TW202208516A - 感光性樹脂組成物、硬化物、顯示裝置、半導體裝置及硬化物的製造方法 - Google Patents
感光性樹脂組成物、硬化物、顯示裝置、半導體裝置及硬化物的製造方法 Download PDFInfo
- Publication number
- TW202208516A TW202208516A TW110129670A TW110129670A TW202208516A TW 202208516 A TW202208516 A TW 202208516A TW 110129670 A TW110129670 A TW 110129670A TW 110129670 A TW110129670 A TW 110129670A TW 202208516 A TW202208516 A TW 202208516A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- photosensitive resin
- group
- formula
- layer
- Prior art date
Links
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
- G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-137261 | 2020-08-17 | ||
| JP2020137261 | 2020-08-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202208516A true TW202208516A (zh) | 2022-03-01 |
Family
ID=80322677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110129670A TW202208516A (zh) | 2020-08-17 | 2021-08-11 | 感光性樹脂組成物、硬化物、顯示裝置、半導體裝置及硬化物的製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2022039028A1 (fr) |
| KR (1) | KR102891923B1 (fr) |
| CN (1) | CN115698854B (fr) |
| TW (1) | TW202208516A (fr) |
| WO (1) | WO2022039028A1 (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120883136A (zh) * | 2023-03-13 | 2025-10-31 | 东丽株式会社 | 感光性组合物、固化物、显示装置及固化物的制造方法 |
| WO2025203858A1 (fr) * | 2024-03-25 | 2025-10-02 | 東レ株式会社 | Composition de résine photosensible, produit durci et dispositif d'affichage |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4982927B2 (ja) * | 2000-06-28 | 2012-07-25 | 東レ株式会社 | 表示装置 |
| JP4982928B2 (ja) | 2000-06-28 | 2012-07-25 | 東レ株式会社 | 表示装置 |
| CN102015835A (zh) * | 2008-05-09 | 2011-04-13 | 旭化成电子材料株式会社 | 聚酰亚胺前体、感光性聚酰亚胺前体组合物、感光性干膜及使用它们的柔性印刷布线基板 |
| JP2011227492A (ja) * | 2010-03-30 | 2011-11-10 | Dainippon Printing Co Ltd | ネガ型レジスト組成物、並びに、当該レジスト組成物を用いたレリーフパターンの製造方法及び電子部品 |
| JP5691657B2 (ja) * | 2011-03-04 | 2015-04-01 | 日油株式会社 | 感光性樹脂組成物およびその用途 |
| JP5468650B2 (ja) * | 2011-09-29 | 2014-04-09 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜並びにその製造方法 |
| JP5884551B2 (ja) * | 2012-02-27 | 2016-03-15 | 日油株式会社 | 感光性樹脂組成物およびその用途 |
| JP6140506B2 (ja) * | 2013-03-29 | 2017-05-31 | 東京応化工業株式会社 | ポジ型レジスト組成物及びレジストパターン形成方法 |
| JP2016166951A (ja) * | 2015-03-09 | 2016-09-15 | Jnc株式会社 | 感光性組成物 |
-
2021
- 2021-08-04 WO PCT/JP2021/028917 patent/WO2022039028A1/fr not_active Ceased
- 2021-08-04 KR KR1020227042069A patent/KR102891923B1/ko active Active
- 2021-08-04 CN CN202180043115.7A patent/CN115698854B/zh active Active
- 2021-08-04 JP JP2021546305A patent/JPWO2022039028A1/ja active Pending
- 2021-08-11 TW TW110129670A patent/TW202208516A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2022039028A1 (fr) | 2022-02-24 |
| WO2022039028A1 (fr) | 2022-02-24 |
| KR102891923B1 (ko) | 2025-11-27 |
| CN115698854A (zh) | 2023-02-03 |
| CN115698854B (zh) | 2025-08-22 |
| KR20230051766A (ko) | 2023-04-18 |
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