TW202303867A - Electronic package and manufacturing method thereof - Google Patents

Abstract

An electronic package in which a first electronic component is embedded in a packaging layer, wherein the first electronic component has an active surface and a non-active surface opposite to the active surface, at least one groove is formed on the non-active surface and extends to a side surface of the encapsulation layer, so that the groove is exposed to the encapsulation layer as an air passage, and a metal layer is formed on the non-acting surface. Therefore, heat generated by the first electronic component during operation is introduced into the air passage by the groove.

Description

Electronic package and its manufacturing method

The invention relates to a semiconductor packaging process, especially an electronic package with a heat dissipation mechanism and its manufacturing method.

With the vigorous development of portable electronic products in recent years, the development of various related products is also moving towards the trend of high density, high performance, light, thin, short, and small. For this reason, the industry has developed various integrated multi-functional packages. In order to meet the requirements of light, thin, short and high density of electronic products. For example, wireless communication technology has been widely used in various consumer electronic products to receive or send various wireless signals. Among them, the planar antenna (Patch Antenna) is widely used because of its small size, light weight and easy manufacturing. It is used in wireless communication modules of electronic products such as cell phone and personal digital assistant (PDA).

FIG. 1 is a schematic cross-sectional view of a conventional electronic device 1 . The electronic device 1 comprises a circuit structure 10 combined with a plurality of solder balls 13, a plurality of semiconductor chips 11, 12 disposed on the circuit structure 10 and electrically connected to the circuit structure 10, a covering of these semiconductor chips 11, The encapsulation layer 16 of 12, and the antenna structure 17 arranged on the outer surface of the encapsulation layer 16, so that the antenna structure is combined on the encapsulation layer 16 through the dielectric layer 14, and the circuit structure 10 is formed by the solder balls 13 is installed on a circuit board (figure omitted).

However, in the conventional electronic device 1, the heat generated by the semiconductor chips 11, 12 during operation needs to pass through the encapsulation layer 16 to conduct heat to the external environment (or through the connection between the circuit structure 10 and the antenna structure 17). The dielectric layer 14 conducts to the external environment), so it is easy to accumulate heat and cannot meet the requirement of heat dissipation.

Therefore, how to overcome the problems of the above-mentioned conventional technologies has become an urgent problem to be solved at present.

In view of the various deficiencies of the above-mentioned conventional technologies, the present invention provides an electronic package, which includes: a packaging layer; a first electronic component embedded in the packaging layer, wherein the first electronic component has an opposite active surface and the non-active surface, and at least one groove is formed on the non-active surface, so that the groove extends and communicates with the side of the packaging layer, so that the groove is exposed to the packaging layer for use as an air channel; and the metal layer is It is arranged on the non-active surface of the first electronic component.

The present invention also provides a method for manufacturing an electronic package, which includes: covering a first electronic component with a packaging layer, so that the first electronic component is embedded in the packaging layer, wherein the first electronic component has an opposite active surface and the non-active surface, and at least one groove is formed on the non-active surface, so that the groove extends and communicates with the side of the encapsulation layer, so that the groove is exposed to the encapsulation layer for use as an air channel; and forming a metal layer on the The non-active surface of the first electronic component.

In the aforementioned electronic package and its manufacturing method, the metal layer is extended and arranged along the wall of the groove.

In the aforementioned electronic package and its manufacturing method, the active surface of the first electronic component is stacked with the second electronic component.

In the aforementioned electronic package and its manufacturing method, it further includes forming a plurality of conductive elements in the packaging layer, so that the plurality of conductive elements are exposed on the packaging layer. For example, complex includes the complex conductive elements connected to the circuit board so that the air channel is located between the circuit board and the non-active surface of the first electronic component.

In the aforementioned electronic package and its manufacturing method, part or all of the groove is provided with a heat conduction element.

In the aforementioned electronic package and its manufacturing method, at least one heat dissipation layer covering the groove is formed on the non-active surface.

It can be seen from the above that in the electronic package and its manufacturing method of the present invention, at least one groove is formed on the non-active surface of the first electronic component to directly guide the heat generated by the first electronic component. In the air channel, compared with the conventional technology, the heat generated by the first electronic component during operation can be conducted to the external environment without passing through the encapsulation layer, so that the problem of heat accumulation will not occur, so as to meet the requirements of heat dissipation. needs.

1: Electronic device

10: Line structure

11,12: Semiconductor wafer

13: solder ball

14: Dielectric layer

16,26: encapsulation layer

17,27: Antenna structure

2,3,4: Electronic Packages

20: Bearing structure

20a: First side

20b: Second side

200: line layer

21: The first electronic component

21a: Action surface

21b: Non-active surface

210: conductive bump

211: primer

212: electrode pad

22: Second electronic component

23: Conductive element

25: metal layer

250: Groove

26a: surface

26c: side

260: perforation

35: Heat conduction element

45: heat dissipation layer

8: Circuit board

S: air channel

FIG. 1 is a schematic cross-sectional view of a conventional electronic device.

2A to 2F are schematic cross-sectional views of the manufacturing method of the electronic package of the present invention.

FIG. 2E-1 is a schematic cross-sectional view corresponding to FIG. 2E.

3A and 3B are schematic cross-sectional views of other different embodiments corresponding to FIG. 2F .

The implementation of the present invention is described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this manual are only used to match the content disclosed in the manual, for the understanding and reading of those who are familiar with this technology, and are not used to limit The limit conditions for the implementation of the present invention are set, so it has no technical significance. Any modification of the structure, change of the proportional relationship or adjustment of the size shall not affect the effect and the purpose of the present invention. Still fall within the scope covered by the technical content disclosed in the present invention. At the same time, terms such as "above", "first", "second" and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of the present invention. The change or adjustment of the relative relationship shall also be regarded as the applicable scope of the present invention if there is no substantial change in the technical content.

2A to 2F are schematic cross-sectional views of the manufacturing method of the electronic package 2 of the present invention.

As shown in FIG. 2A , a packaging module is provided, which includes a carrying structure 20 , a second electronic component 22 embedded in the carrying structure 20 , and an antenna structure 27 disposed on the carrying structure 20 .

The carrying structure 20 is, for example, a packaging substrate (substrate) with a core layer and a circuit structure or a circuit structure without a core layer (coreless), which forms a plurality of circuit layers 200 on an insulating material, such as fan out (fan out) ) type redistribution layer (redistribution layer, referred to as RDL).

In this embodiment, the carrying structure 20 has opposite first side 20a and second side 20b, and the material forming the circuit layer 200 is copper, and the insulating material is such as polybenzoxazole (Polybenzoxazole, Dielectric materials such as PBO for short), Polyimide (PI for short), Prepreg (PP for short), or solder resist materials such as green paint and ink.

The second electronic component 22 is an active component, a passive component or a combination thereof, wherein the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor.

In this embodiment, the second electronic component 22 is a semiconductor chip, which can be electrically connected to the circuit layer 200 by flip chip method, wire bonding method, direct contact with the circuit layer 200 or other appropriate methods, and there is no special limitation .

The antenna structure 27 is combined on the second side 20b of the carrying structure 20 .

In this embodiment, the light and thin antenna structure 27 is fabricated by sputtering, vaporizing, electroplating, electroless plating, electroless plating or foiling. For example, the manufacturing process of the antenna structure 27 can first form a patterned groove on the carrier structure 20, and then form a conductive material in the groove as the antenna structure 27; or, the manufacturing process of the antenna structure 27 can also be directly in the A patterned conductive material (without forming grooves) is formed on the carrying structure 20 to serve as the antenna structure 27 .

As shown in FIG. 2B , a first electronic component 21 is disposed on the first side 20 a of the carrying structure 20 , and the first electronic component 21 is electrically connected to the circuit layer 200 .

In this embodiment, the first electronic component 21 is an active component, a passive component or a combination thereof, wherein the active component is such as a semiconductor chip, and the passive component is such as a resistor, capacitor and inductor. For example, the first electronic component 21 has opposite active surfaces 21a and non-active surfaces 21b, and the electrode pads 212 of the active surface 21a of the first electronic component 21 can be covered by a plurality of conductive bumps 210 such as solder materials. set on the circuit layer 200 and electrically connect the circuit layer 200, and then cover the conductive bumps 210 with primer 211; or, the electrode pad 212 of the first electronic component 21 can be connected by a plurality of bonding wire (Illustrated) The circuit layer 200 is electrically connected by wire bonding; or, the electrode pad 212 of the first electronic component 21 can be directly electrically connected to the circuit layer 200 . However, the manner in which the first electronic component 21 is electrically connected to the carrying structure 20 is not limited to the above.

As shown in FIG. 2C , an encapsulation layer 26 is formed on the first side 20 a of the carrying structure 20 to cover the first electronic component 21 . Next, a plurality of through holes 260 are formed in the encapsulation layer 26 , so that part of the surface of the circuit layer 200 is exposed through the through holes 260 .

In this embodiment, the encapsulation layer 26 is an insulating material, such as polyimide (PI for short), dry film (dry film), encapsulation colloid or encapsulation material (molding compound) such as epoxy resin (epoxy). ), but not limited to the above.

Furthermore, the surface 26a of the encapsulation layer 26 can be flushed with the non-active surface 21b of the first electronic component 21 through a leveling process, so that the inactive surface 21b of the first electronic component 21 is exposed to the encapsulation layer Surface 26a of 26. For example, the leveling process removes part of the material of the first electronic component 21 and part of the material of the encapsulation layer 26 by grinding.

As shown in FIG. 2D , conductive elements 23 are formed in the through holes 260 so that the conductive elements 23 are electrically connected to the circuit layer 200 .

In this embodiment, the conductive element 23 is a spherical shape such as a solder ball, or a columnar shape of metal materials such as copper pillars and solder bumps, or a stud conductor made by a wire bonding machine, but Not limited to this. For example, the conductive element 23 protrudes from the surface 26 a of the encapsulation layer 26 , so that the plurality of conductive elements 23 are exposed on the surface 26 a of the encapsulation layer 26 .

As shown in Figure 2E, at least one groove 250 is formed on the non-active surface 21b of the first electronic component 21, and a metal layer 25 is formed on the non-active surface 21b, and the metal layer 25 is along the wall surface of the groove 250 Extending the layout, the air channel S is formed on the non-active surface 21b of the first electronic component 21, and then the electronic package 2 of the present invention is formed.

In this embodiment, part of the material of the non-active surface 21b of the first electronic component 21 and the encapsulation layer 26 is removed together by etching, as shown in the cross-sectional schematic diagram of FIG. 2E-1, to form multiple connections. The grooves 250 on opposite sides 26c of the packaging layer 26 make the air channel S available for heat dissipation. It should be noted that the metal layer 25 will not fill up the groove 250 .

Moreover, the metal layer 25 is formed on the non-active surface 21 b of the electronic component 21 and the wall surface of the groove 250 by electroplating, sputtering or other coating methods.

In the subsequent process, as shown in FIG. 2F , the electronic package 2 is connected to a circuit board 8 with the conductive elements 23 , and the metal layer 25 is made to contact the circuit board 8 .

Therefore, in the manufacturing method of the present invention, at least one groove 250 is formed on the non-active surface 21b of the first electronic component 21 to directly guide the heat generated by the first electronic component 21 into the air formed by the groove 250. channel S, so when the electronic package 2 is connected to the circuit board 8, the heat generated by the first electronic component 21 during operation does not need to pass through the package layer 26, and the heat can pass through the air channel S Conduction To the external environment (in other words, the air channel S can be used to dissipate heat between the first electronic component 21 and the circuit board 8), so there will be no heat accumulation problem, so as to meet the heat dissipation requirements and greatly improve the heat dissipation performance .

Furthermore, as shown in FIG. 3A , in the electronic package 3 according to another embodiment of the present invention, at least one heat-conducting element 35 such as a copper column can be formed in part or all of the groove 250, and the heat-conducting element 35 is in contact with the The metal layer 25 is still formed with the air channel S, so that when the electronic package 3 is connected to the circuit board 8, the heat conduction element 35 contacts the circuit board 8 to facilitate heat dissipation. Further, as shown in FIG. 3B , in the electronic package 4 of another embodiment of the present invention, a heat dissipation layer 45 can be formed on the metal layer 25 on the non-active surface 21b of the first electronic component 21 and the heat conduction element 35, so as to Make the heat dissipation layer 45 cover the groove 250, but still form the air channel S, so that when the electronic package 4 is connected to the circuit board 8, the heat dissipation layer 45 contacts the circuit board 8 to facilitate heat dissipation .

The present invention also provides an electronic package 2 , 3 , 4 , which includes: a package layer 26 , a first electronic component 21 and a metal layer 25 .

The first electronic component 21 is embedded in the encapsulation layer 26, wherein the first electronic component 21 has an opposite active surface 21a and a non-active surface 21b, and at least one groove is formed on the non-active surface 21b 250, so that the groove 250 extends and communicates with the side surface 26c of the encapsulation layer 26, so that the groove 250 is exposed to the encapsulation layer 26 for use as an air channel S.

The metal layer 25 is disposed on the non-active surface 21b of the first electronic component 21 .

In one embodiment, the metal layer 25 is extended along the wall of the groove 250 .

In one embodiment, the second electronic component 22 is stacked on the active surface 21 a of the first electronic component 21 .

In one embodiment, the electronic packages 2 , 3 , and 4 include a plurality of conductive elements 23 embedded in the encapsulation layer 26 , and the plurality of conductive elements 23 are exposed on the encapsulation layer 26 . For example, the plurality of conductive elements 23 are connected to the circuit board 8 so that the air passage S is located between the circuit board 8 and the non-active surface 21 b of the first electronic element 21 .

In one embodiment, part or all of the groove 250 is provided with a plurality of heat conducting elements 35 .

In one embodiment, at least one heat dissipation layer 45 covering the groove 250 is formed on the non-active surface 21b.

In summary, the electronic package and its manufacturing method of the present invention are designed with grooves formed on the non-active surface of the first electronic component to directly guide the heat generated by the first electronic component into the air Therefore, the heat generated by the first electronic component during operation can be conducted to the external environment without passing through the encapsulation layer, so that the problem of heat accumulation will not occur, so as to meet the requirement of heat dissipation.

The above-mentioned embodiments are used to illustrate the principles and effects of the present invention, but not to limit the present invention. Any person skilled in the art can modify the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of the patent application described later.

2: Electronic package

21: The first electronic component

21b: Non-active surface

23: Conductive element

25: metal layer

250: Groove

26: encapsulation layer

8: Circuit board

S: air channel

Claims (14)

An electronic package, comprising: encapsulation layer; The first electronic component is embedded in the encapsulation layer, wherein the first electronic component has an opposite active surface and a non-active surface, and at least one groove is formed on the non-active surface so that the groove extends and communicates the side surface of the encapsulation layer, so that the groove is exposed to the encapsulation layer for use as an air channel; and The metal layer is arranged on the non-active surface of the first electronic component. The electronic package as claimed in claim 1, wherein the metal layer is extended along the wall of the groove. The electronic package as claimed in claim 1, wherein the active surface of the first electronic component is stacked with the second electronic component. The electronic package according to claim 1 further includes a plurality of conductive elements embedded in the packaging layer, and the plurality of conductive elements are exposed on the packaging layer. The electronic package as claimed in claim 4, wherein the plurality of conductive elements are connected to a circuit board so that the air channel is located between the circuit board and the non-active surface of the first electronic element. The electronic package according to claim 1, wherein part or all of the groove is provided with a heat conduction element. The electronic package as claimed in claim 1, wherein at least one heat dissipation layer covering the groove is formed on the non-active surface. A method for manufacturing an electronic package, comprising: Covering the first electronic component with an encapsulation layer, so that the first electronic component is embedded in the encapsulation layer, wherein the first electronic component has an opposite active surface and a non-active surface, and at least one is formed on the non-active surface. a groove, so that the groove extends and communicates with the side of the encapsulation layer, so that the groove is exposed to the encapsulation layer for use as an air channel; and A metal layer is formed on the non-active surface of the first electronic component. The method for manufacturing an electronic package according to claim 8, wherein the metal layer is extended along the wall of the groove. The method for manufacturing an electronic package according to claim 8, wherein the second electronic component is stacked on the active surface of the first electronic component. The method for manufacturing an electronic package as claimed in claim 8 further includes forming a plurality of conductive elements in the encapsulation layer, and exposing the plurality of conductive elements to the encapsulation layer. The method for manufacturing an electronic package as claimed in claim 11 further includes placing the plurality of conductive elements on a circuit board so that the air channel is located between the circuit board and the non-active surface of the first electronic component. The method for manufacturing an electronic package according to Claim 8, wherein a part or all of the groove is provided with a heat conduction element. The method for manufacturing an electronic package according to claim 8 further includes forming at least one heat dissipation layer covering the groove on the non-active surface.

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