41 may also be connected. Furthermore, in order to easily ensure the distance between adjacent film-forming parts 41, the diameter of the film-forming rollers 25 may be appropriately changed.
於各成膜部41分別設置有特定之靶(未圖示)。藉由公知之構造對靶施加電壓。於本實施方式中,於靶附近設置有以特定之流量向靶供給特定之反應性氣體及載氣之氣體供給部(未圖示)、及於靶之表面形成磁場之公知之磁場產生源(未圖示)。Each film-forming section 41 has a specific target (not shown). A voltage is applied to the target using a known structure. In this embodiment, a gas supply section (not shown) that supplies specific reactive gas and carrier gas to the target at a specific flow rate, and a known magnetic field generating source (not shown) that forms a magnetic field on the surface of the target are provided near the target.
靶之材料、及反應性氣體之種類及流量係根據藉由通過成膜部41與成膜輥25之間而形成於透明基材11上之密接層13、高折射率層14a、低折射率層14b之組成來適當決定。例如,為了形成包含SiO2作為主成分之層作為低折射率層14b,將Si用作靶,將O2用作反應性氣體。又,例如,於形成包含Nb2O5作為主成分之高折射率層14a之情形時,將Nb用作靶,將O2用作反應性氣體。The target material, and the type and flow rate of the reactive gas, are appropriately determined based on the composition of the close-bonding layer 13, the high-refractive-index layer 14a, and the low-refractive-index layer 14b formed on the transparent substrate 11 through the film-forming section 41 and the film-forming roller 25. For example, in order to form a low-refractive-index layer 14b containing SiO2 as the main component, Si is used as the target and O2 is used as the reactive gas. Similarly, for example, in the case of forming a high-refractive-index layer 14a containing Nb2O5 as the main component, Nb is used as the target and O2 is used as the reactive gas.
於本實施方式中,就成膜速度之高速化之觀點而言,濺鍍法較佳為使用磁控濺鍍法。再者,濺鍍法並不限定於磁控濺鍍法,亦可使用利用藉由直流輝光放電或高頻而產生之電漿之兩極濺鍍方式、附加熱陰極之三極濺鍍方式等。In this embodiment, from the viewpoint of increasing the film formation speed, magnetron sputtering is preferred. Furthermore, sputtering is not limited to magnetron sputtering; bipolar sputtering using plasma generated by DC glow discharge or high frequency, tripolar sputtering with an additional hot cathode, etc., can also be used.
濺鍍裝置1於成膜成為密接層13及光學功能層14之各層之後,具備作為測定光學特性之測定部之光學監視器(未圖示)。藉此,可確保已形成之密接層13及光學功能層14之品質。濺鍍裝置1於例如具有2個以上之腔室之情形時,較佳為於各腔室內設置光學監視器。After the sputtering apparatus 1 forms the bonding layer 13 and the optical functional layer 14, it is equipped with an optical monitor (not shown) as a measuring unit for measuring optical properties. This ensures the quality of the formed bonding layer 13 and optical functional layer 14. When the sputtering apparatus 1 has, for example, two or more chambers, it is preferable to install an optical monitor in each chamber.
光學監視器(未圖示)例如可例舉藉由可於寬度方向進行掃描之光學頭對形成於硬塗層12上之密接層13及光學功能層14於寬度方向之光學特性進行測定者。於具備此種光學監視器之情形時,例如可藉由測定反射率之峰值波長作為光學特性並換算為光學厚度,而對密接層13及光學功能層14於寬度方向之光學厚度分佈進行測定。藉由使用光學監視器來測定光學特性,可一面即時地調整濺鍍條件,一面形成具備具有最佳光學特性之密接層13及光學功能層14之光學積層體101、102。An optical monitor (not shown) may, for example, use an optical head capable of scanning in the width direction to measure the optical characteristics of the bonding layer 13 and the optical functional layer 14 formed on the hard coating layer 12 in the width direction. With such an optical monitor, for example, the optical thickness distribution of the bonding layer 13 and the optical functional layer 14 in the width direction can be measured by measuring the peak wavelength of the reflectivity as an optical characteristic and converting it into optical thickness. By using an optical monitor to measure the optical characteristics, the sputtering conditions can be adjusted in real time to form optical laminates 101 and 102 with optimal optical characteristics for the bonding layer 13 and the optical functional layer 14.
<預處理裝置2B>預處理裝置2B具有內部形成為特定之減壓氛圍之腔室32、罐輥26、複數個(圖4中為2個)導輥22、及電漿放電裝置44。如圖4所示,罐輥26、導輥22、及電漿放電裝置44係設置於腔室36內。預處理裝置2B與向腔室36內導入混合氣體之混合氣體調整單元60連接。如圖4所示,腔室36與蒸鍍裝置3之腔室33連結。<Pretreatment Unit 2B> The pretreatment unit 2B has a chamber 32 with an internally formed depressurized atmosphere, a canister roller 26, a plurality of (two in Figure 4) guide rollers 22, and a plasma discharge device 44. As shown in Figure 4, the canister roller 26, guide rollers 22, and plasma discharge device 44 are disposed within the chamber 36. The pretreatment unit 2B is connected to a gas mixing unit 60 that introduces a mixed gas into the chamber 36. As shown in Figure 4, the chamber 36 is connected to the chamber 33 of the evaporation unit 3.
罐輥26及導輥22以特定之搬送速度搬送自濺鍍裝置1輸送之形成有直至光學功能層14之各層之透明基材11,並將光學功能層14之表面經處理之透明基材11送出至蒸鍍裝置3。電漿放電裝置44例如可使用與預處理裝置2A相同者。The can roller 26 and guide roller 22 transport the transparent substrate 11, which is formed with each layer up to the optical functional layer 14, which is conveyed from the sputtering apparatus 1, at a specific conveying speed, and deliver the transparent substrate 11 with the surface treated of the optical functional layer 14 to the vapor deposition apparatus 3. The plasma discharge device 44 can be, for example, the same as the pretreatment device 2A.
如圖4所示,電漿放電裝置44係隔開特定間隔地與罐輥26之外周面對向配置。電漿放電裝置44係藉由輝光放電使氣體游離。氣體可使用水蒸氣及氬氣,此外,可混合氧氣、氮氣、氦氣等。即,可自混合氣體調整單元60向設置有電漿放電裝置44之腔室36導入包含H2O及氬氣之混合氣體。於本實施方式中,電漿放電裝置44較佳為使用藉由高頻電漿使氬氣離子化之輝光放電裝置。As shown in Figure 4, the plasma discharge device 44 is arranged facing the outer peripheral surface of the tank roller 26 at specific intervals. The plasma discharge device 44 ionizes the gas through fluorescent discharge. The gas can be water vapor and argon, and can also be a mixture of oxygen, nitrogen, helium, etc. That is, a mixture of gas containing H2O and argon can be introduced from the gas mixing unit 60 into the chamber 36 where the plasma discharge device 44 is provided. In this embodiment, the plasma discharge device 44 is preferably a fluorescent discharge device that ionizes argon using high-frequency plasma.
電漿處理步驟中之電極功率密度為1400 W/m2以上且44200 W/m2以下,例如為4400 W/m2以上且18000 W/m2以下,更佳為7000 W/m2以上且14000 W/m2以下。The electrode power density in the plasma treatment step is above 1400 W/ m² and below 44200 W/ m² , for example, above 4400 W/ m² and below 18000 W/m², more preferably above 7000 W/ m² and below 14000 W/ m² .
圖5係表示圖4所示之製造裝置中之預處理裝置2B之一例之圖。於圖5中,將圖4中簡化表示之混合氣體調整單元60之一例放大表示。混合氣體調整單元60例如具備氬氣供給源61、收容有水之水蒸氣供給源62、對水蒸氣供給源62進行加熱之加熱器63、與氬氣供給源61及水蒸氣供給源62連接之調整室65、將調整室65內之氣體排出之真空泵64及設置為可測定水蒸氣供給源62內之水之溫度之H2O溫度計66。圖5所示之符號NB之構成表示針閥,符號MFC之構成表示質量流量控制器。Figure 5 is a diagram showing an example of the pretreatment device 2B in the manufacturing apparatus shown in Figure 4. In Figure 5, an enlarged view is shown of an example of the simplified gas mixing unit 60 shown in Figure 4. The gas mixing unit 60 includes, for example, an argon gas supply source 61, a water vapor supply source 62 containing water, a heater 63 for heating the water vapor supply source 62, an adjustment chamber 65 connected to the argon gas supply source 61 and the water vapor supply source 62, a vacuum pump 64 for venting the gas from the adjustment chamber 65, and an H₂O thermometer 66 for measuring the temperature of the water in the water vapor supply source 62. The symbol NB in Figure 5 represents a needle valve, and the symbol MFC represents a mass flow controller.
調整室65內供給有氬氣及水蒸氣,氬氣由氬氣供給源供給,並藉由質量流量控制器(MFC1)測定流量,水蒸氣收容於水蒸氣供給源62,並藉由利用加熱器63進行加熱而蒸發。氬氣及水蒸氣之混合氣體自調整室65供給至腔室36內,且其流量由設置於調整室65與腔室36間之質量流量控制器(MFC2)調整,調整室65內之氣體中未供給至腔室36內之氣體則由真空泵64排出。Argon and water vapor are supplied to the conditioning chamber 65. The argon is supplied by an argon supply source and the flow rate is measured by a mass flow controller (MFC1). The water vapor is contained in a water vapor supply source 62 and evaporated by heating using a heater 63. The mixture of argon and water vapor is supplied from the conditioning chamber 65 to the chamber 36, and its flow rate is adjusted by a mass flow controller (MFC2) located between the conditioning chamber 65 and the chamber 36. Gas in the conditioning chamber 65 that is not supplied to the chamber 36 is discharged by a vacuum pump 64.
已知氬氣優先於水蒸氣自調整室65導入至腔室36內。腔室36內每種組成氣體之比率可藉由設置於腔室36內之分壓真空計(未圖示)進行測定。認為水蒸氣相對於供給至腔室36內之氬氣及水蒸氣之總和(混合氣體之總和)的流量比率依存於氬氣流量之絕對值。藉由預先對水蒸氣相對於混合氣體之總和之流量比率與氬氣流量之依存性進行實驗,可藉由調整氬氣流量而使水蒸氣相對於供給至腔室36內之混合氣體之總和之流量比率成為目標值。Argon gas is known to be introduced into chamber 36 from adjustment chamber 65 with priority over water vapor. The ratio of each component gas in chamber 36 can be measured by a partial pressure vacuum gauge (not shown) installed in chamber 36. It is assumed that the flow rate ratio of water vapor relative to the sum of argon and water vapor supplied to chamber 36 (the sum of the mixed gases) depends on the absolute value of the argon flow rate. By conducting experiments on the dependence of the flow rate ratio of water vapor relative to the sum of the mixed gases on the argon flow rate, the flow rate ratio of water vapor relative to the sum of the mixed gases supplied to chamber 36 can be adjusted to achieve a target value.
<蒸鍍裝置>蒸鍍裝置3具有內部形成為特定之減壓氛圍之腔室33、將腔室33內之氣體排出而形成減壓氛圍之1個或複數個真空泵21(圖4中為1個)、複數個(圖4中為4個)導輥22、蒸鍍源43、及加熱裝置53。如圖4所示,導輥22及蒸鍍源43係設置於腔室33內。腔室33與輥捲取裝置5之腔室35連結。The <Evaporation Apparatus> The evaporation apparatus 3 includes a chamber 33 with an internally formed depressurized atmosphere, one or more vacuum pumps 21 (one in Figure 4) for venting gas from the chamber 33 to form the depressurized atmosphere, multiple (four in Figure 4) guide rollers 22, an evaporation source 43, and a heating device 53. As shown in Figure 4, the guide rollers 22 and the evaporation source 43 are disposed within the chamber 33. The chamber 33 is connected to the chamber 35 of the roller take-up device 5.
蒸鍍源43係與透明基材11對向地配置,該透明基材11大致水平地於相鄰之2個導輥22間被搬送,且光學功能層14之表面經過處理。蒸鍍源43將包含成為防污層15之材料之蒸發氣體供給至光學功能層14上。蒸鍍源43之朝向可任意設定。加熱裝置53將成為防污層15之材料加熱至蒸氣壓溫度。加熱裝置53可使用利用電阻加熱方式、加熱器加熱方式、感應加熱方式、電子束方式進行加熱者等。於電阻加熱方式中,將收容成為防污層15之防污性材料之容器作為電阻體而進行通電加熱。於加熱器加熱方式中,利用配置容器外周之加熱器對容器進行加熱。於感應加熱方式中,由設置於外部之感應線圈藉由電磁感應作用對容器或防污性材料進行加熱。The vapor deposition source 43 is positioned opposite the transparent substrate 11, which is conveyed substantially horizontally between two adjacent guide rollers 22, and the surface of the optical functional layer 14 has been treated. The vapor deposition source 43 supplies vapor gas containing the material that forms the antifouling layer 15 to the optical functional layer 14. The orientation of the vapor deposition source 43 can be arbitrarily set. The heating device 53 heats the material that forms the antifouling layer 15 to the vapor pressure temperature. The heating device 53 can use methods such as resistance heating, heater heating, induction heating, or electron beam heating. In the resistance heating method, the container housing the antifouling material that forms the antifouling layer 15 is energized and heated as a resistor. In the heating method using a heater, the container is heated by a heater positioned around its outer periphery. In the induction heating method, the container or antifouling material is heated by an externally mounted induction coil through electromagnetic induction.
蒸鍍裝置3具備將以蒸鍍源43蒸發之蒸鍍材料引導至特定位置之引導板(未圖示)、對藉由蒸鍍所形成之防污層15之厚度進行觀察之膜厚計(未圖示)、測定腔室33內之壓力之真空壓計(未圖示)、及電源裝置(未圖示)。引導板只要可將已蒸發之蒸鍍材料引導至所期望之位置,則可為任意形狀。若無需要,亦可不具備引導板。真空壓計例如可使用離子計等。電源裝置例如可例舉高頻電源等。The vapor deposition apparatus 3 includes a guide plate (not shown) for guiding the vapor deposition material evaporated from the vapor deposition source 43 to a specific position, a film thickness gauge (not shown) for observing the thickness of the antifouling layer 15 formed by vapor deposition, a vacuum gauge (not shown) for measuring the pressure inside the chamber 33, and a power supply device (not shown). The guide plate can be of any shape as long as it can guide the evaporated vapor deposition material to the desired position. If not needed, the guide plate can be omitted. The vacuum gauge can be, for example, an ion meter. The power supply device can be, for example, a high-frequency power supply.
<輥捲取裝置>輥捲取裝置5具有內部形成為特定之減壓氛圍之腔室35、將腔室35內之氣體排出而形成減壓氛圍之1個或複數個真空泵21(圖4中為1個)、及設置於腔室35內之捲取輥24及導輥22。捲取輥24上捲繞有表面形成有直至防污層15為止之各層之透明基材11(光學積層體101、102)。捲取輥24及導輥22以特定之捲取速度捲取光學積層體101、102。亦可視需要使用載膜。<Roller Winding Device> The roller winding device 5 has a chamber 35 with an internally formed depressurized atmosphere, one or more vacuum pumps 21 (one in Figure 4) to expel gas from the chamber 35 to form a depressurized atmosphere, and a winding roller 24 and a guide roller 22 disposed within the chamber 35. A transparent substrate 11 (optical laminates 101, 102) with layers formed on its surface up to an antifouling layer 15 is wound around the winding roller 24. The winding roller 24 and the guide roller 22 wind the optical laminates 101, 102 at a specific winding speed. A carrier film may also be used if necessary.
製造裝置20所具備之真空泵21例如可使用乾式真空泵、油旋泵、渦輪分子泵、油擴散泵、低溫泵、濺射離子泵、吸氣泵等。真空泵21可適當選擇或進行組合而使用以於各腔室31、32、33、34、35中形成所期望之減壓狀態。The vacuum pump 21 provided with the manufacturing apparatus 20 may be, for example, a dry vacuum pump, an oil swirl pump, a turbine molecular pump, an oil diffusion pump, a cryogenic pump, a sputtering ion pump, a suction pump, etc. The vacuum pump 21 may be appropriately selected or combined for use to create the desired reduced pressure state in each of the chambers 31, 32, 33, 34, and 35.
真空泵21只要可將濺鍍裝置1之腔室31及蒸鍍裝置3之腔室33兩者維持於所期望之減壓狀態即可,製造裝置20中之真空泵21之設置位置及數量並無特別限定。又,於圖4所示之製造裝置20中,輥捲出裝置4、預處理裝置2A、濺鍍裝置1、預處理裝置2B、蒸鍍裝置3及輥捲取裝置5連結。因此,真空泵21可分別設置於腔室31、32、33、34、35,若可將濺鍍裝置1之腔室31及蒸鍍裝置3之腔室33兩者維持於所期望之減壓狀態,則亦可僅設置於腔室31、32、33、34、35中之部分腔室。The vacuum pump 21 only needs to maintain both the chamber 31 of the sputtering apparatus 1 and the chamber 33 of the evaporation apparatus 3 at the desired depressurization state. There are no particular limitations on the location and number of vacuum pumps 21 in the manufacturing apparatus 20. Furthermore, in the manufacturing apparatus 20 shown in Figure 4, the roller winding device 4, the pretreatment device 2A, the sputtering apparatus 1, the pretreatment device 2B, the evaporation apparatus 3, and the roller winding device 5 are connected. Therefore, vacuum pump 21 can be installed in chambers 31, 32, 33, 34, and 35 respectively. If chamber 31 of sputtering device 1 and chamber 33 of evaporation device 3 can be maintained in the desired depressurized state, it can also be installed in only some of the chambers 31, 32, 33, 34, and 35.
其次,對使用圖4所示之製造裝置20對基材進行高折射率層形成步驟、低折射率層形成步驟、電漿處理步驟及防污層形成步驟,並利用輥對輥方式製造光學積層體101、102之方法進行說明。Next, the method of using the manufacturing apparatus 20 shown in Figure 4 to perform a high refractive index layer formation step, a low refractive index layer formation step, a plasma treatment step, and an antifouling layer formation step on a substrate, and to manufacture optical laminates 101 and 102 using a roller-to-roll method will be explained.
首先,於輥捲出裝置4之腔室34內設置捲繞有表面形成有硬塗層12之透明基材11之捲出輥23。繼而,使捲出輥23及導輥22旋轉,從而以特定之搬送速度將表面形成有硬塗層12之透明基材11送出至預處理裝置2A。First, an extrusion roller 23, on which a transparent substrate 11 with a hard coating 12 is formed on its surface, is disposed in the chamber 34 of the roller extrusion device 4. Then, the extrusion roller 23 and the guide roller 22 are rotated, thereby conveying the transparent substrate 11 with the hard coating 12 on its surface to the pretreatment device 2A at a specific conveying speed.
其次,於預處理裝置2A之腔室32內,進行表面處理步驟作為對要形成密接層13及光學功能層14之表面進行之預處理。於本實施方式中,對形成有硬塗層12之透明基材11進行表面處理步驟。於表面處理步驟中,使罐輥26及導輥22旋轉,從而一面以特定之搬送速度搬送形成有硬塗層12之透明基材11,一面對在罐輥26上移行之硬塗層12之表面進行處理。Next, a surface treatment step is performed in chamber 32 of pretreatment device 2A as a pretreatment of the surface to which the bonding layer 13 and optical functional layer 14 are to be formed. In this embodiment, a surface treatment step is performed on the transparent substrate 11 to which the hard coating layer 12 is formed. In the surface treatment step, the can roller 26 and guide roller 22 are rotated, thereby conveying the transparent substrate 11 to which the hard coating layer 12 is formed at a specific conveying speed, and treating the surface of the hard coating layer 12 moving on the can roller 26.
硬塗層12之表面處理方法例如可使用輝光放電處理、電漿處理、離子蝕刻、鹼處理等。該等之中,較佳為使用輝光放電處理,原因在於可進行大面積處理。輝光放電處理例如可以0.1 kwh~10 kwh之處理強度進行。藉由對硬塗層12之表面進行輝光放電處理,硬塗層12之表面於奈米等級被粗化,並且存在於硬塗層12之表面之結合力較弱之物質被去除。其結果為,硬塗層12與形成於硬塗層12上之光學功能層14之密接性變良好。The surface treatment methods for the hard coating layer 12 can include, for example, fluorescent discharge treatment, plasma treatment, ion etching, and alkaline treatment. Among these, fluorescent discharge treatment is preferred because it allows for large-area treatment. Fluorescent discharge treatment can be performed at a treatment intensity of, for example, 0.1 kWh to 10 kWh. By performing fluorescent discharge treatment on the surface of the hard coating layer 12, the surface of the hard coating layer 12 is roughened at the nanoscale, and substances with weak adhesion on the surface of the hard coating layer 12 are removed. As a result, the adhesion between the hard coating layer 12 and the optical functional layer 14 formed on the hard coating layer 12 becomes better.
其次,於濺鍍裝置1之腔室31內進行密接層形成步驟及光學功能層形成步驟。具體而言,使成膜輥25及導輥22旋轉,從而一面以特定之搬送速度搬送形成有硬塗層12之透明基材11,一面於在成膜輥25上移行之硬塗層12上形成密接層13及光學功能層14。Next, a bonding layer formation step and an optical functional layer formation step are performed in the chamber 31 of the sputtering apparatus 1. Specifically, the film-forming roller 25 and the guide roller 22 are rotated, thereby conveying the transparent substrate 11 with the hard coating layer 12 formed at a specific conveying speed, and forming a bonding layer 13 and an optical functional layer 14 on the hard coating layer 12 moving on the film-forming roller 25.
其次,於濺鍍裝置1之腔室31內進行密接層形成步驟及光學功能層形成步驟。關於密接層形成步驟及光學功能層形成步驟,例如使成膜輥25及導輥22旋轉,從而一面以特定之搬送速度搬送形成有硬塗層12之透明基材11一面進行該等步驟。Next, a bonding layer formation step and an optical functional layer formation step are performed in the chamber 31 of the sputtering apparatus 1. For example, the bonding layer formation step and the optical functional layer formation step are performed by rotating the film forming roller 25 and the guide roller 22, thereby conveying the transparent substrate 11 with the hard coating layer 12 formed at a specific conveying speed.
於本實施方式中,首先,使設置於各成膜部41之靶之材料、或自氣體供給部供給之反應性氣體之種類及流量變化而進行濺鍍,藉此形成密接層13,繼而於基材上交替地積層高折射率層14a及低折射率層14b作為高折射率層形成步驟及低折射率層形成步驟。於高折射率層形成步驟中,直接或介隔其他層於基材上形成高折射率層。此處,於本實施方式中,基材上意指透明基材11上,可不與透明基材11直接接觸。於本實施方式中,介隔硬塗層12及密接層13而於透明基材11上形成高折射率層14a及低折射率層14b。In this embodiment, firstly, sputtering is performed on the material of the target disposed on each film-forming section 41, or on the reactive gas supplied from the gas supply section, by varying the type and flow rate, thereby forming a close-fitting layer 13. Then, a high-refractive-index layer 14a and a low-refractive-index layer 14b are alternately deposited on the substrate as high-refractive-index layer formation steps and low-refractive-index layer formation steps. In the high-refractive-index layer formation step, a high-refractive-index layer is formed on the substrate directly or through other layers. Here, in this embodiment, "on the substrate" means on the transparent substrate 11, and does not necessarily involve direct contact with the transparent substrate 11. In this embodiment, a high refractive index layer 14a and a low refractive index layer 14b are formed on a transparent substrate 11 by separating the hard coating layer 12 and the bonding layer 13.
於成膜SiOx膜作為密接層13之情形時,使用矽靶而導入氧氣及氬氣。於藉由濺鍍而連續地積層密接層13、高折射率層14a及低折射率層14b之情形時,亦可於成膜密接層13時、成膜高折射率層14a時及成膜低折射率層14b時將靶之材料製膜。又,亦可例如將1種材料用作靶,並藉由改變濺鍍時之氧(反應性氣體)流量而交替形成由靶材料構成之層及由靶材料之氧化物構成之層作為密接層13、高折射率層14a及低折射率層14b。When a SiOx film is used as the bonding layer 13, a silicon target is used to introduce oxygen and argon. When the bonding layer 13, the high-refractive-index layer 14a, and the low-refractive-index layer 14b are continuously deposited by sputtering, the target material can also be formed during the formation of the bonding layer 13, the high-refractive-index layer 14a, and the low-refractive-index layer 14b. Alternatively, for example, a single material can be used as the target, and by varying the oxygen (reactive gas) flow rate during sputtering, layers composed of the target material and layers composed of oxides of the target material can be alternately formed as the bonding layer 13, the high-refractive-index layer 14a, and the low-refractive-index layer 14b.
於低折射率層形成步驟時,於腔室31內在不導入H2O之乾燥氛圍下進行。若於低折射率層形成步驟時導入H2O,則有如下之虞:構成低折射率層之光學功能層內部之SiO2因水解而溶解,形成SiOH,光學積層體之特性偏離目標特性。若光學功能層內部之矽氧烷鍵被切斷而生成羥基,則光學積層體中之SiO2之結合能降低。認為與光學功能層內部而非表面之Si元素結合之羥基不會被矽烷偶合劑取代,因此與遠離低折射率層表面之內部之Si元素結合之羥基即便經過防污層形成步驟亦無助於提高光學積層體之耐鹼性。During the low-refractive-index layer formation step, the process is carried out in chamber 31 under a dry atmosphere without the introduction of H₂O . If H₂O is introduced during the low-refractive-index layer formation step, the following risks exist: SiO₂ within the optical functional layer constituting the low-refractive-index layer may dissolve due to hydrolysis, forming SiOH, causing the characteristics of the optical laminate to deviate from the target characteristics. Furthermore, if the siloxane bonds within the optical functional layer are cleaved to generate hydroxyl groups, the binding energy of SiO₂ within the optical laminate will decrease. It is believed that hydroxyl groups bonded to Si elements inside the optical functional layer rather than on the surface will not be replaced by silane coupling agents. Therefore, even if the antifouling layer formation step is carried out, hydroxyl groups bonded to Si elements inside the layer that are far from the surface of the low refractive index layer will not help improve the alkali resistance of the optical laminate.
形成密接層13及光學功能層14時之濺鍍之壓力可為2 Pa以下,較佳為1 Pa以下,更佳為0.6 Pa以下,尤佳為0.2 Pa以下。若為濺鍍時之壓力為1 Pa以下之減壓下之狀態,則成膜分子之平均自由步驟變長,會以成膜分子之能量較高之狀態積層,因此膜較緻密且膜質更良好。The sputtering pressure during the formation of the close-packed layer 13 and the optical functional layer 14 can be below 2 Pa, preferably below 1 Pa, more preferably below 0.6 Pa, and even more preferably below 0.2 Pa. If the sputtering pressure is below 1 Pa under reduced pressure, the mean free step length of the film-forming molecules increases, and the film will be deposited in a state with higher energy, resulting in a denser film and better film quality.
其後,藉由成膜輥25及導輥22之旋轉將於硬塗層12上形成有密接層13及光學功能層14之透明基材11送出至預處理裝置2B。於預處理裝置2B中進行電漿處理步驟。於電漿處理步驟中,於導入水蒸氣及氬氣之混合氣體之環境下對低折射率層14b進行電漿處理。即,電漿處理步驟係於存在H2O及Ar作為反應性氣體之氛圍下進行。於電漿處理步驟中導入之混合氣體較佳為僅包含水蒸氣及氬氣。進行電漿處理步驟之預處理裝置2B之腔室32內之氛圍較佳為包含水蒸氣及氬氣之氛圍。Subsequently, the transparent substrate 11, on which the bonding layer 13 and the optical functional layer 14 are formed on the hard coating layer 12, is fed to the pretreatment apparatus 2B by the rotation of the film-forming roller 25 and the guide roller 22. An electroplating process is performed in the pretreatment apparatus 2B. In the electroplating process, the low refractive index layer 14b is electroplated in an environment containing a mixture of water vapor and argon. That is, the electroplating process is carried out in an atmosphere containing H₂O and Ar as reactive gases. Preferably, the mixed gas introduced in the electroplating process contains only water vapor and argon. The atmosphere in chamber 32 of the pretreatment device 2B for the plasma treatment step is preferably an atmosphere containing water vapor and argon.
於預處理裝置2B中對形成防污層15之前之光學積層體的位於最表面之低折射率層14b進行預處理。預處理係於存在水蒸氣及氬氣之氛圍下,對低折射率層14b之表面進行電漿處理。具體而言,使用電漿放電裝置44對氬氣及水蒸氣之一者或兩者進行藉由高頻電漿而離子化之輝光放電處理。In the pretreatment apparatus 2B, the low-refractive-index layer 14b, the outermost layer of the optical laminate before the formation of the antifouling layer 15, is pretreated. The pretreatment is performed by plasma treatment of the surface of the low-refractive-index layer 14b in the presence of water vapor and argon. Specifically, a plasma discharge apparatus 44 is used to perform luminescent discharge treatment on one or both of the argon and water vapor by ionization using high-frequency plasma.
如上所述,腔室36內之氛圍為存在水蒸氣及氬氣之氛圍下,此外可混合氧氣、氮氣、氦氣等,但較佳為僅包含水蒸氣及氬氣之氛圍。向腔室36內導入水蒸氣及氬氣例如可藉由混合氣體調整單元60來進行。於混合氣體調整單元60中,自調整室65將通過質量流量控制器(MFC2)及針閥(NB)之混合氣體導入至腔室36內。如上所述,調整室65供給有來自氬氣供給源61之經質量流量控制器(MFC1)測定過流量之氬氣及來自水蒸氣供給源62之水蒸氣。關於自調整室65導入至腔室36內之混合氣體,確認到氬氣之導入優先於水蒸氣之導入。因此,供給至腔室36內之混合氣體中水蒸氣之流量比率(目標%)可基於預先藉由實驗所確認之向腔室36內供給之氬氣及水蒸氣之總和中水蒸氣相對於向腔室36內供給之氬氣之流量的流量比率之依存性之近似曲線而算出。As described above, the atmosphere within chamber 36 is an atmosphere containing water vapor and argon, and may also contain oxygen, nitrogen, helium, etc., but preferably only water vapor and argon. The introduction of water vapor and argon into chamber 36 can be performed, for example, by a gas mixing unit 60. In the gas mixing unit 60, the mixed gas, passing through a mass flow controller (MFC2) and a needle valve (NB), is introduced into chamber 36 from the adjusting chamber 65. As described above, the adjusting chamber 65 is supplied with argon from the argon supply source 61 at a flow rate determined by the mass flow controller (MFC1) and water vapor from the water vapor supply source 62. Regarding the mixed gas introduced from the adjustment chamber 65 into the chamber 36, it was confirmed that the introduction of argon gas takes precedence over the introduction of water vapor. Therefore, the flow rate ratio (target %) of water vapor in the mixed gas supplied to the chamber 36 can be calculated based on an approximate curve of the dependence of the flow rate ratio of water vapor relative to the flow rate of argon gas supplied to the chamber 36 in the total amount of argon and water vapor supplied to the chamber 36, which was previously confirmed by experiments.
導入至腔室36內之混合氣體中水蒸氣之流量比率(目標%)例如可設為2%以上且100%以下,較佳為設為10%以上且90%以下。藉由於上述條件下進行電漿處理步驟,光學積層體中之低折射率層14b表面親水化,於下述防污層形成步驟中,構成防污層之氟系有機化合物容易與低折射率層14b中所生成之羥基結合。因此,可使於光學積層體101、102最表面構成防污層之氟系有機化合物之量增大。若腔室36內之氛圍之含水量之比率過剩,則羥基之一部分不會與氟系有機化合物結合,一部分羥基殘存於表面。認為於將光學積層體曝露於鹼性溶液或氛圍之情形時,鹼金屬被表面之H所取代,導致由鹼性溶液或氛圍引起之劣化。由於此種機制,認為於電漿處理步驟之氛圍中之含水量之比率為特定值以下之情形時,長期耐鹼性變得特別高。The flow rate ratio (target %) of water vapor in the mixed gas introduced into chamber 36 can be set to, for example, 2% or more and 100% or less, preferably 10% or more and 90% or less. By performing the plasma treatment step under the above conditions, the surface of the low-refractive-index layer 14b in the optical laminate becomes hydrophilic. During the antifouling layer formation step described below, the fluorine-based organic compounds constituting the antifouling layer readily combine with the hydroxyl groups generated in the low-refractive-index layer 14b. Therefore, the amount of fluorine-based organic compounds constituting the antifouling layer on the outermost surface of the optical laminates 101 and 102 can be increased. If the water content ratio of the atmosphere in chamber 36 is excessive, a portion of the hydroxyl groups will not combine with the fluorine-based organic compounds, and a portion of the hydroxyl groups will remain on the surface. It is believed that when optical laminates are exposed to alkaline solutions or atmospheres, the alkali metals are replaced by hydrogen on the surface, leading to degradation caused by the alkaline solution or atmosphere. Due to this mechanism, it is believed that long-term alkali resistance becomes particularly high when the water content ratio in the atmosphere of the plasma treatment step is below a certain value.
再者,於圖4及圖5所示之預處理裝置2B中,混合氣體中之氬氣及水蒸氣係暫時儲存於調整室65後進行供給而供給至腔室36內,因此腔室36內之氛圍中之水蒸氣相對於氬氣及水蒸氣之總和的比率未必與上述混合氣體中之水蒸氣之流量比率一致。存在於腔室36內之氛圍中之水蒸氣相對於水蒸氣及氬氣之總和的比率(實際比率)例如超過0.5%且為70%以下,較佳為6%以上且65%以下,更佳為6.5%以上且50%以下。Furthermore, in the pretreatment apparatus 2B shown in Figures 4 and 5, the argon and water vapor in the mixed gas are temporarily stored in the adjustment chamber 65 before being supplied to the chamber 36. Therefore, the ratio of water vapor in the atmosphere of the chamber 36 to the sum of argon and water vapor may not be consistent with the flow rate ratio of water vapor in the mixed gas. The ratio (actual ratio) of water vapor in the atmosphere of the chamber 36 to the sum of water vapor and argon is, for example, more than 0.5% and less than 70%, preferably more than 6% and less than 65%, and more preferably more than 6.5% and less than 50%.
電漿處理步驟時之腔室內之全壓較佳為設為0.008 Pa以上且0.02 Pa以下。The total pressure in the chamber during the plasma treatment step is preferably set to be above 0.008 Pa and below 0.02 Pa.
其後,藉由罐輥26及導輥22之旋轉,將光學功能層14之表面經過處理之透明基材11送出至蒸鍍裝置3。其次,於蒸鍍裝置3之腔室33內進行防污層形成步驟。於本實施方式中,對最表面之低折射率層14b之表面於電漿處理步驟中經過電漿處理之積層體進行防污層形成步驟。於防污層形成步驟中,使導輥22旋轉,從而一面以特定之搬送速度搬送光學功能層14之表面經過處理之透明基材11,一面將蒸鍍源43蒸鍍於光學功能層14之表面。Subsequently, the transparent substrate 11 with the surface treated of the optical functional layer 14 is conveyed to the vapor deposition apparatus 3 by the rotation of the tank roller 26 and the guide roller 22. Next, an antifouling layer formation step is performed in the chamber 33 of the vapor deposition apparatus 3. In this embodiment, an antifouling layer formation step is performed on the laminate formed by plasma treatment of the surface of the outermost low refractive index layer 14b in the plasma treatment step. In the antifouling layer formation step, the guide roller 22 is rotated, thereby conveying the transparent substrate 11 with the surface treated of the optical functional layer 14 at a specific conveying speed, while the vapor deposition source 43 is deposited on the surface of the optical functional layer 14.
於本實施方式中,例如將成為防污層15之包含氟系有機化合物之防污性材料藉由加熱裝置53加熱至蒸氣壓溫度,於減壓環境下自蒸鍍源43供給所獲得之蒸發氣體,使其附著於表面經過處理之光學功能層14,並藉由真空蒸鍍形成防污層15。關於防污性材料,可較佳地使用包含氟改性有機基、及反應性矽烷基(例如烷氧基矽烷)之化合物作為氟系有機化合物。市售品可例舉OPTOOL DSX(Daikin股份有限公司製造)、KY-100 Series(信越化學工業股份有限公司製造)等。In this embodiment, for example, the antifouling material containing a fluorinated organic compound, which becomes the antifouling layer 15, is heated to a vapor pressure temperature by a heating device 53. Under reduced pressure, the obtained vaporized gas is supplied from the vapor deposition source 43, causing it to adhere to the surface-treated optical functional layer 14, and the antifouling layer 15 is formed by vacuum vapor deposition. Regarding the antifouling material, compounds containing fluorinated modified organic groups and reactive silyl groups (e.g., alkoxysilanes) are preferably used as the fluorinated organic compound. Commercially available examples include OPTOOL DSX (manufactured by Daikin Co., Ltd.) and KY-100 Series (manufactured by Shin-Etsu Chemical Co., Ltd.).
進行防污層15之真空蒸鍍時之壓力例如較佳為0.05 Pa以下,更佳為0.01 Pa以下,尤佳為0.001 Pa以下。若進行真空蒸鍍時之壓力為0.05 Pa以下之減壓下之狀態,則成膜分子之平均自由步驟較長,蒸鍍能變高,因此獲得緻密且更良好之防污層15。The pressure during vacuum evaporation of the antifouling layer 15 is preferably 0.05 Pa or less, more preferably 0.01 Pa or less, and even more preferably 0.001 Pa or less. If the pressure during vacuum evaporation is reduced to 0.05 Pa or less, the mean free step of the film-forming molecules is longer, the evaporation energy is higher, and thus a denser and better antifouling layer 15 is obtained.
藉由如上所述之方法,可製造如圖1及圖2所示之光學積層體101、102。Optical laminates 101 and 102, as shown in Figures 1 and 2, can be manufactured using the method described above.
本實施方式之光學積層體亦可為不具有硬塗層12及密接層13之光學積層體。於形成此種光學積層體之情形時,亦可使用不具有硬塗層12之基板、即由透明基材11構成之基板,可省略表面處理步驟及密接層形成步驟。又,於本實施方式中,所謂於基板上只要較透明基材11位於上方即可,可為不與透明基材11接觸之構成。The optical laminate of this embodiment can also be an optical laminate without the hard coating layer 12 and the bonding layer 13. When forming such an optical laminate, a substrate without the hard coating layer 12, i.e., a substrate composed of a transparent substrate 11, can also be used, thus omitting the surface treatment step and the bonding layer formation step. Furthermore, in this embodiment, the term "above the transparent substrate 11" is sufficient; the substrate can be configured not to contact the transparent substrate 11.
根據上述實施方式,藉由於導入氬氣及水蒸氣之混合氣體之條件下進行電漿處理步驟,除利用氬氣之電漿處理所產生之與距光學功能層14表面數nm之最表面之Si鍵結之羥基外,亦由光學功能層14之最表面附近之SiO鍵之水解而生成羥基,藉此可易於與構成防污層15之具有反應性矽烷基之氟系有機化合物進行化學反應。即,可增加形成於光學功能層14上之防污層15之氟系有機化合物之量,即便鹼溶液附著於光學積層體101、102表面,亦可減少光學功能層14之SiO鍵之曝露量。此處,藉由於乾燥氛圍下形成低折射率層14b,可抑制低折射率層14b內部之無助於與防污層15之鍵結之羥基増大及水解,可抑制光學特性之劣化。According to the above-described embodiment, the plasma treatment step is performed under conditions of introducing a mixture of argon and water vapor. In addition to the hydroxyl groups generated by the argon plasma treatment and bonded to the Si bonds on the outermost surface of the optical functional layer 14 (a few nm away from the surface), hydroxyl groups are also generated by the hydrolysis of SiO bonds near the outermost surface of the optical functional layer 14. This allows for easy chemical reaction with the reactive silyl fluorinated organic compounds constituting the antifouling layer 15. That is, the amount of fluorinated organic compounds in the antifouling layer 15 formed on the optical functional layer 14 can be increased, and even if alkaline solutions adhere to the surfaces of the optical layers 101 and 102, the exposure of SiO bonds in the optical functional layer 14 can be reduced. Here, by forming a low refractive index layer 14b in a dry atmosphere, the growth and hydrolysis of hydroxyl groups inside the low refractive index layer 14b that do not contribute to the bonding with the antifouling layer 15 can be suppressed, thereby suppressing the deterioration of optical properties.
又,藉由對低折射率層14b進行之電漿處理步驟中之輝光放電處理,可提高光學功能層14之表面能,可易於接著防污層15。藉由輝光放電,出現親水化而水接觸角變小,可減少無法與基板接著而游離之氟系有機化合物。根據本實施方式,可以此方式提供長期耐鹼性優異之光學積層體。Furthermore, the glow discharge treatment in the plasma processing step of the low refractive index layer 14b can improve the surface energy of the optical functional layer 14, making it easier to attach the antifouling layer 15. Through glow discharge, hydrophilicity occurs, and the water contact angle decreases, reducing the amount of fluorine-based organic compounds that cannot bond to the substrate and thus become free. According to this embodiment, an optical laminate with excellent long-term alkali resistance can be provided in this way.
以上,對本發明之實施方式進行了詳細說明,但本發明並不限定於上述實施方式,而可於申請專利範圍內所記載之本發明之主旨之範圍內進行各種省略、替換、變化/變更。該等實施方式或其變化包含於發明之範圍或主旨內,同樣地亦包含於申請專利範圍所記載之發明及其均等之範圍內。The embodiments of this invention have been described in detail above. However, this invention is not limited to the above embodiments, and various omissions, substitutions, changes/modifications may be made within the scope of the spirit of this invention as recorded in the patent application. Such embodiments or changes thereof are included in the scope or spirit of the invention, and likewise, they are also included in the scope of the invention as recorded in the patent application and its equivalents.
本說明書中所記載之數值範圍之上限值及/或下限值可分別任意進行組合而規定較佳之範圍。例如,可將數值範圍之上限值及下限值任意進行組合而規定較佳之範圍,可將數值範圍之上限值彼此任意進行組合而規定較佳之範圍,又,可將數值範圍之下限值彼此任意進行組合而規定較佳之範圍。The upper and/or lower limits of the numerical ranges described in this specification can be arbitrarily combined to define a better range. For example, the upper and lower limits of the numerical ranges can be arbitrarily combined to define a better range, the upper limits of the numerical ranges can be arbitrarily combined with each other to define a better range, and the lower limits of the numerical ranges can be arbitrarily combined with each other to define a better range.
應理解於本發明之全文中,除非另有說明,否則單數形式之表述亦包含其複數形式之概念。因此,應理解除非另有說明,否則單數形式之冠詞(例如,於英語之情形時為「a」、「an」、「the」等)亦包含其複數形式之概念。It should be understood throughout this invention that, unless otherwise stated, the singular form of a statement also includes the concept of its plural form. Therefore, it should be understood that, unless otherwise stated, the singular articles (e.g., "a," "an," "the," etc. in the case of English) also include the concept of their plural forms.
[實施例]以下,對本發明之實施例進行說明。再者,以下之實施例及比較例中所製作之光學積層體為作為抗反射膜發揮作用之一例,本發明之主旨並不限定於其等。[Examples] Hereinafter, embodiments of the present invention will be described. Furthermore, the optical laminates produced in the following embodiments and comparative examples are examples of functions as antireflective films, and the purpose of the present invention is not limited to them.
(實施例1-1)首先,準備於厚度80 μm之TAC形成4 μm之包含氧化矽微粒子之丙烯酸樹脂製覆膜(硬塗層)而成之樹脂膜作為透明基材。(Example 1-1) First, a resin film containing silica microparticles and formed on a 4 μm thick TAC is prepared as a transparent substrate.
其次,以輥對輥方式,藉由以下所示之方法於形成有硬塗層之透明基材上形成密接層,繼而交替形成高折射率層及低折射率層作為光學功能層,並於形成光學功能層中位於最上面之低折射率層之後進行電漿處理步驟,其後形成防污層,藉此製作光學積層體(抗反射膜)。Secondly, using a roller-to-roll method, a close-fitting layer is formed on a transparent substrate with a hard coating, and then high-refractive-index and low-refractive-index layers are alternately formed as optical functional layers. After forming the uppermost low-refractive-index layer in the optical functional layers, a plasma treatment step is performed, followed by the formation of an antifouling layer, thereby producing an optical laminate (anti-reflective film).
製造裝置係使用圖4所示之製造裝置20。線速係設為2 m/min。形成光學積層體時之全壓係設為1 Pa以下。The manufacturing apparatus used is the manufacturing apparatus 20 shown in Figure 4. The linear velocity is set to 2 m/min. The total pressure during the formation of the optical laminate is set to 1 Pa or less.
對硬塗層12,將輝光放電處理之處理速度設為400 W・min/m2而進行輝光放電處理。繼而,於輝光放電處理後之硬塗層12上,於壓力1.0 Pa以下之腔室內藉由濺鍍成膜厚度5 nm之包含SiOx之密接層13,並於密接層上成膜由厚度15 nm之Nb2O5膜(高折射率層)、厚度38 nm之SiO2膜(低折射率層)、厚度30 nm之Nb2O5膜(高折射率層)、及厚度102 nm之SiO2膜(低折射率層)所組成之光學功能層14(積層體)。高折射率層及低折射率層之成膜係於未導入H2O之乾燥氛圍下進行。For the hard coating layer 12, a light discharge treatment is performed with a processing speed of 400 W·min/m 2. Subsequently, on the hard coating layer 12 after light discharge treatment, a 5 nm thick SiOx-containing bonding layer 13 is sputtered into a chamber with a pressure of less than 1.0 Pa. On the bonding layer, an optical functional layer 14 (laminated layer) is formed, consisting of a 15 nm thick Nb 2 O 5 film (high refractive index layer), a 38 nm thick SiO 2 film (low refractive index layer), a 30 nm thick Nb 2 O 5 film (high refractive index layer), and a 102 nm thick SiO 2 film (low refractive index layer). The high-refractive-index layer and the low-refractive-index layer were formed in a dry atmosphere without the introduction of H2O .
繼而,於存在水分及氬氣之氛圍下對上述低折射率層進行電漿處理。低折射率層表面之電漿處理係一面向腔室內導入水蒸氣及氬氣一面於H2O及Ar氛圍下進行。將自調整室65導入至腔室36內之水蒸氣及氬氣之總流量設為500 sccm,將自氬氣供給源61供給至調整室65之氬氣供給量設為500 sccm。藉此,於實施例1-1中,將導入至腔室36內之水蒸氣及氬氣之混合氣體中水蒸氣之流量比率設為10%,將氬氣之流量比率設為90%。有時將導入至腔室36內之水蒸氣及氬氣之混合氣體中水蒸氣之流量比率表示為H2O目標%。即,於實施例1-1中,H2O目標%為10%。H2O目標%係基於預先所獲得之與H2O比率平均值相關之近似曲線。氬氣之流量比率係根據該近似曲線及H2O目標%來決定。又,利用分壓真空計(ULVAC股份有限公司製造、型號:CGM051)測定腔室36內之氛圍中H2O、Ar、H2及O2各者之量之比率。腔室36內之氛圍中H2O之量之比率為9.4%。有時將腔室36內之氛圍中H2O之量之比率表示為H2O%。Next, the aforementioned low-refractive-index layer is subjected to plasma treatment in the presence of moisture and argon. The plasma treatment of the low-refractive-index layer surface is carried out in an atmosphere of H₂O and Ar while water vapor and argon are introduced into the chamber. The total flow rate of water vapor and argon introduced from the adjustment chamber 65 into the chamber 36 is set to 500 sccm, and the argon supply from the argon supply source 61 to the adjustment chamber 65 is set to 500 sccm. Thus, in Embodiment 1-1, the flow rate ratio of water vapor in the mixture of water vapor and argon introduced into the chamber 36 is set to 10%, and the flow rate ratio of argon is set to 90%. Sometimes the flow rate ratio of water vapor in the mixture of water vapor and argon introduced into chamber 36 is expressed as the target H₂O %. That is, in Embodiment 1-1, the target H₂O % is 10%. The target H₂O % is based on an approximate curve obtained beforehand that correlates with the average H₂O ratio. The flow rate ratio of argon is determined based on this approximate curve and the target H₂O %. Furthermore, the ratios of H₂O , Ar, H₂ , and O₂ in the atmosphere within chamber 36 are measured using a partial pressure vacuum gauge (manufactured by ULVAC Co., Ltd., model: CGM051). The ratio of H₂O in the atmosphere within chamber 36 is 9.4%. Sometimes the ratio of H₂O in the atmosphere within chamber 36 is expressed as H₂O .
上述與H2O比率平均值相關之近似曲線係藉由下述方法預先獲得。首先,使用實施例1-1中所使用之裝置,於與實施例1-1相同之環境下向腔室內供給特定量之氬氣及水蒸氣。此時,藉由設置於氬氣供給源及腔室之間之質量流量計測定氬氣之流量,進而藉由設置於腔室內之分壓真空計測定腔室內之每種組成氣體之比率。測定將氬氣設為10、20、50、100、150、175、200、250、300、400、500[SCCM]時水蒸氣相對於供給至腔室內之混合氣體之總和之比率,並繪製成曲線。繼而,由所繪製之資料,藉由非線性最小平方法製作出關於混合氣體之和中之水蒸氣相對於氬氣流量之流量比率的依存性之近似曲線。可由該近似曲線決定用以獲得特定之水蒸氣之氬氣流量。The approximate curve relating to the average H₂O ratio was obtained in advance using the following method. First, using the apparatus used in Example 1-1, a specific amount of argon and water vapor was supplied to the chamber under the same environment as in Example 1-1. At this time, the flow rate of argon was measured using a mass flow meter installed between the argon supply source and the chamber, and the ratio of each component gas in the chamber was measured using a partial pressure vacuum gauge installed in the chamber. The ratio of water vapor to the total amount of the mixed gas supplied to the chamber was measured when the argon was set to 10, 20, 50, 100, 150, 175, 200, 250, 300, 400, and 500 [SCCM], and the results were plotted as a curve. Then, using the plotted data, an approximate curve is generated regarding the dependence of the flow rate ratio of water vapor in the mixture relative to the argon flow rate using the nonlinear least squares method. The argon flow rate for obtaining a specific water vapor can be determined from this approximate curve.
於低折射率層之最表面進行輝光放電處理時之輝光放電處理之電極功率密度係設為4421(W/m2)。The electrode power density for the photoluminescence discharge treatment when performing photoluminescence discharge treatment on the outermost surface of the low refractive index layer is set to 4421 (W/m 2 ).
其次,於光學功能層上,於蒸鍍腔室內壓力0.01 Pa以下、蒸鍍溫度230℃,藉由蒸鍍形成以光學厚度計為4 nm之防污層15,該防污層15包含具有氟之有機化合物即具有全氟聚醚基之烷氧基矽烷化合物(KY-1901,信越化學工業股份有限公司製造)。其後,捲取成輥狀,獲得實施例1之光學積層體(抗反射膜)。Next, on the optical functional layer, an antifouling layer 15 with an optical thickness of 4 nm is formed by evaporation at a pressure below 0.01 Pa and a evaporation temperature of 230°C in the evaporation chamber. This antifouling layer 15 contains an organic compound containing fluorine, namely an alkoxysilane compound with a perfluoropolyether group (KY-1901, manufactured by Shin-Etsu Chemical Industry Co., Ltd.). Subsequently, it is rolled into a roll to obtain the optical laminate (antireflective film) of Example 1.
(1)使用廢布(不織布擦拭布)之耐擦傷性試驗除使用廢布(不織布擦拭布)(Bemcot Lint-Free CT-8,旭化學處理工業股份有限公司製造)作為摩擦體以外,實施擦傷性試驗。試驗設定係設為荷重250 g/cm2、行程25 mm、速度50 mm/s。摩擦體之水平往返運動次數係設為4000次。(1) Abrasion resistance test using waste cloth (non-woven wiping cloth) In addition to using waste cloth (non-woven wiping cloth) (Bemcot Lint-Free CT-8, manufactured by Asahi Chemical Processing Co., Ltd.) as the friction element, an abrasion resistance test was conducted. The test settings were: load 250 g/ cm² , stroke 25 mm, speed 50 mm/s. The number of horizontal reciprocating motions of the friction element was set to 4000.
測定摩擦後之試片之水接觸角,求出摩擦前及水平往返運動4000次之摩擦後之試片之水接觸角。試驗係於摩擦後30分鐘以內實施。The water contact angle of the test piece after friction was measured, and the water contact angle of the test piece before friction and after 4000 horizontal reciprocating motions was calculated. The test was conducted within 30 minutes after friction.
(2)耐鹼性試驗利用透明膠帶將黑色丙烯酸系樹脂板貼附於光學積層體之背面,以消除背面反射。對該未處理之光學積層體,以CIE1976(L﹡a﹡b﹡)色空間之SCI方式測定亮度L﹡、色度a﹡及b﹡作為光學特性。光學測定係使用積分球分光測色計(SP-64:X-rite股份有限公司製造)。設定係設為D65光源、視野角10°。(2) Alkali resistance test: A black acrylic resin plate was attached to the back of the optical laminate using transparent tape to eliminate back reflection. The luminance L * , chromaticity a * , and b * of the untreated optical laminate were measured using the SCI method in the CIE1976 (L * a * b * ) color space as optical characteristics. Optical measurements were performed using an integrating sphere spectrophotometer (SP-64: manufactured by X-rite Co., Ltd.). The settings were set to a D65 light source and a field of view of 10°.
又,準備0.1(mol/L)之氫氧化鈉水溶液。將光學積層體收容於內徑38 mm之圓筒狀構件,向圓筒狀構件內滴下試劑,並利用玻璃板蓋住上表面開口。繼而,保持液溫55℃並靜置4小時後,利用蒸餾水清洗各試片,獲得處理後樣品。對靜置4小時後之光學積層體,藉由與未處理者相同之方法對光學特性進行評價。測定處理4小時後之光學積層體相對於未處理之光學積層體的由下述式(1)所表示之ΔE值。ΔE﹡ ab={(L﹡ 2-L﹡ 1)2+(a﹡ 2-a﹡ 1)2+(b﹡ 2-b﹡ 1)2}1/2・・・(1)(式中,L﹡ 1:滴下NaOH水溶液前之亮度,L﹡ 2:自滴下NaOH水溶液起經過特定時間後之亮度,a﹡ 1:滴下NaOH水溶液前之色度,a﹡ 2:自滴下NaOH水溶液起靜置特定時間後之色度,b﹡ 1:滴下NaOH水溶液前之色度,b﹡ 2:自滴下NaOH水溶液起靜置特定時間後之色度)Furthermore, a 0.1 mol/L sodium hydroxide aqueous solution was prepared. The optical laminate was housed in a cylindrical component with an inner diameter of 38 mm. The reagent was dropped into the cylindrical component, and the opening on the upper surface was covered with a glass plate. Then, the liquid temperature was maintained at 55°C and allowed to stand for 4 hours. Each sample was then washed with distilled water to obtain the treated sample. The optical properties of the optical laminate after standing for 4 hours were evaluated using the same method as the untreated sample. The ΔE value of the optical laminate after 4 hours of treatment relative to the untreated optical laminate was measured as expressed by the following formula (1). ΔE * ab ={(L * 2 -L * 1 ) 2 +(a * 2 -a * 1 ) 2 +(b * 2 -b * 1 ) 2 } 1/2・・・(1)(where, L * 1 : brightness before the NaOH aqueous solution is added, L * 2 : brightness after a specific time has elapsed since the NaOH aqueous solution was added, a * 1 : chromaticity before the NaOH aqueous solution was added, a * 2 : chromaticity after a specific time has elapsed since the NaOH aqueous solution was added, b * 1 : chromaticity before the NaOH aqueous solution was added, b * 2 : chromaticity after a specific time has elapsed since the NaOH aqueous solution was added)
(3)氟量測定試驗對光學積層體(試片)之氟量(cps:每單位時間之計數值)進行測定(清洗前氟量(初始狀態之氟量))。(3) Fluorine content determination test: The fluorine content (cps: count value per unit time) of the optical laminate (sample) is determined (fluorine content before cleaning (fluorine content in the initial state)).
氟量之測定係使用X射線光電子分光測定器(Electron Spectroscopy for Chemical Analysis,ESCA)(PHI5000 VersaProbe III,ULVAC-PHI股份有限公司製造)、及螢光X射線分析法(X-ray fluorescence analysis,XRF)(EDX-8000,島津製作所股份有限公司製造)。藉由X射線光電子分光測定器及螢光X射線分析法所求出之氟值(cps)係由以初始狀態為n=3進行測定所獲得之結果算出之平均值。The fluorine content was determined using an X-ray photoelectron spectrophotometer (Electron Spectroscopy for Chemical Analysis, ESCA) (PHI5000 VersaProbe III, manufactured by ULVAC-PHI Corporation) and X-ray fluorescence analysis (XRF) (EDX-8000, manufactured by Shimadzu Corporation). The fluorine value (cps) obtained by X-ray photoelectron spectrophotometer and XRF analysis was the average value calculated from the results obtained by measurements with an initial state of n=3.
(4)SiO2結合能測定試驗對光學積層體,自防污層側藉由(3)中所使用之X射線光電子分析(ESCA)於下述條件下測定SiO2之結合能。於ESCA中,可測定距光學積層體表面數nm之SiO2之結合能。作為參考,矽單質之結合能為99.2 eV,矽酮之結合能為102.4 eV,SiO2之結合能為103.6 eV。即,於低於103.6 eV之情形時,可知防污層更厚或形成為高密度。又,同樣地亦實施寬掃描,確認光學積層體所包含之金屬元素。關於金屬元素,除構成光學積層體之金屬以外之金屬亦作為檢測對象,對除構成光學積層體所使用之金屬氧化物之金屬以外之金屬元素(實施例1-1中為Nb、Si以外之金屬元素)之混入進行確認。ESCA測定條件・測定:窄掃描、寬掃描・X射線源:單一Al・X射線槍:200 μmϕ 50 w 15 V・停留時間(單步時間):20 ms・步距(測定間隔):0.05 eV・掃描(累計):10次・通過能量:55 eV(4) SiO2 Binding Energy Measurement Test: The binding energy of SiO2 on the optical laminate was measured from the antifouling layer side using X-ray photoelectron analysis (ESCA) as described in (3) under the following conditions. In ESCA, the binding energy of SiO2 at a distance of several nm from the surface of the optical laminate can be measured. For reference, the binding energy of elemental silicon is 99.2 eV, the binding energy of silicone is 102.4 eV, and the binding energy of SiO2 is 103.6 eV. That is, when the binding energy is lower than 103.6 eV, it can be seen that the antifouling layer is thicker or formed with a high density. In addition, a wide scan was also performed to confirm the metal elements contained in the optical laminate. Regarding metal elements, metals other than those constituting the optical laminate are also included in the detection scope. The inclusion of metal elements other than those in the metal oxides used to constitute the optical laminate (metal elements other than Nb and Si in Example 1-1) is confirmed. ESCA Measurement Conditions: Measurement: Narrow scan, wide scan; X-ray source: Single Al; X-ray gun: 200 μm, ϕ 50 W, 15 V; Dwell time (single step time): 20 ms; Step size (measurement interval): 0.05 eV; Scans (cumulative): 10; Through energy: 55 eV
(實施例1-2~實施例1-5)調整對低折射率層表面進行之電漿處理步驟中自氬氣供給源61供給至調整室65之氬氣量,以調整為如表1所示之H2O目標%,除此以外,以與實施例1-1相同之方式製作光學積層體並進行評價。(Examples 1-2 to 1-5) Adjust the amount of argon gas supplied from argon gas supply source 61 to adjustment chamber 65 in the plasma treatment step of the low refractive index layer surface to the target H2O percentage as shown in Table 1. Otherwise, the optical laminate is fabricated and evaluated in the same manner as in Example 1-1.
(實施例2-1~實施例2-3)實施例2-1~實施例2-5係將對低折射率層表面進行之電漿處理步驟中輝光放電處理時之電極功率密度設為7516(W/m2),並調整自氬氣供給源61供給至調整室65之氬氣量以調整為如表1所示之H2O目標%,除此以外,以與實施例1-1相同之方式製作光學積層體並進行評價。電漿處理步驟時之H2O%如表3所示。(Examples 2-1 to 2-3) Examples 2-1 to 2-5 set the electrode power density during the glow discharge treatment in the plasma treatment step of the low refractive index layer surface to 7516 (W/ m² ), and adjusted the amount of argon gas supplied from the argon gas supply source 61 to the adjustment chamber 65 to the target H₂O percentage shown in Table 1. Otherwise, the optical laminate was fabricated and evaluated in the same manner as in Example 1-1. The H₂O percentage during the plasma treatment step is shown in Table 3.
(實施例3-1~實施例3-5)實施例3-1~實施例3-5係將對低折射率層表面進行之電漿處理步驟中輝光放電處理時之電極功率密度設為8842(W/m2),並調整自氬氣供給源61供給至調整室65之氬氣量以調整為如表1所示之H2O目標%,除此以外,以與實施例1-1相同之方式製作光學積層體並進行評價。電漿處理步驟時之H2O%如表3所示。(Examples 3-1 to 3-5) Examples 3-1 to 3-5 set the electrode power density during the glow discharge treatment in the plasma treatment step of the low refractive index layer surface to 8842 (W/ m² ), and adjusted the amount of argon gas supplied from the argon gas supply source 61 to the adjustment chamber 65 to the target H₂O percentage shown in Table 1. Otherwise, the optical laminate was fabricated and evaluated in the same manner as in Example 1-1. The H₂O percentage during the plasma treatment step is shown in Table 3.
(實施例4-1~實施例4-5)實施例4-1~實施例4-5係將對低折射率層表面進行之電漿處理步驟中輝光放電處理時之電極功率密度設為13263(W/m2),並調整自氬氣供給源61供給至調整室65之氬氣量以調整為如表1所示之H2O目標%,除此以外,以與實施例1-1相同之方式製作光學積層體並進行評價。電漿處理步驟時之H2O%如表3所示。(Examples 4-1 to 4-5) Examples 4-1 to 4-5 set the electrode power density during the glow discharge treatment in the plasma treatment step of the low refractive index layer surface to 13263 (W/ m² ), and adjusted the amount of argon gas supplied from the argon gas supply source 61 to the adjustment chamber 65 to the target H₂O percentage shown in Table 1. Otherwise, the optical laminate was fabricated and evaluated in the same manner as in Example 1-1. The H₂O percentage during the plasma treatment step is shown in Table 3.
(實施例5-1~實施例5-3)實施例5-1~實施例5-3係將對低折射率層表面進行之電漿處理步驟中輝光放電處理時之電極功率密度設為17684(W/m2),並調整自氬氣供給源61供給至調整室65之氬氣量以調整為如表1所示之H2O目標%,除此以外,以與實施例1-1相同之方式製作光學積層體並進行評價。電漿處理步驟時之H2O%如表3所示。(Examples 5-1 to 5-3) Examples 5-1 to 5-3 set the electrode power density during the glow discharge treatment in the plasma treatment step of the low refractive index layer surface to 17684 (W/ m² ), and adjusted the amount of argon gas supplied from the argon gas supply source 61 to the adjustment chamber 65 to the target H₂O percentage shown in Table 1. Otherwise, the optical laminate was fabricated and evaluated in the same manner as in Example 1-1. The H₂O percentage during the plasma treatment step is shown in Table 3.
(比較例1)於對低折射率層表面進行之表面處理中之輝光放電處理時,不對腔室36導入水蒸氣作為反應性氣體,而僅使氬氣流動,除此以外,以與實施例1-1相同之方式製作光學積層體。電漿處理步驟時之H2O%如表4所示。(Comparative Example 1) During the glow discharge process in the surface treatment of the low refractive index layer, water vapor is not introduced into chamber 36 as a reactive gas; instead, argon gas is allowed to flow. Otherwise, the optical laminate is fabricated in the same manner as in Example 1-1. The H₂O % during the plasma treatment step is shown in Table 4.
(比較例2)於對低折射率層表面進行之表面處理中之輝光放電處理時,不對腔室36導入水蒸氣作為反應性氣體,而僅使氬氣流動,除此以外,以與實施例2-1相同之方式製作光學積層體。電漿處理步驟時之H2O%如表4所示。(Comparative Example 2) During the glow discharge process in the surface treatment of the low refractive index layer, water vapor is not introduced into chamber 36 as a reactive gas; instead, argon gas is allowed to flow. Otherwise, the optical laminate is fabricated in the same manner as in Example 2-1. The H₂O % during the plasma treatment step is shown in Table 4.
(比較例3)於對低折射率層表面進行之表面處理中之輝光放電處理時,將電極功率密度設為17684 W/m2,不對腔室36導入水蒸氣作為反應性氣體,而僅使氬氣流動,除此以外,以與實施例1-1相同之方式製作光學積層體。電漿處理步驟時之H2O%如表4所示。(Comparative Example 3) During the optical discharge process in the surface treatment of the low refractive index layer, the electrode power density was set to 17684 W/ m² . Water vapor was not introduced into the chamber 36 as a reactive gas; instead, argon gas was allowed to flow. Otherwise, the optical laminate was fabricated in the same manner as in Example 1-1. The H₂O % during the plasma treatment step is shown in Table 4.
(比較例4-1~比較例4-4)於對低折射率層表面進行之表面處理中之輝光放電處理時,將電極功率密度設為1326 W/m2,並調整自氬氣供給源61供給至調整室65之氬氣量以調整為如表1所示之H2O目標%,除此以外,以與實施例1-1相同之方式製作光學積層體。電漿處理步驟時之H2O%如表4所示。(Comparative Examples 4-1 to 4-4) During the glow discharge treatment in the surface treatment of the low refractive index layer, the electrode power density was set to 1326 W/ m² , and the amount of argon gas supplied from the argon gas supply source 61 to the adjustment chamber 65 was adjusted to the target H₂O percentage as shown in Table 1. Otherwise, the optical laminate was fabricated in the same manner as in Example 1-1. The H₂O percentage during the plasma treatment step is shown in Table 4.
如上所述,對實施例及比較例中所製作之光學積層體之特性進行評價。將實施例1-1~實施例5-3之光學積層體之特性測定結果總結於表1,將比較例1~比較例4-4之光學積層體之特性測定結果總結於表2。於表1、2中,「利用ESCA之Al等金屬元素之檢測」一欄中,於藉由ESCA檢測出構成光學積層體所使用之金屬氧化物之金屬以外之金屬元素的混入之情形時表示為「○」,於未檢測出之情形時表示為「-」。又,關於利用分壓真空計所測得之腔室36內之氛圍中各氣體之比率及腔室36內之全壓(TP值),將實施例1-1~實施例5-3之結果總結於表3,將比較例1~比較例4-4之結果總結於表4。As described above, the characteristics of the optical laminates produced in the embodiments and comparative examples were evaluated. The characteristic measurement results of the optical laminates of Embodiments 1-1 to 5-3 are summarized in Table 1, and the characteristic measurement results of the optical laminates of Comparative Examples 1 to 4-4 are summarized in Table 2. In Tables 1 and 2, in the column "Detection of metal elements such as Al using ESCA", if the inclusion of metal elements other than the metals of the metal oxides used to constitute the optical laminate is detected by ESCA, it is indicated by "○", and if it is not detected, it is indicated by "-". Furthermore, regarding the ratio of each gas in the atmosphere within chamber 36 and the total pressure (TP value) within chamber 36 measured using a partial pressure vacuum gauge, the results of Examples 1-1 to 5-3 are summarized in Table 3, and the results of Comparative Examples 1 to 4-4 are summarized in Table 4.
[表1]
[表2]
[表3]
[表4]
藉由將實施例1-1~實施例5-3與比較例1~比較例4-4進行對比,可確認於電漿處理步驟中,藉由使H2O流動作為反應性氣體,顯示出較未導入H2O作為反應性氣體者優異之耐鹼性。由此顯示出,藉由於低折射率層之電漿處理時存在H2O氣體,防污層形成後之耐鹼性較高。By comparing Examples 1-1 to 5-3 with Comparative Examples 1 to 4-4, it can be confirmed that in the plasma treatment step, using H₂O flow as a reactive gas exhibits superior alkali resistance compared to those without H₂O as a reactive gas. This demonstrates that the presence of H₂O gas during plasma treatment of the low refractive index layer results in higher alkali resistance after the formation of the antifouling layer.
惟,若將比較例4-1~比較例4-5與實施例1-1~實施例5-3進行比較,則即便於設為相同之目標H2O%且於實施例及比較例中設為相同範圍之H2O%之情形時,比較例4-1~比較例4-5之耐鹼性亦變低。由該結果可知,即便導入H2O氣體,耐鹼性之提昇亦需要一定以上之電漿處理步驟時之電極功率密度。However, when Comparative Examples 4-1 to 4-5 are compared with Examples 1-1 to 5-3, even when the target H₂O % is set to the same level and the H₂O % range is set in the same range in both examples and comparisons, the alkali resistance of Comparative Examples 4-1 to 4-5 is still lower. This result shows that even with the introduction of H₂O gas, improving alkali resistance requires a certain level of electrode power density during the plasma treatment steps.
即,可知藉由變更電漿處理步驟之條件,形成於低折射率層上之防污層之氟系有機化合物增大。認為因構成防污層之氟系有機化合物增大,構成低折射率層之SiO2與水進行接觸之區域減少,抑制了矽氧烷鍵水解,羥基之H被鹼金屬所取代之情況,獲得如上所述之耐鹼性。That is, it can be seen that by changing the conditions of the plasma treatment steps, the amount of fluorine-based organic compounds forming the antifouling layer on the low refractive index layer increases. It is believed that because the amount of fluorine-based organic compounds constituting the antifouling layer increases, the area of SiO2 constituting the low refractive index layer that comes into contact with water decreases, inhibiting the hydrolysis of siloxane bonds and the replacement of the H in the hydroxyl group with an alkali metal, thus obtaining the alkali resistance described above.
1:濺鍍裝置2A:預處理裝置2B:預處理裝置3:蒸鍍裝置4:裝置11:透明基材12:硬塗層13:密接層14:光學功能層14a:高折射率層14b:低折射率層15:防污層20:製造裝置21:真空泵22:導輥23:輥24:捲取輥25:成膜輥26:罐輥31:腔室32:腔室33:腔室34:腔室35:腔室36:腔室41:成膜部42:電漿放電裝置43:蒸鍍源60:混合氣體調整單元61:氬氣供給源62:水蒸氣供給源63:加熱器64:真空泵65:調整室66:H2O溫度計101,102:光學積層體200:物品201:邊框202:主要部分MFC:質量流量控制器NB:針閥1: Splash coating apparatus 2A: Pretreatment apparatus 2B: Pretreatment apparatus 3: Evaporation apparatus 4: Apparatus 11: Transparent substrate 12: Hard coating layer 13: Adhesive layer 14: Optical functional layer 14a: High refractive index layer 14b: Low refractive index layer 15: Antifouling layer 20: Manufacturing apparatus 21: Vacuum pump 22: Guide roller 23: Roller 24: Take-up roller 25: Film-forming roller 26: Tank roller 31: Chamber 32: Chamber 33: Chamber 34: Chamber 35: Chamber 36: Chamber 41: Film-forming section 42: Plasma discharge device 43: Evaporation source 60: Mixed gas adjustment unit 61: Argon gas supply source 62: Water vapor supply source 63: Heater 64: Vacuum pump 65: Adjustment chamber 66: H₂O thermometer 101, 102: Optical laminate 200: Item 201: Frame 202: Main part MFC: Mass flow controller NB: Needle valve
圖1係表示本發明之一實施方式之光學積層體構成之一例的剖視圖。圖2係圖1之另一例之光學積層體之剖視圖。圖3係表示應用有本發明之一實施方式之光學積層體的物品構成之一例之立體圖。圖4係表示可用於本發明之一實施方式之光學積層體之製造方法的製造裝置之一例之概略圖。圖5係表示圖4所示之製造裝置中之預處理裝置2B之一例之圖。Figure 1 is a cross-sectional view showing an example of the optical laminate configuration according to one embodiment of the present invention. Figure 2 is a cross-sectional view showing another example of the optical laminate of Figure 1. Figure 3 is a perspective view showing an example of the article configuration using the optical laminate of one embodiment of the present invention. Figure 4 is a schematic diagram showing an example of a manufacturing apparatus for a manufacturing method of the optical laminate of one embodiment of the present invention. Figure 5 is a diagram showing an example of the pretreatment apparatus 2B in the manufacturing apparatus shown in Figure 4.
11:透明基材 11: Transparent substrate
12:硬塗層 12: Hard Coating
13:密接層 13: Adhesive layer
14:光學功能層 14: Optical functional layer
14a:高折射率層 14a: High refractive index layer
14b:低折射率層 14b: Low refractive index layer
15:防污層 15: Anti-fouling layer
101:光學積層體 101: Optical Laminators
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