TW202018800A - Processing cup unit and substrate processing apparatus - Google Patents

Abstract

This processing cup unit is disposed so as to surround a substrate being held in a horizontal position when the substrate is subjected to a process using a processing liquid. The processing cup unit is provided with a lower cup, an upper cup, and a mist attachment-preventing member. The upper cup is disposed so as to surround the substrate. The lower cup is located under the upper cup. The mist attachment-preventing member is disposed under the substrate. The mist attachment-preventing member prevents a mist of the processing liquid from attaching to the underside of the substrate.

Description

Processing cup unit and substrate processing device

The invention relates to a processing cup unit and a substrate processing device provided with the processing cup unit.

A substrate is used for processing a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a reticle, or a glass substrate for an optical disc using a processing solution such as a developer, cleaning solution, rinse solution, or photoresist solution Processing device. For example, in the substrate processing apparatus described in Patent Document 1, in a state where the substrate is horizontally supported by the rotation holding portion and rotated, the processing liquid is ejected toward the central portion of the processed surface of the substrate. The processing liquid in the central part of the surface to be processed is spread to the entire surface to be processed by the centrifugal force accompanying the rotation of the substrate. By this, the processing liquid is supplied to the entire processed surface of the substrate.

[Patent Document 1] Japanese Patent Application Publication No. 2014-49679

[Problems to be solved by the invention] In the rotary substrate processing apparatus as in Patent Document 1, part of the processing liquid on the surface to be processed is scattered due to centrifugal force. In this case, the processing liquid adheres to the lower surface on the opposite side to the surface to be processed, and contaminates the lower surface of the substrate. Therefore, in the substrate processing apparatus of Patent Document 1, a processing liquid nozzle for supplying a cleaning liquid to the lower surface of the substrate is provided to remove the processing liquid adhering to the lower surface. However, there is a case where it is difficult to sufficiently remove the processing liquid adhering to the lower surface of the substrate. In particular, when the viscosity of the processing liquid is high, a large amount of cleaning liquid needs to be supplied to the lower surface of the substrate.

An object of the present invention is to provide a processing cup unit and a substrate processing apparatus that can prevent contamination of the lower surface of a substrate due to a processing liquid.

[Technical means to solve the problem] (1) The processing cup unit of one aspect of the present invention is provided to surround the substrate when the substrate held in a horizontal posture is treated with a processing liquid, and it includes: a lower cup; an upper cup, which is in the lower cup The upper part is arranged to surround the periphery of the substrate; and the anti-fog adhesion member is arranged below the substrate and prevents the mist of the processing liquid from adhering to the lower surface of the substrate. In this processing cup unit, a lower cup and an upper cup are provided when performing processing using a processing liquid on a substrate held in a horizontal posture. The upper cup is arranged above the lower cup so as to surround the periphery of the substrate. The anti-fog adhesion member is arranged below the substrate. According to this configuration, since the processing liquid scattered from the processed surface of the substrate is captured by the lower cup and the upper cup during substrate processing, contamination of the outside of the processing cup unit due to the scattering of the processing liquid is prevented. Here, even in the case where the processing liquid scattered from the substrate collides with the lower cup or the upper cup to generate mist of the processing liquid, the anti-fog adhesion member prevents the mist of the processing liquid from adhering to the lower surface of the substrate. Thereby, the contamination of the lower surface of the substrate due to the processing liquid can be prevented. In addition, since the processing liquid does not adhere to the lower surface of the substrate, there is no need to supply the cleaning liquid for cleaning the lower surface of the substrate to the lower surface of the substrate. Therefore, the amount of cleaning solution used for substrate processing can be reduced.

(2) The anti-fog adhesion member may be arranged along the lower surface of the substrate and close to the lower surface of the substrate. In this case, the space between the anti-fog adhesion member and the lower surface of the substrate is narrowly formed. Therefore, it is easier to prevent the processing liquid on the processed surface of the substrate from bypassing to the lower surface. In this way, the contamination of the lower surface of the substrate due to the processing liquid can be more reliably prevented.

(3) The distance between the vertical anti-fog adhesion member and the lower surface of the substrate can be 2 mm or more and 5 mm or less. In this case, the space between the anti-fog adhesion member and the lower surface of the substrate is more narrowly formed by sufficiently approaching the anti-fog adhesion member and the lower surface of the substrate. With this, it is possible to more reliably prevent the processing liquid on the processed surface of the substrate from bypassing to the lower surface.

(4) The distance between the vertical anti-fog adhesion member and the lower surface of the substrate can be gradually reduced from the inner side to the outer side. In this case, since the distance between the anti-fog adhesion member and the lower surface of the substrate becomes narrower on the outer side, it is possible to further reliably prevent the treatment liquid of the processed surface of the substrate from detouring to the lower surface.

(5) The outer edge of the anti-fog adhesion member may be located closer to the inner side than the outer edge of the substrate. In this case as well, it is possible to further surely prevent the processing liquid on the processed surface of the substrate from bypassing to the lower surface.

(6) The processing cup unit may be further provided with a gas nozzle forming a flow of gas from the inside to the outside along the lower surface of the substrate. In this case, the space between the anti-fog adhesion member and the lower surface of the substrate can be maintained at a positive pressure. This can further reliably prevent the mist of the processing liquid from adhering to the lower surface of the substrate and the processing liquid of the processed surface of the substrate to bypass the lower surface.

(7) The inner edge of the lower cup can be located closer to the inner edge than the inner edge of the upper cup. In this case, the inner edge of the lower cup is sufficiently close to the substrate. Therefore, when the flying distance of the processing liquid is short, the processing liquid can still be collected by the lower cup. Furthermore, even when the processing liquid collides with the lower cup near the substrate to generate mist of the processing liquid, the anti-fog adhesion member prevents the mist of the processing liquid from adhering to the lower surface of the substrate. Thereby, the contamination of the lower surface of the substrate due to the processing liquid can be prevented.

(8) The inner edge of the lower cup may be located below the outer edge of the anti-fog adhesion member. In this case, the inner edge of the lower cup is sufficiently close to the substrate. Therefore, when the flying distance of the processing liquid is short, the processing liquid can still be collected by the lower cup. Furthermore, even when the processing liquid collides with the lower cup near the substrate to generate mist of the processing liquid, the anti-fog adhesion member prevents the mist of the processing liquid from adhering to the lower surface of the substrate. Thereby, the contamination of the lower surface of the substrate due to the processing liquid can be prevented.

(9) The viscosity of the processing liquid used in substrate processing may be 100 cP or more and 300 cP or less. According to this configuration, since the mist of the processing liquid is prevented from adhering to the lower surface of the substrate by the anti-fog adhesion member, even when the viscosity of the processing liquid used for substrate processing is relatively high, it can still be used without using the cleaning liquid Prevent contamination of the surface under the substrate.

(10) A substrate processing apparatus according to still another aspect of the present invention includes: a rotation holding device that holds the substrate in a horizontal posture and rotates it; and a processing liquid ejection section that processes the substrate held by the rotation holding device The processing liquid is ejected from the surface; and the processing cup unit according to one aspect of the present invention is provided to surround the substrate held by the rotation holding device.

In this substrate processing apparatus, the substrate is held in a horizontal posture by the rotation holding device and rotated. In this state, the substrate is processed by ejecting the processing liquid on the surface of the substrate to be processed by the processing liquid ejecting portion. Since the above-mentioned processing cup unit is provided in such a way as to surround the periphery of the substrate, the contamination of the substrate processing device due to the scattering of the processing liquid is prevented.

Moreover, even in the case where the processing liquid scattered from the substrate collides with the lower cup or the upper cup to generate mist of the processing liquid, the anti-fog adhesion member prevents the mist of the processing liquid from adhering to the lower surface of the substrate. Thereby, the contamination of the lower surface of the substrate due to the processing liquid can be prevented. Furthermore, since the processing liquid does not adhere to the lower surface of the substrate, there is no need to supply the cleaning liquid for cleaning the lower surface of the substrate to the lower surface of the substrate. Therefore, the amount of cleaning solution used for substrate processing can be reduced.

[Effect of invention] According to the present invention, it is possible to prevent contamination of the lower surface of the substrate due to the processing liquid.

(1) Structure of substrate processing apparatus Hereinafter, a processing cup unit and a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. 1 is a schematic cross-sectional view along a direction of a substrate processing apparatus according to an embodiment of the present invention. 2 is a partially enlarged cross-sectional view of the processing cup unit 10 of FIG. 1. As shown in FIG. 1, the substrate processing apparatus 100 includes a processing cup unit 10, a rotation holding device 20, and a processing nozzle 30. The processing cup unit 10 is a non-rotating cup that prevents the processing liquid from scattering from the substrate W, and is provided so as to surround the periphery of the substrate W.

The rotation holding device 20 is, for example, a spin chuck, and includes a drive device 21 and a rotation holding portion 23. The drive device 21 is, for example, an electric motor, and has a rotating shaft 22. The rotation holding portion 23 is attached to the front end of the rotation shaft 22 of the drive device 21, and is rotationally driven around the vertical axis while holding the substrate W in a horizontal posture. In the following description, as indicated by the thick arrows in FIG. 1, in the horizontal plane, the direction toward the center of the substrate W held by the rotation holding portion 23 is defined as the inner side, and the opposite direction is defined as the outer side .

The processing nozzle 30 is connected to the processing liquid supply system A, and is movably provided between the processing position above the center of the substrate W and the standby position outside the processing cup unit 10, as indicated by the dotted arrow in FIG. . During the substrate processing, the processing nozzle 30 moves from the standby position to the processing position, and discharges the processing liquid stored in the processing liquid supply system A toward the center of the processing surface of the rotating substrate W. The processing liquid stored in the processing liquid supply system A is, for example, a coating liquid such as a resist liquid, and has a relatively high viscosity. In this example, the viscosity of the treatment liquid is 100 cP or more and 300 cP or less.

As shown in FIG. 2, the processing cup unit 10 is provided so as to surround the substrate W held and held by the rotation holding portion 23, and includes the lower cup 11, the upper cup 12, and the side wall portion 13. The lower cup 11 is arranged so as to surround the space below the substrate W. In this example, the inner edge portion of the lower cup 11 is located closer to the inner side than the inner edge portion of the upper cup 12 and is located below the outer edge portion of the substrate W. In addition, in order to prevent the lower cup 11 from interfering with the anti-fog adhesion member 17 which will be disposed below the substrate W, a notch 11n is formed in the upper portion of the inner edge of the lower cup 11.

The upper surface 11a of the lower cup 11 is inclined from the inside toward the outside, and slightly inclined downward. A groove portion 11g is formed on the upper surface 11a of the lower cup 11 and is recessed downward along the outer peripheral portion of the lower cup 11 and extends annularly in a horizontal plane. The vibration member 14 is provided in the groove portion 11g. Here, one vibration member 14 extending annularly in a horizontal plane may be provided, or a plurality of vibration members 14 may be arranged at substantially equal angular intervals. The vibration member 14 is, for example, an ultrasonic vibrator.

The upper cup 12 is arranged above the lower cup 11 so as to protrude inward from the upper part of the thick-walled part 13a described later on the side wall part 13 and surround the space above the substrate W. The lower surface 12a of the upper cup 12 contains portions p1, p2, p3. The portion p1 of the lower surface 12a is inclined from the inner side toward the outer side and steeply downward. The portion p2 of the lower surface 12a is inclined outward from the outer peripheral portion of the portion p1 and gently inclined downward. The portion p3 of the lower surface 12a extends substantially horizontally from the outer peripheral portion of the portion p2 toward the outside.

As a result, the distance between the upper surface 11a of the lower cup 11 and the lower surface 12a of the upper cup 12 gradually decreases from the inner side toward the outer side. Hereinafter, the space between the upper surface 11a of the lower cup 11 and the portion p2 of the lower surface 12a of the upper cup 12 is referred to as a collection space V1. The space between the upper surface 11a of the lower cup 11 and the portion p3 of the lower surface 12a of the upper cup 12 is referred to as a collection space V2. The maximum length of the collection space V1 in the vertical direction is, for example, 20 mm or more and 50 mm or less. The maximum radial length of the collection space V1 is, for example, 20 mm or more and 40 mm or less.

A groove portion 12g is formed on the lower surface 12a of the upper cup 12, which is recessed upward along the outer peripheral portion of the upper cup 12 and extends annularly in a horizontal plane. Thereby, between the groove portion 11g of the lower cup 11 and the groove portion 12g of the upper cup 12, a scattered space V3 larger than the collection space V2 is formed. At the bottom of the groove portion 12g, a plurality of through-holes 12h extending in the substantially vertical direction and connected to the scattered space V3 are formed at substantially equal angular intervals. In FIG. 2, only one through hole 12h is shown.

The side wall portion 13 includes a thick portion 13a and a thin portion 13b. In this example, the upper cup 12, the thick portion 13a, and the thin portion 13b are integrally formed. In FIG. 2, the boundary between the upper cup 12 and the thick portion 13 a and the thin portion 13 b is shown by broken lines. The thick portion 13a is disposed outside the lower cup 11 and the upper cup 12. In addition, the inner edge of the thick portion 13a is located above the outer edge of the lower cup 11. In the lower part of the outer periphery of the side wall portion 13, a groove portion 13g is formed, which is recessed upward and extends annularly in a horizontal plane.

The thin portion 13b has a smaller thickness than the thick portion 13a, and extends from below the outer edge of the thick portion 13a along the outer side of the lower cup 11 and below the lower cup 11. Thereby, a discharge space V4 is formed between the thin portion 13b and the lower cup 11. Between the inner edge portion of the thick portion 13a and the outer edge portion of the lower cup 11, a small gap S connecting the scattered space V3 and the discharge space V4 is provided.

Below the lower cup 11, an exhaust flow path F1 and a waste liquid flow path F2 connected to the discharge space V4 are provided. The exhaust flow path F1 is connected to the exhaust system B of FIG. 1. The exhaust system B guides the gas discharged from the exhaust flow path F1 toward the exhaust equipment in the factory. The waste liquid flow path F2 is located outside the exhaust flow path F1 and is connected to the waste liquid system C of FIG. 1. The waste liquid system C guides the liquid discharged from the waste liquid flow path F2 toward the waste liquid equipment in the factory.

A plurality of washing nozzles 15 corresponding to the plurality of through-holes 12h are attached to the upper cup 12, respectively. A plurality of cleaning nozzles 15 are connected to the cleaning liquid supply system D of FIG. 1 via a pipe P. Furthermore, the pipe P is led in an annular shape in the horizontal plane above the upper cup 12. Each cleaning nozzle 15 discharges the cleaning liquid stored in the cleaning liquid supply system D toward the scattered space V3 and the groove portion 11g from above through the pipe P and the corresponding through hole 12h. Thereby, the lower cup 11, the upper cup 12, and the side wall portion 13 are washed, and the washing liquid is stored in the groove portion 11g.

The cleaning liquid stored in the cleaning liquid supply system D is a liquid such as rinse liquid that dissolves the processing liquid. Specifically, the cleaning solution may be, for example, PGME (propyleneglycol monomethyl ether), PGMEA (propyleneglycol monomethyl ether acetate), or cyclohexanone. Alternatively, the washing liquid may be, for example, a mixed liquid of PGME and PGMEA, and the mixing ratio thereof may be, for example, 7:3.

The processing cup unit 10 further includes a pad 16, an anti-fog adhesion member 17 and a plurality of gas nozzles 18. The pad 16 is a member used for recovering the processing liquid ejected onto the substrate W, and has a disk shape, for example. The pad 16 is disposed below the substrate W so as to surround the rotation shaft 22 of the driving device 21 of FIG. 1.

The anti-fog adhesion member 17 is a member that prevents the mist of the processing liquid described later from adhering to the lower surface of the substrate W, and has a substantially circular plate shape, for example. The anti-fog adhesion member 17 is disposed between the substrate W and the pad 16 so as to surround the rotation holding portion 23 of FIG. 1, and is supported on the pad 16 by a support member (not shown).

The upper surface of the anti-fog adhesion member 17 is close to the lower surface on the opposite side to the surface to be treated of the substrate W, and extends from the inner side to the outer side along the lower surface of the substrate W. Thereby, the space V5 between the upper surface of the anti-fog adhesion member 17 and the lower surface of the substrate W is narrowly formed. The distance between the upper surface of the anti-fog adhesion member 17 and the lower surface of the substrate W is, for example, 2 mm or more and 3 mm or less, and the maximum is 5 mm.

In this example, the distance between the upper surface of the anti-fog adhesion member 17 and the lower surface of the substrate W gradually decreases from the inner side toward the outer side. In this case, the space V5 is formed narrower. In addition, the outer edge of the anti-fog adhesion member 17 is located closer to the inner side than the outer edge of the substrate W. Even in this case, the space V5 can be narrowly formed.

A plurality of gas nozzles 18 are connected to the gas supply part E, and are provided at substantially equal angular intervals so as to penetrate the anti-fog gas attachment member 17 obliquely upward below the substrate W. Each gas nozzle 18 supplies the gas enclosed in the gas supply part E to the lower surface of the rotating substrate W. The gas supplied to the lower surface of the substrate W is guided from the inner side to the outer side along the lower surface of the substrate W. The gas enclosed in the gas supply part E is nitrogen, for example. The gas enclosed in the gas supply part E may be other gases such as clean air.

(2) Operation of the substrate processing device 1 and 2, the operation of the substrate processing apparatus 100 will be described. The substrate W is held in a horizontal posture by the rotation holding portion 23 with the surface to be processed facing upward. In this state, the substrate W is rotated by the rotation holding portion 23, and the processing liquid is discharged from the processing nozzle 30 toward the vicinity of the center of the surface of the substrate W to be processed. By this, the processing liquid ejected toward the center of the processed surface of the substrate W is spread to the entire processed surface of the substrate W by the centrifugal force accompanying the rotation of the substrate W, and the processed liquid is formed on the processed surface of the substrate W Of the film.

Here, when the substrate W rotates at a rotation speed greater than a specific rotation speed, the processing liquid having high kinetic energy supplied to the processed surface of the substrate W is thrown away from the processed surface of the substrate W in the up and down direction It spreads outward from the peripheral portion of the substrate W with a width. The processing liquid scattered from the substrate W is collected in the collection space V1 by the upper surface 11 a of the lower cup 11 and the lower surface 12 a of the upper cup 12.

The treatment liquid trapped in the trapping space V1 is guided outward along the upper surface 11a of the lower cup 11 and the lower surface 12a of the upper cup 12, and gathers in the collection space V2 and passes through the collection space V2. The processing liquid passing through the collection space V2 reaches the flying space V3, collides with the thick portion 13a of the side wall portion 13, and is scattered in the up-down direction and the radial direction in the scattering space V3. A part of the scattered processing liquid loses kinetic energy and falls due to gravity, and is stored in the groove portion 11g. On the other hand, there is a case where another part of the treatment liquid after the scattering becomes mist.

In this case as well, the interval of the collection space V2 gradually decreases from the inner side toward the outer side. Furthermore, the processing liquid scattered from the substrate W continuously passes through the collection space V2 from the inside toward the outside. Therefore, the mist of the treatment liquid is pushed back toward the outside through the flow of the treatment liquid in the collection space V2, and the mist of the treatment liquid does not pass through the collection space V2 again and returns to the collection space V1. This prevents the mist of the processing liquid from flowing back and adhering to the processed surface and the lower surface of the substrate W, and prevents the mist of the processing liquid from flying out of the processing cup unit 10.

In addition, the anti-fog adhesion member 17 narrowly forms the space V5 between the upper surface of the anti-fog adhesion member 17 and the lower surface of the substrate W. In addition, a plurality of gas nozzles 18 supply gas from the inside to the outside along the lower surface of the substrate W. Therefore, the space V5 is maintained at a positive pressure. Furthermore, the gas in the scattered space V3 is guided to the discharge space V4 through the gap S, and then discharged from the exhaust flow path F1. The gas discharged from the exhaust flow path F1 is guided to the exhaust equipment in the factory through the exhaust system B.

According to the above configuration, the anti-fog adhesion member 17 prevents the airflow formed from the outside of the substrate W toward the lower surface of the substrate W. Therefore, the mist of the processing liquid rebounded in the processing cup unit 10 does not adhere to the lower surface of the substrate W, so that the processing liquid of the processed surface of the substrate W does not detour to the lower surface. Thereby, even if the lower surface of the substrate W is not cleaned with the cleaning liquid, the contamination of the lower surface of the substrate due to the processing liquid can be prevented. In addition, since there is no case where the processing liquid rebounded by the processing cup unit 10 adheres to the processed surface of the substrate W, it is possible to prevent the film formed on the processed surface from being contaminated.

A part of the processing liquid that reaches the scattered space V3 is attached to the wall surface in the processing cup unit 10 that is in contact with the scattered space V3. Here, the washing liquid is sprayed from the plurality of washing nozzles 15 through the plurality of through holes 12h toward the scattered space V3 and the groove portion 11g. The washing liquid sprayed to the scattered space V3 is transmitted to the wall surface in the processing cup unit 10 which is in contact with the scattered space V3 and is guided downward. As a result, the washing liquid adhering to the wall surface is dissolved and stored in the groove portion 11g of the lower cup 11 together with the washing liquid as indicated by the arrow X in FIG. 2.

Here, the treatment liquid dissolved and stored in the tank portion 11g is reduced in viscosity by vibrating the vibrating member 14 provided in the tank portion 11g. The treatment liquid reduced in viscosity is guided toward the discharge space V4 by the air flow through the gap S. Here, since the groove portion 11g is formed along the outer peripheral portion of the lower cup 11, the distance between the groove portion 11g and the substrate W is sufficiently separated. Therefore, it is easy to prevent the treatment liquid having a reduced viscosity from flowing back and adhering to the substrate W again.

Moreover, even when the processing liquid guided from the groove portion 11g to the discharge space V4 collides with the thin portion 13b of the side wall portion 13 and expands or floats upward, the processing liquid is still caught by the groove portion 13g , Return to the discharge space V4 below by gravity. Thereafter, the processing liquid in the discharge space V4 is discharged from the waste liquid flow path F2, and is guided to the waste liquid equipment in the factory by the waste liquid system C.

According to the above configuration, even in the case where the viscosity of the processing liquid is high, the processing liquid does not remain in a state of being attached to the wall surface of the processing cup unit 10. Therefore, the path for exhaust and waste liquid in the processing cup unit 10 is prevented from being blocked by the processing liquid. In addition, since the processing liquid is reduced in viscosity, it is easily discharged out of the processing cup unit 10. Thereby, contamination of the processing cup unit 10 is prevented, and particles of the processing liquid in the processing cup unit 10 are also prevented. Therefore, the frequency with which the processing cup unit 10 is removed and washed or the frequency with which the processing cup unit 10 is replaced is reduced. As a result, the frequency of maintenance and repair of the processing cup unit 10 can be reduced.

(3) Variation In this embodiment, the upper surface 11a of the lower cup 11 is slightly inclined downward from the inner side toward the outer side, but the shape of the lower cup 11 is not limited to this. FIG. 3 is a partially enlarged cross-sectional view of the processing cup unit 10 of a modified example. As shown in FIG. 3, the upper surface 11a of the lower cup 11 may be inclined obliquely upward from the inside toward the outside. In this configuration, when the lower cup 11 does not interfere with the anti-fog adhesion member 17, the notch 11n may not be formed in the lower cup 11. Alternatively, the upper surface 11a of the lower cup 11 may be almost horizontal without being inclined.

(4) Effect In the substrate processing apparatus 100 of this embodiment, the substrate W is held in the horizontal posture by the rotation holding device 20 and rotated. In this state, the processing nozzle 30 discharges the processing liquid toward the processing surface of the substrate W to process the substrate W. Since the processing cup unit 10 is provided so as to surround the periphery of the substrate W, it is possible to prevent contamination of the substrate processing apparatus 100 due to the scattering of the processing liquid.

In the processing cup unit 10, the anti-fog adhesion member 17 is arranged below the substrate W. According to this configuration, even when the processing liquid scattered from the substrate W collides with the lower cup 11 or the upper cup 12 to generate mist of the processing liquid, the anti-fog adhesion member 17 prevents the mist of the processing liquid from adhering to the substrate W Under the surface. Thereby, the contamination of the lower surface of the substrate W due to the processing liquid can be prevented. In addition, since the processing liquid does not adhere to the lower surface of the substrate W, there is no need to supply the cleaning liquid for cleaning the lower surface of the substrate W to the lower surface of the substrate W. Therefore, the amount of cleaning solution used for substrate processing can be reduced.

In the processing cup unit 10, the processing liquid scattered from the substrate W is dissolved and stored in the groove portion 11g formed in the lower cup 11 and vibrated by the vibrating member 14, and then discharged from the discharge space V4. According to this configuration, the treatment liquid is reduced in viscosity by vibrating by the vibrating member 14 in the groove portion 11g. Therefore, it is easy to discharge the processing liquid out of the processing cup unit 10. In this case, the amount of the treatment liquid remaining on the wall surface of the lower cup 11, the upper cup 12, or the side wall portion 13 is reduced. Thereby, the frequency of maintenance and repair of the processing cup unit 10 can be reduced.

Furthermore, in the present embodiment, the inner edge of the lower cup 11 is sufficiently close to the substrate W. Specifically, the inner edge of the lower cup 11 is located closer to the inner edge than the inner edge of the upper cup 12. Alternatively, the inner edge of the lower cup 11 is located below the outer edge of the substrate W or the outer edge of the anti-fog adhesion member 17. Therefore, even in the case where the rotation speed of the substrate W is small or the viscosity of the processing liquid is high and the flying distance of the processing liquid is short, the processing liquid can be captured by the lower cup 11.

The processing liquid collected by the lower cup 11 is guided to the groove portion 11g formed in the lower cup 11. With this, the processing liquid can be discharged out of the processing cup unit 10. Moreover, even when the processing liquid collides with the lower cup 11 near the substrate W and a part of the processing liquid becomes mist, the anti-fog adhesion member 17 can prevent the mist of the processing liquid from adhering to the lower surface of the substrate W. Therefore, it is possible to prevent contamination of the lower surface of the substrate W due to the processing liquid.

5. Other embodiments (a) In the above embodiment, the processing cup unit 10 includes the gas nozzle 18, but the present invention is not limited to this. In the case where the space V5 between the upper surface of the anti-fog gas attachment member 17 and the lower surface of the substrate W is sufficiently narrow, the processing cup unit 10 may not include the gas nozzle 18. (b) In the above embodiment, the processing cup unit 10 includes the cleaning nozzle 15, but the present invention is not limited to this. When the viscosity of the processing liquid can be reduced, the processing cup unit 10 may not include the cleaning nozzle 15. In addition, in the substrate processing, a dissolving liquid such as an organic solvent in which the processing liquid is dissolved may be used (for example, a pre-wetting process). In this case, the dissolving liquid is stored in addition to the processing liquid in 11 g of the tank portion, and the processing liquid is dissolved. Therefore, even in such a case, the processing cup unit 10 may not include the washing nozzle 15. (c) In the above embodiment, the processing cup unit 10 includes the vibrating member 14, but the present invention is not limited to this. When the processing liquid can be efficiently discharged outside the processing cup unit 10, the processing cup unit 10 may not include the vibration member 14.

(6) Correspondence between each component of the request item and each part of the embodiment Hereinafter, an example of correspondence between each constituent element of the request item and each part of the embodiment will be described, but the present invention is not limited to the following examples. As each constituent element of the request item, various other elements having the structure or function described in the request item can be used. In the above embodiment, the substrate W is an example of a substrate, the processing cup unit 10 is an example of a processing cup unit, the lower cup 11 is an example of a lower cup, and the upper cup 12 is an example of an upper cup. The anti-fog adhesion member 17 is an example of an anti-fog adhesion member, the gas nozzle 18 is an example of a gas nozzle, the rotation holding device 20 is an example of a rotation holding device, the processing nozzle 30 is an example of a processing liquid ejection portion, and the substrate processing device 100 is a substrate Examples of processing devices.

10: Handle the cup unit 11: next cup 11a: upper surface 11g: Groove 11n: Notch 12: Cup 12a: lower surface 12g: Groove 12h: through hole 13: Side wall 13a: thick wall 13b: Thin-walled part 13g: Groove 14: Vibration member 15: Wash nozzle 16: Pad 17: Anti-fog adhesion member 18: gas nozzle 20: Rotating holding device 21: Drive 22: Rotating axis 23: Rotating holding part 30: Processing nozzle 100: substrate processing device A: Treatment liquid supply system B: Exhaust system C: Waste liquid system D: Cleaning liquid supply system E: Gas supply unit F1: Exhaust flow path F2: Waste liquid flow path P: piping p1: part p2: part p3: part S: gap V1: capture space V2: Collection space V3: scattered space V4: discharge space V5: Space W: substrate

1 is a schematic cross-sectional view along a direction of a substrate processing apparatus according to an embodiment of the present invention. 2 is a partially enlarged cross-sectional view of the processing cup unit of FIG. 1. 3 is a partially enlarged cross-sectional view of a processing cup unit according to a modification.

10: Handle the cup unit

11: next cup

11a: upper surface

11g: Groove

11n: Notch

12: Cup

12a: lower surface

12g: Groove

12h: through hole

13: Side wall

13a: thick wall

13b: Thin-walled part

13g: Groove

14: Vibration member

15: Wash nozzle

16: Pad

17: Anti-fog adhesion member

18: gas nozzle

F1: Exhaust flow path

F2: Waste liquid flow path

P: piping

p1: part

p2: part

p3: part

S: gap

V1: capture space

V2: Collection space

V3: scattered space

V4: discharge space

V5: Space

W: substrate

Claims (10)

A processing cup unit which is installed in such a manner as to surround a substrate held in a horizontal posture when processing using a processing liquid, and includes: Next cup The upper cup is arranged above the lower cup in such a way as to surround the substrate; and The anti-fog adhesion member is arranged below the substrate and prevents the mist of the processing liquid from adhering to the lower surface of the substrate. The processing cup unit according to claim 1, wherein the aforementioned anti-fog adhesion member is arranged to extend along the lower surface of the substrate and close to the lower surface of the substrate. The processing cup unit according to claim 2, wherein the distance between the aforementioned anti-fog adhesion member in the up and down direction and the lower surface of the substrate is 2 mm or more and 5 mm or less. The processing cup unit according to claim 2 or 3, wherein the distance between the aforementioned anti-fog adhesion member in the up-down direction and the lower surface of the substrate gradually decreases from the inside toward the outside. The processing cup unit according to claim 2 or 3, wherein the outer edge of the anti-fog adhesion member is located closer to the inner side than the outer edge of the substrate. The processing cup unit according to claim 2 or 3, which further includes a gas nozzle forming a flow of gas along the lower surface of the substrate from inside to outside. The processing cup unit according to claim 2 or 3, wherein the inner edge of the lower cup is located closer to the inner side than the inner edge of the upper cup. The processing cup unit according to claim 2 or 3, wherein the inner edge portion of the aforementioned lower cup is located below the outer edge portion of the aforementioned anti-fog adhesion member. The processing cup unit according to claim 2 or 3, wherein the viscosity of the processing liquid used for substrate processing is 100 cP or more and 300 cP or less. A substrate processing apparatus including: a rotation holding device that holds a substrate in a horizontal posture and rotates it; A processing liquid ejecting part, which ejects the processing liquid to the surface of the substrate held by the rotation holding device; and The processing cup unit according to claim 2 or 3 is provided to surround the substrate held by the rotation holding device.

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