TW202124059A - Cleaning apparatus and cleaning method for workpiece - Google Patents

Abstract

Proposed are a cleaning apparatus and a cleaning method for a workpiece, which are capable of suppressing the increasing of the particle stuck quantity at the center of the backside of the workpiece after cleaning. A cleaning apparatus, comprises: a first fixing body 11, equipped with a first cylindrical part 11a and a lid part 11b; a second fixing body 12, accommodating the first cylindrical part 11a inside; and a rotor 13, having a second cylindrical part 13a placed between the first cylindrical part 11a and the second fixing body 12; and the cleaning apparatus further comprises: an air outlet 20, set up on the first fixing body 11 and used for evacuating gap air between the first fixing body 11 and the rotor 13 from a gap; an exhaust pipe 21, placed in the first fixing body 11 and having one end connected to the air outlet 20; and an absorbing means 22, connected to the other end of the exhaust pipe 21 and used for absorbing the gap air between the first fixing body 11 and the rotor 13.

Description

Workpiece cleaning device and cleaning method

The present invention relates to a cleaning device and a cleaning method for a workpiece.

Conventionally, silicon wafers have been used as substrates for semiconductor devices. Silicon wafers are obtained by performing wafer processing on single crystal silicon ingots grown by the Czochralski (CZ) method. During the above-mentioned processing, the silicon wafer is cleaned after the processing because particles such as abrasive powder adhere to the surface of the silicon wafer.

Among the cleaning devices for workpieces such as silicon wafers, there are a batch-type cleaning device that cleans a plurality of workpieces at the same time, and a leaf-type cleaning device that cleans one workpiece at a time. In particular, because the amount of cleaning solution required is relatively small, mutual contamination between wafers can be avoided, and it becomes difficult to process multiple silicon wafers at the same time due to the increased diameter, in recent years, a leaf-type cleaning device has been used.

In the leaf-type washing device, the workpiece to be cleaned is loaded on the workpiece holding part installed on the rotating table, and the workpiece is rotated at high speed along with the rotating table, and the upper and lower nozzles face the surface (front) and the back of the workpiece. Spray cleaning liquid to remove particles. At that time, the cleaning liquid sprayed on the back of the workpiece may fall and jump on the rotating table rotating at a high speed and then adhere to the back of the workpiece, causing the problem of contamination of the back of the workpiece.

Therefore, for example, in Patent Document 1, a receiving tray is provided to receive the cleaning liquid sprayed from the lower nozzle, because the receiving tray is provided at a part protruding upward than the rotating table of the lower nozzle to prevent the cleaning liquid from falling off the rotating table. And restrain the back of the workpiece from being contaminated. [Advanced Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Publication No. 2008-258330

[The problem to be solved by the invention]

However, the present inventors found that the silicon wafer was cleaned using the cleaning device described in Patent Document 1, and after cleaning, the amount of particles deposited on the center of the back surface of the silicon wafer increased.

Therefore, the object of the present invention is to propose a cleaning device and a cleaning method for a workpiece, which can suppress an increase in the amount of particles attached to the center of the back surface of the silicon wafer after cleaning. [Means to solve the problem]

The present invention for solving the above-mentioned problems is as follows. [1] The cleaning device of the workpiece, including: The first fixed body has a cylindrical first cylindrical portion extending in a vertical direction and a cover portion covering the upper portion of the first cylindrical portion; The second fixed body has a larger diameter than the first cylindrical portion of the first fixed body, and the first cylindrical portion of the first fixed body is housed inside; Rotating body, with: The second cylindrical portion has a larger diameter than the first cylindrical portion of the first fixed body and a smaller diameter than the second fixed body; The rotating table is arranged on the upper part of the second cylindrical portion; and The workpiece holding body is arranged on the surface of the above-mentioned rotating table to hold the workpiece to be cleaned; The second cylindrical portion is arranged between the first cylindrical portion of the first fixed body and the second fixed body, and the rotating body utilizes a connection between the first cylindrical portion of the first fixed body and the rotating body. A pair of upper and lower first bearings arranged in the gap between the two and a pair of upper and lower second bearings arranged in the gap between the second fixed body and the second cylindrical portion of the rotating body are composed of the first fixed body and The above-mentioned second fixed body is freely rotated and supported; The upper nozzle sprays cleaning liquid on the surface of the above-mentioned workpiece; and The lower nozzle is fixed to the cover body while being arranged inside the first fixed body, and sprays the cleaning liquid to the back of the workpiece; Its characteristics are: The cleaning device for the above-mentioned workpiece includes: An exhaust port is provided in the first fixed body to discharge the gap gas between the first fixed body and the rotating body from the gap; An exhaust pipe arranged in the first fixed body, one end of which is connected to the exhaust port; and The suction means is connected to the other end of the exhaust pipe and sucks the void gas between the first fixed body and the rotating body.

[2] The device for cleaning a workpiece according to [1], wherein the exhaust port is provided at a higher position than the bearing on the upper side of the first bearing.

[3] The device for cleaning a workpiece according to [2], wherein the exhaust port is provided in both the first cylindrical shape and the lid.

[4] The workpiece cleaning device described in any one of [1] to [3] above, wherein four or more exhaust ports are provided at equal intervals in the circumferential direction at the same height position.

[5] The method for cleaning the workpiece, using the workpiece cleaning device described in any one of [1] to [4] above, to clean both sides of the workpiece, including: In the cleaning step, while rotating the rotating body at a first rotation speed to rotate the workpiece, while spraying cleaning liquid from the upper nozzle onto the surface of the workpiece, and spraying the cleaning liquid from the lower nozzle to the back of the workpiece to clean Both sides of the above-mentioned workpiece; and In the drying step, the rotating body is rotated at a second rotation speed higher than the first rotation speed to dry the cleaned work piece; Its characteristics are: In the drying step, at least while the rotation speed of the workpiece is 600 rpm or higher, the suction means is driven to discharge the void gas between the first fixed body and the rotating body from the exhaust port.

[6] The method for cleaning a workpiece according to [5] above, wherein the workpiece is a silicon wafer. [Effects of the invention]

According to the present invention, after washing, it is possible to suppress an increase in the amount of particle adhesion at the center of the back surface of the workpiece.

(Wafer cleaning device) Hereinafter, embodiments of the present invention will be described with reference to the drawings. The device for cleaning a workpiece according to the present invention includes: a first fixed body having a cylindrical first cylindrical portion extending in a vertical direction and a cover portion covering the upper portion of the first cylindrical portion; and a second fixed body having a ratio The first cylindrical portion of the first fixed body has a larger diameter, and the first cylindrical portion of the first fixed body is housed inside; the rotating body has: a second cylindrical portion that has a larger diameter than the first fixed body The first cylindrical portion has a larger diameter and a smaller diameter than the second fixed body; a rotary table is arranged on the upper part of the second cylindrical portion; and a workpiece holder is provided on the surface of the rotary table to hold the washing A workpiece for cleaning; wherein the second cylindrical portion is arranged between the first cylindrical portion of the first fixed body and the second fixed body, and the rotating body utilizes the first cylindrical portion of the first fixed body A pair of upper and lower first bearings arranged in the gap between the shaped portion and the rotating body, and a pair of upper and lower second bearings arranged in the gap between the second fixed body and the second cylindrical portion of the rotating body, The first fixed body and the second fixed body are rotatably supported; the upper nozzle sprays the cleaning liquid on the surface of the workpiece; and the lower nozzle is arranged inside the first fixed body and fixed to the cover body to The cleaning liquid is sprayed on the back of the above-mentioned workpiece. Here, it is characterized by comprising: an exhaust port provided in the first fixed body for discharging the gap gas between the first fixed body and the rotating body from the gap; and an exhaust pipe arranged in the first fixed body. 1. One end of the fixed body is connected to the exhaust port; and a suction means is connected to the other end of the exhaust pipe to suck air in the gap between the first fixed body and the rotating body.

When cleaning silicon wafers using the cleaning device described in Patent Document 1, the inventors focused on the reason for the increase in the amount of particles deposited on the center of the back surface of the workpiece after cleaning. As described above, in the single-leaf type cleaning device, the silicon wafers loaded on the turntable are rotated at a high speed while spraying the cleaning liquid to clean the silicon wafers. Then, after washing, the silicon wafer is rotated at a high speed to dry the silicon wafer.

During the wafer cleaning described above, since the cleaning liquid is continuously sprayed on the back of the wafer, it is difficult to expect that the amount of particles attached during the cleaning will increase. On the other hand, when the wafer is dried, the centrifugal force of the wafer's high-speed rotation causes the air below the center of the wafer to flow in the circumferential direction, creating a negative pressure under the silicon wafer (Bernoulli's law).

The inventors speculate that when the wafer is dried, due to the negative pressure generated as described above, particles generated in the device are attracted to the center of the wafer through the gap in the device, etc., and adhere to the center of the back of the wafer. Specifically, it is estimated that due to deterioration over time, dust is generated from sliding members such as bearings, rotating belts, and pulleys in the drive source, and the dust flows into the lower part of the center of the silicon wafer.

Based on the above estimation, the inventors focused on a method for suppressing the flow of the raw dust from the raw dust source into the center of the back surface. As a result, it was found that an exhaust line is provided on the path from the dust source of the bearing etc. to the lower part of the center of the silicon wafer, and it is extremely effective to exhaust the gas on the path, and the present invention has been completed.

Fig. 1 is a main part diagram showing an example of a workpiece cleaning device of the present invention. In addition, Fig. 2(a) shows an enlarged view of the vicinity of the upper part of the washing device shown in Fig. 1. In the workpiece cleaning device 1 shown in FIG. 1, the first fixed body 11 has a cylindrical first cylindrical portion 11a extending in the vertical direction and a cover portion 11b covering the upper portion of the first cylindrical portion 11a. The cover 11b holds the lower nozzle 19 described later. The second fixed body 12 is a cylindrical member, has a larger diameter than the first cylindrical portion 11a of the first fixed body 11, and houses the first cylindrical portion 11a of the first fixed body 11 inside. The first fixed body 11 and the second fixed body 12 are fixed to a bottom not shown, and constitute a main column supporting the rotating body 13.

The rotating body 13 has: a cylindrical second cylindrical portion 13a having a larger diameter than the first cylindrical portion 11a of the first fixed body 11 and a smaller diameter than the second fixed body 12; the rotating table 13b is arranged The upper part of the second cylindrical portion 13a and the workpiece holding body 13c are provided on the surface of the rotating table 13b to hold the workpiece to be cleaned. In the illustrated example, a recess 13d is provided in the turntable 13b, and the cover 11b of the first fixed body 11 is accommodated in the recess 13d.

The second cylindrical portion 13 a is arranged between the first cylindrical portion 11 a of the first fixed body 11 and the second fixed body 12. Then, in the gap between the first cylindrical portion 11a of the first fixed body 11 and the rotating body 13, a pair of upper and lower first bearings 14 are arranged, and the second fixed body and the second cylindrical portion 13a of the rotating body 13 are arranged. In the gap between, a pair of upper and lower second bearings 15 are arranged. Then, the rotating body 13 is rotatably supported by the first fixed body 11 and the second fixed body 12 via the first bearing 14 and the second bearing 15.

In addition, the rotating belt 16 extends below the second cylindrical portion 13a of the rotating body 13, and is configured to rotate the second cylindrical portion 13a and the work W on the rotating table 13b through the drive of the motor 17.

On the other hand, the upper part of the cleaning device 1 is provided with an upper nozzle 18 that sprays a cleaning liquid onto the surface (front surface) of the workpiece W. In this upper nozzle 18, when the type of chemical liquid is set, for example, when four chemical liquids are sprayed, the upper nozzle 18 may be constituted by four nozzles arranged at equal intervals.

In addition, in the cover portion 11b of the first fixed body 11, the lower nozzle 19 is arranged to hold the cleaning liquid sprayed to the back surface of the workpiece W, and the cleaning liquid can be sprayed to the center portion of the back surface of the workpiece. The lower nozzle 19 is prepared for the type of chemical liquid similar to the upper nozzle 18. For example, when four chemical liquids are sprayed, the lower nozzle 19 may be composed of four nozzles arranged at equal intervals.

Therefore, in the cleaning device 1 of the present invention, the first fixed body 11 is provided with an exhaust port 20 for discharging gas from the gap between the first fixed body 11 and the rotating body 13 from the gap. , Connect one end of the exhaust pipe 21 arranged in the first fixed body 11. In addition, a suction means 22 is connected to the other end of the exhaust pipe 21. The suction means 22 may be constituted by a suction pump, a gas ejector, a water ejector, a steam ejector, or the like.

Therefore, during the cleaning of the workpiece W, by driving the suction means 22, the air in the gap between the first fixed body 11 and the rotating body 13 through which the dust from the dust source such as the bearings 14, 15 flows is sucked, and it is possible to suppress reaching the workpiece. Dust in the center of the back of W.

In addition, it is preferable that the exhaust pipe 21 is not made of metal, but made of a fluorine resin such as tetrafluoroethylene (PFA) with high chemical resistance.

The exhaust port 20 is preferably provided at a position higher than the bearing 14 a on the upper side of the first bearing 14. Thereby, more dust particles flowing through the gap between the first cylindrical portion 11a of the first fixed body 11 and the second cylindrical portion 13a of the rotating body 13 can be removed.

In addition, the exhaust port 20 is preferably provided with both the first cylindrical portion 11a and the lid portion 11b of the first fixed body 11. Thereby, the second bearing 15, the rotating belt 16, the motor 17, the pulley (not shown), etc. arranged between the second fixed body 12 and the second cylindrical portion 13a of the rotating body 13 are generated and transmitted through the outer periphery of the device 1. The generated turbulent flow can also be removed by the dust generated between the first fixed body 11 and the rotating body 13 and the mist of the cleaning liquid existing in the space below the workpiece W.

In addition, it is preferable to provide four or more exhaust ports 20 at equal intervals in the circumferential direction at the same height position. Thereby, the dust generation can be uniformly removed during washing.

The outer peripheries of the first fixed body 11, the second fixed body 12, and the rotating body 13 are provided with a water blocking cover 23 that prevents the washing liquid scattered to the outer circumference of the workpiece from being scattered to the outside of the device 1 during washing, and a connection for receiving the washing liquid. Water cup 24. The water receiving cup 24 is provided with a drain pipe 24a for discharging the washing liquid and an exhaust pipe 24b for discharging the air in the device 1.

By using such a cleaning device 1 to clean the workpiece W, it is possible to suppress an increase in the amount of particles attached to the center of the back surface of the workpiece W after the cleaning.

(How to clean the workpiece) The method for cleaning a workpiece of the present invention is a method for cleaning both sides of a workpiece using the above-mentioned workpiece cleaning device of the present invention. While spraying the cleaning liquid from the upper nozzle 18 to the surface of the workpiece, spraying the cleaning liquid from the lower nozzle 19 to the back of the workpiece to clean both sides of the workpiece W; and the drying step, in the second rotation, which is higher than the first rotation speed. The rotating body 13 is rotated at a speed to dry the cleaned work W. Here, in the drying step, at least while the rotation speed of the workpiece W is 600 rpm or higher, the suction means 22 is driven to discharge the void gas between the first fixed body 11 and the rotating body 13 from the exhaust port 20.

As described above, according to the workpiece cleaning device 1 of the present invention, dust generated from dust sources such as the bearing shafts 14 and 15 are removed, and after washing, it is possible to suppress an increase in the amount of particles attached to the center of the back surface of the workpiece W.

Therefore, as shown in the embodiment described later, the suction means 22 is driven at least while the rotation speed of the workpiece W is 600 rpm or higher in the drying step, and the gap gas between the first fixed body 11 and the rotating body 13 is discharged from the exhaust port 20 Thereby, after washing, it is possible to suppress an increase in the amount of particles attached to the center of the back surface of the workpiece W.

In this way, the workpiece cleaning method of the present invention is characterized in that the dust-generating material from the dust-generating source is removed by the exhaust line during cleaning, and the specific cleaning conditions are not particularly limited, and can be performed as required.

For example, when the silicon wafer is cleaned, the surface where the element is formed faces upward, as shown in FIG. 2, the silicon wafer is loaded on the workpiece holder 13c on the turntable 13b. Next, the motor 17 is driven to rotate the turntable 13b at a rotation speed of, for example, 100 to 2000 rpm via the second cylindrical portion 13a. In this state, the upper nozzle 18 and the lower nozzle 19 spray the cleaning liquid on the surface and the back surface of the silicon wafer, respectively.

The cleaning solution used is not particularly limited, and an appropriate cleaning solution can be used according to the purpose. For example, as the cleaning liquid, ozone water, hydrofluoric acid solution, ammonia water, etc. can be used.

On the surface of the silicon wafer, the cleaning liquid attached to the surface (front side) of the silicon wafer due to gravity flows toward the periphery of the silicon wafer by centrifugal force, spreading the cleaning liquid across the board. In addition, on the back side, the cleaning liquid adhered to the silicon wafer due to surface tension is also fully spread by centrifugal force. In this way, the front and back sides of the silicon wafer can be cleaned (cleaning step).

Next, while rotating the turntable 13b at a higher speed, the suction means 22 is driven to start exhausting, and the silicon wafer is dried. After the drying, the rotating table 13b is decelerated, and when the rotating table 13b is stopped, the driving of the suction means 22 is stopped.

In addition, after the rotating cleaning of the cleaning liquid through the used cleaning liquid, ultrapure water or ozone water is sprayed from the upper nozzle 18 and the lower nozzle 19 to perform a rinsing process to remove the remaining cleaning on the surface and back of the wafer. Clean liquid is also fine.

In the above, the washing liquid or ultrapure water discharged from the silicon wafer or splashed by centrifugal force is caught by the water blocking cover 23 and the water receiving cup 24, and is discharged from the drain pipe 24a. In this way, the silicon wafer can be cleaned. [Example]

Hereinafter, an embodiment related to the present invention will be described, but the present invention is not limited to this embodiment.

(Invention Examples 1 to 5, Comparative Examples 1 to 5) Using the workpiece cleaning device 1 shown in FIG. 1, the silicon wafer is cleaned. Figure 3 shows the cleaning guide diagram of the silicon wafer. The acceleration time of the cleaning step ((0)~(10) in Figure 3) is 8 seconds and the holding time of 300rpm ((0)~(2) in Figure 3 )) is 77 seconds, the acceleration time of the drying step ((2)~(3) in Figure 3) is 10 seconds, the holding time of 1500rpm ((3)~(4) in Figure 3) is 25 seconds, and the deceleration time is ((4)~(5) in Fig. 3) is 7 seconds.

In the cleaning step, the oxidative cleaning process with ozone water and the acid cleaning process with hydrofluoric acid solution are repeated three times at a rotation speed of 300 rpm of the silicon wafer, and then the ozone water is used for the rinse process. In the drying step, the silicon wafer is spin-dried by rotating at a rotation speed of 1500 rpm. In the above-mentioned washing step and drying step, the suction means 22 is driven at the exhaust start timing shown in Table 1, and the suction means 22 is stopped at the exhaust end timing. Drive.

[Table 1] Timing of the start of exhaust Exhaust end timing Increase in the amount of particles attached Customary example - - have Invention Example 1 5 seconds before the end of the washing step At the end of the drying step none Invention Example 2 At the end of the washing step At the end of the drying step none Invention Example 3 5 seconds before the end of the washing step When it reaches 600rpm after deceleration starts none Invention Example 4 At the end of the washing step When it reaches 600rpm after deceleration starts none Comparative example 1 5 seconds before the end of the washing step When it reaches 1400rpm after deceleration starts have Comparative example 2 At the end of the washing step When it reaches 1400rpm after deceleration starts have Comparative example 3 5 seconds before the end of the washing step At the beginning of the deceleration have Comparative example 4 At the end of the washing step At the beginning of the deceleration have Invention Example 5 When the drying step reaches 600 rpm after the acceleration starts When it reaches 600rpm after deceleration starts none Comparative example 5 When the drying step reaches 1400 rpm after the acceleration starts When it reaches 600rpm after deceleration starts have

Regarding the above-mentioned conventional examples, the silicon wafers of Inventive Examples 1 to 5 and Comparative Examples 1 to 5, before and after cleaning, were measured with a particle measuring device (manufactured by KLA-Tencor: Surfscan SP2) attached to the back of the wafer. The number of particles. Then, it was investigated whether the number of particles increased after washing increased. The results obtained are shown in Table 1.

Fig. 4 shows LPD diagrams showing particles adhered during washing, (a) Regarding the conventional example, (b) Regarding the comparative example 1, (c) Regarding the invention example 1. In addition, Fig. 4 is obtained by subtracting the LPD map before washing from the LPD map after washing.

It is clear from Fig. 4 that, regarding the conventional example and the comparative example, it is clear that particles are attached during washing. However, with regard to the comparative example of exhausting, it is clear that the number of particles increased compared to the conventional example is small. This is the same with Comparative Examples 2 to 5. On the other hand, with regard to Inventive Example 1, particles did not adhere during washing. That is, after the acceleration of the drying step starts, the exhaust starts before reaching 600 rpm, and when the deceleration reaches 600 rpm after the start of the deceleration, if the transferred exhaust is stopped, that is, if the exhaust is exhausted while the rotation speed of the silicon wafer is above 600 rpm, it is clear that particles can be prevented. The amount of attachment increased. This is the same with invention examples 2 to 5. [Industrial Utilization Possibility]

According to the present invention, after cleaning, it is possible to suppress an increase in the amount of particle adhesion at the center of the back surface of the workpiece, which is useful in semiconductor wafer manufacturing.

1: Workpiece cleaning device 11: The first fixed body 11a: The first cylindrical part 11b: Lid 12: The second fixed body 13: Rotating body 13a: The second cylindrical part 13b: Rotating table 13c: Workpiece holder 13d: recess 14: 1st bearing 15: 2nd bearing 16: rotating belt 17: Motor 18: Upper nozzle 19: Lower nozzle 20: exhaust port 21: Exhaust pipe 22: Attraction 23: Water retaining cover 24: water cup 24a: Drain pipe 24b: exhaust pipe W: Workpiece

[Fig. 1] is a diagram showing the main parts of an example of a cleaning device for a workpiece of the present invention; [FIG. 2] (a) is an enlarged view of the vicinity of the upper part of the washing device shown in FIG. 1, and (b) the cover when viewed from above; [FIG. 3] A guide diagram showing the cleaning of silicon wafers in the embodiment; and [Fig. 4] is an LPD diagram showing particles attached during washing, (a) related to the conventional example, (b) related to the comparative example 1, and (c) related to the invention example 1.

1: Workpiece cleaning device

11: The first fixed body

11a: The first cylindrical part

11b: Lid

12: The second fixed body

13: Rotating body

13a: The second cylindrical part

13b: Rotating table

13c: Workpiece holder

13d: recess

14: 1st bearing

15: 2nd bearing

16: rotating belt

17: Motor

18: Upper nozzle

19: Lower nozzle

20: exhaust port

21: Exhaust pipe

22: Attraction

23: Water retaining cover

24: water cup

24a: Drain pipe

24b: exhaust pipe

W: Workpiece

Claims (6)

A cleaning device for workpieces, including: The first fixed body has a cylindrical first cylindrical portion extending in a vertical direction and a cover portion covering the upper portion of the first cylindrical portion; The second fixed body has a larger diameter than the first cylindrical portion of the first fixed body, and the first cylindrical portion of the first fixed body is housed inside; Rotating body, with: The second cylindrical portion has a larger diameter than the first cylindrical portion of the first fixed body and a smaller diameter than the second fixed body; The rotating table is arranged on the upper part of the second cylindrical portion; and The workpiece holding body is arranged on the surface of the above-mentioned rotating table to hold the workpiece to be cleaned; The second cylindrical portion is arranged between the first cylindrical portion of the first fixed body and the second fixed body, and the rotating body utilizes a connection between the first cylindrical portion of the first fixed body and the rotating body. A pair of upper and lower first bearings arranged in the gap between the two and a pair of upper and lower second bearings arranged in the gap between the second fixed body and the second cylindrical portion of the rotating body are composed of the first fixed body and The above-mentioned second fixed body is freely rotated and supported; The upper nozzle sprays cleaning liquid on the surface of the above-mentioned workpiece; and The lower nozzle is fixed to the cover body while being arranged inside the first fixed body, and sprays cleaning liquid to the back of the workpiece; Its characteristics are: The cleaning device for the above-mentioned workpiece includes: An exhaust port is provided in the first fixed body to discharge the gap gas between the first fixed body and the rotating body from the gap; An exhaust pipe arranged in the first fixed body, one end of which is connected to the exhaust port; and The suction means is connected to the other end of the exhaust pipe and sucks the gap gas between the first fixed body and the rotating body. Such as the cleaning device for the workpiece in claim 1, where: The exhaust port is provided at a higher position than the bearing on the upper side of the first bearing. Such as the cleaning device for the workpiece in claim 2, where: The exhaust port is provided in both the first cylindrical shape and the cover body. Such as the cleaning device for the workpiece in any one of claims 1 to 3, wherein: At the same height position, four or more exhaust ports are arranged at equal intervals in the circumferential direction. A method for cleaning a workpiece, using the cleaning device of any one of claims 1 to 4 to clean both sides of the workpiece, including: In the cleaning step, while rotating the rotating body at a first rotation speed to rotate the workpiece, while spraying cleaning liquid from the upper nozzle onto the surface of the workpiece, and spraying the cleaning liquid from the lower nozzle to the back of the workpiece to clean Both sides of the above-mentioned workpiece; and In the drying step, the rotating body is rotated at a second rotation speed higher than the first rotation speed to dry the cleaned work piece; Its characteristics are: In the drying step, at least during the period when the rotation speed of the workpiece is 600 rpm or higher, the suction means is driven to discharge the void gas between the first fixed body and the rotating body from the exhaust port. Such as the cleaning method of the workpiece in claim 5, where: The above-mentioned workpiece is a silicon wafer.

Images