TW202242818A - A method of manufacturing an electronic device - Google Patents

Abstract

A method of manufacturing an electronic device including the following step is provided: providing a transfer mold, which includes a first transfer area and a second transfer area, wherein the first transfer area has a first block thickness, and the second transfer area has a second block thickness, and the thickness of the first block is different from the thickness of the second block; disposing a first electronic device on the first transfer area of the transfer mold; disposing a second electronic device on the second transfer area of the transfer mold; transferring the first electronic device and the second electronic device to the circuit substrate by the transfer mold, wherein the first electronic device has a first device thickness, the second electronic device has a second device thickness, and the first device thickness is different from the second device thickness.

Description

Electronic device manufacturing method

The present invention relates to a method of manufacturing an electronic device, and in particular to a method of manufacturing an electronic device by using transfer jigs with different block thicknesses.

Backlight modules made of millimeter light-emitting diodes (mini LEDs) often need to be driven by microchips (mini chip/mimi IC/micro chip/micro IC). However, the thickness of the light-emitting diode and the microchip will basically be inconsistent due to millimeters. Therefore, it is usually more complicated to manufacture.

The invention provides a manufacturing method of an electronic device, which is relatively simple.

The manufacturing method of the electronic device of the present invention includes the following steps: providing a transfer fixture, which includes a first transfer area and a second transfer area, wherein the first transfer area has a first block thickness, and the second transfer area has a second block thickness, and the thickness of the first block is different from the thickness of the second block; disposing the first electronic component in the first transfer area of the transfer jig; disposing the second electronic component in the second transfer area of the transfer jig; and by transferring The jig transfers the first electronic component and the second electronic component to the circuit substrate, wherein the first electronic component has a first component thickness, the second electronic component has a second component thickness, and the first component thickness is different from the second component thickness .

Based on the above, the manufacturing method of the electronic device of the present invention can be relatively simple.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

In the drawings, the thickness of each element and the like is exaggerated for clarity. Throughout the specification, the same reference numerals denote the same elements. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, Alternatively intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to a physical and/or electrical connection.

It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, and/or or parts thereof shall not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, "a first element," "component," "region," "layer," or "section" discussed below could be termed a second element, component, region, layer or section without departing from the teachings herein.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include plural forms including "at least one" unless the content clearly dictates otherwise. "Or" means "and/or". As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. It should also be understood that when used in this specification, the terms "comprising" and/or "comprising" designate the stated features, regions, integers, steps, operations, the presence of elements and/or parts, but do not exclude one or more Existence or addition of other features, regions as a whole, steps, operations, elements, parts and/or combinations thereof.

Additionally, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe one element's relationship to another element as shown in the figures. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in one of the figures is turned over, elements described as being on the "lower" side of other elements would then be oriented on "upper" sides of the other elements. Thus, the exemplary term "below" can encompass both an orientation of "below" and "upper," depending on the particular orientation of the drawing. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "below" or "beneath" can encompass both an orientation of above and below.

As used herein, "about," "substantially," or "essentially" includes the stated value and averages within acceptable deviations from the particular value as determined by one of ordinary skill in the art, taking into account the measurements in question and the relative A specific amount of measurement-related error (ie, the limit of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted to have meanings consistent with their meanings in the context of the relevant art and the present invention, and will not be interpreted as idealized or excessive formal meaning, unless expressly so defined herein.

Exemplary embodiments are described herein with reference to cross section illustrations that are schematic illustrations of idealized embodiments. Accordingly, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances are to be expected. Thus, embodiments described herein should not be construed as limited to the particular shapes of regions as illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, a region shown or described as flat, may, typically, have rough and/or non-linear features. Additionally, acute corners shown may be rounded. Thus, the regions shown in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the claims.

1A to 1B are partial cross-sectional schematic views of a partial manufacturing method of a transfer jig according to an embodiment of the present invention.

Referring to FIG. 1A , a substrate 118 is provided. In this embodiment, the base material 118 may be a bulk material with a single material. For example, the substrate 118 may include glass, but the invention is not limited thereto.

Please continue to refer to FIG. 1A , a patterned photoresist layer 180 may be formed on a surface 118 b of the substrate 118 . The pattern of the patterned photoresist layer 180 can be adjusted according to subsequent requirements, which is not limited in the present invention.

Referring to FIGS. 1A-1B , the patterned photoresist layer 180 can be used as a mask to remove part of the substrate 118 (indicated in FIG. 1A ) by etching. In this way, the transfer jig 110 (shown in FIG. 1B ) having at least one recess 110c on the surface can be formed. In this embodiment, since the transfer jig 110 may be formed by the base material 118 having a block material of a single material, the transfer jig 110 may also correspond to a single block material.

In this embodiment, the one-time etching method is only exemplarily shown or described. In an unillustrated embodiment, the recesses can have corresponding depths by adjusting the parameters of the etching process (eg, adjusting the type of etchant, adjusting the etching time, or other methods). In an unillustrated embodiment, the recesses with different depths can be formed by etching multiple times.

Referring to FIG. 1B , the transfer jig 110 may include a first transfer area 111 and a second transfer area 112 . The first transfer region 111 has a first block thickness 111h. The second transfer region 112 has a second block thickness 112h. The first block thickness 111h is different from the second block thickness 112h.

In this embodiment, the adhesive layer 160 may be formed on the transfer surface 110 b of the transfer jig 110 , but the invention is not limited thereto. The adhesive layer 160 includes, for example, a light to heat conversion (light to heat conversion; LTHC) debonding material or other suitable materials, so that the corresponding components can be indirectly configured on the transfer jig 110 in subsequent processes, and/or in the In further subsequent processes, the components on the transfer jig 110 can be easily separated from the transfer jig 110 by a suitable method.

In one embodiment, the transfer jig 110 can be directly configured on the transfer jig 110 in a subsequent manufacturing process by a suitable method (such as: electrostatic adsorption or charge adsorption, but not limited). . That is to say, the transfer surface 110 b of the transfer jig 110 may not have an adhesive layer that is the same as or similar to the adhesive layer 160 .

In this embodiment, the adhesive layer 160 may conformally cover the transfer surface 110 b of the transfer jig 110 , but the invention is not limited thereto.

In this embodiment, the surface 110 a of the transfer jig 110 away from the transfer surface 110 b may be substantially a plane, but the invention is not limited thereto.

In an exemplary application of the transfer jig 110 , the side surface 110 c between the surface 100 a and the transfer surface 110 b and/or the surface 110 a may be clamped or fixed directly or indirectly by other tools, jigs or mechanisms.

2A to 2D are partial cross-sectional schematic diagrams of a partial manufacturing method of an electronic device according to the first embodiment of the present invention.

Referring to FIG. 2A , a transfer jig is provided.

In this embodiment, the transfer jig used is the transfer jig 110 of the previous embodiment. Therefore, the transfer jig 110 is used as an exemplary illustration in the drawings and subsequent descriptions. In an embodiment, the used transfer jig may be a transfer jig similar to the transfer jig 110 .

Please continue to refer to FIG. 2A , the first electronic component 121 is provided. The first electronic component 121 may be disposed on the temporary carrier 171, but the invention is not limited thereto.

In this embodiment, the first electronic component 121 may include an active component for driving current, such as an integrated circuit (IC) or a control circuit produced by other semiconductor processes. For example, the first electronic component 121 may include a microchip (mini chip/mimi IC/micro chip/micro IC), but the invention is not limited thereto. In this embodiment, the first electronic component 121 may have a first component thickness 121h. In an embodiment, the thickness 121h of the first element may be about 120 micrometers (micrometer; µm) to 180 micrometers (eg, about 150 micrometers), but the invention is not limited thereto.

In this embodiment, the temporary carrier 171 may include a carrier tape, such as blue tape, but the invention is not limited thereto.

2A to 2B, the transfer fixture 110 can be made close to the first electronic component 121, so that the first electronic component 121 is disposed on the transfer surface 110b of the transfer fixture 110, and the first electronic component 121 It is configured corresponding to the first transfer area 111 .

Please continue to refer to FIG. 2B , the second electronic component 122 is provided. The second electronic component 122 may be disposed on the temporary carrier 172, but the invention is not limited thereto.

In this embodiment, the second electronic component 122 may include a light emitting component. For example, the second electronic component 122 may include a submillimeter light emitting diode (mini LED), but the invention is not limited thereto. In this embodiment, the second electronic component 122 may have a second component thickness 122h. In one embodiment, the second element thickness 122h may be about 60 microns to 100 microns (eg, about 80 microns), but the invention is not limited thereto. In one embodiment, the second electronic component 122 may be a horizontal light emitting diode (lateral LED), but the invention is not limited thereto.

In this embodiment, the temporary carrier 172 may include a carrier tape, such as blue film tape, but the invention is not limited thereto.

2B to 2C, the transfer tool 110 can be brought close to the second electronic component 122, so that the second electronic component 122 is disposed on the transfer surface 110b of the transfer tool 110, and the second electronic component 122 It is configured corresponding to the second transfer area 112 .

It should be noted that, in this embodiment, first the first electronic component 121 is disposed on the transfer surface 110b of the transfer jig 110, and then the second electronic component 122 is disposed on the transfer surface 110b of the transfer jig 110 , but the present invention is not limited thereto. In an embodiment not shown, the second electronic component 122 can be arranged on the transfer surface 110b of the transfer jig 110 first, and then the first electronic component 121 is arranged on the transfer surface of the transfer jig 110 110b on. In addition, the quantity of the first electronic components 121 or the second electronic components 122 can be adjusted according to requirements, which is not limited in the present invention.

In this embodiment, the first electronic component 121 disposed on the transfer jig 110 has a first component bottom 121b (that is, the area of the first electronic component 121 farthest from the transfer surface 110b), and the second electronic component 121 disposed on the transfer jig 110 The electronic component 122 has a second component bottom 122b (i.e., the region of the second electronic component 122 farthest from the transfer surface 110b), and the first component bottom 121b and the second component bottom 122b can be located substantially on the same plane (which can be a virtual plane) on P1. That is to say, the first element bottom 121b and the second element bottom 122b are substantially at the same level.

In one embodiment, the first electronic component 121 may include conductive terminals at the bottom 121b thereof, and/or the second electronic component 122 may include conductive terminals at the bottom 122b thereof, but the invention is not limited thereto.

In this embodiment, the sum of the first block thickness 111h and the first element thickness 121h is substantially the same as the sum of the second block thickness 112h and the second element thickness 122h.

Referring to FIG. 2C to FIG. 2D , the first electronic component 121 and the second electronic component 122 are transferred to the circuit substrate 130 by the transfer jig 110 .

In this embodiment, the circuit substrate 130 may include corresponding circuits. In addition, for the sake of clarity, only part of the circuits of the circuit substrate 130 (such as the corresponding connection pads 132 ) may be shown in the drawings or other corresponding circuits of the circuit substrate 130 may be omitted.

In this embodiment, the first component bottom 121b of the first electronic component 121 and the second component bottom 122b of the second electronic component 122 can face and be very close to or contact the corresponding circuit on the circuit substrate 130 (such as: corresponding connection pad 132). Then, the conductive material (such as: the conductive terminal of the first electronic component 121, the conductive terminal of the second electronic component 122 or other suitable low melting point conductive material) can be at least partially melted by direct heating or laser heating. , so that the first electronic component 121 and the second electronic component 122 can be electrically connected to the corresponding circuit on the circuit substrate 130 . Afterwards, the first electronic component 121 and the second electronic component 122 can be separated from the transfer jig 110 by a suitable method (eg, heat or light to reduce or decompose the bonding force of the adhesive layer 160 ). In this way, the same or similar structure as shown in FIG. 2D can be formed. In addition, the above-mentioned manner is only an example, and does not limit the present invention.

In this embodiment, the first electronic component 121 and the second electronic component 122 can be transferred to the circuit substrate 130 at one time in the same or similar manner as above. In this way, the manufacturing method can be simplified. In addition, if (that is, a non-limiting embodiment), the first electronic component 121 and the second electronic component 122 are electrically connected to the corresponding circuits on the circuit substrate 130 by the aforementioned heating method. Also because of the aforementioned one-time transfer method, the possibility of damage/damage of the circuit substrate 130 due to repeated heating can be reduced. In this way, the yield rate of the manufacturing method can be improved.

In this embodiment, the first electronic component 121 and the second electronic component 122 may be disposed on the circuit substrate 130 by means of flip-chip bonding.

After the above process, the electronic device 100 of this embodiment can be substantially completed.

In this embodiment, the electronic device 100 may include a light emitting device (such as a display panel or a backlight module), but the invention is not limited thereto.

3 is a partial cross-sectional schematic diagram of a partial manufacturing method of an electronic device according to a second embodiment of the present invention. The manufacturing method of the electronic device (not directly marked) in this embodiment is similar to the manufacturing method of the electronic device 100 in the first embodiment, and its similar components are denoted by the same reference numerals, and have similar functions, materials or formation methods , and omit the description.

Referring to FIG. 3 , the transfer jig 210 may include a first transfer area 111 , a second transfer area 112 and a third transfer area 213 . The third transfer region 213 has a third block thickness 213h. The third block thickness 213h is different from the first block thickness 111h and the second block thickness 112h. The material or forming method of the transfer jig 210 may be the same or similar to the transfer jig 110 of the foregoing embodiment, so details are not described here.

Please continue to refer to FIG. 3, the first electronic component 121, the second electronic component 122 and the third electronic component 223 can be arranged on the transfer tool 210 in the same or similar manner as in FIG. 2A and/or FIG. 2B. surface 110b.

It should be noted that the present invention does not limit the sequence of disposing the first electronic component 121 , the second electronic component 122 and the third electronic component 223 on the transfer jig 210 . In addition, the quantity of the first electronic component 121 , the second electronic component 122 or the third electronic component 223 can be adjusted according to requirements, which is not limited in the present invention.

In this embodiment, the third electronic component 223 may include a light emitting component. For example, the third electronic component 223 may include a submillimeter light emitting diode (mini LED), but the invention is not limited thereto. In one embodiment, the third electronic component 223 may be a horizontal light emitting diode (lateral LED), but the invention is not limited thereto.

In this embodiment, the third electronic component 223 on the transfer fixture 210 has a third component bottom 223b (that is, the area of the third electronic component 223 farthest from the transfer surface 110b), and the first component bottom 121b, the second The element bottom 122b and the third element bottom 223b may be substantially located on the same plane (which may be a virtual plane) P2. That is to say, the first element bottom 121b, the second element bottom 122b and the third element bottom 223b are substantially at the same level.

In this embodiment, the sum of the first block thickness 111h and the first element thickness 121h, the sum of the second block thickness 112h and the second element thickness 122h, and the sum of the third block thickness 213h and the third element thickness 223h basically the same as each other.

Please continue to refer to FIG. 3 , the first electronic component 121 , the second electronic component 122 and the third electronic component 223 can be transferred to the circuit substrate by the transfer jig 210 in the same or similar manner as in FIG. 2C to FIG. 2D 130 on.

After the above process, the electronic device (not directly marked) of this embodiment can be substantially completed.

FIG. 4 is a schematic partial cross-sectional view of a partial manufacturing method of an electronic device according to a third embodiment of the present invention. The manufacturing method of the electronic device (not directly marked) in this embodiment is similar to the manufacturing method of the electronic device 100 of the first embodiment or the manufacturing method of the electronic device (not directly marked) of the second embodiment, and its similar components Denote by the same reference numerals, and have similar functions, materials or forms, and descriptions are omitted.

Referring to FIG. 4 , the transfer jig 310 may include a first transfer area 111 , a second transfer area 112 , a third transfer area 213 and a fourth transfer area 314 . The fourth transfer region 314 has a fourth block thickness 314h. The fourth block thickness 314h is different from the first block thickness 111h, the second block thickness 112h and the third block thickness 213h. The material or forming method of the transfer jig 310 may be the same or similar to the transfer jig 110 of the foregoing embodiment, so details are not described here.

Please continue to refer to FIG. 4, the first electronic component 121, the second electronic component 122, the third electronic component 223 and the fourth electronic component 324 can be configured in the same or similar manner as in FIG. 2A and/or FIG. 2B. on the transfer surface 110 b of the transfer jig 310 .

It should be noted that the present invention does not limit the sequence of disposing the first electronic component 121 , the second electronic component 122 , the third electronic component 223 and the fourth electronic component 324 on the transfer jig 310 . In addition, the quantity of the first electronic component 121 , the second electronic component 122 , the third electronic component 223 or the fourth electronic component 324 can be adjusted according to requirements, which is not limited in the present invention.

In this embodiment, the fourth electronic component 324 may include a light emitting component. For example, the fourth electronic component 324 may include a submillimeter light emitting diode (mini LED), but the invention is not limited thereto. In one embodiment, the fourth electronic component 324 may be a horizontal light emitting diode (lateral LED), but the invention is not limited thereto.

In one embodiment, the second electronic component 122 , the third electronic component 223 and the fourth electronic component 324 may have different light emitting colors. For example, the second electronic component 122 , the third electronic component 223 or the fourth electronic component 324 can emit red light, green light or blue light.

In this embodiment, the fourth electronic component 324 disposed on the transfer fixture 310 has a fourth component bottom 324b (that is, the region of the fourth electronic component 324 farthest from the transfer surface 110b), and the first component bottom 121b, the second The element bottom 122b, the third element bottom 223b and the third element bottom 223b may be basically located on the same plane (which may be a virtual plane) P3. That is to say, the first element bottom 121b, the second element bottom 122b, the third element bottom 223b and the fourth element bottom 324b are substantially at the same level.

In this embodiment, the sum of the first block thickness 111h and the first element thickness 121h, the sum of the second block thickness 112h and the second element thickness 122h, the sum of the third block thickness 213h and the third element thickness 223h And the sum of the fourth block thickness 314h and the fourth element thickness 324h is substantially the same as each other.

Please continue to refer to FIG. 4, the first electronic component 121, the second electronic component 122, the third electronic component 223 and the fourth electronic The components 324 are transferred onto the circuit substrate 130 .

After the above process, the electronic device (not directly marked) of this embodiment can be substantially completed.

To sum up, the manufacturing method of the electronic device of the present invention can be relatively simple.

110, 210, 310: transfer fixture 110a, 110b, 110c: faces 110d: depression 111, 112, 213, 314: transfer area 111h, 112h, 213h, 314h: block thickness 118: Substrate 118b: surface 121, 122, 223, 324: electronic components 121h, 122h, 223h, 324h: component thickness 121b, 122b, 223b, 324b: element bottom 130: circuit substrate 132: connection pad 160: Adhesive layer 171, 172: temporary carrier 180: Patterned photoresist layer P1, P2, P3: plane

1A to 1B are partial cross-sectional schematic views of a partial manufacturing method of a transfer jig according to an embodiment of the present invention. 2A to 2D are partial cross-sectional schematic diagrams of a partial manufacturing method of an electronic device according to the first embodiment of the present invention. 3 is a partial cross-sectional schematic diagram of a partial manufacturing method of an electronic device according to a second embodiment of the present invention. FIG. 4 is a schematic partial cross-sectional view of a partial manufacturing method of an electronic device according to a third embodiment of the present invention.

110: transfer jig

110b: surface

111, 112: transfer area

111h, 112h: block thickness

121, 122: electronic components

121b, 122b: element bottom

121h, 122h: component thickness

130: circuit substrate

132: connection pad

160: Adhesive layer

P1: Plane

Claims (10)

A method of manufacturing an electronic device, comprising: A transfer jig is provided, which includes a first transfer area and a second transfer area, wherein the first transfer area has a first block thickness, the second transfer area has a second block thickness, and the first area a block thickness different from said second block thickness; arranging a first electronic component in the first transfer area of the transfer jig; disposing a second electronic component on the second transfer area of the transfer jig; and Transferring the first electronic component and the second electronic component onto a circuit substrate by using the transfer jig, wherein the first electronic component has a first component thickness, and the second electronic component has a second component thickness, and the thickness of the first element is different from the thickness of the second element. The method for manufacturing an electronic device according to claim 1, wherein the step of transferring the first electronic component and the second electronic component onto the circuit substrate by using the transfer jig is: transferring the The first electronic component and the second electronic component on the jig are transferred to the circuit substrate at one time. The method for manufacturing an electronic device as claimed in claim 1, wherein the transfer jig is a single piece. The method of manufacturing an electronic device as claimed in claim 1, wherein the transfer junction is at least formed by etching. The method for manufacturing an electronic device according to claim 1, wherein the first electronic component or the second electronic component is disposed on the circuit substrate by flip-chip bonding. The method of manufacturing an electronic device as claimed in claim 1, wherein the first electronic component configured on the transfer jig has a first component bottom, and the second electronic component on the transfer jig is configured The electronic component has a second component bottom, and the first component bottom and the second component bottom are at the same level. The method of manufacturing an electronic device according to claim 1, wherein the sum of the first block thickness and the first element thickness is the same as the sum of the second block thickness and the second element thickness. The method of manufacturing an electronic device as claimed in item 1, wherein the transfer fixture further includes a third transfer region, wherein the third transfer region has a third block thickness, and the third block thickness is different from the The thickness of the first block and the thickness of the second block, and the manufacturing method further includes: disposing a third electronic component on the third transfer area of the transfer jig; and The third electronic component is further transferred onto the circuit substrate by the transfer jig, wherein the third electronic component has a third component thickness, and the third component thickness is different from that of the first component thickness and the second element thickness. The method of manufacturing an electronic device as claimed in claim 8, wherein the transfer fixture further includes a fourth transfer region, wherein the fourth transfer region has a fourth block thickness, and the fourth block thickness is different from the The thickness of the first block, the thickness of the second block and the thickness of the third block, and the manufacturing method further includes: disposing a fourth electronic component in the fourth transfer area of the transfer jig; and Furthermore, the fourth electronic component is transferred onto the circuit substrate by the transfer jig, wherein the fourth electronic component has a fourth component thickness, and the fourth component thickness is different from that of the first component thickness, the third element thickness, and the third element thickness. The method of manufacturing an electronic device according to claim 1, wherein the transfer jig includes N transfer regions each having a different region thickness, and 2≦N≦4.

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