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TW202124086A - Assembly module, assembly apparatus and application method of assembly module capable of achieving the effects of easy to operate and quick assembly - Google Patents

Assembly module, assembly apparatus and application method of assembly module capable of achieving the effects of easy to operate and quick assembly Download PDF

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TW202124086A
TW202124086A TW110105744A TW110105744A TW202124086A TW 202124086 A TW202124086 A TW 202124086A TW 110105744 A TW110105744 A TW 110105744A TW 110105744 A TW110105744 A TW 110105744A TW 202124086 A TW202124086 A TW 202124086A
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assembly
mold
assembled
parts
assembling
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TW110105744A
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TWI759110B (en
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王鼎瑞
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王鼎瑞
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Abstract

An assembly module, an assembly apparatus and an application method of assembly module are provided. The assembly module includes a first assembly mold, a second assembly mold and at least one combination mold. The first assembly mold has a plurality of first assembly parts. The second assembly mold has a plurality of second assembly parts. The second assembly mold corresponds to the first assembly mold. The combination mold is removably provided at least one first assembly part, at least one second assembly part, or corresponding positions of at least one first assembly part and at least one second assembly part. Therefore, the assembly module can be used as a component required for assembling and an assembled body, so as to achieve the efficacy of easy to operate and quick assembly.

Description

組裝模組與組裝設備及組裝模組之應用方法Assembling module and assembling equipment and application method of assembling module

本發明係提供一種組裝模組與組裝設備及組裝模組之應用方法,尤指一種可作為組合所需之元件與被組裝體,而達到易於操作以及快速組裝之組裝模組與組裝設備及組裝模組之應用方法。The present invention provides an assembly module, assembly equipment and an application method of assembly modules, especially an assembly module and assembly equipment and assembly that can be used as components and assembled bodies required for assembly to achieve easy operation and rapid assembly The application method of the module.

按,一般元件之組裝模組,通常依據組裝之零件而具有多道組裝設備與製程,而導致操作之諸多不便,而影響組裝速度。By the way, the assembly module of general components usually has multiple assembly equipment and manufacturing processes depending on the assembled parts, which causes many inconveniences in operation and affects the assembly speed.

因此,如何發明出一種組裝模組與組裝設備及組裝模組之應用方法,以期可作為組合所需之元件與被組裝體,而達到易於操作以及快速組裝的目的,將是本發明所欲積極揭露之處。Therefore, how to invent an assembly module, assembly equipment, and an application method of assembly modules, in order to be used as the components and the assembled body required for the combination, and achieve the purpose of easy operation and rapid assembly, will be the active goal of the present invention. Revealed.

有鑑於上述習知技術之缺憾,發明人有感其未臻於完善,遂竭其心智悉心研究克服,進而研發出一種組裝模組與組裝設備及組裝模組之應用方法,以期可作為組合所需之元件與被組裝體,而達到易於操作以及快速組裝的目的。In view of the shortcomings of the above-mentioned conventional technology, the inventor felt that it was not perfect, so he exhausted his mind to study and overcome it, and then developed an assembly module, assembly equipment and application method of assembly module, hoping to be used as an assembly The required components and the assembled body can be easily operated and quickly assembled.

為達上述目的及其他目的,本發明係提供一種組裝模組,其包含:一第一組裝模具、一第二組裝模具以及至少一組合模具。該第一組裝模具具有多數第一組立部;該第二組裝模具具有多數第二組立部,該第二組裝模具與該第一組裝模具相對應;該組合模具可移除地設於至少一第一組立部、至少一第二組立部或至少一第一組立部及至少一第二組立部之相對應位置。To achieve the above and other objectives, the present invention provides an assembly module, which includes: a first assembly mold, a second assembly mold, and at least one assembly mold. The first assembly mold has a plurality of first assembly parts; the second assembly mold has a plurality of second assembly parts, and the second assembly mold corresponds to the first assembly mold; the assembly mold is removably provided on at least one second assembly mold. Corresponding positions of a set of standing parts, at least one second set of standing parts, or at least one first set of standing parts and at least one second set of standing parts.

本發明另提供一種組裝模組,其包含:一第一組裝模具或一第二組裝模具以及至少一組合模具。該第一組裝模具具有多數第一組立部,或該第二組裝模具具有多數第二組立部;該組合模具可移除地設於至少一第一組立部或至少一第二組立部。The present invention also provides an assembly module, which includes: a first assembly mold or a second assembly mold and at least one assembly mold. The first assembly mold has a plurality of first assembly parts, or the second assembly mold has a plurality of second assembly parts; the assembly mold is removably provided on at least one first assembly part or at least one second assembly part.

上述的組裝模組中,組合模具可依據組立之至少一元件或至少一被組裝體,而於該等第一組立部與該等第二組立部上進行更換。In the above-mentioned assembly module, the assembly mold can be replaced on the first assembly part and the second assembly part according to at least one component or at least one assembled body to be assembled.

上述的組裝模組中,該等第一組立部與該等第二組立部為矩陣排列或編碼法編碼排列定義所在位置In the above-mentioned assembly module, the first assembling parts and the second assembling parts are arranged in a matrix arrangement or a coding arrangement defining positions

上述的組裝模組中,該等第一組立部與該等第二組立部分別設置以組合模具進行組裝之至少一被組裝體,該被組裝體具有用以組合至少一元件之一被組裝部,該元件具有一填料空間,組合模具施壓於該元件,用以使該被組裝體之材料進入或流入該填料空間。In the above-mentioned assembly module, the first assembling parts and the second assembling parts are respectively provided with at least one assembled body assembled by a combination mold, and the assembled body has an assembled part for assembling at least one element The element has a filling space, and the combined mold presses on the element to allow the material of the assembled body to enter or flow into the filling space.

上述的組裝模組中,該等第一組立部與該等第二組立部分別設置以組合模具進行組裝之至少一被組裝體,該被組裝體具有用以組合至少一元件之一被組裝部,該元件具有一擴接部,組合模具施壓於該元件,用以使該元件之材料擴接於該被組裝體。In the above-mentioned assembly module, the first assembling parts and the second assembling parts are respectively provided with at least one assembled body assembled by a combination mold, and the assembled body has an assembled part for assembling at least one element , The component has an expansion part, and the combined mold presses the component to expand the material of the component to the assembled body.

上述的組裝模組中,組合模具分別具有一或一以上之合組部,該合組部設於一或一以上之第一組立部或第二組立部,用以符合組裝不同之至少一元件或至少一被組裝體,或用以符合組合之至少一元件於至少一被組裝體的空間或位置。In the above-mentioned assembly module, the assembly molds respectively have one or more assembly parts, and the assembly parts are arranged on one or more first assembly parts or second assembly parts for assembling at least one different component Or at least one assembled body, or at least one component used to match the space or position of at least one assembled body.

上述的組裝模組中,該等第一組立部或該等第二組立為孔部、槽部、凸部、凹部、階部、斜面部、弧面部、曲面部、平面部、扣部或螺紋部。In the above assembly module, the first assembly parts or the second assembly parts are holes, grooves, convex parts, concave parts, step parts, inclined parts, arc parts, curved parts, flat parts, buckles or threads Department.

上述的組裝模組中,組合模具具有與該等第一組立部或該等第二組立部組立之合組部,合組部為孔部、槽部、凸部、凹部、階部、斜面部、弧面部、曲面部、平面部、扣部或螺紋部。In the above assembly module, the combined mold has a combination part that is assembled with the first assembly part or the second assembly part, and the assembly part is a hole part, a groove part, a convex part, a concave part, a step part, and a slope part. , Curved surface, curved surface, flat surface, buckle or threaded portion.

上述的組裝模組中,組合之至少一元件或至少一被組裝體,或組合之至少一元件於至少一被組裝體,可設置為不同編輯方式,於不同之編輯方式執行時,可應用不同之組合模具設置於該等第一組立部與該等第二組立部之組合。In the above assembly module, at least one component or at least one assembled body, or at least one component combined in at least one assembled body, can be set to different editing methods, and different editing methods can be applied when different editing methods are executed. The combined mold is set in the combination of the first assembling parts and the second assembling parts.

上述的組裝模組中,該等第一組立部、該等第二組立部與組合模具之組合方式為鎖合、扣接、鉚接、磁吸、一體成型或銲接。In the above assembly module, the combination of the first assembly, the second assembly and the combined mold is locking, buckling, riveting, magnetic attraction, integral molding or welding.

上述的組裝模組中,先放置第一種之組合模具組立於第一種目標組裝位置,之後再放置第二種之組合模具組立於第二種目標組裝位置。In the above-mentioned assembly module, the first type of combined mold assembly is first placed at the first type of target assembly position, and then the second type of combined mold assembly is placed at the second type of target assembly position.

上述的組裝模組中,組合模具分別具有一或一以上之合組部,合組部與該等第一組立部及該等第二組立部之組合方式為鎖合、扣接、鉚接磁吸、一體成型或銲接。In the above assembly module, the combined mold has one or more assembly parts, and the assembly method of the assembly part and the first assembly parts and the second assembly parts is locking, buckling, riveting, and magnetic attraction. , One-piece molding or welding.

上述的組裝模組中,該等第一組立部或該等第二組立部為矩陣排列,各該第一組立部與各該第二組立部間為相同之距離或不同之距離。In the above-mentioned assembly module, the first assembling parts or the second assembling parts are arranged in a matrix, and each of the first assembling parts and each of the second assembling parts are at the same distance or different distances.

上述的組裝模組中,該等第一組立部與該等第二組立部以編碼方式管理,或組合模具以編碼方式管理。In the above-mentioned assembly module, the first assembly parts and the second assembly parts are managed in a coded manner, or the combined molds are managed in a coded manner.

上述的組裝模組中,該等第一組立部與該等第二組立部以編碼方式管理,或組合模具具有一或一以上之合組部,該合組部以編碼方式管理,或該組合模具以編碼方式管理。In the above assembly module, the first assembly parts and the second assembly parts are managed by coding, or the assembly mold has one or more assembly parts, and the assembly part is managed by coding, or the assembly The mold is managed in a coded manner.

上述的組裝模組中,該等第一組立部與該等第二組立部或組合模具間之不同組合或排列組合,可產生不同之組立應用高度、空間、位置或力量配置組合。In the above assembly module, the different combinations or permutations between the first assembling parts and the second assembling parts or assembling molds can produce different assembling application heights, spaces, positions, or power configuration combinations.

上述的組裝模組中,該第一組裝模具、該第二組裝模具、該等第一組立部、該等第二組立部、組合模具或組合模具之一合組部以銑床、車床、CNC加工、模具射出、鍛造或模具加工方式製作。In the above assembly module, the first assembly mold, the second assembly mold, the first assembly parts, the second assembly parts, the combined mold, or one of the combined molds are processed by a milling machine, a lathe, or CNC , Mold injection, forging or mold processing methods.

上述的組裝模組中,該第一組裝模具、該第二組裝模具、該等第一組立部、該等第二組立部、組合模具或組合模具之一合組部為螺紋部、柱體、錐體、凹部、凸部、平面部、斜面部、階部、曲面部或弧面部。In the above assembly module, the first assembly mold, the second assembly mold, the first assembly parts, the second assembly parts, the combined mold, or one of the combined molds are threaded parts, cylinders, Cone, concave, convex, flat, inclined, step, curved, or arc.

上述的組裝模組中,該第一組裝模具之該等第一組立部或該第二組裝模具之該等第二組立部於不變動或變動之條件下,依據不同或相同之至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體之安排,選用或設計適合之至少一組合模具進行組裝。In the above assembly module, the first assembly parts of the first assembly mold or the second assembly parts of the second assembly mold are based on different or identical at least one element, At least one assembled body or at least one component is assembled in at least one assembled body, and at least one combination mold suitable for assembly is selected or designed.

上述的組裝模組中,該第一組裝模具、該第二組裝模具、該等第一組立部、該等第二組立部、組合模具或該組合模具之一合組部可選用自動化組立裝置、施壓裝置或螺鎖裝置進行組裝。In the above-mentioned assembly module, the first assembly mold, the second assembly mold, the first assembly parts, the second assembly parts, the combined mold, or one of the combined molds can select an automated assembly device, Pressure device or screw lock device for assembly.

上述的組裝模組中,組合模具可組立至少一元件,該元件為一扣件,該元件具有活動組接之一頭部或身部,該頭部可設置扣部。In the above-mentioned assembling module, the combined mold can assemble at least one element, which is a fastener, and the element has a movably assembled head or body, and the head can be provided with a buckle.

上述的組裝模組中,該扣部為柱體、螺紋體、外扣體或內扣體。In the above assembly module, the buckle part is a cylinder, a threaded body, an outer buckle body, or an inner buckle body.

上述的組裝模組中,更包括有一彈性元件,該彈性元件一端抵頂該頭部,另一端抵頂該身部。The above-mentioned assembly module further includes an elastic element, one end of the elastic element abuts against the head part, and the other end of the elastic element abuts against the body part.

上述的組裝模組中,該元件具有填料空間、擴接部、螺紋部或被施壓部,另該元件為單零件,或多零件之組合。In the above assembly module, the element has a filling space, an expansion part, a threaded part or a pressed part, and the element is a single part or a combination of multiple parts.

上述的組裝模組中,該元件具有一頸部,或該元件具有錐部或螺紋部,或該頸部用以扣入另一物體。In the above-mentioned assembly module, the element has a neck, or the element has a taper portion or a threaded portion, or the neck is used to buckle another object.

上述的組裝模組中,該元件裝置於一載體,且以一工具取起。In the above-mentioned assembly module, the component is mounted on a carrier and taken up with a tool.

上述的組裝模組中,該工具為真空吸取器、夾具、扣具或磁吸器。In the above assembly module, the tool is a vacuum suction device, a clamp, a fastener or a magnetic suction device.

上述的組裝模組中,該等第一組立部、該等第二組立部與組合模具可對應配對組合成不同之位置、高度或型式之組裝,以增加組合模具於至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體時之共用性。In the above assembly module, the first assembly part, the second assembly part and the assembly mold can be matched and assembled into different positions, heights or types of assembly, so as to increase the assembly mold in at least one element and at least one quilt. The commonality when the assembly or at least one component is assembled in at least one to be assembled.

上述的組裝模組中,該第一組裝模具及該第二組裝模具可與該等第一組立部及該等第二組立部一體成型、或該第一組裝模具及該第二組裝模具可與組合模具一體成型、或該第一組裝模具及該第二組裝模具可與該等第一組立部、該等第二組立部及組合模具一體成型。In the above assembly module, the first assembly mold and the second assembly mold may be integrally formed with the first assembly parts and the second assembly parts, or the first assembly mold and the second assembly mold may be integrated with the first assembly mold and the second assembly mold. The combined mold is integrally formed, or the first assembly mold and the second assembly mold can be integrally formed with the first assembly parts, the second assembly parts, and the assembly mold.

上述的組裝模組中,該第一組裝模具或該第二組裝模具同時安裝於同一台組裝設備,或一台組裝設備中只具有該第一組裝模具,或一台組裝設備中只具有該第二組裝模具。In the aforementioned assembly module, the first assembly mold or the second assembly mold is installed in the same assembly equipment at the same time, or one assembly equipment only has the first assembly mold, or one assembly equipment only has the first assembly mold. 2. Assemble the mold.

本發明另提供一種組裝設備,該第一組裝模具與該第二組裝模具設置於該組裝設備,該組裝設備或該第一組裝模具與該第二組裝模具具有一固定部,用以固接設置。The present invention also provides an assembly device. The first assembly mold and the second assembly mold are set on the assembly device, and the assembly device or the first assembly mold and the second assembly mold have a fixing portion for fixed connection. .

上述的組裝設備中,該組裝設備或該第一組裝模具與該第二組裝模具具有一固定部,用以固接設置。In the above-mentioned assembling equipment, the assembling equipment or the first assembling mold and the second assembling mold have a fixing part for fixing and setting.

上述的組裝設備中,該組裝設備具有一機架部作為機架,該機架部具有一輪動部作為輪動。In the aforementioned assembling equipment, the assembling equipment has a frame part as a frame, and the frame part has a rotating part as a rotating part.

上述的組裝設備中,該組裝設備之施壓驅動為空壓驅動、油壓驅動、手施壓驅動、電力驅動、螺桿力驅動、磁力驅動或外力驅動。In the above assembly equipment, the pressure driving of the assembly equipment is air pressure driving, oil pressure driving, hand pressure driving, electric driving, screw force driving, magnetic driving or external force driving.

上述的組裝設備中,該組裝設備具有下壓部,用以下壓至少一元件或至少一被組裝體,或將至少一元件組裝於至少一被組裝體。In the above-mentioned assembling equipment, the assembling equipment has a pressing part for pressing down at least one element or at least one assembled body, or assembling at least one element to at least one assembled body.

上述的組裝設備中,該下壓部具有上部與下部,可下壓該上部進入該下部,或該下部進入該上部。In the above assembly equipment, the pressing part has an upper part and a lower part, and the upper part can be pressed down to enter the lower part, or the lower part can enter the upper part.

上述的組裝設備中,該組裝設備可選用自動化組立裝置、施壓裝置或螺鎖裝置進行組裝。Among the above-mentioned assembly equipment, the assembly equipment can be assembled by using an automated assembly device, a pressing device or a screw locking device.

上述的組裝設備中,該組裝設備具有一操作面板。In the above-mentioned assembling equipment, the assembling equipment has an operation panel.

上述的組裝設備中,該組裝設備具有一加熱器,可加熱具有可焊表面之一元件、具有可焊表面之一被組裝體、或於一元件與一被組裝體間之焊錫,用以進行加熱焊接該元件與該被組裝體。In the above assembly equipment, the assembly equipment has a heater that can heat a component with a solderable surface, an assembled body with a solderable surface, or solder between a component and an assembled body to perform Heat welding the component and the assembled body.

上述的組裝設備中,該等第一組立部、該等第二組立部與組合模具可對應配對組合成不同之位置、高度或型式之組裝,以增加組合模具與該組裝設備於至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體時之共用性。In the above assembly equipment, the first assembly part, the second assembly part and the assembly mold can be matched and assembled into different positions, heights or types of assembly, so as to increase the assembly mold and the assembly equipment in at least one element, The commonality when at least one assembled body or at least one component is assembled in at least one assembled body.

本發明另提供一種組裝模組之應用方法,其先裝置組裝模組於第一組立部或第二組立部,再放置至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體於組裝模組,再用以組裝模組施壓至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體以用以組裝。The present invention also provides an application method of an assembled module. The assembly module is first installed in the first assembly part or the second assembly part, and then at least one component, at least one assembled body or at least one component is assembled in at least one assembled part. The assembly module is used for the assembly module to press at least one component, at least one assembled body, or at least one component assembled in at least one assembled body for assembly.

本發明另提供一種組裝模組之應用方法,其先裝置組裝模組於第一組立部或第二組立部,再放置至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體於組裝模組,再用以組裝模組施壓至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體以用以組裝;其中該等第一組立部或該等第二組立部以編碼方式管理,或組合模具有一或一以上之合組部,合組部以編碼方式管理,或組合模具以編碼方式管理。The present invention also provides an application method of an assembled module. The assembly module is first installed in the first assembly part or the second assembly part, and then at least one component, at least one assembled body or at least one component is assembled in at least one assembled part. Body in the assembly module, and then used to assemble the module to press at least one component, at least one assembled body, or at least one component assembled in at least one assembled body for assembly; wherein the first assembly part or the first assembly The second assembly department is managed by coding, or the combination mold has one or more than one assembly department, the assembly department is managed by coding, or the combination mold is managed by coding.

本發明另提供一種組裝模組之應用方法,其先裝置組裝模組於第一組立部或第二組立部再放置至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體於組裝模組,再用以組裝模組施壓至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體以用以組裝;其中該等第一組立部或該等第二組立部或組合模具間之不同組合或排列組合,可產生不同之組立應用高度、空間、位置或力量配置組合。The present invention also provides an application method of an assembly module, which first installs the assembly module on the first assembly part or the second assembly part and then places at least one component, at least one assembled body, or at least one component assembled on at least one assembled body In the assembly module, the assembly module is then used to press at least one component, at least one assembled body, or at least one component assembled in at least one assembled body for assembly; wherein the first assembly part or the second assembly The different combinations or permutations between the assembly parts or the combination molds can produce different assembly application heights, spaces, positions or strength configuration combinations.

本發明另提供一種組裝模組之應用方法,其更包含一種組裝設備,該第一組裝模具或該第二組裝模具設置於該組裝設備;可先裝置組合模具於第一組立部或第二組立部再放置至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體於組合模具,再用以組合模具施壓至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體以用以組裝;其中該等第一組立部或該等第二組立部以編碼方式管理,或組合模具有一或一以上之合組部,合組部以編碼方式管理,或組合模具以編碼方式管理。The present invention also provides an application method of an assembly module, which further includes an assembly equipment. The first assembly mold or the second assembly mold is set in the assembly equipment; the assembly mold can be installed in the first assembly part or the second assembly first. Place at least one component, at least one assembled body, or at least one component assembled in at least one assembled body in a combined mold, and then use the combined mold to press at least one component, at least one assembled body, or at least one component assembled in at least An assembled body for assembling; wherein the first assembly part or the second assembly part is managed by coding, or the combination mold has one or more assembly parts, and the assembly part is managed by coding, or assembly The mold is managed in a coded manner.

本發明另提供一種組裝模組之應用方法,其更包含一種組裝設備,該第一組裝模具或該第二組裝模具設置於該組裝設備;可先裝置組合模具於第一組立部或第二組立部再放置至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體於組合模具,再用以組合模具施壓至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體以用以組裝;其中該等第一組立部或該等第二組立部或組合模具間之不同組合或排列組合,可產生不同之組立應用高度、空間、位置或力量配置組合。The present invention also provides an application method of an assembly module, which further includes an assembly equipment. The first assembly mold or the second assembly mold is set in the assembly equipment; the assembly mold can be installed in the first assembly part or the second assembly first. Place at least one component, at least one assembled body, or at least one component assembled in at least one assembled body in a combined mold, and then use the combined mold to press at least one component, at least one assembled body, or at least one component assembled in at least An assembled body is used for assembling; wherein the different combinations or permutations between the first assembly parts or the second assembly parts or the assembly molds can produce different assembly application heights, spaces, positions, or power configuration combinations.

藉此,本發明之組裝模組與組裝設備及組裝模組之應用方法,可作為組合所需之元件與被組裝體,而達到易於操作以及快速組裝的目的。As a result, the assembly module, assembly equipment, and application method of the assembly module of the present invention can be used as the components and the assembled body required for combination, so as to achieve the purpose of easy operation and rapid assembly.

為充分瞭解本發明之目的、特徵及功效,茲藉由下述具體之實施例,並配合所附之圖式,對本發明做一詳細說明,說明如後:In order to fully understand the purpose, features, and effects of the present invention, the following specific embodiments are used in conjunction with the accompanying drawings to give a detailed description of the present invention. The description is as follows:

請參考圖1至圖4,如圖所示,本發明係提供一種組裝模組與組裝設備及組裝模組之應用方法,該組裝模組1包含:一第一組裝模具11、一第二組裝模具12以及至少一組合模具13。Please refer to Figures 1 to 4, as shown in the figure, the present invention provides an assembly module, assembly equipment and an application method of the assembly module. The assembly module 1 includes: a first assembly mold 11, a second assembly The mold 12 and at least one combined mold 13.

該第一組裝模具11具有多數第一組立部111。The first assembly mold 11 has a plurality of first assembly parts 111.

該第二組裝模具12具有多數第二組立部121,該第二組裝模具12與該第一組裝模具11相對應。The second assembly mold 12 has a plurality of second assembly parts 121, and the second assembly mold 12 corresponds to the first assembly mold 11.

該組合模具13可移除地設於至少一第一組立部111、至少一第二組立部121或至少一第一組立部111及至少一第二組立部121之相對應位置。The combined mold 13 is removably disposed at the corresponding positions of at least one first assembly part 111, at least one second assembly part 121, or at least one first assembly part 111 and at least one second assembly part 121.

另外,該組裝模組1亦可包含該第一組裝模具11或該第二組裝模具12以及該組合模具13,而該組合模具13可移除地設於至少一第一組立部111或至少一第二組立部121之相對應位置。In addition, the assembly module 1 may also include the first assembly mold 11 or the second assembly mold 12 and the assembly mold 13, and the assembly mold 13 is removably provided on at least one first assembly portion 111 or at least one The corresponding position of the second assembly 121.

當組裝使用時,本發明使用以多數該組合模具13為實施例,可將該第一組裝模具11與該第二組裝模具12設置於一組裝設備2,該組裝設備2具有至少一下壓部21,且讓該等組合模具13依據組立之至少一元件3或至少一被組裝體4,而於該等第一組立部111與該等第二組立部121上進行更換,以使該等組合模具13符合該元件3或該被組裝體4之組裝需求,之後再由該組裝設備2之下壓部21下壓而施壓於該元件3(或該被組裝體4),藉以將至少一元件2組裝於至少一被組裝體4,而達到易於操作以及快速組裝的目的。When assembling and using, the present invention uses a majority of the combined mold 13 as an example, the first assembly mold 11 and the second assembly mold 12 can be set in an assembly device 2, the assembly device 2 has at least a lower pressure part 21 , And allow the combined molds 13 to be replaced on the first assembling parts 111 and the second assembling parts 121 according to the assembled at least one element 3 or at least one assembled body 4, so that the combined molds 13 meets the assembly requirements of the component 3 or the assembled body 4, and then is pressed down by the lower pressing portion 21 of the assembling device 2 to press the component 3 (or the assembled body 4), so that at least one component 2 Assemble at least one to be assembled body 4, so as to achieve the purpose of easy operation and quick assembly.

於本發明之較佳具體實施例中,該等第一組立部111與該等第二組立部121分別設置以該等組合模具13進行組裝之至少一被組裝體4,該被組裝體4具有用以組合至少一元件3之一被組裝部41,該元件3具有一填料空間38,該等組合模具13施壓於該元件3,用以使該被組裝體4之材料進入或流入該填料空間38,以使該元件3穩固結合於該被組裝體4。In a preferred embodiment of the present invention, the first assembling parts 111 and the second assembling parts 121 are respectively provided with at least one assembled body 4 assembled by the combined mold 13, and the assembled body 4 has For assembling at least one of the assembled parts 41 of the element 3, the element 3 has a filling space 38, and the combined molds 13 are pressed against the element 3 to allow the material of the assembled body 4 to enter or flow into the filling The space 38 allows the element 3 to be firmly combined with the assembled body 4.

於本發明之較佳具體實施例中,該第一組裝模具11或該第二組裝模具12可同時安裝於同一台組裝設備2,或 一台組裝設備2中只具有該第一組裝模具11,或一台組裝設備2中只具有該第二組裝模具12。如此,可使本發明能更符合實際運用之需求。In a preferred embodiment of the present invention, the first assembly mold 11 or the second assembly mold 12 can be installed in the same assembly equipment 2 at the same time, or one assembly equipment 2 only has the first assembly mold 11. Or one assembly device 2 only has the second assembly mold 12. In this way, the present invention can be more in line with actual application requirements.

如圖4所示,於本發明之較佳具體實施例中,該等第一組立部111與該等第二組立部121為矩陣排列或編碼法編碼排列定義所在位置。另外,以編碼法標示該等第一組立部111與該等第二組立部121之位置,再依據組立之至少一被組裝體4之組裝位置或至少一元件3之組裝位置,選擇編碼對應之該等組合模具13用以對應至少一被組裝體4之組裝位置或至少一元件3之組裝位置以進行組裝,且該等第一組立部111與該等第二組立部121為矩陣排列,各該第一組立部111與各該第二組立部121間為相同之距離或不同之距離。如此,可使本發明能更符合實際運用之需求。As shown in FIG. 4, in a preferred embodiment of the present invention, the first assembling parts 111 and the second assembling parts 121 are arranged in a matrix arrangement or a coding arrangement to define positions. In addition, the positions of the first assembling parts 111 and the second assembling parts 121 are marked by a coding method, and then according to the assembly position of at least one assembled body 4 or the assembly position of at least one component 3, the corresponding code is selected The combined molds 13 are used to assemble at least one assembly position of the assembled body 4 or at least one component 3 for assembly, and the first assembly parts 111 and the second assembly parts 121 are arranged in a matrix, each The distance between the first assembly portion 111 and each of the second assembly portions 121 is the same or different. In this way, the present invention can be more in line with actual application requirements.

於本發明之較佳具體實施例中,該等第一組立部111與該等第二組立部121分別為孔部、槽部、凸部、凹部、階部、斜面部、弧面部、曲面部、平面部、扣部或螺紋部。如此,可使本發明能更符合實際運用之需求。In a preferred embodiment of the present invention, the first assembling portions 111 and the second assembling portions 121 are respectively a hole portion, a groove portion, a convex portion, a concave portion, a step portion, an inclined surface portion, an arc surface portion, and a curved surface portion. , Flat part, buckle part or threaded part. In this way, the present invention can be more in line with actual application requirements.

於本發明之較佳具體實施例中,該等組合模具13分別具有與該等第一組立部111及該等第二組立部121組立之合組部131,該等合組部131為孔部、槽部、凸部、凹部、階部、斜面部、弧面部、曲面部、平面部、扣部或螺紋部,且該等合組部131與該等第一組立部111及該等第二組立部121之組合方式為鎖合、扣接、鉚接或磁吸。如此,可使本發明能更符合實際運用之需求。In a preferred embodiment of the present invention, the combined molds 13 respectively have combined parts 131 that are combined with the first assembling parts 111 and the second assembling parts 121, and the combined parts 131 are holes. , Groove, convex, concave, step, slope, arc, curved, flat, buckle, or threaded portion, and the combined portion 131 and the first assembling portion 111 and the second The combination method of the assembling part 121 is locking, buckling, riveting or magnetic attraction. In this way, the present invention can be more in line with actual application requirements.

於本發明之較佳具體實施例中,該組裝設備2之施壓驅動為空壓驅動、油壓驅動、手施壓驅動、電力驅動、螺桿力驅動、磁力驅動或外力驅動。如此,可使本發明能更符合實際運用之需求。In a preferred embodiment of the present invention, the pressure driving of the assembly equipment 2 is air pressure driving, oil pressure driving, hand pressure driving, electric driving, screw force driving, magnetic driving or external force driving. In this way, the present invention can be more in line with actual application requirements.

於本發明之較佳具體實施例中,該組裝設備2可選用自動化組立裝置、施壓裝置或螺鎖裝置進行組裝。如此,可使本發明能更符合實際運用之需求。In a preferred embodiment of the present invention, the assembling equipment 2 can be assembled using an automated assembly device, a pressing device or a screw locking device. In this way, the present invention can be more in line with actual application requirements.

於本發明之較佳具體實施例中,該組裝設備2具有一操作面板22。如此,可使本發明能更符合實際運用之需求。In the preferred embodiment of the present invention, the assembling equipment 2 has an operation panel 22. In this way, the present invention can be more in line with actual application requirements.

於本發明之較佳具體實施例中,該等第一組立部111、該等第二組立部121與該等組合模具13之組合方式為鎖合、扣接、鉚接或磁吸。In a preferred embodiment of the present invention, the combination of the first assembling parts 111, the second assembling parts 121 and the combined molds 13 is locking, buckling, riveting or magnetic attraction.

於本發明之較佳具體實施例中,該等組合模具13分別具有一或一以上之合組部131,該等合組部131設於一或一以上之第一組立部111與第二組立部121,以符合組裝之至少一元件3或至少一被組裝體4,或組合之至少一元件3於至少一被組裝體4的空間或位置。如此,可使本發明能更符合實際運用之需求。In a preferred embodiment of the present invention, the combined molds 13 respectively have one or more combining parts 131, and the combining parts 131 are provided on one or more of the first and second assembly parts 111 and 111 respectively. The portion 121 conforms to the space or position of the assembled at least one element 3 or the at least one assembled body 4, or the combined at least one element 3 in the at least one assembled body 4. In this way, the present invention can be more in line with actual application requirements.

於本發明之較佳具體實施例中,該等第一組立部111與該等第二組立部121或該等組合模具13間之不同組合或排列組合,可產生不同之組立應用高度、空間、位置或力量配置組合。如此,可使本發明能更符合實際運用之需求。In a preferred embodiment of the present invention, the different combinations or permutations between the first assembling parts 111 and the second assembling parts 121 or the combined molds 13 can produce different assembly application heights, spaces, Combination of position or power configuration. In this way, the present invention can be more in line with actual application requirements.

於本發明之較佳具體實施例中,該第一組裝模具11、該第二組裝模具12、該等第一組立部111、該等第二組立部121、該等組合模具13或該等合組部131以銑床、車床、CNC加工、模具射出、鍛造或模具加工方式製作。如此,可使本發明能更符合實際運用之需求。In a preferred embodiment of the present invention, the first assembly mold 11, the second assembly mold 12, the first assembly parts 111, the second assembly parts 121, the assembly molds 13, or the assembly molds The assembly part 131 is made by milling machine, lathe, CNC machining, mold injection, forging or mold processing. In this way, the present invention can be more in line with actual application requirements.

於本發明之較佳具體實施例中,該第一組裝模具11、該第二組裝模具12、該等第一組立部111、該等第二組立部121、該等組合模具13或該等合組部131為螺紋部、柱體、錐體、凹部、凸部、平面部、斜面部、階部、曲面部或弧面部。如此,可使本發明能更符合實際運用之需求。In a preferred embodiment of the present invention, the first assembly mold 11, the second assembly mold 12, the first assembly parts 111, the second assembly parts 121, the assembly molds 13, or the assembly molds The assembly portion 131 is a threaded portion, a cylinder, a cone, a concave portion, a convex portion, a flat surface, an inclined surface, a stepped portion, a curved surface, or a curved surface. In this way, the present invention can be more in line with actual application requirements.

於本發明之較佳具體實施例中,該等第一組立部111、該等第二組立部121與該等組合模具13可對應配對組合成不同之位置、高度或型式之組裝,以增加該等組合模具13與該組裝設備2於至少一元件3、至少一被組裝體4或至少一元件3組裝於至少一被組裝體4時之共用性。如此,可使本發明能更符合實際運用之需求。In a preferred embodiment of the present invention, the first assembling parts 111, the second assembling parts 121 and the combined molds 13 can be matched and assembled into different positions, heights or types of assembly to increase the The commonality of the combination mold 13 and the assembly device 2 when at least one element 3, at least one assembled body 4, or at least one element 3 is assembled in at least one assembled body 4. In this way, the present invention can be more in line with actual application requirements.

於本發明之較佳具體實施例中,該第一組裝模具11、該第二組裝模具12、該等第一組立部111、該等第二組立部121、該等組合模具13或該等組合模具13之合組部131可選用自動化組立裝置、施壓裝置或螺鎖裝置進行組裝。如此,可使本發明能更符合實際運用之需求。In a preferred embodiment of the present invention, the first assembly mold 11, the second assembly mold 12, the first assembly parts 111, the second assembly parts 121, the assembly molds 13, or the assembly The assembly part 131 of the mold 13 can be assembled with an automatic assembly device, a pressing device or a screw locking device. In this way, the present invention can be more in line with actual application requirements.

請參考圖5,如圖所示,於本發明之較佳具體實施例中,於組合之至少一元件3或至少一被組裝體4,或組合之至少一元件3於至少一被組裝體4,可設置為不同編輯方式,於不同之編輯方式執行時,可應用不同之組合模具13設置於該等第一組立部111與該等第二組立部121之組合。且該等第一組立部111與該等第二組立部121以編碼方式管理,該等組合模具13與該等合組部131以編碼方式管理。如此,可使本發明能更符合實際運用之需求。Please refer to FIG. 5, as shown in the figure, in a preferred embodiment of the present invention, at least one element 3 or at least one assembled body 4 is combined, or at least one element 3 is combined with at least one assembled body 4 , It can be set to different editing modes. When different editing modes are executed, different combination molds 13 can be used to set in the combination of the first assembling parts 111 and the second assembling parts 121. In addition, the first assembling parts 111 and the second assembling parts 121 are managed in a coding manner, and the combined molds 13 and the combining parts 131 are managed in a coding manner. In this way, the present invention can be more in line with actual application requirements.

請參考圖6,如圖所示,於本發明之較佳具體實施例中,該組裝設備2具有一固定部23,用以固接設置該第二組裝模具12,且該組裝設備2具有一機架部24作為機架,該機架部24具有一輪動部25作為輪動。如此,可使本發明能更符合實際運用之需求。Please refer to FIG. 6, as shown in the figure, in a preferred embodiment of the present invention, the assembling device 2 has a fixing portion 23 for fixing the second assembling mold 12, and the assembling device 2 has a The frame part 24 serves as a frame, and the frame part 24 has a wheel movement part 25 as a wheel movement. In this way, the present invention can be more in line with actual application requirements.

請參考圖7,如圖所示,於本發明之較佳具體實施例中,該等第一組立部111與該等第二組立部121以編碼方式管理,該等組合模具13與該等合組部131以編碼方式管理,且該第一組裝模具11、該第二組裝模具12、該等第一組立部111、該等第二組立部121、該等組合模具13或該等合組部131可設置為不同專案編輯a方式,於不同之專案編輯a方式執行時,可應用不同之組合模具13設置於該等第一組立部111與該等第二組立部121之組合,以達成每一不同專案之組裝專案目的。組裝時可先放置第一種之組合模具13組立於第一種目標組裝位置,之後再放置第二種之組合模具13組立於第二種目標組裝位置,於組合之至少一元件3或至少一被組裝體4,或組合之至少一元件3於至少一被組裝體4;且該等第一組立部111、該等第二組立部121與該等組合模具13可對應配對組合成不同之位置、高度或型式之組裝,以增加該等組合模具13與該組裝設備2於至少一元件3、至少一被組裝體4或至少一元件3組裝於至少一被組裝體4時之共用性。如此,可使本發明能更符合實際運用之需求。Please refer to FIG. 7, as shown in the figure, in a preferred embodiment of the present invention, the first assembling parts 111 and the second assembling parts 121 are managed in a coded manner, and the combined molds 13 are combined with the The assembly part 131 is managed by coding, and the first assembly mold 11, the second assembly mold 12, the first assembly parts 111, the second assembly parts 121, the assembly molds 13, or the assembly parts 131 can be set to different project editing mode a. When different project editing mode a is executed, different combination molds 13 can be used to set the combination of the first assembly parts 111 and the second assembly parts 121 to achieve each The purpose of the assembly project for a different project. When assembling, you can place the first combination mold 13 and set it in the first target assembly position, and then place the second combination mold 13 and set it in the second target assembly position. At least one component 3 or at least one assembly The assembled body 4, or the combined at least one component 3 in at least one assembled body 4; and the first assembling parts 111, the second assembling parts 121, and the assembling molds 13 can be matched and combined into different positions correspondingly , Height or type of assembly to increase the commonality of the combination mold 13 and the assembly equipment 2 when at least one element 3, at least one assembled body 4 or at least one element 3 is assembled in at least one assembled body 4. In this way, the present invention can be more in line with actual application requirements.

於本發明之較佳具體實施例中,該組裝設備2之施壓驅動裝置5為空壓驅動或油壓驅動。In a preferred embodiment of the present invention, the pressure driving device 5 of the assembly equipment 2 is pneumatically driven or hydraulically driven.

請參考圖8,如圖所示,於本發明之較佳具體實施例中,該組裝設備2具有多數下壓部21,用以下壓至少一元件3或至少一被組裝體4,或將至少一元件3組裝於至少一被組裝體4,而該下壓部21具有上部211與下部212,可下壓該上部(例如桿體)211進入該下部(例如桶體)212,或該下部(例如桶體)212進入該上部(例如桿體)211。如此,可使本發明能更符合實際運用之需求。Please refer to FIG. 8, as shown in the figure, in a preferred embodiment of the present invention, the assembling device 2 has a plurality of pressing parts 21, and at least one element 3 or at least one assembled body 4 is pressed down, or at least An element 3 is assembled to at least one assembled body 4, and the pressing part 21 has an upper part 211 and a lower part 212, and the upper part (such as a rod) 211 can be pressed down to enter the lower part (such as a barrel) 212, or the lower part ( For example, the barrel body 212 enters the upper part (for example, the rod body) 211. In this way, the present invention can be more in line with actual application requirements.

請參考圖9,如圖所示,於本發明之較佳具體實施例中,該第一組裝模具11之該等第一組立部111與該第二組裝模具12之該等第二組立部121於不變動或變動之條件下,依據不同或相同之至少一元件3、至少一被組裝體4或至少一元件3組裝於至少一被組裝體4之安排,選用或設計適合之至少一組合模具13進行組裝。如此,可使本發明能更符合實際運用之需求。Please refer to FIG. 9, as shown in the figure, in a preferred embodiment of the present invention, the first assembly parts 111 of the first assembly mold 11 and the second assembly parts 121 of the second assembly mold 12 Under the condition of no change or change, according to the arrangement of different or the same at least one component 3, at least one assembled body 4 or at least one component 3 assembled in at least one assembled body 4, select or design at least one suitable combination mold 13 Perform assembly. In this way, the present invention can be more in line with actual application requirements.

請參考圖10及圖11,如圖所示,於本發明之較佳具體實施例中,該第一組裝模具11與該第二組裝模具12可配合該組裝設備2選用自動化施壓裝置26(如圖10),或自動化螺鎖裝置27(如圖11)進行組裝。Please refer to Figure 10 and Figure 11, as shown in the figure, in a preferred embodiment of the present invention, the first assembly mold 11 and the second assembly mold 12 can cooperate with the assembly equipment 2 to select an automatic pressing device 26 ( As shown in Figure 10), or the automated screw locking device 27 (Figure 11) is assembled.

請參考圖12至圖14,如圖所示,於本發明之較佳具體實施例中,該等組合模具13可組立至少一元件3,該元件3為一扣件,該元件3具有活動組接之一頭部31與身部32,該頭部31可設置扣部33;其中該扣部33為柱體(如圖12之a部分)、螺紋體(如圖12之b部分)、外扣體(如圖12之c部分)或內扣體(如圖12之d部分),另外更包括有一彈性元件34,該彈性元件34一端抵頂該頭部31,另一端抵頂該身部32。如此,可使本發明能更符合實際運用之需求。Please refer to Figures 12 to 14, as shown in the figure, in a preferred embodiment of the present invention, the combined molds 13 can be assembled with at least one element 3, the element 3 is a fastener, the element 3 has a movable assembly Connecting a head 31 and a body 32, the head 31 can be provided with a buckle 33; wherein the buckle 33 is a cylinder (part a in Figure 12), a threaded body (part b in Figure 12), and The buckle body (part c in Figure 12) or the inner buckle body (part d in Figure 12) further includes an elastic element 34. One end of the elastic element 34 abuts the head 31 and the other end abuts the body 32. In this way, the present invention can be more in line with actual application requirements.

於本發明之較佳具體實施例中,該元件3具有一頸部35,另該元件3具有錐部36或螺紋部37,或該頸部用以扣入另一物體。且該元件3具有填料空間38、擴接部39、螺紋部或被施壓部,另該元件3為單零件,或多零件之組合。如此,可使本發明能更符合實際運用之需求。In a preferred embodiment of the present invention, the element 3 has a neck 35, and the element 3 has a taper portion 36 or a threaded portion 37, or the neck portion is used to buckle another object. And the element 3 has a filling space 38, an expansion part 39, a threaded part or a pressed part, and the element 3 is a single part or a combination of multiple parts. In this way, the present invention can be more in line with actual application requirements.

請參考圖15,如圖所示,於本發明之較佳具體實施例中,該元件3裝置於一載體7,且以一工具71取起,其中該工具71為真空吸取器、夾具、扣具或磁吸器。如此,可使本發明能更符合實際運用之需求。Please refer to FIG. 15, as shown in the figure, in a preferred embodiment of the present invention, the element 3 is mounted on a carrier 7, and is taken up by a tool 71, wherein the tool 71 is a vacuum suction device, a clamp, a buckle Tools or magnetic attractors. In this way, the present invention can be more in line with actual application requirements.

請參考圖16,如圖所示,於本發明之較佳具體實施例中,該元件3以該工具71取起。Please refer to FIG. 16, as shown in the figure, in a preferred embodiment of the present invention, the component 3 is taken up with the tool 71.

請參考圖17,如圖所示,於本發明之較佳具體實施例中,該等第一組立部111與該等第二組立部121分別設置以該等組合模具13進行組裝之至少一被組裝體4,該被組裝體4具有用以組合至少一元件3之一被組裝部41,該元件3具有一擴接部39,該等組合模具13施壓於該元件3,用以使該元件3之材料擴接於該被組裝體4。Please refer to FIG. 17, as shown in the figure, in a preferred embodiment of the present invention, the first assembling portions 111 and the second assembling portions 121 are respectively provided with at least one quilt assembled by the combined mold 13 The assembled body 4 has an assembled part 41 for combining at least one element 3, and the element 3 has an expansion part 39. The combined molds 13 press the element 3 to make the The material of the element 3 is expanded to the assembled body 4.

於本發明之較佳具體實施例中,該第一組裝模具11及該第二組裝模具12可與該等第一組立部111及該等第二組立部121一體成型、或該第一組裝模具11及該第二組裝模具12可與該等組合模具13一體成型、或該第一組裝模具11及該第二組裝模具12可與該等第一組立部111、該等第二組立部121及該等組合模具13一體成型。如此,可使本發明能更符合實際運用之需求。In a preferred embodiment of the present invention, the first assembly mold 11 and the second assembly mold 12 can be integrally formed with the first assembly parts 111 and the second assembly parts 121, or the first assembly mold 11 and the second assembly mold 12 may be integrally formed with the assembly molds 13, or the first assembly mold 11 and the second assembly mold 12 may be integrated with the first assembly parts 111, the second assembly parts 121 and The combined molds 13 are integrally formed. In this way, the present invention can be more in line with actual application requirements.

請參考圖18,如圖所示,於本發明之較佳具體實施例中,該組裝設備2具有一加熱器28,可加熱具有可焊表面30之一元件3、具有可焊表面42之一被組裝體4、或於一元件3與一被組裝體4間之焊錫,以進行加熱焊接該元件3與該被組裝體4,以使該元件3與該被組裝體4達到穩固組合之功效。Please refer to FIG. 18, as shown in the figure, in a preferred embodiment of the present invention, the assembly device 2 has a heater 28 that can heat a component 3 having a solderable surface 30 and a solderable surface 42 The assembled body 4, or the solder between a component 3 and an assembled body 4, for heating and welding the component 3 and the assembled body 4, so that the component 3 and the assembled body 4 achieve a stable combination effect .

本發明在上文中已以較佳實施例揭露,然熟習本項技術者應理解的是,該實施例僅用於描繪本發明,而不應解讀為限制本發明之範圍。應注意的是,舉凡與該實施例等效之變化與置換,均應設為涵蓋於本發明之範疇內。因此,本發明之保護範圍當以申請專利範圍所界定者為準。The present invention has been disclosed in a preferred embodiment above, but those skilled in the art should understand that the embodiment is only used to describe the present invention and should not be construed as limiting the scope of the present invention. It should be noted that all changes and substitutions equivalent to this embodiment should be included in the scope of the present invention. Therefore, the protection scope of the present invention should be defined by the scope of the patent application.

1:組裝模組 11:第一組裝模具 111:第一組立部 12:第二組裝模具 121:第二組立部 13:組合模具 131:合組部 2:組裝設備 21:下壓部 211:上部 212:下部 22:操作面板 23:固定部 24:機架部 25:輪動部 26:自動化施壓裝置 27:自動化螺鎖裝置 28:加熱器 3:元件 30:可焊表面 31:頭部 32:身部 33:扣部 34:彈性元件 35:頸部 36:錐部 37:螺紋部 38:填料空間 39:擴接部 4:被組裝體 41:被組裝部 42:可焊表面 5:施壓驅動裝置 6:電腦系統軟體 7:載體 71:工具 72:比對裝置 a:專案編輯1: Assemble the module 11: The first assembly mold 111: The first group 12: The second assembly mold 121: The second assembly 13: Combination mold 131: Team 2: Assemble equipment 21: Depression 211: Upper 212: Lower 22: Operation panel 23: Fixed part 24: Rack section 25: Wheel Drive 26: Automatic pressure device 27: Automatic screw lock device 28: heater 3: components 30: Solderable surface 31: head 32: Body 33: Buckle 34: elastic element 35: neck 36: Cone 37: Threaded part 38: Packing space 39: Expansion Department 4: Assembled body 41: Assembled Department 42: Solderable surface 5: Pressure driving device 6: Computer system software 7: Carrier 71: Tools 72: Comparison device a: Project editor

[圖1] 係本發明第一實施例之外觀示意圖。 [圖2] 係本發明第一實施例之使用狀態示意圖一。 [圖3] 係本發明第一實施例之使用狀態示意圖二。 [圖4] 係本發明第一組裝模具、第二組裝模具之示意圖。 [圖5] 係本發明第二實施例之使用狀態示意圖。 [圖6] 係本發明第三實施例之使用狀態示意圖。 [圖7] 係本發明第四實施例之使用狀態示意圖。 [圖8] 係本發明第五實施例之使用狀態示意圖。 [圖9] 係本發明第六實施例之使用狀態示意圖。 [圖10] 係本發明第七實施例之使用狀態示意圖。 [圖11] 係本發明第八實施例之使用狀態示意圖。 [圖12] 係本發明不同型態之元件示意圖一。 [圖13] 係本發明不同型態之元件示意圖二。 [圖14] 係本發明不同型態之元件示意圖三。 [圖15] 係本發明第九實施例之使用狀態示意圖。 [圖16] 係本發明第十實施例之使用狀態示意圖。 [圖17] 係本發明第十一實施例之使用狀態示意圖。 [圖18] 係本發明第十二實施例之使用狀態示意圖。[Figure 1] is a schematic diagram of the appearance of the first embodiment of the present invention. [Figure 2] is the first schematic diagram of the use state of the first embodiment of the present invention. [Figure 3] is the second schematic diagram of the use state of the first embodiment of the present invention. [Figure 4] is a schematic diagram of the first assembly mold and the second assembly mold of the present invention. [Figure 5] is a schematic diagram of the use state of the second embodiment of the present invention. [Figure 6] is a schematic diagram of the use state of the third embodiment of the present invention. [Figure 7] is a schematic diagram of the use state of the fourth embodiment of the present invention. [Figure 8] is a schematic diagram of the use state of the fifth embodiment of the present invention. [Figure 9] is a schematic diagram of the use state of the sixth embodiment of the present invention. [Figure 10] is a schematic diagram of the use state of the seventh embodiment of the present invention. [Figure 11] is a schematic diagram of the use state of the eighth embodiment of the present invention. [Figure 12] is the first schematic diagram of different types of elements of the present invention. [Figure 13] is the second schematic diagram of different types of elements of the present invention. [Figure 14] is the third schematic diagram of different types of elements of the present invention. [Figure 15] is a schematic diagram of the use state of the ninth embodiment of the present invention. [Figure 16] is a schematic diagram of the use state of the tenth embodiment of the present invention. [Figure 17] is a schematic diagram of the use state of the eleventh embodiment of the present invention. [Figure 18] is a schematic diagram of the use state of the twelfth embodiment of the present invention.

1:組裝模具 1: Assemble the mold

11:第一組裝模具 11: The first assembly mold

111:第一組立部 111: The first group

12:第二組裝模具 12: The second assembly mold

121:第二組立部 121: The second assembly

13:組合模具 13: Combination mold

131:合組部 131: Team

2:組裝設備 2: Assemble equipment

21:下壓部 21: Depression

22:操作面板 22: Operation panel

Claims (27)

一種組裝模組,其包含: 一第一組裝模具,其具有多數第一組立部; 一第二組裝模具,其具有多數第二組立部,該第二組裝模具與該第一組裝模具相對應;以及 多數組合模具,其可移除地設於至少一第一組立部及至少一第二組立部之相對應位置; 其中該至少一第二組立部之組合模具設置有一被組裝體,該被組裝體具有組合一元件之一被組裝部,該元件具有一擴接部,該至少一第一組立部之組合模具施壓於該元件的擴接部,該擴接部擴接於該被組裝部。An assembly module, which includes: A first assembly mold, which has a plurality of first assembly parts; A second assembly mold having a plurality of second assembly parts, the second assembly mold corresponding to the first assembly mold; and Most combined molds are removably provided at corresponding positions of at least one first assembly part and at least one second assembly part; The combined mold of the at least one second assembly part is provided with an assembled body, the assembled body has an assembled part that combines an element, the element has an expansion part, and the assembly mold of the at least one first assembly part is constructed Press on the expansion part of the element, and the expansion part is expanded and connected to the assembled part. 一種組裝模組,其包含: 一第二組裝模具,其具有多數第二組立部;以及 至少一組合模具,其可移除地設於至少一第二組立部; 其中該至少一第二組立部之組合模具設置有一被組裝體,該被組裝體具有組合一元件之一被組裝部,該元件具有一擴接部,該元件的擴接部被用以施壓,該擴接部擴接於該被組裝部。An assembly module, which includes: A second assembly mold, which has a plurality of second assembly parts; and At least one combined mold, which is removably provided on at least one second assembly part; The combined mold of the at least one second assembly part is provided with an assembled body, the assembled body has an assembled part that combines an element, the element has an expansion part, and the expansion part of the element is used to press , The expansion part is expanded to the assembled part. 如請求項1或2所述之組裝模組,其中該等第一組立部或該等第二組立部為以矩陣或編碼定義所在位置。The assembly module according to claim 1 or 2, wherein the first assembling part or the second assembling part is defined by a matrix or a code. 如請求項1或2所述之組裝模組,其中該組合模具具有一或一以上之合組部,該合組部設於一或一以上之第一組立部或第二組立部,以符合組裝之至少一元件或至少一被組裝體,或用以符合組合之至少一元件於至少一被組裝體的空間或位置。The assembly module according to claim 1 or 2, wherein the assembly mold has one or more assembly parts, and the assembly parts are arranged on one or more first assembly parts or second assembly parts to conform to The assembled at least one component or at least one assembled body, or the space or position of the at least one assembled component in the at least one assembled body. 如請求項1或2所述之組裝模組,其中該等第一組立部或該等第二組立部為孔部、槽部、凸部、凹部、階部、斜面部、弧面部、曲面部、平面部、扣部或螺紋部。The assembly module according to claim 1 or 2, wherein the first assembly portion or the second assembly portion is a hole, a groove, a convex portion, a concave portion, a stepped portion, an inclined surface portion, a curved surface portion, and a curved surface portion , Flat part, buckle part or threaded part. 如請求項1或2所述之組裝模組,其中該組合模具具有與該等第一組立部或該等第二組立部組立之合組部,該合組部為孔部、槽部、凸部、凹部、階部、斜面部、弧面部、曲面部、平面部、扣部或螺紋部。The assembly module according to claim 1 or 2, wherein the combined mold has a combined part that is combined with the first assembling part or the second assembling part, and the combined part is a hole part, a groove part, and a convex part. Part, concave part, step part, inclined part, arc part, curved part, flat part, buckle part or thread part. 如請求項1或2所述之組裝模組,其中該等第一組立部、該等第二組立部與該組合模具之組合方式為鎖合、扣接、鉚接、磁吸、一體成型或銲接。The assembly module according to claim 1 or 2, wherein the combination of the first assembly part, the second assembly part and the assembly mold is locking, buckling, riveting, magnetic attraction, integral molding or welding . 如請求項1或2所述之組裝模組,其中先放置第一種之組合模具組立於第一種目標組裝位置,之後再放置第二種之組合模具組立於第二種目標組裝位置。The assembly module according to claim 1 or 2, wherein the first combination mold assembly is placed at the first target assembly position, and then the second combination mold assembly is placed at the second target assembly position. 如請求項1或2所述之組裝模組,其中該組合模具具有一或一以上之合組部,該合組部與該等第一組立部或該等第二組立部之組合方式為鎖合、扣接、鉚接、磁吸、一體成型或銲接。The assembly module according to claim 1 or 2, wherein the assembly mold has one or more assembly parts, and the assembly part and the first assembly parts or the second assembly parts are assembled by a lock Closing, buckling, riveting, magnetic attraction, integral molding or welding. 如請求項1或2所述之組裝模組,其中該等第一組立部或該等第二組立部為矩陣排列,各該第一組立部或各該第二組立部間為相同之距離或不同之距離。The assembly module according to claim 1 or 2, wherein the first assembling parts or the second assembling parts are arranged in a matrix, and each of the first assembling parts or the second assembling parts is at the same distance or Different distances. 如請求項1或2所述之組裝模組,其中該等第一組立部或該等第二組立部或該組合模具間之不同組合或排列組合,可產生不同之組立應用高度、空間、位置或力量配置組合。The assembly module according to claim 1 or 2, wherein the different combinations or permutations between the first assembly parts or the second assembly parts or the assembly mold can produce different assembly application heights, spaces, and positions Or combination of power allocation. 如請求項1或2所述之組裝模組,其中該第一組裝模具之該等第一組立部或該第二組裝模具之該等第二組立部於不變動或變動之條件下,依據不同或相同之至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體之安排,選用或設計適合之至少一組合模具進行組裝。The assembly module according to claim 1 or 2, wherein the first assembly parts of the first assembly mold or the second assembly parts of the second assembly mold are not changed or changed according to different Or the same arrangement of at least one element, at least one assembled body, or at least one element assembled in at least one assembled body, at least one combination mold suitable or designed for assembly is selected or designed. 如請求項1或2所述之組裝模組,其中該組合模具可組立至少一元件,該元件為一扣件,或該元件具有活動組接之一頭部或身部,或該頭部可設置扣部。The assembly module according to claim 1 or 2, wherein the assembly mold can assemble at least one element, the element is a fastener, or the element has a head or body that can be movably assembled, or the head can be Set the buckle. 如請求項13所述之組裝模組,其中該扣部為柱體、螺紋體、外扣體或內扣體。The assembly module according to claim 13, wherein the buckle part is a cylinder, a threaded body, an outer buckle body, or an inner buckle body. 如請求項13所述之組裝模組,其中更包括有一彈性元件,該彈性元件一端抵頂該頭部,另一端抵頂該身部。The assembly module according to claim 13, which further includes an elastic element, one end of the elastic element abuts the head and the other end abuts the body. 如請求項13所述之組裝模組,其中該元件具有一頸部,或該元件具有錐部或螺紋部,或該頸部用以扣入另一物體。The assembly module according to claim 13, wherein the element has a neck portion, or the element has a taper portion or a threaded portion, or the neck portion is used to buckle another object. 如請求項13所述之組裝模組,其中該元件裝置於一載體,且以一工具取起,該工具為真空吸取器、夾具、扣具或磁吸器。The assembly module according to claim 13, wherein the component is mounted on a carrier and taken up by a tool, the tool being a vacuum suction device, a clamp, a fastener or a magnetic suction device. 如請求項1或2所述之組裝模組,其中該等第一組立部、該等第二組立部與組合模具可對應配對組合成不同之位置、高度或型式之組裝,以增加組合模具於至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體時之共用性。The assembly module according to claim 1 or 2, wherein the first assembling part, the second assembling part and the assembly mold can be matched and assembled into different positions, heights or types of assembly, so as to increase the assembly mold in The commonality when at least one element, at least one assembled body, or at least one element is assembled in at least one assembled body. 如請求項1或2所述之組裝模組,其中該第一組裝模具或該第二組裝模具可與該等第一組立部或該等第二組立部一體成型、或該第一組裝模具或該第二組裝模具可與組合模具一體成型、或該第一組裝模具或該第二組裝模具可與該等第一組立部、該等第二組立部或組合模具一體成型。The assembly module according to claim 1 or 2, wherein the first assembly mold or the second assembly mold can be integrally formed with the first assembly parts or the second assembly parts, or the first assembly mold or The second assembly mold may be integrally formed with a combination mold, or the first assembly mold or the second assembly mold may be integrally formed with the first assembly parts, the second assembly parts or the assembly mold. 如請求項1或2所述之組裝模組,其中該第一組裝模具或該第二組裝模具同時安裝於同一台組裝設備,或一台組裝設備中只具有該第一組裝模具,或一台組裝設備中只具有該第二組裝模具。The assembly module according to claim 1 or 2, wherein the first assembly mold or the second assembly mold is installed in the same assembly equipment at the same time, or one assembly equipment has only the first assembly mold, or one Only the second assembling mold is provided in the assembling equipment. 一種組裝設備,其包含如請求項1至20任一項中之組裝模組,該第一組裝模具或該第二組裝模具設置於該組裝設備。An assembling device comprising the assembling module in any one of claims 1 to 20, and the first assembling mold or the second assembling mold is set in the assembling device. 如請求項21所述之組裝設備,其中該組裝設備之施壓驅動為空壓驅動、油壓驅動、手施壓驅動、電力驅動、螺桿力驅動、磁力驅動或外力驅動。The assembly equipment according to claim 21, wherein the pressure driving of the assembly equipment is air pressure driving, oil pressure driving, hand pressure driving, electric driving, screw force driving, magnetic driving or external force driving. 如請求項21所述之組裝設備,其中該組裝設備具有下壓部,用以下壓至少一元件或至少一被組裝體,或將至少一元件組裝於至少一被組裝體。The assembling device according to claim 21, wherein the assembling device has a pressing part for pressing down at least one element or at least one assembled body, or assembling at least one element to at least one assembled body. 如請求項21所述之組裝設備,其中該等第一組立部、該等第二組立部與組合模具可對應配對組合成不同之位置、高度或型式之組裝,以增加組合模具與該組裝設備於至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體時之共用性。The assembly equipment according to claim 21, wherein the first assembling parts, the second assembling parts and the combined molds can be matched and combined into different positions, heights or types of assembly to increase the combined molds and the assembling equipment Commonality when at least one component, at least one assembled body, or at least one component is assembled in at least one assembled body. 一種組裝模組之應用方法,其包含如請求項1至20任一項中之組裝模組,其先裝置組裝模組於第一組立部或第二組立部,再放置至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體於組裝模組,再用以組裝模組施壓至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體以用以組裝。An application method of an assembly module, which includes the assembly module as in any one of Claims 1 to 20, which first installs the assembly module on the first assembly part or the second assembly part, and then places at least one component, at least one The assembled body or at least one component is assembled in at least one assembled body in the assembly module, and the assembly module is used to press at least one component, at least one assembled body, or at least one component assembled in at least one assembled body for Assembly. 一種組裝模組之應用方法,其包含如請求項1至20任一項中之組裝模組,其先裝置組裝模組於第一組立部或第二組立部再放置至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體於組裝模組,再用以組裝模組施壓至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體以用以組裝; 其中該等第一組立部或該等第二組立部或組合模具間之不同組合或排列組合,可產生不同之組立應用高度、空間、位置或力量配置組合。An application method of an assembly module, which includes the assembly module as in any one of Claims 1 to 20, which first installs the assembly module on the first assembly part or the second assembly part, and then places at least one component and at least one quilt The assembly or at least one component is assembled in at least one assembled body in the assembly module, and the assembly module is used to press at least one component, at least one assembled body, or at least one component assembled in at least one assembled body for assembly ; Among them, the different combinations or permutations of the first assembly parts or the second assembly parts or assembly molds can produce different assembly application heights, spaces, positions, or power configuration combinations. 一種組裝模組之應用方法,其包含如請求項1至20任一項中之組裝模組,其更包含一種組裝設備,該第一組裝模具或該第二組裝模具設置於該組裝設備;可先裝置組合模具於第一組立部或第二組立部再放置至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體於組合模具,再用以組合模具施壓至少一元件、至少一被組裝體或至少一元件組裝於至少一被組裝體以用以組裝; 其中該等第一組立部或該等第二組立部或組合模具間之不同組合或排列組合,可產生不同之組立應用高度、空間、位置或力量配置組合。An application method of an assembly module, which includes the assembly module as in any one of claims 1 to 20, and further includes an assembly device, and the first assembly mold or the second assembly mold is set in the assembly device; First install the combined mold on the first assembly part or the second assembly part, then place at least one element, at least one assembled body, or at least one element assembled on at least one assembled body in the assembly mold, and then use the assembled mold to press at least one element , At least one assembled body or at least one element is assembled to at least one assembled body for assembly; Among them, the different combinations or permutations of the first assembly parts or the second assembly parts or assembly molds can produce different assembly application heights, spaces, positions, or power configuration combinations.
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