TW202132036A - High-temperature environment processing device and method for hard and brittle plate including at least one optical processing device, a processing cavity, at least a pair of positive pressure generator and negative pressure generator and at least a pair of heating devices - Google Patents
High-temperature environment processing device and method for hard and brittle plate including at least one optical processing device, a processing cavity, at least a pair of positive pressure generator and negative pressure generator and at least a pair of heating devices Download PDFInfo
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- 230000003287 optical effect Effects 0.000 title claims abstract description 51
- 238000010438 heat treatment Methods 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 28
- 239000000463 material Substances 0.000 claims description 16
- 238000005452 bending Methods 0.000 claims description 13
- 230000005855 radiation Effects 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000010453 quartz Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims description 2
- 230000000630 rising effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 10
- 230000006378 damage Effects 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 239000000047 product Substances 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 238000003672 processing method Methods 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005485 electric heating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000005459 micromachining Methods 0.000 description 2
- 239000005304 optical glass Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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本發明係有關一種硬脆板材高溫環境加工裝置及方法,特別是用於硬脆板材工件加工,並於一加工腔體內以至少一氣屏區(Air curtains)隔離該光學加工裝置與硬脆板材工件高溫加工環境熱能之裝置及方法。 The present invention relates to a high-temperature environment processing device and method for hard and brittle plates, particularly for processing hard and brittle plate workpieces, and at least one air curtains in a processing cavity isolate the optical processing device from the hard and brittle plate workpieces Device and method for high temperature processing environment thermal energy.
按各式光學玻璃、藍寶石,石英玻璃…等等硬脆板材,廣泛應用於如新一代的智慧型手機、平板電腦、電儀表面板、顯示器玻璃面板、汽車儀表面板、手錶鏡面產品中,以提供智慧型手機、平板電腦、電儀表面板、顯示器玻璃面板、汽車儀表面板及手錶產品中之上、下、左及右四個方向的邊緣曲面顯示或觸控操作功能,然而,針對上述之各硬脆板材之加熱方式,習知以如雷射加工設備之光束來進行如切割、打孔、表面雕刻、蝕刻、拋光…等加工操作,以使該硬脆板材得以加工形成成品或半成品。 According to various hard and brittle plates such as optical glass, sapphire, quartz glass, etc., they are widely used in the new generation of smart phones, tablet computers, electric instrument panels, display glass panels, automobile instrument panels, and watch mirror products to provide Smart phones, tablet computers, electric instrument panels, display glass panels, automotive instrument panels and watch products have four directions of upper, lower, left and right edge curved display or touch operation functions. However, for the above-mentioned hardware The heating method of the brittle sheet is conventionally used to perform processing operations such as cutting, perforating, surface engraving, etching, polishing, etc. with the beam of a laser processing equipment, so that the hard and brittle sheet can be processed into finished or semi-finished products.
但以上述習知的硬脆板材加工方式,由於如各式光學玻璃、藍寶石、石英等硬脆板材材料本身對於溫度遽昇變化相當敏感,如該硬脆板材在平常室溫溫度下,以上述的雷射高溫光束瞬間射向該硬脆板材之硬脆板材工件表面進行加工,將使該硬脆板材工件表面瞬間局部溫度被改變遽昇,致使該硬脆板材之表面有碎裂或破損之問題,因而致使該硬脆板材之表面加工品質大受影響,並使得該硬脆板材之加工良率大幅降低,實乃目前硬脆板材加工所極待解決之課題。 However, with the above-mentioned conventional hard and brittle plate processing methods, because the hard and brittle plate materials such as various optical glass, sapphire, quartz, etc. are very sensitive to temperature changes, such as the hard and brittle plate at normal room temperature, the above-mentioned The laser high-temperature beam of the laser beam is instantly directed to the surface of the hard and brittle plate workpiece for processing, which will cause the surface of the hard and brittle plate workpiece to be instantly changed and the local temperature rises rapidly, causing the surface of the hard and brittle plate to be cracked or damaged. As a result, the surface processing quality of the hard and brittle sheet material is greatly affected, and the processing yield of the hard and brittle sheet material is greatly reduced. This is a problem that needs to be solved in the current hard and brittle sheet material processing.
另外,如考慮將該硬脆板材表面先加熱至較高之溫度環境,例如:攝氏400℃以上,使得該高溫雷射加工光束再於對硬脆板材表面實施加工時,得以讓該硬脆板材之表面不會因瞬間溫差遽昇而有破裂或碎裂之問題,但如此一來,將使該硬脆板材的高溫加工環境熱量及雷射加工設備之雷射光束加工溫度之熱量因熱對流上昇至該雷射加工設備之終端鏡片, 例如:最終端之聚焦透鏡,因而極易對該雷射加工設備之終端鏡片造成高溫損壞,致使該雷射加工設備的終端鏡片受損,而讓該雷射加工設備無法使用於將硬脆板材加熱之高溫環境中進行加工。 In addition, if it is considered that the surface of the hard and brittle plate is heated to a higher temperature environment, for example: above 400°C, the high-temperature laser processing beam can be used to process the surface of the hard and brittle plate. The surface will not be cracked or chipped due to the instantaneous temperature difference, but in this way, the heat of the high-temperature processing environment of the hard and brittle sheet and the heat of the laser beam processing temperature of the laser processing equipment will be caused by thermal convection. Up to the final lens of the laser processing equipment, For example: the most terminal focusing lens, so it is easy to cause high temperature damage to the terminal lens of the laser processing equipment, resulting in damage to the terminal lens of the laser processing equipment, and the laser processing equipment cannot be used for hard and brittle plates Processing in a heated high temperature environment.
另外,在先前的相關專利技術文獻方面,如中華民國專利公開公報第M461498號「雷射切割機之工件壓抵裝置」新型專利案,則揭示該雷射頭設有輸出端,且於該輸出端設有具穿槽之端座,並由該端座之穿槽射出雷射光束,以供切割工件,另於該端座之穿槽周圍設有噴氣結構,以供噴出氣體,並於雷射光束之周圍形成壓抵工件之氣幕,亦即該專利前案必需大幅改造該雷射頭設備,無法適用於現有之雷射加工設備使用,因而大幅侷限其應用範疇及產業利用效益,並且,仍存有該工件如為硬脆板材時,由於雷射光束瞬間投射於工件表面的高溫溫昇遽變而使該硬脆板材工件有因碎裂或破損之問題與缺點,另外,該噴氣結構於雷射頭之雷射光束周圍形成壓抵工件之氣幕,其影響體積與範圍太小,並不適用於工件加熱至攝400℃以上之高溫工作環境中,無法有效阻絕及隔離如工件加工高溫環境之熱對流熱能及對該雷射頭鏡片的高溫熱能,按目前工業應用之雷射系統光學透鏡及其鍍膜,耐溫能力均小於攝氏300℃,仍會使該雷射頭的鏡片因而受損損壞。 In addition, in the previous related patent technical documents, such as the Republic of China Patent Publication No. M461498 "Workpiece pressing device of laser cutting machine" new patent case, it is disclosed that the laser head is provided with an output terminal, and the output is The end is provided with an end seat with a through groove, and the laser beam is emitted from the through groove of the end seat for cutting workpieces. In addition, an air jet structure is provided around the through groove of the end seat for ejecting gas and spraying on the mine. An air curtain is formed around the beam to press against the workpiece, that is, the previous patent case requires a major modification of the laser head equipment, which is not suitable for the use of existing laser processing equipment, which greatly limits its application scope and industrial utilization benefits, and , When the workpiece is a hard and brittle plate, because the high temperature rise of the laser beam instantly projected on the surface of the workpiece, the hard and brittle plate workpiece has problems and shortcomings due to chipping or damage. In addition, the jet The structure forms an air curtain against the workpiece around the laser beam of the laser head. The volume and range of its influence are too small. It is not suitable for the workpiece heated to a high temperature working environment above 400℃, and it cannot effectively block and isolate the workpiece. The thermal convection heat energy of processing high temperature environment and the high temperature heat energy of the laser lens, according to the current industrial application of laser system optical lens and its coating, the temperature resistance is less than 300 ℃, which will still make the laser head The lens is damaged and damaged.
此外,再如美國發明專利第US8288684號「Laser micro-machining system with post-scan lens deflection(具掃瞄透鏡後偏轉之雷射微加工系統)」案,則揭示一種利用一鏡面,其定位於該掃描透鏡與該工件之間且相對於該工作表面而傾斜以將該雷射脈衝反射朝向該工件,以使得該雷射脈衝相關於該工作表面以90度角撞擊該鏡面,且以相關於該工作表面之一經修改攻角反射朝向該工作表面的技術,但同樣地,此種習知的雷射微加工系統亦無法應用於上述之硬脆板材的高溫環境加工中,因該透鏡組件同樣會受到硬脆板材高溫加工環境之熱能影響而損壞,而仍然存在上述習知雷射加工系統使用於硬脆板材高溫加工環境所產生之終端鏡組會受到高溫熱對流熱能損壞之問題及缺點。 In addition, another example of the US Invention Patent No. US8288684 "Laser micro-machining system with post-scan lens deflection" case discloses the use of a mirror surface positioned on the The scanning lens and the workpiece are inclined with respect to the working surface to reflect the laser pulse toward the workpiece, so that the laser pulse impacts the mirror surface at a 90 degree angle relative to the working surface and is related to the work surface. One of the working surfaces is modified to reflect the angle of attack technology towards the working surface, but likewise, this conventional laser micromachining system cannot be applied to the high-temperature processing of the above-mentioned hard and brittle plates, because the lens assembly will also It is damaged by the heat energy of the high-temperature processing environment of hard and brittle plates, but there are still problems and shortcomings that the terminal lens assembly produced by the above-mentioned conventional laser processing system used in the high-temperature processing environment of hard and brittle plates will be damaged by high-temperature heat convection heat.
上述習知或各專利前案中之雷射加工系統或光學加工系統 在於高溫工作環境中,存在所產生高溫熱能損壞該雷射加工或光學加工系統之終端鏡組元件之問題及缺點。 The laser processing system or optical processing system in the above-mentioned prior art or each patent In a high-temperature working environment, there are problems and shortcomings that the high-temperature heat generated damages the terminal lens assembly components of the laser processing or optical processing system.
緣此,本發明之一種硬脆板材高溫環境加工裝置,係包含:至少一光學加工裝置,該光學加工裝置前端設有至少一終端鏡片組,該光學加工裝置可透過該終端鏡片組後產生至少一加工光束;一加工腔體,該加工腔體週緣設有至少一開口,以供該光學加工裝置之終端鏡片組納入,於該加工腔體前半部週邊分別設有至少一對正壓輸入口及負壓輸出口,該加工腔體內之後半部並供至少一硬脆板材工件容置;至少一對正壓產生器及負壓產生器,該正壓產生器對應連結於該加工腔體之正壓輸入口,以輸入正壓氣壓至該加工腔體內,該負壓產生器對應連結於該加工腔體之負壓輸出口,以吸出該正壓產生器輸入加工腔體中之正壓氣壓,以使該加工腔體內之前半部形成至少一氣屏區(Air curtains);以及至少一對加熱裝置,分別設置於該加工腔體後半部週緣,以對該加工腔體內部及該硬脆板材工件進行加熱至攝氏400℃至該硬脆板材工件之材料軟化點高溫溫度,以使該光學加工裝置之加工光束透過該正壓產生器及負壓產生器於加工腔體內前半部所形成之氣屏區,以向該處於高溫溫度環境之硬脆板材工件進行加工。 For this reason, a high-temperature environment processing device for hard and brittle plates of the present invention includes: at least one optical processing device, the front end of the optical processing device is provided with at least one terminal lens group, and the optical processing device can produce at least A processing beam; a processing cavity, the periphery of the processing cavity is provided with at least one opening for the terminal lens assembly of the optical processing device to receive, and at least a pair of positive pressure input ports are respectively provided on the periphery of the front half of the processing cavity And a negative pressure output port, the back half of the processing cavity is provided for at least one hard and brittle plate workpiece to be accommodated; at least a pair of positive pressure generators and negative pressure generators, the positive pressure generators are correspondingly connected to the processing cavity The positive pressure input port is used to input positive pressure air pressure into the processing cavity, and the negative pressure generator is correspondingly connected to the negative pressure output port of the processing cavity to suck out the positive pressure air pressure input into the processing cavity by the positive pressure generator , So that at least one air curtains are formed in the front half of the processing cavity; and at least a pair of heating devices are respectively arranged on the periphery of the rear half of the processing cavity to control the inside of the processing cavity and the hard and brittle plate The workpiece is heated to 400°C to the high temperature of the material softening point of the hard and brittle plate workpiece, so that the processing beam of the optical processing device passes through the gas formed by the positive pressure generator and the negative pressure generator in the front half of the processing cavity The screen area is used to process the hard and brittle plate workpiece in the high temperature environment.
進一步地,上述本發明之硬脆板材高溫環境加工裝置,其中,該光學加工裝置為一雷射加工設備所構成。 Further, in the high-temperature environment processing device for hard and brittle plates of the present invention, the optical processing device is constituted by a laser processing equipment.
上述本發明之硬脆板材高溫環境加工裝置,其中,該光學加工裝置為一遠紅外線加工設備所構成。 In the above-mentioned hard and brittle board high-temperature environment processing device of the present invention, the optical processing device is constituted by a far-infrared processing equipment.
上述本發明之硬脆板材高溫環境加工裝置,其中,該終端鏡片組為至少一透鏡所構成。 In the above-mentioned hard and brittle board high-temperature environment processing device of the present invention, the terminal lens group is composed of at least one lens.
上述本發明之硬脆板材高溫環境加工裝置,其中,該終端鏡片組為至少一異形多凸點透鏡所構成。 In the above-mentioned hard and brittle board high-temperature environment processing device of the present invention, the terminal lens group is composed of at least one irregular-shaped multi-convex lens.
上述本發明之硬脆板材高溫環境加工裝置,其中,該終端鏡片組為多個複合透鏡所構成。 In the above-mentioned hard and brittle board high-temperature environment processing device of the present invention, the terminal lens group is composed of a plurality of compound lenses.
上述本發明之硬脆板材高溫環境加工裝置,其中,該加工腔體內後半部所容置之硬脆板材工件為一玻璃所構成。 In the above-mentioned hard and brittle plate high-temperature environment processing device of the present invention, the hard and brittle plate work piece contained in the rear half of the processing cavity is made of glass.
上述本發明之硬脆板材高溫環境加工裝置,其中,該加工腔體內後半部所容置之硬脆板材工件為一藍寶石玻璃所構成。 In the above-mentioned hard and brittle plate high-temperature environment processing device of the present invention, the hard and brittle plate workpiece contained in the rear half of the processing cavity is composed of a sapphire glass.
上述本發明之硬脆板材高溫環境加工裝置,其中,該加工腔體內後半部所容置之硬脆板材工件為一石英所構成。 In the above-mentioned hard and brittle plate high-temperature environment processing device of the present invention, the hard and brittle plate work piece contained in the rear half of the processing cavity is made of quartz.
上述本發明之硬脆板材高溫環境加工裝置,其中,該加工腔體內之硬脆板材工件底面結合至少一工作平台。 The above-mentioned hard and brittle plate high-temperature environment processing device of the present invention, wherein the bottom surface of the hard and brittle plate workpiece in the processing cavity is combined with at least one working platform.
上述本發明之硬脆板材高溫環境加工裝置,其中,該加工腔體內之硬脆板材工件底面結合之工作平台為一多軸移動平台構成。 The above-mentioned hard and brittle plate high temperature environment processing device of the present invention, wherein the working platform combined with the bottom surface of the hard and brittle plate work piece in the processing cavity is formed by a multi-axis moving platform.
上述本發明之硬脆板材高溫環境加工裝置,其中,該加工腔體內之硬脆板材工件底面結合之工作平台為一彎折治具所構成。 In the above-mentioned hard and brittle plate high-temperature environment processing device of the present invention, wherein the working platform combined with the bottom surface of the hard and brittle plate work piece in the processing cavity is constituted by a bending jig.
上述本發明之硬脆板材高溫環境加工裝置,其中,該加工腔體外部設有至少一活動門,該活動門藉由開啟、關閉,供至少一熱輻射加熱裝置進、出該加工腔體內部,並藉由該熱輻射加熱裝置對該加工腔體內之硬脆板材工件以中紅外線到遠紅外線間之波長進行預先加熱至攝氏400℃至該硬脆板材工件之材料軟化點高溫溫度。 The above-mentioned hard and brittle plate high-temperature environment processing device of the present invention, wherein at least one movable door is provided outside the processing cavity, and the movable door is opened and closed to allow at least one heat radiation heating device to enter and exit the processing cavity , And pre-heat the hard and brittle plate work piece in the processing cavity with a wavelength between mid-infrared to far-infrared rays by the thermal radiation heating device to a high temperature of 400°C to the material softening point of the hard and brittle plate work piece.
上述本發明之硬脆板材高溫環境加工裝置,其中,該正壓產生器為一空壓機所構成。 In the high-temperature environment processing device for hard and brittle plates of the present invention, the positive pressure generator is constituted by an air compressor.
上述本發明之硬脆板材高溫環境加工裝置,其中,該負壓產生器為一抽氣設備所構成。 In the high-temperature environment processing device for hard and brittle plates of the present invention, the negative pressure generator is constituted by an air extraction device.
上述本發明之硬脆板材高溫環境加工裝置,其中,該加熱裝置為一電熱裝置所構成。 In the above-mentioned hard and brittle plate high-temperature environment processing device of the present invention, the heating device is constituted by an electric heating device.
上述本發明之硬脆板材高溫環境加工裝置,其中,該加熱裝置連結至少一溫度控制電路,以控制該加熱裝置之加熱溫度。 In the above-mentioned device for processing hard and brittle plates in a high-temperature environment of the present invention, the heating device is connected to at least one temperature control circuit to control the heating temperature of the heating device.
上述本發明之硬脆板材高溫環境加工裝置,其中,該加工腔體內之後半部設有至少一第一反射鏡及第二反射鏡,該第一反射鏡及第二反射鏡相互呈九十度位置之配置,以藉該第一反射鏡反射該光學加工裝置之加工光束至該第二反射鏡,再由該第二反射鏡將加工光束反射至該加工腔體內後半部之硬脆材料工件進行加工。 The above-mentioned hard and brittle plate high-temperature environment processing device of the present invention, wherein the rear half of the processing cavity is provided with at least one first reflector and a second reflector, and the first reflector and the second reflector are 90 degrees to each other The position is arranged so that the processing beam of the optical processing device is reflected by the first reflector to the second reflector, and then the processing beam is reflected by the second reflector to the hard and brittle material workpiece in the second half of the processing cavity. Processing.
上述本發明之硬脆板材高溫環境加工裝置,其中,該加工腔 體內後半部之該第一反射鏡及第二反射鏡為一金屬反射鏡所構成。 The above-mentioned hard and brittle plate high temperature environment processing device of the present invention, wherein the processing cavity The first reflector and the second reflector in the back half of the body are composed of a metal reflector.
上述本發明之硬脆板材高溫環境加工裝置,其中,該加工腔體內後半部之該第一反射鏡及第二反射鏡上分別結合至少一水冷散熱裝置。 The above-mentioned hard and brittle board high-temperature environment processing device of the present invention, wherein the first reflector and the second reflector in the rear half of the processing cavity are respectively combined with at least one water-cooled heat dissipation device.
上述本發明之硬脆板材高溫環境加工裝置,其中,該加工腔體內後半部之該第一反射鏡及第二反射鏡上分別結合有至少一第一偏轉驅動器及第二偏轉驅動器,以分別由該第一偏轉驅動器及第二偏轉驅動器控制該第一反射鏡及第二反射鏡之偏轉及反射角度。 The above-mentioned hard and brittle plate high temperature environment processing device of the present invention, wherein the first mirror and the second mirror in the rear half of the processing cavity are respectively combined with at least a first deflection driver and a second deflection driver, so as to be respectively The first deflection driver and the second deflection driver control the deflection and reflection angles of the first mirror and the second mirror.
上述本發明之硬脆板材高溫環境加工裝置,其中,該加工腔體內後半部之該第一反射鏡及第二反射鏡上所結合之第一偏轉驅動器及第二偏轉驅動器係設置於該加工腔體外部。 The above-mentioned hard and brittle plate high-temperature environment processing device of the present invention, wherein the first deflection driver and the second deflection driver combined on the first reflector and the second reflector in the rear half of the processing cavity are arranged in the processing cavity Outside the body.
上述本發明之硬脆板材高溫環境加工裝置,其中,該加工腔體內後半部之該第一反射鏡及第二反射鏡上所結合之第一偏轉驅動器及第二偏轉驅動器為一馬達所構成。 In the above-mentioned hard and brittle plate high-temperature environment processing device of the present invention, the first deflection driver and the second deflection driver combined on the first mirror and the second mirror in the rear half of the processing cavity are formed by a motor.
一種硬脆板材高溫環境加工方法,其步驟係包含: A method for processing hard and brittle plates in a high-temperature environment, the steps of which include:
(a)於一加工腔體內形成至少一氣屏區,即藉由至少一對正壓產生器及負壓產生器分別結合於一內部容置一硬脆板料工件之加工腔體之前半部週緣,以分別對該加工腔體內之前半部進行正氣壓輸入及負氣壓輸出,以使該加工腔體前半部形成至少一氣屏區; (a) At least one air shield area is formed in a processing cavity, that is, at least a pair of positive pressure generators and negative pressure generators are respectively combined with the front half of the periphery of a processing cavity that houses a hard and brittle sheet material. , To respectively perform positive air pressure input and negative air pressure output on the front half of the processing cavity, so that at least one air shield area is formed in the front half of the processing cavity;
(b)加工腔體內及硬脆板材工件加熱至高溫環境,即對該步驟(a)之加工腔體內之後半部及該硬脆板材工件,以結合在該加工腔體後半部週緣之至少一對加熱裝置予以加熱該硬脆板材工件到攝氏400℃至軟化點之間的溫度,以讓該加工腔體後半部及硬脆板材工件形成高溫溫度環境; (b) The processing cavity and the hard and brittle plate workpiece are heated to a high temperature environment, that is, the rear half of the processing cavity in step (a) and the hard and brittle plate workpiece are combined with at least one of the periphery of the rear half of the processing cavity The heating device heats the hard and brittle plate work piece to a temperature between 400°C and the softening point, so that the second half of the processing cavity and the hard and brittle plate work piece form a high temperature environment;
(c)加工光束穿過氣屏區,即藉由至少一光學加工裝置及該光學加裝置前端之至少一終端鏡片組件結合於該步驟(a)之加工腔體前半部,以藉由該光學加工裝置透過該終端鏡片組所產生之加工光束穿過該氣屏區而射向加工腔體內之硬脆板材工件;以及 (c) The processing beam passes through the air shield area, that is, at least one optical processing device and at least one terminal lens component at the front end of the optical processing device are combined with the front half of the processing cavity of step (a), so that the optical processing device The processing light beam generated by the processing device through the terminal lens group passes through the air shield area and is directed to the hard and brittle plate workpiece in the processing cavity; and
(d)進行硬脆板材工件之高溫環境下加工,即透過步驟(b)之加工腔體內及硬脆板材工件加熱至高溫環境及步驟(c)之加工光束穿過氣屏區步驟,使該 容置於加工腔體內之硬脆板材工件可受該光學加工裝置於高溫環境下進行加工。 (d) Process hard and brittle plate workpieces in a high temperature environment, that is, through the processing cavity of step (b) and the hard and brittle plate workpieces heated to a high temperature environment and the step of processing beams of step (c) through the air shield area, the The hard and brittle plate workpiece contained in the processing cavity can be processed by the optical processing device in a high temperature environment.
進一步,上述本發明之硬脆板材高溫環境加工方法,其中,該步驟(a)之加工腔體中之氣屏區係在於1大氣壓力條件下形成。 Furthermore, in the high-temperature environment processing method of the hard and brittle sheet of the present invention, the gas barrier area in the processing cavity of the step (a) is formed under the condition of 1 atmospheric pressure.
上述本發明之硬脆板材高溫環境加工方法,其中,該步驟(b)之該步驟(b)之加工腔體內及硬脆板材工件加熱至高溫環境之加工腔體可透過至少一可移進及移出之移動式之熱輻射加熱裝置,以近紅外線到遠紅外線間之波長照射該硬脆板材工件,以加熱該硬脆板材工件至攝氏400℃至軟化點之間的溫度。 The above-mentioned method for processing hard and brittle plates in a high-temperature environment of the present invention, wherein the processing cavity in the step (b) of the step (b) and the processing cavity of the hard and brittle plate workpiece heated to a high temperature environment can be moved through at least one The removed mobile thermal radiation heating device irradiates the hard and brittle plate work with a wavelength between near infrared and far infrared to heat the hard and brittle plate work to a temperature between 400°C and its softening point.
上述本發明之硬脆板材高溫環境加工方法,其中,該步驟(d)之進行硬脆板材工件之高溫環境下加工之硬脆板材工件之加工溫度為攝氏500℃~900℃之溫度。 In the above-mentioned method for processing hard and brittle plates in a high temperature environment of the present invention, the processing temperature of the hard and brittle plate workpieces processed in a high temperature environment of the hard and brittle plate workpieces in the step (d) is a temperature of 500°C to 900°C.
本發明之硬脆板材高溫環境加工裝置及方法功效,係在於藉由該加工腔體之前半部形成氣屏區,以隔離該光學加工裝置之終端鏡片組與該加工腔體後半部及硬脆板材工件之高溫環境區域,讓該光學加工裝置所發出之加工光束得以穿過該氣屏區再對該硬脆板材工件進行如切割、打孔、拋光、研磨、表面雕刻、蝕刻…等等加工,可以讓該硬脆板材工件在於高溫環境下進行加工,而讓該硬脆板材工件絕不會有任何因溫度由常溫劇昇而產生之碎裂或破損之情況產生,另外,並可藉由該氣屏區有效隔離該光學加工裝置之終端鏡片組及加工腔體後半部及硬脆板材工件之高溫環境之熱對流熱能,使該光學加工裝置之終端鏡片組被有效保護,不會受到任何溫昇或熱對流熱能之侵入破壞,可以確保該硬脆板材工件之加工穩定性及加工品質,進一步提昇本發明之產業利用價值及經濟效益。 The effect of the high-temperature environment processing device and method for hard and brittle plates of the present invention is that the front half of the processing cavity forms an air shield area to isolate the terminal lens group of the optical processing device from the rear half of the processing cavity and the hard and brittle The high-temperature environment area of the plate workpiece allows the processing beam emitted by the optical processing device to pass through the air shield area and then perform processing such as cutting, drilling, polishing, grinding, surface engraving, etching, etc. on the hard and brittle plate workpiece , The hard and brittle plate workpiece can be processed in a high temperature environment, and the hard and brittle plate workpiece will never have any chipping or damage caused by the temperature rise from room temperature. In addition, it can be processed by The air shield area effectively isolates the terminal lens group of the optical processing device and the back half of the processing cavity and the thermal convection heat of the high temperature environment of the hard and brittle plate workpiece, so that the terminal lens group of the optical processing device is effectively protected from any The intrusion and destruction of temperature rise or heat convection heat energy can ensure the processing stability and processing quality of the hard and brittle plate workpiece, and further enhance the industrial utilization value and economic benefits of the present invention.
100:硬脆板材高溫環境加工裝置 100: High temperature environment processing device for hard and brittle plates
10:光學加工裝置 10: Optical processing device
11:終端鏡片組 11: Final lens group
11’:終端鏡片組 11’: Terminal lens group
11A:終端鏡片組 11A: Final lens group
12:加工光束 12: Processing beam
12’:加工光束 12’: Processing beam
12A:加工光束 12A: Processing beam
20:加工腔體 20: Machining cavity
21:開口 21: opening
22:正壓輸入口 22: Positive pressure input port
23:負壓輸出口 23: Negative pressure output port
24:第一反射鏡 24: The first mirror
25:第二反射鏡 25: second mirror
26:水冷散熱裝置 26: Water cooling device
27:第一偏轉驅動器 27: The first deflection driver
28:第二偏轉驅動器 28: The second deflection driver
30:正壓產生器 30: Positive pressure generator
40:負壓產生器 40: negative pressure generator
50:加熱裝置 50: heating device
200:硬脆板材工件 200: Hard and brittle plate workpiece
210:工作平台 210: work platform
210’:工作平台 210’: work platform
300:加工成品 300: finished product
400:於一加工腔體內形成至少一氣屏區 400: At least one air shield area is formed in a processing cavity
410:加工腔體內及硬脆板材工件加熱至高溫環境 410: The processing cavity and hard and brittle plate workpieces are heated to a high temperature environment
420:加工光束穿過氣屏區 420: The processing beam passes through the air screen area
430:進行硬脆板材工件之高溫環境下加工 430: Processing of hard and brittle plate workpieces under high temperature environment
X:氣屏區 X: Air screen area
51:溫度控制電路 51: temperature control circuit
29:活動門 29: movable door
60:熱輻射加熱裝置 60: Thermal radiation heating device
220:垂直輔助加速器 220: Vertical auxiliary accelerator
第一圖為本發明之硬脆板材高溫環境加工裝置的第一實施例圖; The first figure is a diagram of the first embodiment of the apparatus for processing hard and brittle plates in a high-temperature environment according to the present invention;
第二圖為本發明之硬脆板材高溫環境加工裝置的第二實施例圖; The second figure is a diagram of the second embodiment of the apparatus for processing hard and brittle plates in a high-temperature environment according to the present invention;
第三圖為本發明之硬脆板材高溫環境加工裝置的第三實施例圖; The third figure is a diagram of the third embodiment of the device for processing hard and brittle plates in a high-temperature environment according to the present invention;
第四圖為本發明之硬脆板材高溫環境加工裝置的第四實施例圖; The fourth figure is a diagram of the fourth embodiment of the high-temperature environment processing device for hard and brittle plates of the present invention;
第五圖為本發明之硬脆板材高溫環境加工裝置的第五實施例圖; The fifth figure is a diagram of the fifth embodiment of the apparatus for processing hard and brittle plates in a high-temperature environment according to the present invention;
第六圖為本發明之硬脆板材高溫環境加工裝置的第六實施例圖; The sixth figure is a diagram of the sixth embodiment of the apparatus for processing hard and brittle plates in a high-temperature environment according to the present invention;
第七圖為本發明之硬脆板材高溫環境加工裝置的第七實施例圖; The seventh figure is a figure of the seventh embodiment of the high-temperature environment processing device for hard and brittle plates of the present invention;
第八圖係為第七圖中之活動門開啟,使該熱輻射加熱裝置移出加工腔體之示意圖; Figure 8 is a schematic diagram of the movable door in Figure 7 being opened to move the heat radiation heating device out of the processing cavity;
第九圖係為第七圖中之加工腔體內部之硬脆板材工件經熱輻射加熱裝置加溫為高溫環境後進行正式加工之示意圖; The ninth figure is a schematic diagram of the hard and brittle plate workpiece in the processing cavity in the seventh figure after being heated to a high temperature environment by a thermal radiation heating device;
第十圖為本發明之硬脆板材高溫環境加工裝置的較佳應用例圖; The tenth figure is a diagram of a preferred application example of the high-temperature environment processing device for hard and brittle plates of the present invention;
第十一圖為第十圖之硬脆板材高溫環境加工裝置中的硬脆板材工件之加工成品示意圖; Figure 11 is a schematic diagram of the finished product of the hard and brittle plate workpiece in the hard and brittle plate high-temperature environment processing device in Figure 10;
第十二圖為本發明之硬脆板材高溫環境加工方法的流程圖。 Figure 12 is a flow chart of the method for processing hard and brittle plates in a high-temperature environment of the present invention.
首先請參閱第一圖所示,為本發明之硬脆板材高溫環境加工裝置100之第一實施例,該硬脆板材高溫環境加工裝置100係包含至少一光學加工裝置10,其型式不限,在本發明中係列舉以雷射加工設備、遠紅外線加工設備為例,並且,該光學加工裝置10前端設有至少一終端鏡片組11,該光學加工裝置10可透過該終端鏡片組11後產生至少一加工光束12,該終端鏡片組11之型式不限,在本發明第一實施例中,係列舉以至少一透鏡構成為例。
First, please refer to the first figure, which is the first embodiment of the high-temperature
一加工腔體20,週緣設有至少一開口21,以供該光學加工裝置10之終端鏡片組11納入,於該加工腔體20前半部週邊分別設有至少一對正壓輸入口22及負壓輸出口23,且該正壓輸入口22及負壓輸出口23之排列方式不限,在本發明中係列舉該正壓輸入口22設於負壓輸入口23之上方,該加工腔體20內之後半部並供至少一硬脆板材工件200容置,該硬脆板材工件200之型式不限,在本發明中係列舉該硬脆板材工件200為玻
璃、藍寶石玻璃、石英構成為例,該硬脆板材工件200底部結合至少一工作平台210,該工作平台210之型式不限,在本發明之第一實施例中係列舉為一多軸移動平台構成為例,可帶動該硬脆板材工件200進行多軸移動。
A
至少一對正壓產生器30及負壓產生器40,該正壓產生器30對應連結於該加工腔體20之正壓輸入口22,以輸入正壓氣壓至該加工腔體20內,該負壓產生器40對應連結於該加工腔體之負壓輸出口23,以吸出該正壓產生器30輸入加工腔體中之正壓氣壓(如第一圖中之箭頭方向所示),以使該加工腔體內之前半部形成至少一氣屏區X,該正壓產生器30之型式不限,在本發明中係以一空壓機構成為例,並且,該負壓產生器40之型式不限,在本發明中係以一抽氣設備為例。
At least a pair of
至少一對加熱裝置50,分別設置於該加工腔體20後半部週緣,以對該加工腔體20內部及該硬脆板材工件200進行加熱至攝氏400℃至該硬脆板材工件200之材料軟化點高溫溫度,該軟化點之溫度不限,在本發明中係列舉500℃為例,以使該光學加工裝置10之加工光束12透過該正壓產生器30及負壓產生器40於加工腔體20內前半部所形成之氣屏區X,以向該處於高溫溫度環境之硬脆板材工件200進行如切割、打孔、拋光、研磨、表面雕刻、蝕刻…等等加工,該硬脆板材工件200之加工溫度為攝氏500℃~900℃之溫度,該加熱裝置50之型式不限,在發明中係列舉以一電熱裝置構成為例,並且,該加熱裝置50連結至少一溫度控制電路51,以藉由該溫度控制電路51控制該加熱裝置50之加熱溫度。
At least a pair of
請再配合第二圖所示,為本發明之硬脆板材高溫環境加工裝置100之第二實施例,其中,係顯示該終端鏡片組11’為至少一異形多凸點透鏡構成為例,可使該加工光束12’為多焦光束之型態,而穿過該氣屏區X,以對該加工腔體20內後半部之高溫環境的硬脆板材工件200進行加工。
Please cooperate with the second figure, which is the second embodiment of the hard and brittle plate high-temperature
請再參考第三圖所示,為本發明之硬脆板材高溫環境加工裝置100之第三實施例,其中,係顯示該終端鏡片組11A為多個複合透鏡構成為例,可使該加工光束12A為單焦光束之型態,而穿過該氣屏區X,以對該加工腔體20內後半部之高溫環境的硬脆板材工件200進行加工。
Please refer to the third figure again, which is the third embodiment of the high-temperature
請再配合第四圖所示,為本發明之硬脆板材高溫環境加工裝置100之第四實施例,其中,係顯示該終端鏡片組11為至少一透鏡構成為例,並且,該加工腔體20內之後半部設有至少一第一反射鏡24及第二反射鏡25,該第一反射鏡24及第二反射鏡25之型式不限,在本發明中係列舉以一金屬反射鏡構成為例,且該第一反射鏡24及第二反射鏡25相互呈九十度位置之配置,以藉該第一反射鏡24反射該光學加工裝置10之加工光束12至該第二反射鏡25,再由該第二反射鏡25將加工光束12反射至該加工腔體20內後半部之硬脆材料工件200進行加工,該第一反射鏡24及第二反射鏡25上分別結合至少一水冷散熱裝置26,可分別提供該第一反射鏡24及第二反射鏡25散熱之用,並且,該第一反射鏡24及第二反射鏡25上分別結合有至少一第一偏轉驅動器27及第二偏轉驅動器28,以分別由該第一偏轉驅動器27及第二偏轉驅動器28控制該第一反射鏡24及第二反射鏡25之偏轉及反射角度,該第一偏轉驅動器27及第二偏轉驅動器28係設置於該加工腔體20外部,且該第一偏轉驅動器27及第二偏轉驅動器28之型式不限,在本發明中係列舉以一馬達構成為例,亦即在此第四實施例中顯示使該加工腔體20後半部之硬脆板材工件200及工作平台210可以保持不動之狀態,而僅需由該第一偏轉驅動器27及第二偏轉驅動器28控制該第一反射鏡24及第二反射鏡25之偏轉量及反射角度,即可讓該加工光束12得以移動涵蓋整個硬脆板材工件200之範圍進行加工。
Please cooperate with the fourth figure, which is the fourth embodiment of the hard and brittle plate high-temperature
請再參閱第五圖所示,為本發明之硬脆板材高溫環境加工裝置100之第五實施例,其中,係顯示與第四圖不同之處為終端鏡片組11’為至少一異形多凸點透鏡構成為例,可使該加工光束12’為多焦光束之型態,同樣地,可藉由該加工腔體20後半部之硬脆板材工件200及工作平台210保持不動之狀態,而僅需由該第一偏轉驅動器27及第二偏轉驅動器28控制該第一反射鏡24及第二反射鏡25之偏轉量及反射角度,即可讓該加工光束12’得以移動涵蓋整個硬脆板材工件200之範圍進行加工。
Please refer to the fifth figure again, which is the fifth embodiment of the high-temperature
請再配合第六圖所示,為本發明之硬脆板材高溫環境加工裝置100之第六實施例,其中,係顯示與第四圖不同之處為終端鏡片組11A為多個複合透鏡所構成為例,可使該加工光束12A為單焦光束之型態,同
樣地,可藉由該加工腔體20後半部之硬脆板材工件200及工作平台210保持不動之狀態,而僅需由該第一偏轉驅動器27及第二偏轉驅動器28控制該第一反射鏡24及第二反射鏡25之偏轉量及反射角度,即可讓該加工光束12A得以移動涵蓋整個硬脆板材工件200之範圍進行加工為多焦光束之型態,而穿過該氣屏區X,以對該加工腔體20內後半部之高溫環境的硬脆板材工件200進行加工。
Please cooperate with the sixth figure, which is the sixth embodiment of the hard and brittle plate high-temperature
請再參閱第七圖、第八圖及第九圖所示,第七圖為本發明之硬脆板材高溫環境加工裝置100之第七應用例,其中,與該第一圖所示之第一實施例之差異之處,係在於該加工腔體20外部設有至少一活動門29,該活動門29藉由開啟、關閉(如第七圖及第八圖所示),供至少一熱輻射加熱裝置60進、出該加工腔體20內部,並藉由該熱輻射加熱裝置60對該加工腔體20內之硬脆板材工件200以中紅外線到遠紅外線間之波長進行預先加熱至上述加熱至攝氏400℃至該硬脆板材工件200之材料軟化點高溫溫度,再將該熱輻射加熱裝置60經由該開啟之活動門29移出至該加工腔體20外部(如第八圖所示),再關閉該活動門29後,再行由該光學加工裝置10發出之加工光束12穿過該氣屏區X,以對該加工腔體20內後半部之高溫環境的硬脆板材工件200進行加工(如第九圖所示),同樣可以達到如上所示之本發明之硬脆板材高溫環境加工裝置100的第一實施例~六實施例所示讓硬脆板材工件200於高溫環境下進行加工之功效。
Please refer to the seventh, eighth and ninth figures again. The seventh figure is the seventh application example of the hard and brittle plate high-temperature
請再參閱第十圖及第十一圖所示,第十圖為本發明之硬脆板材高溫環境加工裝置100之較佳應用例,其中,顯示該終端鏡片組11’為至少一異形多凸點透鏡構成為例,可使該加工光束12’為多焦光束之型態,而穿過該氣屏區X,以對該加工腔體20內後半部之高溫環境的硬脆板材工件200進行加工,並且,該容納硬脆板材工件200之工作平台210’為一彎折治具所構成,即該硬脆板材工件200彎折加工之治具,並且,該工作平台210’底部結合至少一垂直輔助加速器220,可藉該上加工光束12’為多焦光束分別接觸該硬脆板材工件200四個週邊之彎折點部位予以加工,再藉由該垂直輔助加速器220上、下垂直加速運動(如第十圖中之上、下虛線箭頭方向所示),使該硬脆板材工件200之四個週邊部位受熱軟化後
加速彎曲下垂定型,以進一步讓該硬脆板材工件200最後形成一具立體週邊彎折的述之加工成品300(如第十一圖所示),可提供如智慧型手機之立體彎折觸控面板之用。
Please refer to the tenth and eleventh figures again. The tenth figure is a preferred application example of the hard and brittle plate high-temperature
上述第十圖及第十一圖所示之本發明之硬脆板材高溫環境加工裝置100之較佳應用例所揭示之硬脆板材工件200的四個週邊彎折部位加工方式,並不以上述第十圖及第十一圖所述以該彎折治具型態之工作平台210’與垂直輔助加速器220的輔助加速彎折型式為限,其他如以非接觸式的導引氣流方式(圖未顯示),諸如申請人前向我國申請核准公告在案之中華民國發明專利公告號碼:I660920號「非接觸成型裝置及方法」發明專利案之導引氣流非接觸彎折玻璃板材技術,亦可適用於上述第十圖及第十一圖所示之本發明之硬脆板材高溫環境加工裝置100之較佳應用例的硬脆板材工件200的四個週邊彎折部位加工方式之應用範疇。
The processing method of the four peripheral bending parts of the hard and
請再配合第十二圖所示,為本發明之硬脆板材高溫環境加工方法的流程圖,其步驟係包括步驟400~430,其中:
Please cooperate with Figure 12, which is a flowchart of the method for processing hard and brittle plates in a high temperature environment of the present invention. The steps include
(400)於一加工腔體內形成至少一氣屏區,即藉由該正壓產生器30及負壓產生器40分別結合於該內部容置一硬脆板料工件200之加工腔體20之前半部週緣,以分別對該加工腔體20內之前半部進行正氣壓輸入及負氣壓輸出,以使該加工腔體20前半部形成至少一氣屏區X;
(400) At least one air shield area is formed in a processing cavity, that is, the
(410)加工腔體內及硬脆板材工件加熱至高溫環境,即對該步驟(400)之加工腔體20內之後半部及該硬脆板材工件200,以結合在該加工腔體20後半部週緣之至少一對加熱裝置26予以加熱該硬脆板材工件200到攝氏400℃至軟化點之間的溫度,以讓該加工腔體20後半部及硬脆板材工件200形成高溫溫度環境;
(410) The processing cavity and the hard and brittle plate workpiece are heated to a high temperature environment, that is, the rear half of the
(420)加工光束穿過氣屏區,即藉由至少一光學加工裝置10及該光學加裝置10前端之至少一終端鏡片組件11結合於該步驟(400)之加工腔體20前半部,以藉由該光學加工裝置10透過該終端鏡片組11產生之加工光束12穿過該氣屏區X而射向加工腔體20內之硬脆板材工件200;以及
(420) The processing beam passes through the air shield area, that is, at least one
(430)進行硬脆板材工件之高溫環境下加工,即透過步驟(420)之加工腔體20內及硬脆板材工件200加熱至高溫環境及步驟(430)之加工光束12穿過氣屏
區X步驟,使該容置於加工腔體20內之硬脆板材工件200可受該光學加工裝置10於高溫環境下進行加工,該硬脆板材工件200之加工溫度為攝氏500℃~900℃之溫度。
(430) Process the hard and brittle plate workpiece in a high temperature environment, that is, through the
在以上第一圖~第十二圖所示本發明之硬脆板材高溫環境加工裝置及方法,其中所揭示的相關說明及圖式,係僅為便於闡明本發明的技術內容及技術手段,所揭示較佳實施例之一隅,並不而限制其範疇,並且,舉凡針對本發明之細部結構修飾或元件之等效替代修飾,皆不脫本發明之創作精神及範疇,其範圍將由以下的申請專利範圍來界定之。 The apparatus and method for processing hard and brittle plates in a high temperature environment of the present invention shown in Figures 1 to 12 above. The relevant descriptions and drawings disclosed therein are only for the convenience of elucidating the technical content and technical means of the present invention. Disclosure of one of the preferred embodiments does not limit its scope, and any detailed structural modification or element equivalent substitution modification for the present invention does not depart from the creative spirit and scope of the present invention. Its scope will be determined by the following application It is defined by the scope of patents.
100:硬脆板材高溫環境加工裝置 100: High temperature environment processing device for hard and brittle plates
10:光學加工裝置 10: Optical processing device
11:終端鏡片組 11: Final lens group
12:加工光束 12: Processing beam
20:加工腔體 20: Machining cavity
21:開口 21: opening
22:正壓輸入口 22: Positive pressure input port
23:負壓輸出口 23: Negative pressure output port
30:正壓產生器 30: Positive pressure generator
40:負壓產生器 40: negative pressure generator
50:加熱裝置 50: heating device
51:溫度控制電路 51: temperature control circuit
200:硬脆板材工件 200: Hard and brittle plate workpiece
210:工作平台 210: work platform
X:氣屏區 X: Air screen area
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