TW202120979A - An optical transmitting device and an optical transceiver module and an optical cable module - Google Patents

Abstract

The present invention provides an optical transmitting device, an optical transceiver module and an optical cable module. The optical transmitting device comprises a hermetic housing, a circuit board, an optical transmitter and at least one capacitor. The circuit board is disposed in the hermetic housing, and the optical transmitter is disposed on the circuit board, and the capacitor is electrically connected between inner leads of the optical transmitter and the circuit board. The optical transceiver module a substrate, at least one optical receiving device and the optical transmitting device. The optical cable module comprises an optical fiber cable and the optical transceiver module.

Description

Light emitting element, optical transceiver module and optical fiber cable module

The invention relates to the technical field of optical fiber communication, in particular to a light emitting element, an optical transceiver module and an optical fiber cable module.

In the application of optical fiber communication technology, the electrical signal needs to be converted into an optical signal through a light emitting element (such as a laser), and then the optical signal is coupled into the optical fiber that conducts the optical signal.

Traditional telecommunications transmission systems are gradually being replaced by optical fiber transmission systems. The optical fiber transmission system has the advantages of high-speed transmission, long transmission distance, and material immunity from electromagnetic wave interference because it does not have bandwidth limitations. Therefore, the current electronics industry is mostly researching and developing in the direction of optical fiber transmission.

However, in recent years, further miniaturization of optical modules such as optical transceivers has been required, so the structure of the optical fiber transmission system needs to be optimized. When the optical transceiver is miniaturized, the cost and bandwidth of the optical transceiver must be improved at the same time.

The present invention provides an optical transceiver module to improve the cost and use bandwidth of the optical transceiver.

The present invention provides a light emitting element, which includes a sealed casing, a circuit substrate, a light emitter, and a capacitor. The circuit substrate is arranged in the sealed casing, the light emitter is arranged on the circuit substrate, and the capacitor is electrically connected to the inner pin of the light emitting element and the circuit substrate between.

The present invention also provides an optical transceiver module, which includes a substrate, a light receiving element, and a light emitting element. The light emitting element includes a sealed casing, a circuit substrate, a light emitter, and a capacitor. The circuit substrate is arranged in the sealed casing, the light emitter is arranged on the circuit substrate, and the capacitor is electrically connected between the inner pin of the light emitting element and the circuit substrate.

The present invention also provides an optical fiber cable module. The optical fiber cable module includes: an optical fiber cable and an optical transceiver module. The optical transceiver module includes a substrate, a light receiving element, and a light emitting element. The light emitting element includes a sealed casing, a circuit substrate, a light emitter, and a capacitor. The circuit substrate is arranged in the sealed casing, the light emitter is arranged on the circuit substrate, and the capacitor is electrically connected between the inner pin of the light emitting element and the circuit substrate.

The present invention provides a light emitting element, an optical transceiver module and its application, which can adjust the system impedance of the light emitting element to an appropriate system impedance, avoid high-frequency signal reflection, and increase the bandwidth, so it is suitable for high-frequency signal optical Transceiver module. Furthermore, the manufacturing process of the capacitor and the lead is simple, and the manufacturing cost of the light emitting element can be reduced, which is beneficial to the overall cost of the optical transceiver module.

In order to have a more detailed understanding of the purpose, efficacy, features, and structure of the present invention, preferred embodiments are described below in conjunction with the drawings.

100: Optical cable module

101: electronic device

102: matching port

103: processor

104: Shell

105: Peripheral devices

106: Path

110: Optical transceiver module

111: substrate

112: processor

113: light emitting element

113a: optical transmitter

113b: sealed housing

113c: Pedestal

113d: pillar

113e: circuit board

113f: capacitor

113g: first lead

113h: second lead

113i: inner pin

114: light receiving element

130: Optical fiber cable

L3: equivalent inductance

L4: equivalent inductance

L5: equivalent inductance

C1: equivalent capacitance

Figure 1 is a block diagram of an embodiment of a system using the optical cable module of the present invention;

2 is a schematic diagram of an embodiment of the optical transceiver module of the present invention;

3 to 4 are schematic diagrams of an embodiment of the light emitting element of the present invention;

Fig. 5 is an equivalent circuit diagram of the inner pins, leads and capacitors of the light emitting element of the present invention;

Figures 6A and 6B are the frequency response diagram and the eye diagram when the capacitor is not provided, respectively;

Fig. 7A and Fig. 7B are the frequency response diagram and the eye diagram when a capacitor is provided, respectively.

The description of the following embodiments refers to the attached drawings to illustrate that the present invention can be Specific embodiment to implement. The directional terms mentioned in the present invention, such as "up", "down", "front", "rear", "left", "right", "inner", "outer", "side", etc., are for reference only The direction of the additional schema. Therefore, the directional terms used are used to describe and understand the present invention, rather than to limit the present invention.

The drawings and descriptions are to be regarded as illustrative in nature and not restrictive. In the figure, units with similar structures are indicated by the same reference numerals. In addition, for understanding and ease of description, the size and thickness of each element shown in the drawings are arbitrarily shown, but the present invention is not limited thereto.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. In the drawings, the thickness of some layers and regions are exaggerated for understanding and ease of description. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, the element can be directly on the other element, or intervening elements may also be present.

In addition, in the specification, unless expressly described to the contrary, the word "comprising" will be understood to mean that the element is included, but does not exclude any other elements. In addition, in the specification, "on" means to be located above or below the target group element, and does not mean that it must be located on the top based on the direction of gravity.

Please refer to FIG. 1. This embodiment provides an optical cable module 100. FIG. 1 is a flowchart of using the optical cable module 100. The optical cable module 100 includes an optical transceiver module 110 and an optical fiber cable 130. And electronic device 101. The electronic device 101 can be any of many computing or display devices, including but not limited to data centers, desktop or laptop computers, notebook computers, ultra-thin notebooks, tablet computers, notebooks, or other Computing device. In addition to the computing device, it can be understood that many other types of the electronic device 101 may include one or more of the optical transceiver module 110 and/or the matching port 102 described in the present invention and described in the present invention The embodiments can be equivalently applied to these electronic devices. Examples of these other electronic devices 101 may include electric vehicles, handheld devices, smart phones, media devices, personal digital assistants (PDAs), mobile personal computers, mobile phones, multimedia devices, memory devices, cameras, answering machines, I/O devices, servers, set-top boxes, printers, scanners, monitors, televisions, Electronic signage, projector, entertainment control unit, portable music player, digital camera, internet device, game device, game console, or any other electronic device that may include the optical transceiver module 110 and/or the matching port 102 101. In other embodiments, the electronic device 101 may be any other electronic device that processes data or images.

As shown in FIG. 1, the optical fiber cable 130 is connected to the optical transceiver module 110 for transmitting optical signals. The optical fiber cable 130 may include at least one or more optical fiber cores for allowing optical signals to be transmitted within the optical fiber cores.

Please refer to FIG. 1, the electronic device 101 may include a processor 103, which may represent any type of processing element for processing electrical and/or optical I/O signals. It is understandable that the processor 103 may be a single processing device or multiple separate devices. The processor 103 may include or may be a microprocessor, programmable logic device or array, microcontroller, signal processor, or some combination.

Please refer to FIG. 1, the matching port 102 of the electronic device 101 can be used as an interface to connect to the optical transceiver module 110. The optical transceiver module 110 can allow another peripheral device 105 and the electronic device 101 to be connected to each other. The optical transceiver module 110 of this embodiment can support communication via an optical interface. In various embodiments, the optical transceiver module 110 can also support communication through an electrical interface.

Please refer to FIG. 1, the peripheral device 105 may be a peripheral I/O device. In various embodiments, the peripheral device 105 may be any of a variety of computing devices, including but not limited to a desktop or laptop computer, a notebook computer, an ultra-thin notebook, a tablet computer, a notebook, or Other computing devices. In addition to computing devices, it can be understood that peripheral devices 105 may include electric vehicles, palm-sized devices, smart phones, media devices, personal digital assistants (PDAs), ultra-mobile personal computers, mobile phones, multimedia devices, memory Body devices, cameras, answering machines, I/O devices, servers, set-top boxes, printers, scanners, monitors, televisions, electronic signs, projectors, entertainment control units, portable music players , Digital camera, on Internet devices, game devices, game consoles, or other electronic devices.

Please refer to FIG. 1. In an embodiment, the electronic device 101 may also include an internal optical path. The optical path may represent one or more components, which may include processing and/or termination components for transmitting an optical signal between the processor 103 and the matching port 102. Transmitting a signal can include generating and converting to optical, or receiving and converting to electrical. In an embodiment, the device may also include an electrical path. The electrical path represents one or more components that transmit an electrical signal between the processor 103 and the matching port 102.

Please refer to FIG. 1, the optical transceiver module 110 can be used to correspond to the matching port 102 of the electronic device 101. In this embodiment, mating a connector plug with another can be used to provide a mechanical connection. Mating a connector plug with another usually also provides a communication connection. The mating port 102 may include a housing 104, which may provide the mechanical connection mechanism. The matching port 102 may include one or more optical interface components. The path 106 may represent one or more components, which may include processing and/or termination components for transmitting optical signals (or optical signals and electrical signals) between the processor 103 and the matching port 102. Transmitting signals may include generating and converting into optical signals, or receiving and converting into electrical signals.

Please refer to FIG. 1, the optical transceiver module 110 of the present invention may be referred to as an optical connector or an optical connector. Generally speaking, this optical connector can be used to provide a physical connection interface that interfaces with a matching connector and optical element. The optical transceiver module 110 may be a light engine for generating optical signals and/or receiving and processing optical signals. The optical transceiver module 110 can provide conversion from electrical-to-optical signals or from light-to-electrical signals.

In some embodiments, the optical transceiver module 110 can be used to process the optical signals in compliance with or in accordance with one or more communication protocols. For the embodiment in which the optical transceiver module 110 is used to transmit an optical signal and an electrical signal, the optical interface and the electrical interface can be based on the same agreement, but this is not absolutely necessary. Regardless of whether the optical transceiver module 110 processes signals according to the electrical I/O interface protocol, or according to a different protocol or standard, the optical transceiver module 110 can It is constructed or programmed in a specific module for an intended protocol, and different transceiver modules or light engines can be constructed for different protocols.

Please refer to FIG. 2, which is a schematic diagram of an embodiment of the optical transceiver module of the present invention. The optical transceiver module 110 proposed in this embodiment may include a substrate 111, a processor 112, a light emitting element 113, and a light receiving element 114. The substrate 111 is, for example, a printed circuit board (PCB) or a ceramic substrate, and may include, for example, pins or connection balls for interfacing with an external device. The processor 112 is connected to the substrate 111, and the processor 112 can be any type of processor die or optical IC, and is not limited to any specific processor type. The light emitting element 113 and the light receiving element 114 are the processor 112 connected to the substrate 111, and are used for transmitting and receiving optical signals, respectively. The light emitting element 113 and the light receiving element 114 may include a transmitting circuit and a receiving circuit for transmitting electronic signals, more specifically, processing the timing or other agreement matters of the electronic signals corresponding to the optical signals.

In addition, in some embodiments, two opposite surfaces of the substrate 111 may be provided with different circuits for setting circuits, chips or components with different functions. For example, the light receiving element 114 may be disposed on one surface of the substrate 111, and the processor 112 and IC chips (such as but not limited to LDD, PA, CDR, DSP chips, etc.) may be disposed on the other surface of the substrate 111. In this way, the installation space of the circuit or the chip can be increased, and the size of the substrate 111 can be correspondingly reduced. In some embodiments, the light receiving element 114 may also be fixed on the substrate 111 by a chip on board method.

In this embodiment, the optical transceiver module 110 can be applied to, for example, a four-fiber channel parallel transmission (Parallel Single Mode 4 lane, PSM4) technology, which uses a plurality of light emitting elements 113 to separate four laser sources with different wavelengths. The light is introduced into the optical fiber, and the medium and long-distance transmission is carried out through the optical fiber. The light receiving element 114 can receive light signals, and can respectively guide the processed light signals to different channels. However, it is not limited to this. In addition to the PSM4 technology, the optical transceiver module 110 can also be applied to various multi-fiber channel wavelength division multiplexing (multi-channel, WDM), such as but not limited to: two-position phase shift modulation (Binary Phase Shift Keying, BPSK), four-bit phase shift Shift modulation (Quadrature Phase Shift Keying, QPSK), Coarse Wavelength Division Multiplexing (Conventional/Coarse Wavelength Division Multiplexing, CWDM), High-density Wavelength Division Multiplexing (DWDM), Optical Increase/Decrease Multiplexing ( Optical Add/Drop Multiplexer, OADM), Reconfigurable Optical Add/Drop Multiplexer (ROADM), LR4 or similar related optical communication technology.

As shown in FIGS. 3 and 4, each light emitting element 113 may include a light emitter 113a and a sealed housing 113b, and the light emitter 113a may be completely sealed in one or more sealed housings 113b, and also That is, the light emitter 113a in the light emitting element 113 will not contact the external environment or the air outside the light emitting element 113, so as to avoid the aging of the light emitter 113a component, ensure the component performance of the light emitter 113a, and greatly extend the component. Service life. Wherein, the degree of sealing of the light emitting element 113 can meet the airtight requirement of the TO (Transmitter Optical Sub-Assembly) type package for industrial use. For example, the sealing degree of each light emitting element 113 may be 1×10-12~5×10-7 (atm*cc/sec).

In various embodiments, the wavelength of the light signal emitted by the light emitter 113a of the light emitting element 113 may be in the range of near-infrared light to infrared light, which is about 830 nanometers (nm) to 1660 nanometers. The light emitter 113a can be any type of laser chip suitable for generating optical signals (for example, edge-fire type laser device, FP/DFB/EML laser, or vertical cavity surface-emission type laser, VCSEL).

In different embodiments, the light emitter 113a can be directly sealed in the sealed casing 113b without an exposed gap, so as to ensure the airtightness of the light emitting element 113. In some embodiments, the sealed housing 113b is, for example, a cylindrical housing.

In different embodiments, through the arrangement and arrangement of the light emitting elements 113 and/or the design of the substrate 111, the size of the substrate 111 can be designed to meet the requirements of QSFP28, QSFP+ or Micro QSFP+. For example, in some embodiments, the width of the substrate 111 may be about 11-18 mm, and in some embodiments, the length of the substrate 111 may be about 58-73 mm to meet the requirements of QSFP+ or QSFP28. Therefore, through the arrangement of the light emitting elements 113 and/or the design of the substrate 111, it is possible to The multiple light emitting elements 113 are arranged and packaged in a small optical transceiver module 110 to realize the miniaturization of the optical transceiver module.

In different embodiments, the plurality of light receiving elements 114 may also be arranged in a staggered manner, and the light receiving directions of the plurality of light emitting elements have an angle between 90 degrees and 180 degrees.

In different embodiments, the light receiving element 114 and the substrate may have an inclination angle, and the inclination angle between the light receiving element and the substrate may be less than 90 degrees, for example, between 0 degrees and 90 degrees, such as 1 degree, 5 degrees, 30 degrees, 60 degrees or 45 degrees.

In some embodiments, the light receiving element 114 may be, for example, a cylindrical light receiving element, or, for example, a coaxial (Transistor-Ou ne) cylindrical (TO-CAN) light receiving element. Among them, the degree of sealing of the cylindrical light receiving element meets the airtight requirements of the TO (Transmitter Optical Sub-Assembly) type package for industrial use. For example, the sealing degree of each of the plurality of cylindrical light receiving elements may be 1 x 10-12~5*10-7 (atm*cc/sec). In an embodiment, more specifically, the sealing degree of each cylindrical light receiving element may be 1×10-9~5×10-8 (atm*cc/sec). However, it is not limited to this. In some embodiments, the light receiving element 114 may also be an unsealed light receiving element.

It is worth noting that in different embodiments, the light emitting element 113 and the light receiving element 114 may have different arrangements, combinations, and/or configurations. For example, in some embodiments, the light emitting element 113 and the light receiving element 114 may be disposed on the same side of the substrate 111. However, it is not limited to this. In some embodiments, the light emitting element 113 and the light receiving element 114 may also be respectively disposed on different sides of the substrate 111.

As shown in FIGS. 3 and 4, in different embodiments, each light emitting element 113 may further include a base 113c, a pillar 113d, a circuit substrate 113e, a capacitor 113f, and leads 113g and 113h. The light emitter 113a, the base 113c, the support 113d, the circuit board 113e, the capacitor 113f, and the lead wires 113g and 113h are arranged in the sealed casing 113b. The pillar 113d is arranged on the base 113c, the circuit substrate 113e is arranged on the pillar 113d, the light emitter 113a is arranged on the circuit substrate 113e, and the capacitor 113f can be electrically connected to the light emitting element through the leads 113g and 113h. Between the inner pin 113i of the component 113 and the circuit board 113e.

As shown in FIGS. 3 and 4, the sealed housing 113b and the base 113c can form a closed space for accommodating the light emitter 113a, the pillar 113d, and the circuit board 113e. The pillar 113d can be extended from the base 113g to support the circuit board 113e. In different embodiments, the number of the pillars 113d may be one or more to support different circuit elements. In different embodiments, the pillar 113d may be integrally formed on the base 113c, that is, the pillar 113d and the base 113c may have the same material, for example, a metal with good thermal conductivity. In some embodiments, the pillar 113d may be a semicircular column shape, but it is not limited thereto. In some embodiments, the pillar 113d may be a rectangular column shape, a cylindrical shape, a cone shape, or other three-dimensional shapes.

As shown in FIGS. 3 and 4, in different embodiments, the circuit substrate 113e may be provided with a circuit for setting the light emitter 113a, and the circuit substrate 113e may include a good thermal conductivity material (such as ceramic, alumina, nitride) Aluminum) to improve heat dissipation efficiency and reduce high-frequency signal loss.

In different embodiments, the capacitor 113f can be arranged in a proper position in the light emitting element 113, and can be electrically connected between the inner pin 113i of the light emitting element 113 and the circuit substrate 113e through the leads 113g and 113h for Adjust the system impedance of the light emitting element 113 to a preset system impedance (for example, 20 ohm ~ 50 ohm) to avoid high frequency signal reflection and increase the bandwidth.

In some embodiments, as shown in FIGS. 3 and 4, the capacitor 113f may be disposed on the inner surface of the base 113c and located between the inner pin 113i and the circuit substrate 113e to shorten the lead length. However, it is not limited to this, and the capacitor 113f can also be disposed in other suitable positions in the light emitting element 113, such as in the sealed housing 113b or on the pillar 113d.

In some embodiments, the capacitor 113f may be, for example, a single layer capacitor (SLC) or other suitable capacitors, and the capacitance value of the capacitor 113f is, for example, 0.05 pF to 1 pF. However, it is not limited to this. The capacitance value of the capacitor 113f can also be adjusted according to the overall impedance of the light emitting element 113 to adjust the system impedance of the light emitting element 113 to an appropriate system. impedance.

In different embodiments, as shown in FIGS. 3 and 4, the leads 113g and 113h may include a first lead 113g and a second lead 113h. The first lead 113g is connected between the circuit substrate 113e and the capacitor 113f, that is, electrically connected between the light emitter 113a and the capacitor 113f. The second lead 113h is connected between the capacitor 113f and the inner pin 113i, and the first lead 113g and the second lead 113h can be connected to the same surface of the capacitor 113f. In different embodiments, the length of the leads 113g and 113h is, for example, 100um~1500um. However, it is not limited to this. The lengths of the leads 113g and 113h can also be adjusted according to the overall impedance of the light emitting element 113 to further adjust the system impedance of the light emitting element 113 to an appropriate system impedance.

It is worth noting that, as shown in Figure 5, the equivalent inductance L3 of the inner pin 113i, the equivalent inductance L4 of the first lead 113g, the equivalent inductance L5 of the second lead 113h, and the equivalent capacitance C1 of the capacitor 113f can be formed T-shaped equivalent circuit. By adjusting the impedance of the T-shaped equivalent circuit, the system impedance of the light emitting element 113 can be further adjusted to an appropriate system impedance.

6A and 6B are the frequency response diagram and the eye pattern when the capacitor is not provided, respectively, and FIG. 7A and FIG. 7B are the frequency response diagram and the eye pattern when the capacitor is provided, respectively. As shown in FIGS. 6A, 6B, 7A, and 7B, the configuration of the capacitor 113f of the light emitting element 113 significantly improves the bandwidth of the light emitting element 113 and the transmission of high-frequency signals.

Therefore, by configuring the capacitor 113f of the light emitting element 113 and the leads 113g, 113h, the lead inductance impedance of the light emitting element 113 can be improved, so as to adjust the system impedance of the light emitting element 113 to an appropriate system impedance and avoid high-frequency signal reflection. , And increase the bandwidth, so it is suitable for the optical transceiver module 110 of high frequency signal (above 10Gb/s). Furthermore, the manufacturing process of the capacitor 113f and the leads 113g and 113h is simple, and the manufacturing cost of the light emitting element 113 can be reduced, which is beneficial to the overall cost of the optical transceiver module 110.

In different embodiments, each light emitting element 113 may further include at least one optical lens (not shown) to optically improve the light signal emitted by the light emitter 113a, for example, Such as focusing, collimation, divergence, etc.

The terms "in some embodiments" and "in various embodiments" are used repeatedly. The term usually does not refer to the same embodiment; but it can also refer to the same embodiment. The terms "including", "having", and "including" are synonymous, unless the context indicates other meanings.

Although examples of various methods, devices, and systems have been described herein, the scope covered by the present disclosure is not limited thereto. On the contrary, this disclosure covers all methods, equipment, systems, and manufactured things that reasonably fall within the scope defined by the claims, and the scope of the claims should be interpreted based on the established principles of interpretation of the scope of patent applications. For example, although the examples of the system disclosed above include software or firmware that can be executed from the hardware in addition to other components, it should be understood that these systems are only exemplary examples and should be interpreted as It is a restrictive example. In detail, any or all of the disclosed hardware, software, and/or firmware components may be specifically embodied as hardware, specifically embodied as software, specifically embodied as firmware, or hardware, Some combination of software and/or firmware.

In summary, although the present invention has been disclosed as above in preferred embodiments, the above preferred embodiments are not intended to limit the present invention. Those of ordinary skill in the art can make various modifications and changes without departing from the spirit and scope of the present invention. Retouching, therefore, the protection scope of the present invention is subject to the scope defined by the claims.

Therefore, the present invention has excellent advancement and practicability among similar products. At the same time, after searching through domestic and foreign technical materials and documents about this kind, it is indeed not found that the same or similar structure or technology exists before the application of this case. Therefore, This case should have met the patent requirements of "novelty", "suitable for industrial use" and "progressiveness", and an application was filed in accordance with the law.

However, the above is only a preferred embodiment of the present invention, and any other equivalent structural changes made by applying the specification of the present invention and the scope of the patent application should be included in the scope of the patent application of the present invention.

113: light emitting element

113a: optical transmitter

113c: Pedestal

113d: pillar

113e: circuit board

113f: capacitor

113g: first lead

113h: second lead

113i: inner pin

Claims (10)

A light emitting element includes: Sealed shell; The circuit board is arranged in the sealed housing; The light emitter is arranged on the circuit substrate; and The capacitor is electrically connected between the inner pin of the light emitting element and the circuit substrate. For example, the light emitting element of item 1 of the scope of the patent application further includes a base and a pillar. The pillar is arranged on the base, and the circuit board is arranged on the pillar. For example, the light emitting element of the second item of the scope of patent application, wherein the capacitor is arranged on the inner surface of the base and located between the inner pin and the circuit substrate. For example, the light emitting device of the first item in the scope of patent application, the capacitance value of the capacitor is 0.05pF~1pF. For example, the light emitting device of the first item of the scope of patent application, wherein the capacitor is electrically connected between the inner lead of the light emitting device and the circuit substrate through a lead wire. For example, the light emitting element of item 5 of the scope of patent application, wherein the lead includes a first lead and a second lead, the first lead is connected between the circuit substrate and the capacitor, and the second lead is connected between the capacitor and the inner Between the pins. For example, the light emitting device of the 6th patent application, wherein the first lead and the second lead are connected to the same surface of the capacitor. For example, the light emitting device of item 5 in the scope of patent application, the length of the lead wire is 100um~1500um. An optical transceiver module, including: Substrate The light receiving element is connected to the substrate; and The light emitting element is connected to the substrate, wherein the light emitting element includes: Sealed shell; The circuit substrate is arranged in the sealed housing; The light emitter is arranged on the circuit substrate; and The capacitor is electrically connected between the inner pin of the light emitting element and the circuit substrate. An optical fiber cable module, including: A fiber optic cable; and An optical transceiver module, including: Substrate The light receiving element is connected to the substrate; and The light emitting element is connected to the substrate, wherein the light emitting element includes: Sealed shell; The circuit substrate is arranged in the sealed housing; The light emitter is arranged on the circuit substrate; and The capacitor is electrically connected between the inner pin of the light emitting element and the circuit substrate.

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