TW202404066A - Microscopic light-emitting diode display and manufacturing method thereof - Google Patents

Abstract

A microscopic light-emitting diode display includes a first substrate, a second substrate, a color conversion layer, a first barrier and a microscopic light-emitting diode (micro-LED). The color conversion layer is located between the first substrate and the second substrate. The color conversion layer is connected with the first substrate. The first barrier is connected with the first substrate. The first barrier surrounds and connects with the color conversion layer. The micro-LED is located between the color conversion layer and the second substrate. The micro-LED is connected with the second substrate and is separated from the color conversion layer.

Description

Microluminescent diode display and manufacturing method thereof

The present invention relates to a micro-luminescent diode display and a method for manufacturing the micro-luminescent diode display.

With the advancement of today's technology, various types of displays have been greatly integrated into consumers' daily lives. In order to meet the needs of consumers and seize this huge business opportunity, manufacturers are committed to improving the factory quality of displays under better cost control.

Therefore, in the production process of micro-luminescent diode displays, how to effectively improve the production yield at low cost is undoubtedly a development direction that the industry attaches great importance to.

One object of the present invention is to provide a micro-light-emitting diode display that allows users to easily replace or repair the micro-light-emitting diodes, thereby reducing the manufacturing cost of the micro-light-emitting diode display.

According to an embodiment of the present invention, a micro-light emitting diode display includes a first substrate, a second substrate, a color transfer layer, a first barrier part and a micro-light emitting diode. The color transfer layer is located between the first substrate and the second substrate, and the color transfer layer is connected to the first substrate. The first barrier part is connected to the first substrate and surrounds and connected to the color transfer layer. The micro-light emitting diode is located between the color transfer layer and the second substrate. The micro-light emitting diode is connected to the second substrate and separated from the color transfer layer.

In one or more embodiments of the present invention, the above-mentioned first barrier portion has a width, and the width tapers in a direction toward the first substrate.

In one or more embodiments of the present invention, the above-mentioned micro-light emitting diode display further includes a first light-absorbing portion. The first light absorbing part is connected between the first substrate and the first blocking part.

In one or more embodiments of the present invention, the above-mentioned micro-light emitting diode display further includes a second blocking portion. The second barrier part is connected to the second substrate and surrounds and connected to the micro-light emitting diode. The second barrier part and the first barrier part are separated from each other.

In one or more embodiments of the present invention, the above-mentioned second blocking portion is at least partially located between the micro-light emitting diode and the second substrate.

In one or more embodiments of the present invention, the above-mentioned micro-light emitting diode display further includes a second light-absorbing portion. The second light absorbing part is connected to a side of the first blocking part away from the first substrate, and the second light absorbing part and the second blocking part are separated from each other.

In one or more embodiments of the present invention, the above-mentioned micro-light emitting diode display further includes optical materials. The optical material is at least partially filled between the second light absorbing part and the second blocking part.

In one or more embodiments of the present invention, the above-mentioned micro-light emitting diode display further includes a third light-absorbing portion. The third light absorbing part is connected to a side of the second barrier part away from the second substrate, and the third light absorbing part and the second light absorbing part are separated from each other.

In one or more embodiments of the present invention, the above-mentioned micro-light emitting diode display further includes optical materials. The optical material is at least partially filled between the third light absorbing part and the second light absorbing part.

In one or more embodiments of the present invention, the above-mentioned micro-light emitting diode display further includes a second light-absorbing portion. The second light absorbing part is connected between the first blocking part and the second blocking part.

In one or more embodiments of the present invention, the above-mentioned micro-light emitting diode display further includes a fourth light-absorbing part and an optical material. The fourth light-absorbing part is connected to the second substrate and surrounds the micro-light-emitting diode. The fourth light-absorbing part and the first blocking part are separated from each other. The optical material is at least partially filled between the fourth light absorbing part and the first blocking part.

In one or more embodiments of the present invention, the above-mentioned first blocking part includes a light-absorbing material.

In one or more embodiments of the present invention, the micro-LED display further includes a color filter layer. The color filter layer is connected between the first substrate and the color transfer layer.

In one or more embodiments of the present invention, the above-mentioned micro-light emitting diode display further includes a patterned optical coating. The patterned optical coating is at least partially connected between the microluminescent diode and the color transfer layer, and the patterned optical coating is wider than the microluminescent diode.

In one or more embodiments of the present invention, the above-mentioned patterned optical coating has a bevel, which is connected to and surrounds the micro-luminescent diode, and a certain angle is formed between the bevel and the color transfer layer. The range of this angle is 30 degrees. between 90 degrees.

One object of the present invention is to provide a method for manufacturing a micro-light emitting diode display, which can manufacture a display in which the micro-light emitting diodes are easy to replace or repair, thereby reducing the manufacturing cost of the micro-light emitting diode display.

According to an embodiment of the present invention, a method for manufacturing a micro-light emitting diode display includes manufacturing an upper structure and a lower structure. The manufacturing structure includes: arranging a first substrate on the first base plate; arranging a plurality of color filter layers and a first light-absorbing part on the first substrate, and the first light-absorbing parts are connected to surround each color filter layer; A first blocking part is provided on the top, and the cross section of the first blocking part is at least partially inverted cone shape, and the first blocking part has a plurality of spaces, and these spaces are respectively connected to the corresponding color filter layers; and at least one rotation is arranged in the space. The color layer is connected to the first barrier part. Manufacturing the lower structure includes: arranging a second substrate on the second base plate; arranging a plurality of micro-luminescent diodes on the second substrate; and arranging a second barrier portion on the second substrate and surrounding the micro-luminescent diodes with the second barrier portion. diode. The manufacturing method further includes: flipping the upper structure relative to the lower structure so that the micro-light emitting diodes are aligned with corresponding spaces respectively, and connecting the upper structure and the lower structure to each other; and removing the first base plate and the second base plate.

In one or more embodiments of the present invention, the step of connecting the upper structure and the lower structure to each other includes: connecting the upper structure and the lower structure with an optical material, and maintaining the color transfer layer and the corresponding micro-light emitting diode. separated from each other.

In one or more embodiments of the present invention, the step of connecting the upper structure and the lower structure to each other includes: connecting the upper structure and the lower structure with a frame, and maintaining the color transfer layer and the corresponding micro-light emitting diode. separated from each other.

In one or more embodiments of the present invention, the above-mentioned step of manufacturing the lower structure includes: respectively providing patterned optical coatings on the micro-light emitting diodes.

In one or more embodiments of the present invention, the above-mentioned second blocking part includes a light-absorbing material.

The above-mentioned embodiments of the present invention at least have the following advantages: since the micro-luminescent diode display is composed of an upper structure and a lower structure, the micro-luminescent diode connected to the second substrate and the color transfer layer connected to the first substrate are separated from each other, that is, there is no direct contact between the micro-LED and the color transfer layer. Therefore, when the micro-LED needs to be replaced or repaired, the user only needs to disassemble the upper structure and the lower structure. Micro-light-emitting diodes can be replaced or repaired, and the process does not involve the destruction or removal of the color transfer layer. Therefore, the production yield of micro-light-emitting diodes can be effectively improved, thereby reducing the production cost of micro-light-emitting diode displays. cost.

A plurality of embodiments of the present invention will be disclosed in the drawings below. For clarity of explanation, many practical details will be explained in the following description. However, it will be understood that these practical details should not limit the invention. That is to say, in some embodiments of the present invention, these practical details are not necessary. In addition, for the sake of simplifying the drawings, some commonly used structures and components are illustrated in the drawings in a simple schematic manner, and the same reference numerals are used to represent the same or similar components in all the drawings. . And if possible in implementation, features of different embodiments can be applied interchangeably.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have their ordinary meanings that can be understood by one familiar with the art. Furthermore, the definitions of the above-mentioned words in commonly used dictionaries should be interpreted as meanings consistent with the relevant fields of the present invention in the content of this specification. Unless specifically defined, these terms will not be interpreted as having an idealized or overly formal meaning.

Please refer to picture 1. Figure 1 is a flow chart illustrating a method 500 for manufacturing a microscopic light-emitting diode (micro-LED) display according to an embodiment of the present invention. In this embodiment, as shown in Figure 1 , a method 500 for manufacturing a micro-light emitting diode display includes the following steps (it should be understood that the steps mentioned in some embodiments, unless the order is specifically stated In addition, the sequence can be adjusted according to actual needs, and can even be executed simultaneously or partially simultaneously):

(1) Fabricate the upper structure US (step 510). Please refer to Figures 2 to 6. Figures 2 to 6 are schematic diagrams illustrating the manufacturing process of the structure US shown in Figure 1 . Specifically, the step of manufacturing the upper structure US (ie step 510) further includes:

(1.1) Set the first substrate 110 on the first base plate 210 (step 511). As shown in FIG. 2 , the first substrate 110 has been disposed on the first base plate 210 .

(1.2) A plurality of color filter layers 170 and first light absorbing parts 161 are provided on the first substrate 110, and the first light absorbing parts 161 are connected to surround each color filter layer 170 (step 512). As shown in FIG. 3 , three color filter layers 170 have been disposed on the first substrate 110 . In fact, the colors of the three color filter layers 170 are different. For example, the color filter layers 170 arranged from left to right in FIG. 3 may be a red color filter layer 170R, a green color filter layer 170G, and a blue color filter layer 170B respectively. Furthermore, the first light absorbing parts 161 are connected to surround each color filter layer 170 .

(1.3) A first blocking part 141 is provided on the first light-absorbing part 161, and the cross section of the first blocking part 141 is at least partially inverted cone shape, and the first blocking part 141 has a plurality of spaces SP, and the spaces SP are connected to the corresponding spaces respectively. Color filter layer 170 (step 513). As shown in Figure 4, the first blocking part 141 is disposed on the first light absorbing part 161, and the first light absorbing part 161 is connected between the first substrate 110 and the first blocking part 141, and the cross section of the first blocking part 141 is at least Partially inverted cone shape. In other words, the cross-sectional width WD of the first barrier portion 141 tapers in the direction toward the first substrate 110 , that is, the width of the side of the first barrier portion 141 away from the first substrate 110 is larger than the first barrier portion 141 Close to the width of one side of the first substrate 110 .

(1.4) Set the color transfer layer 130 in at least one of the spaces SP, and connect the color transfer layer 130 to the first barrier portion 141 (step 514). For example, as mentioned above, the leftmost color filter layer 170 in FIG. 5 is a red color filter layer 170R. As shown in FIG. 5 , a red color transfer layer 130R is provided in the space SP corresponding to the red color filter layer 170R, and the red color filter layer 170R is connected between the first substrate 110 and the red color transfer layer 130R. . Furthermore, the first barrier part 141 surrounds and connects the red color transfer layer 130R, and the first barrier part 141 can provide optical barrier and physical barrier functions to the color transfer layer 130R.

(1.5) Fill the remaining space SP with the first optical material OM1, and connect the first optical material OM1 to the first blocking part 141 (step 515). For example, in FIG. 6 , as mentioned above, the color filter layer 170 arranged in the middle is a green color filter layer 170G, and the color filter layer 170 located on the far right is a blue color filter layer 170B. As shown in FIG. 6 , the space SP corresponding to the green color filter layer 170G and the blue color filter layer 170B is provided with the first optical material OM1 , and the first optical material OM1 is connected to the first blocking part 141 . In practical applications, the thickness of the first optical material OM1 is less than or equal to the thickness of the first blocking part 141 .

At this time, the upper structure US is also completed.

(2) Fabricate the lower structure LS (step 520). Please refer to Figures 7 to 10. Figures 7 to 10 are schematic diagrams illustrating the manufacturing process of the structure LS shown in Figure 1 . Specifically, the step of manufacturing the lower structure LS (ie step 520) further includes:.

(2.1) Set the second substrate 120 on the second base plate 220 (step 521). As shown in FIG. 7 , the second substrate 120 has been disposed on the second base plate 220 .

(2.2) Arrange a plurality of micro-light emitting diodes 150 on the second substrate 120 (step 522). As shown in FIG. 8 , three micro-light emitting diodes 150 have been disposed on the second substrate 120 . For example, among the three micro-light-emitting diodes 150, the one in the middle is the micro-light-emitting diode 150G that can emit green light, and the ones on both sides are the micro-light-emitting diodes 150B that can emit blue light. . In other embodiments, the three micro-light-emitting diodes 150 may all be micro-light-emitting diodes 150B that can emit blue light, or among the three micro-light-emitting diodes 150 , one of the two micro-light-emitting diodes 150 may be located on both sides. One is a micro-light emitting diode 150 that can emit red light, and the other two micro-light emitting diodes 150 are located on one side of the micro-light emitting diode 150B that can emit blue light.

(2.3) Set the second barrier portion 142 on the second substrate 120 and surround each micro-light emitting diode 150 (step 523). As shown in FIG. 9 , the second blocking part 142 has been disposed on the second substrate 120 , and the second blocking part 142 surrounds each micro-light emitting diode 150 . In this embodiment, the second blocking portion 142 is at least partially connected to the micro-light emitting diode 150 .

(2.4) Set patterned optical coatings 180 on the micro-light emitting diodes 150 (step 524). As shown in FIG. 10 , the patterned optical coatings 180 have been respectively disposed on the three micro-light emitting diodes 150 . It is worth noting that the patterned optical coating 180 is wider than the micro-light-emitting diode 150 , that is, the width of the patterned optical coating 180 is greater than the width of the corresponding micro-light-emitting diode 150 . More specifically, the size of the patterned optical coating 180 is larger than the size of the micro-light emitting diode 150 but smaller than or equal to the space SP surrounded by the first blocking portion 141 .

Furthermore, the manufacturing method 500 further includes:

(3) Flip the upper structure US relative to the lower structure LS, so that the micro-light emitting diodes 150 are respectively aligned with the corresponding spaces SP, and the upper structure US and the lower structure LS are connected to each other (step 530). Please refer to Figures 11 and 12. Figure 11 is a schematic diagram illustrating the connection between the upper structure US in Figure 6 and the lower structure LS in Figure 10. Figure 12 shows the micro-light emitting diode display 100 of Figure 11, in which the upper structure US and the lower structure LS have been connected to each other, and the first bottom plate 210 and the second bottom plate 220 have been removed. As shown in FIG. 11 , the upper structure US has been flipped relative to the lower structure LS, and the micro-light emitting diodes 150 are respectively aligned with the corresponding spaces SP. Specifically, in Figure 11, the red color filter layer 170R and the red color transfer layer 130R are aligned with the micro-luminescent diode 150B that can emit blue light, and the green color filter layer 170G and the first optical material OM1 are aligned with each other to emit blue light. The green light-emitting diode 150G is aligned with the blue color filter layer 170B and the first optical material OM1 to emit the blue light-emitting diode 150B. Furthermore, in this embodiment, as shown in FIG. 12 , the upper structure US and the lower structure LS are connected to each other by the frame 190 being connected between the upper structure US and the lower structure LS, and maintaining the red rotation. The color layer 130R and the corresponding micro-light-emitting diode 150B that can emit blue light are separated from each other. Moreover, the second blocking part 142 and the first blocking part 141 are also separated from each other. More specifically, the frame 190 is connected between the first substrate 110 of the upper structure US and the second barrier portion 142 of the lower structure LS, and the upper structure US and the lower structure LS are at least partially separated from each other by air.

(4) Remove the first bottom plate 210 and the second bottom plate 220 (step 540). As shown in FIG. 12 , the first base plate 210 and the second base plate 220 have been removed, and the fabrication of the micro-LED display 100 is completed.

It is worth noting that since the micro-light-emitting diode display 100 is connected by the upper structure US and the lower structure LS, the micro-light-emitting diode 150 connected to the second substrate 120 and the color conversion chip connected to the first substrate 110 The layers 130 are separated from each other, that is, there is no direct contact between the micro-light-emitting diode 150 and the color transfer layer 130. Therefore, when the micro-light-emitting diode 150 needs to be replaced or repaired, the user only needs to remove the upper structure US and the lower structure US. When the structure LS is disassembled, the micro-light-emitting diode 150 can be replaced or repaired. The process does not involve the destruction or removal of the color transfer layer 130, so the production yield of the micro-light-emitting diode 150 can be effectively improved, thereby further improving the production yield of the micro-light-emitting diode 150. The manufacturing cost of the micro-light emitting diode display 100 can be reduced.

Furthermore, as mentioned above, the red color transfer layer 130R is aligned with the micro-luminescent diodes 150B that can emit blue light, and the first optical material OM1 is aligned with the micro-luminescent diodes 150G that can emit green light and blue light, respectively. , 150B. In other words, when the upper structure US and the lower structure LS are paired, the upper structure US with only one red color transfer layer 130R is suitable for corresponding to two micro-luminescent diodes 150B that can emit blue light and one that can emit blue light. The lower structure LS of the micro-light emitting diode 150G that emits green light. In addition, the upper structure US having only one green color transfer layer 130 is suitable for corresponding to the lower structure LS having one micro-luminescent diode 150 that can emit red light and two micro-luminescent diodes 150B that can emit blue light. Furthermore, depending on the actual situation, the user can use three micro-light emitting diodes 150B that can emit blue light, and configure them to align the red color transfer layer 130R, the green color transfer layer 130 and the first optical material OM1 respectively. This results in a combination of red, green and blue light. Alternatively, depending on the actual situation, the user can use three micro-light emitting diodes 150 that can emit ultraviolet light and configure them to align the red color transfer layer 130R, the green color transfer layer 130 and the blue color transfer layer 130 respectively. , to obtain a combination of red, green, and blue light. However, the present invention does not limit the micro-LED display 100 to only emit a combination of red, green, and blue light. Depending on the actual situation, the user can also match different micro-light emitting diodes 150 and color transfer layers 130 of different colors so that the micro-light emitting diode display 100 can emit white light.

Furthermore, as shown in FIG. 12 , the patterned optical coating 180 is at least partially connected between the micro-light-emitting diode 150 and the color transfer layer 130 , or at least partially connected between the micro-light-emitting diode 150 and the first color transfer layer 130 . Between optical materials OM1.

Please refer to Figure 13. FIG. 13 is a schematic cross-sectional view of a micro-light emitting diode display 100 according to another embodiment of the present invention. In this embodiment, as shown in FIG. 13 , the micro-LED display 100 further includes a second light-absorbing portion 162 . The second light absorbing part 162 is connected between the first blocking part 141 and the second blocking part 142 . Furthermore, in this embodiment, the micro-light emitting diode display 100 does not include the above-mentioned patterned optical coating 180, and the color transfer layer 130 and the first optical material OM1 are respectively separated from the corresponding micro-light emitting diodes 150. .

Please refer to Figure 14. FIG. 14 is a schematic cross-sectional view of a micro-light emitting diode display 100 according to yet another embodiment of the present invention. In this embodiment, as shown in FIG. 14 , the micro-light emitting diode display 100 includes a second light absorbing part 162 and a third light absorbing part 163 . The second light absorbing part 162 is connected to a side of the first blocking part 141 away from the first substrate 110 , and the third light absorbing part 163 is connected to a side of the second blocking part 142 away from the second substrate 120 . In this embodiment, the third light absorbing part 163 and the second light absorbing part 162 are separated from each other.

Furthermore, in this embodiment, as shown in FIG. 14 , the patterned optical coating 180 is at least partially connected between the micro-luminescent diode 150 and the color transfer layer 130 , and the patterned optical coating 180 is relatively micro. LED 150 is wider. More specifically, the patterned optical coating 180 has a bevel 180a, the bevel 180a is connected to and surrounds the micro-light emitting diode 150, and an angle θ is formed between the bevel 180a and the color transfer layer 130. In practical applications, in order to control the light emission angle of the micro-light emitting diode 150, the range of the angle θ is between 30 degrees and 90 degrees.

Furthermore, as shown in FIG. 14 , the second blocking portion 142 is at least partially located between the micro-light emitting diode 150 and the second substrate 120 . More specifically, the second barrier portion 142 can be at least partially filled between the pins of the micro-LED 150 facing the second substrate 120 .

Please refer to Figure 15. FIG. 15 is a schematic cross-sectional view of a micro-light emitting diode display 100 according to another embodiment of the present invention. In this embodiment, as shown in FIG. 15 , the upper structure US and the lower structure LS are connected to each other by using the second optical material OM2 to connect between the upper structure US and the lower structure LS and maintain the color transfer layer 130 The corresponding micro-light emitting diodes 150 are separated from each other.

Specifically, as shown in FIG. 15 , the patterned optical coating 180 is at least partially connected between the micro-light emitting diode 150 and the color transfer layer 130 . In addition, the micro-light emitting diode display 100 includes the second light absorbing portion 162 but does not include the above-mentioned third light absorbing portion 163 . The second light absorbing part 162 is connected to a side of the first blocking part 141 away from the first substrate 110 , and the second light absorbing part 162 and the second blocking part 142 are separated from each other. More specifically, the second optical material OM2 is at least partially filled between the second light absorbing part 162 and the second blocking part 142 .

Please refer to Figure 16. FIG. 16 is a schematic cross-sectional view of a micro-light emitting diode display 100 according to another embodiment of the present invention. In this embodiment, as shown in FIG. 16 , the micro-luminescent diode display 100 does not include the above-mentioned patterned optical coating 180 , but the color transfer layer 130 and the first optical material OM1 are respectively connected with the corresponding micro-luminescent diodes. The bodies 150 are separated from each other by the second optical material OM2. Furthermore, the micro-LED display 100 includes a second light-absorbing part 162 and a third light-absorbing part 163 . The second light absorbing part 162 is connected to a side of the first blocking part 141 away from the first substrate 110 , and the third light absorbing part 163 is connected to a side of the second blocking part 142 away from the second substrate 120 . In this embodiment, the third light absorbing part 163 and the second light absorbing part 162 are separated from each other by the second optical material OM2.

Please refer to Figure 17. FIG. 17 is a schematic cross-sectional view of a micro-light emitting diode display 100 according to yet another embodiment of the present invention. In this embodiment, as shown in FIG. 17, the first blocking part 141 includes a light-absorbing material. Specifically, the first blocking part 141 can be integrally formed with the first light absorbing part 161 .

Please refer to Figure 18. FIG. 18 is a schematic cross-sectional view of a micro-light emitting diode display 100 according to another embodiment of the present invention. In this embodiment, the second blocking part 142 may include a light-absorbing material to form the fourth light-absorbing part 164 . As shown in FIG. 18 , the fourth light absorbing part 164 is connected to the second substrate 120 and surrounds the micro light emitting diode 150 . The fourth light absorbing part 164 and the micro light emitting diode 150 are separated from each other. Furthermore, the fourth light absorbing part 164 and the first blocking part 141 are separated from each other, and the second optical material OM2 is at least partially filled between the fourth light absorbing part 164 and the first blocking part 141, and between the fourth light absorbing part 164 and the first blocking part 141. Between 150 micro light emitting diodes.

To sum up, the technical solutions disclosed in the above embodiments of the present invention have at least the following advantages: since the micro-light emitting diode display is composed of an upper structure and a lower structure, the micro-light emitting diodes connected to the second substrate It is separated from the color transfer layer connected to the first substrate, that is, there is no direct contact between the micro light emitting diode and the color transfer layer. Therefore, when the micro light emitting diode needs to be replaced or repaired, the user only needs to By disassembling the upper structure and lower structure, the micro-light-emitting diodes can be replaced or repaired. The process does not involve the destruction or removal of the color transfer layer, so the production yield of micro-light-emitting diodes can be effectively improved, thereby further improving the production yield of micro-light-emitting diodes. The production cost of the micro-light emitting diode display can be reduced.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make various modifications and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention is The scope shall be determined by the appended patent application scope.

100:Micro light emitting diode display 110: First substrate 120: Second substrate 130,130R: color transfer layer 141:First blocking part 142:Second blocking part 150, 150B, 150G: micro light emitting diodes 161: First light absorption part 162: Second light absorption part 163: The third light absorption part 164: The fourth light absorption part 170,170B,170G,170R: Color filter layer 180:Patterned optical coating 180a: Bevel 190:frame 210:First base plate 220: Second base plate 500: Manufacturing method 510-540,511-515,521-524: Steps LS: lower structure OM1: The first optical material OM2: Second optical material SP:space US: upper structure WD: width θ: angle

FIG. 1 is a flow chart illustrating a method of manufacturing a micro-light emitting diode display according to an embodiment of the present invention. Figures 2 to 6 are schematic diagrams illustrating the manufacturing process of the structure shown in Figure 1 . Figures 7 to 10 are schematic diagrams illustrating the manufacturing process of the structure shown in Figure 1 . Figure 11 is a schematic diagram illustrating the connection between the upper structure of Figure 6 and the lower structure of Figure 10. Figure 12 shows the micro-light emitting diode display of Figure 11, in which the upper structure and the lower structure have been connected to each other, and the first bottom plate and the second bottom plate have been removed. Figures 13 to 18 are schematic cross-sectional views of micro-light emitting diode displays according to different embodiments of the present invention.

Domestic storage information (please note in order of storage institution, date and number) without Overseas storage information (please note in order of storage country, institution, date, and number) without

100:Micro light emitting diode display

110: First substrate

120: Second substrate

130: Color transfer layer

141:First blocking part

142:Second blocking part

150:Micro light emitting diode

161: First light absorption part

162: Second light absorption part

163: The third light absorption part

170: Color filter layer

180:Patterned optical coating

180a: Bevel

190:Frame

LS: lower structure

SP:space

US: upper structure

θ: angle

Claims (20)

A micro-luminescent diode display including: a first substrate; a second substrate; A color transfer layer is located between the first substrate and the second substrate, and the color transfer layer is connected to the first substrate; A first barrier portion is connected to the first substrate and surrounds and connected to the color transfer layer; and A micro-light emitting diode is located between the color transfer layer and the second substrate. The micro-light emitting diode is connected to the second substrate and separated from the color transfer layer. The micro-light emitting diode display as claimed in claim 1, wherein the first barrier portion has a width that tapers in a direction toward the first substrate. The micro-light emitting diode display as described in claim 1 further includes: A first light-absorbing part is connected between the first substrate and the first blocking part. The micro-light emitting diode display as described in claim 1 further includes: A second barrier part is connected to the second substrate and surrounds and connected to the micro-light emitting diode. The second barrier part and the first barrier part are separated from each other. The micro-light-emitting diode display of claim 4, wherein the second blocking portion is at least partially located between the micro-light-emitting diode and the second substrate. The micro-light emitting diode display as described in claim 4 further includes: A second light-absorbing part is connected to a side of the first blocking part away from the first substrate, and the second light-absorbing part and the second blocking part are separated from each other. The micro-light emitting diode display as described in claim 6 further includes: An optical material is at least partially filled between the second light-absorbing part and the second blocking part. The micro-light emitting diode display as described in claim 6 further includes: A third light-absorbing part is connected to a side of the second barrier part away from the second substrate, and the third light-absorbing part and the second light-absorbing part are separated from each other. The micro-light emitting diode display as described in claim 8 further includes: An optical material is at least partially filled between the third light-absorbing part and the second light-absorbing part. The micro-light emitting diode display as described in claim 4 further includes: A second light-absorbing part is connected between the first blocking part and the second blocking part. The micro-light emitting diode display as described in claim 1 further includes: a fourth light-absorbing part connected to the second substrate and surrounding the micro-luminescent diode, the fourth light-absorbing part and the first blocking part being separated from each other; and An optical material is at least partially filled between the fourth light-absorbing part and the first blocking part. The micro-light emitting diode display as claimed in claim 1, wherein the first blocking part includes a light-absorbing material. The micro-light emitting diode display as described in claim 1 further includes: A color filter layer is connected between the first substrate and the color transfer layer. The micro-light emitting diode display as described in claim 1 further includes: A patterned optical coating is at least partially connected between the microluminescent diode and the color transfer layer, and the patterned optical coating is wider than the microluminescent diode. The micro-light emitting diode display as claimed in claim 14, wherein the patterned optical coating has a bevel, the bevel is connected to and surrounds the micro-light emitting diode, and an angle is formed between the bevel and the color transfer layer, The range of this angle is between 30 degrees and 90 degrees. A method of manufacturing a micro-luminescent diode display, including: Create a structure, including: disposing a first substrate on a first base plate; A plurality of color filter layers and a first light-absorbing part are provided on the first substrate, and the first light-absorbing part is connected to surround each of the color filter layers; A first blocking part is provided on the first light-absorbing part. The cross-section of the first blocking part is at least partially inversely tapered. The first blocking part has a plurality of spaces, and these spaces are respectively connected to the corresponding color filter layers. ;as well as A color transfer layer is provided in at least one of the spaces, and the color transfer layer is connected to the first barrier part; Create the following structure, including: disposing a second substrate on a second base plate; A plurality of micro-light emitting diodes are provided on the second substrate; and A second barrier portion is provided on the second substrate, and the second barrier portion surrounds each of the micro-light emitting diodes; Flip the upper structure relative to the lower structure, so that the micro-light emitting diodes are aligned with the corresponding spaces, and the upper structure and the lower structure are connected to each other; and Remove the first base plate and the second base plate. The method as described in claim 16, wherein connecting the upper structure and the lower structure to each other includes: An optical material is connected between the upper structure and the lower structure, and the color transfer layer and the corresponding micro-light emitting diode are kept separated from each other. The method as described in claim 16, wherein connecting the upper structure and the lower structure to each other includes: A frame is connected between the upper structure and the lower structure, and keeps the color transfer layer and the corresponding micro-light emitting diode separated from each other. The method of claim 16, wherein manufacturing the following structure includes: A patterned optical coating is provided on each of the micro-light emitting diodes. The method of claim 16, wherein the second blocking part includes a light-absorbing material.

Images