TW202111509A - Touch-sensing electrode structure and manufacturing method thereof, and touch display device using the same - Google Patents

Abstract

The present invention provides a touch-sensing electrode structure by respectively connecting a first touch-sensing metal layer and a second touch-sensing metal layer to two surfaces of an optically clear adhesive (OCA). Particularly, the touch-sensing electrode structure does not include any transparent polymer substrate, therefore has outstanding properties of high transmittance, ultra thin, and ultra light. Moreover, since this touch-sensing electrode structure not includes transparent polymer substrate, there are no problems of rainbow pattern and blackout occurring in the touch-sensing electrode structure. As such, this touch-sensing electrode structure is suitable for being applied in any one type of touch display device, such as LCD touch display device, OLED touch display device, Mini LED touch display device, or Micro LED touch display device.

Description

Metal sensing electrode structure and manufacturing method thereof, and touch display device using the metal sensing electrode structure

The present invention relates to the technical field of touch panels, in particular to directly connect a metal sensing electrode layer and another metal sensing electrode layer directly to the two surfaces of an Optically Clear Adhesive (OCA) A metal sensing electrode structure. At the same time, the present invention also discloses a process method for manufacturing the metal electrode sensing junction, and also discloses a touch display device with the metal sensing electrode structure.

It is known that a touch panel usually includes a transparent substrate and one or more than two metal electrode layers fabricated on the transparent substrate, and the prior art has also proposed a variety of different structural designs of the metal electrode layer. For example, a capacitive touch panel may include a single-layer metal electrode structure or a double-layer metal electrode structure. When the user's finger touches a specific position of the metal electrode layer, the static electricity of the finger will cause the capacitance value of the specific position of the metal electrode layer to change. Therefore, when receiving a touch sensing signal transmitted by the metal electrode layer ( After Touch sensing signal), the signal processing circuit at the back end can learn the coordinate position of the capacitive touch panel corresponding to the specific position after completing the related signal processing and calculation.

At present, indium tin oxide (Indium Tin Oxide, ITO), indium tin oxide/silver/indium tin oxide (ITO/Ag/ITO), silver nanowire (AgNW), or silver halide (Silver halide, AgX ) The transparent conductive film made is widely used as the metal electrode layer of touch panels. Moreover, after practical application, silver nanowires (AgNW) and silver halide (AgX) have been confirmed to show unreliable migration problems. On the other hand, with the gradual increase in market demand for All-in-one PCs, large-size notebook computers, and large-scale touch screens, the aforementioned ITO transparent conductive film has problems with excessively high material costs and (area) resistance. Therefore, it is considered unsuitable to be used as the metal electrode layer of large-size touch panels.

Therefore, in view of the reliability of the transparent conductive film of silver nanowire (AgNW) and silver halide (AgX) and the ITO transparent conductive film cannot be used in the production of large-size touch panels, a metal mesh (Metal The transparent conductive film made of Mesh) was developed and used as the metal electrode layer of the touch panel. At present, the main suppliers of touch panels and/or transparent conductive substrates using metal grids include: Toray Japan, Sumitomo Japan, Panasonic Japan, and Taiwan Dingzhan Electronics (Flextek Taiwan). When manufacturing touch panels using metal grids, coincidentally, the four suppliers all use thin film growth technology (for example: sputtering or vacuum evaporation) in conjunction with thick film growth technology (for example: electroplating ( Electroplating or chemical plating is used to make a copper layer on the surface of a transparent plastic substrate.

It is worth noting that vacuum sputtering or vacuum evaporation can indeed produce dense copper films, but its low deposition rate leads to poor thickening efficiency and output speed of dense copper films. It is also very slow. In addition, the thickness of the aforementioned dense copper film is usually equal to or less than 2 micrometers (µm). Therefore, when the transparent plastic substrate plated with a thin copper film layer is continuously subjected to the subsequent process, the thin copper film layer It is especially vulnerable to damage, even dust attached to the rollers of the etching machine may cause damage to the thin copper film. On the other hand, if the thickness of the copper layer is greater than 2 microns, it will affect the fineness of the metal electrode after etching, and the corrosion resistance and acid and alkali resistance of the blackened layer on the surface of the metal electrode are also one of the keys to the reliability of the metal electrode. .

FIG. 1 shows a structure diagram of a conventional touch display device. As shown in FIG. 1, the conventional touch display device TPa includes: a metal mesh touch panel 1a, a liquid crystal module (LCM) 2a, and a cover glass (Cover glass) 3a; Wherein, the metal mesh touch panel 1a and the glass cover 3a form a so-called GFF (Glass-Film-Film structure) touch sensor, and the metal mesh touch panel 1a includes a first transparent conductive substrate 11a and a second transparent conductive substrate 15a. It can be seen from FIG. 1 that the first transparent conductive substrate 11a and the second transparent conductive substrate 15a are superimposed on each other through a first optical adhesive (OCA) 12a. In addition, the first transparent conductive substrate 11a is further laminated on the liquid crystal display module 2a through a second optical glue 13a, and the glass cover 3a is laminated on the liquid crystal display module 2a through a third optical glue 14a. On the two transparent conductive substrates 15a.

In more detail, the first transparent conductive substrate 11a includes a first PET substrate 111a and a first copper electrode layer 112a formed on the first PET substrate 111a, and the second transparent conductive substrate 15a includes a first PET substrate 111a. Two PET substrates 151a and a second copper electrode layer 152a formed on the second PET substrate 151a. It is worth noting that the first copper electrode layer 112a is presented in the form of a metal grid and used as a Transitive electrode (Tx) layer. On the other hand, the second copper electrode layer 152a is also presented in the form of a metal grid, but is used as a receiving electrode (Rx) layer.

FIG. 2 shows a structural diagram of another conventional touch display device. As shown in FIG. 2, another conventional touch display device TPb includes: a metal mesh touch panel 1b, a liquid crystal display module (LCM) 2b, and a glass cover 3b, in which the metal mesh touches The control panel 1b and the glass cover 3b constitute a so-called GF2 touch sensor. Moreover, the metal mesh touch panel 1b is laminated on the liquid crystal display module 2b through a layer of optical glue 15b, and the glass cover 3b is laminated on the metal grid through another layer of optical glue 16b. Above the touch panel 1b. It can be seen from FIG. 2 that the metal mesh touch panel 1b includes a PET substrate 11b, a first copper electrode layer 12b formed on the surface of the PET substrate 11b, and a first copper electrode layer 12b formed on the bottom surface of the PET substrate 11b. Two copper electrode layers 13b. It is worth noting that the first copper electrode layer 12b is presented in the form of a metal grid and used as a receiving electrode (Rx) layer. On the other hand, the second copper electrode layer 13b is also presented in the form of a metal grid and used as a Transitive electrode (Tx) layer.

From Figure 2 and Figure 1, it can be found that the GF2 touch sensor is lighter and thinner than the GFF touch sensor. The reason is that the GFF touch sensor further includes a layer of optical glue ( OCA) and a PET substrate. However, whether it is a GFF touch sensor or a GF2 touch sensor, the stacked structure of the metal mesh touch panel (1a, 1b) contained in it is first coated on a plastic substrate (such as PET). A metal layer is formed, and then the metal layer is patterned into a metal electrode using a yellow light process, and then an optical adhesive (OCA) is used to overlap the glass cover plate and the liquid crystal display module (LCM). Engineers who have been involved in the design and production of GF2 touch sensors and/or GFF touch sensors for a long time must know that optical grade PET substrates have problems with rainbow and blackout. In the use of Cyclic Olefins Polymer (COP), Cyclic Olefins Copolymet (COC), Clear Polyimide (CPI), or Super Retardation Film (Super Retardation Film) , SRF) After replacing the original PET substrate with the transparent substrate made by SRF, the aforementioned problems are solved. However, in addition to the problem of excessively high material unit prices, COP, CPI, and SRF are not cost-effective. In addition, the COP substrate and the SRF substrate are deformed due to heat accumulation during the vacuum sputtering process or the vacuum evaporation process.

It can be seen from the above description that there is currently no technology on the market that can directly design and fabricate a metal sensing electrode layer with a thickness of more than 2 micrometers (µm) on a non-transparent polymer substrate, and there is no ultra-thin and ultra-thin technology. Transparent conductive substrate and/or touch panel. Based on the above-mentioned reasons, the inventor of this case worked hard to research and invention, and finally developed a metal sensing electrode structure and manufacturing method of the present invention, and a touch display device using the metal sensing electrode structure.

The main purpose of the present invention is to provide a metal sensing electrode structure. The present invention forms the metal sensing electrode structure by connecting a first metal sensing electrode layer and a second metal sensing electrode layer to the two surfaces of an optical adhesive layer, respectively. In particular, the metal sensing electrode structure of the present invention does not use any transparent polymer substrate, so it has the significant advantages of high light transmittance, ultra-light, and ultra-thin. At the same time, since the metal sensing electrode structure of the present invention does not have a polymer substrate, it will not produce interference fringes (for example: rainbow pattern) and blackout problems. Therefore, the metal sensing electrode structure of the present invention can be applied to any kind of touch display device as a touch sensor of the touch display device. The touch display device may be an LCD touch display device, an OLED touch display device, a Mini LED touch display device, or a Micro LED touch display device.

In order to achieve the above-mentioned main objective of the present invention, the present invention provides an embodiment of the metal sensing electrode structure, which includes: A first optical adhesive layer; A first metal sensing electrode layer, connected to a first surface of the first optical adhesive layer, and including a first patterned metal electrode structure, a first patterned metal electrode structure covering and covering the first patterned metal electrode structure A blackening film, and a first anti-oxidation film covering and covering the first blackening film; and A second metal sensing electrode layer, connected to a second surface of the first optical adhesive layer, and including a second patterned metal electrode structure, a second patterned metal electrode structure covering and covering the second patterned metal electrode structure The blackening film and a second anti-oxidation film covering and covering the second blackening film.

Moreover, the present invention also provides an embodiment of a manufacturing method of the metal sensing electrode structure, which includes the following steps: (1) Provide a pure copper foil, and perform a surface treatment on the pure copper foil; (2) forming a black layer to cover and wrap the pure copper foil, and then form an anti-oxidation layer to cover and cover the black layer; (3) Connect the pure copper foil covered with the anti-oxidation layer and the black layer to a supporting substrate with a debonding adhesive layer on the surface; (4) Perform a photolithography process (Photolithography) on the product of the foregoing step (3) to obtain a first laminate structure and a second laminate structure; wherein, the first laminate structure includes the carrier substrate and the solvable An adhesive layer and a first metal sensing electrode layer, and the second laminated structure includes the carrier substrate, the debonding adhesive layer, and a second metal sensing electrode layer; wherein the first metal sensing The electrode layer includes a first patterned metal electrode structure, a first black film covering and covering the first patterned metal electrode structure, and a first anti-oxidation film covering and covering the first black film , And the second metal sensing electrode layer includes a second patterned metal electrode structure, a second black film covering and covering the second patterned metal electrode structure, and a second black film covering and covering the second patterned metal electrode structure A second anti-oxidation film of the film; (5) Make the first laminate structure face a first surface of a first optical adhesive layer with its first metal sensing electrode level, and make the second laminate structure use its second metal sensing The electrode layer is on a second surface of the first optical adhesive; then, the first laminated structure and the second laminated structure are respectively connected to the first surface and the second surface; and (6) Remove the carrier substrate and the debondable adhesive layer of the first laminated structure, and remove the carrier substrate and the debondable adhesive layer of the second laminated structure to obtain the first optical adhesive layer A metal sensing electrode structure composed of the first metal sensing electrode layer and the second metal sensing electrode layer.

In the foregoing embodiments of the metal sensing electrode structure of the present invention and the manufacturing method thereof, the thickness of the pure copper foil is between 2 μm and 12 μm, and it is a rolled copper foil or an electrolytic foil. Electrodeposited copper foil.

In the foregoing embodiment of the metal sensing electrode structure of the present invention and the manufacturing method thereof, the step (1) uses an acid solution to remove a resist layer and an oxide layer on the surface of the pure copper foil, and the acid solution is as follows Any one: sulfuric acid, nitric acid, hydrochloric acid, formic acid, acetic acid, malic acid, citric acid, a mixture of any two of the above, or a mixture of any two or more of the above.

In the foregoing embodiments of the metal sensing electrode structure of the present invention and the manufacturing method thereof, the acidic solution is added with a trace amount of hydrogen peroxide.

In the foregoing embodiments of the metal sensing electrode structure of the present invention and the manufacturing method thereof, the thickness of the first blackened film and the second blackened film is between 1 nanometer and 1 micron, and the materials are manufactured Any of the following: copper selenide (CuSe), copper oxide selenide (CuSe _x O _1-x ), copper oxide (CuO _x ), copper sulfide (CuS), or copper oxysulfide (CuS _x O _1-x ).

In the foregoing embodiments of the metal sensing electrode structure of the present invention and the manufacturing method thereof, the anti-oxidation layer is formed by coating an organic corrosion inhibitor (Corrosion inhibitor) on the black layer And the thickness of the first anti-oxidation film of the first metal sensing electrode layer and the second anti-oxidation film of the second metal sensing electrode layer are both between 1 nanometer and 1 micron . And, the organic corrosion inhibitor is any one of the following: benzotriazole (1,2,3-benzotriazole, BTA), methyl benzotriazole (5-methyl-1H-benzotriazole, TTA), mercapto Benzothiazole (Mercaptobenzothiazole, MBT), Sodium salt of 1,2,3-benzotriazole (BTA Na), Sodium salt of mercaptobenzothiazole (MBT Na), Methyl Benzotriazole (Sodium salt of 5-methyl-1H-benzotriazole, TTA•Na), Methylchloroisothiazolinone (CMIT) and mixtures of the above single or multiple materials with polyurethane or acrylic resin.

In the foregoing embodiments of the metal sensing electrode structure of the present invention and the manufacturing method thereof, the supporting substrate is a PET substrate, and the thickness thereof is between 12 μm and 300 μm.

In the foregoing embodiments of the metal sensing electrode structure of the present invention and the manufacturing method thereof, the thickness of the debondable adhesive layer is between 10 μm and 375 μm, and it is any one of the following: acrylic pressure Acrylic pressure sensitive adhesive (PSA), UV light debonding tape, or heat debonding tape.

In the foregoing embodiments of the metal sensing electrode structure of the present invention and the manufacturing method thereof, an initial adhesion force of the debondable adhesive layer RA is greater than 0.2N/25mm, and an initial adhesion force of the debondable adhesive layer RA is performed After the debonding treatment, the adhesive force of one of the debonding adhesive layers RA after debonding is less than 0.02N/25mm.

In the foregoing embodiments of the metal sensing electrode structure of the present invention and the manufacturing method thereof, the material of the first optical adhesive layer is any one of the following: Thermoplastic polyurethane (TPU) or Acrylic (Acrylic) ).

Further, the present invention also provides an embodiment of a touch display device using one of the metal sensing electrode structures, which includes: The aforementioned metal sensing electrode structure; A second optical adhesive layer having a third surface and a fourth surface, wherein the second optical adhesive layer is connected to the first metal sensing electrode layer of the metal sensing electrode structure by the third surface; A glass, plastic or hard (HC) plastic containing cover plate connected to the fourth surface of the second optical adhesive layer; and A third optical adhesive layer having a fifth surface and a sixth surface, wherein the third optical adhesive layer is connected to the second metal sensing electrode layer of the metal sensing electrode structure by the fifth surface; as well as A display panel module is connected to the sixth surface of the third optical adhesive layer.

In the foregoing embodiment of the touch display device of the present invention, the display panel module is any one of the following: LCD display panel module, OLED display panel module, Mini LED display panel module, or Micro LED display panel module group.

In the foregoing embodiment of the touch display device of the present invention, the touch display device is integrated into an electronic device, and the electronic device is any one of the following: a smart phone, a tablet computer, a notebook computer, All-in-one computer, smart watch, or door phone.

In order to be able to more clearly describe a metal sensing electrode structure and its manufacturing method proposed by the present invention, and a touch display device using the metal sensing electrode structure, the following will cooperate with the drawings to describe in detail the preferred embodiments of the present invention .

Metal sensing electrode structure

FIG. 3 shows a structure diagram of a metal sensing electrode structure of the present invention. The metal sensing electrode structure 1 of the present invention has the characteristics of a simple structure, which includes: a first optical adhesive layer A1, a first metal sensing electrode layer 11, and a second metal sensing electrode layer 12. Wherein, the thickness of the first optical adhesive layer A1 is between 12 μm and 125 μm, and it has an adhesive force greater than 0.2N/25mm. In a feasible embodiment, the material of the first optical adhesive layer A1 can be Thermoplastic polyurethane (TPU) or Acrylic.

As shown in FIG. 3, the first metal sensing electrode layer 11 is connected to a first surface A11 of the first optical adhesive layer A1, and includes a first patterned metal electrode structure 111, covering and covering the first surface A11 of the first optical adhesive layer A1. A first black film 112 of a patterned metal electrode structure 111 and a first anti-oxidation film 113 covering and covering the first black film 112. In addition, the second metal sensing electrode layer 12 is connected to a second surface A12 of the first optical adhesive layer A1, and includes a second patterned metal electrode structure 121 covering and covering the second patterned metal electrode A second black film 122 of the structure 121 and a second anti-oxidation film 123 covering and covering the second black film 122.

According to the design of the present invention, the first patterned metal electrode structure 111 is made by applying a photolithography process to a copper foil. Engineers familiar with the operation and use of the photolithography process must know that the photolithography process at least includes the steps of photoresist (or dry film), exposure, development, etching, and photoresist (or dry film) removal. Similarly, the second patterned metal electrode structure 121 is also made by applying the photolithography process to the other pure copper foil. It is further explained that the pure copper foil is a rolled copper foil or an electrodeposited copper foil, and its thickness is between 2 μm and 12 μm. Preferably, the thickness of the pure copper foil is between 2 μm and 6 μm.

In more detail, the first blacking film 112 and the second blacking film 122 can be made by a production method or a replacement method. In a feasible embodiment, the first black film 112 and the second black film 122 may be made of copper selenide (CuSe), copper oxide selenide (CuSe _x O _1-x ), copper oxide ( CuO _x ), copper sulfide (CuS), or copper oxysulfide (CuS _x O _1-x ), and the thickness of both is between 1 nanometer and 1 micron. Preferably, the thickness of the first blackening film 112 and the second blackening film 122 can be between 10 nanometers and 0.2 micrometers.

Furthermore, an organic corrosion inhibitor (Corrosion inhibitor) can be dissolved in water or other solvents to obtain an organic corrosion inhibitor (Corrosion inhibiting agent). Next, the first anti-oxidation film 113 is formed by coating the aforementioned organic corrosion inhibitor on the first patterned metal electrode structure 111 covered with the first black film 112, and the organic inhibitor The etchant is coated on the second patterned metal electrode structure 121 covered with the second black film 122 to form the second anti-oxidation film 123. According to the design of the present invention, the thickness of the first anti-oxidation film 113 and the second anti-oxidation film 123 is between 1 nanometer and 1 micrometer. Preferably, the thickness of the first anti-oxidation film 113 and the second anti-oxidation film 123 can be between 10 nanometers and 0.2 micrometers. Moreover, in a feasible embodiment, the organic corrosion inhibitor is any one of the following: 1,2,3-benzotriazole (BTA), methyl benzotriazole (5-methyl-1H -benzotriazole, TTA), mercaptobenzothiazole (Mercaptobenzothiazole, MBT), sodium benzotriazole (Sodium salt of 1,2,3-benzotriazole, BTA Na), sodium salt of mercaptobenzothiazole (Sodium salt of mercaptobenzothiazole, MBT Na), Sodium salt of 5-methyl-1H-benzotriazole (TTA Na), or Methylchloroisothiazolinone (CMIT) and the above single or multiple materials and polyurethane or Blends such as acrylic resin.

As can be seen from FIG. 1, a conventional metal mesh touch panel 1a includes a first transparent conductive substrate 11a and a second transparent conductive substrate 15a, wherein the first transparent conductive substrate 11a includes a first PET substrate 111a and formed A first copper electrode layer 112a on the first PET substrate 111a, and the second transparent conductive substrate 15a includes a second PET substrate 151a and a second copper electrode formed on the second PET substrate 151a层152a. Therefore, it can be easily found through FIG. 3 and FIG. 1 that the metal sensing electrode structure 1 of the present invention does not use any transparent polymer substrate (for example, a PET substrate). Instead, the present invention connects a first metal sensing electrode layer 11 to the first surface A11 of a first optical adhesive layer A1, and connects a second metal sensing electrode layer 12 to the first optical adhesive layer The second surface of A1 is A12.

In addition, as shown in FIG. 2, another conventional metal mesh touch panel 1b includes a PET substrate 11b, a first copper electrode layer 12b formed on the surface of the PET substrate 11b, and a metal mesh touch panel 1b formed on the PET substrate 11b. A second copper electrode layer 13b on the bottom surface. Wherein, the first copper electrode layer 12b is presented in the form of a metal grid and used as a receiving electrode (Rx) layer. On the other hand, the second copper electrode layer 13b is also presented in the form of a metal grid and used as a Transitive electrode (Tx) layer. Therefore, after comparing FIG. 2 and FIG. 1, it can be known that the metal mesh touch panel 1 b has shown the advantages of being thinner and lighter than the metal mesh touch panel 1 a in terms of structure. It is worth noting that it can be seen from FIG. 3 and FIG. 2 that the metal sensing electrode structure 1 of the present invention is further lighter and thinner than the metal mesh touch panel 1b. The main reason is that the metal sensing electrode structure 1 of the present invention does not use any transparent polymer substrate (for example, a PET substrate). Instead, the present invention connects a first metal sensing electrode layer 11 to the first surface A11 of a first optical adhesive layer A1, and connects a second metal sensing electrode layer 12 to the first optical adhesive layer The second surface of A1 is A12.

It is easy to infer that without using any polymer substrate, the metal sensing electrode structure 1 of the present invention has the remarkable advantages of high light transmittance, ultra-light, and ultra-thin. At the same time, since the metal sensing electrode structure 1 of the present invention does not have a polymer substrate, it will not cause any interference fringes (for example, rainbow patterns) and blackout problems. Therefore, the metal sensing electrode structure 1 of the present invention can be applied to any touch display device, such as: LCD touch display device, OLED touch display device, Mini LED touch display device, or Micro LED touch display device Device.

Touch display device

FIG. 4 shows a structure diagram of a touch display device including the metal sensing electrode structure of the present invention. The touch display device TPa includes: the metal sensing electrode structure of the present invention 1, a second optical adhesive layer A2, a glass, plastic, or hard (HC)-containing plastic cover plate 2, a third optical adhesive layer A3 , And a display panel module 3. The foregoing description has clearly revealed that the structure of the metal sensing electrode structure 1 of the present invention includes a first optical adhesive layer A1, a first metal sensing electrode layer 11, and a second metal sensing electrode layer 12. As shown in FIG. 4, the second optical adhesive layer A2 has a third surface A21 and a fourth surface A22, and the second optical adhesive layer A2 is connected to the first metal sensor by its third surface A21极层11。 Electrode layer 11. On the other hand, the cover plate 2 is connected to the fourth surface A22 of the second optical adhesive layer A2.

In more detail, the third optical adhesive layer A3 has a fifth surface A31 and a sixth surface A32, wherein the third optical adhesive layer A3 and the fifth surface A31 are connected to the metal sensing electrode structure 1 The second metal sensing electrode layer 12. Moreover, the display panel module 3 is connected to the sixth surface A32 of the third optical adhesive layer A3. Depending on the type of the touch display device TPa, the display panel module 3 may be an LCD display panel module, an OLED display panel module, a Mini LED display panel module, or a Micro LED display panel module. Furthermore, the present invention does not limit the touch display device to be an independent device, and it can also be integrated into an electronic device so that the electronic device has both touch function and display function. The electronic device may be a smart phone, a tablet computer, a notebook computer, an All-in-One computer, a smart watch, or a door phone.

Manufacturing method of metal sensing electrode structure

5A and 5B show a flow chart of a manufacturing method of a metal sensing electrode structure of the present invention, and FIGS. 6A to 6F show a manufacturing flow chart of a metal sensing electrode structure of the present invention. When manufacturing the metal sensing electrode structure 1 of the present invention, as shown in FIGS. 5A and 6A, step S1 is first performed: a pure copper foil CF is provided, and a surface treatment is performed on the pure copper foil CF. In step S1, the pure copper foil CF used is a rolled copper foil or an electrodeposited copper foil, and its thickness is between 2 μm and 12 μm. Preferably, the thickness of the pure copper foil CF is between 2 μm and 6 μm. When performing the surface treatment, an acid solution is used to remove a resist layer and an oxide layer on the surface of the pure copper foil CF, and the acid solution is any one of the following: sulfuric acid, nitric acid, hydrochloric acid, formic acid, acetic acid, and malic acid , Citric acid, a mixture of any two of the above, or a mixture of any two or more of the above. It is worth noting that adding a small amount of hydrogen peroxide to the acid solution can promote the reaction speed of the surface treatment, not only can increase the surface roughness and cleanliness of the pure copper foil CF, but also can improve the subsequent surface blackening layer and The adhesion of the anti-oxidation (corrosion) layer to the surface of the pure copper foil CF.

Continuing, the method flow system executes step S2. In step S2, as shown in FIGS. 5A and 6B, a black layer BL is formed to cover and coat the pure copper foil CF, and then an anti-oxidation layer AO is formed to cover and coat the black layer BL. The black layer BL can be formed by a generation method or a replacement method. In a feasible embodiment, the black layer BL may be made of copper selenide (CuSe), copper oxide selenide (CuSe _x O _1-x ), copper oxide (CuO _x ), copper sulfide (CuS), or Copper oxysulfide (CuS _x O _1-x ), and the thickness of both is between 1 nanometer and 1 micron. Preferably, the thickness of the first blackening film 112 and the second blackening film 122 can be between 10 nanometers and 0.2 micrometers.

It can be seen from the above description that the black layer BL is actually a copper compound film layer. Therefore, an organic corrosion inhibitor (Corrosion inhibiting agent) can be subsequently coated on the pure copper foil CF covered with the black layer BL, and then an organic copper is further formed on the pure copper foil CF covered with the black layer BL. The compound film is used as the anti-oxidation (anti-corrosion) layer AO. Wherein, the organic corrosion inhibitor can be obtained by dissolving an organic corrosion inhibitor (Corrosion inhibitor) in water or other solvents, and the organic corrosion inhibitor is any one of the following: benzotriazole (1,2 ,3-benzotriazole, BTA), 5-methyl-1H-benzotriazole (TTA), Mercaptobenzothiazole (MBT), Sodium salt of 1,2 , 3-benzotriazole, BTA Na), Sodium salt of mercaptobenzothiazole (MBT Na), Sodium salt of 5-methyl-1H-benzotriazole (TTA Na), Or methyl isothiazolinone (Methylchloroisothiazolinone, CMIT) and the above-mentioned single or multiple materials mixed with polyurethane or acrylic resin.

In the present invention, the thickness of the anti-oxidation layer AO is between 1 nanometer and 1 micrometer, and preferably 10 nm-0.2 μm. As shown in Fig. 5A, the method flow system continues to execute step S3. And, in step S3, as shown in FIG. 6C, the pure copper foil CF covered with the anti-oxidation layer AO and the black layer BL is connected to a supporting substrate (Supporting substrate) Above SS. In the present invention, the supporting substrate SS is a polymer substrate (for example, a PET substrate), and its thickness is between 12 μm and 300 μm. Preferably, the thickness of the polymer substrate is between 50 microns and 125 microns. On the other hand, the releasable adhesive layer RA can be an acrylic pressure sensitive adhesive (PSA), an ultraviolet light releasable adhesive, or a heat releasable adhesive. Take acrylic pressure-sensitive adhesive (PSA) as an example, as long as the acrylic pressure-sensitive adhesive (PSA) is added with an appropriate amount of expanded particles, then only the acrylic pressure-sensitive adhesive (PSA) can be heated. Destroy its colloidal structure, make it lose its adhesion or reduce its adhesion. On the other hand, if an ultraviolet light (heat) debondable adhesive is used as the debondable adhesive layer RA, then only the debondable adhesive layer RA needs to be placed in an ultraviolet light (heated) environment, and the debondable adhesive layer RA can be debonded. Adhesive layer RA will lose its adhesion or decrease its adhesion due to the aggregation of small molecules inside into macromolecules.

The thickness of the debondable adhesive layer RA must be determined according to the actual conditions of use, and is generally between 10 microns and 375 microns. It must be specifically stated that whether it is presented in the form of acrylic pressure sensitive adhesive (PSA), ultraviolet light debonding adhesive, or thermal debonding adhesive, it is coated on the PET substrate (that is, the carrier substrate SS). The upper debonding layer RA must have an initial adhesion greater than 0.2N/25mm. Moreover, after performing a debonding treatment on the debonding layer RA, such as heating or irradiating ultraviolet light, the adhesive force of one of the debonding layers RA must be less than 0.02N/25mm to facilitate subsequent Transfer to the surface of the optical glue.

Next, as shown in FIG. 5A, the method flow system continues to perform step S4. Please refer to Figure 6D and Figure 6E at the same time. In step S4, a photolithography process is performed on the product of step S3 to obtain a first stacked structure ST1 and a second stacked structure ST2. Engineers familiar with the operation and use of the photolithography process must know that the photolithography process at least includes the steps of photoresist (or dry film), exposure, development, etching, and photoresist (or dry film) removal. After the photolithography process is completed, as shown in FIG. 6D, the first laminated structure ST1 includes the carrier substrate SS, the releasable adhesive layer RA, and a first metal sensing electrode layer 11. On the other hand, as shown in FIG. 6E, the second laminated structure ST2 includes the carrier substrate SS, the releasable adhesive layer RA, and a second metal sensing electrode layer 12.

In more detail, the first metal sensing electrode layer 11 includes a first patterned metal electrode structure 111, a first black film 112 covering and covering the first patterned metal electrode structure 111, and covering and A first anti-oxidation film 113 covering the first black film 112. In addition, the second metal sensing electrode layer 12 includes a second patterned metal electrode structure 121, a second black film 122 covering and covering the second patterned metal electrode structure 121, and covering and covering the second patterned metal electrode structure 121. A second anti-oxidation film 123 of the second blacking film 122.

It can be seen from FIG. 5B that after step S4 is completed, the method flow is followed by step S5. In step S5, as shown in FIG. 6F, the first laminated structure ST1 is made to face a first surface A11 of a first optical adhesive layer A1 with its first metal sensing electrode layer 11, and the The second laminated structure ST2 faces a second surface A12 of the first optical adhesive A1 with the second metal sensing electrode layer 12; then, the first laminated structure ST1 and the second laminated structure ST2 are respectively connected To the first surface A11 and the second surface A12. It is also inferred that by heating or irradiating ultraviolet light, the debonding adhesive layer RA can lose its adhesion or reduce its adhesion; afterwards, in step S6, the first laminated structure can be removed The supporting substrate SS and the releasable adhesive layer RA of ST1, and the supporting substrate SS and the releasable adhesive layer RA of the second laminated structure ST2 are removed to obtain the first optical adhesive layer A1 and the first optical adhesive layer RA. A metal sensing electrode structure 1 composed of a metal sensing electrode layer 11 and the second metal sensing electrode layer 12 (as shown in FIG. 3).

In this way, the above description has completely and clearly described a metal sensing electrode structure 1 of the present invention, a manufacturing method thereof, and a touch display device TPD using the metal sensing electrode structure 1 of the present invention. However, it must be emphasized that the above detailed description is a specific description of possible embodiments of the present invention, but this embodiment is not intended to limit the patent scope of the present invention, and any equivalent implementation or implementation without departing from the technical spirit of the present invention All changes shall be included in the patent scope of this case.

<The present invention> 1: Metal sensing electrode structure 11: The first metal sensing electrode layer 111: first patterned metal electrode structure 112: The first black film 113: The first anti-oxidation film 12: The second metal sensing electrode layer 121: second patterned metal electrode structure 122: The second black film 123: The second anti-oxidation film A1: The first optical adhesive layer A11: First surface A12: Second surface A2: The second optical adhesive layer A21: Third surface A22: Fourth surface A3: The third optical adhesive layer A31: Fifth surface A32: The sixth surface 2: cover 3: Display panel module S1-S6: steps CF: Pure copper foil BL: Black layer AO: Anti-oxidation layer RA: Debondable layer SS: Carrying base ST1: The first layered structure ST2: Second stack structure TPD: Touch display device

<Learning> TPa: Touch display device 1a: Metal mesh touch panel 11a: The first transparent conductive substrate 111a: The first PET substrate 112a: the first copper electrode layer 12a: The first optical glue 13a: The second optical glue 14a: The third optical glue 15a: Second transparent conductive substrate 151a: Second PET substrate 152a: second copper electrode layer 2a: LCD module 3a: glass cover TPb: Touch display device 1b: Metal mesh touch panel 11b: PET substrate 12b: The first copper electrode layer 13b: The second copper electrode layer 15b, 16b: optical glue 2b: LCD module 3b: glass cover

FIG. 1 shows a structure diagram of a conventional touch display device; FIG. 2 shows a structural diagram of another conventional touch display device; FIG. 3 shows a structural diagram of a metal sensing electrode structure of the present invention; 4 shows a structural diagram of a touch display device including the metal sensing electrode structure of the present invention; 5A and 5B show a flow chart of a manufacturing method of a metal sensing electrode structure of the present invention; and 6A to 6F show the manufacturing flow chart of the metal sensing electrode structure of the present invention.

1: Metal sensing electrode structure

11: The first metal sensing electrode layer

111: first patterned metal electrode structure

112: The first black film

113: The first anti-oxidation film

12: The second metal sensing electrode layer

121: second patterned metal electrode structure

122: The second black film

123: The second anti-oxidation film

A1: The first optical adhesive layer

A11: First surface

A12: Second surface

Claims (22)

A metal sensing electrode structure includes: A first optical adhesive layer; A first metal sensing electrode layer, connected to a first surface of the first optical adhesive layer, and including a first patterned metal electrode structure, a first patterned metal electrode structure covering and covering the first patterned metal electrode structure A blackening film, and a first anti-oxidation film covering and covering the first blackening film; and A second metal sensing electrode layer, connected to a second surface of the first optical adhesive layer, and including a second patterned metal electrode structure, a second patterned metal electrode structure covering and covering the second patterned metal electrode structure The blackening film and a second anti-oxidation film covering and covering the second blackening film. The metal sensing electrode structure described in claim 1, wherein the first patterned metal electrode structure is made by applying a photolithography process to a pure copper foil, and the second patterning The metal electrode structure is made by applying the photolithography process through another pure copper foil. The metal sensing electrode structure described in item 2 of the scope of patent application, wherein the thickness of the pure copper foil is between 2 μm and 12 μm, and it is a rolled copper foil or an electrolytic copper foil (Electrodeposited copper foil). The metal sensing electrode structure described in item 1 of the scope of patent application, wherein the thickness of the first blackened film and the second blackened film is between 1 nanometer and 1 micron, and the manufacturing materials are as follows Any one: copper selenide (CuSe), copper oxyselenide (CuSe _x O _1-x ), copper oxide (CuO _x ), copper sulfide (CuS), or copper oxysulfide (CuS _x O _1-x ). The metal sensing electrode structure described in claim 1, wherein the first anti-oxidation film is formed by coating an organic corrosion inhibitor on the first patterned film covered with the first black film It is formed on the metal electrode structure, and the organic corrosion inhibitor is coated on the second patterned metal electrode structure covered with the second black film to form the second anti-oxidation film. The metal sensing electrode structure described in item 5 of the scope of patent application, wherein the thickness of the first anti-oxidation film and the second anti-oxidation film is between 1 nanometer and 1 micron, and the organic corrosion inhibitor Any of the following: benzotriazole (1,2,3-benzotriazole, BTA), methyl benzotriazole (5-methyl-1H-benzotriazole, TTA), mercaptobenzothiazole (Mercaptobenzothiazole, MBT ), Sodium salt of 1,2,3-benzotriazole (BTA Na), Sodium salt of mercaptobenzothiazole (MBT Na), Tolyl benzotriazole (Sodium Salt of 5-methyl-1H-benzotriazole, TTA•Na), or Methylchloroisothiazolinone (CMIT). In the metal sensing electrode structure described in item 1 of the scope of patent application, the thickness of the first optical adhesive layer is between 12 μm and 125 μm, and it has an adhesive force greater than 0.2N/25mm. The metal sensing electrode structure described in item 7 of the scope of patent application, wherein the optical adhesive layer is made of any one of the following materials: Thermoplastic polyurethane (TPU) or Acrylic (Acrylic). A touch display device includes: The metal sensing electrode structure described in any one of items 1 to 8 in the scope of the patent application; A second optical adhesive layer having a third surface and a fourth surface, wherein the second optical adhesive layer is connected to the first metal sensing electrode layer of the metal sensing electrode structure by the third surface; A cover plate connected to the fourth surface of the second optical adhesive layer; and A third optical adhesive layer having a fifth surface and a sixth surface, wherein the third optical adhesive layer is connected to the second metal sensing electrode layer of the metal sensing electrode structure by the fifth surface; as well as A display panel module is connected to the sixth surface of the third optical adhesive layer. The touch display device described in item 9 of the scope of patent application, wherein the display panel module is any one of the following: LCD display panel module, OLED display panel module, Mini LED display panel module, or Micro LED display Panel module. The touch display device according to claim 9 of the scope of patent application, wherein the touch display device is integrated in an electronic device, and the electronic device is any one of the following: a smart phone, a tablet computer, a notebook Computer, all-in-one computer, smart watch, or door phone. A manufacturing method of a metal sensing electrode structure includes the following steps: (1) Provide a pure copper foil, and perform a surface treatment on the pure copper foil; (2) forming a black layer to cover and wrap the pure copper foil, and then form an anti-oxidation layer to cover and cover the black layer; (3) Connect the pure copper foil covered with the anti-oxidation layer and the black layer to a supporting substrate with a debonding adhesive layer on the surface; (4) Perform a photolithography process (Photolithography) on the product of the foregoing step (3) to obtain a first laminate structure and a second laminate structure; wherein, the first laminate structure includes the carrier substrate and the solvable An adhesive layer and a first metal sensing electrode layer, and the second laminated structure includes the carrier substrate, the debonding adhesive layer, and a second metal sensing electrode layer; wherein the first metal sensing The electrode layer includes a first patterned metal electrode structure, a first black film covering and covering the first patterned metal electrode structure, and a first anti-oxidation film covering and covering the first black film , And the second metal sensing electrode layer includes a second patterned metal electrode structure, a second black film covering and covering the second patterned metal electrode structure, and a second black film covering and covering the second patterned metal electrode structure A second anti-oxidation film of the film; (5) Make the first laminate structure face a first surface of a first optical adhesive layer with its first metal sensing electrode level, and make the second laminate structure use its second metal sensing The electrode layer is on a second surface of the first optical adhesive; then, the first laminated structure and the second laminated structure are respectively connected to the first surface and the second surface; and (6) Remove the carrier substrate and the debondable adhesive layer of the first laminated structure, and remove the carrier substrate and the debondable adhesive layer of the second laminated structure to obtain the first optical adhesive layer A metal sensing electrode structure composed of the first metal sensing electrode layer and the second metal sensing electrode layer. The manufacturing method of the metal sensing electrode structure described in item 12 of the scope of patent application, the thickness of the pure copper foil is between 2 microns and 12 microns, and it is a rolled copper foil or an electrolytic copper Electrodeposited copper foil. The manufacturing method of the metal sensing electrode structure described in item 12 of the scope of patent application, in this step (1), an acid solution is used to remove a resist layer and an oxide layer on the surface of the pure copper foil, and the acid The solution is any one of the following: sulfuric acid, nitric acid, hydrochloric acid, formic acid, acetic acid, malic acid, citric acid, a mixture of any two of the above, or a mixture of any two or more of the above. The manufacturing method of the metal sensing electrode structure described in item 14 of the scope of patent application, wherein the acidic solution is added with a trace amount of hydrogen peroxide. The manufacturing method of the metal sensing electrode structure described in item 12 of the scope of patent application, wherein the thickness of the black layer is between 1 nanometer and 1 micron, and the manufacturing material is any one of the following: selenization Copper (CuSe), copper oxide selenide (CuSe _x O _1-x ), copper oxide (CuO _x ), copper sulfide (CuS), or copper oxysulfide (CuS _x O _1-x ). The manufacturing method of the metal sensing electrode structure described in item 12 of the scope of patent application, wherein the anti-oxidation layer is formed by coating an organic corrosion inhibitor on the blackened layer. The manufacturing method of the metal sensing electrode structure described in the scope of patent application, wherein the thickness of the anti-oxidation layer is between 1 nanometer and 1 micron, and the organic corrosion inhibitor is any one of the following: Benzotriazole (1,2,3-benzotriazole, BTA), methyl benzotriazole (5-methyl-1H-benzotriazole, TTA), mercaptobenzothiazole (Mercaptobenzothiazole, MBT), benzotriazole Sodium salt of 1,2,3-benzotriazole (BTA•Na), sodium salt of mercaptobenzothiazole (MBT•Na), methyl benzotriazole (Sodium salt of 5-methyl- 1H-benzotriazole, TTA•Na), Methylchloroisothiazolinone (CMIT). The manufacturing method of the metal sensing electrode structure described in claim 12, wherein the supporting substrate is a polymer substrate, and the thickness thereof is between 12 μm and 300 μm. The manufacturing method of the metal sensing electrode structure described in item 12 of the scope of patent application, wherein the thickness of the releasable adhesive layer is between 10 microns and 375 microns, and it is any one of the following: acrylic Pressure sensitive adhesive (Acrylic pressure sensitive adhesive (PSA)), UV light debonding adhesive, or heat debonding adhesive. The manufacturing method of the metal sensing electrode structure described in the scope of patent application 20, wherein an initial adhesion force of the debonding adhesive layer is greater than 0.2N/25mm, and a solution is performed on the debonding adhesive layer After the adhesion treatment, the adhesion force of one of the debonding adhesive layers is less than 0.02N/25mm. The manufacturing method of the metal sensing electrode structure described in item 12 of the scope of patent application, wherein the material of the first optical adhesive layer is any one of the following: Thermoplastic polyurethane (TPU) or acrylic ( Acrylic).

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