TW202129817A - Substrate processing device - Google Patents

Abstract

The invention can suppress the reduction in productivity caused by the action of one indexing manipulator. The present invention preferentially uses the frame parts of the upper reversing path unit 33 and the lower reversing path unit 35 corresponding to the upper section UF and the lower section DF of the processing block 7 that are closer to the boundary between the upper section UF and the lower section DF. In this way, by studying the transportation from one indexing manipulator to the reversing path unit 31, the moving distance of one indexing manipulator in the up and down direction Z can be shortened. Therefore, the reduction in productivity caused by the movement of one indexing manipulator can be suppressed.

Description

Substrate processing device

The present invention relates to a substrate for semiconductor wafers, liquid crystal displays or organic (EL, Electroluminescence, electroluminescence) display devices, glass substrates for photomasks, substrates for optical discs, substrates for magnetic discs, ceramic substrates, and substrates for solar cells A substrate processing apparatus that performs cleaning processes such as surface cleaning or back surface cleaning, such as substrates (hereinafter referred to as substrates).

Conventionally, as this type of device, there is a processing block with an indexing block, a surface cleaning unit and a back cleaning unit, and a reversing path area installed between the indexing block and the processing block Blockers (for example, refer to Patent Document 1).

The indexing block is provided with: a carrier placing part, which places a carrier containing a plurality of substrates; and an indexing manipulator, which transports the substrate between the carrier and the reversing path block. The reversing path block is provided with a reversing path unit, and the reversing path unit is provided with a plurality of stages of racks on which the substrate is placed, and the substrate is transferred between the substrate and the processing block or the front and back of the substrate are inverted. The processing block is equipped with: a first processing section row with a 4-layer structure, which is equipped with four surface cleaning units from the bottom on the left when viewed from the indexing block; a second processing section row with a 4-layer structure, When observing the indexing block, there are 4 back surface cleaning units from the bottom on the right side; and a main manipulator, which transports the substrate between the surface cleaning unit, the back surface cleaning unit, and the reversing path unit. The reversing path block is provided with an upper reversing path unit in the upper section corresponding to the upper 2 layers, and a lower reversing path unit at the lower section corresponding to the lower 2 layers. The upper reversing path unit and the lower reversing path unit are in Spaced up and down. When the indexing robot transports the unprocessed substrate to the processing block, it only transports it via the upper reversing path unit, and when receiving the processed substrate from the processing block, it only receives it via the lower reversing path unit.

In this device, there is one main manipulator in the processing block, but recently there is a kind of two main manipulators equipped with two main manipulators corresponding to the upper processing unit and the lower processing unit in the processing block in order to increase productivity. Device (for example, refer to Patent Document 2). [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2008-166369 (Figure 1, Figure 2) [Patent Document 2] Japanese Patent Laid-Open No. 2016-201526 (Figure 10)

(The problem to be solved by the invention)

However, in the case of a conventional example with such a structure, there are the following problems. That is, in the conventional device, an indexing robot needs to enter and exit the upper inversion path unit when transporting unprocessed substrates, and needs to enter and exit the lower inversion path unit when receiving processed substrates. Therefore, when the substrate is cleaned, the moving distance of one indexing manipulator in the up and down direction is long, and the production capacity is reduced due to the operation of one indexing manipulator.

The present invention was completed in view of this situation, and its object is to provide a substrate processing apparatus that can suppress the transfer from one indexing robot to the reversing path unit by studying the transfer from one indexing robot to the reverse path unit. Reduced production capacity due to operating conditions. (Technical means to solve the problem)

In order to achieve such an object, the present invention adopts the following configuration. That is, the first invention is a substrate processing apparatus that performs cleaning processing on a substrate; it is characterized in that it includes an indexing block having a carrier placing portion for placing a carrier for accommodating a plurality of substrates, And it is equipped with an indexing manipulator that transfers the substrate between it and the carrier of the carrier placement part; the processing block has a surface cleaning unit for cleaning the surface of the substrate and the back of the substrate The back washing unit of the washing process, as a processing unit, is equipped with the above-mentioned processing unit in the upper and lower sections, respectively; and a reverse path block, which is arranged between the indexing block and the processing block, and has a placement The multiple stages of the substrate have the function of reversing the front and back of the substrate; in the processing block, the upper and lower stages are respectively provided for conveying between the processing units and the reversing path block The center manipulator of the substrate, the reversing path block includes: an upper reversing path unit having a plurality of reversing path portions corresponding to the upper segment; and a lower reversing path unit having a plurality of reversing path portions corresponding to the lower segment Reversing path section; the indexing manipulator transfers the substrate to the reversing path section, wherein priority is given to the plurality of reversing path sections of the upper reversing path unit and the plurality of reversing paths of the lower reversing path unit In the path part, the one that is closer to the junction of the above-mentioned upper section and the above-mentioned lower section.

[Function and Effect] According to the first invention, an indexing manipulator transfers the substrate to the reversing path section when it transfers the substrate between it and the processing block via the reversing path block, of which priority is given to the transfer For the plurality of inverted path portions of the upper inverted path unit and the plurality of inverted path portions of the lower inverted path unit, the ones that are closer to the boundary between the upper and lower segments. In this way, by studying the transportation from one indexing manipulator to the reverse path block, the moving distance of one indexing manipulator in the up and down direction can be shortened, so the movement of one indexing manipulator can be suppressed Reduced production capacity caused by the situation.

Furthermore, in the present invention, it is preferable that the indexing manipulator transfers the substrate to the reversing path portion, wherein the priority is given to the rotation axis of the reversing path portion, and is away from the upper stage and the lower stage. The shelf that is closer to the border (item 2).

The indexing manipulator transfers the substrate to the reversing path part, wherein the priority is given to the frame part that is closer to the boundary between the upper section and the lower section based on the rotation axis in the reversing path section. Therefore, even in the case where the closest to the junction of the plurality of reversing path portions cannot be used, the shelf portion that is as close as possible to the junction of the upper and lower sections is preferred. As a result, it is possible to reliably shorten the moving distance of one indexing manipulator in the up and down direction.

Furthermore, in the present invention, it is preferable that the central robot hand transfers the substrates processed in the processing block to the reversing path section, wherein priority is given to the plurality of reversing path units of the upper reversing path unit. Among the plurality of reversing path portions of the reversing path portion and the lower reversing path unit, the one that is closer to the boundary between the upper portion and the lower portion (item 3).

The central manipulator transfers the substrate to the reversing path section, where the priority is given to the multiple reversing path sections of the upper reversing path unit and the multiple reversing path units of the lower reversing path unit, and the boundary between the upper section and the lower section Closer. As a result, since the moving distance of the indexing robot in the up and down direction when receiving the substrate from the reversing path block can be shortened, the production capacity caused by the movement of the indexing robot can also be suppressed when the substrate after the processing is returned. reduce.

Furthermore, in the present invention, it is preferable that the indexing manipulator includes: a guide rail which is fixedly erected in a horizontal direction; a base part which moves up and down along the guide rail; and a multi-joint arm which is arranged in On the base portion; and the hand, which is the arm supporting substrate on the front end side of the articulated arm; in the standby state before entering and exiting the reversing path block, the hand is located at the boundary between the upper section and the lower section (Item 4).

One indexing manipulator has a guide rail, a base part, an articulated arm, and a hand. The base part is raised and lowered relative to the guide rail, and the articulated arm is driven to move the hand freely relative to the base part. In the standby state before entering and exiting the reverse path block, the hand is located at the junction of the upper section and the lower section. Therefore, the moving distance when entering and exiting the upper reversing path unit or the lower reversing path unit can be shortened.

Furthermore, in the present invention, it is preferable that the inversion path block only mounts the substrate without inverting it when only the surface cleaning unit is used for the surface cleaning process of the substrate (section 5 items).

The reversal path block places and transfers the substrate without reversing it, and can use the surface cleaning unit to perform only the surface cleaning process of the substrate.

In addition, in the present invention, it is preferable that the inverted path block is used when the surface cleaning unit and the back surface cleaning unit are used for cleaning the front and back surfaces of the substrate. Before loading the back surface cleaning unit and before loading the surface cleaning unit, invert the substrate twice (item 6).

The reverse path block can reverse the substrate twice to perform surface cleaning processing using a surface cleaning unit and back cleaning processing using a back surface cleaning unit. (Compared to the effect of the previous technology)

According to the substrate processing apparatus of the present invention, an indexing robot transfers the substrate to the reversing path section when it transfers the substrate between it and the processing block via the reversing path block, and the priority is given to the upper reversing path. Among the plurality of reversing path portions of the path unit and the plurality of reversing path portions of the lower reversing path unit, which is closer to the boundary between the upper section and the lower section. In this way, by studying the transfer from one indexing manipulator to the reverse path unit, the moving distance of one indexing manipulator in the up and down direction can be shortened, so the movement of one indexing manipulator can be suppressed. The resulting reduction in production capacity.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

Furthermore, FIG. 1 is a perspective view showing the overall structure of the substrate processing apparatus of the embodiment, FIG. 2 is a plan view of the substrate processing apparatus, and is a view showing the upper layer in the upper section of the processing block, and FIG. 3 is a plan view of the substrate processing apparatus , And is a diagram showing the upper and lower layers of the processing block. Figure 4 is a side view of the substrate processing device.

The substrate processing apparatus 1 of this embodiment is an apparatus that can perform surface cleaning processing for cleaning the surface of the substrate W and back surface cleaning processing for cleaning the back surface of the substrate. The substrate processing apparatus 1 includes an indexing block 3, a reverse path block 5, a processing block 7, a conveying block 9 and a common block 11.

The index block 3 transfers the substrate W as the processing target between the index block 3 and the reverse path block 5. The reverse path block 5 is arranged between the index block 3 and the processing block 7. The reverse path block 5 directly transfers the substrate W between the indexing block 3 and the transport block 9 without inverting the front and back of the substrate W, or inverting the front and back of the substrate W before it and the transport block The substrate W is transferred between 9. The transfer block 9 performs transfer of the substrate W between the reverse path block 5 and the processing block 7. The processing block 7 includes a surface cleaning unit SS that cleans the surface of the substrate W, and a back surface cleaning unit SSR that cleans the back surface of the substrate W. The common block 11 has a configuration for supplying processing liquids such as chemical liquid or pure water, or gases such as nitrogen or air to the processing block 7.

The substrate processing apparatus 1 is sequentially arranged with an indexing block 3, a reverse path block 5, a processing block 7 and a transport block 9, and a common block 11.

In the following description, the direction in which the index block 3, the reverse path block 5, the processing block 7, the transport block 9 and the common block 11 are arranged is referred to as the "front-rear direction X" (horizontal direction). In particular, the direction from the common block 11 to the index block 3 is referred to as "front XF", and the direction opposite to the front XF direction is referred to as "rear XB". Let the direction orthogonal to the front-rear direction X in the horizontal direction be the "width direction Y". Furthermore, when viewed from the surface of the index block 3, one of the width directions Y is appropriately referred to as "right YR", and the other direction opposite to the right YR is appropriately referred to as "left YL". In addition, the vertical direction is referred to as the "up and down direction Z" (height direction, vertical direction). In addition, when only described as "side" or "lateral", etc., it is not limited to any one of the front-rear direction X and the width direction Y.

The indexing block 3 includes a carrier placing part 13, a transport space AID, and an indexing manipulator TID. The substrate processing apparatus 1 in this embodiment includes, for example, four carrier mounting parts 13. Specifically, four carrier mounting portions 13 are provided in the width direction Y. The carrier C is placed on each carrier placing portion 13. The carrier C is a stack of a plurality of (for example, 25) substrates W for storage, and each carrier placement portion 13 is, for example, and an OHT (Overhead Hoist Transport, not shown) overhead lifting and conveying system: also known as Carrying over the vehicle C between the elevated unmanned transport vehicles). OHT uses the top wall of the clean room to transport the carrier C. As the carrier C, for example, FOUP (Front Opening Unified Pod) can be cited.

The conveying space AID is arranged behind XB of the carrier placing portion 13. An indexing robot TID is arranged in the transfer space AID. The indexing robot TID transfers the substrate W between it and the carrier C, and transfers the substrate W between it and the reversing path block 5. Only one indexing robot TID is placed in the transfer space AID.

Here, refer to FIG. 5. Furthermore, FIG. 5 is a perspective view of the entire indexing manipulator.

As shown in FIG. 5, one indexing robot TID includes a guide rail 15, a base portion 17, an articulated arm 19 and a hand 21. The longitudinal direction of the guide rail 15 is arranged in the vertical direction Z, and the base part 17 is raised and lowered with the driving of a driving part not shown. At this time, the guide rail 15 guides the base part 17 in the vertical direction Z. The position of the guide rail 15 in the front and rear direction X and the width direction Y is fixed. Specifically, when the guide rail 15 is viewed from the side of the carrier placement portion 13 of the index block 3 in the width direction Y, it is arranged so as not to overlap with the placement position of the substrate W in the reverse path block 5的的位置。 The location. Moreover, it is arranged on the inner wall side of the reverse path block 5 side in the index block 3. Here, in a plan view, an imaginary line VL connecting the center of the index block 3 in the width direction Y and the center of the reverse path block 5 in the width direction Y is defined (refer to FIGS. 2 and 3). The guide rail 15 and the base portion 17 are arranged at a position shifted from the imaginary line VL to the side, which is shifted to the right YR in this embodiment. The base portion 17 is arranged in a plan view with a space SP reserved from the back surface of the index block 3 toward the carrier placing portion 13 side. The space SP has a size that allows at least a part of the reverse path block 5 to be accommodated.

The base part 17 is provided with the base part main body 17a, which is arrange|positioned movably on the guide rail 15, and the fixed arm 17b extended sideways from the base part main body 17a. The fixed arm 17b is arranged to extend from the base part main body 17a to the front XF so that the front end side thereof is located at the center in the width direction Y of the four carrier placing parts 13, that is, on the above-mentioned imaginary line VL. The multi-joint arm 19 is composed of a first arm 19a, a second arm 19b, and a third arm 19c. If the third arm 19c where the hand 21 is arranged is the front end side, the first arm 19a is the base end side. Then, the base end of the first arm 19a on the base end side is attached to the front end side of the fixed arm 17b.

The multi-joint arm 19 is configured such that each of the first to third arms 19a, 19b, and 19c can pass through the rotation axis P1 on the proximal end side of the first arm 19a, the rotation axis P2 on the proximal end side of the second arm 19b, and the second arm 19b. The rotation axis P3 on the base end portion side of the three arm 19c rotates, and the hand 21 is configured to be able to move freely in the front-rear direction X and the width direction Y. The hand 21 is configured to be movable in the vertical direction Z by the base portion 17 being raised and lowered along the guide rail 15. In addition, in the multi-joint arm 19, when viewed from the side of the carrier mounting portion 13, the rotation axis P1 in the first arm 19a on the base end portion side is offset from the guide rail 15 to the reverse path block in the width direction Y Configured on 5 sides. That is, the rotation axis P1 is located on the aforementioned virtual line VL. Moreover, if the rotation axis P1 is based on the base part 17, it will be located in the left YL. The indexing manipulator TID thus constituted can enter and exit 4 carriers C and the following reverse path block 5 through the multi-joint arm 19.

Here, refer to FIG. 6. Furthermore, Fig. 6 is a perspective view showing the hand of the indexing manipulator, Fig. 6(a) shows a 4-piece hand body, and Fig. 6(b) shows a 2-piece hand body.

The indexing robot TID is provided with a hand 21. The hand 21 includes a hand body 21a, a hand body 21b, a hand body 21c, and a hand body 21d in order from top to bottom as shown in FIG. 6(a). The four hand bodies 21a-21d of the hand 21 are attached to the third arm 19c. As shown in FIG. 6(b), the uppermost hand main body 21a and the lowermost hand main body 21d among the four hand main bodies 21a to 21d are configured to be able to move up and down in the vertical direction Z. When the indexing robot TID transports the substrate W between it and the carrier C, for example, when 25 substrates W are stored on the carrier C, the four hand bodies 21a-21d are used to sequentially transport the substrates W four at a time. When one piece remains, for example, one piece of substrate W is transported by the hand main bodies 21a, 21b integrated with the hand main body 21a and the hand main body 21b, and one substrate W is used by the hand main body 21c and the hand main body 21d. The resulting hand bodies 21c and 21d transport one substrate W on the next carrier C. As a result, the indexing robot TID provided with the four hand bodies 21a-21d can efficiently transport to the carrier C containing 25 substrates W.

Furthermore, one indexing manipulator TID with the above-mentioned structure is preferably controlled in such a way that in the standby state before entering and exiting the reversing path block 5, the hand 21 is located at the upper stage UF in the vertical direction Z The junction with the lower DF.

Here, refer to FIG. 7 and FIG. 8. Furthermore, FIG. 7 is a perspective view of the reverse path block in the state of the index block viewed from the back, and FIG. 8 is a diagram showing the state of the index block and the reverse path block viewed from the left side.

The reverse path block 5 is integrally installed in the index block 3 on the processing block 7 side of the index block 3. Specifically, the index block 3 is provided with a mounting frame 25, a mounting hanger 27, and a hanger 29 extending from the index block 3 to the processing block 7 side on the back side (rear XB). The reverse path block 5 includes a reverse path unit 31. The back side of the index block 3 is formed with an upper inlet and outlet 3a and a lower inlet and outlet 3b that communicate with the conveying space AID. The reverse path unit 31 includes an upper reverse path unit 33 and a lower reverse path unit 35. The upper reversal path unit 33 is arranged at a position corresponding to the upper entrance and exit 3a, and the lower reversal path unit 35 is arranged at a position corresponding to the lower entrance and exit 3b. The lower part of the lower reversing path unit 35 is screwed to the mounting frame 25, and the upper part is fixed to the mounting hanger 27 by a fixing member 37. In addition, the lower part of the upper reversal path unit 33 is screwed to the mounting hanger 27, and the upper part is fixed to the hanger 29 by a fixing member 39.

The upper reversal path unit 33 and the lower reversal path unit 35 are overlapped and arranged without shifting in the front-rear direction X and the width direction Y in a plan view. Therefore, the area occupied by the substrate processing apparatus 1 can be reduced.

The reverse path block 5 and the index block 3 are formed integrally, but the reverse path block 5 is configured such that at least a part of it can be stored in the index block 3 when the substrate processing apparatus 1 is transported.

Specifically, the screws fixing the lower part of the upper reversing path unit 33 and the lower reversing path unit 35 are removed, and the fixing members 37, 39 are removed, and the upper reversing path unit 33 is pushed from the upper inlet and outlet 3a. Enter into the space SP located inside the index block 3, and push the lower reversing path unit 35 from the lower entrance and exit 3b into the space SP located inside the index block 3. Thereby, it is configured that at least a part of the reverse path block 5 can be reliably stored in the index block 3.

The upper reverse path unit 33 includes a reverse path frame portion 33a and a frame portion spacer 33b. An upper reversal path portion 33U is arranged on the upper portion partitioned by the frame portion spacer 33b, and a lower reversal path portion 33D is arranged on the lower portion partitioned by the frame portion spacer 33b. In addition, the lower reversing path unit 35 includes a reversing path frame portion 35a and a frame portion spacer 35b. An upper reversal path portion 35U is arranged on the upper portion partitioned by the frame portion spacer 35b, and a lower reversal path portion 35D is arranged on the lower portion partitioned by the frame portion spacer 33b.

Here, the details of the reverse path unit 31 will be described with reference to FIGS. 9 and 10. Furthermore, FIG. 9 is a perspective view showing the main part of the reversing path unit, and FIGS. 10(a) to (d) are diagrams illustrating the operation of the reversing path unit.

The reverse path unit 31 includes an upper reverse path unit 33 and a lower reverse path unit 35. The upper reverse path unit 33 and the lower reverse path unit 35 include upper reverse path portions 33U, 35U, and a lower reverse path portion 33D. 35D. In the following description, the upper reversal path portion 33U is described as an example, but the upper reversal path portion 35U and the lower reversal path portions 33D and 35D have the same configuration.

The upper reversal path portion 33U includes a guide portion 41 for placing the substrate W, and a rotation holding portion 43 for rotating the substrate W placed on the guide portion 41 so that the front and back sides are reversed. In addition, the same guide portion 41 and rotation holding portion 43 are also arranged opposite to each other on the right YR side, but they are omitted for convenience of illustration. The guide portion 41 includes a plurality of stages (for example, a total of 10 stages of 5 stages + 5 stages) frame portions 45 for holding a plurality of substrates W in a horizontal position in a layered manner, and the frame portions 45 are spaced apart in the front-rear direction X. The guide part 41 is driven by a driving part (not shown) in such a way that it straddles and protrudes to the placement position (not shown) of the right YR and retreats to the retreat position of the left YL shown in FIG. 9. The retreat position is the oblique downward direction descending from the bottom of the substrate W toward the left YL. Thereby, the sliding of the guide portion 41 does not occur under the substrate W during the retreat. Furthermore, the guide portion 41 not shown is driven so as to straddle and protrude to the placement position of the left YL and retreat to the obliquely downward retreat position of the right YR.

The rotation holding portion 43 is arranged between the guide portions 41 and includes a plurality of stages (10 stages in total) of frame portions 47 the same as the number of the guide portions 41. The height position of the arranging frame portion 47 in the vertical direction Z is the same as each frame portion 45 of the guide portion 41 when the guide portion 41 is located at the placement position. Each frame portion 47 is provided with a holding member (not shown) for gently holding the front and back surfaces of the substrate W to prevent it from falling from each frame portion 47 when the substrate W is rotated. The rotation holding portion 43 is attached to the rotation member 49, and each frame portion 47 is arranged spaced apart in the front-rear direction X. In this embodiment, the rotating member 49 is in the shape of the letter H, and the frame portions 47 are arranged in the I-shaped portion. The rotation member 49 is connected to a rotation drive part and a forward/backward drive part which are not shown in figure. The rotating member 49 rotates around the rotation axis P4 along the width direction Y. Furthermore, the rotating member 49 is driven to advance and retreat across the holding position protruding to the right YR and retreating to the retreat position (not shown) of the left YL shown in FIG. 9. With these actions, each frame portion 47 rotates or advances and retreats. Furthermore, the rotating member 49 not shown in the figure is driven to advance and retreat so as to straddle and protrude to the holding position of the left YL and retreat to the retreat position of the right YR.

The upper reversing path portion 33U performs the following operations: maintaining the state shown in FIG. 10(a), placing a plurality of substrates W, and performing the transfer in the original state without reversing the front and back sides; or by using the state shown in FIG. 10 In the same operations as (a) to (d), the front and back surfaces of the plurality of substrates W are reversed and then transferred.

In the case of reversing the front and back of the substrate W, for example, the guide portion 41 and the rotation holding portion 43 are driven as follows.

In the initial state, the guide portions 41 are moved to the placement position separated by the diameter of the substrate W in the width direction Y, and the rotation holding portion 43 is moved to the retracted position (FIG. 10(a)). In this state, a plurality of substrates W are placed on the guide portion 41. Next, the rotation holding portion 43 is positioned at the holding position (FIG. 10(b)), and then the guide portion 41 is moved to the retracted position (FIG. 10(c)). Furthermore, the rotation holding part 43 is rotated about the rotation axis P4 by half a turn (FIG. 10(d)). Through these series of actions, the front and back sides of the plurality of substrates W are simultaneously reversed.

In addition, the upper reversal path portion 33U and the lower reversal path portion 33D, and the upper reversal path portion 35U and the lower reversal path portion 35D respectively correspond to "a plurality of reversal path portions" in the present invention.

Return to Figure 2 to Figure 4. Also, refer to FIG. 11. Furthermore, FIG. 11 is an exploded perspective view showing the state of the substrate processing apparatus at the time of transportation.

A processing block 7 and a transport block 9 are arranged on XB after the reverse path block 5. The processing block 7 is arranged opposite to the left YL and the right YR with the conveying block 9 interposed therebetween.

Each processing block 7 is provided with two layers of processing units PU in the upper stage UF and the lower stage DF, for example. In addition, each processing block 7 includes two processing units PU in the front-rear direction X. That is, one processing block 7 includes eight processing units PU, and the two processing blocks 7 as a whole include 16 processing units PU. Furthermore, in the following description, when it is necessary to distinguish between the processing units PU, as shown in FIG. 11, the four processing units PU arranged from top to bottom among the processing units PU located at YL on the left and XF on the front are respectively As the processing units PU11 to PU14, the four processing units PU arranged from top to bottom in the processing unit PU located on the right YR and the front XF are respectively used as processing units PU21 to PU24, and the processing units located on the left YL and the rear XB The four processing units PU arranged from top to bottom in the PU are respectively used as processing units PU31 to PU34, and the four processing units PU arranged from top to bottom in the processing unit PU on the right YR and the rear XB are respectively used as processing units PU41 ~PU44.

In addition, the four processing units PU11 to PU14 located on the left YL and the front XF are called tower unit TW1, and the four processing units PU21 to PU24 located on the right YR and front XF are called the tower unit TW2, and will be located on the left The four processing units PU31 to PU34 of YL and the rear XB are called the tower unit TW3, and the four processing units PU41 to PU44 of the YR on the right and the rear XB are called the tower unit TW4. In addition, the two processing blocks 7 are composed of four tower units TW1 to TW4, but each of the tower units TW1 to TW4 is controlled or managed, and electrical wiring or fluid lines can be easily connected to the tower unit. Each of TW1～TW4 is separated and connected.

On the upper layer of the upper stage UF of the processing block 7, for example, a surface cleaning unit SS is arranged as shown in FIG. 2. The surface cleaning unit SS performs cleaning processing on the surface of the substrate W (generally, the surface on which the electronic circuit pattern and the like are formed). The surface cleaning unit SS includes, for example, a suction chuck 51, a guard 53, and a processing nozzle 55. The suction chuck 51 sucks the vicinity of the center of the back surface of the substrate W by vacuum suction. The suction chuck 51 is rotationally driven by an electric motor (not shown), thereby causing the substrate W to be rotationally driven in a horizontal plane. The guard 53 is arranged so as to surround the periphery of the suction chuck 51, and prevents the processing liquid supplied from the processing nozzle 55 to the substrate W from scattering around. The processing nozzle 55 cleans the surface of the substrate W by supplying the processing liquid to the surface of the substrate W by, for example, a jet stream.

On the upper layer UF and lower layer of the processing block 7, as shown in FIG. 3, for example, a back surface cleaning unit SSR is arranged. The back surface cleaning unit SSR performs a cleaning process on the back surface of the substrate W (generally, the surface on which the electronic circuit pattern and the like are not formed). The back surface cleaning unit SSR includes, for example, a mechanical chuck 57, a guard 59, and a cleaning brush 61. The mechanical chuck 57 abuts the periphery of the supporting substrate W, does not touch most of the bottom of the substrate W, and supports the substrate W in a horizontal state. The mechanical chuck 57 is rotationally driven by an electric motor (not shown), whereby the substrate W is rotationally driven in a horizontal plane. The guard 59 is arranged so as to surround the periphery of the mechanical chuck 57, and prevents the treatment liquid from being scattered around by the cleaning brush 61. The cleaning brush 61 includes, for example, a brush that rotates around a longitudinal axis, and the supplied processing liquid is applied to the back surface of the substrate W by the rotating force of the brush to perform cleaning.

The lower stage DF of the processing block 7 in this embodiment has, for example, the same structure as the upper and lower layers of the upper stage UF. That is, the upper layer of the lower section DF of the processing block is provided with a surface cleaning unit SS, and the lower layer of the lower section DF of the processing block is provided with a back surface cleaning unit SSR. That is, a total of 16 processing units PU in the processing block 7 includes 8 surface cleaning units SS and 8 back surface cleaning units SSR.

Here, refer to FIG. 12 in addition to FIGS. 2 to 4. Furthermore, FIG. 12 is a perspective view showing the main part of the transport block.

The transfer block 9 is respectively provided with center robots CR1 and CR2 at positions corresponding to the upper stage UF and the lower stage DF. The transfer block 9 is not provided with a partition plate or the like at the boundary between the upper UF and the lower DF, and the downflow in the device can circulate from the upper UF to the lower DF. The central robot CR1 transports the substrate W between the upper reversing path unit 33 and the processing units PU in the upper UF in the reversing path block 5. In addition, the center robot CR2 transports the substrate W between the lower reversing path unit 35 in the reversing path block 5 and each processing unit PU in the lower DF. In this way, the upper reversing path unit 33 and the lower reversing path unit 35 through the reversing path block 5 can distribute the substrate W to the processing blocks 7 of the upper UF and the lower DF by the central robots CR1 and CR2. Therefore, the production capacity can be increased.

Since the central manipulator CR1 and the central manipulator CR2 have the same structure, the central manipulator CR1 is taken as an example for description.

The center robot CR1 includes a fixed frame 63, a movable frame 65, a base portion 67, a rotating base 69, and an arm 71. The fixed frame 63 has openings that reach all the processing units PU in the upper stage UF. The movable frame 65 is installed in the fixed frame 63 so as to be movable in the front-rear direction X. The base portion 67 is attached to the lower frame of the four frames constituting the movable frame 65. The upper part of the base part 67 is comprised so that the turning base 69 is mounted, and the turning base 69 can be rotated with respect to the base part 67 in a horizontal plane. The arm 71 is mounted on the upper portion of the turning base 69 so as to advance and retreat with respect to the turning base 69. In the arm 71, the arm main body 71b is overlapped and arranged on the upper part of the arm main body 71a. The arm 71 is configured to be able to advance and retreat across the first position of the rotating base 69 and the second position protruding from the rotating base 69. According to this configuration, for example, when the central robot CR1 moves in and out of the processing unit PU, it can receive the processed substrate W in the processing unit PU with the arm main body 71a in a state where the rotating base 69 faces the processing unit PU, and The unprocessed substrate W supported by the arm body 71b is delivered to the processing unit PU.

The transport block 9 is configured as described above, and there is no common frame between the two processing blocks 7 adjacent to each other in the width direction Y. Therefore, the transport block 9 can be separated from the adjacent processing block 7. In addition, as shown in FIG. 11, the substrate processing apparatus 1 with the above-mentioned structure can be separated into an integrated unit with the indexing block 3 of the reverse path block 5, the processing block 7, the conveying block 9 and the common Block 11. In addition, the processing block 7 can be further divided into four tower units TW1 to TW4. Therefore, the restrictions on height, width, or depth that arise when the aircraft is used for transportation can be eliminated. Furthermore, as shown in FIG. 8, a part of the reverse path block 5 integrally installed in the index block 3 can be housed in the index block 3. Therefore, in addition to the restrictions on height, width or depth that arise when the aircraft is used for transportation, the restrictions on the volume can also be eliminated.

Here, with reference to FIGS. 13 to 15, an example of the transfer of the substrate W in the above-mentioned substrate processing apparatus 1 will be described.

As described above, one indexing robot TID included in the indexing block 3 has a configuration that can transport up to four substrates W at a time. However, in the description of the following transport examples, in order to facilitate the understanding of the invention, a case where one substrate W is transported will be described as an example. In addition, only the transfer between the reverse path block 5 and the processing block 7 is focused, and the operation of the center robots CR1 and CR2 is omitted from the illustration. In the figure, in order to be easily distinguished from other symbols, the symbols with brackets (S number-number) are used to indicate the steps of each action. Regarding the posture of the substrate W, the upward convex triangle indicates the state with the surface facing upward, the downward convex triangle indicates the state with the back facing upward, the black indicates the unwashed state, and the white indicates the cleaned state. In addition, the left half of the triangle indicates the washing state of the surface, and the right half indicates the washing state of the back.

Transport example 1: Front and back cleaning treatment

Refer to Figure 13. Furthermore, FIG. 13 is a schematic diagram for explaining an example of the transfer between the indexing manipulator and the processing block in the front and back washing process.

In the cleaning process of the substrate W, for example, the indexing robot TID sequentially transfers the substrate W from the upper part of the carrier C to the lower part, and performs processing. This is to prevent the following situation: the substrate after cleaning is returned to the same position of the same carrier C, but if there is a substrate W before cleaning at this time, particles will fall from the substrate W before cleaning. Etc., and the cleaned substrate W is contaminated again. Regarding the cleaning process spanning the front and back surfaces of the substrate W, first, the back surface cleaning process of the substrate W is performed, and then the surface cleaning process of the substrate W is performed. Furthermore, one indexing manipulator TID is controlled in such a way that the height position of the hand 21 in the vertical direction Z in the standby state before entering and exiting the reverse path block 5 is, for example, the upper section UF and the lower section DF The junction.

Here, the substrate W is processed in the lower stage DF in the processing block 7. The indexing robot TID transfers the substrate W to the reversing path unit 31 of the reversing path block 5, for example. Specifically, the indexing robot TID is transported to the upper reversing path unit 35U of the lower reversing path unit 35 in the reversing path unit 31 closer to the boundary between the upper UF and the lower DF. More specifically, the substrate W is transported to the uppermost shelf portion in the upper reversal path portion 35U (step S1-1). In addition, the frame portion is located at a position closer to the boundary between the upper stage UF and the lower stage DF based on the rotation axis P4 of the upper reversal path portion 35U. The black triangle raised upwards represents the substrate W whose front and back are not cleaned and the surface is facing upwards.

Then, the upper reversal path portion 35U rotates in a manner of up and down switching. Thereby, the substrate W placed on the uppermost shelf part in the upper reversal path part 35U moves to the lowermost shelf part, and the substrate W is reversed to the posture with the back face up (step S1-2). The black triangle protruding downwards represents the substrate W with the front and back sides not cleaned and the back side is facing upwards.

Then, the center robot CR2 transfers, for example, the substrate W to the back surface cleaning unit SSR of the processing unit PU44 (step S1-3). The back surface cleaning unit SSR uses the cleaning brush 61 to clean the back surface of the substrate W facing upward.

The center robot CR2 transports the substrate W after the back surface has been cleaned to, for example, the second shelf section from below in the lower reversal path section 35D (step S1-4). The triangle that protrudes downward and the right half is white represents the substrate W with the back side facing up, and only the back side has been cleaned.

The lower reversal path portion 35D rotates in an up-and-down manner. Thereby, the substrate W placed in the lower reversal path portion 35D in the second stage from below moves to the second stage from above, and the substrate W becomes the posture with the surface facing upward (step S1-5 ). The triangle that bulges upward and the right half is white represents the substrate W with the back side facing up, and only the back side has been cleaned.

Then, the center robot CR2 transfers, for example, the substrate W to the surface cleaning unit SS of the processing unit PU13 (step S1-6). The surface cleaning unit SS cleans the surface of the substrate W facing upward through the processing nozzle 55.

The substrate W whose front and back surfaces have been cleaned is transported by the center robot CR2 to the fourth stage from below of the upper reversing path portion 35U (step S1-7). Then, the indexing robot TID transports the substrate W placed on the fourth shelf section from the bottom of the upper reversing path section 35U, and returns it to the original position of the original carrier C storing the substrate W (step S1- 8). Furthermore, as in step S1-7, the central robot CR2 preferably transfers the substrate W processed in the processing block 7 to the upper reversing path portion 35U, wherein the priority is given to the upper reversing path unit 33 The upper reversing path portion 33U, the lower reversing path portion 33D, and the lower reversing path unit 35 are those that are closer to the boundary between the upper reversing path portion 35U and the lower reversing path portion 35D. Thereby, since the moving distance of the indexing robot TID in the vertical direction when receiving the processed substrate W from the reversing path block 5 can be shortened, the substrate W after the processing is returned to the carrier C when it is transported It can also suppress the reduction in productivity caused by the action of the indexing robot TID.

According to the above-mentioned transport example, the substrate processing apparatus 1 reverses the substrate W twice in the lower reversing path unit 35 to perform the cleaning process across the front and back surfaces.

Transport example 2: Surface cleaning treatment

Refer to Figure 14. Furthermore, FIG. 14 is a schematic diagram for explaining an example of the transfer between the indexing manipulator and the processing block in the surface cleaning process.

The indexing robot TID is transported to the reversing path unit 31, for example, the upper reversing path portion 35U of the lower reversing path unit 35 is closer to the boundary between the upper UF and the lower DF. More specifically, the substrate W is transported to the fourth stage from below in the upper reversal path portion 35U (step S2-1). The black triangles that bulge upward indicate the substrate W with the surface facing upwards and the front and back sides have not been cleaned.

Then, the center robot CR2 transfers, for example, the substrate W to the surface cleaning unit SS of the processing unit PU13 (step S2-2). The surface cleaning unit SS cleans the surface of the substrate W facing upward through the processing nozzle 55.

The center robot CR2 transfers the substrate W whose surface has been cleaned to, for example, the fourth-stage rack from the bottom of the upper reversing path portion 35U (step S2-3). The upward-protruding triangle with a white left half represents the substrate W with the surface facing upward, and only the surface has been cleaned. The indexing robot TID transports the substrate W placed on the fourth shelf section from the bottom of the upper reversing path section 35U, and returns it to the original position of the original carrier C storing the substrate W (step S2-4) . Furthermore, as in step S2-3, the central robot CR2 preferably transfers the substrate W processed in the processing block 7 to the upper reversing path portion 35U, wherein the priority is given to the upper section UF and the lower section DF. The boundary is closer to the upper reversal path portion 35U. As a result, since the moving distance of the indexing robot TID in the vertical direction when receiving the substrate W from the reversing path block 5 can be shortened, it can also be suppressed when the substrate W after processing is returned to the carrier C. Reduced production capacity caused by the movement of the indexing robot TID.

According to the above-mentioned transport example, the substrate processing apparatus 1 performs surface cleaning processing without reversing the substrate W in the lower reversing path unit 35.

Transport example 3: Backside cleaning treatment

Refer to Figure 15. Furthermore, FIG. 15 is a schematic diagram for explaining an example of the transfer between the indexing manipulator and the processing block in the back washing process.

The indexing robot TID is transported, for example, to the upper reversing path portion 35U of the lower reversing path unit 35 closer to the boundary between the upper UF and the lower DF. More specifically, the substrate W is transported to the uppermost shelf portion in the upper reversal path portion 35U (step S3-1). In addition, the frame portion is located at a position closer to the boundary between the upper stage UF and the lower stage DF based on the rotation axis P4 of the upper reversal path portion 35U. The black triangles that bulge upward indicate the substrate W with the surface facing upwards and neither the front nor the back are cleaned.

Then, the upper reversal path portion 35U rotates in a manner of up and down switching. Thereby, the substrate W placed on the uppermost shelf part in the upper reversal path part 35U moves to the lowermost shelf part, and the substrate W is inverted to the posture with the back facing upward (step S3-2). The black triangle protruding downwards represents the substrate W with the back side facing up and the front and back sides have not been cleaned.

Then, the center robot CR2 transfers, for example, the substrate W to the back surface cleaning unit SSR of the processing unit PU24 (step S3-3). The back surface cleaning unit SSR uses the cleaning brush 61 to clean the back surface of the substrate W facing upward.

The center robot CR2 transfers the substrate W after the back surface has been cleaned, for example, to the lowermost rack portion of the lower reversal path portion 35D (step S3-4). The triangle that protrudes downward and the right half is white represents the substrate W with the back side facing up, and only the back side has been cleaned.

The lower reversal path portion 35D rotates to exchange the substrate W up and down. Thereby, the substrate W placed on the lowermost shelf part in the lower inversion path part 35D moves to the uppermost shelf part, and the substrate W becomes the posture with the surface facing upward (step S3-5). The triangle that bulges upward and the right half is white represents the substrate W with the back side facing up, and only the back side has been cleaned. The indexing robot TID transports the substrate W placed on the uppermost shelf from the bottom of the lower reversing path portion 35D, and returns it to the original position of the original carrier C that accommodates the substrate W (step S3-6).

According to the above-mentioned transport example, the substrate processing apparatus 1 reverses the substrate W only once in the lower reversing path unit 35 to perform the cleaning process of the back surface.

In addition, in the above-mentioned transport examples 1 to 3, the transport example in the lower stage DF, that is, the transport example using only the lower reversing path unit 35 is described, but only the upper reversing path unit 33 is used in the upper UF. In this case, it is also possible to perform the cleaning treatment as described above by using a shelf part closer to the boundary between the upper UF and the lower DF.

As described above, when cleaning the substrate W, one indexing robot TID transports the substrate W between it and the processing block 7 via the reversing path block 5. At this time, the substrate W is preferentially transferred to the upper reversing path unit 33, the upper reversing path portion 33U, the lower reversing path portion 33D, and the lower reversing path unit 35, the upper reversing path portion 35U, and the lower reversing path portion 35D. The middle or the closest to the junction of the upper UF and the lower DF. In this way, by studying the transfer from one indexing robot TID to the reverse path block 5, the moving distance of one indexing robot TID in the up and down direction Z can be shortened. As a result, it is also expected to shorten the moving time required for the lifting of the hand 21 of one indexing manipulator, or to improve the positioning accuracy of the hand 21 and the reversing path block 5 when transferring the substrate W. Therefore, it is possible to suppress the reduction in productivity caused by the operation of one indexing robot TID.

Furthermore, the hand 21 of the indexing robot TID is located at the boundary between the upper UF and the lower DF in the vertical direction Z in the standby state before entering and exiting the reversing path block 5. Therefore, it is possible to shorten the moving distance in the vertical direction Z when entering and exiting the upper reversing path unit 33 or the lower reversing path unit.

The present invention is not limited to the above-mentioned embodiment, and can be modified and implemented as follows.

(1) In the above embodiment, the upper stage UF and the lower stage DF are respectively provided with two reversal path portions (the upper reversal path portion 33U, the lower reversal path portion 33D, the upper reversal path portion 35U, and the lower reversal path portion 35D), the upper reversal path portion 35U that is closer to the boundary between the upper UF and the lower DF is preferentially used (first priority rule). However, for example, the lower reversal path portion 33D that is closer to the boundary between the upper stage UF and the lower stage DF may also be used.

(2) In the above embodiment, in the reverse path block 5, the upper reverse path unit 33 includes an upper reverse path portion 33U and a lower reverse path portion 33D, and the lower reverse path unit 35 includes an upper reverse path portion. 35U and the lower reversal path portion 35D. However, the present invention is not limited to this configuration. In other words, the upper reversal path unit 33 and the lower reversal path unit 35 may also be configured with three or more reversal path portions. When the reversing path unit 31 is composed of three reversing path portions in the upper stage UF and the lower segment DF, that is, the upper stage UF is composed of an upper reversing path portion, a center reversing path portion, and a lower reversing path portion, When the lower stage DF is composed of an upper reversal path portion, a center reversal path portion, and a lower reversal path portion, it is only necessary to give priority to use as described below (the second priority rule). For example, in the lower DF, not only the upper reversal path portion, but the central reversal path portion is also closer to the boundary between the upper UF and the lower DF than the lower reversal path portion, so as long as the central reversal path portion is also preferentially used. That is, since the central reversal path portion is second to the upper reversal path portion and is closer to the boundary between the upper stage UF and the lower stage DF than the lower reversal path portion, it is used one by one in the closest order.

Furthermore, when the central reversal path is used preferentially, the indexing robot TID preferentially transfers the substrate W to the boundary between the upper UF and the lower DF based on the rotation axis P4 in the central reversal path. The frame department. Therefore, even if the upper reversal path portion, the central reversal path portion, and the lower reversal path portion that are closest to the boundary cannot be used, priority will be given to using the frame that is as close as possible to the boundary between the upper and lower sections. . As a result, it is possible to reliably shorten the moving distance of one indexing manipulator in the vertical direction.

(3) In the above embodiment, the hand 21 of one indexing manipulator TID is located at the boundary between the upper UF and the lower DF in the standby state, but the present invention is not limited to this configuration. For example, even if the hand 21 is not located at the junction, it can be set to stand by at the position of the upper UF closer to the lower DF, or the position of the lower DF closer to the upper UF.

(4) In the above embodiment, the central robot CR2 will preferentially transfer the substrate W processed in the processing block 7 to the upper reversing path portion 35U that is closer to the boundary between the upper UF and the lower DF. However, for example, the lower reversal path portion 33D that is closer to the boundary between the upper stage UF and the lower stage DF may also be used. In addition, in the present invention, this configuration is not essential, and only the indexing robot TID may be used preferentially for the above-mentioned reversing path portion. (Industrial availability)

As described above, the present invention is applicable to a substrate processing apparatus that performs cleaning processes such as surface cleaning or back cleaning.

1: Substrate processing equipment 3: Index block 3a: Upper inlet and outlet 3b: Lower inlet and outlet 5: Reverse path block 7: Processing block 9: Transport block 11: Public block 13: Vehicle loading department 15: Rail 17,67: Abutment 17a: Abutment body 17b: fixed arm 19: Multi-joint arm 19a: arm 1 19b: 2nd arm 19c: 3rd arm 21: Hands 21a～21d: Hand body 25: Mounting frame 27: Mounting the suspension frame 29: Suspension frame 31: Reverse path unit 33: Upper reversal path unit 33a, 35a: Reverse path frame body 33b, 35b: Frame spacer 33D, 35D: Lower reversal path part 33U, 35U: Upper reversal path section 35: Lower reversal path unit 37, 39: fixed parts 41: Guiding Department 43: Rotation holding part 45, 47: Shelf 49: Rotating member 51: Suction Chuck 53: Protective parts 55: Treatment nozzle 57: mechanical chuck 59: Protective parts 61: Washing brush 63: fixed frame 65: movable frame 69: Rotating base 71: arm 71a, 71b: arm body AID, CTS: transport space C: Vehicle CR1, CR2: Central manipulator DF: Lower paragraph P1～P4: Rotation axis PU, PU11～14, PU21～24, PU31～34, PU41～44: processing unit SP: Space SS: Surface cleaning unit SSR: Back washing unit TID: Indexing robot TW1～TW4: Tower unit UF: Upper paragraph VL: imaginary line W: substrate X: front and rear direction XB: Rear XF: Forward Y: width direction YL: Left YR: Right Z: Up and down direction

FIG. 1 is a perspective view showing the overall structure of the substrate processing apparatus of the embodiment. Fig. 2 is a top view of the substrate processing apparatus, and is a diagram showing the upper layer in the upper section of the processing block. FIG. 3 is a top view of the substrate processing apparatus, and is a diagram showing the upper and lower layers of the processing block. Fig. 4 is a side view of the substrate processing apparatus. Fig. 5 is a perspective view showing the whole indexing manipulator. Fig. 6 is a perspective view showing the hand of the indexing manipulator, Fig. 6(a) shows a 4-piece hand body, and Fig. 6(b) shows a 2-piece hand body. Fig. 7 is a perspective view of the reverse path block in the state of the index block viewed from the back. Fig. 8 is a diagram showing the state of the index block and the reverse path block viewed from the left side. Fig. 9 is a perspective view showing the main part of the reversing path unit. Fig. 10 (a) to (d) are diagrams illustrating the operation of the reverse path unit. Fig. 11 is an exploded perspective view showing the state of the substrate processing apparatus during transportation. Figure 12 is a perspective view showing the main part of the transport block. Fig. 13 is a schematic diagram for explaining an example of the transfer between the indexing manipulator and the processing block in the cleaning process of the front and back. Fig. 14 is a schematic diagram for explaining an example of the transfer between the indexing manipulator and the processing block in the surface cleaning process. FIG. 15 is a schematic diagram for explaining an example of the transfer between the indexing manipulator and the processing block in the back washing process.

5: Reverse path block

7: Processing block

31: Reverse path unit

33: Upper reversal path unit

33D, 35D: Lower reversal path part

33U, 35U: Upper reversal path part

35: Lower reversal path unit

DF: Lower paragraph

PU11~14, PU21~24, PU31~34, PU41~44: processing unit

SS: Surface cleaning unit

SSR: Back washing unit

TW1~TW4: Tower unit

UF: Upper paragraph

X: front and rear direction

XB: Rear

XF: Forward

Z: Up and down direction

Claims (6)

A substrate processing device, which is a person who cleans and treats substrates; and is characterized in that, It has: The indexing block is provided with a carrier placing part for placing a carrier containing a plurality of substrates, and an indexing manipulator for transporting the substrate between it and the carrier of the carrier placing part; A processing block, which has a surface cleaning unit for cleaning the surface of the substrate and a back cleaning unit for cleaning the back of the substrate, as a processing unit, and the above-mentioned processing units are respectively provided in the upper and lower stages; and A reversing path block, which is arranged between the indexing block and the processing block, has a plurality of racks for placing the substrate, and has a reversal function for reversing the front and back of the substrate; In the above-mentioned processing block, the above-mentioned upper stage and the above-mentioned lower stage are respectively provided with a center manipulator for transferring substrates between the above-mentioned processing units and the above-mentioned reversing path block, The reversing path block includes: an upper reversing path unit including a plurality of reversing path portions corresponding to the upper segment; and a lower reversing path unit including a plurality of reversing path portions corresponding to the lower segment; The indexing manipulator transfers the substrate to the reversing path section, wherein the priority is given to the plurality of reversing path sections of the upper reversing path unit and the plurality of reversing path sections of the lower reversing path unit. The above-mentioned upper section and the above-mentioned lower section are closer to each other. Such as the substrate processing apparatus of claim 1, wherein: The indexing manipulator transfers the substrate to the reversal path section, wherein the priority is given to the frame section that is closer to the boundary between the upper section and the lower section based on the rotation axis in the reversal path section. Such as the substrate processing apparatus of claim 1 or 2, wherein, The central manipulator will transfer the substrate processed in the processing block to the reversing path section, wherein the priority is given to the plurality of reversing path sections of the upper reversing path unit and one of the lower reversing path unit Among the plurality of reversing path portions, the one that is closer to the boundary between the above-mentioned upper section and the above-mentioned lower section. Such as the substrate processing apparatus of any one of claims 1 to 3, wherein: The indexing manipulator is provided with: a guide rail which is fixedly erected in a horizontal direction; a base part which moves up and down along the guide rail; a multi-joint arm which is arranged on the base part; and a hand which is placed on the The arm supporting base plate at the front end side of the multi-joint arm; In the standby state before entering and exiting the reverse path block, the hand is located at the boundary of the upper section and the lower section. Such as the substrate processing apparatus of any one of claims 1 to 4, wherein: When only the surface cleaning unit is used for the surface cleaning process of the substrate, the inversion path block only places the substrate without inverting it. Such as the substrate processing apparatus of any one of claims 1 to 4, wherein: In the case of using the front surface cleaning unit and the back surface cleaning unit for the front and back cleaning processing across the front and back of the substrate, the reverse path block is loaded before and before the back surface cleaning unit is loaded. Before cleaning the unit, the substrate was inverted twice.

Images