TW202301920A - Electronic device - Google Patents

Abstract

The present disclosure provides an electronic device including a first substrate, a second substrate and an adhesive element. The first substrate has a plurality of through holes. The second substrate is disposed on the first substrate. The adhesive element is disposed between the first substrate and the second substrate, wherein the adhesive element and the plurality of through holes at least partially overlap. The electronic device of the present disclosure does not need to be provided with screw holes, which can maintain the integrity of the first substrate and the second substrate without damage, save material costs, and save time and cost due to the convenience of automation.

Description

electronic device

The present invention relates to an electronic device, and more particularly to an electronic device capable of saving production costs.

In the prior art, three fixing methods are used to fix the light board and the back board: dot/spray glue, double-sided tape and screw lock. In order to overcome the tightness between the lamp board and the back board, a screw locking method with a higher locking density is used, which requires more man-hours, damages the structural integrity of the lamp board and the back board, and costs materials Also higher. Therefore, how to maintain the integrity between the lamp panel and the back panel at a lower production cost has become one of the problems to be solved urgently.

The invention provides an electronic device, which can save production cost.

The electronic device of the present invention includes a first substrate, a second substrate and an adhesive element. The first substrate has a plurality of through holes. The second substrate is disposed on the first substrate. The adhesive element is disposed between the first substrate and the second substrate, wherein the adhesive element at least partially overlaps the plurality of through holes.

Based on the above, in the embodiments of the present disclosure, the adhesive element overlaps at least partially the through hole of the first substrate, thereby eliminating the need to provide screw holes, maintaining the integrity and no damage of the first substrate and the second substrate, and saving material costs. And because it is beneficial to automation, it can also save time and cost. Therefore, the electronic device according to the embodiments of the present disclosure can effectively save production costs (including, for example, time costs and material costs).

The present disclosure can be understood by referring to the following detailed description combined with the accompanying drawings. It should be noted that, in order to make the readers understand easily and for the simplicity of the drawings, several drawings in the present disclosure only depict a part of the electronic device. Also, certain elements in the drawings are not drawn to actual scale. In addition, the number and size of each component in the figure are only for illustration, and are not intended to limit the scope of the present disclosure.

Certain terms will be used throughout the specification and appended claims of this disclosure to refer to particular elements. Those skilled in the art should understand that electronic device manufacturers may refer to the same element by different names. This document does not intend to distinguish between those elements that have the same function but have different names.

In the description and claims below, words such as "comprising" and "comprising" are open-ended words, so they should be interpreted as meaning "including but not limited to...".

In addition, relative terms such as "below" or "bottom" and "upper" or "top" may be used in the embodiments to describe the relative relationship of one element to another element in the drawings. It will be appreciated that if the illustrated device is turned over so that it is upside down, elements described as being on the "lower" side will then become elements on the "upper" side.

In some embodiments of the present disclosure, terms such as “connected” and “interconnected” related to bonding and connection, unless otherwise specified, may mean that two structures are in direct contact, or may also mean that two structures are not directly (indirectly). ) contact with other structures interposed between the two structures. And the terms about joining and connecting may also include the situation that both structures are movable, or both structures are fixed. In addition, the term "coupled" includes the transfer of energy between two structures by means of direct or indirect electrical connection, or the transfer of energy between two separate structures by means of mutual induction.

It will be understood that when an element or film is referred to as being "on" or "connected to" another element or film, it can be directly on or directly connected to the other element or film To another element or layer, or there is an intervening element or layer between the two (indirect cases). In contrast, when an element is referred to as being "directly on" or "directly connected to" another element or film, there are no intervening elements or layers present.

The terms "about", "equal", "equal" or "same", "substantially" or "substantially" are generally interpreted as being within 20% of a given value or range, or as being within 20% of a given value or range Within 10%, 5%, 3%, 2%, 1%, or 0.5% of a value or range.

As used herein, the terms "film" and/or "layer" may refer to any continuous or discontinuous structures and materials (such as materials deposited by the methods disclosed herein). For example, films and/or layers may comprise two-dimensional materials, three-dimensional materials, nanoparticles, or even partial or complete molecular layers, or partial or complete atomic layers, or clusters of atoms and/or molecules. The film or layer may comprise a material or layer having pinholes, which may be at least partially continuous.

Although the terms first, second, third... may be used to describe various constituent elements, the constituent elements are not limited to this term. This term is only used to distinguish a single constituent element from other constituent elements in the specification. The same terms may not be used in the claims, but are replaced by first, second, third... in the order in which elements are declared in the claims. Therefore, in the following description, a first constituent element may be a second constituent element in the claims.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the related art and the present disclosure, and not in an idealized or overly formal manner Interpretation, unless specifically defined herein.

It should be noted that in the following embodiments, without departing from the spirit of the present disclosure, technical features in several different embodiments may be replaced, reorganized, and mixed to complete other embodiments.

The electronic device of the present disclosure may include a display device, an antenna device, a sensing device, a light emitting device, or a splicing device, but is not limited thereto. Electronic devices may include bendable or flexible electronic devices. Electronic devices may include electronic components. The electronic device includes, for example, a liquid crystal (liquid crystal) layer or a light emitting diode (Light Emitting Diode, LED). Electronic components can include passive components and active components, such as capacitors, resistors, inductors, variable capacitors, filters, diodes, transistors (transistors), inductors, MEMS, liquid crystal chips ), etc., but not limited thereto. The diodes may include light emitting diodes or photodiodes. The light emitting diodes may, for example, include organic light emitting diodes (organic light emitting diodes, OLEDs), submillimeter light emitting diodes (mini LEDs), micro light emitting diodes (micro LEDs), quantum dot light emitting diodes (quantum dot LED), fluorescence (fluorescence), phosphorescence (phosphor) or other suitable materials, or a combination of the above, but not limited thereto. The sensors may, for example, include capacitive sensors, optical sensors, electromagnetic sensors, fingerprint sensors (fingerprint sensor, FPS), touch sensors (touch sensor) , antenna (antenna), or stylus (pen sensor), etc., but not limited thereto. In the following, a display device is used as an electronic device to illustrate the content of the disclosure, but the disclosure is not limited thereto.

Reference will now be made in detail to the exemplary embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and descriptions to refer to the same or like parts.

FIG. 1A is a partially exploded perspective view of an electronic device according to an embodiment of the present disclosure. FIG. 1B is a schematic top view of a first substrate of the electronic device in FIG. 1A . FIG. 1C is a schematic partial top view of the electronic device in FIG. 1A . 2A to 2C are schematic top views of various through holes according to various embodiments of the present disclosure. For convenience of illustration, the semiconductor elements are omitted in FIG. 1C .

Please refer to FIG. 1A and FIG. 1B at the same time. In this embodiment, the electronic device 100 includes a first substrate 110 a, a second substrate 120 and an adhesive component 130 a. The first substrate 110a has a plurality of through holes 115a. The second substrate 120 is disposed on the first substrate 110a. The adhesive element 130a is disposed between the first substrate 110a and the second substrate 120, wherein the adhesive element 130a at least partially overlaps with the through hole 115a.

In detail, in this embodiment, the first substrate 110a is, for example, a back panel, and the second substrate 120 is, for example, a lamp panel. The material of the first substrate 110a can be metal (such as zinc, aluminum, etc.), and the first substrate 110a is, for example, an electro-galvanized steel sheet (SECC), a hot-dip galvanized steel sheet (SGLC), or an aluminum alloy sheet. The material of the second substrate 120 is, for example, glass fiber (FR4), metal (such as copper, aluminum, etc.), and its thickness is, for example, 0.5 mm to 2 mm, such as 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm or 1.9mm, but not limited thereto. The electronic device 100 further includes a semiconductor element 140 disposed on the second substrate 120 , and the semiconductor elements 140 are arranged in a matrix on a side of the second substrate 120 relatively away from the first substrate 110 a. The semiconductor elements 140 can also be arranged on the second substrate 120 in other suitable ways, such as dislocation arrangement. In one embodiment, the semiconductor element 140 is, for example, a light emitting element, and the light emitting element is, for example, a light emitting diode, such as an organic light emitting diode (OLED), a submillimeter light emitting diode (mini LED), Micro LED (micro LED) or quantum dot light emitting diode (quantum dot, QD, such as QLED, QDLED), fluorescent (fluorescence), phosphorescent (phosphor) or other suitable materials and its material can be arbitrary permutations and combinations, but not limited thereto. The semiconductor element 140 may be a structure cut directly from the wafer and not packaged; or a structure cut from the wafer and packaged, which is not limited here. In addition, if the semiconductor device 140 is packaged, it can be a single die package; or multiple die packages, which are not limited here. If the semiconductor element 140 is a micro light-emitting diode, it may be, for example, a single bare die package, multiple bare die packages of the same color, or multiple bare die packages of different colors, which is not limited here.

Please refer to FIG. 1B again, the through-holes 115a are arranged in multiple rows, and the through-holes 115a in each row are arranged at equal intervals, for example, or at unequal intervals. In this embodiment, there is a distance D1 between any two adjacent through holes 115a, wherein the distance D1 is, for example, between 10 mm and 200 mm. In one embodiment, the distance D1 is, for example, between 20 mm and 150 mm. In another embodiment, the distance D1 is, for example, between 50 mm and 100 mm.

Furthermore, the shape of the through hole 115a of the first substrate 110a in this embodiment is, for example, a regular shape, such as a circle, but it is not limited thereto. In other embodiments, please refer to FIG. 2A, the shape of the through hole 115b of the first substrate 110b is, for example, oval; or, please refer to FIG. 2B, the shape of the through hole 115c of the first substrate 110c is, for example, a rectangle; or, please Referring to FIG. 2C, the through hole 115d of the first substrate 110d is, for example, irregular in shape, the through hole 115d includes a main body portion 117, and the shape of the main body portion 117 is, for example, a regular shape, such as a circle, and the through hole 115d also includes a connection connecting the main body portion 117. part 119, and the shape of the connection part 119 is, for example, an irregular shape. Here, the connecting portion 119 connects opposite sides of the main body portion 117 , and the connecting portion 119 may have the same and symmetrical shape or different shapes, but not limited thereto. In other embodiments, in addition to the regular shapes described above, regular shapes may also include polygons such as triangles, squares, trapezoids, rhombuses, pentagons, or stars; or a combination of at least one straight line and at least one arc, For example, semicircle, semi-ellipse; or, a combination of at least two of the above shapes; or, in addition to the above-mentioned two-dimensional shape, the regular shape can also be a three-dimensional shape of the above-mentioned regular shape, such as a cuboid or a cylinder, except Shapes other than regular shapes are irregular shapes.

Furthermore, please refer to FIG. 1B, FIG. 2A, FIG. 2B and FIG. 2C at the same time, each through hole 115a, 115b, 115c, 115d has a maximum width W1, W2, W3, W4, and the maximum width W1, W2, W3, W4 Between 1mm and 30mm. For example, the shape of the through hole 115a is circular, and the maximum width W1 is the diameter of the through hole 115a. The shape of the through hole 115b is, for example, an ellipse, and the maximum width W2 is the long axis of the through hole 115b. The shape of the through hole 115c is, for example, a rectangle, and the maximum width W3 is the length of the through hole 115c. The shape of the perforation 115d is, for example, a circle plus an irregular shape, and the maximum width W4 is the maximum length of the perforation 115d. In one embodiment, the maximum widths W1 , W2 , W3 , W4 are, for example, between 1.5 mm and 20 mm. In another embodiment, the maximum widths W1 , W2 , W3 , W4 are, for example, between 3 mm and 10 mm.

Please refer to FIG. 1C, the second substrate 120 of the present embodiment has an edge 121, and there is a minimum distance E1 between the through hole 115a closest to the edge 121 and the edge 121, and the minimum distance E1 is, for example, between 2 mm and 50 mm. between. Wherein, the minimum distance E1 is, for example, the distance between the center point of the through hole 115 a or the edge of the through hole 115 a and the edge 121 of the second substrate 120 . In one embodiment, the minimum distance E1 is, for example, between 5 mm and 25 mm. In another embodiment, the minimum distance E1 is, for example, between 10 mm and 15 mm.

In addition, please refer to FIG. 1A and FIG. 1C at the same time. The adhesive element 130a of this embodiment is, for example, double-sided adhesive tape, liquid adhesive adhesive (such as RTV silicone rubber, MS silicone rubber, etc.) or other suitable materials, but it is not intended to be limit. The shape of the adhesive element 130a can be regular or irregular. Here, the shape of the adhesive element 130a is, for example, a strip, and its width is, for example, 1 mm to 100 mm, such as 10 mm, 20 mm, 30 mm, 40 mm, 50 mm, 60 mm, 70 mm, 80 mm or 90 mm. mm, and fully or partially overlap with the through hole 115a, but not limited thereto. The distance G between the adhesive elements 130a of two adjacent rows is, for example, between 20 mm and 200 mm, such as 40 mm, 60 mm, 80 mm, 100 mm, 120 mm, 140 mm, 160 mm or 180 mm, but not This is the limit. It should be noted that the position, quantity, and shape of the through holes 115a can be adjusted according to the material of the second substrate 120, the specification of the adhesive component 130a, and the shape design and space requirements of the first substrate 110a.

FIG. 3A is a schematic partial cross-sectional view of the electronic device of the present disclosure and a pressing fixture used in heavy work. 3B to 3F are schematic diagrams of multiple paths during rework of the electronic device of the present disclosure. For clarity, the illustration of the second substrate 120 disposed on the first substrate 110 a is omitted in FIGS. 3B to 3F . Please refer to FIG. 1A, FIG. 3A and FIG. 3B at the same time. In one embodiment, when the electronic device 100 needs to be reworked, the reworking steps are as follows. First, a pressing fixture F is provided, wherein the pressing fixture F includes a force application end. F1 and ejection end F2. The diameter T1 of the ejection end F2 is, for example, 1 mm to 30 mm, such as 5 mm, 10 mm, 15 mm, 20 mm or 25 mm, and the length H1 protrudes from the first substrate 110a by about 0.1 mm to 100 mm, such as 10 mm, 20 mm, 30 mm, 40 mm, 50 mm, 60 mm, 70 mm, 80 mm or 90 mm, and the diameter T2 of the force application end F1 is, for example, 1 mm to 100 mm, and the length H2 is, for example, 1 mm to 100 mm, such as 10 mm. mm, 20mm, 30mm, 40mm, 50mm, 60mm, 70mm, 80mm or 90mm. Afterwards, a force of 0.1 kg to 100 kg is applied to the perforation 115a of the first substrate 110a through the pressing fixture F, such as 10 kg, 20 kg, 30 kg, 40 kg, 50 kg, 60 kg, 70 kg, 80 kg or 90 kg, and along the path S1 in FIG. 3B , from the row R1 one hole at a time, from left to right, sequentially push through the holes 115a. Next, repeat the above-mentioned steps, from row R2 to row Rn, after one row is completed, the next row is pressed, so that the second substrate 120 adhered to the first substrate 110a through the adhesive element 130a can be smoothly connected to the first substrate 110a separate.

It should be noted that the present embodiment is not limited to the pressing-through-hole 115 a once shown in FIG. 3B . In other embodiments, along the paths S21 and S22 in FIG. 3C , two holes at a time can be pressed from the row R1 from the left and right sides to the middle direction to press the through holes 115a sequentially. Next, the above steps are repeated, from row R2 to row Rn, after one row is completed, the next row is pressed, so that the second substrate 120 can be separated from the first substrate 110 a smoothly. Since multiple (eg, two) through-holes 115a are pressed simultaneously in a left-right dispersed pressing order, not only the efficiency can be improved, but also the deformation of the first substrate 110a and/or the second substrate 120 can be avoided.

Of course, this embodiment is not limited to the path S1 in FIG. 3B . In other embodiments, along the path S3 in FIG. 3D , from the row R1 one hole at a time from left to right and then from the row R2 to the right to the left, press the through hole 115a sequentially, so that the second substrate 120 It can be smoothly separated from the first substrate 110a. Alternatively, along the path S4 in FIG. 3E , the through-holes 115 a can be pressed sequentially from the row L1 one hole at a time from top to bottom. Next, the above steps are repeated, from the row L2 to the row Ln, and after one row is completed, the next row is pressed, so that the second substrate 120 can be separated from the first substrate 110 a smoothly. Alternatively, along the path S5 in FIG. 3F , from the row L1 one hole at a time from top to bottom and then from the bottom of the row L2 to the top, press the through holes 115a sequentially, so that the second substrate 120 can be smoothly Separated from the first substrate 110a. The above all belong to the scope of protection intended by this disclosure.

From the above content, it can be known that, compared with the prior art using screw locking, the combination of the through hole 115a of the first substrate 110a and the adhesive element 130a in this embodiment does not require drilling holes on the second substrate 120 In addition to maintaining the integrity and no damage of the first substrate 110 a and the second substrate 120 to save material costs, the second substrate 120 can also have a better circuit layout. Furthermore, the through hole 115a of the first substrate 110a also has the purpose of heavy work and the effect of heat dissipation. In this embodiment, an adhesive element 130a is provided between the first substrate 110a and the second substrate 120, and the first substrate 110a and the second substrate 120 are fixed through the adhesive element 130a, so that the first substrate 110a and the second substrate 120 can be There is a better bonding density between them. In addition, the use of the fixing method of the adhesive element 130a can also realize automatic attachment and fixing and is easy to implement, thus saving time and cost.

In short, the adhesive element 130a at least partially overlaps the through hole 115a of the first substrate 110a, thereby eliminating the need to provide screw holes, maintaining the integrity and no damage of the first substrate 110a and the second substrate 120, and saving material costs. Furthermore, because it is beneficial to automation, time and cost can also be saved. Therefore, the electronic device 100 of this embodiment can effectively save production costs (including, for example, time costs and material costs).

FIG. 4 is a schematic top view of a first substrate and an adhesive component of an electronic device according to another embodiment of the present disclosure. Adhesive element 130b may be of regular shape or irregular shape. Please refer to FIG. 4 , in this embodiment, the adhesive element 130b is, for example, irregular in shape. In detail, the adhesive element 130b has an edge 131, and at least one through hole 115d closest to the edge 131 has a minimum distance E2 from the edge 131, and the minimum distance E2 is, for example, between 10 mm and 15 mm. In addition, there is a distance D2 between any two adjacent through holes 115d, wherein the distance D2 is, for example, between 10 mm and 200 mm. In one embodiment, the distance D2 is, for example, between 50 mm and 100 mm.

To sum up, in the embodiments of the present disclosure, the adhesive element and the through hole of the first substrate are at least partially overlapped, thereby eliminating the need to provide screw holes, maintaining the integrity and no damage of the first substrate and the second substrate, and saving materials Cost, and because it is conducive to automation, it can also save time and cost. Therefore, the electronic device of the embodiment of the present disclosure can effectively save the production cost.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: It is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the various embodiments of the present invention. scope.

100: Electronic device 110a, 110b, 110c, 110d: first substrate 115a, 115b, 115c, 115d: perforation 117: Main body 119: connection part 120: second substrate 121, 131: edge 130a, 130b: Adhesive elements 140: Semiconductor components D1, D2: distance E1, E2: minimum distance H1, H2: length T1, T2: Diameter F: top pressure fixture F1: force end F2: ejection end G: Spacing R1, R2, Rn: columns L1, L2, Ln: row S1, S21, S22, S3, S4, S5: paths W1, W2, W3, W4: maximum width

FIG. 1A is a partially exploded perspective view of an electronic device according to an embodiment of the present disclosure. FIG. 1B is a schematic top view of a first substrate of the electronic device in FIG. 1A . FIG. 1C is a schematic partial top view of the electronic device in FIG. 1A . 2A to 2C are schematic top views of various through holes according to various embodiments of the present disclosure. FIG. 3A is a schematic partial cross-sectional view of the electronic device of the present disclosure and a pressing fixture used in heavy work. 3B to 3F are schematic diagrams of multiple paths during rework of the electronic device of the present disclosure. FIG. 4 is a schematic top view of a first substrate and an adhesive component of an electronic device according to another embodiment of the present disclosure.

100: Electronic device

110a: first substrate

115a: perforation

120: second substrate

130a: Adhesive components

140: Semiconductor components

G: Spacing

Claims (10)

An electronic device comprising: The first substrate has a plurality of through holes; a second substrate disposed on the first substrate; and The adhesive element is disposed between the first substrate and the second substrate, wherein the adhesive element at least partially overlaps with the through holes. The electronic device according to claim 1, wherein there is a distance between any two adjacent through holes, and the distance is between 10 mm and 200 mm. The electronic device as claimed in claim 1, wherein each of the through holes includes a main body, and the shape of the main body includes a regular shape or an irregular shape. The electronic device as claimed in claim 3, wherein each of the through holes further includes a connecting portion connected to the main body, and the shape of the connecting portion includes a regular shape or an irregular shape. The electronic device as claimed in claim 1, wherein each of the through holes has a maximum width, and the maximum width is between 1 mm and 30 mm. The electronic device as claimed in claim 1, wherein the first substrate comprises a backplane. The electronic device as described in Claim 1, further comprising: The semiconductor element is arranged on the second substrate. The electronic device as claimed in claim 7, wherein the semiconductor element includes a light emitting element. The electronic device as claimed in claim 1, wherein the second substrate has an edge, and at least one of the through holes closest to the edge has a minimum distance from the edge, and the minimum distance is between 2 mm and 50 between millimeters. The electronic device according to claim 1, wherein the adhesive element has an edge, and at least one of the perforations closest to the edge has a minimum distance from the edge, and the minimum distance is between 10 mm and 15 mm between.

Images