[go: up one dir, main page]

TW202208516A - 感光性樹脂組成物、硬化物、顯示裝置、半導體裝置及硬化物的製造方法 - Google Patents

感光性樹脂組成物、硬化物、顯示裝置、半導體裝置及硬化物的製造方法 Download PDF

Info

Publication number
TW202208516A
TW202208516A TW110129670A TW110129670A TW202208516A TW 202208516 A TW202208516 A TW 202208516A TW 110129670 A TW110129670 A TW 110129670A TW 110129670 A TW110129670 A TW 110129670A TW 202208516 A TW202208516 A TW 202208516A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
group
formula
layer
Prior art date
Application number
TW110129670A
Other languages
English (en)
Chinese (zh)
Inventor
池田圭
小森悠佑
三好一登
Original Assignee
日商東麗股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東麗股份有限公司 filed Critical 日商東麗股份有限公司
Publication of TW202208516A publication Critical patent/TW202208516A/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/023Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/22Exposing sequentially with the same light pattern different positions of the same surface
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G09F9/335Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
TW110129670A 2020-08-17 2021-08-11 感光性樹脂組成物、硬化物、顯示裝置、半導體裝置及硬化物的製造方法 TW202208516A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-137261 2020-08-17
JP2020137261 2020-08-17

Publications (1)

Publication Number Publication Date
TW202208516A true TW202208516A (zh) 2022-03-01

Family

ID=80322677

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110129670A TW202208516A (zh) 2020-08-17 2021-08-11 感光性樹脂組成物、硬化物、顯示裝置、半導體裝置及硬化物的製造方法

Country Status (5)

Country Link
JP (1) JPWO2022039028A1 (fr)
KR (1) KR102891923B1 (fr)
CN (1) CN115698854B (fr)
TW (1) TW202208516A (fr)
WO (1) WO2022039028A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120883136A (zh) * 2023-03-13 2025-10-31 东丽株式会社 感光性组合物、固化物、显示装置及固化物的制造方法
WO2025203858A1 (fr) * 2024-03-25 2025-10-02 東レ株式会社 Composition de résine photosensible, produit durci et dispositif d'affichage

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4982927B2 (ja) * 2000-06-28 2012-07-25 東レ株式会社 表示装置
JP4982928B2 (ja) 2000-06-28 2012-07-25 東レ株式会社 表示装置
CN102015835A (zh) * 2008-05-09 2011-04-13 旭化成电子材料株式会社 聚酰亚胺前体、感光性聚酰亚胺前体组合物、感光性干膜及使用它们的柔性印刷布线基板
JP2011227492A (ja) * 2010-03-30 2011-11-10 Dainippon Printing Co Ltd ネガ型レジスト組成物、並びに、当該レジスト組成物を用いたレリーフパターンの製造方法及び電子部品
JP5691657B2 (ja) * 2011-03-04 2015-04-01 日油株式会社 感光性樹脂組成物およびその用途
JP5468650B2 (ja) * 2011-09-29 2014-04-09 富士フイルム株式会社 感光性樹脂組成物、硬化膜並びにその製造方法
JP5884551B2 (ja) * 2012-02-27 2016-03-15 日油株式会社 感光性樹脂組成物およびその用途
JP6140506B2 (ja) * 2013-03-29 2017-05-31 東京応化工業株式会社 ポジ型レジスト組成物及びレジストパターン形成方法
JP2016166951A (ja) * 2015-03-09 2016-09-15 Jnc株式会社 感光性組成物

Also Published As

Publication number Publication date
JPWO2022039028A1 (fr) 2022-02-24
WO2022039028A1 (fr) 2022-02-24
KR102891923B1 (ko) 2025-11-27
CN115698854A (zh) 2023-02-03
CN115698854B (zh) 2025-08-22
KR20230051766A (ko) 2023-04-18

Similar Documents

Publication Publication Date Title
JP6521030B2 (ja) 感光性着色樹脂組成物
JP7013872B2 (ja) 樹脂組成物、硬化膜、半導体装置およびそれらの製造方法
CN106715597B (zh) 树脂组合物、耐热性树脂膜的制造方法及显示装置
CN108604061B (zh) 固化膜及正型感光性树脂组合物
KR102891923B1 (ko) 감광성 수지 조성물, 경화물, 표시 장치, 반도체 장치 및 경화물의 제조 방법
WO2015137281A1 (fr) Composition de résine photosensible
TWI827824B (zh) 正型感光性樹脂組成物、硬化膜的製造方法、硬化膜、光學元件以及電子材料
JP2014178400A (ja) ポジ型感光性樹脂組成物
CN115066980B (zh) 有机el显示装置及其制造方法、固化物的制造方法
WO2023171487A1 (fr) Composition de résine photosensible, article durci, dispositif d'affichage et procédé de production de dispositif d'affichage
WO2022181350A1 (fr) Composition de résine photosensible, objet durci, produit stratifié, dispositif d'affichage et procédé de production de dispositif d'affichage
TW202330729A (zh) 感光性樹脂組成物、硬化物、有機el顯示裝置、半導體裝置及硬化物的製造方法
JP2024027778A (ja) 感光性樹脂組成物、硬化物、積層体、表示装置、および表示装置の製造方法
KR102926281B1 (ko) 유기 el 표시 장치, 경화물의 제조 방법 및 유기 el 표시 장치의 제조 방법
TW202243910A (zh) 積層體、顯示裝置及顯示裝置之製造方法
CN118679427A (zh) 感光性树脂组合物、硬化物、硬化物的制造方法、有机el显示装置及显示装置
TW202336096A (zh) 感光性樹脂組成物、硬化物、有機電致發光顯示裝置及顯示裝置
JP2024049758A (ja) 感光性樹脂組成物、硬化物および表示装置
TW202540226A (zh) 感光性樹脂組成物、硬化物、顯示裝置
CN118020025A (zh) 感光性树脂组合物、硬化物、有机el显示装置、半导体装置及硬化物的制造方法