TW202519815A - Infrared heating device - Google Patents

Abstract

The present invention provides an infrared heating device capable of performing a debinding process and a baking process in a short period of time. The infrared heating device comprises a carrier part for carrying an object, a heating lamp for illuminating infrared light for heating the object, a furnace chamber configured with the carrier part and the heating lamp and formed to be closed, a gas supply part for supplying gas to the furnace chamber, a gas discharge part for discharging gas from the furnace chamber, and a steam supply part that supplies steam to the furnace chamber separately from the gas supplied from the gas supply part, and a pressure control device that controls the pressure in the furnace chamber to positive or negative pressure.

Description

Infrared heating device

The present invention relates to an infrared heating device. More specifically, it relates to an infrared heating device, which includes: a placing portion for placing an object; a heating lamp for irradiating infrared light to heat the object; a furnace cavity that is equipped with the placing portion and the heating lamp and is sealable; a gas supply portion for supplying gas into the furnace cavity; and a gas exhaust portion for exhausting gas from the furnace cavity.

As is well known, as the above-mentioned infrared heating device, there is a device described in Japanese Patent Document 1, for example. In this device, ambient gas is introduced into the furnace from the gap of the far-infrared heater in the ceiling of the furnace. When the adhesive removal treatment (hereinafter referred to as "debonding") is performed, the C (carbon) contained in the adhesive component in the furnace will increase. Therefore, if it is not discharged (exhausted) to the outside of the furnace, the heater and the like will be contaminated by the C (carbon) component and the heating efficiency will be reduced. However, this device does not have an exhaust structure, so it cannot solve the pollution problem. In addition, since this device continuously transports the object and heats it, it is impossible to achieve airtightness in the furnace, and it is difficult to control and manage the environment. Therefore, debonding and heating (baking) take time.

[Patent Literature]

Patent document 1: Japanese Patent Publication No. 2003-114092.

In view of the actual situation of the above-mentioned prior art, the purpose of the present invention is to provide an infrared heating device that can perform heating treatments such as adhesive removal treatment and baking treatment in a short time.

The purpose of the infrared heating device of the present invention is achieved according to the following technologies:

An infrared heating device includes: a placing portion for placing an object; a heating lamp for irradiating infrared light for heating the object; a furnace cavity which is equipped with the placing portion and the heating lamp and is configured to be sealable; a gas supply portion for supplying gas into the furnace cavity; and a gas exhaust portion for exhausting gas from the furnace cavity, wherein the device further includes: a steam supply portion for supplying steam into the furnace cavity separately from the gas supplied from the gas supply portion; and a pressure control device for controlling the pressure in the furnace cavity to be positive pressure or negative pressure.

Here, according to the infrared heating device of the present invention, in a furnace cavity which is equipped with a heating lamp and is configured to be sealed, the infrared light from the heating lamp is used to heat the object on the carrier, so that the object can be rapidly heated (heated up). At this time, the components such as the adhesive and the solvent existing inside the object can burn in a short time and combine with the internal oxygen to quickly release the organic component (carbon). On the other hand, due to the rapid temperature rise, more thermal stress is applied to the object, so cracks and the like may sometimes occur. According to the above structure, it also includes a steam supply part which supplies steam to the furnace cavity separately from the gas supplied from the gas supply part. Thus, during the heat treatment, steam can be supplied from the steam supply unit to the furnace chamber, so that oxygen can easily penetrate into the interior of the object, thereby promoting the heat treatment (reaction) while preventing the occurrence of cracks and the like. In addition, a pressure control device is included to control the pressure in the furnace chamber to be positive pressure or negative pressure. If the furnace chamber is set to a positive pressure, since pressure is applied to the interior of the furnace chamber when the steam is introduced, the steam can be evenly filled into the furnace chamber and can be evenly transferred to the object, thereby promoting the heat treatment (reaction). On the other hand, if the furnace chamber is set to a negative pressure, the exhaust of the gas in the furnace chamber is promoted. In this way, by supplying steam and controlling the pressure in the furnace, the process can be accelerated.

In the above structure, a cooling device for cooling the furnace wall of the furnace cavity is further included, and the steam supply part may have a heating part for heating the steam before supplying the steam into the furnace cavity. In order to cool the heating furnace as a whole, a cooling device such as a cooler is provided on the furnace wall to cool the furnace wall. By heating the steam by the heating part before supplying the steam into the furnace cavity, the temperature drop of the steam can be suppressed, and condensation can be prevented from occurring in the furnace cavity.

In such a structure, the heating part is arranged on the ceiling of the furnace wall and may have a plurality of nozzles protruding into the furnace cavity. In addition, the plurality of nozzles are provided with a plurality of through holes on four sides of the circumferential surface of the nozzle body, and the front end of the nozzle body may be closed. Thus, the steam can be more evenly transmitted to the entire object on the mounting part.

In addition, in the above structure, the steam supply part supplies the steam from the top of the furnace cavity, and the gas exhaust part can exhaust the gas in the furnace cavity from at least one side of the furnace cavity. Since the steam is supplied from the top and the gas is exhausted from at least one side, the generated gas is difficult to be retained in the furnace cavity, and the gas can be exhausted smoothly. In addition, the mounting part is a rectangular tray having a long side parallel to the long side direction of the heating lamp, and the gas exhaust part exhausts the gas in the furnace cavity from both sides of the furnace cavity opposite to the short side of the tray. As a result, the generated gas flows along the long side of the tray to both sides, so it is possible to suppress the stagnation of the generated gas and exhaust it more efficiently.

On the other hand, in the above structure, the steam supply part supplies the steam from the top of the furnace cavity, and the gas discharge part can also discharge the gas in the furnace cavity from the top of the furnace cavity.

In the above structure, the pressure control device can control the pressure in the furnace chamber to be positive pressure during the period of supplying the steam into the furnace chamber. If the furnace chamber is set to be positive pressure, since the pressure is applied to the inside of the furnace chamber when the steam is introduced, the steam can be evenly filled into the furnace chamber and evenly transferred to the object, thereby promoting the heating process (reaction).

In addition, in the above-mentioned structure, there are: a stage temperature setting unit that sets a plurality of heating stages for increasing the temperature inside the furnace cavity and a cooling stage for decreasing the temperature inside the furnace cavity; and an output adjusting unit that adjusts the output of the heating lamp according to the increase and decrease of the temperature inside the furnace, wherein the stage temperature setting unit sets each heating rate and cooling rate in the steps of repeating the heating stage and the cooling stage at least twice in an alternating manner, and the output adjusting unit can also adjust the output of the heating lamp according to the heating rate and the cooling rate so that the heating lamp irradiates the infrared light. According to our experiments, when the temperature is raised in a short time, the oxygen concentration in the furnace chamber decreases during the temperature rise process, and the oxygen concentration in the furnace chamber hardly changes when the temperature is kept for a period of time after the temperature rise. In other words, it is speculated that debonding is promoted during the temperature rise process. Then, after the rapid temperature rise, the temperature is lowered, and the temperature is raised again rapidly. By repeating the temperature rise and fall at least twice, debonding and other treatments can be performed in a short time.

In addition, in the above structure, the steam supply unit may also include: a storage tank for storing hot water; a mixed gas supply unit for supplying a mixed gas into the hot water; and a heating pipeline for heating the steam generated in the storage tank and supplying it to the heating unit. In this case, it also includes: a furnace temperature measuring unit for measuring the furnace temperature in the furnace cavity; and a supply start temperature setting unit for setting the supply start temperature when the steam is supplied to the furnace cavity. When the furnace temperature exceeds the supply start temperature, the steam supply unit can supply the steam from the heating unit to the furnace cavity. In addition, it may also include a heating temperature setting unit for setting the temperature of the storage tank, the temperature of the heating pipeline, and the temperature of the heating unit, respectively. In this way, condensation can be prevented by controlling the supply of steam. In any of the above structures, for example, the above object is an MLCC.

According to the characteristics of the infrared heating device of the present invention, heating treatments such as adhesive removal treatment and baking treatment can be performed in a short time.

Other objects, structures and effects of the present invention will become apparent from the following description of the embodiments of the present invention.

The present invention will be described in more detail below with reference to the accompanying drawings as appropriate. The infrared heating device 1 according to the present invention generally includes: an air supply system 2, an exhaust system 3, a steam supply system 6, a camera 7, a control device 8 and a heating furnace 20 (as shown in the first to tenth figures). The tray 34 as a placing part for placing the object C to be processed is a horizontal rectangular plate with edges, and is a rectangle with a long side parallel to the long side direction L1 of the heating lamp 31 (described later). In this embodiment, a case where a plurality of MLCCs (multi-layer ceramic capacitors) as objects C are placed on a tray 34 and are processed successively from degreasing (binder removal) to glaze firing (glost firing) is described below as an example.

The gas supply system 2 has a supply path 2a1, an electromagnetic valve 2b1, and a gas cylinder 2c1, and supplies the gas in the gas cylinder 2c1 to a plurality of gas supply ports (gas supply parts), i.e., nozzles 30, provided at the top of the baking oven 20. The gas supply system 2 has a supply path 2a2, an electromagnetic valve 2b2, and a gas cylinder 2c2, and supplies the cooling gas in the gas cylinder 2c2 to a plurality of cooling nozzles 50 provided just below the tray 34. The cooling gas may be, for example, nitrogen N2 gas.

On the other hand, the exhaust system 3 has an exhaust path 3a and an ejector 3b, and in this embodiment, the gas in the furnace cavity 21 is forcibly exhausted from the left and right gas exhaust ports (gas exhaust parts) 35, 35 provided on both sides of the furnace cavity 21 opposite to the short side of the tray 34. The ejector 3b is controlled by the control device 8, and functions as a pressure control device for controlling the pressure in the furnace cavity 21 to positive pressure or negative pressure. In addition to supplying and exhausting gas, the control device 8 also executes the process from degreasing to glaze firing according to the set conditions (curve, program).

The steam supply system 6 has a steam supply unit 60 for supplying steam We into the furnace chamber 21 separately from the gas supplied from the gas supply nozzle 30. In the present embodiment, the steam supply unit 60 supplies steam We from the top (ceiling) 20a of the heating furnace 20.

The steam supply section 60 generally includes: a heating section 61 for heating the steam We before supplying it into the furnace chamber 21; a storage tank 62 for storing warm water H for generating the steam We supplied to the heating section 61; and a mixed gas tank 63 (as shown in the second figure) serving as a mixed gas supply section for supplying the mixed gas into the storage tank 62.

The heating part 61 includes a box 61a provided on the ceiling 23a of the heating furnace 20 and a plurality of steam supply nozzles 61b which penetrate the ceiling 23a from the inside of the box 61a and protrude into the furnace chamber 21. A heater 61c for heating the internal space is provided on the box 61a. Here, a cooling pipe 36 as a cooling device is provided on the furnace wall 23 of the furnace chamber 21 to cool the heating furnace 20 (as shown in the fourth and fifth figures). Therefore, by heating and supplying the steam We in the heating part 61 before supplying the steam We to the furnace chamber 21, the temperature drop of the steam We is suppressed, and condensation is prevented from occurring in the furnace chamber 21. In addition, the heating section 61 is provided with a temperature sensor 61d for measuring the internal temperature.

The storage tank 62 is provided with a heater 62b on the tank body 62a, and the hot water H is heated to a predetermined temperature. The mixed gas supplied from the mixed gas tank 63 is supplied to the hot water H through the supply pipe 62c, and steam (bubbles) are generated in the tank body 62a. The generated steam We is supplied to the heating part 61 through the exhaust pipe 62d through the heating pipe 64. The heating pipe 64 prevents the steam We heated to 30°C to 50°C from cooling down. In addition, the heating pipe 64 is also provided with a temperature sensor 64a for measuring the internal temperature.

The mixed gas tank 63 includes a flow control unit 63a such as an MFC (Mass flow Controller) to control the amount of gas supplied to the tank body 62a. The mixed gas contains at least hydrogen and nitrogen, for example, and the mixing ratio thereof can be appropriately adjusted.

The heating lamp 31 heats the tray 34 by infrared rays. On the other hand, the temperature measuring unit 32 measures the temperature of the tray 34 by a thermocouple. In the temperature monitoring by the temperature measuring unit 32, the output adjustment unit 88a of the control device 8 described later controls the heating power of the heating lamp 31, and performs heating or cooling according to the curve set (programmed) by the curve setting unit 80 described later.

The control device 8 is constituted by, for example, a personal computer, and includes: a curve setting unit 80 for setting at least debonding conditions and baking conditions of the MLCC as the object C, a monitoring unit 87, a control unit 88, and a recording unit 89 (as shown in the third figure).

The dotted lines in the first and second figures represent the electronic control system, and all the components, measuring parts, sensors, etc. connected thereto send signals or data to the control unit 8, and are controlled by the control unit 88 of the control unit 8. The camera 7 records the conditions in the heating furnace 20 in the recording unit 89 of the sequential control unit 8. That is, the control unit 8 can easily set and change the temperature curve and the two timings of gas supply and exhaust when and how many times to perform heating or cooling during the process (from degreasing to glazing), and can record the image of the camera 7 together with the temperature data of the execution result while performing heating or cooling.

The curve setting unit 80 generally includes a stage temperature setting unit 81, a temperature setting unit 82, a gas amount setting unit 83 for adjusting the gas supply amount to the furnace chamber 21 and the gas exhaust amount from the furnace chamber 21, and a steam supply setting unit 84 for setting the supply of steam We.

The stage temperature setting unit 81 sets the temperature rising stage S1 for raising the internal temperature of the furnace chamber 21 and the temperature falling stage S2 for lowering the internal temperature of the furnace chamber 21 multiple times. The stage temperature setting unit 81 sets the temperature rising speed and the temperature falling speed in the debonding treatment and baking treatment, which at least include the treatment steps of repeating the temperature rising stage S1 and the temperature falling stage S2 at least twice in an alternating manner. In addition, in this specification, the treatment step of repeating the temperature rising stage S1 and the temperature falling stage S2 at least twice in an alternating manner is referred to as the pulse treatment S. In addition, the set temperature rising speed is +5°C/sec to +25°C/sec, and the temperature falling speed is -25°C/sec to -5°C/sec.

The temperature setting unit 82 includes a supply start temperature setting unit 82a for setting the supply start temperature when the steam We is supplied into the furnace chamber 21, and a heating temperature setting unit 82b for respectively setting the temperature of the storage tank 62, the temperature of the heating pipe 64, and the temperature of the heating unit 61. In addition, the stage temperature setting unit 81 sets the peak temperature and the holding temperature of each stage in the process.

The gas amount setting unit 83 includes a supply amount setting unit 83a for setting the amount of gas supplied into the furnace chamber 21 and an exhaust amount setting unit 83b for setting the amount of gas exhausted from the furnace chamber 21. The steam supply setting unit 84 sets the on/off of the supply of steam We during the heat treatment of the debonding treatment or the baking treatment.

The control unit 88 includes an output adjustment unit 88a for adjusting the output of the heating lamp 31 according to the heating speed and the cooling speed. The output adjustment unit 88a adjusts the output of the heating lamp 31 according to the heating speed and the cooling speed set by the stage temperature setting unit 81, so that the heating lamp 31 radiates infrared light.

The monitoring unit 87 is used to monitor the temperature of the temperature measuring unit 32 (temperature in the furnace), the heating temperature of each temperature sensor 61d, 64a, the oxygen concentration of the oxygen concentration sensor 39 in the furnace, and other conditions in the furnace. The control unit 88 controls the supply and exhaust of gas, the supply and stop of steam We, the output of the heating lamp, etc. based on the conditions (curve) set by the curve setting unit 80 and various data monitored by the monitoring unit 87. The recording unit 89 records various data monitored by the monitoring unit 87 and the control of the control unit 88, the conditions in the processing of the camera 7, etc.

As shown in the second to fourth figures, the heating furnace 20 has an inner surface where parabolas with six vertices are concentrated like a flower shape in cross section, and the furnace wall 23 has the same shape with respect to the longitudinal direction L1 on the left and right. At the focal point F (F1, F2a, F2b, F3a, F3b) of each parabola, a strip-shaped heating lamp is arranged along the longitudinal direction L1 so that the filament at the center is located on the heating lamp. Therefore, the infrared light emitted from the filament of the heating lamp 31 as the focal point F is reflected by the furnace wall 23 as a reflection surface and travels in parallel, and is concentrated to the central part of the internal space 22 of the furnace cavity 21, and the part is uniformly heated.

This point is explained with reference to FIG. 5 in particular. In the figure, heating lamps 31 are provided at four locations on the left and right and one location at the bottom. In the optical path of the light emitted from the focal points F (F1, F2a, F2b, F3a, F3b) of each parabola where the filament is located, the portion passing through the vicinity of the end of the parabola and the center is indicated by a double-point line. Through the light from the left and right focal points F2a, F2b, F3a, and F3b, it can be seen that the tray 34 is accommodated in the four diamond-shaped areas in the center and is heated uniformly. In addition, through the focal point F1 on the lower side, the center portion including the contact member 32a is heated, and the temperature can be measured accurately. In addition to direct radiation from each focal point F to the tray 34 , light entering the parabola surface of other focal point regions is reflected by the surface and radiates to the tray 34 in the same manner.

Therefore, even if the tray 34 has a width in the front-rear direction L2 orthogonal to the long-side direction L1, it can be heated uniformly. In addition, the cross-sectional shape may be an elliptical shape other than a parabola, and the filament of the heating lamp 31 may be arranged at one focus, and the center of the tray 34 may be arranged at another focus. However, for the uniform heating of the entire tray 34, a parabolic shape is better. In the case of an ellipse, the heating deviation can be alleviated by increasing the light-emitting area of the filament.

Although the heating lamp 31 is not shown in the figure, the spiral filament as the heating part (light-emitting part) is accommodated in a straight quartz tube along the longitudinal direction L1 and supported on the left and right sides, and halogen gas etc. is sealed inside. Electricity is supplied from the left and right terminals, and the heat dissipation state is controlled by the control device 8 in front through the thyristor etc. When the filament is lit under the supply of electricity, the infrared light emitted from here is reflected by the furnace wall 23 in front, and the heating is performed as described above. There are 5 heating lamps 31 except the top one.

Here, as shown in FIG. 4 and FIG. 5, an appropriate cooling pipe 36 is formed in the furnace chamber 21 as a cooling device for the furnace wall 23, and cooling water is passed through the cooling pipe 36 to prevent overheating of the furnace chamber 21. Since the furnace wall 23 is cooled by the cooling pipe 36, when the steam We is supplied into the furnace chamber 21, condensation occurs on the inner surface of the furnace wall 23 and water droplets are attached. Therefore, in the present invention, as described above, the steam We is heated by the heating unit 61 to suppress the temperature drop of the steam We, thereby preventing condensation from occurring in the furnace chamber 21. Furthermore, the control device 8 controls the supply of steam We into the furnace chamber 21 when the temperature in the furnace rises to a predetermined temperature or higher, thereby further suppressing the occurrence of condensation.

In the furnace chamber 21 of the heating furnace 20, the front opening 24 and the back opening 25 are arranged in parallel with the front-rear direction L2 of the front end, so that the internal space 22 can be easily cleaned. Each opening is sealed by a front cover 26 and a back cover 27. A through hole 28a is formed in the central part of the furnace chamber 21, and an observation window 28 made of a transparent heat-resistant material such as quartz is provided on the through hole 28a, and photography is performed using the above-mentioned camera 7. Although only a representative heating lamp 31 is schematically illustrated in FIG. 8, each terminal portion at both ends is passed through the furnace chamber 21 to protrude, and each end portion is sealed by a seal 31a and a fixed end cover 31b to maintain the airtightness of the internal space 22.

The back cover 27 is mainly used only during cleaning. The tray 34 is usually placed and taken out by opening and closing the front cover 26. The back cover 27 is supported by the hinge on the lower side and is opened and closed with the hinge as a fulcrum. In contrast, the front cover 26 is opened and closed by horizontal movement of the motion device (not shown).

The upper surface of the tray 34 is flat, and has a convex portion around it to prevent the MLCC from sliding off, and is formed with a substantially uniform cross section in the transverse direction along the long side direction L1. In addition, the temperature measuring unit 32 has a support arm 32b inserted into a hole formed on a small block-shaped contact member 32a in contact with the tray 34, in which a thermocouple coupling portion 32c is arranged, and is connected to the control device 8 via a connector 32d with a cable. The tray 34 and the contact member 32a are both made of the same material that absorbs infrared light, for example, ceramics, silicon carbide (SiC), and silicon carbide (SiC) coated with zirconium oxide (ZrO ₂ ) or the like.

In addition, a plurality of cooling nozzles 50 for spraying cooling gas toward the bottom of the tray 34 are arranged at appropriate intervals along the longitudinal direction L1 directly below the tray 34. In the cooling nozzle 50, a plurality of nozzle holes 50a are formed at appropriate intervals along the longitudinal direction of the nozzle (front-rear direction L2) on the top of the nozzle 50. Thus, the entire tray 34 can be uniformly and quickly cooled. As described above, the tray 34 is heated by the infrared light from the heating lamp 31. The infrared heating device 1 of the present invention heats and cools the object C directly, but heats and cools the object C through the tray 34. In particular, when baking a large number of fine objects C such as MLCC, the infrared heating device 1 can heat and cool the object C quickly and evenly, and can suppress the deviation of each object C. In addition, since the temperature measuring part 32 is in contact with the lower surface of the tray 34, the temperature can be properly managed.

A pair of support arms 33 made of heat-resistant material such as quartz is provided on the front cover 26. By using a material that is difficult to absorb infrared light (a material with high infrared light transmittance), heat transfer to the front cover 26 is prevented, while infrared light irradiation to the tray 34 is not hindered, thereby improving temperature control and response performance. The support arm 32b is arranged between the support arms 33, 33, and the contact member 32a is arranged between them.

A plurality of through holes 29 are formed on the upper surface of the furnace chamber 21, and a plurality of nozzles 30 as gas supply ports and a steam supply nozzle 61b are installed in an airtight state. These nozzles 30, 61b are made of a material that is difficult to absorb infrared light (a material with a high transmittance of infrared light), such as a quartz tube, and do not hinder the irradiation of infrared light to the tray 34. A plurality of nozzle holes 30b are formed around the tubular nozzle body 30a to disperse the gas in all directions.

Through the above-mentioned nozzles 30, 61b, the gas and vapor We are uniformly transferred to the flat tray 34. And, the gas is exhausted through the ejector 3b from the gas exhaust ports 35, 35 provided at approximately the same height as the tray 34 and on the left and right along the long side direction L1 of the tray 34. Through the combination of the supply and exhaust of the gas and vapor We, the layer of the gas and vapor We is uniformly transferred to the object C on the tray 34. In the case of MLCC, in order to prevent the solvent from being separated due to debonding and the oxidation of the solder paste, the layer of the gas and vapor We is usually uniformly flowed and renewed, thereby preventing these adverse effects.

However, in the tunnel furnace generally used as shown in the above-mentioned literature, the airtightness of the furnace cannot be ensured because the object to be debonded and baked is transported in sequence by a conveying device such as a conveyor belt, and therefore the pressure in the furnace cannot be switched to positive pressure or negative pressure. For example, in the case of negative pressure, in order to exhaust the gas generated in the furnace, it is necessary to suck in the gas (air) in the furnace, but since the gas heated by the burner or heater is also exhausted, this often makes the temperature in the furnace easy to drop, making it difficult to perform strong exhaust. In addition, in the case of positive pressure, various gases generated from the object are not exhausted but remain in the furnace, making it difficult to perform stable treatments such as baking or debonding.

On the other hand, the heating furnace 20 of the present invention heats (raises the temperature of) the tray 34 using infrared light from the heating lamp 31, so the temperature inside the furnace does not drop sharply due to exhaust gas. In addition, since the temperature measuring unit 32 is provided on the tray 34, the correct temperature of the object can be measured. Then, as described above, the gas is exhausted from the gas exhaust ports (gas exhaust units) 35, 35 through the ejector 3b. Therefore, by controlling the amount of gas supplied to the furnace chamber 21 and the amount of gas exhausted from the furnace chamber 21, the pressure inside the furnace chamber 21 during processing can be controlled while avoiding a decrease in the temperature inside the furnace. Relative to the gas supply amount to the furnace chamber 21, the furnace chamber 21 becomes negative pressure by increasing the gas exhaust amount of the injector 3b, and the furnace chamber 21 becomes positive pressure by reducing the gas exhaust amount of the injector 3b, thereby controlling the switching between positive pressure and negative pressure in the furnace chamber 21.

If negative pressure is formed in the furnace chamber 21, various gases generated from the object C can be forced to be discharged outside the furnace chamber 21 without lowering the temperature in the furnace, and the gases generated in the furnace chamber 21 will not be retained, so that the adverse effects on the object C can be suppressed to a minimum. In addition, the generated gases can be suppressed from adhering to the surface of the heating lamp 31 or the inner surface of the furnace wall 23, thereby preventing the reduction of thermal efficiency.

On the other hand, if the furnace chamber 21 is set to a positive pressure, the furnace chamber 21 is in a state of being pressurized when the steam We is introduced, so the introduced steam We can be uniformly filled into the furnace chamber 21 and can be uniformly transferred to the object C. On the other hand, if the furnace chamber 21 is set to a negative pressure, the exhaust of the gas in the furnace chamber 21 is promoted, and the stagnation of the generated gas can be suppressed.

Next, as a method of using the infrared heating device 1, taking the curves shown in Figures 9 and 10 as an example, the processing steps starting from the removal of the adhesive (debonding, degreasing) and debonding treatment of the MLCC with copper paste containing glass powder attached to the electrode as the object C, and continuously performing the baking treatment in the same furnace chamber are explained.

First, the control device 8 performs the curve setting as shown in FIG. 9, for example. In this embodiment, the processing steps are set to 14 stages, and the peak temperature (°C), the heating rate (°C/min), the peak temperature maintenance time (sec), the supply gas (nitrogen-hydrogen mixed gas and nitrogen) and the steam switch (Dry/Wet) and the exhaust volume (L/min) in each stage are set. The curve is shown in FIG. 10, which shows the relationship between temperature (vertical axis) and time (horizontal axis). In this case, in the supply start temperature setting unit 81a, the supply start temperature when the steam We is supplied to the furnace chamber 21 is set to, for example, 100°C. Therefore, for example, in stage 2, when the temperature in the furnace exceeds 100°C, the steam We will be supplied to the furnace chamber 21.

Then, the object C is placed on the tray 34 and moved on the support arms 33, 33 by a robot arm or the like. Next, the opening and closing actuator (not shown) is extended, and the front cover 26 is closed in an airtight state, and the tray 34 is installed in the center of the furnace cavity 21.

Next, the control unit 88 turns on the heating lamp 31 to start heating, and at the same time opens the electromagnetic valve 2b1 to supply nitrogen to the nozzle 30. The ejector 3b is operated to discharge the gas in the furnace chamber 21 from the gas exhaust port 35. Then, according to the set curve, the output adjustment unit 88a adjusts the output of the heating lamp 31 according to the set temperature increase rate and temperature decrease rate, so that the heating lamp 31 irradiates infrared light. In addition, the control unit 88 controls the supply of gas, exhaust, and on/off of steam according to the gas amount setting unit 83 and the steam supply setting unit 84. When the temperature in the furnace exceeds 100°C, steam We is supplied to the furnace chamber 21.

Here, in the example shown in FIG. 9 and FIG. 10, the stage 3 is set to the temperature rising stage S1 with a temperature rising rate of 5°C/min, and the stage 4 is set to the temperature falling stage S2 with a temperature rising rate of -5°C/min (temperature falling rate of 5°C/min) through the stage temperature setting unit 81. In stages 5 to 10, the temperature rising stage S1 and the temperature falling stage S2 are set alternately through the stage temperature setting unit 81. Therefore, in stages 3 to 10, the temperature rising stage S1 and the temperature falling stage S2 are repeated 4 times in an alternating manner, and the heat treatment step becomes a pulse heat treatment S.

In addition, in this embodiment, the gas exhaust amount into the furnace chamber 21 is set to be less than the gas supply amount in the temperature increase stage S1 (stages 3, 5, 7, 9) through the supply amount setting unit 83a and the exhaust amount setting unit 83b, and the gas exhaust amount into the furnace chamber 21 is set to be greater than the gas supply amount in the temperature decrease stage S2 (stages 4, 6, 8, 10). That is, in the temperature increase stage S1, the furnace chamber 21 is controlled to be positive pressure, and in the temperature decrease stage S2, the furnace chamber 21 is controlled to be negative pressure.

As mentioned above, in this curve, the temperature is set to rise (the temperature rise rate is a positive value) and fall (the temperature rise rate is a negative value) repeatedly. In addition to MLCC, electronic parts such as sensors, coils, and high-frequency substrates are manufactured by mixing binders (resins, organic substances) into the materials, and the contained binders need to be removed during productization. In the commonly used tunnel furnace shown in the above literature, due to the low combustion efficiency, after the temperature is raised to a predetermined temperature, it takes a long time (several hours to dozens of hours) and is continuously maintained at the predetermined temperature for debonding (degreasing).

In addition, in the known tunnel furnace, heat treatment is performed by heating the air (gas) inside with a burner or heater, so it is difficult to change the temperature of the air rapidly, and it is difficult to perform strong exhaust because the generated gas is exhausted and the temperature inside the furnace is easily lowered. In addition, in the case of positive pressure, various gases generated from the object are not exhausted but remain in the furnace, making it difficult to perform stable treatment such as baking or debonding.

However, in the infrared heating device 1 according to the present invention, since the tray 34 is heated (heated) by infrared light from the heating lamp 31 in the closed furnace chamber 21, the object C can be rapidly heated (heated). As a result, the adhesive and solvent existing inside the object C can burn in a short time, combine with the internal oxygen and quickly release the organic component (carbon). According to the experiments of the inventors, when the temperature is raised in a short time, the oxygen concentration in the furnace will decrease during the temperature rise process. On the other hand, even if the temperature after the temperature rise is maintained for a certain period of time, the oxygen concentration in the furnace hardly changes. In other words, it is speculated that debonding is promoted during the temperature rise process. Then, after the rapid temperature rise, the temperature is lowered and the temperature is rapidly raised again. By repeating the temperature rise and fall multiple times, debonding can be achieved in a short time.

As described above, due to the rapid temperature rise, a large amount of thermal stress is applied to the object C, so cracks and the like may sometimes occur. Therefore, in this embodiment, the supply of steam We is set to ON in the debonding process (stages 2 to 11) through the steam supply setting unit 84. As a result, since steam We is supplied from the steam supply unit 60 to the furnace chamber 21 during the debonding process, oxygen easily penetrates into the interior of the object C, further promoting debonding while preventing the occurrence of cracks and the like. In this embodiment, the pressure in the furnace chamber 21 is controlled to be positive pressure in the temperature rise stage S1, and the pressure in the furnace chamber 21 is controlled to be negative pressure in the temperature drop stage S2.

In particular, when the object C is a relatively large product, it takes some time for the steam to penetrate into the object C (product). Therefore, when the temperature rises to promote the debonding (reaction), the pressure in the furnace chamber 21 is set to positive pressure to promote the penetration of oxygen into the object C, and when the temperature drops, the pressure in the furnace chamber 21 is set to negative pressure to promote the exhaust, so that the debonding process can be accelerated. In the case of a product with a small amount of adhesive components in the object C, the debonding process is promoted by setting the pressure in the furnace chamber 21 to positive pressure when the temperature rises.

In this embodiment, stage 11 is equivalent to the secondary debonding treatment. When the temperature exceeds 900°C, if the object C does not contain an adhesive, no debonding-derived gas is generated, so the exhaust gas volume is controlled to be less than the supply gas volume, and the furnace chamber 21 is controlled to be positive pressure.

Then, in the curve of this embodiment, after the debonding process (stages 2 to 11) is continued, the baking process (stage 12) is set. As described above, in the control device 8 of the present invention, since the conditions (curves) of the debonding process and the baking process can be set continuously, it is not necessary to divide the debonding process and the baking process into different steps and devices as in the prior art, and the steps from debonding to glaze firing can be continuously processed in the same furnace. In addition, since the pressure in the furnace chamber 21 can be controlled to be positive pressure/negative pressure, the debonding process can be promoted by switching between positive pressure/negative pressure during the debonding process, and the exhaust of the gas generated by the debonding process can also be promoted. Therefore, even if the debonding process and the baking process are performed continuously in the same furnace, the quality of the object C will not be reduced.

After the baking is completed, the power supply to the heating lamp 31 is reduced or stopped in stages 13 and 14 to cool it down. In addition, if necessary, nitrogen as a cooling gas can be sprayed from the cooling nozzle 50 to the tray 34 to promote the cooling of the object C and the tray 34. In these cooling processes (stages 13 and 14) after these baking processes, the supply of steam We is set to OFF through the steam supply setting unit 84, and the supply of steam We is completed during the baking process. By moving each action device in the opposite order to the setting and replacing the tray, the baking operation is completed. According to the infrared heating device 1 of the present invention, the debonding process and the baking process are completed in a very short time (as shown in Figure 10).

The following lists possible other embodiments of the present invention. The same symbols are used for the same components. In the above embodiment, the cooling nozzle 50 is arranged directly below the tray 34, but the position of the cooling nozzle 50 is not limited to directly below the tray 34. For example, the cooling nozzle 50 may be arranged obliquely below the tray 34. In this way, by arranging the cooling nozzle 50 on the lower side of the tray 34, the tray 34 is effectively cooled without affecting the object C. In addition, as long as the cooling nozzle 50 is arranged in a manner that does not affect the object C, it is also possible to arrange it near the tray 34.

In the above-mentioned embodiment, copper paste is used in MLCC, but silver paste may also be used. In this case, oxygen may also be used as a gas in addition to nitrogen. In addition, in the above-mentioned embodiment, MLCC coated with copper paste containing glass powder as an external electrode is described as object C. However, object C and its baking step are not limited to the above-mentioned embodiment. The infrared heating device 1 of the present invention may also be used, for example, for a chip baking step as a previous step of the external electrode sintering step of MLCC.

In the above embodiment, the gas supplied to the inside of the heating furnace 20 and the cooling gas are described separately, but the two gases can also be switched. Of course, the present invention is not limited to two gases, and one or more gases can also be used.

The structure of the infrared heating device 1 can be modified other than the above without departing from the main purpose of the present invention. For example, although the cross-sectional shape of the furnace wall is 6 parabolas, it can also be a collection of 5 or 4 parabolas.

In the above embodiment, steam is supplied from the upper part of the furnace cavity 21 and gas is exhausted from both sides of the furnace cavity 21 opposite to each other across the tray, but the present invention is not limited to both sides, and gas in the furnace cavity 21 may be exhausted from at least one side of the furnace cavity 21. On the other hand, when the amount of exhausted gas is large, steam may be supplied from the upper part of the furnace cavity 21 and gas in the furnace cavity 21 may be exhausted from the upper part of the furnace cavity 21.

In addition, the curves in the above-mentioned embodiments shown in Figures 9 and 10 are only examples, and the present invention is not limited to this. In the above-mentioned curve example, in the debonding process, the pressure in the furnace chamber 21 is controlled to be positive pressure in the temperature rise stage S1, and the pressure in the furnace chamber 21 is controlled to be negative pressure in the temperature drop stage. However, it is also possible to supply steam We into the furnace chamber 21 during the debonding process, and at the same time control the pressure in the furnace chamber 21 to be positive pressure. In this way, the penetration of oxygen into the interior of the object C is promoted, and the debonding process is accelerated. In addition, during the baking process, the pressure in the furnace chamber 21 can also be controlled to be negative pressure to promote exhaust. In addition, as shown in the above embodiment, after the baking process, the pressure in the furnace cavity 21 can also be controlled to be negative pressure.

In addition, the embodiments of the present invention are constructed as described above, but more comprehensively, they may also include the following structures. Another object of the present invention is to provide a debonding device that can significantly shorten the debonding treatment time and a debonding method using the debonding device.

In order to achieve the above-mentioned purpose, the debonding device is characterized by comprising: a placing portion for placing an object containing an adhesive component; a heating lamp for irradiating infrared light for heating the object; a furnace cavity configured with the placing portion and the heating lamp and configured to be sealable; a gas supply portion for supplying gas into the furnace cavity; and a gas exhaust portion for exhausting gas from the furnace cavity, and having: a plurality of temperature rising stages for increasing the temperature in the furnace cavity and a plurality of temperature reducing stages for increasing the temperature in the furnace cavity. a stage temperature setting unit for a cooling stage in which the temperature drops; and an output adjusting unit for adjusting the output of the heating lamp according to the rise and fall of the temperature in the furnace, wherein the stage temperature setting unit sets each heating rate and cooling rate in the debonding process including at least repeating the heating stage and the cooling stage at least twice in an alternating manner, and the output adjusting unit adjusts the output of the heating lamp according to the heating rate and the cooling rate so that the heating lamp irradiates the infrared light.

Here, according to the debonding device of the present invention, it includes: a placing part for placing an object containing an adhesive component; a heating lamp for irradiating infrared light to heat the object; a furnace cavity equipped with the placing part and the heating lamp and configured to be sealable; a gas supply part for supplying gas into the furnace cavity; and a gas exhaust part for exhausting gas from the furnace cavity. Therefore, the object containing an adhesive component is heated by the infrared light from the heating lamp in the furnace cavity equipped with the heating lamp and configured to be sealable, so that the object can be rapidly heated (temperature increased). At this time, components such as the adhesive and solvent existing inside the object can burn in a short time, combine with the oxygen inside, and quickly release organic components (carbon). According to the experiments of the inventors, when the temperature is raised in a short time, the oxygen concentration in the furnace decreases during the temperature rise process. On the other hand, even if the temperature after the temperature rise is maintained for a certain period of time, the oxygen concentration in the furnace hardly changes. In other words, it is speculated that debonding is promoted during the temperature rise process.

According to the above structure, there are: a stage temperature setting part that sets a plurality of temperature increase stages for increasing the temperature in the furnace chamber and a temperature drop stage for decreasing the temperature in the furnace chamber; and an output adjustment part that adjusts the output of the heating lamp according to the increase and decrease of the temperature in the furnace chamber. In addition, the stage temperature setting part sets the temperature increase speed and the temperature drop speed in the debonding treatment that at least includes a treatment step (pulse treatment) of repeating the temperature increase stage and the temperature drop stage at least twice in an alternating manner, and the output adjustment part adjusts the output of the heating lamp according to the temperature increase speed and the temperature drop speed so that the heating lamp irradiates the infrared light.

In this way, by lowering the temperature after a rapid temperature rise, and then rapidly raising the temperature again, and repeating the temperature rise and fall at least twice, the debonding time can be greatly shortened, and the debonding process can be performed in a short time.

In the above structure, it also includes: a steam supply part that supplies steam from the gas to the furnace cavity separately; and a pressure control device that controls the pressure in the furnace cavity to be positive pressure or negative pressure. The steam supply part supplies the steam to the furnace cavity during the debonding process, and the pressure control device controls the pressure in the furnace cavity to be positive pressure in the temperature rising stage and controls the pressure in the furnace cavity to be negative pressure in the temperature falling stage. For example, if it takes time for steam to penetrate into the object, the debonding process can be accelerated by controlling the temperature rise step to positive pressure to promote oxygen penetration into the object, and by controlling the temperature fall step to negative pressure to promote exhaust.

In the above structure, it also includes: a steam supply part that supplies steam to the furnace cavity separately from the gas; and a pressure control device that controls the pressure in the furnace cavity to be positive pressure or negative pressure. The steam supply part supplies the steam to the furnace cavity during the debonding process, and the pressure control device can control the pressure in the furnace cavity to be positive pressure during the debonding process. If the furnace cavity is set to a positive pressure, since pressure is applied to the inside of the furnace cavity when the steam is introduced, the steam can be evenly filled into the furnace cavity and can be evenly transferred to the object, which can further promote the debonding process. In any of the above structures, the temperature increase rate and the temperature decrease rate may be, for example, 5° C./sec to 25° C./sec.

In any of the above structures, a cooling device for cooling the furnace wall of the furnace chamber is further included, and the steam supply part may have a heating part on the furnace wall of the furnace chamber for heating the steam before supplying the steam into the furnace chamber. In order to cool the heating furnace as a whole, a cooling device such as a cooler is provided on the furnace wall to cool the furnace wall. By heating the steam by the heating part before supplying the steam into the furnace chamber, condensation can be prevented from occurring in the furnace chamber, and a decrease in the temperature of the steam can be suppressed, and condensation can be prevented from occurring in the furnace chamber.

In the above structure, an oxygen measuring device for measuring the oxygen concentration in the above furnace chamber may be provided in the above furnace chamber. In addition, in the above structure, for example, the above object is an MLCC having a Ni internal electrode formed thereon, and a baking process is continuously performed after the above debonding process.

In addition, the above structure also includes a steam supply part that supplies steam to the furnace cavity separately from the gas, and a pressure control device that controls the pressure in the furnace cavity to be positive pressure or negative pressure. After the debonding treatment, a baking treatment is performed in the same furnace cavity. The steam supply part supplies the steam to the furnace cavity during the debonding treatment, and the pressure control device controls the pressure in the furnace cavity to be positive pressure during the debonding treatment and to be negative pressure during the baking treatment. By making the furnace cavity positive pressure during the debonding process, the furnace cavity is pressurized when the steam is introduced, so the steam can be evenly filled into the furnace cavity and evenly transferred to the object, which can promote the debonding process. In addition, by making the furnace cavity negative pressure during the baking process, the gas generated by baking can be quickly discharged to the outside of the furnace cavity, so the adverse effects on the product can be suppressed and the baking time can be shortened.

In addition, in order to achieve the above-mentioned purpose, a debonding method using a debonding device is provided, wherein the debonding device includes: a placing portion for placing an object containing an adhesive component; a heating lamp for irradiating infrared light for heating the object; a furnace cavity configured with the placing portion and the heating lamp and configured to be sealable; a gas supply portion for supplying gas into the furnace cavity; and a gas exhaust portion for exhausting gas from the furnace cavity, and having: a plurality of settings for making the furnace cavity A stage temperature setting unit includes a heating stage for raising the temperature in the furnace in the cavity and a cooling stage for lowering the temperature in the furnace; and an output adjusting unit for adjusting the output of the heating lamp according to the rising and falling temperature in the furnace, wherein each heating rate and cooling rate in the debonding treatment of the heat treatment step including at least repeating the heating stage and the cooling stage at least twice in an alternating manner are set, and the output of the heating lamp is adjusted according to the heating rate and the cooling rate so that the heating lamp irradiates the infrared light.

In the above structure, the debonding device also includes a steam supply part that supplies steam into the furnace cavity separately from the gas, and a pressure control device that controls the pressure in the furnace cavity to positive pressure or negative pressure. The steam supply part supplies the steam into the furnace cavity during the debonding process, and the pressure control device controls the pressure in the furnace cavity to positive pressure during the debonding process.

In addition, in the above-mentioned structure, the debonding device also includes a steam supply part that supplies steam into the furnace cavity separately from the gas, and a pressure control device that controls the pressure in the furnace cavity to be a positive pressure or a negative pressure. The steam supply part supplies the steam into the furnace cavity during the debonding process, and the pressure control device can control the pressure in the furnace cavity to be a positive pressure in the temperature rising stage and to be a negative pressure in the temperature falling stage.

In addition to the above-mentioned embodiments, the following structures can also be included in a more comprehensive list. Another object of the present invention is to provide an MLCC manufacturing device capable of continuously performing a debonding process and a baking process in the same furnace and an MLCC manufacturing method using an infrared heating device.

In order to achieve the above-mentioned purpose, an MLCC manufacturing device is characterized by comprising: a placing portion on which an MLCC is placed; a heating lamp for irradiating infrared light for heating the MLCC; a furnace cavity configured with the placing portion and the heating lamp and configured to be sealable; a gas supply portion for supplying gas into the furnace cavity; and a gas exhaust portion for exhausting gas from the furnace cavity, and further comprising a curve setting portion for setting at least debonding conditions and baking conditions of the MLCC and adjusting the heating lamp according to the rise and fall of the furnace temperature in the furnace cavity. An output adjusting unit for outputting the output, wherein the curve setting unit at least includes a stage temperature setting unit for setting a plurality of temperature rising stages for raising the furnace temperature in the furnace cavity and a temperature falling stage for lowering the furnace temperature in the furnace cavity, and the infrared light is irradiated based on the output adjustment of the output adjusting unit to remove the adhesive component from the MLCC while discharging the gas containing the removed adhesive component to perform a debonding treatment, and then the MLCC from which the adhesive component is removed is baked in the same furnace cavity.

Here, the MLCC manufacturing device according to the present invention includes: a placement portion on which MLCC is placed; a heating lamp for irradiating infrared light to heat the MLCC; a furnace cavity configured with the placement portion and the heating lamp and configured to be sealed; a gas supply portion for supplying gas into the furnace cavity; and a gas exhaust portion for exhausting gas from the furnace cavity. Therefore, the MLCC is heated by infrared light from the heating lamp in the furnace cavity configured with the heating lamp and configured to be sealed, so that the object can be heated (temperature increased) rapidly.

According to the above structure, it also includes an output adjustment unit that adjusts the output of the heating lamp according to a curve setting unit that sets at least the debonding conditions and baking conditions of the MLCC and the rise and fall of the furnace temperature in the furnace cavity, wherein the curve setting unit includes at least a stage temperature setting unit that sets a plurality of temperature rising stages for raising the furnace temperature in the furnace cavity and a temperature falling stage for lowering the furnace temperature. Therefore, according to the setting of the stage temperature setting unit, and by adjusting the irradiation of the infrared light according to the output of the output adjustment unit, the adhesive component is removed from the MLCC, and the gas containing the removed adhesive component is discharged and debonding treatment is performed. Then, the MLCC from which the adhesive component is removed can be baked in the same furnace cavity.

In the above structure, it also includes a steam supply unit for supplying steam to the furnace cavity separately from the gas, and a pressure control device for controlling the pressure in the furnace cavity to be positive pressure or negative pressure. The curve setting unit also includes: a steam supply setting unit for setting the supply of the steam; and a gas amount adjustment unit for adjusting the gas supply amount to the furnace cavity and the gas exhaust amount from the furnace cavity. The steam supply setting unit The gas quantity adjustment unit sets the steam supply to ON during the debonding process and sets the steam supply to OFF during the baking process. The gas quantity adjustment unit can control the pressure in the furnace cavity to be positive pressure by making the gas supply quantity greater than the gas exhaust quantity during the debonding process, and control the pressure in the furnace cavity to be negative pressure by making the gas supply quantity less than the gas exhaust quantity during the baking process. By making the furnace cavity to be positive pressure during the debonding process, since the pressure is applied to the inside of the furnace cavity when the steam is introduced, the steam can be evenly filled into the furnace cavity and evenly transferred to the object, thereby promoting the debonding process. Furthermore, by making the furnace cavity negative pressure during the baking process, the gas generated by baking can be quickly discharged to the outside of the furnace cavity, thereby suppressing the adverse effects on the product.

In such a structure, the stage temperature setting unit sets the processing step (pulse processing) of repeating the heating stage and the cooling stage at least twice in an alternating manner in the debonding process, and sets each heating speed and cooling speed at the same time, and the output adjustment unit can adjust the output of the heating lamp according to the heating speed and the cooling speed so that the heating lamp irradiates the infrared light. By lowering the temperature after a rapid temperature rise, and raising the temperature again, and repeating the heating and cooling at least twice, the debonding time can be greatly shortened, and the debonding process can be performed in a short time.

In any of the above structures, a cooling device for cooling the outer wall of the furnace cavity is further included, and the steam supply part may have a heating part on the furnace wall of the furnace cavity for heating the steam before supplying the steam into the furnace cavity. In order to cool the entire furnace, a cooling device such as a cooler is provided on the furnace wall to cool the furnace wall. By heating the steam by the heating part before supplying the steam into the furnace cavity, condensation can be prevented from occurring in the furnace cavity, and a temperature drop in the furnace cavity can be suppressed, and condensation can be prevented from occurring in the furnace cavity.

In order to achieve the above-mentioned purpose, a method for manufacturing MLCC is characterized in that a method for manufacturing MLCC using an infrared heating device includes: a mounting portion on which the MLCC is mounted; a heating lamp for irradiating infrared light to heat the MLCC; a furnace cavity configured with the mounting portion and the heating lamp and configured to be sealable; a gas supply portion for supplying gas into the furnace cavity; and a gas exhaust portion for exhausting gas from the furnace cavity, wherein the infrared heating device further includes a curve setting portion for setting at least a debonding condition and a baking condition of the MLCC, and the curve setting portion The invention at least comprises: a stage setting unit for setting a plurality of temperature rising stages for raising the temperature in the furnace cavity and a temperature falling stage for lowering the temperature in the furnace cavity; and an output adjusting unit for adjusting the output of the heating lamp according to the rise and fall of the temperature in the furnace, and adjusting the irradiation of the infrared light based on the output of the output adjusting unit to remove the adhesive component from the MLCC while discharging the gas containing the removed adhesive component to perform a debonding treatment, and then performing a baking treatment in which the MLCC from which the adhesive component has been removed is baked in the same furnace cavity.

The infrared heating device of the present invention can be used for heating treatment of MLCC and other electronic components, and components other than electronic components that require temperature and gas environment control.

1: Infrared heating device (debonding device, MLCC manufacturing device) 2a1, 2a2: Supply path 2b1, 2b2: Solenoid valve 2c1, 2c2: Gas cylinder 3a: Exhaust duct 3b: Injector (pressure control device) 4a: Current supply path 6: Steam supply system 7: Camera 8: Control device 20: Heating furnace 21: Furnace cavity 22: Internal space 23: Furnace wall 23a: Ceiling (top) 24: Front opening 25: Back opening 26: Front cover 27: Back cover 28: Observation window 28a: Through hole 29: Through hole 30: Nozzle (gas supply port, gas supply unit) 30a: Nozzle body 30b: Nozzle hole 31: Heating lamp 31a: Seal 31b: Fixed end cap 32: Temperature measuring part 32a: Contact member 32b: Support arm 32c: Thermocouple coupling part 32d: Connector 33: Support arm 34: Tray (mounting part, susceptor, setter) 35: Gas exhaust port (gas exhaust part) 36: Cooling pipeline (cooling device) 39: Oxygen concentration measuring device (sensor) 50: cooling nozzle 50a: nozzle hole 60: steam supply part 61: heating part 61a: box 61b: steam supply nozzle 61b1: nozzle body 61b2: nozzle hole 61c: heater 61d: temperature sensor 62: storage tank 62a: tank body 62b: heater 62c: supply pipe 62d: discharge pipe 63: mixed gas tank (mixed gas supply part) 63a: flow control part (MFC) 64: Heating pipeline 64a: Temperature sensor 80: Curve setting unit 81: Stage temperature setting unit 82: Temperature setting unit 82a: Supply start temperature setting 82b: Heating temperature setting unit 83: Gas volume setting unit 83a: Supply volume setting unit 83b: Exhaust volume setting unit 84: Steam supply setting unit 87: Monitoring unit 88: Control unit 88a: Output adjustment unit 89: Recording unit L1: Long side direction L2: Front and back direction C: Object (MLCC) H: Warm water We: Steam

[Figure 1] is a schematic diagram of an infrared heating device according to the present invention. [Figure 2] is a schematic diagram of a steam supply unit of an infrared heating device according to the present invention. [Figure 3] is a block diagram of a control device. [Figure 4] is a partial cross-sectional view of a furnace cavity. [Figure 5] is a longitudinal cross-sectional view of a furnace cavity. [Figure 6] is a top view of a furnace cavity. [Figure 7] is a diagram of each nozzle, wherein (a) is a perspective view of the nozzle and (b) is a transverse cross-sectional view of the nozzle. [Figure 8] is a schematic longitudinal cross-sectional view of the relationship between each nozzle and the suction port. [Figure 9] is a curve-one example diagram of a processing step. [Figure 10] Plot the temperature variation in the furnace in the curve shown in Figure 9.

1: Infrared heating device

7: Camera

8: Control device

2a1,2a2: Supply path

2b1,2b2: Solenoid valve

2c1,2c2: Gas cylinders

3: Exhaust system

3a: Exhaust duct

3b: Injector (pressure control device)

4a: Current supply path

6: Steam supply system

20: Heating furnace

21: Furnace cavity

23a: Ceiling (top)

29:Through hole

30: Nozzle (gas supply port, gas supply unit) supplying gas

31: Heating lamp

32: Temperature measurement department

34: Tray (loading part, susceptor, setter)

35: Gas exhaust port (gas exhaust part)

39: Oxygen concentration meter (sensor)

50: Cool nozzle

60: Steam supply unit

61: Heating section

61b: Steam supply nozzle

C: Object (MLCC)

Claims (13)

An infrared heating device includes: a placing portion for placing an object; a heating lamp for irradiating infrared light to heat the object; a furnace cavity configured with the placing portion and the heating lamp and configured to be sealable; a gas supply portion for supplying gas into the furnace cavity; and a gas exhaust portion for exhausting gas from the furnace cavity, wherein the device further includes: a steam supply portion for supplying steam into the furnace cavity separately from the gas supplied from the gas supply portion; and a pressure control device for controlling the pressure in the furnace cavity to be positive pressure or negative pressure. The infrared heating device as described in claim 1, further comprising a cooling device for cooling the furnace wall of the furnace cavity, and the steam supply part has a heating part for heating the steam before supplying it into the furnace cavity. An infrared heating device as described in claim 2, wherein the heating portion is arranged on the ceiling portion of the furnace wall and has a plurality of nozzles protruding into the furnace cavity. As described in claim 3, the infrared heating device, wherein the plurality of nozzles are provided with a plurality of through holes on four sides of the circumference of the nozzle body, and the front end of the nozzle body is closed. An infrared heating device as described in claim 3, wherein the steam supply part supplies the steam from the top of the furnace cavity, and the gas exhaust part exhausts the gas in the furnace cavity from at least one side of the side of the furnace cavity. An infrared heating device as described in claim 5, wherein the mounting portion is a rectangular tray having long sides parallel to the long sides of the heating lamp, and the gas exhaust portion exhausts the gas in the furnace cavity from both side surfaces of the furnace cavity opposite to the short sides of the tray. An infrared heating device as described in claim 3, wherein the steam supply part supplies the steam from the top of the furnace cavity, and the gas exhaust part exhausts the gas in the furnace cavity from the top of the furnace cavity. An infrared heating device as described in claim 3, wherein the pressure control device controls the pressure in the furnace cavity to be positive pressure during the period when the steam is supplied to the furnace cavity. An infrared heating device as described in claim 3, wherein the device comprises: a stage temperature setting unit for setting a plurality of heating stages for increasing the temperature inside the furnace cavity and a cooling stage for decreasing the temperature inside the furnace cavity; and an output adjusting unit for adjusting the output of the heating lamp according to the increase and decrease of the temperature inside the furnace, wherein the stage temperature setting unit sets each heating rate and cooling rate in the step of repeating the heating stage and the cooling stage at least twice in an alternating manner, and the output adjusting unit adjusts the output of the heating lamp according to the heating rate and the cooling rate so that the heating lamp irradiates the infrared light. The infrared heating device as described in claim 3, wherein the steam supply unit further includes: a storage tank for storing warm water; a mixed gas supply unit for supplying a mixed gas into the warm water; and a heating pipeline for heating the steam generated in the storage tank and supplying it to the heating unit. The infrared heating device as described in claim 10, further comprising: a furnace temperature measuring unit for measuring the furnace temperature in the furnace cavity; and a supply start temperature setting unit for setting a supply start temperature for supplying the steam into the furnace cavity, wherein when the furnace temperature exceeds the supply start temperature, the steam supply unit supplies the steam from the heating unit into the furnace cavity. The infrared heating device as described in claim 11, further comprising a heating temperature setting unit for setting the temperature of the storage tank, the temperature of the heating pipeline and the temperature of the heating unit respectively. An infrared heating device as described in any one of claims 1 to 12, wherein the object is an MLCC.

Images