TW202303665A - Charged particle beam writing apparatus and charged particle beam writing method - Google Patents

Abstract

According to one embodiment, a charged particle beam writing apparatus includes, a writing mechanism, a writing control circuit, a deflection operation control circuit configured to generate control data for controlling the blanking of each of the charged particle beams based on the shot data, a storage, a blanking control circuit configured to control the blanking based on the control data, and a detector. The writing control circuit is configured to, when the detector detects the abnormality during the writing, interrupt the writing, and generate interrupt position information at a position where the writing is interrupted based on the shot data which has been stored at the storage and is related to the control data that has not been used for controlling the blanking.

Description

Charged particle beam drawing device and charged particle beam drawing method

This application enjoys the priority of the basic application based on Japanese Patent Application No. 2021-064193 (filing date: April 5, 2021). This application includes the entire content of the basic application by referring to this basic application.

The invention relates to a charged particle beam drawing device and a charged particle beam drawing method.

In the manufacturing process of semiconductor devices, using a reduced projection exposure device (called "stepper (stepper)" or "scanner (scanner)"), the original picture pattern formed on the mask (hereinafter also expressed as " pattern") onto a semiconductor substrate (also referred to as a "wafer"). For example, the mask is produced by a charged particle beam drawing device using a charged particle beam such as an electron beam.

For example, an electron beam drawing device, which is one of charged particle beam drawing devices, includes an electron gun as an emitting unit that emits electron beams. A relatively high voltage of several tens of kV or more is applied between the cathode and the anode of the electron gun in order to accelerate the thermal electrons emitted from the cathode. The accelerated thermal electrons are emitted from the electron gun as electron beams.

The electron beam emitted from the electron gun is imaged on the mask through an electron optical system including a plurality of holes, deflectors, and lenses, so as to draw a desired pattern on the mask.

One of the electron beam drawing devices is a multi-beam drawing device. The multi-beam drawing device performs exposure per pixel of a pattern drawn using a plurality of electron beams. In a multi-beam drawing device using a blanked aperture array, for example, an electron beam emitted from one electron gun passes through a blanked aperture array having a plurality of openings, thereby forming a multi-beam. Multiple beams are blanked controlled by respective blankers (electrode pairs) corresponding to the electron beams.

In such a multi-beam drawing device, when drawing a pattern on a mask, for example, multiple drawing in which one pixel is irradiated with an electron beam multiple times may be used. By multiple drawing, the error of the positional accuracy of the pattern and the error of the connection accuracy of the pattern generated at the boundary of the electron beam deflection area are reduced by the averaging effect.

In the electron beam drawing apparatus, if the electromagnetic field fluctuates due to earthquakes or abnormal discharges during drawing operations, drawing abnormalities may occur, and pattern formation defects may occur. Therefore, when an electromagnetic field fluctuation occurs, drawing needs to be stopped quickly to suppress mask scrapping as much as possible.

In Japanese Patent Application Laid-Open No. 2013-38397, which is the Japanese Patent Application Laid-Open Publication, an electron beam drawing device and an electron beam drawing method are disclosed, which, when seismic information is received, draw sub-regions during drawing After completion, the drawing is temporarily stopped, and when it is judged that it can be restarted, the drawing is restarted.

If the multiplicity of multiple drawing by the multi-beam drawing device is increased, even if an electromagnetic field anomaly occurs once during multiple electron beam irradiations, the mask does not need to be scrapped as long as the influence on the pattern is small. Therefore, by rapidly suspending drawing after detecting an electromagnetic field abnormality, the number of shots performed in an electromagnetic field abnormal state can be suppressed. In addition, by resuming drawing from the interrupted position, the occurrence of mask scrapping can be reduced.

The present embodiment provides a charged particle beam drawing device and a charged particle beam drawing method capable of suppressing mask scrapping.

According to an aspect of the present invention, the charged particle beam drawing device includes: a drawing mechanism for irradiating a plurality of charged particle beams to an object while blanking each to draw a pattern; and a drawing control unit for The drawing mechanism is controlled; the deflection calculation control circuit generates control data based on the shooting data transmitted from the drawing control part, and the control data is used to perform blanking control on a plurality of charged particle beams respectively; the storage part saves the shooting data, Until the drawing based on the shooting data is completed; the blanking control circuit controls the blanking based on the control data transmitted by the self-deflection calculation control circuit; and the detector detects abnormalities. When the detector detects an abnormality during the drawing process, the deflection calculation control circuit interrupts the transmission of the control data to the blanking control circuit to interrupt the drawing, and saves the control data stored in the storage unit and not sent to the blanking control circuit. The relevant shooting data is sent to the drawing control department. The drawing control unit generates interruption position information of a position where drawing is interrupted based on the shooting data transmitted from the deflection calculation control circuit.

According to an aspect of the present invention, the charged particle beam drawing method is a drawing method of drawing a pattern by irradiating a plurality of charged particle beams while blanking each, and includes: generating shot data based on the pattern; generating control data based on the shot data, The control data is used to blank a plurality of charged particle beams respectively; save the shot data for which the control data is generated until the drawing based on the shot data is completed; When an abnormality is detected during the drawing process, the drawing is interrupted, and based on the saved shot data related to the control data not used for blanking control, interrupt position information of the position where the drawing has been interrupted is generated.

Hereinafter, embodiments will be described with reference to the drawings. The embodiment exemplifies a device or a method for realizing the technical idea of the invention. The drawings are schematic or conceptual, and the dimensions and ratios of the drawings may not be the same as those in reality. The technical idea of the present invention is not particularly specified by the shape, structure, arrangement, etc. of the constituent elements.

1. First Embodiment The charged particle beam drawing device according to the first embodiment will be described. Hereinafter, as the charged particle beam drawing device according to the present embodiment, an electron beam drawing device which irradiates multiple beams will be taken as an example and described. In addition, the charged particle beam is not limited to the electron beam. Additionally, the charged particle beam may be a single beam.

1.1 Structure First, the overall configuration of the electron beam drawing apparatus 1 will be described using FIG. 1 . FIG. 1 is a conceptual diagram showing an example of the overall configuration of an electron beam drawing apparatus 1 . In addition, although some connections between blocks are shown in the example of FIG. 1, the connection between blocks is not limited to these connections.

As shown in FIG. 1 , the electron beam drawing device 1 includes a drawing mechanism 10 and a control mechanism 20 .

The drawing mechanism 10 includes a drawing chamber 101 and a lens barrel 102 .

A stage 104 on which a sample 103 is placed is provided in the drawing chamber 101 . The sample 103 includes, for example, a mask (mask blank, reticle, etc.) or a semiconductor substrate. The stage 104 is movable in the X direction parallel to the surface of the stage 104 (sample 103 ), and in the Y direction parallel to the surface of the stage 104 and intersecting the X direction.

The stage drive mechanism 105 has a drive mechanism for moving the stage 104 on the XY plane including the X direction and the Y direction. Moreover, the platform driving mechanism 105 may also have a mechanism that makes the platform 104 rotate around the rotation axis on the XY plane with the Z direction perpendicular to the surface (XY plane) of the platform 104 as the rotation axis, or may have a mechanism that makes the platform 104 move along the XY plane. A mechanism that moves in the Z direction.

Platform position detector 408 includes a laser length measurement system. The laser length measurement system irradiates laser light to the reflector 107 provided on the platform 104 and receives the laser reflected by the reflector 107 . The laser length measuring system measures the position of the platform 104 in the X direction and the Y direction according to the received laser information.

A Faraday cup (Faraday cup) 106 is installed on the platform 104 and is used for monitoring the electron beam or for avoiding a beam described later.

The mirror 107 is disposed on the platform 104 and used for position detection of the platform 104 .

The lens barrel 102 is installed on the drawing chamber 101 . For example, the lens barrel 102 has a cylindrical shape extending in the Z direction. The surfaces where the drawing chamber 101 and the lens barrel 102 are in contact with each other are open. The space formed by the drawing chamber 101 and the lens barrel 102 is maintained in a vacuum (decompression) state. For example, the lens barrel 102 is made of a conductive material such as stainless steel, and is grounded to a ground potential.

An electron gun (charged particle gun) 111, an illumination lens 112, a shaped aperture array substrate 113, a blanking aperture array mechanism 114, a reducing lens 115, a limiting aperture substrate 116, an objective lens 117, Batch blankers 118 and deflectors 119 . In addition, the structure of the electron optical system is not limited to this structure.

The electron gun 111 is provided to emit an electron beam B toward the drawing chamber 101 .

The illumination lens 112 causes the electron beam B to illuminate the entire aperture shaped array substrate 113 by making the trajectory of the electron beam B emitted from the electron gun 111 substantially perpendicular to the aperture shaped array substrate 113 (Z direction). Furthermore, as the illumination lens 112, for example, an electromagnetic lens can be used.

The shaped aperture array substrate 113 has a plurality of openings. The electron beam B passing through the opening is shaped into a multi-beam MB.

An example of a plan view of the shaped aperture array substrate 113 is shown in FIG. 2 . As shown in FIG. 2 , a plurality of openings 130 arranged in a matrix along the X direction and the Y direction are provided in the shaped aperture array substrate 113 . In the example of FIG. 2 , the coordinates of the openings 130 (hereinafter referred to as “hole coordinates”) are expressed as (x, y)=(1,1)˜(512,512) from the lower left on the paper to the upper right on the paper. In addition, the number of openings 130 is arbitrary. In addition, the shape of the opening 130 is not limited. For example, the shape of the opening 130 may be rectangular or circular. In addition, the arrangement of the openings 130 can be designed arbitrarily. For example, the openings 130 may be arranged in a staggered manner.

The blanking aperture array mechanism 114 has a mechanism for independently performing blanking control on the electron beams (multi-beam MB) passing through the openings 130 of the shaped aperture array substrate 113 . The blanking aperture array mechanism 114 includes a plurality of blankers (pairs of electrodes) respectively corresponding to the plurality of openings 130 of the shaped aperture array substrate 113 . For example, one of the electrodes of the blanker is fixed at ground potential. The other electrode of the blanker is switched between ground potential and other potentials. By switching the potential, the electron beam passing through the blanker is deflection controlled. The electron beams deflected by the blanking aperture array mechanism 114 are shielded by an aperture limiting substrate 116 described later, and do not reach the sample 103 (off state). On the other hand, the electron beams not deflected by the blanking aperture array mechanism 114 reach the sample 103 (on state).

The reduction lens 115 reduces the multi-beam MB toward an opening provided in the center of the aperture-limiting substrate 116 . Furthermore, as the reducing lens 115, for example, an electromagnetic lens can be used.

The batch blanker 118 deflects the beams passing through the blanking aperture array mechanism 114 in batches.

The aperture limiting substrate 116 shields the multi-beams MB deflected in batches by the batch blanker 118 and the electron beams deflected by the blanking control of the blanking aperture array mechanism 114 among the multi-beam MBs.

The objective lens 117 adjusts the focus of the multi-beam MB passing through the aperture-limited substrate 116 . The focus-adjusted multi-beam MB forms a pattern image with a preset reduction ratio on the sample 103 . Furthermore, as the objective lens 117, for example, an electromagnetic lens can be used.

The deflector 119 deflects so that the multi-beam MB is irradiated to a desired position of the stage 104 (sample 103 ), so that the sample 103 is drawn by the multi-beam MB.

FIG. 3 is a conceptual diagram showing an example of the drawing sequence on the surface of the sample 103 . As shown in FIG. 3 , the drawing area 500 of the sample 103 is virtually divided, for example, along the Y direction into a plurality of elongated striped areas 501 to 508 with preset widths. In the example of FIG. 3 , it is divided into eight stripe regions 501 to 508 , but the number of stripe regions to be divided can be set arbitrarily. Furthermore, the stage driving mechanism 105 moves the stage 104 so that the eight divided stripe regions 501 to 508 are drawn continuously. More specifically, for example, first, in the stripe region 501 , the stage driving mechanism 105 moves the irradiation region 510 that can be irradiated by one shot along the X direction from the left side to the right side of the paper. That is, the stage drive mechanism 105 moves the stage 104 in the X direction from the right side toward the left side of the drawing. After the drawing of the stripe region 501 is completed, in the stripe region 502 , the stage driving mechanism 105 moves the irradiation region 510 in a direction opposite to that of the stripe region 501 . Next, in the stripe region 503 , the stage driving mechanism 105 moves the irradiation region 510 in a direction opposite to that of the stripe region 502 . In the other stripe regions 504 to 508 , drawing is also performed while alternately changing the moving direction of the irradiation region 510 . For example, when the drawing is interrupted before the drawing of the stripe region 503 is completed, the drawing is stopped in the stripe region 503 .

In addition, a plurality of discharge detectors 120 are provided as detectors in the lens barrel 102 . The discharge detector 120 detects abnormal discharge generated in the electron gun 111 and the electron optical system. For example, the discharge detector 120 includes an antenna electrode provided inside the lens barrel 102 . For example, the discharge detector 120 detects a current generated by electrification of the antenna electrodes.

In addition, the detector is not limited to the discharge detector, and the magnetic field sensor 402 which detects a magnetic field fluctuation including an earthquake described later, or a person who detects other abnormalities requiring interrupt processing can be applied. The installation location is not limited to the lens barrel 102, and may also be installed outside the device.

The control mechanism 20 includes a software part 30 controlled by software (a program or firmware executed by a computer including a circuit), and a hardware part 40 controlled by hardware (ie, a dedicated circuit). Software, for example, implements its functions by executing firmware through a processor (central processing unit (CPU)) included in a computer.

Drawing data (layout data) input from outside is stored in the drawing data storage unit 301 . The drawing data storage unit 301 can use, for example, a storage medium such as a hard disk drive (Hard Disk Drive, HDD) or a solid state drive (Solid State Drive, SSD).

The shot data generation unit 302 generates shot data corresponding to each shot and control data of the batch blanker 118 based on the drawing data stored in the drawing data storage unit 301 . The shot data generating unit 302 may also be disposed outside the device.

In the shot data, for example, as control data of the blanking aperture array mechanism 114, irradiation conditions in each shot of the multi-beam MB (ON/OFF and The irradiation time of the electron beam), and the drawing position and other information. In addition, the shot data generation unit 302 assigns a shot ID to the shot data so that each shot can be identified.

FIG. 4 is an example of a table showing shot data. The example in FIG. 4 shows a case in which shot IDs with preset arbitrary numbers (for example, 00000 to 99999) are sequentially and repeatedly assigned in accordance with the order of shots (hereinafter, expressed as “circular type”). The number of circular shot IDs can be set according to the number of shots that can be stored in the shot data storage unit 406, for example. In the case of a cyclic shot ID, it is possible to suppress an increase in the amount of data (number of bits) of the shot ID in each shot. The number of cyclic shot IDs may be a stripe area unit, or an area unit narrower than the stripe area. Furthermore, different shot IDs may be assigned to all shots. Furthermore, it is not necessary to assign shot IDs to all shots. For example, it is only necessary to specify the drawing position of unprocessed data (control data not used for blanking control because drawing has not been completed) in the hardware unit 40 .

As shown in FIG. 4, each row of the table corresponds to the information of a shot. The indication of "on" or "off" at each point on the hole coordinates shows the on/off control of the corresponding electron beam. In the shot data, information on the irradiation time is also provided to define the irradiation time of the beam in the on state. Furthermore, the information of only the irradiation time can also be set by setting the irradiation time as 0=off, and the irradiation time>0=on.

The drawing control unit 303 controls the electron beam drawing device 1 . The rendering control unit 303 has an interrupt position information storage unit 304 .

The rendering control unit 303 holds the generated shot data. The drawing control unit 303 acquires the position data of the platform 104 from the platform position detector 408 and controls the platform driving mechanism 105 .

The interrupt location information storage unit 304 stores the interrupt location information. The interrupt location information storage unit 304 can use random access memory (Random Access Memory, RAM), for example. Furthermore, the interrupt position information storage unit 304 may also be disposed outside the rendering control unit 303 .

The drawing control unit 303 may have a display unit for displaying abnormality detection results, or an output unit for outputting interruption position coordinates saved as a log.

The drawing control unit 303 controls the high voltage power supply 401 , the magnetic field sensor 402 , the discharge detection control circuit 403 , the blanking control circuit 404 , the deflection calculation control circuit 405 and the platform position detector 408 included in the hardware unit 40 .

The high-voltage power supply 401 applies a high voltage for causing the electron gun 111 to emit electron beams B to the electron gun 111 . For example, when the voltage applied to the electron gun 111 deviates from a preset standard due to abnormal discharge, the high-voltage power supply 401 sends an alarm signal AL1 to notify the abnormality detection to the deflection calculation control circuit 405 .

The magnetic field sensor 402 detects changes in the magnetic field caused by earthquakes or currents flowing in various circuits in the electron beam mapping device 1 . Furthermore, the magnetic field sensor 402 transmits an alarm signal AL2 for notifying the abnormality detection to the deflection calculation control circuit 405, for example, when the measurement result of the magnetic field deviates from a preset range.

The discharge detection control circuit 403 transmits to the deflection calculation control circuit 405 an alarm signal AL3 notifying that the discharge detector 120 has detected abnormal discharge.

The blanking control circuit 404 controls the blanking aperture array mechanism 114 and the batch blanker 118 . The blanking control circuit 404 receives control data from the deflection calculation control circuit 405 . The blanking control circuit 404 may also include, for example, a shift register, etc., so as to be able to maintain the control data of multiple shots. The blanking control circuit 404 performs on/off control of each electron beam in the multi-beam MB. That is, the blanking control circuit 404 controls the voltage to be applied to each blanker of the blanking aperture array mechanism 114 . Furthermore, the blanking control circuit 404 controls the on/off of the electron beam and the irradiation time of the electron beam in each blanker.

The deflection calculation control circuit 405 includes a shooting data storage unit 406 and a deflection calculation output unit 407 . The shot data storage unit 406 stores the shot data transmitted from the rendering control unit 303 .

The deflection calculation control circuit 405 is a deflection calculation control unit that calculates the deflection data of the multi-beam MB based on the position data in order to deflect the multi-beam MB to follow the movement of the stage 104 and irradiate to a desired position. The deflection calculation control circuit 405 controls, for example, the deflector 119 based on the deflection amount data. In addition, the deflection calculation control circuit 405 transmits control data to the blanking control circuit 404 so that the blanking control follows the movement of the platform 104 .

1.2 Operation of Electron Beam Drawing Device Next, the operation of the electron beam drawing apparatus 1 of this embodiment will be described. In the present embodiment, the electron beam drawing device 1 selects any one of three operation modes based on the drawing level for each sample drawn in advance. Furthermore, when an abnormality is detected during drawing, the electron beam drawing apparatus 1 interrupts drawing, and then executes the selected operation mode. For example, any one of the standby mode, the diagnosis mode, and the suspension mode is selected as the operation mode.

The standby mode is a mode in which the electron beam drawing apparatus 1 is brought into a standby state after the drawing is interrupted and before the abnormality subsides, and drawing is restarted after the abnormality subsides. For example, in the standby mode, the electron beam drawing apparatus 1 is brought into the standby state for a preset period. For example, when the abnormality is not resolved within this period and the timeout occurs, drawing is terminated.

The diagnosis mode is a mode in which failure diagnosis is performed after the drawing is interrupted, and drawing is restarted when it is determined that the electron beam drawing apparatus 1 is normal. For example, in the case of the diagnosis mode, if the result of the fault diagnosis is that a fault is found, drawing is stopped.

The stop mode is a mode for stopping drawing when an abnormality is detected during drawing.

1.2.1 Action flow First, the flow of the operation will be described using the flowchart showing an example of the drawing operation shown in FIG. 5 .

As shown in FIG. 5 , first, an operation mode after detection of an abnormality such as abnormal discharge is set (step S1 ).

After setting the operation mode, the drawing control unit 303 executes drawing (step S2 ). That is, the sample 103 is irradiated with the multi-beam MB to draw a pattern.

When no abnormality is detected during the drawing (step S3_No (No)), drawing ends after drawing a desired pattern on the sample 103 .

When abnormality is detected during drawing (step S3_Yes (Yes)), drawing is interrupted (step S4). Then, drawing is restarted/stopped according to the set operation mode (step S5 to step S9 ).

1.2.2 Operation when standby mode is set Next, the rendering operation when the standby mode is set will be described using FIG. 6 . FIG. 6 is a flowchart showing an example of a drawing operation when a standby mode is set. In the following description, the operation related to transmission and reception of shot data will be mainly described. In addition, in the example of FIG. 6, the operation|movement after the operation mode demonstrated in FIG. 5 is set is shown.

As shown in FIG. 6 , first, in the drawing process, the shot data generation unit 302 generates shot data based on the drawing data transmitted from the drawing data storage unit 301 (step S10 ). At this time, the shot ID associated with the drawing position is assigned to the shot data. The shot data generation unit 302 sends the shot data to the drawing control unit 303 .

The drawing control unit 303 sends the shooting data to the deflection calculation control circuit 405 (step S11 ). The deflection calculation control circuit 405 stores the transmitted shooting data in the shooting data storage unit 406 . Saved shot data is retained until data processing is complete, ie rendering is complete.

Next, the deflection calculation control circuit 405 generates control data for sequentially turning on/off blanking as drawing progresses based on the shot data stored in the shot data storage unit 406 (step S12 ). Then, the deflection calculation control circuit 405 sends the control data to the blanking control circuit 404 (step S13 ). Furthermore, the control data does not include information that can specifically designate the drawing position.

The blanking control circuit 404 controls the blanking aperture array mechanism 114 based on the control data. The blanking-controlled multi-beam MB in the blanking aperture array mechanism 114 is irradiated to the sample 103 (step S14 ).

In the drawing step, when no abnormality is detected (step S15_No), the drawing operation ends after drawing a desired pattern on the sample 103 .

When an abnormality is detected during the drawing process (step S15_Yes), the deflection calculation control circuit 405 receives at least one of the alarm signals AL1 -alarm signal AL3 notifying the occurrence of the abnormality.

If at least one of the alarm signals AL1 to AL3 is received, the deflection calculation output unit 407 of the deflection calculation control circuit 405 interrupts the transmission of control data to the blanking control circuit 404 (step S16 ). The blanking control circuit 404 forcibly turns on the blanking, deflects the multi-beam MB in batches to make the beams off, or controls the platform drive mechanism 105 to move the platform 104 to avoid the sample 103 (step S17) . At this time, the platform driving mechanism 105 can also move the platform 104 to irradiate the multi-beam MB to the Faraday cup 106 .

In addition, the deflection calculation control circuit 405 transmits unprocessed shot data to the rendering control unit 303 (step S18 ). More specifically, for example, the deflection calculation control circuit 405 generates the shot data of the control data that will be transmitted next unless the drawing is interrupted, among the shot data that has generated the control data that is not transmitted to the blanking control circuit 404. The shot ID is sent to the rendering control unit 303 . Furthermore, the deflection calculation control circuit 405 can also send the information about the abnormality detection to the drawing control unit 303 . In this case, the rendering control unit 303 can display the result.

The drawing control unit 303 generates drawing interruption position information (drawing position) based on the shot ID of the transmitted unprocessed shot data (step S19 ). Then, the rendering control unit 303 stores the generated interrupt position information in the interrupt position information storage unit 304 .

After suspending the drawing process, the drawing control unit 303 outputs the drawing position at which drawing was interrupted as a log to the outside (step S20 ). Furthermore, when the rendering control unit 303 includes a display unit, the log may be displayed on the display unit.

Whether the abnormal discharge subsides is determined by not receiving the alarm signals AL1 - AL3 within a preset time (standby time) (step S21 ).

For example, when the abnormal state continues and the abnormality has not subsided within a preset time (step S21_No), the drawing control unit 303 stops drawing (step S22 ). For example, the drawing control unit 303 can output information about suspension of drawing to the outside.

When the abnormality subsides within a preset time (step S21_YES), or when no abnormality is detected, the deflection calculation control circuit 405 transmits information notifying that the abnormality has subsided to the drawing control unit 303 . At this point, regenerate the shot profile as necessary. The drawing control unit 303 controls the stage drive mechanism 105 based on the interruption position information, so that the stage 104 moves to the interruption position (step S23 ). The drawing control unit 303 returns to step S11, restarts the transmission of the shot data to the deflection calculation control circuit 405, and starts drawing again.

1.2.3 Drawing operation when diagnosis mode is set Next, the rendering operation at the time of diagnosis mode setting will be described using FIG. 7 . FIG. 7 is a flowchart showing an example of a rendering operation when a diagnosis mode is set. In the following description, the point which differs from FIG. 6 is centered and demonstrated.

As shown in FIG. 7 , the drawing step and the interruption step (step S10 to step S20 ) are the same as those in FIG. 6 .

When the abnormality subsides, the drawing control unit 303 performs failure diagnosis (step S30 ).

The method of fault diagnosis can be appropriately selected. For example, the hardware unit 40 may include a self-diagnosis circuit (not shown) for performing failure diagnosis of the electron beam drawing apparatus 1 . After the abnormality subsides, the self-diagnosis circuit, for example, temporarily deletes the data stored in the hardware part 40 and resets it, so as to perform fault diagnosis. The rendering control unit 303 determines whether or not rendering can be restarted based on the result of the failure diagnosis performed by the self-diagnostic circuit.

Alternatively, for example, the drawing control unit 303 may perform drawing using test data, and perform failure diagnosis based on the result. For example, the rendering control unit 303 includes a failure determination unit (not shown). More specifically, for example, the drawing control unit 303 controls the stage driving mechanism 105 to move the stage 104 so that the Faraday cup 106 on the stage 104 is arranged at the drawing position. Then, the drawing control unit 303 executes drawing using the test data, and compares the output of the digital data with the normal data by the failure judging unit, thereby performing failure diagnosis. Alternatively, the rendering control unit 303 may also perform fault diagnosis in the following way: use the fault determination unit to diagnose the output of the digital data by a checksum.

In addition, for example, as fault diagnosis, device diagnosis based on voltage measurement can also be performed. More specifically, the analog output voltages of circuits with analog outputs such as various power sources (such as lenses or deflectors) and digital-to-analog converter (Digital to Analog Converter, DAC) amplifiers installed in the electron beam drawing device 1 are tested. Measure and compare the measured value with the set value.

Alternatively, for example, as a fault diagnosis, it is also possible to diagnose whether or not the multi-beam MB was irradiated normally. More specifically, for example, the drawing control unit 303 scans the alignment mark provided on the surface of the sample 103 using the multi-beam MB. At this time, it is possible to check whether the focal point and drawing position of the multi-beam MB deviate, whether or not a defect beam in which the electron beam is not normally irradiated occurs in the multi-beam MB, and the like. That is, the drawing control unit 303 checks whether or not the drawing accuracy required for the sample 103 has been obtained.

In fault diagnosis, more than two fault diagnoses can also be performed.

When it is determined as a result of the failure diagnosis that there is a failure (step S31_YES), the drawing control unit 303 stops drawing (step S22 ). For example, the rendering control unit 303 may output information about suspension of rendering to the outside.

When it is determined that there is no failure (step S31_No), the drawing control unit 303 controls the stage drive mechanism 105 based on the interruption position information to move the stage 104 to the interruption position (step S23 ). The drawing control unit 303 returns to step S11, restarts the transmission of the shot data to the deflection calculation control circuit 405, and starts drawing again.

1.2.4 Drawing operation when suspend mode setting Next, the rendering operation when the pause mode is set will be described with reference to FIG. 8 . FIG. 8 is a flowchart showing an example of the drawing operation when the pause mode is set. In the following description, the point which differs from FIG. 6 is centered and demonstrated.

As shown in FIG. 8 , the drawing step (step S10 to step S13 ) is the same as that in FIG. 6 .

When the stop mode is selected, if an abnormality is detected, the drawing control unit 303 stops drawing (step S21 ). At this time, log output as necessary.

1.3 Effects of this embodiment According to this embodiment, by interrupting the data transmission from the deflection calculation control circuit after abnormality is detected, drawing can be interrupted quickly, and the number of shots executed in an abnormal state can be suppressed. Furthermore, drawing is restarted from the interrupted position based on the interrupted position information generated from the unprocessed shot data in the deflection calculation control circuit, thereby reducing the occurrence of mask scrapping.

2. The second embodiment Next, a second embodiment will be described. In the second embodiment, the structure of the electron beam drawing apparatus 1 different from that of the first embodiment will be described. Hereinafter, the description will focus on points different from the first embodiment.

2.1 Structure of electron beam drawing device First, the configuration of the electron beam drawing apparatus 1 will be described using FIG. 9 . FIG. 9 is a conceptual diagram showing an example of the configuration of the electron beam drawing device 1 . In addition, although some connections between blocks are shown in the example of FIG. 9, the connection between blocks is not limited to these connections.

As shown in FIG. 9, the structures of the drawing mechanism 10 and the software part 30 are the same as those of the first embodiment.

In this embodiment, the high-voltage power supply 401 , the magnetic field sensor 402 , and the discharge detection control circuit 403 respectively send an alarm signal AL1 to an alarm signal AL3 to the blanking control circuit 404 .

The structure of other hardware parts 40 is the same as that of the first embodiment.

2.2 Depicting actions Next, the rendering operation will be described. The flow of the drawing operation is the same as that of the first embodiment.

Hereinafter, a case where the standby mode is set will be described using FIG. 10 . FIG. 10 is a flowchart showing an example of a drawing operation when the standby mode is set.

As shown in FIG. 10, the operations of step S10 to step S15 in the drawing process are the same as those in FIG. 6 of the first embodiment.

If an abnormality is detected (step S15_Yes), the blanking control circuit 404 that receives at least one of the alarm signal AL1-alarm signal AL3 interrupts the blanking control (step S40). The beam MB is turned off or the sample 103 is avoided (step S17 ). Then, the blanking control circuit 404 transmits the unprocessed control data held internally and not used for blanking control to the deflection calculation control circuit 405 (step S41 ). Furthermore, the blanking control circuit 404 can also send the information about the abnormality detection to the deflection calculation control circuit 405 .

The deflection calculation control circuit 405 uses the unprocessed control data transmitted from the blanking control circuit 404 and the shot data used when generating the control data not sent to the blanking control circuit 404 to generate the following if drawing is not interrupted. The shot ID of the shot data used for the control data to be sent to the blanking control circuit 404 is sent to the rendering control unit 303 (step S42 ). The rendering control unit 303 generates interruption position information based on the shot count generated from the transmitted unprocessed control data and the shot ID of the shot data (step S43 ).

The operations of step S20 to step S23 are the same as those in Fig. 6 of the first embodiment.

2.3 Effects of this embodiment According to this embodiment, the same effect as that of the first embodiment can be obtained. Furthermore, since the data transmission from the blanking control circuit 404 downstream of the deflection calculation control circuit 405 can be interrupted, the number of shots performed in an abnormal state can be suppressed, and the occurrence of mask scrapping can be further reduced.

3. The third embodiment Next, a third embodiment will be described. In the third embodiment, the structure of the electron beam drawing apparatus 1 that is different from the first embodiment and the second embodiment will be described. Hereinafter, description will focus on points different from the first embodiment and the second embodiment.

3.1 The overall structure of the electron beam drawing device First, the overall configuration of the electron beam drawing apparatus 1 will be described using FIG. 11 . FIG. 11 is a conceptual diagram showing an example of the overall configuration of the electron beam drawing apparatus 1 .

In this embodiment, the structure of the drawing mechanism 10 is the same as that of the first embodiment and the second embodiment, but includes a deflection calculation control unit 305 that uses the software unit 30 to perform the deflection calculation control operation instead of the first embodiment and the second embodiment. The deflection calculation control circuit 405 described in the form.

Similar to the second embodiment, the high-voltage power supply 401, the magnetic field sensor 402, and the discharge detection control circuit 403 send the alarm signal AL1 to the alarm signal AL3 to the blanking control circuit 404, respectively.

The structure of other control means 20 is the same as that of the first embodiment and the second embodiment.

3.2 Depicting actions Next, the rendering operation will be described. The flow of the drawing operation is the same as that of the first embodiment.

Hereinafter, a case where the standby mode is set will be described using FIG. 12 . FIG. 12 is a flowchart showing an example of a rendering operation when the standby mode is set.

As shown in FIG. 12, the operations of step S10 to step S15 in the drawing process are the same as those in FIG. 6 of the first embodiment.

If an abnormality is detected (step S15_Yes), the blanking control circuit 404 that receives at least one of the alarm signals AL1 -alarm signal AL3 interrupts the blanking control (step S40 ). Then, the blanking control circuit 404 turns off the multi-beam MB or avoids the sample 103 as in the first embodiment (step S17 ). Then, the blanking control circuit 404 transmits the unprocessed control data held internally that is not used for blanking control to the deflection calculation control unit 305 (step S44 ). Furthermore, the blanking control circuit 404 can also send information about abnormality detection to the deflection calculation control unit 305 .

The deflection calculation control unit 305 generates the unprocessed control data transmitted from the blanking control circuit 404 and the unprocessed shot data that was not used when generating the control data, which will be transmitted to the blanking screen next unless drawing is interrupted. The shot ID of the shot data used when controlling the data by the hidden control circuit 404 is sent to the rendering control unit 303 (step S45 ). The rendering control unit 303 generates interruption position information based on the shot count generated from the transmitted unprocessed control data and the shot ID of the shot data (step S46 ).

The operations of step S20 to step S23 are the same as those in Fig. 6 of the first embodiment.

3.3 Effects of this embodiment According to this embodiment, the same effect as that of the second embodiment can be obtained.

4. Modifications, etc. In the above-mentioned embodiment, the case where the operation mode is set before drawing has been described, but the present invention is not limited thereto. In the discharge detection control circuit 403, the high-voltage power supply 401, and the magnetic field sensor 402, the determination level can also be set in two stages, and the operation mode can be set according to the determination level. More specifically, for example, in the discharge detection control circuit 403 , the standby mode (or diagnosis mode) is selected when the current measurement value is greater than or equal to the judgment level of the first stage and smaller than the judgment level of the second stage. In addition, when the measured value of the current is equal to or higher than the determination level of the second step, the stop mode is selected.

In addition, this invention is not limited to the said embodiment, Various deformation|transformation is possible in the range which does not deviate from the summary in an implementation stage. In addition, each embodiment can be implemented in combination suitably, and in this case, the combined effect can be acquired. Furthermore, the above-described embodiments include various inventions, and various inventions can be selected from combinations selected from a plurality of disclosed structural elements. For example, in the case where a problem can be solved and an effect can be obtained even if some structural elements are deleted from all the structural elements shown in the embodiment, the structure from which the structural elements are deleted can be selected as an invention.

1: Electron beam drawing device 10: Delineate the Body 20: Control Mechanism 30:Software department 40: Hardware Department 101: Drawing Room 102: lens barrel 103: Sample 104: Platform 105: Platform drive mechanism 106: Faraday Cup 107: Mirror 111: Electron gun (charged particle gun) 112: Lighting lens 113: Shaped Aperture Array Substrate 114: Blanking Aperture Array Mechanism 115: Narrowing lens 116: Restricted Aperture Substrate 117: objective lens 118: Batch blanker 119: deflector 120: discharge detector 130: opening 301: Depict data storage department 302: Shooting data generation department 303:Delineate the control department 304: Interrupt location information storage unit 305: deflection calculation control unit 401: High voltage power supply 402: Magnetic field sensor 403: discharge detection control circuit 404: Blanking control circuit 405: deflection calculation control circuit 406: Shooting data preservation department 407: deflection calculation output unit 408: Platform position detector 500:Delineate the area 501～508: stripe area 510: Irradiated area AL1, AL2, AL3: alarm signal B: electron beam MB: Multibeam S1, S2, S3, S4, S5, S6, S7, S8, S9, S10, S11, S12, S13, S14, S15, S16, S17, S18, S19, S20, S21, S22, S23, S30, S31, S40, S41, S42, S43, S44, S45, S46: steps X, Y, Z: direction

FIG. 1 is a conceptual diagram of a charged particle beam drawing apparatus according to a first embodiment. Fig. 2 is a plan view of a shaped aperture array substrate in the charged particle beam imaging device according to the first embodiment. 3 is a conceptual diagram showing a drawing area of a sample to be drawn in the charged particle beam drawing apparatus according to the first embodiment. 4 is a table showing the relationship between shot identifiers (identifiers, IDs) and shot conditions in the charged particle beam mapping device according to the first embodiment. 5 is a flowchart showing the flow of a drawing operation in the charged particle beam drawing apparatus according to the first embodiment. 6 is a flowchart showing the flow of the drawing operation when the standby mode is set in the charged particle beam drawing apparatus according to the first embodiment. 7 is a flowchart showing the flow of the drawing operation when the diagnosis mode is set in the charged particle beam drawing apparatus according to the first embodiment. 8 is a flowchart showing the flow of the drawing operation when the pause mode is set in the charged particle beam drawing apparatus according to the first embodiment. Fig. 9 is a conceptual diagram of a charged particle beam drawing device according to a second embodiment. 10 is a flowchart showing the flow of the drawing operation when the standby mode is set in the charged particle beam drawing apparatus according to the second embodiment. Fig. 11 is a conceptual diagram of a charged particle beam drawing device according to a third embodiment. 12 is a flowchart showing the flow of the drawing operation when the standby mode is set in the charged particle beam drawing apparatus according to the third embodiment.

1: Electron beam drawing device

10: Delineate the Body

20: Control Mechanism

30:Software Department

40: Hardware Department

101: Drawing room

102: lens barrel

103: Sample

104: Platform

105: Platform drive mechanism

106: Faraday Cup

107: Mirror

111: Electron gun (charged particle gun)

112: Lighting lens

113: Shaped Aperture Array Substrate

114: Blanking Aperture Array Mechanism

115: Narrowing lens

116: Restricted Aperture Substrate

117: objective lens

118: Batch blanker

119: deflector

120: discharge detector

301: Depict data storage department

302: Shooting data generation department

303:Delineate the control department

304: Interrupt location information storage unit

401: High voltage power supply

402: Magnetic field sensor

403: discharge detection control circuit

404: Blanking control circuit

405: deflection calculation control circuit

406: Shooting data preservation department

407: deflection calculation output unit

408: Platform position detector

AL1, AL2, AL3: alarm signal

B: electron beam

MB: Multibeam

Claims (13)

A charged particle beam mapping device, comprising: The drawing mechanism irradiates a plurality of charged particle beams to the object while blanking each to draw a pattern; a drawing control unit that controls the drawing mechanism based on shot data generated from the pattern; a deflection calculation control circuit for generating control data based on the shot data transmitted from the drawing control unit, and the control data is used to perform blanking control on the plurality of charged particle beams; The storage unit stores the shooting data until the drawing based on the shooting data is completed; a blanking control circuit for controlling the blanking based on the control data transmitted from the deflection calculation control circuit; and Detector, which detects anomalies, When the detector detects the abnormality during drawing, the drawing control section interrupts the drawing, and based on the The shot data related to the control data is used to generate interruption location information of the location where the rendering has been interrupted. The charged particle beam drawing device according to claim 1, wherein, After the abnormality subsides, the rendering control unit restarts the rendering based on the interruption position information. The charged particle beam drawing device according to claim 1, wherein, The blanking control circuit interrupts blanking control if the transmission of the control data from the deflection calculation control circuit is interrupted. The charged particle beam drawing device according to claim 1, wherein, When the detector detects the abnormality during the rendering, the blanking control circuit interrupts blanking control to interrupt the rendering, and further stores the control data not used for the blanking control sent to the drawing control unit, The rendering control unit further generates the interrupt position information based on the control data not used for the blanking control. The charged particle beam drawing device according to claim 1, wherein, The drawing control unit determines whether or not the drawing can be restarted based on at least one of drawing accuracy required by the sample, a standby time, and a result of failure diagnosis. The charged particle beam drawing device according to claim 5, wherein, The failure diagnosis includes at least one of diagnosis based on profile data and diagnosis based on voltage measurement. The charged particle beam drawing device according to claim 1, wherein, The storage unit stores a shot identifier associated with a drawing position included in the shot data. The charged particle beam drawing device according to claim 1, wherein, The rendering control unit includes an interruption position information storage unit storing the interruption position information. A charged particle beam drawing method is a drawing method of drawing a pattern by irradiating a plurality of charged particle beams while blanking, respectively, and the drawing method includes: generating shot data based on the pattern; generating control data based on the shot data, the control data being used to respectively blank the plurality of charged particle beams; saving the shot data from which the control data is generated until the drawing based on the shot data is completed; controlling the blanking for rendering based on the control data; and When an abnormality is detected during the rendering, the rendering is interrupted, and based on the saved shot data related to the control data not used for the blanking control, the interrupted data is generated. Interrupt location information for the depicted location. The charged particle beam drawing method according to Claim 9 further includes: restarting the drawing based on the interrupted position information after the abnormality subsides. The charged particle beam drawing method according to claim 9, wherein, Interrupting the depiction includes: interrupt the transmission of the control data; and interrupt the blanking control. The charged particle beam drawing method according to claim 10, wherein, Start again with the described profile including: Whether or not the drawing can be restarted is determined based on at least one of the drawing accuracy required for the sample, the standby time, and the result of the fault diagnosis. The charged particle beam drawing method according to claim 9, wherein, Said saving said shooting data includes: A shot identifier associated with a drawing position included in the shot data is stored.

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