TW202439078A - Replaceable cooling fan module and electronic device having the same - Google Patents
Replaceable cooling fan module and electronic device having the same Download PDFInfo
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- 238000001816 cooling Methods 0.000 title claims abstract description 39
- 230000017525 heat dissipation Effects 0.000 claims description 57
- 238000005452 bending Methods 0.000 claims description 13
- 238000009423 ventilation Methods 0.000 claims description 6
- 230000007257 malfunction Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 10
- 238000013461 design Methods 0.000 description 4
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 3
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
Description
本發明為散熱風扇之有關技術領域,尤指一種抽取式散熱風扇模組。The present invention relates to the technical field of heat dissipation fans, and in particular to an extraction type heat dissipation fan module.
已知,計算機系統包括:桌上型電腦、筆記型電腦、一體式電腦、工業電腦、伺服器主機、電玩主機等。應知道,前述之計算機系統皆會配備至少一個散熱風扇,用以協助機殼內部的電子晶片及/或電子模組進行散熱。圖1為習知的一種計算機系統的示意性立體圖。如圖1所示,習知的計算機系統1a包括:一機殼11a、必要的電子零組件12a以及複數個散熱風扇13a,其中,所述必要的電子零組件12a包含處理器晶片、繪圖晶片、DRAM模組與硬碟裝置。應知道,在該計算機系統1a正常工作的情況下,所述電子零組件12a在處理/傳輸數據的過程中會產生熱氣,該複數個散熱風扇13a運轉從而將熱氣排出該機殼11a。It is known that computer systems include: desktop computers, laptops, all-in-one computers, industrial computers, server hosts, video game hosts, etc. It should be known that the aforementioned computer systems are all equipped with at least one cooling fan to assist the electronic chips and/or electronic modules inside the case to dissipate heat. FIG1 is a schematic three-dimensional diagram of a known computer system. As shown in FIG1, the known computer system 1a includes: a
熟悉任一種計算機系統1a之設計與製造的資訊工程師必然知道,該機殼11a的至少一外表面會挖設有複數個通風孔(vent holes),且所述散熱風扇13a的一排風側係面對至少一個所述通風孔,從而利於該散熱風扇13a透過該通風孔將熱氣排出該機殼11a。然而,實務經驗指出,具有如圖1所示架構之習知的計算機系統1a具有缺陷與不足,整理如下:
(1)在使用一段時間之後,部分的通風孔會嵌有毛絮、灰塵,該些毛絮、灰塵會阻擋散熱風扇13a透過該通風孔將熱氣排出該機殼11a。
(2)在使用一段時間之後,一個或多個散熱風扇13a會因為零件損壞而無法正常運轉。此時,工程師必須打開整個機殼11a才能進行散熱風扇13a的更換,相當不便。
An information engineer familiar with the design and manufacture of any computer system 1a must know that at least one outer surface of the
由上述說明可知,現有的具多個扇熱風扇的計算機系統存在實務缺陷有待改善。因此,本發明之創作人係極力加以研究發明,而終於研發完成本發明之一種抽取式散熱風扇模組。As can be seen from the above description, the existing computer system with multiple cooling fans has practical defects that need to be improved. Therefore, the creator of the present invention has made great efforts to research and invent, and finally developed and completed the present invention of an extractable cooling fan module.
本發明之主要目的在於提供一種抽取式散熱風扇模組,係設置在一電子裝置的一機殼內,且允許自該機殼將其抽出。依據本發明之設計,該抽取式散熱風扇模組主要包括:一長方形框架、設置在該長方形框架之內的一過濾件以及複數個散熱風扇,其中該過濾件具有一舌片。因此,在此抽取式散熱風扇模組設置在該機殼之中的情況下,拖拉該舌片能將使用過後的過濾件自該長方形框架抽取,接著將另一新的過濾件置入該長方形框架。另一方面,亦可將整個抽取式散熱風扇模組自該機殼抽出,接著將工作異常的散熱風扇取下,並替換新的散熱風扇,再將抽取式散熱風扇模組推入該機殼內。The main purpose of the present invention is to provide a removable heat dissipation fan module, which is arranged in a casing of an electronic device and allows it to be pulled out from the casing. According to the design of the present invention, the removable heat dissipation fan module mainly includes: a rectangular frame, a filter arranged in the rectangular frame, and a plurality of heat dissipation fans, wherein the filter has a tongue. Therefore, when the removable heat dissipation fan module is arranged in the casing, the used filter can be pulled out from the rectangular frame by pulling the tongue, and then another new filter can be placed in the rectangular frame. On the other hand, the entire extractable cooling fan module can be extracted from the housing, and then the cooling fan that is working abnormally can be removed and replaced with a new cooling fan, and then the extractable cooling fan module can be pushed into the housing.
為達成上述目的,本發明提出所述抽取式散熱風扇模組的一實施例,其係設置在一電子裝置的一機殼內,且包括: 一長方形框架,具有一板件、連接該板件頂側的一上折彎板件以及連接該板件底側的一下折彎板件,且該上折彎板件、該板件與該下折彎板件圍出一容置槽; 一過濾件,設置於該容置槽內;以及 複數個散熱風扇,設置鄰近於該板件的一第一側邊,使得各所述散熱風扇以其一出風側面對該過濾件,並以其一入風側面對該機殼內部; 其中,該板件的一第二側邊面對該機殼的一側板,該第二側邊和該第一側邊為該板件的二相對邊,該板件上設有複數個第一通風孔,且該側板設有複數個第二通風孔; 其中,該過濾件的前端設有一舌片,且拖拉該舌片能將該過濾件自該容置槽取出。 To achieve the above-mentioned purpose, the present invention proposes an embodiment of the extractable heat dissipation fan module, which is arranged in a casing of an electronic device and includes: A rectangular frame having a plate, an upper bending plate connected to the top of the plate, and a lower bending plate connected to the bottom of the plate, and the upper bending plate, the plate and the lower bending plate surround a receiving groove; A filter, arranged in the receiving groove; and A plurality of heat dissipation fans, arranged adjacent to a first side of the plate, so that each of the heat dissipation fans faces the filter with an air outlet side thereof and faces the interior of the casing with an air inlet side thereof; Wherein, a second side of the plate faces a side plate of the housing, the second side and the first side are two opposite sides of the plate, the plate is provided with a plurality of first ventilation holes, and the side plate is provided with a plurality of second ventilation holes; Wherein, a tongue is provided at the front end of the filter, and the filter can be taken out of the accommodating groove by pulling the tongue.
在一實施例中,該長方形框架更包括: 一承載板,設置在該板件的該第一側邊,且連接該下折彎板件,使得該複數個散熱風扇設置在該承載板之上;以及 一前面板,設置在該承載板之上,且連接該上折彎板件。 In one embodiment, the rectangular frame further includes: a supporting plate disposed on the first side of the plate and connected to the lower folding plate, so that the plurality of heat dissipation fans are disposed on the supporting plate; and a front panel disposed on the supporting plate and connected to the upper folding plate.
在一實施例中,該前面板設有一開口與一第一鎖固部,且該前面板的頂側設有一第一樞接部。In one embodiment, the front panel is provided with an opening and a first locking portion, and a first hinge portion is provided on the top side of the front panel.
在一實施例中,一電路板設置在該承載板之上,複數個電連接器設置在該電路板之上,且該複數個散熱風扇透過複數條纜線分別耦接該複數個電連接器。In one embodiment, a circuit board is disposed on the carrier board, a plurality of electrical connectors are disposed on the circuit board, and the plurality of heat dissipation fans are respectively coupled to the plurality of electrical connectors through a plurality of cables.
在可行的實施例中,本發明所述之抽取式散熱風扇模組更包括: 一蓋板,具有和該第一樞接部相互樞接的一第二樞接部;以及 一第一鎖固件,透過該蓋板而螺入該第一鎖固部,使該蓋板結合至該前面板,並遮蓋該開口以及該容置槽的一前槽口。 In a feasible embodiment, the extractable heat dissipation fan module of the present invention further includes: a cover plate having a second hinge portion hinged to the first hinge portion; and a first locking member screwed into the first locking portion through the cover plate, so that the cover plate is coupled to the front panel and covers the opening and a front notch of the receiving slot.
在一實施例中,在將該第一鎖固件自該第一鎖固部螺出並接著將該蓋板旋動一角度以露出該容置槽的該前槽口之後,接著拖拉該舌片能將該過濾件自該容置槽取出。In one embodiment, after the first locking member is screwed out from the first locking portion and the cover plate is rotated at an angle to expose the front notch of the receiving tank, the filter element can be removed from the receiving tank by pulling the tongue.
在一實施例中,該機殼的一前板設有一前開口,使得所述抽取式散熱風扇模組穿過該前開口而設置在該機殼內。In one embodiment, a front plate of the housing is provided with a front opening, so that the extractable heat dissipation fan module passes through the front opening and is disposed in the housing.
在一實施例中,該前板具有位於該前開口內的一第二鎖固部,使得一第二鎖固件透過該前面板而螺入該第二鎖固部。In one embodiment, the front panel has a second locking portion located in the front opening, so that a second locking member is screwed into the second locking portion through the front panel.
在一實施例中,在將該第二鎖固件自該第二鎖固部螺出之後,接著拖拉該第二鎖固件能將所述抽取式散熱風扇模組自該機殼取出。In one embodiment, after the second locking member is screwed out from the second locking portion, the second locking member can be pulled to remove the extractable heat dissipation fan module from the housing.
在一實施例中,該電路板電連接設置在該機殼之內的一主板,且一微動開關設置在該機殼之內,並電性連接設置在該主板上的一風扇控制晶片。In one embodiment, the circuit board is electrically connected to a main board disposed in the housing, and a micro switch is disposed in the housing and electrically connected to a fan control chip disposed on the main board.
在一實施例中,該微動開關的一控制部係位於該前開口內,且在該抽取式散熱風扇模組置入該機殼內之後,該前面板推擠下壓該控制部,使該微動開關自一斷路狀態切換至一通路狀態,從而使能該風扇控制晶片驅動且控制該複數個散熱風扇運轉。In one embodiment, a control portion of the micro switch is located in the front opening, and after the extractable cooling fan module is placed in the housing, the front panel pushes down the control portion to switch the micro switch from an open state to an open state, thereby enabling the fan control chip to drive and control the operation of the plurality of cooling fans.
並且,本發明同時提供一種電子裝置的一實施例,其包括一機殼以及設置在該機殼的一主板,其中該機殼的一前板設有一前開口;其特徵在於,進一步包括如前所述本發明之抽取式散熱風扇,且該抽取式散熱風扇模組穿過該前開口而設置在該機殼內。Furthermore, the present invention also provides an embodiment of an electronic device, which includes a casing and a mainboard disposed in the casing, wherein a front panel of the casing is provided with a front opening; the device is characterized in that it further includes the extractable heat dissipation fan of the present invention as described above, and the extractable heat dissipation fan module passes through the front opening and is disposed in the casing.
為了能夠更清楚地描述本發明所提出之一種抽取式散熱風扇模組及包含其之電子裝置,以下將配合圖式,詳盡說明本發明之較佳實施例。In order to more clearly describe the extractable heat dissipation fan module and the electronic device including the same proposed by the present invention, the following will be combined with the drawings to explain in detail the preferred embodiments of the present invention.
請參閱圖2A、圖2B與圖2C,其分別為包含本發明之一種抽取式散熱風扇模組的一電子裝置的第一、第二、第三立體圖。如圖2A、圖2B與圖2C所示,該電子裝置2可以是但不限於伺服器、交換機、路由器、閘道器、工業電腦、桌上型電腦、一體式(all-in-one)電腦、智慧型電視、或投影機,且其包括一機殼21以及設置在該機殼21的一主板。其中,該機殼21的一前板21F設有一前開口21O,使得本發明之抽取式散熱風扇模組1可以穿過該前開口21O從而設置在該機殼21內。Please refer to FIGS. 2A, 2B and 2C, which are respectively first, second and third perspective views of an electronic device including a removable cooling fan module of the present invention. As shown in Figure 2A, Figure 2B and Figure 2C, the
圖3A與圖3B分別為本發明之一種抽取式散熱風扇模組的第一、第二立體圖。並且,圖4A為圖3A所示之抽取式散熱風扇模組的立體分解圖,且圖4B為圖3B所示之抽取式散熱風扇模組的立體分解圖。依據本發明之設計,所述抽取式散熱風扇模組1包括:一長方形框架11、一過濾件12、複數個散熱風扇13、一蓋板1C、一電路板15、複數個電連接器16、一第一鎖固件17、以及一第二鎖固件18。如圖4A與圖4B所示,該長方形框架11包括:一板件11P、一上折彎板件11U、一下折彎板件11L、一承載板11S、以及一前面板1F,其中該上折彎板件11U連接該板件11P的頂側,且該下折彎板件11L接該板件11P的底側。FIG3A and FIG3B are respectively the first and second three-dimensional views of a removable heat dissipation fan module of the present invention. FIG4A is a three-dimensional exploded view of the removable heat dissipation fan module shown in FIG3A, and FIG4B is a three-dimensional exploded view of the removable heat dissipation fan module shown in FIG3B. According to the design of the present invention, the removable heat
依據本發明之設計,複數個肋件11R連接該上折彎板件11U與該下折彎板件11L,從而與該上折彎板件11U、該板件11P以及該下折彎板件11L一同圍出一容置槽111,使得該過濾件12得以被設置於該容置槽111內。另一方面,該承載板11S設置在該板件11P的一第一側邊,且連接該下折彎板件11L。並且,該板件11P的一第二側邊面對該機殼21的一側板21S,該第二側邊和該第一側邊為該板件11P的二相對邊,該板件11P上設有複數個第一通風孔112,且該側板21S設有複數個第二通風孔21V。According to the design of the present invention, a plurality of
更詳細地說明,該前面板1F設置在該承載板11S之上,且連接該上折彎板件11U。並且,該前面板1F設有一開口1F1與一第一鎖固部1F2,且該前面板1F的頂側設有一第一樞接部1F3。如圖2A至圖4B所示,該蓋板1C具有和該第一樞接部1F3相互樞接的一第二樞接部1C1。值得注意的是,該第一鎖固件17透過該蓋板1C而螺入該第一鎖固部1F2,使該蓋板1C結合至該前面板1F,並遮蓋該開口1F1以及該容置槽111的一前槽口。To explain in more detail, the
如圖2A至圖4B所示,該複數個散熱風扇13設置在該承載板11S之上,使得各所述散熱風扇13以其一出風側面對該過濾件12,並以其一入風側面對該機殼21內部。進一步地,該電路板15設置在該承載板11S之上,且該複數個電連接器16設置在該電路板15之上,使得該複數個散熱風扇13得以透過複數條纜線分別耦接該複數個電連接器16。補充說明的是,該電路板15電連接設置在該機殼21之內的一主板,且一微動開關1M設置在該機殼21之內,並電性連接設置在該主板上的一風扇控制晶片。As shown in FIG. 2A to FIG. 4B , the plurality of
繼續地參閱圖2A至圖4B,並請同時參閱圖5A與圖5B,其分別為本發明之抽取式散熱風扇模組的第三、第四立體圖。如圖2A至圖5B所示,由於該過濾件12具有一舌片121,因此,在此抽取式散熱風扇模組1設置在該機殼21之中的情況下,可以先將該第一鎖固件17自該第一鎖固部1F2螺出並接著將該蓋板1C旋動一角度以露出該容置槽111的該前槽口,接著拖拉該舌片121以將該過濾件12自該容置槽111取出。之後,可在清除該過濾件12之上的毛絮、灰塵之後,再將該過濾件12放回該容置槽111。當然,在取出已使用的過濾件12之後,亦可直接將另一新的過濾件12置入該容置槽111。Continuing to refer to FIG. 2A to FIG. 4B, and also to FIG. 5A and FIG. 5B, which are respectively the third and fourth three-dimensional views of the extractable heat dissipation fan module of the present invention. As shown in FIG. 2A to FIG. 5B, since the
更詳細地說明,該機殼21的該前板21F具有位於該前開口21O內的一第二鎖固部21FF。因此,在將所述抽取式散熱風扇模組1置入該機殼21之後,可以接著令該第二鎖固件18透過該前面板1F而螺入該第二鎖固部21FF,藉此方式固定該抽取式散熱風扇模組15。相反地,欲自該機殼21取出整組所述抽取式散熱風扇模組1之時,須先將該第二鎖固件18自該第二鎖固部21FF螺出,接著拖拉該第二鎖固件18以將所述抽取式散熱風扇模組自該機殼21取出。此時,便可以將工作異常的散熱風扇13取下,而後替換新的散熱風扇13,再將所述抽取式散熱風扇模組1推回該機殼21內。 值得注意的是,該微動開關1M的一控制部1M1係位於該前開口21O內。因此,在該抽取式散熱風扇模組1推回該機殼21之內後,該前面板1F推擠下壓該控制部1M1,使該微動開關1M自一斷路狀態切換至一通路狀態,從而使能該風扇控制晶片驅動且控制該複數個散熱風扇13運轉。To explain in more detail, the
如此,上述係已完整且清楚地說明本發明之抽取式散熱風扇模組。必須加以強調的是,上述之詳細說明係針對本發明可行實施例之具體說明,惟該實施例並非用以限制本型之專利範圍,凡未脫離本明技藝精神所為之等效實施或變更,均應包含於本案之專利範圍中。Thus, the above description has completely and clearly described the extraction type heat dissipation fan module of the present invention. It must be emphasized that the above detailed description is a specific description of the feasible embodiment of the present invention, but the embodiment is not used to limit the patent scope of this type. Any equivalent implementation or modification that does not deviate from the technical spirit of the present invention should be included in the patent scope of this case.
1a:計算機系統
11a:機殼
12a:電子零組件
13a:散熱風扇
1:抽取式散熱風扇模組
11:長方形框架
111:容置槽
112:第一通風孔
11P:板件
11U:上折彎板件
11L:下折彎板件
11S:承載板
11R:肋件
12:過濾件
121:舌片
13:散熱風扇
15:電路板
16:電連接器
17:第一鎖固件
18:第二鎖固件
1F:前面板
1F1:開口
1F2:第一鎖固部
1F3:第一樞接部
1C:蓋板
1C1:第二樞接部
1M:微動開關
1M1:控制部
2:電子裝置
21:機殼
21S:側板
21V:第二通風孔
21F:前板
21O:前開口
21FF:第二鎖固部
1a:
圖1為習知的一種計算機系統的示意性立體圖; 圖2A為包含本發明之一種抽取式散熱風扇模組的一電子裝置的第一立體圖; 圖2B為包含本發明之抽取式散熱風扇模組的電子裝置的第二立體圖; 圖2C為包含本發明之抽取式散熱風扇模組的電子裝置的第三立體圖; 圖3A為本發明之一種抽取式散熱風扇模組的第一立體圖; 圖3B為本發明之抽取式散熱風扇模組的第二立體圖; 圖4A為圖3A所示之抽取式散熱風扇模組的立體分解圖; 圖4B為圖3B所示之抽取式散熱風扇模組的立體分解圖; 圖5A為本發明之抽取式散熱風扇模組的第三立體圖;以及 圖5B為本發明之抽取式散熱風扇模組的第三立體圖。 FIG1 is a schematic three-dimensional diagram of a known computer system; FIG2A is a first three-dimensional diagram of an electronic device including a removable heat dissipation fan module of the present invention; FIG2B is a second three-dimensional diagram of an electronic device including the removable heat dissipation fan module of the present invention; FIG2C is a third three-dimensional diagram of an electronic device including the removable heat dissipation fan module of the present invention; FIG3A is a first three-dimensional diagram of a removable heat dissipation fan module of the present invention; FIG3B is a second three-dimensional diagram of the removable heat dissipation fan module of the present invention; FIG4A is a three-dimensional exploded diagram of the removable heat dissipation fan module shown in FIG3A; FIG4B is a three-dimensional exploded diagram of the removable heat dissipation fan module shown in FIG3B; FIG5A is a third three-dimensional diagram of the removable heat dissipation fan module of the present invention; and Figure 5B is a third perspective view of the extractable heat dissipation fan module of the present invention.
1:抽取式散熱風扇模組 1: Extraction type cooling fan module
1M1:控制部 1M1: Control Department
2:電子裝置 2: Electronic devices
21:機殼 21: Chassis
21S:側板 21S: Side panels
21V:第二通風孔 21V: Second vent
21F:前板 21F: Front panel
21O:前開口 21O: front opening
21FF:第二鎖固部 21FF: Second locking part
Claims (13)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112110609A TWI855604B (en) | 2023-03-22 | 2023-03-22 | Replaceable cooling fan module and electronic device having the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112110609A TWI855604B (en) | 2023-03-22 | 2023-03-22 | Replaceable cooling fan module and electronic device having the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI855604B TWI855604B (en) | 2024-09-11 |
| TW202439078A true TW202439078A (en) | 2024-10-01 |
Family
ID=93649034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112110609A TWI855604B (en) | 2023-03-22 | 2023-03-22 | Replaceable cooling fan module and electronic device having the same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI855604B (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW475747U (en) * | 2000-07-25 | 2002-02-01 | Kwok-Yan Leung | Venting device of the host compute housing for industrial computer |
| US7821790B2 (en) * | 2006-03-24 | 2010-10-26 | Slt Logic, Llc | Modular chassis providing scalable mechanical, electrical and environmental functionality for MicroTCA and Advanced TCA boards |
| TWM315007U (en) * | 2006-12-11 | 2007-07-01 | Delta Electronics Inc | Frame structure of a cooling fan, the cooling fan and heat generating device having the fan |
| TWM341393U (en) * | 2008-02-13 | 2008-09-21 | Advantech Co Ltd | Fan fixation rack |
| TWM643790U (en) * | 2023-03-22 | 2023-07-11 | 立端科技股份有限公司 | Extractable cooling fan module and electronic device including same |
-
2023
- 2023-03-22 TW TW112110609A patent/TWI855604B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI855604B (en) | 2024-09-11 |
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