[go: up one dir, main page]

TW202000948A - Metal sheet wound body, packaging provided with wound body, wound body packaging method, wound body storage method, method of manufacturing evaporation mask using wound body metal sheet, and metal sheet - Google Patents

Metal sheet wound body, packaging provided with wound body, wound body packaging method, wound body storage method, method of manufacturing evaporation mask using wound body metal sheet, and metal sheet Download PDF

Info

Publication number
TW202000948A
TW202000948A TW108119941A TW108119941A TW202000948A TW 202000948 A TW202000948 A TW 202000948A TW 108119941 A TW108119941 A TW 108119941A TW 108119941 A TW108119941 A TW 108119941A TW 202000948 A TW202000948 A TW 202000948A
Authority
TW
Taiwan
Prior art keywords
metal plate
shaft member
vapor deposition
less
winding body
Prior art date
Application number
TW108119941A
Other languages
Chinese (zh)
Other versions
TWI782212B (en
Inventor
池永知加雄
舟津宇紘
Original Assignee
日商大日本印刷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=68769195&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW202000948(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 日商大日本印刷股份有限公司 filed Critical 日商大日本印刷股份有限公司
Publication of TW202000948A publication Critical patent/TW202000948A/en
Application granted granted Critical
Publication of TWI782212B publication Critical patent/TWI782212B/en

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B1/00Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/40Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B21B3/02Rolling special iron alloys, e.g. stainless steel
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21CMANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES, PROFILES OR LIKE SEMI-MANUFACTURED PRODUCTS OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C37/00Manufacture of metal sheets, rods, wire, tubes, profiles or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
    • B21C37/02Manufacture of metal sheets, rods, wire, tubes, profiles or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21CMANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES, PROFILES OR LIKE SEMI-MANUFACTURED PRODUCTS OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C47/00Winding-up, coiling or winding-off metal wire, metal band or other flexible metal material characterised by features relevant to metal processing only
    • B21C47/28Drums or other coil-holders
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/26Methods of annealing
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/74Methods of treatment in inert gas, controlled atmosphere, vacuum or pulverulent material
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D6/00Heat treatment of ferrous alloys
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D6/00Heat treatment of ferrous alloys
    • C21D6/001Heat treatment of ferrous alloys containing Ni
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D6/00Heat treatment of ferrous alloys
    • C21D6/007Heat treatment of ferrous alloys containing Co
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D8/00Modifying the physical properties by deformation combined with, or followed by, heat treatment
    • C21D8/02Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D8/00Modifying the physical properties by deformation combined with, or followed by, heat treatment
    • C21D8/02Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips
    • C21D8/0221Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips characterised by the working steps
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/0081Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for slabs; for billets
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C19/00Alloys based on nickel or cobalt
    • C22C19/03Alloys based on nickel or cobalt based on nickel
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C38/00Ferrous alloys, e.g. steel alloys
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C38/00Ferrous alloys, e.g. steel alloys
    • C22C38/08Ferrous alloys, e.g. steel alloys containing nickel
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C38/00Ferrous alloys, e.g. steel alloys
    • C22C38/10Ferrous alloys, e.g. steel alloys containing cobalt
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C38/00Ferrous alloys, e.g. steel alloys
    • C22C38/10Ferrous alloys, e.g. steel alloys containing cobalt
    • C22C38/105Ferrous alloys, e.g. steel alloys containing cobalt containing Co and Ni
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/10Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of nickel or cobalt or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/02Local etching
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions
    • C23F1/16Acidic compositions
    • C23F1/28Acidic compositions for etching iron group metals
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Winding, Rewinding, Material Storage Devices (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)

Abstract

Provided is a wound body with which it is possible to implement an evaporation mask inspection step appropriately. A wound body of a metal sheet for use in manufacturing an evaporation mask is provided with: a shaft member having an outer diameter of not less than 150 mm and not more than 550 mm; and a metal sheet which is wound around the shaft member and has a thickness of not more than 50 [mu]m.

Description

金屬板之捲繞體、具備捲繞體之捆包體、捲繞體之捆包方法、捲繞體之保管方法、使用捲繞體之金屬板之蒸鍍罩之製造方法及金屬板Winding body of metal plate, packaging body with winding body, packaging method of winding body, storage method of winding body, method of manufacturing vapor deposition cover of metal plate using winding body, and metal plate

本發明之實施形態係關於一種金屬板之捲繞體、具備捲繞體之捆包體、捲繞體之捆包方法、捲繞體之保管方法、使用捲繞體之金屬板之蒸鍍罩之製造方法及金屬板。An embodiment of the present invention relates to a wound body of a metal plate, a packaged body provided with a wound body, a packaging method of the wound body, a storage method of the wound body, and a vapor deposition cover of a metal plate using the wound body Manufacturing method and metal plate.

近年來,對智慧型手機或平板PC(pesonal computer,個人電腦)等能夠攜帶之器件中所使用之顯示裝置,要求為高精細,例如像素密度為500 ppi以上。又,於能夠攜帶之器件中,對與超高清(UHD)對應的需求提高,於該情形時,要求顯示裝置之像素密度例如為800 ppi以上。In recent years, display devices used in portable devices such as smart phones or tablet PCs (pesonal computers) have been required to be high-definition, for example, having a pixel density of 500 ppi or more. In addition, among portable devices, the demand for ultra high definition (UHD) is increasing. In this case, the pixel density of the display device is required to be, for example, 800 ppi or more.

由於響應性優良或消耗電力降低,故而有機EL (Electroluminescence,電致發光)顯示裝置受到關注。作為形成有機EL顯示裝置之像素之方法,已知有使用包含以所期望之圖案排列之貫通孔之蒸鍍罩,以所期望之圖案形成像素之方法。具體而言,首先,使蒸鍍罩密接於有機EL顯示裝置用之基板,其次,將密接之蒸鍍罩及基板一起投入至蒸鍍裝置,進行有機材料等之蒸鍍。Organic EL (Electroluminescence) display devices have attracted attention due to their excellent responsiveness or reduced power consumption. As a method of forming a pixel of an organic EL display device, a method of forming a pixel in a desired pattern using a vapor deposition mask including through holes arranged in a desired pattern is known. Specifically, first, the vapor deposition cover is adhered to the substrate for the organic EL display device, and then, the vapor deposition cover and the substrate are put into the vapor deposition device together to perform vapor deposition of an organic material or the like.

蒸鍍罩例如具備金屬板及貫通金屬板之複數個貫通孔。此種蒸鍍罩例如如專利文獻1所揭示,藉由利用蝕刻於金屬板形成貫通孔而製作。 [先前技術文獻] [專利文獻]The vapor deposition cover includes, for example, a metal plate and a plurality of through holes penetrating the metal plate. Such a vapor deposition mask is produced by, for example, as disclosed in Patent Document 1, by forming a through hole in a metal plate by etching. [Prior Technical Literature] [Patent Literature]

[專利文獻1]日本專利第5382259號公報[Patent Document 1] Japanese Patent No. 5382259

[發明所欲解決之問題][Problems to be solved by the invention]

作為金屬板之供給形態之一,已知有於軸構件捲繞有金屬板之捲繞體。於使用捲繞體之金屬板製作蒸鍍罩之情形時,對自捲繞體捲出之金屬板實施蝕刻等處理。As one of the supply forms of the metal plate, a winding body in which a metal plate is wound around a shaft member is known. When the metal plate of the winding body is used for the vapor deposition mask, the metal plate rolled out from the winding body is subjected to etching or the like.

於將金屬板捲繞於軸構件之期間,金屬板產生與軸構件之形狀對應之變形。若此種變形亦殘留於自金屬板製作之蒸鍍罩,則認為於蒸鍍罩之檢查步驟中測定蒸鍍罩之尺寸等時之精度降低,或無法測定。During the winding of the metal plate around the shaft member, the metal plate deforms according to the shape of the shaft member. If such deformation also remains in the vapor deposition cover made from the metal plate, the accuracy when measuring the size of the vapor deposition cover in the inspection step of the vapor deposition cover is considered to be reduced, or the measurement may not be possible.

本發明之實施形態之目的在於提供一種可有效地解決此種問題之捲繞體。 [解決問題之技術手段]The purpose of the embodiments of the present invention is to provide a winding body that can effectively solve such problems. [Technical means to solve the problem]

本發明之第1態樣係一種捲繞體,其係用以製造蒸鍍罩之金屬板之捲繞體,且具備:軸構件,其具有150 mm以上且550 mm以下之外徑;及上述金屬板,其捲繞於上述軸構件,且具有50 μm以下之厚度。The first aspect of the present invention is a wound body, which is a wound body for manufacturing a metal plate of a vapor deposition cover, and includes: a shaft member having an outer diameter of 150 mm or more and 550 mm or less; and the above The metal plate is wound around the shaft member and has a thickness of 50 μm or less.

本發明之第2態樣如上述第1態樣之捲繞體,其中上述金屬板亦可具有包含30質量%以上且54質量%以下之鎳之鐵合金。The second aspect of the present invention is the wound body of the first aspect described above, wherein the metal plate may also have an iron alloy containing 30% by mass or more and 54% by mass or less of nickel.

本發明之第3態樣如上述第1態樣或上述第2態樣之捲繞體,其中亦可為上述軸構件之外徑為300 mm以下,上述金屬板之厚度為30 μm以下。The third aspect of the present invention is the wound body of the first aspect or the second aspect, wherein the outer diameter of the shaft member is 300 mm or less, and the thickness of the metal plate is 30 μm or less.

本發明之第4態樣如上述第3態樣之捲繞體,其中上述捲繞體之重量亦可為70 kg以下。The fourth aspect of the present invention is the wound body of the third aspect described above, wherein the weight of the wound body may be 70 kg or less.

本發明之第5態樣如上述第3態樣或上述第4態樣之捲繞體,其中上述軸構件亦可包含酚系樹脂。The fifth aspect of the present invention is the wound body of the third aspect or the fourth aspect, wherein the shaft member may include a phenol resin.

本發明之第6態樣如上述第3態樣至上述第5態樣中任一項之捲繞體,其中上述軸構件亦可為具有100 mm以上之內徑之中空狀構件。The sixth aspect of the present invention is the wound body according to any one of the third aspect to the fifth aspect, wherein the shaft member may be a hollow member having an inner diameter of 100 mm or more.

本發明之第7態樣如上述第6態樣之捲繞體,其中上述軸構件之外徑與內徑之差亦可為5 mm以上。The seventh aspect of the present invention is the wound body of the sixth aspect described above, wherein the difference between the outer diameter and the inner diameter of the shaft member may be 5 mm or more.

本發明之第8態樣如上述第1態樣或上述第2態樣之捲繞體,其中亦可為上述軸構件之外徑為300 mm以上且550 mm以下,上述金屬板之厚度為50 μm以下。The eighth aspect of the present invention is the wound body of the first aspect or the second aspect described above, wherein the outer diameter of the shaft member may be 300 mm or more and 550 mm or less, and the thickness of the metal plate is 50 Below μm.

本發明之第9態樣如上述第8態樣之捲繞體,其中上述捲繞體之重量亦可為100 kg以下。The ninth aspect of the present invention is the wound body of the above-mentioned eighth aspect, wherein the weight of the wound body may be 100 kg or less.

本發明之第10態樣係一種捆包體,其具備:用以製造蒸鍍罩之金屬板之捲繞體;及容器,其收容上述捲繞體;上述捲繞體具備:軸構件,其具有150 mm以上且550 mm以下之外徑;及上述金屬板,其捲繞於上述軸構件,且具有50 μm以下之厚度。A tenth aspect of the present invention is a package body including: a wound body of a metal plate for manufacturing a vapor deposition cover; and a container that houses the wound body; the wound body includes: a shaft member, which It has an outer diameter of 150 mm or more and 550 mm or less; and the above-mentioned metal plate, which is wound on the above-mentioned shaft member, and has a thickness of 50 μm or less.

本發明之第11態樣如上述第10態樣之捆包體,其中上述容器具備支持上述軸構件之側部,上述側部亦可以上述捲繞體之上述金屬板位於較上述側部之下端更靠上方之方式支持上述軸構件。The eleventh aspect of the present invention is the packaging body according to the tenth aspect, wherein the container includes a side portion that supports the shaft member, and the side portion may be that the metal plate of the winding body is located at a lower end of the side portion The shaft member is supported more upward.

本發明之第12態樣如上述第11態樣之捆包體,其中上述容器亦可具備:下部,其位於上述捲繞體之下方;及上述側部,其支持上述軸構件以使上述捲繞體之上述金屬板不與上述下部相接。A twelfth aspect of the present invention is the packaging body according to the eleventh aspect, wherein the container may further include: a lower portion, which is located below the winding body; and the side portion, which supports the shaft member to make the roll The metal plate of the winding body is not in contact with the lower part.

本發明之第13態樣如上述第12態樣之捆包體,其中上述容器亦可具備自上方覆蓋上述捲繞體之上部。A thirteenth aspect of the present invention is the packaging body of the twelfth aspect, wherein the container may include an upper portion covering the winding body from above.

本發明之第14態樣如上述第10態樣至上述第13態樣中之任一項,其中亦可具備位於上述容器之內側之脫氧劑或乾燥劑。The fourteenth aspect of the present invention is any one of the tenth aspect to the thirteenth aspect, and may also include a deoxidizer or a desiccant located inside the container.

本發明之第15態樣係一種捆包方法,其具備:準備步驟,其準備用以製造蒸鍍罩之金屬板之捲繞體;及收容步驟,其將上述捲繞體收容於容器;且上述捲繞體具備:軸構件,其具有150 mm以上且550 mm以下之外徑;及上述金屬板,其捲繞於上述軸構件,且具有50 μm以下之厚度。A fifteenth aspect of the present invention is a packaging method, comprising: a preparation step, which prepares a winding body of a metal plate for manufacturing a vapor deposition cover; and an accommodation step, which houses the winding body in a container; and The wound body includes: a shaft member having an outer diameter of 150 mm or more and 550 mm or less; and the metal plate wound on the shaft member and having a thickness of 50 μm or less.

本發明之第16態樣如上述第15態樣之捆包方法,其中上述容器具備支持上述軸構件之側部,上述側部亦可以上述捲繞體之上述金屬板位於較上述側部之下端更靠上方之方式支持上述軸構件。A sixteenth aspect of the present invention is the packaging method of the fifteenth aspect, wherein the container includes a side portion that supports the shaft member, and the side portion may be the metal plate of the winding body located at a lower end of the side portion The shaft member is supported more upward.

本發明之第17態樣如上述第16態樣之捆包方法,其中上述容器亦可具備:下部,其位於上述捲繞體之下方;上述側部,其支持上述軸構件以使上述捲繞體之上述金屬板不與上述下部相接;及上部,其自上方覆蓋上述捲繞體。A seventeenth aspect of the present invention is the packing method of the sixteenth aspect, wherein the container may further include: a lower portion located below the winding body; and a side portion supporting the shaft member to wind the winding The metal plate of the body is not in contact with the lower part; and the upper part, which covers the winding body from above.

本發明之第18態樣係一種保管方法,其係保管用以製造蒸鍍罩之金屬板之捲繞體之保管方法,且以捲繞於軸構件之上述金屬板中最位於上述軸構件側之部分之內徑成為150 mm以上且550 mm以下之方式保管上述捲繞體。The eighteenth aspect of the present invention is a storage method for storing a wound body of a metal plate used for manufacturing a vapor deposition cover, and the metal plate wound on the shaft member is located most on the shaft member side The inner diameter of the part is kept at 150 mm or more and 550 mm or less so as to store the wound body.

本發明之第19態樣係一種蒸鍍罩之製造方法,其係製造形成有複數個貫通孔之蒸鍍罩之方法,且具備:自金屬板之捲繞體將上述金屬板捲出之步驟;及加工步驟,其對上述金屬板進行蝕刻而於上述金屬板形成上述貫通孔;且上述捲繞體具備:軸構件,其具有150 mm以上且550 mm以下之外徑;及上述金屬板,其捲繞於上述軸構件,且具有50 μm以下之厚度。The nineteenth aspect of the present invention is a method for manufacturing a vapor deposition cover, which is a method for manufacturing a vapor deposition cover formed with a plurality of through holes, and includes: a step of rolling out the metal plate from a winding body of the metal plate And a processing step of etching the metal plate to form the through hole in the metal plate; and the winding body includes: a shaft member having an outer diameter of 150 mm or more and 550 mm or less; and the metal plate, It is wound around the shaft member and has a thickness of 50 μm or less.

本發明之第20態樣係一種金屬板,其係捲繞於具有150 mm以上且550 mm以下之外徑之軸構件且用以製造蒸鍍罩之金屬板,且具有50 μm以下之厚度。The twentieth aspect of the present invention is a metal plate that is wound on a shaft member having an outer diameter of 150 mm or more and 550 mm or less and used to manufacture a vapor deposition mask, and has a thickness of 50 μm or less.

本發明之第21態樣亦可為藉由如上述第15態樣至第17態樣之捆包方法而製造之捆包體。The twenty-first aspect of the present invention may also be a packaging body manufactured by the packaging method as described above in the fifteenth to the seventeenth aspects.

本發明之第22態樣亦可為藉由如上述第19態樣之製造方法而製造之蒸鍍罩。 [發明之效果]The 22nd aspect of this invention can also be a vapor deposition mask manufactured by the manufacturing method as the 19th aspect mentioned above. [Effect of invention]

根據本發明之實施形態,可適當地保管金屬板。According to the embodiment of the present invention, the metal plate can be appropriately stored.

於本說明書及本圖式中,只要無特別之說明,則「板」、「片材」、「膜」等用語並非基於僅稱呼之差異而相互區別者。例如,「板」為亦包含如可稱為片材或膜之構件之概念。又,「面(片材面、膜面)」係指於整體地且大局地觀察成為對象之板狀(片狀、膜狀)之構件之情形時與成為對象之板狀構件(片狀構件、膜狀構件)之平面方向一致的面。又,相對於板狀(片狀、膜狀)之構件使用之法線方向係指相對於該構件之面(片材面、膜面)之法線方向。進而,關於本說明書中所使用之形狀或幾何學條件以及特定其等之程度之例如「平行」或「直交」等用語或長度或角度之值等,並不受嚴格之意義束縛,包含可期待相同之功能之程度之範圍而解釋。In this manual and the drawings, unless otherwise specified, the terms "board", "sheet", and "film" are not distinguished from each other based on the difference in only the address. For example, "board" is a concept that also includes components such as sheets or films. In addition, "surface (sheet surface, film surface)" refers to the overall and overall observation of the target plate-shaped (sheet-shaped, film-shaped) member and the target plate-shaped member (sheet-shaped member , Film-like member) in the same plane direction. In addition, the normal direction used with respect to a plate-shaped (sheet-shaped, film-shaped) member refers to the normal direction with respect to the surface (sheet surface, film surface) of the member. Furthermore, the shape or geometrical conditions used in this specification and terms such as "parallel" or "rectangular" or values of length or angle, etc., which are of a specific degree, are not bound by a strict sense and include expectations The extent of the same function is explained.

於本說明書及本圖式中,於使某構件或某區域等之某構成為其他構件或其他區域等之其他構成之「上(或下)」、「上側(或下側)」、或「上方(或下方)」之情形時,只要無特別之說明,則不僅為某構成與其他構成直接相接之情形,亦包含某構成與其他構成之間包含別的構成之情形而解釋。又,只要無特別之說明,則存在使用上(或,上側或上方)或下(或,下側、下方)之語句說明之情形,但亦可上下方向相反。In this specification and this drawing, the words "upper (or lower)", "upper (or lower)", or "an upper part (or lower side)" that make a structure of a component or a certain area into other structures of other components or other areas In the case of "above (or below)", unless otherwise specified, it is not only the case where a certain structure is directly connected to other structures, but also the case where another structure is included between a certain structure and other structures. In addition, as long as there is no special explanation, there may be a case where words are used to describe the upper (or upper side or upper side) or lower (or lower side or lower side), but the vertical direction may be reversed.

於本說明書及本圖式中,只要無特別之說明,則存在對同一部分或具有相同之功能之部分標註同一之符號或類似之符號而省略其重複之說明的情形。又,存在圖式之尺寸比率為了方便說明而與實際之比率不同之情形,或將構成之一部分自圖式省略之情形。In this specification and this drawing, unless otherwise specified, the same part or part having the same function may be marked with the same symbol or a similar symbol, and repeated descriptions may be omitted. In addition, there are cases where the size ratio of the drawings is different from the actual ratio for convenience of explanation, or a part of the configuration is omitted from the drawings.

於本說明書及本圖式中,只要無特別之說明,則於不產生矛盾之範圍內,可與其他實施形態或變化例組合。又,其他實施形態彼此或其他實施形態與變化例亦可於不產生矛盾之範圍內組合。又,變化例彼此亦可於不產生矛盾之範圍內組合。In this specification and the drawings, as long as there is no special explanation, it can be combined with other embodiments or modifications within a range that does not cause conflicts. In addition, other embodiments or other embodiments and variations may be combined within a range that does not cause conflicts. In addition, the modified examples may be combined within a range that does not cause conflicts.

於本說明書及本圖式中,只要無特別之說明,則於關於製造方法等方法揭示複數個步驟之情形時,亦可於所揭示之步驟之間實施未揭示之其他步驟。又,所揭示之步驟之順序於不產生矛盾之範圍內為任意。In this specification and the drawings, as long as there is no special description, when a plurality of steps are disclosed with respect to a method such as a manufacturing method, other steps not disclosed may be implemented between the disclosed steps. In addition, the order of the steps disclosed is arbitrary within the scope that no contradiction occurs.

於本說明書及本圖式中,只要無特別之說明,則由「~」之記號表達之數值範圍包含放置於「~」之符號之前後之數值。例如,由「34~38質量%」之表達劃定之數值範圍與由「34質量%以上且38質量%以下」之表達劃定之數值範圍相同。In this specification and the drawings, as long as there is no special explanation, the numerical range expressed by the symbol "~" includes the value placed before and after the symbol "~". For example, the numerical range defined by the expression "34 to 38 mass%" is the same as the numerical range defined by the expression "34 mass% or more and 38 mass% or less".

於本說明書之一實施形態中,列舉與為了製造有機EL顯示裝置時將有機材料以所期望之圖案於基板上圖案化而使用之蒸鍍罩或其製造方法相關之例進行說明。但是,並不限定於此種應用,對用於各種用途之蒸鍍罩可應用本實施形態。In one embodiment of the present specification, an example related to a vapor deposition mask used for patterning an organic material on a substrate in a desired pattern for manufacturing an organic EL display device or a method for manufacturing the same will be described. However, it is not limited to this kind of application, and this embodiment can be applied to a vapor deposition mask used for various purposes.

以下,一面參照圖式,一面對本發明之一實施形態詳細地進行說明。再者,以下所示之實施形態係本發明之實施形態之一例,本發明並非僅限定於該等實施形態而解釋者。Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings. In addition, the embodiments shown below are examples of embodiments of the present invention, and the present invention is not limited to these embodiments and explained.

首先,參照圖1對實施使蒸鍍材料蒸鍍於對象物之蒸鍍處理的蒸鍍裝置90進行說明。如圖1所示,蒸鍍裝置90亦可於其內部具備蒸鍍源(例如坩堝94)、加熱器96、及蒸鍍罩裝置10。又,蒸鍍裝置90亦可進而具備用以使蒸鍍裝置90之內部為真空氣氛之排氣機構。坩堝94收容有機發光材料等蒸鍍材料98。加熱器96對坩堝94進行加熱,於真空氣氛下使蒸鍍材料98蒸發。蒸鍍罩裝置10亦可以與坩堝94對向之方式配置。First, referring to FIG. 1, a vapor deposition device 90 that performs a vapor deposition process of vapor-depositing a vapor deposition material on an object will be described. As shown in FIG. 1, the vapor deposition device 90 may include a vapor deposition source (for example, a crucible 94 ), a heater 96, and a vapor deposition cover device 10 inside. In addition, the vapor deposition apparatus 90 may further include an exhaust mechanism for making the inside of the vapor deposition apparatus 90 a vacuum atmosphere. The crucible 94 accommodates a vapor deposition material 98 such as an organic light-emitting material. The heater 96 heats the crucible 94 and evaporates the vapor deposition material 98 in a vacuum atmosphere. The vapor deposition hood device 10 may be arranged to face the crucible 94.

以下,對蒸鍍罩裝置10進行說明。如圖1所示,蒸鍍罩裝置10亦可具備至少1個蒸鍍罩20、及支持蒸鍍罩20之框架15。框架15亦可以蒸鍍罩20不發生撓曲之方式將蒸鍍罩20以於其面方向拉伸之狀態支持。如圖1所示,蒸鍍罩裝置10亦可以蒸鍍罩20與作為使蒸鍍材料98附著之對象物之基板、例如有機EL基板92面對之方式配置於蒸鍍裝置90內。於以下之說明中,將蒸鍍罩20之面中有機EL基板92側之面稱為第1面20a,將位於第1面20a之相反側之面稱為第2面20b。Hereinafter, the vapor deposition mask device 10 will be described. As shown in FIG. 1, the vapor deposition mask device 10 may include at least one vapor deposition mask 20 and a frame 15 that supports the vapor deposition mask 20. The frame 15 may support the vapor deposition cover 20 in a state of being stretched in the direction of its surface in such a manner that the vapor deposition cover 20 does not flex. As shown in FIG. 1, the vapor deposition mask device 10 may be disposed in the vapor deposition device 90 such that the vapor deposition mask 20 faces the substrate to which the vapor deposition material 98 is attached, for example, the organic EL substrate 92. In the following description, the surface of the vapor deposition cover 20 on the side of the organic EL substrate 92 is referred to as a first surface 20a, and the surface on the opposite side of the first surface 20a is referred to as a second surface 20b.

如圖1所示,蒸鍍罩裝置10亦可具備配置於有機EL基板92之與蒸鍍罩20相反之側之面的磁鐵93。藉由設置磁鐵93,可利用磁力將蒸鍍罩20向磁鐵93側牽引,從而使蒸鍍罩20密接於有機EL基板92。又,亦可使用利用靜電力(庫侖力)之靜電吸盤使蒸鍍罩20密接於有機EL基板92。As shown in FIG. 1, the vapor deposition mask device 10 may include a magnet 93 disposed on the surface of the organic EL substrate 92 opposite to the vapor deposition mask 20. By providing the magnet 93, the vapor deposition cover 20 can be pulled toward the magnet 93 side by the magnetic force, so that the vapor deposition cover 20 is closely attached to the organic EL substrate 92. In addition, an electrostatic chuck using electrostatic force (Coulomb force) may be used to closely adhere the vapor deposition cover 20 to the organic EL substrate 92.

圖3係表示自蒸鍍罩20之第1面20a側觀察蒸鍍罩裝置10之情形之俯視圖。如圖3所示,蒸鍍罩裝置10亦可具備複數個蒸鍍罩20。於本實施形態中,各蒸鍍罩20具有於第1方向D1延伸之矩形狀之形狀。於蒸鍍罩裝置10中,複數個蒸鍍罩20於與蒸鍍罩20之第1方向D1交叉之第2方向D2排列。各蒸鍍罩20於蒸鍍罩20之第1方向D1之兩端部,例如藉由焊接而固定於框架15。FIG. 3 is a plan view showing the state of the vapor deposition cover device 10 viewed from the first surface 20 a side of the vapor deposition cover 20. As shown in FIG. 3, the vapor deposition mask device 10 may include a plurality of vapor deposition masks 20. In this embodiment, each vapor deposition mask 20 has a rectangular shape extending in the first direction D1. In the vapor deposition mask device 10, a plurality of vapor deposition masks 20 are arranged in a second direction D2 crossing the first direction D1 of the vapor deposition mask 20. Each vapor deposition cover 20 is fixed to the frame 15 at both ends of the vapor deposition cover 20 in the first direction D1 by welding, for example.

蒸鍍罩20包含在第1方向D1延伸之矩形狀之金屬板、及貫通金屬板之複數個貫通孔25。自坩堝94蒸發後到達至蒸鍍罩裝置10之蒸鍍材料98通過蒸鍍罩20之貫通孔25而附著於有機EL基板92。藉此,能以與蒸鍍罩20之貫通孔25之位置對應之所期望之圖案,將蒸鍍材料98成膜於有機EL基板92之表面。The vapor deposition cover 20 includes a rectangular metal plate extending in the first direction D1 and a plurality of through holes 25 penetrating through the metal plate. After evaporation from the crucible 94, the vapor deposition material 98 that reaches the vapor deposition cover device 10 passes through the through hole 25 of the vapor deposition cover 20 and is attached to the organic EL substrate 92. Thereby, the vapor deposition material 98 can be deposited on the surface of the organic EL substrate 92 in a desired pattern corresponding to the position of the through hole 25 of the vapor deposition cover 20.

圖2係表示使用圖1之蒸鍍裝置90製造出之有機EL顯示裝置100之剖視圖。有機EL顯示裝置100亦可具備有機EL基板92、及包含設置為圖案狀之蒸鍍材料98之像素。再者,於圖2之有機EL顯示裝置100中,省略了對包含蒸鍍材料98之像素施加電壓之電極等。又,於在有機EL基板92上呈圖案狀設置蒸鍍材料98之蒸鍍步驟之後,可於圖2之有機EL顯示裝置100進而設置有機EL顯示裝置之其他構成要素。因此,圖2之有機EL顯示裝置100亦可稱為有機EL顯示裝置之中間體。2 is a cross-sectional view of an organic EL display device 100 manufactured using the vapor deposition device 90 of FIG. 1. The organic EL display device 100 may also include an organic EL substrate 92 and pixels including a vapor deposition material 98 provided in a pattern. In addition, in the organic EL display device 100 of FIG. 2, electrodes and the like that apply voltage to pixels including the vapor deposition material 98 are omitted. In addition, after the vapor deposition step of providing the vapor deposition material 98 on the organic EL substrate 92 in a pattern, other constituent elements of the organic EL display device can be further provided in the organic EL display device 100 of FIG. 2. Therefore, the organic EL display device 100 of FIG. 2 can also be referred to as an intermediate of the organic EL display device.

再者,於欲進行利用複數種顏色之彩色顯示之情形時,分別準備搭載有與各色對應之蒸鍍罩20之蒸鍍裝置90,將有機EL基板92依序投入至各蒸鍍裝置90。藉此,例如,可使紅色用之有機發光材料、綠色用之有機發光材料及藍色用之有機發光材料依序蒸鍍於有機EL基板92。Furthermore, when a color display using a plurality of colors is to be performed, a vapor deposition device 90 equipped with a vapor deposition cover 20 corresponding to each color is prepared, and the organic EL substrate 92 is sequentially put into each vapor deposition device 90. With this, for example, an organic light-emitting material for red, an organic light-emitting material for green, and an organic light-emitting material for blue can be sequentially deposited on the organic EL substrate 92.

且說,蒸鍍處理存在於成為高溫氣氛之蒸鍍裝置90之內部實施之情形。於該情形時,於蒸鍍處理期間,保持於蒸鍍裝置90內部之蒸鍍罩20、框架15及有機EL基板92亦被加熱。此時,蒸鍍罩20、框架15及有機EL基板92會顯示出基於各自之熱膨脹係數之尺寸變化之行為。於該情形時,若蒸鍍罩20或框架15與有機EL基板92之熱膨脹係數存在較大差異,則會產生起因於其等之尺寸變化之差異的位置偏移,其結果,附著於有機EL基板92上之蒸鍍材料之尺寸精度或位置精度降低。In addition, the vapor deposition process may be performed inside the vapor deposition device 90 that becomes a high-temperature atmosphere. In this case, during the vapor deposition process, the vapor deposition cover 20, the frame 15, and the organic EL substrate 92 held inside the vapor deposition device 90 are also heated. At this time, the vapor deposition cover 20, the frame 15, and the organic EL substrate 92 will exhibit the behavior of dimensional change based on the respective thermal expansion coefficients. In this case, if the thermal expansion coefficients of the vapor deposition cover 20 or the frame 15 and the organic EL substrate 92 are significantly different, a positional shift due to the difference in dimensional change or the like will occur, and as a result, they will adhere to the organic EL The dimensional accuracy or position accuracy of the vapor deposition material on the substrate 92 is reduced.

為了解決此種問題,較佳為,蒸鍍罩20及框架15之熱膨脹係數與有機EL基板92之熱膨脹係數為同等值。例如,於使用玻璃基板作為有機EL基板92之情形時,可使用包含鎳之鐵合金作為蒸鍍罩20及框架15之主要之材料。鐵合金除了鎳以外亦可進而包含鈷。例如,可使用以鎳及鈷之含量合計為30質量%以上且54質量%以下,且鈷之含量為0質量%以上且6質量%以下之鐵合金,作為構成蒸鍍罩20之金屬板之材料。作為鎳或包含鎳及鈷之鐵合金之具體例,可列舉包含34質量%以上且38質量%以下之鎳之鎳鋼材料、除了包含30質量%以上且34質量%以下之鎳以外進而包含鈷之超級鎳鋼材料、包含38質量%以上且54質量%以下之鎳之低熱膨脹Fe-Ni系鍍覆合金等。In order to solve such a problem, it is preferable that the thermal expansion coefficients of the vapor deposition cover 20 and the frame 15 and the organic EL substrate 92 have the same value. For example, when a glass substrate is used as the organic EL substrate 92, an iron alloy containing nickel can be used as the main material of the vapor deposition cover 20 and the frame 15. The iron alloy may contain cobalt in addition to nickel. For example, an iron alloy whose total content of nickel and cobalt is 30% by mass or more and 54% by mass or less and whose content of cobalt is 0% by mass or more and 6% by mass or less can be used as the material of the metal plate constituting the vapor deposition cover 20 . Specific examples of nickel or iron alloys containing nickel and cobalt include nickel steel materials containing 34% by mass or more and 38% by mass or less of nickel, and those containing cobalt in addition to nickel containing 30% by mass or more and 34% by mass or less. Super nickel steel material, low thermal expansion Fe-Ni plating alloy containing nickel of 38% by mass or more and 54% by mass or less.

再者,於蒸鍍處理時,於蒸鍍罩20、框架15及有機EL基板92之溫度不到達高溫之情形時,不特別需要使蒸鍍罩20及框架15之熱膨脹係數為與有機EL基板92之熱膨脹係數同等之值。於該情形時,亦可使用上述鐵合金以外之材料,作為構成蒸鍍罩20之材料。例如,亦可使用包含鉻之鐵合金等上述包含鎳之鐵合金以外之鐵合金。作為包含鉻之鐵合金,例如,可使用被稱為所謂不鏽鋼之鐵合金。又,亦可使用鎳或鎳-鈷合金等鐵合金以外之合金。Furthermore, during the vapor deposition process, when the temperature of the vapor deposition cover 20, the frame 15, and the organic EL substrate 92 does not reach a high temperature, it is not particularly necessary to set the thermal expansion coefficient of the vapor deposition cover 20 and the frame 15 to the organic EL substrate. The coefficient of thermal expansion of 92 is the same. In this case, a material other than the above-mentioned iron alloy may be used as the material constituting the vapor deposition cover 20. For example, iron alloys other than the above-mentioned nickel-containing iron alloys such as chromium-containing iron alloys can also be used. As the iron alloy containing chromium, for example, an iron alloy called so-called stainless steel can be used. In addition, alloys other than iron alloys such as nickel or nickel-cobalt alloys can also be used.

其次,對蒸鍍罩20詳細地進行說明。如圖3所示,蒸鍍罩20具備於蒸鍍罩20之第1方向D1上對向之第1耳部17a及第2耳部17b,以及位於一對耳部17a、17b之間之中間部18。Next, the vapor deposition cover 20 will be described in detail. As shown in FIG. 3, the vapor deposition cover 20 includes a first ear portion 17a and a second ear portion 17b opposed in the first direction D1 of the vapor deposition cover 20, and a middle portion between the pair of ear portions 17a, 17b Department 18.

首先,對耳部17a、17b詳細地進行說明。耳部17a、17b係蒸鍍罩20中固定於框架15之部分。第1耳部17a包含蒸鍍罩20之第1方向D1上之一端即第1端部20e。第2耳部17b包含蒸鍍罩20之第1方向D1上之另一端即第2端部20f。First, the ears 17a and 17b will be described in detail. The ears 17a and 17b are parts of the vapor deposition cover 20 fixed to the frame 15. The first ear portion 17a includes a first end portion 20e which is one end of the vapor deposition cover 20 in the first direction D1. The second ear portion 17b includes a second end portion 20f which is the other end in the first direction D1 of the vapor deposition cover 20.

於本實施形態中,耳部17a、17b與中間部18一體地構成。再者,耳部17a、17b亦可藉由與中間部18不同之構件而構成。於該情形時,耳部17a、17b例如藉由焊接而接合於中間部18。In this embodiment, the ear portions 17a, 17b and the intermediate portion 18 are formed integrally. Furthermore, the ear portions 17a and 17b may be constituted by a member different from the middle portion 18. In this case, the ear portions 17a and 17b are joined to the middle portion 18 by welding, for example.

其次,對中間部18進行說明。中間部18包含形成有自第1面20a至第2面20b之貫通孔25之至少1個有效區域22、及包圍有效區域22之周圍區域23。有效區域22係蒸鍍罩20中與有機EL基板92之顯示區域面對之區域。Next, the intermediate portion 18 will be described. The intermediate portion 18 includes at least one effective region 22 in which a through hole 25 is formed from the first surface 20 a to the second surface 20 b, and a peripheral region 23 surrounding the effective region 22. The effective area 22 is an area of the vapor deposition cover 20 that faces the display area of the organic EL substrate 92.

於圖3所示之例中,中間部18包含沿著蒸鍍罩20之第1方向D1空開規定之間隔而排列之複數個有效區域22。一個有效區域22與一個有機EL顯示裝置100之顯示區域對應。因此,根據圖1所示之蒸鍍罩裝置10,能夠進行有機EL顯示裝置100之多面蒸鍍。再者,亦存在一個有效區域22與複數個顯示區域對應之情形。又,雖然未圖示,但於蒸鍍罩20之第2方向D2上亦可空開規定之間隔而排列複數個有效區域22。In the example shown in FIG. 3, the intermediate portion 18 includes a plurality of effective regions 22 arranged at predetermined intervals along the first direction D1 of the vapor deposition mask 20. One effective area 22 corresponds to the display area of one organic EL display device 100. Therefore, according to the vapor deposition cover device 10 shown in FIG. 1, multi-faceted vapor deposition of the organic EL display device 100 can be performed. Furthermore, there is also a case where one effective area 22 corresponds to a plurality of display areas. Although not shown, a plurality of effective regions 22 may be arranged at predetermined intervals in the second direction D2 of the vapor deposition mask 20.

如圖3所示,有效區域22例如於俯視時具有大致四邊形形狀,更正確而言於俯視時具有大致矩形狀之輪廓。再者,雖然未圖示,但各有效區域22根據有機EL基板92之顯示區域之形狀,可具有各種形狀之輪廓。例如,各有效區域22亦可具有圓形狀之輪廓。As shown in FIG. 3, the effective area 22 has a substantially quadrangular shape in plan view, for example, and has a substantially rectangular outline in plan view. In addition, although not shown, each effective area 22 may have contours of various shapes according to the shape of the display area of the organic EL substrate 92. For example, each effective area 22 may also have a circular outline.

以下,對有效區域22詳細地進行說明。圖4係自蒸鍍罩20之第2面20b側將有效區域22放大表示之俯視圖。如圖4所示,於圖示之例中,形成於各有效區域22之複數個貫通孔25於該有效區域22中,沿著相互正交之兩個方向分別以規定之間距排列。Hereinafter, the effective area 22 will be described in detail. FIG. 4 is an enlarged plan view showing the effective region 22 from the second surface 20b side of the vapor deposition mask 20. FIG. As shown in FIG. 4, in the illustrated example, a plurality of through holes 25 formed in each effective area 22 are arranged in the effective area 22 at predetermined intervals along two directions orthogonal to each other.

圖5係沿著圖4之有效區域22之V-V方向之剖視圖。如圖5所示,複數個貫通孔25自沿著蒸鍍罩20之法線方向N之成為一側之第1面20a向沿著蒸鍍罩20之法線方向N之成為另一側之第2面20b貫通。於圖示之例中,如下文所詳述,於蒸鍍罩20之法線方向N上之成為一側之金屬板51之第1面51a藉由蝕刻而形成第1凹部30,於蒸鍍罩20之法線方向N上之成為另一側之金屬板51之第2面51b形成第2凹部35。第1凹部30連接於第2凹部35,藉此第2凹部35與第1凹部30以相互相通之方式形成。貫通孔25藉由第2凹部35與連接於第2凹部35之第1凹部30而構成。如圖4及圖5所示,第1凹部30之壁面31與第2凹部35之壁面36經由周狀之連接部41而連接。連接部41於蒸鍍罩20之俯視時劃分形成貫通孔25之開口面積成為最小之貫通部42。FIG. 5 is a cross-sectional view along the V-V direction of the effective region 22 of FIG. 4. As shown in FIG. 5, the plurality of through holes 25 extend from the first surface 20 a on one side along the normal direction N of the vapor deposition mask 20 to the other side along the normal direction N of the vapor deposition mask 20. The second surface 20b penetrates. In the example shown in the figure, as described in detail below, the first surface 51a of the metal plate 51 that becomes one side in the normal direction N of the vapor deposition mask 20 is formed with a first recess 30 by etching, and is vapor-deposited The second surface 51b of the metal plate 51 on the other side in the normal direction N of the cover 20 forms a second concave portion 35. The first concave portion 30 is connected to the second concave portion 35, whereby the second concave portion 35 and the first concave portion 30 are formed to communicate with each other. The through hole 25 is configured by the second recess 35 and the first recess 30 connected to the second recess 35. As shown in FIGS. 4 and 5, the wall surface 31 of the first recessed portion 30 and the wall surface 36 of the second recessed portion 35 are connected via a circumferential connecting portion 41. The connecting portion 41 defines a through portion 42 where the opening area of the through hole 25 is the smallest when the vapor deposition cover 20 is viewed in plan.

如圖5所示,於蒸鍍罩20之第1面20a側,相鄰之兩個貫通孔25沿著金屬板51之第1面51a相互離開。於蒸鍍罩20之第2面20b側中,相鄰之兩個第2凹部35亦可沿著金屬板51之第2面51b相互離開。即,亦可於相鄰之兩個第2凹部35之間殘存金屬板51之第2面51b。於以下之說明中,將金屬板51之第2面51b之有效區域22中未被蝕刻而殘留之部分亦稱為頂部43。藉由以殘留此種頂部43之方式製作蒸鍍罩20,可使蒸鍍罩20具有充分之強度。藉由該情況,例如於搬送中等可抑制蒸鍍罩20破損。再者,若頂部43之寬度β過大,則於蒸鍍步驟中產生陰影,藉此存在蒸鍍材料98之利用效率降低之情況。因此,較佳為,以頂部43之寬度β不過剩地變大之方式製作蒸鍍罩20。As shown in FIG. 5, on the first surface 20 a side of the vapor deposition mask 20, two adjacent through holes 25 are separated from each other along the first surface 51 a of the metal plate 51. On the second surface 20b side of the vapor deposition mask 20, two adjacent second concave portions 35 may be separated from each other along the second surface 51b of the metal plate 51. That is, the second surface 51b of the metal plate 51 may remain between two adjacent second recesses 35. In the following description, the portion of the effective area 22 of the second surface 51b of the metal plate 51 that is not etched and remains is also referred to as the top portion 43. By making the vapor deposition cover 20 in such a manner that the top portion 43 remains, the vapor deposition cover 20 can have sufficient strength. In this case, for example, damage to the vapor deposition cover 20 can be suppressed during transportation and the like. In addition, if the width β of the top portion 43 is too large, shadows are generated in the vapor deposition step, whereby the utilization efficiency of the vapor deposition material 98 may decrease. Therefore, it is preferable to manufacture the vapor deposition cover 20 such that the width β of the top portion 43 is not excessively increased.

於如圖1所示將蒸鍍罩裝置10收容於蒸鍍裝置90之情形時,如圖5中兩點鏈線所示,蒸鍍罩20之第1面20a與有機EL基板92面對,蒸鍍罩20之第2面20b位於保持蒸鍍材料98之坩堝94側。因此,蒸鍍材料98通過開口面積逐漸變小之第2凹部35後附著於有機EL基板92。於圖5中如自第2面20b側朝向第1面20a之箭頭所示,蒸鍍材料98不僅自坩堝94朝向有機EL基板92沿著有機EL基板92之法線方向N移動,而且向相對於有機EL基板92之法線方向N大幅度傾斜方向移動。此時,若蒸鍍罩20之厚度較大,則傾斜地移動之蒸鍍材料98容易卡在頂部43、第2凹部35之壁面36或第1凹部30之壁面31,其結果,無法通過貫通孔25之蒸鍍材料98之比率變多。因此,為了提高蒸鍍材料98之利用效率,而使蒸鍍罩20之厚度T變小,藉此,認為較佳為使第2凹部35之壁面36或第1凹部30之壁面31之高度變小。即,可謂之較佳的是,作為用以構成蒸鍍罩20之金屬板51,在可確保蒸鍍罩20之強度之範圍內使用厚度T儘可能小之金屬板51。考慮該方面,於本實施形態中,蒸鍍罩20之厚度T較佳為100 μm以下。蒸鍍罩20之厚度T亦可為50 μm以下,亦可為40 μm以下,亦可為35 μm以下,亦可為30 μm以下,亦可為25 μm以下,亦可為20 μm以下。另一方面,若蒸鍍罩20之厚度過小,則蒸鍍罩20之強度降低,蒸鍍罩20容易產生損傷或變形。考慮該方面,蒸鍍罩20之厚度T較佳為5 μm以上。蒸鍍罩20之厚度T亦可為8 μm以上,亦可為10 μm以上,亦可為12 μm以上,亦可為13 μm以上,亦可為15 μm以上。蒸鍍罩20之厚度T之範圍亦可藉由上述複數個上限之候選值中之任意1個與上述複數個下限之候選值中之任意1個之組合而規定。例如,蒸鍍罩20之厚度T之範圍亦可為5 μm以上100 μm以下,亦可為8 μm以上50 μm以下,亦可為10 μm以上40 μm以下,亦可為12 μm以上35 μm以下,亦可為13 μm以上30 μm以下,亦可為15 μm以上25 μm以下,亦可為15 μm以上20 μm以下。又,蒸鍍罩20之厚度T之範圍亦可藉由上述複數個上限之候選值中之任意之2個之組合而規定。例如,蒸鍍罩20之厚度T之範圍亦可為20 μm以上25 μm以下。又,蒸鍍罩20之厚度T之範圍亦可藉由上述複數個下限之候選值中之任意之2個之組合而規定。例如,蒸鍍罩20之厚度T之範圍亦可為13 μm以上15 μm以下。 再者,厚度T為周圍區域23之厚度,即蒸鍍罩20中未形成第1凹部30及第2凹部35之部分之厚度。因此,厚度T亦可稱為金屬板51之厚度。When the vapor deposition mask device 10 is accommodated in the vapor deposition device 90 as shown in FIG. 1, as shown by the two-dot chain line in FIG. 5, the first surface 20 a of the vapor deposition mask 20 faces the organic EL substrate 92, The second surface 20b of the vapor deposition cover 20 is located on the side of the crucible 94 holding the vapor deposition material 98. Therefore, the vapor deposition material 98 passes through the second recess 35 whose opening area gradually decreases, and then adheres to the organic EL substrate 92. As shown by the arrow from the second surface 20b side toward the first surface 20a in FIG. 5, the vapor deposition material 98 not only moves from the crucible 94 toward the organic EL substrate 92 along the normal direction N of the organic EL substrate 92, but also faces The organic EL substrate 92 moves in a substantially oblique direction in the normal direction N. At this time, if the thickness of the vapor deposition cover 20 is large, the vapor deposition material 98 moving obliquely is easily caught on the top portion 43, the wall surface 36 of the second recess 35, or the wall surface 31 of the first recess 30, and as a result, cannot pass through the through hole The ratio of the vapor deposition material 98 of 25 increases. Therefore, in order to improve the utilization efficiency of the vapor deposition material 98, the thickness T of the vapor deposition cover 20 is reduced. Therefore, it is considered that it is preferable to change the height of the wall surface 36 of the second recess 35 or the wall surface 31 of the first recess 30 small. That is, it can be said that it is preferable to use the metal plate 51 having the thickness T as small as possible as the metal plate 51 constituting the vapor deposition cover 20 within a range where the strength of the vapor deposition cover 20 can be ensured. Considering this aspect, in this embodiment, the thickness T of the vapor deposition mask 20 is preferably 100 μm or less. The thickness T of the vapor deposition mask 20 may be 50 μm or less, 40 μm or less, 35 μm or less, 30 μm or less, 25 μm or less, or 20 μm or less. On the other hand, if the thickness of the vapor deposition cover 20 is too small, the strength of the vapor deposition cover 20 decreases, and the vapor deposition cover 20 is likely to be damaged or deformed. Considering this aspect, the thickness T of the vapor deposition mask 20 is preferably 5 μm or more. The thickness T of the vapor deposition mask 20 may be 8 μm or more, 10 μm or more, 12 μm or more, 13 μm or more, or 15 μm or more. The range of the thickness T of the vapor deposition mask 20 can also be specified by a combination of any one of the candidate values of the upper limit and any one of the candidate values of the lower limit. For example, the thickness T of the vapor deposition mask 20 may be 5 μm or more and 100 μm or less, 8 μm or more and 50 μm or less, 10 μm or more and 40 μm or less, or 12 μm or more and 35 μm or less. It may be 13 μm or more and 30 μm or less, 15 μm or more and 25 μm or less, or 15 μm or more and 20 μm or less. In addition, the range of the thickness T of the vapor deposition mask 20 can also be specified by a combination of any two of the plurality of upper limit candidate values. For example, the thickness T of the vapor deposition mask 20 may range from 20 μm to 25 μm. In addition, the range of the thickness T of the vapor deposition mask 20 may be specified by a combination of any two of the candidate values of the plurality of lower limits. For example, the thickness T of the vapor deposition mask 20 may range from 13 μm to 15 μm. In addition, the thickness T is the thickness of the surrounding area 23, that is, the thickness of the portion of the vapor deposition mask 20 where the first recess 30 and the second recess 35 are not formed. Therefore, the thickness T can also be referred to as the thickness of the metal plate 51.

作為測定金屬板51及蒸鍍罩20之厚度之方法,採用接觸式之測定方法。作為接觸式之測定方法,使用具備球套引導式之柱塞之HEIDENHAIN公司製造之長度計HEIDENHAIM-METRO之「MT1271」。As a method of measuring the thickness of the metal plate 51 and the vapor deposition cover 20, a contact type measuring method is used. As the measurement method of the contact type, the "MT1271" of the HEIDENHAIM-METRO length gauge manufactured by HEIDENHAIN Co., Ltd. with a ball-guided plunger is used.

於圖5中,通過成為具有貫通孔25之最小開口面積之部分之連接部41與第2凹部35之壁面36之其他任意之位置的直線M1相對於蒸鍍罩20之法線方向N所成之最小角度由符號θ1表示。為了使傾斜移動之蒸鍍材料98不到達至壁面36而儘可能到達至有機EL基板92,有利的是使角度θ1變大。使角度θ1變大除了對使蒸鍍罩20之厚度T變小有效以外,還對使上述頂部43之寬度β變小有效。In FIG. 5, a straight line M1 formed at any other arbitrary position of the connection portion 41 and the wall surface 36 of the second recess 35 having the minimum opening area of the through hole 25 is formed with respect to the normal direction N of the vapor deposition mask 20 The minimum angle is represented by the symbol θ1. In order to prevent the vapor-deposited material 98 moving obliquely from reaching the wall surface 36 and reaching the organic EL substrate 92 as much as possible, it is advantageous to increase the angle θ1. Increasing the angle θ1 is effective not only to reduce the thickness T of the vapor deposition mask 20 but also to reduce the width β of the top 43.

於圖5中,符號α表示金屬板51之第1面51a之有效區域22中未被蝕刻而殘留之部分(以下,亦稱為凸緣部)之寬度。凸緣部之寬度α及貫通部42之尺寸r根據有機EL顯示裝置之尺寸及顯示像素數而適當決定。例如,凸緣部之寬度α為5 μm以上且40 μm以下,貫通部42之尺寸r為10 μm以上且60 μm以下。In FIG. 5, the symbol α indicates the width of a portion (hereinafter, also referred to as a flange portion) remaining in the effective area 22 of the first surface 51 a of the metal plate 51 without being etched. The width α of the flange portion and the size r of the penetration portion 42 are appropriately determined according to the size of the organic EL display device and the number of display pixels. For example, the width α of the flange portion is 5 μm or more and 40 μm or less, and the dimension r of the penetration portion 42 is 10 μm or more and 60 μm or less.

再者,於圖4及圖5中,表示了於相鄰之兩個第2凹部35之間殘存有金屬板51之第2面51b之示例,但並不限定於此。雖然未圖示,但亦可以相鄰之兩個第2凹部35連接之方式實施蝕刻。即,亦可存在於相鄰之兩個第2凹部35之間不殘存金屬板51之第2面51b之場所。In addition, in FIGS. 4 and 5, an example in which the second surface 51 b of the metal plate 51 remains between two adjacent second concave portions 35 is shown, but it is not limited to this. Although not shown, etching may be performed so that two adjacent second recesses 35 are connected. That is, there may be a place where the second surface 51b of the metal plate 51 does not remain between two adjacent second concave portions 35.

其次,對製造蒸鍍罩20之方法進行說明。Next, a method of manufacturing the vapor deposition mask 20 will be described.

首先,對用以製造蒸鍍罩之金屬板之製造方法進行說明。於本實施形態中,對金屬板51包括包含鎳之鐵合金之軋壓材之例進行說明。軋壓材具有100 μm以下之厚度,較佳為具有50 μm以下、40 μm以下或30 μm以下之厚度。又,軋壓材中之鎳及鈷之含量合計例如為30質量%以上且38質量%以下。包括軋壓材之金屬板51係以下述捲繞體之形態製作流通。First, the manufacturing method of the metal plate used for manufacturing a vapor deposition mask is demonstrated. In this embodiment, an example in which the metal plate 51 includes a rolled material of an iron alloy containing nickel will be described. The rolled material has a thickness of 100 μm or less, preferably 50 μm or less, 40 μm or less, or 30 μm or less. The total content of nickel and cobalt in the rolled material is, for example, 30% by mass or more and 38% by mass or less. The metal plate 51 including the rolled material is produced and circulated in the form of the following wound body.

首先,準備金屬板用之母材510。母材510係藉由將金屬板用之原材料利用熔解爐熔解而製作。金屬板用之原材料例如包含鐵及鎳以及鈷等其他添加材料。將母材510自熔解爐取出之後,亦可實施將母材510之表面削掉之研削步驟。First, the base material 510 for the metal plate is prepared. The base material 510 is produced by melting raw materials for metal plates in a melting furnace. Raw materials for metal plates include iron, nickel, cobalt and other additives. After the base material 510 is taken out from the melting furnace, a grinding step of cutting off the surface of the base material 510 may also be performed.

繼而,如圖6所示,實施將包括包含鎳之鐵合金之母材510軋壓之軋壓步驟。例如,一面朝向包含一對軋壓輥(工作輥)61a、61b之軋壓裝置61向方向F1施加拉伸張力一面搬送。到達至一對軋壓輥61a、61b之間之母材510藉由一對軋壓輥61a、61b而軋壓。其結果,母材510之厚度減少,並且沿著方向F1伸長。藉此,可獲得於方向F1延伸且具有規定之厚度T之金屬板51。於以下之說明中,將金屬板51延伸之方向F1亦稱為長度方向F1。Next, as shown in FIG. 6, a rolling step is performed to roll the base material 510 including an iron alloy containing nickel. For example, it is conveyed while applying tensile tension in the direction F1 toward the rolling device 61 including a pair of rolling rollers (work rolls) 61a, 61b. The base material 510 reaching between the pair of rolling rollers 61a, 61b is rolled by the pair of rolling rollers 61a, 61b. As a result, the thickness of the base material 510 decreases, and it elongates in the direction F1. Thereby, a metal plate 51 extending in the direction F1 and having a predetermined thickness T can be obtained. In the following description, the direction F1 in which the metal plate 51 extends is also referred to as the longitudinal direction F1.

再者,圖6只不過係表示軋壓步驟之概略者,用以實施軋壓步驟之具體性的構成或順序並不特別限定。例如,軋壓步驟亦可包含以使構成母材510之鐵合金之結晶排列變化之溫度以上之溫度加工母材的熱軋步驟或以使鐵合金之結晶排列變化之溫度以下之溫度加工母材之冷軋步驟。又,使母材510或金屬板51通過一對軋壓輥61a、61b之間時之方向並不限定於一個方向。例如,於圖6及圖7中,亦可藉由以自紙面左側向右側之方向、及自紙面右側向左側之方向重複使母材510或金屬板51通過一對軋壓輥61a、61b之間,而將母材510或金屬板51逐漸軋壓。In addition, FIG. 6 merely shows the outline of the rolling step, and the specific configuration or order for performing the rolling step is not particularly limited. For example, the rolling step may also include a hot rolling step of processing the base material at a temperature above the temperature at which the crystal arrangement of the iron alloy constituting the base material 510 is changed or a cold processing of the base material at a temperature below the temperature at which the crystal arrangement of the iron alloy is changed Rolling steps. In addition, the direction when the base material 510 or the metal plate 51 passes between the pair of rolling rollers 61a, 61b is not limited to one direction. For example, in FIGS. 6 and 7, the base material 510 or the metal plate 51 may be passed through the pair of nip rollers 61a, 61b by repeating the direction from the left side to the right side of the paper surface and the direction from the right side to the left side of the paper surface. During this time, the base material 510 or the metal plate 51 is gradually rolled.

於軋壓步驟中,亦可為了調整金屬板51之形狀而調整軋壓致動器之壓力。又,除了軋壓輥(工作輥)61a、61b以外亦可適當調整備用輥之形狀。In the rolling step, the pressure of the rolling actuator may be adjusted in order to adjust the shape of the metal plate 51. In addition to the pressing rollers (work rollers) 61a and 61b, the shape of the backup roller can be appropriately adjusted.

又,於冷軋步驟中,亦可對母材510與軋壓輥61a、61b之間供給煤油等冷卻劑。藉此,可控制母材之溫度。In addition, in the cold rolling step, a coolant such as kerosene may be supplied between the base material 510 and the rolls 61a and 61b. By this, the temperature of the base material can be controlled.

又,於軋壓步驟之前後、或軋壓步驟之間亦可實施對母材510或金屬板51之品質或特性進行分析之分析步驟。例如,亦可將螢光X射線照射至母材510或金屬板51來分析組成。又,亦可藉由熱機械分析(TMA:Thermomechanical Analisys)來測定母材510或金屬板51之熱伸縮量。In addition, an analysis step for analyzing the quality or characteristics of the base material 510 or the metal plate 51 may be performed before or after the rolling step or between the rolling steps. For example, the composition may be analyzed by irradiating fluorescent X-rays to the base material 510 or the metal plate 51. Moreover, the thermal expansion and contraction amount of the base material 510 or the metal plate 51 can also be measured by thermomechanical analysis (TMA: Thermomechanical Analisys).

然後,為了將藉由軋壓蓄積於金屬板51內之殘留應力去除,如圖7所示,亦可使用退火裝置63對金屬板51進行退火。再者,如圖6及圖7所示,亦可於軋壓步驟與退火步驟之間將金屬板51暫時捲取於芯62。Then, in order to remove the residual stress accumulated in the metal plate 51 by rolling, as shown in FIG. 7, the annealing device 63 may be used to anneal the metal plate 51. Furthermore, as shown in FIGS. 6 and 7, the metal plate 51 may be temporarily wound around the core 62 between the rolling step and the annealing step.

退火步驟如圖7所示,亦可一面將金屬板51向長度方向F1拉伸一面實施。即,退火步驟亦可作為一面搬送之連續退火實施,而並非所謂批次式之退火。於該情形時,較佳為,以抑制金屬板51產生座屈(buckling)彎折等變形之方式設定溫度或搬送速度。藉由實施退火步驟,可獲得將殘留應變某程度去除之金屬板51。再者,於圖7中,表示了於退火步驟時將金屬板51於水平方向搬送之示例,但並不限定於此,亦可於退火步驟時將金屬板51於垂直方向等其他方向搬送。As shown in FIG. 7, the annealing step may be carried out while stretching the metal plate 51 in the longitudinal direction F1. That is, the annealing step can also be carried out as a continuous annealing with one side transfer, rather than the so-called batch-type annealing. In this case, it is preferable to set the temperature or the conveying speed in such a way as to suppress deformation of the metal plate 51 such as buckling bending. By performing the annealing step, the metal plate 51 with the residual strain removed to some extent can be obtained. In addition, FIG. 7 shows an example in which the metal plate 51 is transported in the horizontal direction during the annealing step, but it is not limited thereto, and the metal plate 51 may be transported in other directions such as the vertical direction during the annealing step.

較佳為,上述退火步驟於非還原氣氛或惰性氣體氣氛中實施。此處,所謂非還原氣氛,係指不包含氫氣等還原性氣體之氣氛。所謂「不包含還原性氣體」,係指氫氣等還原性氣體之濃度為10%以下。又,所謂惰性氣體氣氛,係指氬氣、氦氣、氮氣等惰性氣體之濃度為90%以上之氣氛。藉由於非還原氣氛或惰性氣體氣氛中實施退火步驟,可抑制鎳氫氧化物等鎳化合物產生於金屬板51之表面層。退火裝置63亦可具有監視惰性氣體之濃度之機構或調整惰性氣體之濃度之機構。Preferably, the above annealing step is performed in a non-reducing atmosphere or an inert gas atmosphere. Here, the non-reducing atmosphere refers to an atmosphere that does not contain reducing gas such as hydrogen. The so-called "excluding reducing gas" means that the concentration of reducing gas such as hydrogen is 10% or less. In addition, the inert gas atmosphere refers to an atmosphere in which the concentration of inert gases such as argon, helium, and nitrogen is 90% or more. Since the annealing step is performed in a non-reducing atmosphere or an inert gas atmosphere, the generation of nickel compounds such as nickel hydroxide on the surface layer of the metal plate 51 can be suppressed. The annealing device 63 may also have a mechanism to monitor the concentration of inert gas or a mechanism to adjust the concentration of inert gas.

亦可於退火步驟之前,實施將金屬板51洗淨之洗淨步驟。藉此,可於退火步驟時抑制異物附著於金屬板51之表面。作為洗淨用之洗淨液,例如,可使用烴系之液體。Before the annealing step, a washing step of washing the metal plate 51 may be performed. In this way, it is possible to suppress foreign matter from adhering to the surface of the metal plate 51 during the annealing step. As the cleaning liquid for cleaning, for example, a hydrocarbon liquid can be used.

又,於圖7中,表示了一面將金屬板51向長度方向F1拉伸一面實施退火步驟之示例,但並不限定於此,亦可於將金屬板51捲取於芯62等構件之狀態下實施退火步驟。即,亦可實施批次式之退火。再者,於在將金屬板51捲取於芯62等構件之狀態下實施退火步驟之情形時,有於金屬板51產生與芯62之外徑對應之翹曲之不良之情況。因此,自抑制翹曲之不良之觀點而言,有利的是一面將金屬板51向長度方向F1拉伸一面實施退火步驟。In addition, FIG. 7 shows an example in which the metal plate 51 is stretched in the longitudinal direction F1 while performing the annealing step, but it is not limited to this, and the metal plate 51 may be wound around the core 62 and other members. The annealing step is implemented next. That is, batch-type annealing can also be performed. Furthermore, when the annealing step is performed in a state where the metal plate 51 is wound around the core 62 and other members, the metal plate 51 may have a problem of warpage corresponding to the outer diameter of the core 62. Therefore, from the viewpoint of suppressing the defect of warpage, it is advantageous to perform the annealing step while stretching the metal plate 51 in the longitudinal direction F1.

然後,亦可實施以金屬板51之寬度成為規定之範圍內之方式將藉由軋壓步驟獲得之金屬板51之寬度方向上之兩端分別跨及規定之範圍切掉之切割步驟。所謂寬度方向,係指於金屬板51之面內與長度方向F1正交之方向。藉由實施切割步驟,例如,可將起因於軋壓而會產生於金屬板51之寬度方向之兩端之裂縫去除。藉由將裂縫去除,可防止金屬板51破斷之現象,所謂板切以裂縫為起點產生。Then, a cutting step may be performed in which both ends in the width direction of the metal plate 51 obtained by the rolling step are cut across the predetermined range so that the width of the metal plate 51 becomes within the predetermined range. The width direction refers to a direction orthogonal to the longitudinal direction F1 in the plane of the metal plate 51. By performing the cutting step, for example, cracks generated at both ends in the width direction of the metal plate 51 due to rolling can be removed. By removing the cracks, it is possible to prevent the metal plate 51 from breaking. The so-called plate cutting takes cracks as a starting point.

於切割步驟中切掉之部分之寬度亦可以切割步驟後之金屬板51之形狀於寬度方向上左右對稱之方式調整。又,亦可將切割步驟於上述退火步驟之前實施。The width of the portion cut off in the cutting step can also be adjusted in a manner that the shape of the metal plate 51 after the cutting step is symmetrical in the width direction. In addition, the dicing step may be performed before the annealing step.

再者,藉由將上述軋壓步驟、退火步驟及切割步驟中之至少2個步驟重複複數次,亦可製作規定之厚度之長條狀之金屬板51。Furthermore, by repeating at least two of the above rolling step, annealing step and cutting step a plurality of times, a long metal plate 51 of a predetermined thickness can also be produced.

於對金屬板51之退火步驟等處理完成之後,實施將金屬板51捲繞於軸構件52之捲繞步驟。於圖7中,表示了於退火步驟之後實施捲繞步驟之示例。雖然未圖示,但亦可於上述切割步驟之後實施捲繞步驟。又,雖然未圖示,但亦可於對金屬板51之退火步驟等處理完成之後,將金屬板51暫時捲繞於芯,然後,從芯將金屬板51捲出,然後將金屬板51捲繞於軸構件52。如此一來,可製作金屬板51之捲繞體50。After the annealing process of the metal plate 51 is completed, the winding step of winding the metal plate 51 around the shaft member 52 is performed. In FIG. 7, an example of performing the winding step after the annealing step is shown. Although not shown, the winding step may be performed after the cutting step. Although not shown, after the annealing process of the metal plate 51 is completed, the metal plate 51 may be temporarily wound around the core, and then the metal plate 51 may be unwound from the core, and then the metal plate 51 may be rolled. Winding shaft member 52. In this way, the wound body 50 of the metal plate 51 can be produced.

以下,對捲繞體50進行說明。圖8係表示捲繞體50之立體圖。捲繞體50具備軸構件52及捲繞於軸構件52之金屬板51。金屬板51可以第2面51b位於較第1面51a靠軸構件52側之方式捲繞於軸構件52,或者亦可以第1面51a位於較第2面51b靠軸構件52側之方式捲繞於軸構件52。Hereinafter, the wound body 50 will be described. FIG. 8 is a perspective view showing the winding body 50. The winding body 50 includes a shaft member 52 and a metal plate 51 wound around the shaft member 52. The metal plate 51 may be wound around the shaft member 52 with the second surface 51b located closer to the shaft member 52 side than the first surface 51a, or may be wound with the first surface 51a located closer to the shaft member 52 side than the second surface 51b于轴员52。 The shaft member 52.

於圖8中,符號W1表示與金屬板51之長度方向F1正交之寬度方向F2上之金屬板51之尺寸。又,符號W2表示寬度方向F2上之軸構件52之尺寸。寬度方向F2與軸構件52之軸向一致。金屬板51之尺寸W1例如為150 mm以上,亦可為300 mm以上。又,金屬板51之尺寸W1例如為1300 mm以下,亦可為1000 mm以下。軸構件52之尺寸W2大於金屬板51之尺寸W1。從尺寸W2減去尺寸W1所得之值例如為20 mm以上,亦可為50 mm以上。又,從尺寸W2減去尺寸W1所得之值例如為500 mm以下,亦可為200 mm以下。In FIG. 8, the symbol W1 indicates the size of the metal plate 51 in the width direction F2 orthogonal to the longitudinal direction F1 of the metal plate 51. In addition, the symbol W2 indicates the size of the shaft member 52 in the width direction F2. The width direction F2 coincides with the axial direction of the shaft member 52. The size W1 of the metal plate 51 is, for example, 150 mm or more, or 300 mm or more. In addition, the size W1 of the metal plate 51 is, for example, 1300 mm or less, or may be 1000 mm or less. The size W2 of the shaft member 52 is larger than the size W1 of the metal plate 51. The value obtained by subtracting the dimension W1 from the dimension W2 is, for example, 20 mm or more, or 50 mm or more. In addition, the value obtained by subtracting the dimension W1 from the dimension W2 is, for example, 500 mm or less, or 200 mm or less.

圖9係於與軸構件52之軸向正交之平面將捲繞體50切斷之情形時之捲繞體50之剖視圖。於圖9所示之例中,軸構件52為具有內徑R1之中空狀構件。符號R2表示軸構件52之外徑。軸構件52之外徑R2與捲繞於軸構件52之金屬板51中與軸構件52相接之金屬板51之內徑一致。符號R3表示捲繞於軸構件52之金屬板51之外徑。再者,所謂「外徑」,係指柱狀體之外周面之直徑。又,所謂「內徑」,係指柱狀體具有起因於中空部之內周面之情形時之內周面之直徑。9 is a cross-sectional view of the wound body 50 when the wound body 50 is cut on a plane orthogonal to the axial direction of the shaft member 52. In the example shown in FIG. 9, the shaft member 52 is a hollow member having an inner diameter R1. Symbol R2 represents the outer diameter of the shaft member 52. The outer diameter R2 of the shaft member 52 corresponds to the inner diameter of the metal plate 51 that is wound on the metal plate 51 of the shaft member 52 and is in contact with the shaft member 52. Symbol R3 represents the outer diameter of the metal plate 51 wound around the shaft member 52. Furthermore, the "outer diameter" refers to the diameter of the outer peripheral surface of the columnar body. The "inner diameter" refers to the diameter of the inner peripheral surface when the columnar body has an inner peripheral surface caused by the hollow portion.

作為測定軸構件52之內徑及外徑、或捲繞於軸構件52之狀態之金屬板51之內徑及外徑的器具,使用測量儀。As an instrument for measuring the inner diameter and outer diameter of the shaft member 52 or the inner diameter and outer diameter of the metal plate 51 in a state of being wound around the shaft member 52, a measuring instrument is used.

且說,若軸構件52之外徑R2較小,則有於將金屬板51捲繞於軸構件52之期間起因於產生於金屬板51之塑性變形之翹曲亦於自軸構件52捲出之後之金屬板51至少局部地殘留的情況。如下所述,蒸鍍罩20係藉由將自捲繞體50捲出之金屬板51加工而製作。因此,若軸構件52之外徑R2較小,則有亦於自金屬板51製作之蒸鍍罩20殘留翹曲之情況。存在此種翹曲於構成金屬板51之鐵合金包含34質量%以上且38質量%以下之鎳之情形時,即鐵合金為所謂鎳鋼材料之情形時明顯產生之情況。作為原因,可列舉於金屬板51為鎳鋼材料之情形時,金屬板51之熱膨脹係數較低,因此金屬板51之熱膨脹係數與軸構件52之熱膨脹係數之差變大,起因於熱膨脹之力容易產生於金屬板51與軸構件52之間,但原因並不特別限定。 若於蒸鍍罩20產生翹曲,則有於蒸鍍罩20之檢查步驟中測定蒸鍍罩20之尺寸時之精度降低,或無法測定之情況。又,若於蒸鍍罩20產生翹曲,則亦認為於俯視時之蒸鍍罩20之尺寸之精度降低。考慮此種問題,軸構件52之外徑R2例如亦可為125 mm以上,亦可為150 mm以上,亦可為180 mm以上,亦可為200 mm以上。In addition, if the outer diameter R2 of the shaft member 52 is small, the warpage caused by the plastic deformation caused by the metal plate 51 during the winding of the metal plate 51 around the shaft member 52 is also rolled out from the shaft member 52 The metal plate 51 remains at least partially. As described below, the vapor deposition cover 20 is manufactured by processing the metal plate 51 rolled out from the winding body 50. Therefore, if the outer diameter R2 of the shaft member 52 is small, warpage may remain in the vapor deposition cover 20 manufactured from the metal plate 51. Such warpage may occur when the iron alloy constituting the metal plate 51 contains 34% by mass or more and 38% by mass or less of nickel, that is, when the iron alloy is a so-called nickel steel material. As a reason, when the metal plate 51 is a nickel steel material, the thermal expansion coefficient of the metal plate 51 is low, so the difference between the thermal expansion coefficient of the metal plate 51 and the thermal expansion coefficient of the shaft member 52 becomes large due to the force of thermal expansion It easily occurs between the metal plate 51 and the shaft member 52, but the reason is not particularly limited. If warpage occurs in the vapor deposition mask 20, the accuracy when measuring the size of the vapor deposition mask 20 in the inspection step of the vapor deposition mask 20 may decrease, or the measurement may not be possible. In addition, if warpage occurs in the vapor deposition mask 20, it is also considered that the accuracy of the size of the vapor deposition mask 20 in plan view decreases. Considering such a problem, the outer diameter R2 of the shaft member 52 may be 125 mm or more, 150 mm or more, 180 mm or more, or 200 mm or more.

如上所述,自抑制自捲繞體50捲出之金屬板51具有翹曲之觀點而言,較佳為軸構件52之外徑R2較大。另一方面,若軸構件52之外徑R2變大,則軸構件52之重量增加,具備軸構件52及金屬板51之捲繞體50之重量亦增加。捲繞體50之重量之增加使捲繞體50之處理之困難度增加。例如,若捲繞體50之重量較大,則捲繞體50之輸送性降低。又,亦認為捲繞體50之金屬板51起因於自重而損傷或劣化。又,於將捲繞體50設置於蒸鍍罩20之製造裝置時,會產生使用堆高機等搬運裝置之必要性。於使用堆高機等搬運裝置之情形時,由於用以使堆高機進入之空間設置於蒸鍍罩20之製造裝置,故而導致製造裝置大型化。考慮此種問題,軸構件52之外徑R2例如亦可為550 mm以下,亦可為400 mm以下,亦可為300 mm以下,亦可為280 mm以下。As described above, from the viewpoint of suppressing warpage of the metal plate 51 rolled out from the winding body 50, it is preferable that the outer diameter R2 of the shaft member 52 is large. On the other hand, when the outer diameter R2 of the shaft member 52 becomes larger, the weight of the shaft member 52 increases, and the weight of the wound body 50 including the shaft member 52 and the metal plate 51 also increases. The increase in the weight of the winding body 50 increases the difficulty of handling the winding body 50. For example, if the weight of the wound body 50 is large, the transportability of the wound body 50 decreases. Also, it is considered that the metal plate 51 of the wound body 50 is damaged or deteriorated due to its own weight. In addition, when the winding body 50 is installed in the manufacturing apparatus of the vapor deposition cover 20, there is a necessity of using a conveying device such as a stacker. When a conveying device such as a stacker is used, the space for the stacker to enter is provided in the manufacturing apparatus of the vapor deposition cover 20, so the manufacturing apparatus is enlarged. Considering such a problem, the outer diameter R2 of the shaft member 52 may be, for example, 550 mm or less, 400 mm or less, 300 mm or less, or 280 mm or less.

軸構件52之外徑R2之範圍亦可藉由上述複數個下限之候選值中之任意之1個與上述複數個上限之候選值中之任意之1個之組合而規定,例如,亦可為125 mm以上550 mm以下,亦可為150 mm以上400 mm以下,亦可為180 mm以上300 mm以下,亦可為200 mm以上280 mm以下。又,軸構件52之外徑R2之範圍亦可藉由上述複數個下限之候選值中之任意之2個之組合而規定,例如,亦可為125 mm以上200 mm以下,亦可為125 mm以上180 mm以下,亦可為150 mm以上200 mm以下,亦可為150 mm以上180 mm以下。又,軸構件52之外徑R2之範圍亦可藉由上述複數個上限之候選值中之任意之2個之組合而規定,例如,亦可為280 mm以上550 mm以下,亦可為280 mm以上400 mm以下,亦可為300 mm以上550 mm以下,亦可為300 mm以上400 mm以下。The range of the outer diameter R2 of the shaft member 52 may also be defined by a combination of any one of the plurality of candidate values of the lower limit and any one of the candidate values of the upper limit, for example, may also be From 125 mm to 550 mm, from 150 mm to 400 mm, from 180 mm to 300 mm, from 200 mm to 280 mm. In addition, the range of the outer diameter R2 of the shaft member 52 can also be specified by a combination of any two of the plurality of candidate values of the lower limit, for example, it can be 125 mm or more and 200 mm or less, or 125 mm Above 180 mm, below 150 mm, above 200 mm, below 150 mm, and below 180 mm. In addition, the range of the outer diameter R2 of the shaft member 52 can also be specified by a combination of any two of the plurality of upper limit candidate values, for example, it can be 280 mm or more and 550 mm or less, or 280 mm Above 400 mm or less, 300 mm or more and 550 mm or less, or 300 mm or more and 400 mm or less.

軸構件52如圖9所示,於為形成有中空部之中空狀構件之情形時,與未於軸構件52形成中空部之情形時相比,軸構件52之重量變小。因此,自使捲繞體50之處理容易之觀點而言,軸構件52為中空狀構件較為有利。As shown in FIG. 9, as shown in FIG. 9, when the hollow member is formed with a hollow portion, the weight of the shaft member 52 becomes smaller than when the hollow member is not formed with the hollow member 52. Therefore, from the viewpoint of facilitating the handling of the wound body 50, it is advantageous that the shaft member 52 is a hollow member.

於軸構件52為中空狀構件之情形時,以可抑制起因於軸構件52之自重或金屬板51之重量而軸構件52變形或破損之方式決定軸構件52之內徑R1。軸構件52之內徑R1例如為100 mm以上,亦可為150 mm以下,亦可為200 mm以上。又,軸構件52之外徑R2與內徑R1之差例如為5 mm以上,亦可為10 mm以上,亦可為20 mm以上,亦可為30 mm以上。又,軸構件52之外徑R2與內徑R1之差亦可為100 mm以下,亦可為80 mm以下,亦可為60 mm以下,亦可為40 mm以下。When the shaft member 52 is a hollow member, the inner diameter R1 of the shaft member 52 is determined in such a manner that the deformation or breakage of the shaft member 52 due to the weight of the shaft member 52 or the weight of the metal plate 51 can be suppressed. The inner diameter R1 of the shaft member 52 is, for example, 100 mm or more, 150 mm or less, or 200 mm or more. The difference between the outer diameter R2 and the inner diameter R1 of the shaft member 52 is, for example, 5 mm or more, 10 mm or more, 20 mm or more, or 30 mm or more. In addition, the difference between the outer diameter R2 and the inner diameter R1 of the shaft member 52 may be 100 mm or less, 80 mm or less, 60 mm or less, or 40 mm or less.

軸構件52之外徑R2與內徑R1之差之範圍亦可藉由上述複數個下限之候選值中之任意之1個與上述複數個上限之候選值中之任意之1個之組合而規定,例如,亦可為5 mm以上100 mm以下,亦可為10 mm以上80 mm以下,亦可為20 mm以上60 mm以下,亦可為30 mm以上40 mm以下。又,軸構件52之外徑R2與內徑R1之差之範圍亦可藉由上述複數個下限之候選值中之任意之2個之組合而規定,例如,亦可為5 mm以上30 mm以下,亦可為5 mm以上20 mm以下,亦可為10 mm以上30 mm以下,亦可為10 mm以上20 mm以下。又,軸構件52之外徑R2與內徑R1之差之範圍亦可藉由上述複數個上限之候選值中之任意之2個之組合而規定,例如,亦可為40 mm以上100 mm以下,亦可為40 mm以上80 mm以下,亦可為60 mm以上100 mm以下,亦可為60 mm以上80 mm以下。The range of the difference between the outer diameter R2 and the inner diameter R1 of the shaft member 52 can also be defined by the combination of any one of the plurality of lower limit candidate values and any one of the plurality of upper limit candidate values For example, it can be 5 mm or more and 100 mm or less, 10 mm or more and 80 mm or less, 20 mm or more and 60 mm or less, or 30 mm or more and 40 mm or less. In addition, the range of the difference between the outer diameter R2 and the inner diameter R1 of the shaft member 52 can also be specified by a combination of any two of the plurality of candidate values of the lower limit, for example, it can be 5 mm or more and 30 mm or less It can also be 5 mm or more and 20 mm or less, 10 mm or more and 30 mm or less, or 10 mm or more and 20 mm or less. In addition, the range of the difference between the outer diameter R2 and the inner diameter R1 of the shaft member 52 can also be specified by a combination of any two of the plurality of upper limit candidate values, for example, 40 mm or more and 100 mm or less It can also be 40 mm or more and 80 mm or less, 60 mm or more and 100 mm or less, or 60 mm or more and 80 mm or less.

於軸構件52為中空狀構件之情形時,作為構成軸構件52之材料,可使用樹脂、樹脂及纖維之混合物、金屬等。作為樹脂之例,可列舉酚系樹脂、ABS(acrylonitrile-butadiene-styrene,丙烯腈-丁二烯-苯乙烯)樹脂、聚苯乙烯樹脂、聚乙烯樹脂等。作為樹脂及纖維之混合物,可列舉酚醛紙、纖維強化塑膠(PRP)等。作為金屬之例,可列舉鐵或鐵合金等。再者,所謂ABS樹脂,係指丙烯腈、丁二烯及苯乙烯聚合之共聚合成樹脂之總稱。所謂酚醛紙,係指紙與酚系樹脂之混合物。酚醛紙為紙及酚系樹脂之混合物,例如,包含含浸有酚系樹脂之紙。纖維強化塑膠例如包含含浸有樹脂之玻璃纖維、碳纖維等纖維。When the shaft member 52 is a hollow member, as the material constituting the shaft member 52, resin, a mixture of resin and fiber, metal, or the like can be used. Examples of the resin include phenol resin, ABS (acrylonitrile-butadiene-styrene, acrylonitrile-butadiene-styrene) resin, polystyrene resin, and polyethylene resin. Examples of the mixture of resin and fiber include phenolic paper and fiber-reinforced plastic (PRP). Examples of metals include iron and iron alloys. In addition, the so-called ABS resin refers to the general term of copolymerization of acrylonitrile, butadiene and styrene to form resin. The so-called phenolic paper refers to a mixture of paper and phenolic resin. Phenolic paper is a mixture of paper and phenol resin, for example, paper containing phenol resin is impregnated. Fiber-reinforced plastics include, for example, glass fibers impregnated with resin, carbon fibers, and other fibers.

軸構件52中之酚系樹脂等樹脂與紙等纖維之混合比率例如亦可為0.2以上,亦可為0.4以上,亦可為0.6以上,亦可為0.8以上。又,樹脂與纖維之混合比率例如亦可為5.0以下,亦可為3.0以下,亦可為2.0以下,亦可為1.5以下。樹脂與纖維之混合比率之範圍亦可藉由上述複數個下限之候選值中之任意之1個與上述複數個上限之候選值中之任意之1個之組合而規定,例如,亦可為0.2以上5.0以下,亦可為0.4以上3.0以下,亦可為0.6以上2.0以下,亦可為0.8以上1.5以下。又,樹脂與纖維之混合比率之範圍亦可藉由上述複數個下限之候選值中之任意之2個之組合而規定,例如,亦可為0.2以上0.8以下,亦可為0.2以上0.6以下,亦可為0.4以上0.8以下,亦可為0.4以上0.6以下。又,樹脂與纖維之混合比率之範圍亦可藉由上述複數個上限之候選值中之任意之2個之組合而規定,例如,亦可為1.5以上5.0以下,亦可為1.5以上3.0以下,亦可為2.0以上5.0以下,亦可為2.0以上3.0以下。再者,所謂樹脂與纖維之混合比率,係指將軸構件52中之樹脂之重量比除以軸構件52中之纖維之重量比所得的值。The mixing ratio of the resin such as phenol resin and the fiber such as paper in the shaft member 52 may be, for example, 0.2 or more, 0.4 or more, 0.6 or more, or 0.8 or more. In addition, the mixing ratio of resin and fiber may be, for example, 5.0 or less, 3.0 or less, 2.0 or less, or 1.5 or less. The range of the mixing ratio of the resin and the fiber can also be defined by the combination of any one of the candidate values of the lower limit and any one of the candidate values of the upper limit, for example, it can be 0.2 More than 5.0 or less, 0.4 or more and 3.0 or less, 0.6 or more and 2.0 or less, or 0.8 or more and 1.5 or less. In addition, the range of the mixing ratio of the resin and the fiber can also be defined by the combination of any two of the plurality of candidate values of the lower limit, for example, it can be 0.2 or more and 0.8 or less, or 0.2 or more and 0.6 or less, It may be 0.4 or more and 0.8 or less, or 0.4 or more and 0.6 or less. In addition, the range of the mixing ratio of the resin and the fiber can also be specified by the combination of any two of the plurality of upper limit candidate values, for example, it can be 1.5 or more and 5.0 or less, or 1.5 or more and 3.0 or less, It may be 2.0 or more and 5.0 or less, or 2.0 or more and 3.0 or less. In addition, the mixing ratio of resin and fiber refers to a value obtained by dividing the weight ratio of the resin in the shaft member 52 by the weight ratio of the fiber in the shaft member 52.

於軸構件52為中空狀構件之情形時,軸構件52之外徑R2例如亦可為125 mm以上,亦可為150 mm以上,亦可為180 mm以上,亦可為200 mm以上。藉此,可抑制於將金屬板51捲繞於軸構件52之期間於金屬板51產生塑性變形。又,於軸構件52為中空狀構件之情形時,軸構件52之外徑R2例如亦可為300 mm以下,亦可為280 mm以下,亦可為250 mm以下,亦可為200 mm以下。When the shaft member 52 is a hollow member, the outer diameter R2 of the shaft member 52 may be 125 mm or more, 150 mm or more, 180 mm or more, or 200 mm or more. This can suppress plastic deformation of the metal plate 51 while the metal plate 51 is wound around the shaft member 52. When the shaft member 52 is a hollow member, the outer diameter R2 of the shaft member 52 may be 300 mm or less, 280 mm or less, 250 mm or less, or 200 mm or less, for example.

軸構件52為中空狀構件之情形時之軸構件52之外徑R2之範圍亦可藉由上述複數個下限之候選值中之任意之1個與上述複數個上限之候選值中之任意之1個之組合而規定,例如,亦可為125 mm以上300 mm以下,亦可為150 mm以上280 mm以下,亦可為180 mm以上250 mm以下。又,軸構件52之外徑R2之範圍亦可藉由上述複數個下限之候選值中之任意之2個之組合而規定,例如,亦可為125 mm以上200 mm以下,亦可為125 mm以上180 mm以下,亦可為150 mm以上200 mm以下,亦可為150 mm以上180 mm以下。又,軸構件52之外徑R2之範圍亦可藉由上述複數個上限之候選值中之任意之2個之組合而規定,例如亦可為200 mm以上300 mm以下,亦可為200 mm以上280 mm以下,亦可為250 mm以上300 mm以下,亦可為250 mm以上280 mm以下。When the shaft member 52 is a hollow member, the range of the outer diameter R2 of the shaft member 52 may be any one of the candidate values of the plurality of lower limits and any one of the candidate values of the plurality of upper limits According to the combination of the two, for example, it may be 125 mm or more and 300 mm or less, 150 mm or more and 280 mm or less, or 180 mm or more and 250 mm or less. In addition, the range of the outer diameter R2 of the shaft member 52 can also be specified by a combination of any two of the plurality of candidate values of the lower limit, for example, it can be 125 mm or more and 200 mm or less, or 125 mm Above 180 mm, below 150 mm, above 200 mm, below 150 mm, and below 180 mm. In addition, the range of the outer diameter R2 of the shaft member 52 can also be specified by a combination of any two of the plurality of upper limit candidate values, for example, 200 mm or more and 300 mm or less, or 200 mm or more 280 mm or less, 250 mm or more and 300 mm or less, or 250 mm or more and 280 mm or less.

於製作捲繞體50之後,亦可實施將捲繞體50收容於容器之收容步驟。捲繞體50係於收容於容器之狀態下流通。於以下之說明中,將具備容器及收容於容器之捲繞體50之物品稱為捆包體。再者,所謂捲繞體50之流通,係指將捲繞體50自捲繞體50之製造者交接至捲繞體50之使用者為止之輸送、保管、交易等活動。捲繞體50之使用者例如為使用捲繞體50製造蒸鍍罩20之事業者。After the winding body 50 is produced, a housing step of housing the winding body 50 in the container may be performed. The winding body 50 is circulated in a state of being accommodated in a container. In the following description, the article provided with the container and the wound body 50 accommodated in the container is referred to as a package. In addition, the circulation of the winding body 50 refers to activities such as conveyance, storage, and transaction until the winding body 50 is transferred from the manufacturer of the winding body 50 to the user of the winding body 50. The user of the winding body 50 is, for example, a company that uses the winding body 50 to manufacture the vapor deposition cover 20.

圖10A係表示具備容器56及收容於容器56之捲繞體50之捆包體55之一例的立體圖。又,圖10B係沿著圖10A之XB-XB線之捆包體55之剖視圖。於圖10B中,表示了將收容有捲繞體50之容器56於與鉛直方向且軸構件52之軸向平行之平面切斷之情形。10A is a perspective view showing an example of a package body 55 including a container 56 and a winding body 50 housed in the container 56. FIG. 10B is a cross-sectional view of the package body 55 along the line XB-XB of FIG. 10A. FIG. 10B shows a case where the container 56 accommodating the wound body 50 is cut on a plane parallel to the vertical direction and the axial direction of the shaft member 52.

如圖10A及圖10B所示,容器56具備:下部57,其位於捲繞體50之下方;一對側部58,其等位於捲繞體50之側方;及上部59,其自上方覆蓋捲繞體50。側部58較佳為以捲繞體50之金屬板51不與下部57相接之方式支持軸構件52。藉此,可抑制因自下部57所受之力而導致於金屬板51產生變形或破損。As shown in FIGS. 10A and 10B, the container 56 includes: a lower portion 57 located below the winding body 50; a pair of side portions 58 located laterally of the winding body 50; and an upper portion 59 covering from above Winding body 50. The side portion 58 preferably supports the shaft member 52 so that the metal plate 51 of the winding body 50 does not contact the lower portion 57. This can suppress deformation or damage to the metal plate 51 due to the force received from the lower portion 57.

側部58支持軸構件52之方法為任意。例如,可將具有大於軸構件52之外徑R2之尺寸之貫通孔58a設置於側部58,將軸構件52插入至貫通孔58a。又,亦可於側部58之上端設置與軸構件52之形狀對應之切口等,於切口上載置軸構件52。The method by which the side portion 58 supports the shaft member 52 is arbitrary. For example, a through hole 58a having a size larger than the outer diameter R2 of the shaft member 52 may be provided in the side portion 58 and the shaft member 52 may be inserted into the through hole 58a. In addition, a cutout or the like corresponding to the shape of the shaft member 52 may be provided at the upper end of the side portion 58 to place the shaft member 52 on the cutout.

作為構成下部57、側部58及上部59等容器56之構件之材料,可使用木材、強化瓦楞紙板等。As the material constituting the container 56 such as the lower part 57, the side part 58 and the upper part 59, wood, reinforced corrugated cardboard, etc. can be used.

捲繞體50於將捲繞體50自捲繞體50之製造者交接至捲繞體50之使用者為止之期間,亦可於適當之保管場所保管。此處,根據本實施形態,捲繞體50之金屬板51係以捲繞於具有規定之閾值以上之外徑R2之軸構件52的狀態被保管。閾值如上所述般為125 mm、150 mm等。藉此,可抑制於自軸構件52捲出之後之金屬板51殘留翹曲。The wound body 50 can also be stored in an appropriate storage place until the wound body 50 is transferred from the manufacturer of the wound body 50 to the user of the wound body 50. Here, according to the present embodiment, the metal plate 51 of the winding body 50 is stored in a state of being wound around the shaft member 52 having an outer diameter R2 of a predetermined threshold value or more. The threshold is 125 mm, 150 mm, etc. as described above. With this, it is possible to suppress the remaining warpage of the metal plate 51 after being rolled out from the shaft member 52.

保管場所之環境以抑制捲繞體50之金屬板51之特性產生變化之方式設定。例如,保管場所之溫度為30℃以下,更佳為25℃以下。又,例如,保管場所之溫度為0℃以上,更佳為10℃以上。又,保管場所之濕度為60%以下,更佳為50%以下。The environment of the storage place is set in such a way as to prevent the characteristics of the metal plate 51 of the winding body 50 from changing. For example, the temperature of the storage place is 30°C or lower, more preferably 25°C or lower. Also, for example, the temperature of the storage place is 0°C or higher, more preferably 10°C or higher. In addition, the humidity of the storage place is 60% or less, more preferably 50% or less.

捲繞體50亦可以收容於上述捆包體55之容器56之狀態被保管。於該情形時,由於可於捲繞體50之金屬板51不與容器56之下部57相接之狀態下保管捲繞體50,故而可抑制金屬板51產生變形或破損。The winding body 50 may be stored in the container 56 of the packaging body 55 described above. In this case, the winding body 50 can be stored in a state where the metal plate 51 of the winding body 50 is not in contact with the lower portion 57 of the container 56, so that the metal plate 51 can be suppressed from being deformed or damaged.

或者,捲繞體50亦可以不收容於容器56之狀態被保管。於該情形時,亦較佳為以金屬板51不與周圍之構造體相接之方式支持軸構件52。藉此,可抑制金屬板51產生變形或破損。Alternatively, the wound body 50 may be stored without being stored in the container 56. In this case, it is also preferable to support the shaft member 52 so that the metal plate 51 is not in contact with the surrounding structure. This can suppress deformation or damage of the metal plate 51.

亦可於將金屬板51捲繞於軸構件52而製作捲繞體50之後,實施將金屬板51捲出並檢查產生於金屬板51之翹曲之檢查方法。檢查方法例如由金屬板51或捲繞體50之製造者於金屬板51或捲繞體50流通前實施。又,亦可於流通中由保管捲繞體50之事業者等實施檢查方法。又,亦可由使用捲繞體50之使用者於獲得捲繞體50之後實施檢查方法。After the metal plate 51 is wound around the shaft member 52 to produce the wound body 50, an inspection method for unwinding the metal plate 51 and inspecting the warpage caused by the metal plate 51 may be implemented. The inspection method is implemented, for example, by the manufacturer of the metal plate 51 or the winding body 50 before the metal plate 51 or the winding body 50 circulates. In addition, the inspection method may be implemented by a company or the like who stores the winding body 50 during circulation. In addition, a user who uses the wound body 50 may perform the inspection method after obtaining the wound body 50.

檢查方法具備:試驗片製作步驟,其係將捲繞體50之金屬板51捲出,取出規定長度之金屬板51製作試驗片66;及測定步驟,其係測定試驗片66之翹曲。於試驗片製作步驟中,例如,將規定長度之金屬板51自捲繞體50切斷。例如,使用剪切機(shear)等大型刀具將捲繞體50之金屬板51切斷。作為試驗片66,使用捲繞於軸構件52之金屬板51中位於最外側之金屬板51。The inspection method includes: a test piece manufacturing step, which is to roll out the metal plate 51 of the winding body 50 and take out a metal plate 51 of a predetermined length to make a test piece 66; and a measurement step, which is to measure the warpage of the test piece 66. In the test piece production step, for example, a metal plate 51 of a predetermined length is cut from the wound body 50. For example, the metal plate 51 of the winding body 50 is cut using a large cutter such as a shear. As the test piece 66, the metal plate 51 located on the outermost side among the metal plates 51 wound around the shaft member 52 is used.

再者,捲繞於軸構件52之金屬板51所產生之翹曲之程度於金屬板51中最內側之部分、即位於最靠軸構件52側之金屬板51中變得最大。另一方面,於本實施形態中,捲繞於軸構件52之金屬板51之外徑R3與軸構件52之外徑R2之差與軸構件52之外徑R2相比較小。例如,金屬板51之外徑R3與軸構件52之外徑R2之差相對於軸構件52之外徑R2的比率、即(R3-R2)/R2為1/5以下,亦存在為1/10以下之情形。因此,認為將捲繞於軸構件52之金屬板51中位於最外側之金屬板51用作試驗片66來測定翹曲可成為捲繞於軸構件52之金屬板51中位於最內側之金屬板51所產生之翹曲之有用指標。Furthermore, the degree of warpage caused by the metal plate 51 wound around the shaft member 52 becomes the largest in the innermost part of the metal plate 51, that is, the metal plate 51 located on the side closest to the shaft member 52. On the other hand, in the present embodiment, the difference between the outer diameter R3 of the metal plate 51 wound around the shaft member 52 and the outer diameter R2 of the shaft member 52 is smaller than the outer diameter R2 of the shaft member 52. For example, the ratio of the difference between the outer diameter R3 of the metal plate 51 and the outer diameter R2 of the shaft member 52 relative to the outer diameter R2 of the shaft member 52, that is, (R3-R2)/R2 is 1/5 or less, and also exists as 1/ In the case of 10 or less. Therefore, it is considered that the metal plate 51 located on the outermost side among the metal plates 51 wound around the shaft member 52 can be used as the test piece 66 to measure the warpage to become the metal plate located on the innermost side among the metal plates 51 wound around the shaft member 52 A useful indicator of the warpage produced by 51.

圖11係表示測定產生於包括金屬板51之試驗片66之翹曲之方法的圖。圖12係表示自箭頭XII之方向觀察圖11之試驗片66之情形時的圖。於圖12中,符號L1表示長度方向F1上之試驗片66之尺寸,符號L2表示寬度方向F2上之試驗片66之尺寸。試驗片66之尺寸L1為400 mm以上600 mm以下,例如為500 mm。試驗片66之尺寸L2與寬度方向F2上之金屬板51之尺寸W1相等,例如為150 mm以上1300 mm以下。試驗片66之尺寸L2,即金屬板51之尺寸W1如圖12所示,較佳為大至可沿著金屬板51之寬度方向F2將複數個蒸鍍罩20分配至金屬板51之程度。FIG. 11 is a diagram showing a method of measuring the warpage caused by the test piece 66 including the metal plate 51. FIG. 12 is a diagram when the test piece 66 of FIG. 11 is viewed from the direction of the arrow XII. In FIG. 12, the symbol L1 represents the size of the test piece 66 in the longitudinal direction F1, and the symbol L2 represents the size of the test piece 66 in the width direction F2. The size L1 of the test piece 66 is 400 mm or more and 600 mm or less, for example, 500 mm. The size L2 of the test piece 66 is equal to the size W1 of the metal plate 51 in the width direction F2, for example, 150 mm or more and 1300 mm or less. As shown in FIG. 12, the size L2 of the test piece 66, that is, the size W1 of the metal plate 51 is preferably large enough to distribute the plurality of vapor deposition covers 20 to the metal plate 51 along the width direction F2 of the metal plate 51.

於測定步驟中,首先,如圖11所示,將試驗片66之一部分固定於牆壁等被附著體67之鉛直面67a。例如,將構成試驗片66之金屬板51之長度方向F1上之第1端部51e以第1端部51e位於上方之方式固定於鉛直面67a。此時,使試驗片66之面中於產生於試驗片66之翹曲之曲率半徑之方向上位於外側之面與被附著體67之鉛直面67a對向。例如,如圖11所示,於在自金屬板51之第2面51b朝向第1面51a之方向上凸狀之翹曲產生於試驗片66之情形時,使金屬板51之第1面51a與被附著體67之鉛直面67a對向。第1端部51e之固定方法為任意。例如,可使用接著劑、單面膠帶、雙面膠帶、磁鐵等將第1端部51e固定於鉛直面67a。In the measurement step, first, as shown in FIG. 11, a part of the test piece 66 is fixed to the vertical surface 67 a of the adherend 67 such as a wall. For example, the first end portion 51e in the longitudinal direction F1 of the metal plate 51 constituting the test piece 66 is fixed to the vertical surface 67a such that the first end portion 51e is located above. At this time, among the surfaces of the test piece 66, the surface located outside in the direction of the radius of curvature of the warpage generated in the test piece 66 is opposed to the vertical surface 67a of the adherend 67. For example, as shown in FIG. 11, when convex warpage occurs in the test piece 66 in the direction from the second surface 51 b of the metal plate 51 toward the first surface 51 a, the first surface 51 a of the metal plate 51 is made It faces the vertical surface 67a of the adherend 67. The method of fixing the first end 51e is arbitrary. For example, the first end 51e can be fixed to the vertical surface 67a using an adhesive, a single-sided tape, a double-sided tape, a magnet, or the like.

繼而,如圖11所示,測定產生於在長度方向F1上與第1端部51e對向之第2端部51f與被附著體67之鉛直面67a之間的間隙S1。作為測定間隙S1之測定器,例如可使用尺、游標卡尺等。Next, as shown in FIG. 11, the gap S1 generated between the second end portion 51 f opposed to the first end portion 51 e in the longitudinal direction F1 and the vertical surface 67 a of the adherend 67 is measured. As a measuring device for measuring the gap S1, for example, a ruler, a vernier caliper, or the like can be used.

於間隙S1為閾值以下之情形時,亦可實施判定經取出試驗片66之捲繞體50為合格之判定步驟。閾值較佳為20 mm以下,更佳為15 mm以下。判定步驟可由捲繞體50之製造者實施,亦可由捲繞體50之使用者實施。於捲繞體50之使用者實施判定步驟之情形時,亦可於判定步驟之後,使用判定為合格之捲繞體50之金屬板51製作蒸鍍罩20。於該情形時,包含判定步驟之上述檢查步驟可謂之為蒸鍍罩20之製造方法之一部分。再者,蒸鍍罩20之製造方法亦可不經常具備上述檢查步驟。In the case where the gap S1 is equal to or less than the threshold value, a determination step for determining that the wound body 50 from which the test piece 66 has been taken out is acceptable. The threshold value is preferably 20 mm or less, and more preferably 15 mm or less. The determination step may be performed by the manufacturer of the winding body 50, or may be performed by the user of the winding body 50. When the user of the winding body 50 performs the determination step, after the determination step, the metal plate 51 of the winding body 50 determined to be acceptable may be used to manufacture the vapor deposition cover 20. In this case, the above-mentioned inspection step including the determination step can be said to be a part of the manufacturing method of the vapor deposition mask 20. Furthermore, the manufacturing method of the vapor deposition mask 20 may not always include the above-mentioned inspection steps.

其次,主要參照圖13~圖17,對使用捲繞於上述捲繞體50之軸構件52之金屬板51製造蒸鍍罩20之方法進行說明。圖13係表示使用金屬板51製造蒸鍍罩20之製造裝置70之圖。首先,準備包含捲繞於軸構件52之金屬板51之捲繞體50。繼而,將捲繞體50之金屬板51自軸構件52捲出,將金屬板51向圖13所示之抗蝕膜形成裝置71、曝光、顯影裝置72、蝕刻裝置73、剝膜裝置74及分離裝置75依序搬送。再者,於圖13中,表示了金屬板51藉由於其長度方向F1搬送而於裝置之間移動之示例,但並不限定於此。例如,亦可將於抗蝕膜形成裝置71中設置有抗蝕膜之金屬板51再次捲取於軸構件52之後,將捲繞體之狀態之金屬板51供給至曝光、顯影裝置72。又,亦可將設置有於曝光、顯影裝置72中被曝光、顯影處理之抗蝕膜之狀態之金屬板51再次捲取於軸構件52之後,將捲繞體之狀態之金屬板51供給至蝕刻裝置73。又,亦可將於蝕刻裝置73中被蝕刻之金屬板51再次捲取於軸構件52之後,將捲繞體之狀態之金屬板51供給至剝膜裝置74。又,亦可將於剝膜裝置74中將下述樹脂54等去除之金屬板51再次捲取於軸構件52之後,將捲繞體之狀態之金屬板51供給至分離裝置75。Next, referring mainly to FIGS. 13 to 17, a method of manufacturing the vapor deposition cover 20 using the metal plate 51 wound around the shaft member 52 of the winding body 50 will be described. FIG. 13 is a diagram showing a manufacturing apparatus 70 for manufacturing the vapor deposition mask 20 using the metal plate 51. First, the winding body 50 including the metal plate 51 wound around the shaft member 52 is prepared. Then, the metal plate 51 of the winding body 50 is unwound from the shaft member 52, and the metal plate 51 is directed to the resist film forming device 71, exposure, developing device 72, etching device 73, film stripping device 74 and The separating device 75 conveys in order. In addition, FIG. 13 shows an example in which the metal plate 51 moves between the devices by being transported in the longitudinal direction F1, but it is not limited to this. For example, after the metal plate 51 provided with the resist film in the resist film forming apparatus 71 is wound around the shaft member 52 again, the metal plate 51 in the state of the winding body may be supplied to the exposure and development device 72. In addition, the metal plate 51 in the state where the resist film exposed to the exposure and development process in the exposure and development device 72 is wound on the shaft member 52 again may be supplied to the metal plate 51 in the state of the winding body Etching device 73. In addition, after the metal plate 51 etched in the etching device 73 is wound around the shaft member 52 again, the metal plate 51 in the state of the wound body may be supplied to the film stripping device 74. In addition, after the metal plate 51 from which the resin 54 described below is removed in the film peeling device 74 is wound around the shaft member 52 again, the metal plate 51 in the state of the wound body may be supplied to the separating device 75.

抗蝕膜形成裝置71係於金屬板51之表面設置抗蝕膜。曝光、顯影裝置72係藉由對抗蝕膜實施曝光處理及顯影處理,而將抗蝕膜圖案化形成抗蝕圖案。The resist film forming device 71 is provided with a resist film on the surface of the metal plate 51. The exposure and development device 72 patterns the resist film to form a resist pattern by performing exposure processing and development processing on the resist film.

蝕刻裝置73係將抗蝕圖案作為遮罩對金屬板51進行蝕刻,於金屬板51形成貫通孔25。再者,於本實施形態中,將與複數片蒸鍍罩20對應的多數之貫通孔25形成於金屬板51。換言之,對金屬板51分配複數片蒸鍍罩20。例如,以於金屬板51之寬度方向F2複數個有效區域22排列且於金屬板51之長度方向F1複數個蒸鍍罩20用之有效區域22排列之方式,於金屬板51形成多數之貫通孔25。剝膜裝置74使為了保護抗蝕圖案或下述樹脂54等金屬板51中未被蝕刻之部分免受蝕刻液影響而設置之構成要素剝離。The etching device 73 etches the metal plate 51 using the resist pattern as a mask, and forms a through hole 25 in the metal plate 51. Furthermore, in this embodiment, a plurality of through holes 25 corresponding to the plurality of vapor deposition covers 20 are formed in the metal plate 51. In other words, a plurality of vapor deposition covers 20 are allocated to the metal plate 51. For example, a plurality of through holes are formed in the metal plate 51 in such a manner that a plurality of effective areas 22 are arranged in the width direction F2 of the metal plate 51 and a plurality of effective areas 22 for the vapor deposition mask 20 are arranged in the length direction F1 of the metal plate 51 25. The film stripping device 74 strips the constituent elements provided to protect the unetched portions of the metal plate 51 such as the resist pattern or the resin 54 described below from the etching solution.

分離裝置75實施將金屬板51中形成有與1片量之蒸鍍罩20對應的複數個貫通孔25之部分自金屬板51分離之分離步驟。如此一來,可獲得單片狀之蒸鍍罩20。The separation device 75 performs a separation step of separating the portion of the metal plate 51 where the plurality of through holes 25 corresponding to one vapor deposition cover 20 is formed from the metal plate 51. In this way, a single-piece vapor deposition cover 20 can be obtained.

以下,對蒸鍍罩20之製造方法之各步驟詳細地進行說明。Hereinafter, each step of the method of manufacturing the vapor deposition mask 20 will be described in detail.

首先,將捲繞體50設置於製造裝置70。例如,將捲繞體50設置於用以朝向抗蝕膜形成裝置71將金屬板51捲出之未圖示之捲出裝置。First, the winding body 50 is installed in the manufacturing apparatus 70. For example, the winding body 50 is provided in an unshown unwinding device for unwinding the metal plate 51 toward the resist film forming device 71.

此處,於本實施形態中,軸構件52之外徑R2為550 mm以下,更佳為300 mm以下。又,於軸構件52形成有中空部。又,捲繞於軸構件52之金屬板51之厚度T較小,例如為50 μm以下。因此,具備金屬板51及軸構件52之捲繞體50之重量與先前之蒸鍍罩20之製造步驟中所使用之捲繞體相比較小。本實施形態之捲繞體50之重量例如為70 kg以下,較佳為50 kg以下。因此,可不使用堆高機等搬運裝置實施將捲繞體50設置於製造裝置70之步驟。例如,可藉由2人之作業者中之一人一面支持軸構件52之一端,另一人一面支持另一端一面搬運捲繞體50,而將捲繞體50設置於製造裝置70。因此,可不將用以使搬運裝置進入之空間設置於蒸鍍罩20之製造裝置地將捲繞體50設置於製造裝置70。藉此,與使用搬運裝置進行捲繞體50之設置之先前之製造裝置相比,可使製造裝置70之面積變小。Here, in the present embodiment, the outer diameter R2 of the shaft member 52 is 550 mm or less, more preferably 300 mm or less. In addition, a hollow portion is formed in the shaft member 52. In addition, the thickness T of the metal plate 51 wound around the shaft member 52 is small, for example, 50 μm or less. Therefore, the weight of the winding body 50 provided with the metal plate 51 and the shaft member 52 is smaller than that of the winding body used in the previous manufacturing step of the vapor deposition cover 20. The weight of the wound body 50 of this embodiment is, for example, 70 kg or less, preferably 50 kg or less. Therefore, the step of installing the winding body 50 in the manufacturing device 70 can be performed without using a conveying device such as a stacker. For example, the winding body 50 may be installed in the manufacturing apparatus 70 by supporting one end of the shaft member 52 while supporting the other end while supporting the other end. Therefore, it is possible to install the winding body 50 in the manufacturing apparatus 70 without providing the space for entering the conveying apparatus in the manufacturing apparatus of the vapor deposition cover 20. This makes it possible to reduce the area of the manufacturing apparatus 70 compared to the previous manufacturing apparatus that uses the conveying apparatus to install the winding body 50.

再者,於本實施形態之捲繞體50中,亦重視作業之安全性等,亦可使用堆高機等搬運裝置將捲繞體50設置於製造裝置70。In addition, in the winding body 50 of the present embodiment, the safety of work is also emphasized, and the winding body 50 may be installed in the manufacturing device 70 using a conveying device such as a stacker.

繼而,使用抗蝕膜形成裝置71,於自捲出裝置捲出之金屬板51之第1面51a上及第2面51b上,如圖14所示形成抗蝕膜53a、53b。例如,藉由將包含丙烯酸系光硬化性樹脂等感光性抗蝕材料之乾膜貼附於金屬板51之第1面51a上及第2面51b上,而形成抗蝕膜53a、53b。或者,亦可藉由將包含負型之感光性抗蝕材料之塗佈液塗佈於金屬板51之第1面51a上及第2面51b上,並使塗佈液乾燥,而形成抗蝕膜53a、53b。Next, using the resist film forming device 71, resist films 53a and 53b are formed on the first surface 51a and the second surface 51b of the metal plate 51 rolled out from the unwinding device, as shown in FIG. For example, the resist films 53a and 53b are formed by attaching a dry film containing a photosensitive resist material such as acrylic photocurable resin to the first surface 51a and the second surface 51b of the metal plate 51. Alternatively, it is also possible to form a resist by applying a coating liquid containing a negative-type photosensitive resist material on the first surface 51a and the second surface 51b of the metal plate 51, and drying the coating liquid The membrane 53a, 53b.

繼而,使用曝光、顯影裝置72,將抗蝕膜53a、53b曝光及顯影。藉此,如圖15所示,可於金屬板51之第1面51a上形成第1抗蝕圖案53c,於金屬板51之第2面51b上形成第2抗蝕圖案53d。Then, using the exposure and development device 72, the resist films 53a and 53b are exposed and developed. Thereby, as shown in FIG. 15, the first resist pattern 53 c can be formed on the first surface 51 a of the metal plate 51, and the second resist pattern 53 d can be formed on the second surface 51 b of the metal plate 51.

繼而,使用蝕刻裝置73,將抗蝕圖案53c、53d作為遮罩對金屬板51進行蝕刻。具體而言,首先,如圖16所示,將金屬板51之第1面51a中未由第1抗蝕圖案53c覆蓋之區域使用第1蝕刻液進行蝕刻。例如,使第1蝕刻液自配置於與被搬送之金屬板51之第1面51a面對之側之噴嘴越過第1抗蝕圖案53c朝向金屬板51之第1面51a噴射。其結果,如圖16所示,於金屬板51中之未由第1抗蝕圖案53c覆蓋之區域,由第1蝕刻液所致之腐蝕進展。藉此,於金屬板51之第1面51a形成多數之第1凹部30。作為第1蝕刻液,例如使用包含氯化鐵溶液及鹽酸者。Then, using the etching device 73, the metal plate 51 is etched using the resist patterns 53c and 53d as a mask. Specifically, first, as shown in FIG. 16, an area of the first surface 51 a of the metal plate 51 that is not covered by the first resist pattern 53 c is etched using the first etchant. For example, the first etchant is sprayed toward the first surface 51a of the metal plate 51 across the first resist pattern 53c from the nozzle disposed on the side facing the first surface 51a of the metal plate 51 to be transported. As a result, as shown in FIG. 16, in the region of the metal plate 51 that is not covered by the first resist pattern 53c, the corrosion by the first etchant progresses. As a result, a plurality of first recesses 30 are formed on the first surface 51a of the metal plate 51. As the first etching solution, for example, a solution containing ferric chloride solution and hydrochloric acid is used.

其次,如圖17所示,將金屬板51之第2面51b中未由第2抗蝕圖案53d覆蓋之區域蝕刻,於第2面51b形成第2凹部35。第2面51b之蝕刻實施直至第1凹部30與第2凹部35相互相通,藉此形成貫通孔25為止。作為第2蝕刻液,與上述第1蝕刻液相同地,例如使用包含氯化鐵溶液及鹽酸者。再者,於第2面51b之蝕刻時,如圖17所示,亦可藉由具有相對於第2蝕刻液之耐性之樹脂54而被覆第1凹部30。Next, as shown in FIG. 17, an area of the second surface 51b of the metal plate 51 that is not covered by the second resist pattern 53d is etched to form a second recess 35 on the second surface 51b. The etching of the second surface 51b is performed until the first concave portion 30 and the second concave portion 35 communicate with each other, thereby forming the through hole 25. As the second etching solution, for example, a solution containing ferric chloride solution and hydrochloric acid is used in the same manner as the above-mentioned first etching solution. In addition, when etching the second surface 51b, as shown in FIG. 17, the first concave portion 30 may be covered with a resin 54 having resistance to the second etching solution.

然後,使用剝膜裝置74,將樹脂54自金屬板51去除。樹脂54例如可藉由使用鹼系剝離液而去除。於使用鹼系剝離液之情形時,與樹脂54同時地亦將抗蝕圖案53c、53d去除。再者,於將樹脂54去除之後,亦可使用與用以使樹脂54剝離之剝離液不同之剝離液,與樹脂54另外將抗蝕圖案53c、53d去除。Then, using the peeling device 74, the resin 54 is removed from the metal plate 51. The resin 54 can be removed by using an alkali-based stripping liquid, for example. When an alkali-based stripping solution is used, the resist patterns 53c and 53d are also removed simultaneously with the resin 54. In addition, after the resin 54 is removed, a peeling liquid different from the peeling liquid for peeling off the resin 54 may be used to remove the resist patterns 53c and 53d separately from the resin 54.

然後,將分配至金屬板51之複數個蒸鍍罩20一個一個地取出。例如,將金屬板51中形成有與1片量之蒸鍍罩20對應之複數個貫通孔25之部分自金屬板51之其他部分分離。藉此,可獲得蒸鍍罩20。再者,於實施分離步驟之前,亦可將分配有適當之數量之蒸鍍罩20之金屬板51之部分切斷。於該情形時,於分離步驟中,自分配有適當之數量之蒸鍍罩20之片狀之金屬板51將蒸鍍罩20一個一個地取出。作為將蒸鍍罩20自金屬板51取出之方法,可採用藉由雷射加工將蒸鍍罩20自金屬板51分離之方法、作業者利用手將蒸鍍罩20自金屬板51分離之方法等各種方法。Then, the plurality of vapor deposition covers 20 distributed to the metal plate 51 are taken out one by one. For example, the part of the metal plate 51 in which a plurality of through holes 25 corresponding to one vapor deposition mask 20 is formed is separated from the other parts of the metal plate 51. Thereby, the vapor deposition cover 20 can be obtained. Furthermore, before performing the separation step, a portion of the metal plate 51 to which an appropriate number of vapor deposition covers 20 are allocated may be cut. In this case, in the separation step, the vapor-deposited covers 20 are taken out one by one from the sheet-shaped metal plate 51 to which an appropriate number of vapor-deposited covers 20 are allocated. As a method of removing the vapor deposition cover 20 from the metal plate 51, a method of separating the vapor deposition cover 20 from the metal plate 51 by laser processing, or a method of separating the vapor deposition cover 20 from the metal plate 51 by an operator And other methods.

再者,於金屬板51形成貫通孔25之方法並不限定於蝕刻。例如,亦可藉由對金屬板51照射雷射之雷射加工而於金屬板51形成貫通孔25。In addition, the method of forming the through-hole 25 in the metal plate 51 is not limited to etching. For example, the through hole 25 may be formed in the metal plate 51 by laser processing that irradiates the metal plate 51 with laser light.

繼而,實施檢查蒸鍍罩20之檢查步驟。檢查步驟包含檢查蒸鍍罩20之構成要素之位置之步驟、檢查蒸鍍罩20之構成要素之尺寸之步驟、或檢查蒸鍍罩20之2個構成要素間之距離之步驟之至少任一個。檢查對象之構成要素例如為貫通孔25。Then, the inspection step of inspecting the vapor deposition cover 20 is implemented. The inspection step includes at least any one of a step of inspecting the position of the constituent elements of the vapor deposition mask 20, a step of inspecting the size of the constituent elements of the vapor deposition mask 20, or a step of inspecting the distance between the two constituent elements of the vapor deposition mask 20. The component to be inspected is, for example, the through-hole 25.

於檢查步驟中,首先,如圖18所示,將蒸鍍罩20載置於檢查台68之水平面68a上。圖19係表示自箭頭XIX之方向觀察圖18之蒸鍍罩20及檢查台68之情形時的圖。檢查台68例如為玻璃板。如圖19所示,以蒸鍍罩20之第1面20a與檢查台68之水平面68a對向之方式,將蒸鍍罩20載置於檢查台68。蒸鍍罩20延伸之第1方向D1亦可與金屬板51之長度方向F1一致。第1方向D1上之蒸鍍罩20之尺寸為500 mm以上1300 mm以下,例如為1200 mm。又,第2方向D2上之蒸鍍罩20之尺寸為30 mm以上400 mm以下,例如為70 mm。In the inspection step, first, as shown in FIG. 18, the vapor deposition cover 20 is placed on the horizontal surface 68 a of the inspection table 68. FIG. 19 is a view when the vapor deposition cover 20 and the inspection table 68 of FIG. 18 are viewed from the direction of the arrow XIX. The inspection table 68 is, for example, a glass plate. As shown in FIG. 19, the vapor deposition cover 20 is placed on the inspection table 68 so that the first surface 20 a of the vapor deposition cover 20 faces the horizontal surface 68 a of the inspection table 68. The first direction D1 in which the vapor deposition cover 20 extends may also coincide with the longitudinal direction F1 of the metal plate 51. The size of the vapor deposition cover 20 in the first direction D1 is 500 mm or more and 1300 mm or less, for example, 1200 mm. In addition, the size of the vapor deposition cover 20 in the second direction D2 is 30 mm or more and 400 mm or less, for example, 70 mm.

於檢查步驟中,例如,沿著水平面68a之法線方向自蒸鍍罩20之第1面20a或第2面20b之一側對蒸鍍罩20照射光。又,使用檢測器檢測通過蒸鍍罩20之貫通孔25自蒸鍍罩20之第1面20a或第2面20b之另一側出射之光。繼而,基於所檢測出之光之圖案,獲得與蒸鍍罩20之貫通孔25之位置、面積、形狀等相關之資訊。可基於該等資訊,判定蒸鍍罩20之合格與否。再者,亦可基於藉由蒸鍍罩20而反射之光之圖案,獲得與蒸鍍罩20之貫通孔25之位置、面積、形狀等相關之資訊。In the inspection step, for example, the vapor deposition cover 20 is irradiated with light from one side of the first surface 20a or the second surface 20b of the vapor deposition cover 20 along the normal direction of the horizontal plane 68a. In addition, the light emitted from the other side of the first surface 20a or the second surface 20b of the vapor deposition cover 20 through the through hole 25 of the vapor deposition cover 20 is detected using a detector. Then, based on the detected light pattern, information about the position, area, shape, etc. of the through hole 25 of the vapor deposition cover 20 is obtained. Based on such information, the qualification of the vapor deposition cover 20 can be determined. Furthermore, information regarding the position, area, shape, etc. of the through hole 25 of the vapor deposition cover 20 can also be obtained based on the pattern of light reflected by the vapor deposition cover 20.

且說,於起因於將金屬板51捲繞於軸構件52之翹曲殘留於蒸鍍罩20之情形時,如圖19所示,有於蒸鍍罩20與檢查台68之水平面68a之間產生間隙S2之情況。如圖19所示,於將蒸鍍罩20載置於水平面68a之情形時,與如圖11所示將金屬板51固定於鉛直面67a之情形時相比,起因於蒸鍍罩20之自重而蒸鍍罩20之金屬板51與水平面68a之間之距離容易變小。因此,間隙S2容易小於間隙S1。然而,由於蒸鍍罩20之貫通孔25之位置、面積、形狀等要求較高之精度,故而如以下所說明,間隙S2會產生問題。In addition, when the metal plate 51 is wound around the shaft member 52, the warpage remains in the vapor deposition cover 20. As shown in FIG. 19, it occurs between the vapor deposition cover 20 and the horizontal surface 68a of the inspection table 68. The case of gap S2. As shown in FIG. 19, when the vapor deposition cover 20 is placed on the horizontal surface 68a, it is due to the weight of the vapor deposition cover 20 as compared with the case where the metal plate 51 is fixed to the vertical surface 67a as shown in FIG. Moreover, the distance between the metal plate 51 of the vapor deposition cover 20 and the horizontal plane 68a tends to become smaller. Therefore, the gap S2 is easily smaller than the gap S1. However, since the position, area, shape, etc. of the through hole 25 of the vapor deposition mask 20 require high accuracy, as described below, the gap S2 may cause a problem.

蒸鍍罩20之翹曲之程度越大,且間隙S2越大,則基於光之圖案所獲得之貫通孔25之位置、面積、形狀等資訊越自蒸鍍罩20之面方向上之實際之貫通孔25之位置、面積、形狀等脫離。因此,蒸鍍罩20之翹曲越大,則蒸鍍罩20之檢查步驟之精度越降低。若蒸鍍罩20之翹曲更大,則亦認為通過蒸鍍罩20之貫通孔25之光、或由蒸鍍罩20反射之光無法到達至檢測器。The greater the degree of warpage of the vapor deposition mask 20, and the greater the gap S2, the more information about the position, area, shape, etc. of the through-hole 25 obtained based on the pattern of light from the actual direction of the surface direction of the vapor deposition mask 20 The position, area, shape, etc. of the through hole 25 are separated. Therefore, the greater the warpage of the vapor deposition mask 20, the lower the accuracy of the inspection step of the vapor deposition mask 20. If the warpage of the vapor deposition cover 20 is greater, the light passing through the through hole 25 of the vapor deposition cover 20 or the light reflected by the vapor deposition cover 20 may not reach the detector.

此處,於本實施形態中,如上所述,捲繞體50之軸構件52之外徑R2至少為125 mm以上或150 mm以上。換言之,捲繞於軸構件52之金屬板51中位於最靠軸構件52側之部分之內徑為125 mm以上或150 mm以上。因此,可抑制於捲繞於軸構件52之金屬板51殘留翹曲。例如,可將自金屬板51取出之試驗片66固定於鉛直面67a之情形時所產生之上述間隙S1抑制為20 mm以下,可抑制為更佳為15 mm以下。因此,可將自金屬板51製作之蒸鍍罩20載置於水平面68a之情形時所產生之上述間隙S2抑制為0.5 mm以下,可抑制為更佳為0.25 mm以下。藉此,於蒸鍍罩20之檢查步驟中,可以較高之精度獲得與貫通孔25之位置、面積、形狀等相關之資訊。Here, in this embodiment, as described above, the outer diameter R2 of the shaft member 52 of the wound body 50 is at least 125 mm or more or 150 mm or more. In other words, the inner diameter of the portion of the metal plate 51 wound around the shaft member 52 that is closest to the shaft member 52 is 125 mm or more or 150 mm or more. Therefore, the metal plate 51 wound around the shaft member 52 can be suppressed from remaining warpage. For example, the gap S1 generated when the test piece 66 taken out of the metal plate 51 is fixed to the vertical surface 67a can be suppressed to 20 mm or less, and more preferably 15 mm or less. Therefore, the gap S2 generated when the vapor deposition cover 20 made from the metal plate 51 is placed on the horizontal plane 68a can be suppressed to 0.5 mm or less, and more preferably to 0.25 mm or less. In this way, in the inspection step of the vapor deposition mask 20, information related to the position, area, shape, etc. of the through hole 25 can be obtained with high accuracy.

再者,若自抑制蒸鍍罩20之翹曲之觀點考慮,則較佳為軸構件52之外徑R2較大。然而,若軸構件52之外徑R2變大,則捲繞體50之重量增加,捲繞體50之輸送、設置等之困難度增加。考慮該方面,於本實施形態中,軸構件52之外徑R2例如為550 mm以下,更佳為300 mm以下。In addition, from the viewpoint of suppressing warpage of the vapor deposition cover 20, it is preferable that the outer diameter R2 of the shaft member 52 is large. However, when the outer diameter R2 of the shaft member 52 becomes larger, the weight of the winding body 50 increases, and the difficulty of conveyance and installation of the winding body 50 increases. Considering this aspect, in the present embodiment, the outer diameter R2 of the shaft member 52 is, for example, 550 mm or less, and more preferably 300 mm or less.

又,作為一面使軸構件52之外徑R2變大,一面抑制捲繞體50之重量之方法,亦考慮使捲繞於軸構件52之金屬板51之長度變短。然而,將捲繞體50之金屬板51之前端投入至製造裝置70之曝光、顯影裝置72、蝕刻裝置73等各裝置之當初,藉由各裝置實施之步驟容易變得不穩定。因此,於自捲繞體50之金屬板51之前端附近製作之蒸鍍罩20中,品質之不均容易變大。因此,為了自1個捲繞體50製作品質之不均較小之複數個蒸鍍罩20,某程度上需要捲繞體50之金屬板51之長度。捲繞體50之金屬板51之長度方向F1上之長度較佳為200 m以上,更佳為300 m以上,進而較佳為400 m以上或500 m以上,亦可為600 m以上。In addition, as a method of increasing the outer diameter R2 of the shaft member 52 while suppressing the weight of the winding body 50, it is also considered to shorten the length of the metal plate 51 wound around the shaft member 52. However, when the front end of the metal plate 51 of the winding body 50 is put into the exposure device, the development device 72, and the etching device 73 of the manufacturing device 70, the steps performed by the devices are likely to become unstable. Therefore, in the vapor deposition cover 20 produced near the front end of the metal plate 51 of the self-winding body 50, uneven quality tends to increase. Therefore, in order to produce a plurality of vapor deposition covers 20 with a small quality unevenness from one winding body 50, the length of the metal plate 51 of the winding body 50 is required to some extent. The length in the longitudinal direction F1 of the metal plate 51 of the wound body 50 is preferably 200 m or more, more preferably 300 m or more, and further preferably 400 m or more or 500 m or more, or 600 m or more.

於此種背景之下,於本實施之特佳之形態中,藉由一面使捲繞體50之金屬板51之長度為至少200 m以上,一面使金屬板51之厚度T為30 μm以下,而降低金屬板51之重量。又,藉由使軸構件52之外徑R2為300 mm以下,而降低捲繞體50整體之重量。又,由於金屬板51之厚度T為30 μm以下,故而即便於軸構件52之外徑R2為125 mm或150 mm較小之情形時,亦可抑制於金屬板51殘留翹曲。又,由於金屬板51之重量降低,故而軸構件52要求之強度或剛性變低。因此,可使用中空狀構件作為軸構件52。又,作為構成軸構件52之材料,可使用酚系樹脂等與金屬相比較輕之樹脂。藉此,可進而降低捲繞體50整體之重量,例如,可設為70 kg以下或50 kg以下。藉由該情況,可減輕捲繞體50之輸送、設置等之困難度。例如,可不使用堆高機等搬運裝置地由2人之作業者利用人力實施將捲繞體50設置於製造裝置70之步驟。藉此,與使用搬運裝置進行捲繞體50之設置之先前之製造裝置相比,可使製造裝置70之面積變小。如此,根據本實施之特佳之形態,可一面抑制金屬板51之翹曲,一面減輕捲繞體50之輸送、設置等之困難度。Against this background, in a particularly preferred form of the present embodiment, by making the length of the metal plate 51 of the winding body 50 at least 200 m or more, while making the thickness T of the metal plate 51 30 m or less, and Reduce the weight of the metal plate 51. In addition, by setting the outer diameter R2 of the shaft member 52 to 300 mm or less, the weight of the entire wound body 50 is reduced. In addition, since the thickness T of the metal plate 51 is 30 μm or less, even when the outer diameter R2 of the shaft member 52 is 125 mm or 150 mm, the remaining warpage of the metal plate 51 can be suppressed. In addition, since the weight of the metal plate 51 is reduced, the required strength or rigidity of the shaft member 52 becomes low. Therefore, a hollow member can be used as the shaft member 52. Further, as the material constituting the shaft member 52, a resin lighter than metal such as phenol resin can be used. As a result, the weight of the entire wound body 50 can be further reduced. For example, it can be set to 70 kg or less or 50 kg or less. This situation can reduce the difficulty of conveyance and installation of the winding body 50. For example, the step of installing the winding body 50 in the manufacturing device 70 may be performed by a two-person operator without using a conveying device such as a stacker. This makes it possible to reduce the area of the manufacturing apparatus 70 compared to the previous manufacturing apparatus that uses the conveying apparatus to install the winding body 50. In this way, according to the particularly preferable form of the present embodiment, the warpage of the metal plate 51 can be suppressed, and the difficulty of transportation and installation of the winding body 50 can be reduced.

作為測定捲繞體50之重量之器具,使用預先載置有設置捲繞體50之治具之大型重量計。As an instrument for measuring the weight of the winding body 50, a large-scale weight scale in which a jig provided with the winding body 50 is placed in advance is used.

於本實施之特佳之形態中,捲繞於捲繞體50之軸構件52之金屬板51之長度亦可根據金屬板51之厚度T來設定。例如,於金屬板51之厚度T為20 μm以下之情形時,使捲繞於軸構件52之金屬板51之長度為550 m以上650 m以下,於金屬板51之厚度T大於20 μm且為30 μm以下之情形時,亦可使捲繞於軸構件52之金屬板51之長度為350 m以上450 m以下。藉此,可使捲繞於軸構件52之金屬板51之重量為約50 kg。In a particularly preferable form of the present embodiment, the length of the metal plate 51 of the shaft member 52 wound around the winding body 50 can also be set according to the thickness T of the metal plate 51. For example, when the thickness T of the metal plate 51 is 20 μm or less, the length of the metal plate 51 wound around the shaft member 52 is 550 m or more and 650 m or less, and the thickness T of the metal plate 51 is more than 20 μm and is In the case of 30 μm or less, the length of the metal plate 51 wound around the shaft member 52 may be 350 m or more and 450 m or less. As a result, the weight of the metal plate 51 wound around the shaft member 52 can be about 50 kg.

其次,實施將以上述方式獲得之蒸鍍罩20焊接於框架15之焊接步驟。藉此,可獲得具備蒸鍍罩20及框架15之蒸鍍罩裝置10。 Next, a welding step of welding the vapor deposition cover 20 obtained in the above manner to the frame 15 is performed. Thereby, the vapor deposition cover device 10 including the vapor deposition cover 20 and the frame 15 can be obtained.

其次,對使用本實施形態之蒸鍍罩20製造有機EL顯示裝置100之方法進行說明。有機EL顯示裝置100之製造方法具備使用蒸鍍罩20於有機EL基板92等基板上蒸鍍著蒸鍍材料98之蒸鍍步驟。於蒸鍍步驟中,首先,以蒸鍍罩20與有機EL基板92對向之方式配置蒸鍍罩裝置10。又,使用磁鐵93使蒸鍍罩20密接於有機EL基板92。又,使蒸鍍裝置90之內部為真空氣氛。於該狀態下,藉由使蒸鍍材料98蒸發後經由蒸鍍罩20向有機EL基板92飛來,可以與蒸鍍罩20之貫通孔25對應之圖案使蒸鍍材料98附著於有機EL基板92。Next, a method of manufacturing the organic EL display device 100 using the vapor deposition cover 20 of this embodiment will be described. The manufacturing method of the organic EL display device 100 includes a vapor deposition step in which a vapor deposition material 98 is vapor deposited on a substrate such as an organic EL substrate 92 using a vapor deposition cover 20. In the vapor deposition step, first, the vapor deposition cover device 10 is arranged so that the vapor deposition cover 20 and the organic EL substrate 92 face each other. In addition, the vapor deposition cover 20 is closely adhered to the organic EL substrate 92 using the magnet 93. In addition, the inside of the vapor deposition apparatus 90 is vacuum atmosphere. In this state, by evaporating the vapor deposition material 98 and flying toward the organic EL substrate 92 through the vapor deposition cover 20, the pattern corresponding to the through hole 25 of the vapor deposition cover 20 can adhere the vapor deposition material 98 to the organic EL substrate 92.

再者,能夠對上述實施形態增加各種變更。以下,根據需要一面參照圖式,一面對變化例進行說明。於以下之說明及以下之說明中所使用之圖式中,對可與上述實施形態相同地構成之部分使用與對上述實施形態中之對應之部分使用之符號相同之符號,並省略重複之說明。又,亦有於明確於上述實施形態中可獲得之作用效果於變化例中亦可獲得之情形時,亦省略其說明之情況。Furthermore, various changes can be added to the above-mentioned embodiment. Hereinafter, as necessary, referring to the drawings, a description will be given of the modified examples. In the following description and the drawings used in the following description, the same symbols as those used for the corresponding parts in the above embodiment are used for the parts that can be constructed in the same manner as in the above embodiment, and repeated descriptions are omitted. . In addition, when it is clarified that the operational effects that can be obtained in the above-described embodiment can be obtained in the modified example, the description thereof is also omitted.

於上述實施形態中,表示了於軸構件52形成有中空部之示例。然而,並不限定於此,如圖20所示,亦可不於捲繞體50之軸構件52形成中空部。此種軸構件52係金屬板51之厚度較大,捲繞於軸構件52之金屬板51之總重量較大,因此較佳地用於軸構件52要求較高之剛性之情形時。例如,可用於金屬板51之厚度T大於30 μm且為50 μm以下之情形時。再者,於金屬板51之厚度T為30 μm以下之情形時,例如為10 μm以上30 μm以下之情形時,亦可使用圖20所示之軸構件52。In the above-mentioned embodiment, an example in which the hollow portion is formed in the shaft member 52 is shown. However, it is not limited to this, and as shown in FIG. 20, the hollow member may not be formed on the shaft member 52 of the winding body 50. The thickness of the metal plate 51 of the shaft member 52 is large, and the total weight of the metal plate 51 wound around the shaft member 52 is large. Therefore, it is preferably used when the shaft member 52 requires high rigidity. For example, it can be used when the thickness T of the metal plate 51 is greater than 30 μm and less than 50 μm. In addition, when the thickness T of the metal plate 51 is 30 μm or less, for example, 10 μm or more and 30 μm or less, the shaft member 52 shown in FIG. 20 may be used.

於未於軸構件52形成中空部之情形時,作為構成軸構件52之材料,可使用樹脂、樹脂及纖維之混合物、金屬等。作為樹脂之例,可列舉酚系樹脂、ABS樹脂、聚苯乙烯樹脂、聚乙烯樹脂等。作為樹脂及纖維之混合物,可列舉酚醛紙、纖維強化塑膠(PRP)等。作為金屬之例,可列舉鐵或鐵合金等。In the case where a hollow portion is not formed in the shaft member 52, as a material constituting the shaft member 52, resin, a mixture of resin and fiber, metal, or the like can be used. Examples of the resin include phenol resin, ABS resin, polystyrene resin, and polyethylene resin. Examples of the mixture of resin and fiber include phenolic paper and fiber-reinforced plastic (PRP). Examples of metals include iron and iron alloys.

於未於軸構件52形成中空部之情形時,軸構件52之外徑R2例如為300 mm以上,亦可為350 mm以上。又,於未於軸構件52形成中空部之情形時,軸構件52之外徑R2例如為550 mm以下,亦可為500 mm以下。When the hollow portion is not formed in the shaft member 52, the outer diameter R2 of the shaft member 52 is, for example, 300 mm or more, or 350 mm or more. In addition, when a hollow portion is not formed in the shaft member 52, the outer diameter R2 of the shaft member 52 is, for example, 550 mm or less, or may be 500 mm or less.

即便於未於軸構件52形成中空部之情形時,亦較佳為捲繞體50之重量小至可不使用堆高機等搬運裝置地實施將捲繞體50設置於製造裝置70之步驟之程度。例如,捲繞體50之重量為100 kg以下。於該情形時,例如,可藉由4人之作業者中之2人一面支持軸構件52之一端側,另2人一面支持另一端側,一面搬運捲繞體50,而將捲繞體50設置於製造裝置70。Even when a hollow portion is not formed in the shaft member 52, it is preferable that the weight of the winding body 50 is so small that the step of installing the winding body 50 in the manufacturing device 70 can be performed without using a conveying device such as a stacker . For example, the weight of the winding body 50 is 100 kg or less. In this case, for example, two of the four-person operator can support the one end side of the shaft member 52 while the other two support the other end side while transporting the winding body 50, and the winding body 50 can be transferred. Provided in the manufacturing apparatus 70.

於上述本實施形態中,表示了金屬板51藉由將母材軋壓而獲得之示例。然而,並不限定於此,亦可藉由利用鍍覆處理之製箔步驟,製作具有所期望之厚度之金屬板51。於製箔步驟中,例如,一面使局部地浸漬於鍍覆液之中之不鏽鋼製等之轉筒旋轉,一面於轉筒之表面形成鍍覆膜,將該鍍覆膜剝離,藉此可利用輥對輥製作長條狀之金屬板。於製作包括包含鎳之鐵合金之金屬板之情形時,作為鍍覆液,可使用包含鎳化合物之溶液與包含鐵化合物之溶液之混合溶液。例如,可使用包含胺基磺酸鎳之溶液與包含胺基磺酸鐵之溶液之混合溶液。亦可於鍍覆液包含添加劑。作為添加劑之例,可列舉作為緩衝劑發揮功能之硼酸、作為平滑材發揮功能之糖精或丙二酸、作為界面活性劑發揮功能之十二烷基硫酸鈉等。In the present embodiment described above, an example in which the metal plate 51 is obtained by rolling the base material is shown. However, it is not limited to this, and a metal plate 51 having a desired thickness may be produced by a foil-making step using a plating process. In the foil-making step, for example, while rotating a drum made of stainless steel or the like partially immersed in the plating solution, a plating film is formed on the surface of the drum, and the plating film is peeled off, which can be used Roll-to-roll production of long metal plates. In the case of manufacturing a metal plate including an iron alloy containing nickel, as the plating solution, a mixed solution of a solution containing a nickel compound and a solution containing an iron compound can be used. For example, a mixed solution of a solution containing nickel sulfamate and a solution containing iron sulfamate can be used. The plating solution may contain additives. Examples of additives include boric acid that functions as a buffer, saccharin or malonic acid that functions as a smoothing material, and sodium lauryl sulfate that functions as a surfactant.

其次,亦可對以此方式獲得之金屬板51實施上述退火步驟。又,於退火步驟之前或之後,亦可實施為了將金屬板51之寬度調整為所期望之寬度而將金屬板51之兩端切掉之上述切割步驟。Secondly, the above-mentioned annealing step may also be performed on the metal plate 51 obtained in this way. In addition, before or after the annealing step, the above-mentioned cutting step of cutting off both ends of the metal plate 51 in order to adjust the width of the metal plate 51 to a desired width may be performed.

於利用鍍覆處理製作金屬板51之情形時,亦與上述本實施形態之情形時相同地,於具有150 mm以上且550 mm以下之外徑R2之軸構件52捲繞金屬板51製作捲繞體50。藉此,可抑制起因於將金屬板51捲繞於軸構件52之翹曲殘留於自軸構件52捲出之金屬板51或蒸鍍罩20。When the metal plate 51 is produced by the plating process, the metal plate 51 is wound around the shaft member 52 having the outer diameter R2 of 150 mm or more and 550 mm or less, as in the case of the above-described embodiment.体50。 50. With this, it is possible to suppress that the warpage caused by winding the metal plate 51 around the shaft member 52 remains in the metal plate 51 or the vapor deposition cover 20 rolled out from the shaft member 52.

於上述本實施形態中,表示了軸構件52為具有內徑R1之中空狀構件之示例。於該情形時,軸構件52之內徑R1如圖22所示,亦可跨軸構件52之軸向而固定。換言之,於與軸構件52之軸向正交之方向上,軸構件52之中空部52c之尺寸亦可固定。或者,如圖23所示,軸構件52之內徑R1亦可根據軸構件52之軸向上之位置而變化。例如,如圖23所示,軸構件52亦可包含隨著自軸向上之軸構件52之端部朝向中心而內徑R1增加之部分。In the present embodiment described above, the shaft member 52 is an example of a hollow member having an inner diameter R1. In this case, as shown in FIG. 22, the inner diameter R1 of the shaft member 52 may be fixed across the axial direction of the shaft member 52. In other words, in the direction orthogonal to the axial direction of the shaft member 52, the size of the hollow portion 52c of the shaft member 52 can also be fixed. Alternatively, as shown in FIG. 23, the inner diameter R1 of the shaft member 52 may be changed according to the axial position of the shaft member 52. For example, as shown in FIG. 23, the shaft member 52 may include a portion where the inner diameter R1 increases from the end of the shaft member 52 in the axial direction toward the center.

又,如圖24所示,軸構件52亦可包含外周部52a與間隔壁52b。外周部52a為軸構件52中沿著軸向擴展且與金屬板51相接之部分。外周部52a規定軸構件52之內徑R1及外徑R2。間隔壁52b為軸構件52中於軸構件52之半徑方向上位於外周部52a之內側,且於與軸向正交之方向上將中空部52c橫穿之部分。於圖24所示之例中,亦藉由軸構件52具有中空部52c,可降低軸構件52之重量。藉此,可使捲繞體50之處理容易化。又,藉由軸構件52具有間隔壁52b,可提高軸構件52之剛性。藉此,可抑制起因於軸構件52之自重或金屬板51之重量而軸構件52變形或破損。Moreover, as shown in FIG. 24, the shaft member 52 may include the outer peripheral part 52a and the partition 52b. The outer peripheral portion 52a is a portion of the shaft member 52 that extends in the axial direction and contacts the metal plate 51. The outer peripheral portion 52a defines the inner diameter R1 and the outer diameter R2 of the shaft member 52. The partition wall 52b is a portion of the shaft member 52 that is located inside the outer peripheral portion 52a in the radial direction of the shaft member 52 and traverses the hollow portion 52c in a direction orthogonal to the axial direction. In the example shown in FIG. 24, since the shaft member 52 has the hollow portion 52c, the weight of the shaft member 52 can be reduced. With this, the handling of the wound body 50 can be facilitated. In addition, since the shaft member 52 has the partition wall 52b, the rigidity of the shaft member 52 can be improved. Thereby, deformation or breakage of the shaft member 52 due to the weight of the shaft member 52 or the weight of the metal plate 51 can be suppressed.

圖25係表示沿著圖24之Α-A線切斷之情形時之捲繞體50之一例的剖視圖。如圖25所示,間隔壁52b亦可以於軸構件52之軸向上位於間隔壁52b之一側之中空部52c與位於間隔壁52b之另一側之中空部52c連通之方式構成。FIG. 25 is a cross-sectional view showing an example of the wound body 50 when cut along the line A-A of FIG. 24. As shown in FIG. 25, the partition wall 52b may be formed in such a manner that the hollow portion 52c located on one side of the partition wall 52b in the axial direction of the shaft member 52 communicates with the hollow portion 52c located on the other side of the partition wall 52b.

圖26係表示沿著圖24之Α-A線切斷之情形時之捲繞體50之一例的剖視圖。如圖26所示,間隔壁52b亦可以於軸構件52之軸向上位於間隔壁52b之一側之中空部52c與位於間隔壁52b之另一側之中空部52c由間隔壁52b分離之方式構成。FIG. 26 is a cross-sectional view showing an example of the wound body 50 when cut along the line A-A of FIG. 24. As shown in FIG. 26, the partition wall 52b may be formed in such a manner that the hollow portion 52c located on one side of the partition wall 52b and the hollow portion 52c located on the other side of the partition wall 52b in the axial direction of the shaft member 52 are separated by the partition wall 52b .

於上述本實施形態中,表示了捆包體55具備下部57、側部58及上部59之示例,但捆包體55之構成為任意。例如,如圖27所示,捆包體55亦可具備位於捲繞體50之側方且支持軸構件52之一對側部58,但不具備下部57及上部59。又,如圖28所示,捆包體55亦可具備位於捲繞體50之側方且支持軸構件52之一對側部58及自上方覆蓋捲繞體50之上部59,但不具備下部57。於圖27所示之例及圖28所示之例之任一者中,均較佳為側部58以捲繞體50之金屬板51位於較側部58之下端58b靠上方之方式支持軸構件52。藉此,可抑制金屬板51產生變形或破損。In the present embodiment described above, the example in which the packaging body 55 includes the lower portion 57, the side portion 58, and the upper portion 59 is shown, but the configuration of the packaging body 55 is arbitrary. For example, as shown in FIG. 27, the packing body 55 may include a pair of side portions 58 located on the side of the winding body 50 and supporting the shaft member 52, but does not include the lower portion 57 and the upper portion 59. Furthermore, as shown in FIG. 28, the packing body 55 may also include a pair of side portions 58 located on the side of the winding body 50 and supporting the shaft member 52, and covering the upper portion 59 of the winding body 50 from above, but not including a lower portion 57. In either the example shown in FIG. 27 or the example shown in FIG. 28, it is preferable that the side portion 58 supports the shaft in such a manner that the metal plate 51 of the winding body 50 is located above the lower end 58b of the side portion 58 Member 52. This can suppress deformation or damage of the metal plate 51.

如圖28所示,亦可於上部59產生起因於上部59之自重或上部59之柔軟性之撓曲等變形。上部59例如亦可包含包括塑膠(vinyl)等塑膠材料之膜。此種上部59亦可於圖10A及圖10B所示之具備下部57、側部58及上部59之捆包體55中採用。As shown in FIG. 28, the upper portion 59 may also be deformed due to the weight of the upper portion 59 or the flexibility of the upper portion 59. The upper portion 59 may also include a film including plastic materials such as plastic. Such an upper part 59 can also be used in the package body 55 provided with the lower part 57, the side part 58, and the upper part 59 shown in FIGS. 10A and 10B.

於上述本實施形態中,表示了捆包體55之下部57、側部58及上部59分別由個別之構件構成之示例。然而,並不限定於此,如圖29所示,下部57與側部58亦可一體地構成。例如,下部57之至少一部分與側部58之至少一部分亦可藉由將一片強化瓦楞紙板等一系列之構件藉由彎折等變形而構成。又,上部59與側部58亦可一體地構成。In the present embodiment described above, the example in which the lower portion 57, the side portion 58 and the upper portion 59 of the packing body 55 are each constituted by individual members is shown. However, it is not limited to this, and as shown in FIG. 29, the lower portion 57 and the side portion 58 may be integrally configured. For example, at least a portion of the lower portion 57 and at least a portion of the side portion 58 may be formed by deforming a series of members such as a piece of reinforced corrugated cardboard by bending or the like. In addition, the upper portion 59 and the side portion 58 may be integrally configured.

圖30係表示捆包體55之一變化例之剖視圖。捆包體55亦可具備位於容器56之內部之環境調整劑60。作為環境調整劑60之例,可列舉捕捉容器56之內部之氧之脫氧劑、捕捉容器56之內部之水分之乾燥劑等。FIG. 30 is a cross-sectional view showing a modified example of the packing body 55. FIG. The packaging body 55 may also include an environmental regulator 60 located inside the container 56. Examples of the environment regulator 60 include a deoxidizer that captures oxygen in the container 56 and a desiccant that captures moisture in the container 56.

乾燥劑例如為矽膠。藉由乾燥劑吸附容器56之內部之水分,可維持容器56之內部之氣氛之乾燥狀態。藉由該情況,可抑制金屬板51或軸構件52因水分而變質。The desiccant is, for example, silicone rubber. By adsorbing the moisture inside the container 56 by the desiccant, the dry state of the atmosphere inside the container 56 can be maintained. In this case, the metal plate 51 or the shaft member 52 can be prevented from being deteriorated due to moisture.

環境調整劑60亦可包含脫氧劑或乾燥劑之任一者,亦可包含兩者。The environmental regulator 60 may contain either a deoxidizer or a desiccant, or both.

容器56之內部亦可減壓為低於大氣壓之壓力。又,亦可於容器56之內部,填充氮氣等惰性氣體或非還原氣體。容器56之內部中之氮氣等惰性氣體或非還原氣體之濃度亦可為85%以上、90%以上、或95%以上。 [實施例]The inside of the container 56 may also be depressurized to a pressure lower than atmospheric pressure. Furthermore, the interior of the container 56 may be filled with an inert gas such as nitrogen or non-reducing gas. The concentration of inert gas or non-reducing gas such as nitrogen in the interior of the container 56 may also be 85% or more, 90% or more, or 95% or more. [Example]

其次,藉由實施例對上述實施形態更具體地進行說明,但實施形態只要不超過主旨,則並不受以下之實施例之記載限定。Next, the above embodiment will be described more specifically by way of examples, but the embodiments are not limited by the description of the following examples as long as they do not exceed the gist.

首先,分別準備具有50 mm、75 mm、100 mm、125 mm、150 mm、200 mm、250 mm、300 mm、400 mm、500 mm及600 mm之外徑R2之軸構件52。作為軸構件52,使用包含紙與酚系樹脂之混合物之中空狀之構件。軸構件52之外徑R2與內徑R1之差為10 mm。作為測定軸構件52之外徑R2之器具,使用測量儀。First, a shaft member 52 having an outer diameter R2 of 50 mm, 75 mm, 100 mm, 125 mm, 150 mm, 200 mm, 250 mm, 300 mm, 400 mm, 500 mm, and 600 mm, respectively, is prepared. As the shaft member 52, a hollow member containing a mixture of paper and phenol resin is used. The difference between the outer diameter R2 and the inner diameter R1 of the shaft member 52 is 10 mm. As an instrument for measuring the outer diameter R2 of the shaft member 52, a measuring instrument is used.

又,分別準備具有8 μm、10 μm、13 μm、15 μm、18 μm、20 μm、25 μm、30 μm、35 μm、40 μm、50 μm及100 μm之厚度T之金屬板51。作為金屬板51之材料,使用包含34質量%之鎳之鐵合金。作為測定金屬板51之厚度T之器具,使用具備球套引導式之柱塞之HEIDENHAIN公司製造之長度計HEIDENHAIM-METRO之「MT1271」。長度方向F1上之各金屬板51之長度均為200 m,寬度方向F2上之各金屬板51之尺寸W1均為500 mm。所準備之各厚度之金屬板51之數量與軸構件52之外徑R2之種類之數量對應。In addition, metal plates 51 having thickness T of 8 μm, 10 μm, 13 μm, 15 μm, 18 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 50 μm, and 100 μm are prepared, respectively. As a material of the metal plate 51, an iron alloy containing 34% by mass of nickel is used. As an instrument for measuring the thickness T of the metal plate 51, "MT1271" of a length gauge HEIDENHAIM-METRO manufactured by HEIDENHAIN Corporation equipped with a ball-guided plunger is used. The length of each metal plate 51 in the longitudinal direction F1 is 200 m, and the size W1 of each metal plate 51 in the width direction F2 is 500 mm. The number of metal plates 51 of each thickness prepared corresponds to the number of types of the outer diameter R2 of the shaft member 52.

繼而,將具有上述各種厚度T之金屬板51分別捲繞於具有上述各種外徑R2之軸構件52製作捲繞體50。繼而,測定捲繞體50之重量。作為測定捲繞體50之重量之器具,使用預先載置有設置捲繞體50之治具之大型重量計。繼而,將各捲繞體50於溫度25℃、濕度55℃之環境下保管30天。然後,將金屬板51自各捲繞體50捲出,製作上述試驗片66。長度方向F1上之試驗片66之尺寸L1為500 mm,寬度方向F2上之試驗片66之尺寸L2為500 mm。Next, the metal plate 51 having the above-mentioned various thicknesses T is wound around the shaft member 52 having the above-mentioned various outer diameters R2 to produce the wound body 50. Then, the weight of the winding body 50 was measured. As an instrument for measuring the weight of the winding body 50, a large-scale weight scale in which a jig provided with the winding body 50 is placed in advance is used. Then, each wound body 50 was stored for 30 days in an environment with a temperature of 25°C and a humidity of 55°C. Then, the metal plate 51 is unwound from each winding body 50 to produce the test piece 66 described above. The size L1 of the test piece 66 in the longitudinal direction F1 is 500 mm, and the size L2 of the test piece 66 in the width direction F2 is 500 mm.

繼而,實施圖11及圖12所示之測定方法,測定自各捲繞體50取出之試驗片66與被附著體67之鉛直面67a之間之間隙S1。將結果示於圖21。於圖21中,於與特定之厚度T與外徑R2之組合對應之單元中與間隙S1為15 mm以下之組合對應的單元,顯示「A1」或「A2」。又,於與間隙S1超過15 mm且為20 mm以下之組合對應之單元,顯示「B」。又,於間隙S1超過20 mm之單元,顯示「C」。於將閾值設定為20 mm實施基於間隙S1之值判定試驗片66之合格與否之判定步驟之情形時,「A1」、「A2」及「B」表示合格,「C」表示不合格。「A1」及「A2」係基於捲繞體50之重量之測定結果之分類。「A1」表示捲繞體50之重量為70 kg以下,「A2」表示捲繞體50之重量超過70 kg。若考慮捲繞體50之搬運之容易度,則較佳為捲繞體50之重量為70 kg以下。因此,「A1」為最佳之結果,「A2」為僅次於「A1」之較佳之結果,「B」為僅次於「A2」之較佳之結果。Then, the measurement method shown in FIGS. 11 and 12 was implemented, and the gap S1 between the test piece 66 taken out from each winding body 50 and the vertical surface 67a of the adherend 67 was measured. The results are shown in Figure 21. In FIG. 21, among the cells corresponding to the combination of the specific thickness T and the outer diameter R2, the cell corresponding to the combination of the gap S1 of 15 mm or less displays "A1" or "A2". In addition, "B" is displayed on the cell corresponding to the combination where the gap S1 exceeds 15 mm and is 20 mm or less. In addition, "C" is displayed in the cell where the gap S1 exceeds 20 mm. When the threshold value is set to 20 mm and the judgment step of judging the pass or fail of the test piece 66 based on the value of the gap S1 is performed, "A1", "A2" and "B" indicate pass, and "C" indicates pass. "A1" and "A2" are classifications based on the measurement results of the weight of the winding body 50. "A1" indicates that the weight of the wound body 50 is 70 kg or less, and "A2" indicates that the weight of the wound body 50 exceeds 70 kg. Considering the ease of handling the wound body 50, the weight of the wound body 50 is preferably 70 kg or less. Therefore, "A1" is the best result, "A2" is the better result after "A1", and "B" is the better result after "A2".

如圖21所示,於金屬板51之厚度T為50 μm以下,且軸構件52之外徑R2為150 mm以上之情形時,間隙S1為15 mm以下。又,於金屬板51之厚度T為30 μm以下,且軸構件52之外徑R2為125 mm以上之情形時,間隙S1亦為15 mm以下。As shown in FIG. 21, when the thickness T of the metal plate 51 is 50 μm or less and the outer diameter R2 of the shaft member 52 is 150 mm or more, the gap S1 is 15 mm or less. In addition, when the thickness T of the metal plate 51 is 30 μm or less and the outer diameter R2 of the shaft member 52 is 125 mm or more, the gap S1 is also 15 mm or less.

又,如圖21所示,於金屬板51之厚度T為10 μm以下,且軸構件52之外徑R2為100 mm以上300 mm以下之情形時,間隙S1為15 mm以下,且捲繞體50之重量為70 kg以下。 又,於金屬板51之厚度T為15 μm以下,且軸構件52之外徑R2為125 mm以上300 mm以下之情形時,間隙S1為15 mm以下,且捲繞體50之重量為70 kg以下。 又,於金屬板51之厚度T為25 μm以下,且軸構件52之外徑R2為125 mm以上280 mm以下之情形時,間隙S1為15 mm以下,且捲繞體50之重量為70 kg以下。 又,於金屬板51之厚度T為30 μm以下,且軸構件52之外徑R2為125 mm以上250 mm以下之情形時,間隙S1為15 mm以下,且捲繞體50之重量為70 kg以下。 又,於金屬板51之厚度T為35 μm以下,且軸構件52之外徑R2為150 mm以上250 mm以下之情形時,間隙S1為15 mm以下,且捲繞體50之重量為70 kg以下。 又,於金屬板51之厚度T為50 μm以下,且軸構件52之外徑R2為150 mm以上200 mm以下之情形時,間隙S1為15 mm以下,且捲繞體50之重量為70 kg以下。Also, as shown in FIG. 21, when the thickness T of the metal plate 51 is 10 μm or less and the outer diameter R2 of the shaft member 52 is 100 mm or more and 300 mm or less, the gap S1 is 15 mm or less, and the wound body The weight of 50 is below 70 kg. In addition, when the thickness T of the metal plate 51 is 15 μm or less, and the outer diameter R2 of the shaft member 52 is 125 mm or more and 300 mm or less, the gap S1 is 15 mm or less, and the weight of the wound body 50 is 70 kg the following. In addition, when the thickness T of the metal plate 51 is 25 μm or less, and the outer diameter R2 of the shaft member 52 is 125 mm or more and 280 mm or less, the gap S1 is 15 mm or less, and the weight of the wound body 50 is 70 kg the following. In addition, when the thickness T of the metal plate 51 is 30 μm or less, and the outer diameter R2 of the shaft member 52 is 125 mm or more and 250 mm or less, the gap S1 is 15 mm or less, and the weight of the wound body 50 is 70 kg the following. In addition, when the thickness T of the metal plate 51 is 35 μm or less, and the outer diameter R2 of the shaft member 52 is 150 mm or more and 250 mm or less, the gap S1 is 15 mm or less, and the weight of the wound body 50 is 70 kg the following. In addition, when the thickness T of the metal plate 51 is 50 μm or less, and the outer diameter R2 of the shaft member 52 is 150 mm or more and 200 mm or less, the gap S1 is 15 mm or less, and the weight of the wound body 50 is 70 kg the following.

10‧‧‧蒸鍍罩裝置 15‧‧‧框架 17a‧‧‧第1耳部 17b‧‧‧第2耳部 18‧‧‧中間部 20‧‧‧蒸鍍罩 20a‧‧‧第1面 20b‧‧‧第2面 20e‧‧‧第1端部 20f‧‧‧第2端部 22‧‧‧有效區域 23‧‧‧周圍區域 25‧‧‧貫通孔 30‧‧‧第1凹部 31‧‧‧第1凹部30之壁面 35‧‧‧第2凹部 36‧‧‧第2凹部35之壁面 41‧‧‧連接部 42‧‧‧貫通部 43‧‧‧頂部 50‧‧‧捲繞體 51‧‧‧金屬板 51a‧‧‧金屬板51之第1面 51b‧‧‧金屬板51之第2面 51e‧‧‧第1端部 51f‧‧‧第2端部 52‧‧‧軸構件 52a‧‧‧外周部 52b‧‧‧間隔壁 52c‧‧‧中空部 53a、53b‧‧‧抗蝕膜 53c、53d‧‧‧抗蝕圖案 54‧‧‧樹脂 55‧‧‧捆包體 56‧‧‧容器 57‧‧‧下部 58‧‧‧側部 58a‧‧‧貫通孔 58b‧‧‧側部58之下端 59‧‧‧上部 60‧‧‧環境調整劑 61‧‧‧軋壓裝置 61a、61b‧‧‧軋壓輥 62‧‧‧芯 63‧‧‧退火裝置 66‧‧‧試驗片 67‧‧‧被附著體 67a‧‧‧鉛直面 68‧‧‧檢查台 68a‧‧‧水平面 70‧‧‧製造裝置 71‧‧‧抗蝕膜形成裝置 72‧‧‧曝光、顯影裝置 73‧‧‧蝕刻裝置 74‧‧‧剝膜裝置 75‧‧‧分離裝置 90‧‧‧蒸鍍裝置 92‧‧‧有機EL基板 93‧‧‧磁鐵 94‧‧‧坩堝 96‧‧‧加熱器 98‧‧‧蒸鍍材料 100‧‧‧有機EL顯示裝置 510‧‧‧母材 D1‧‧‧第1方向 D2‧‧‧第2方向 F1‧‧‧長度方向 F2‧‧‧寬度方向 L1‧‧‧長度方向F1上之試驗片66之尺寸 L2‧‧‧寬度方向F2上之試驗片66之尺寸 M1‧‧‧直線 N‧‧‧ 蒸鍍罩20之法線方向 r‧‧‧貫通部42之尺寸 R1‧‧‧內徑 R2‧‧‧軸構件52之外徑 R3‧‧‧捲繞於軸構件52之金屬板51之外徑 S1‧‧‧間隙 S2‧‧‧間隙 T‧‧‧蒸鍍罩20之厚度 W1‧‧‧與金屬板51之長度方向F1正交之寬度方向F2上之金屬板51之尺寸 W2‧‧‧寬度方向F2上之軸構件52之尺寸 θ1‧‧‧最小角度 α‧‧‧凸緣部之寬度 β‧‧‧頂部43之寬度10‧‧‧Evaporation cover device 15‧‧‧frame 17a‧‧‧1st ear 17b‧‧‧ 2nd ear 18‧‧‧Middle 20‧‧‧Evaporation cover 20a‧‧‧The first side 20b‧‧‧The second side 20e‧‧‧1st end 20f‧‧‧2nd end 22‧‧‧effective area 23‧‧‧ surrounding area 25‧‧‧Through hole 30‧‧‧The first recess 31‧‧‧The wall surface of the first recess 30 35‧‧‧Second recess 36‧‧‧The wall surface of the second recess 35 41‧‧‧ Connection 42‧‧‧Penetration Department 43‧‧‧Top 50‧‧‧wound body 51‧‧‧Metal plate 51a‧‧‧The first side of metal plate 51 51b‧‧‧The second side of the metal plate 51 51e‧‧‧1st end 51f‧‧‧2nd end 52‧‧‧Shaft member 52a‧‧‧Outer periphery 52b‧‧‧ partition 52c‧‧‧Hollow Department 53a, 53b‧‧‧ resist film 53c, 53d‧‧‧ resist pattern 54‧‧‧Resin 55‧‧‧Packing body 56‧‧‧Container 57‧‧‧Lower 58‧‧‧Side 58a‧‧‧Through hole 58b‧‧‧Side 58 lower end 59‧‧‧Upper 60‧‧‧Environmental Regulator 61‧‧‧Rolling device 61a、61b‧‧‧Rolling roller 62‧‧‧Core 63‧‧‧Annealing device 66‧‧‧Test piece 67‧‧‧ Attached 67a‧‧‧straight face 68‧‧‧Examination table 68a‧‧‧horizontal 70‧‧‧Manufacturing device 71‧‧‧resist film forming device 72‧‧‧Exposure and development device 73‧‧‧Etching device 74‧‧‧Film stripping device 75‧‧‧ Separating device 90‧‧‧Evaporation equipment 92‧‧‧ organic EL substrate 93‧‧‧Magnet 94‧‧‧Crucible 96‧‧‧heater 98‧‧‧Evaporation material 100‧‧‧ organic EL display device 510‧‧‧ base material D1‧‧‧First direction D2‧‧‧ 2nd direction F1‧‧‧ length direction F2‧‧‧Width direction L1‧‧‧The size of the test piece 66 in the longitudinal direction F1 L2‧‧‧Dimension of test piece 66 in width direction F2 M1‧‧‧Straight N‧‧‧ Normal direction of the vapor deposition cover 20 r‧‧‧The size of the through part 42 R1‧‧‧Inner diameter R2‧‧‧Outer diameter of shaft member 52 R3‧‧‧Outer diameter of the metal plate 51 wound around the shaft member 52 S1‧‧‧Gap S2‧‧‧Gap T‧‧‧thickness of evaporation cover 20 W1‧‧‧Dimension of the metal plate 51 in the width direction F2 orthogonal to the longitudinal direction F1 of the metal plate 51 W2‧‧‧Dimension of shaft member 52 in width direction F2 θ1‧‧‧minimum angle α‧‧‧Width of flange β‧‧‧Top 43 width

圖1係表示具備一實施形態之蒸鍍罩裝置之蒸鍍裝置之圖。 圖2係表示使用圖1所示之蒸鍍罩裝置製造之有機EL顯示裝置之剖視圖。 圖3係表示一實施形態之蒸鍍罩裝置之俯視圖。 圖4係表示圖3所示之蒸鍍罩之有效區域之局部俯視圖。 圖5係沿著圖4之V-V線之剖視圖。 圖6係表示將母材軋壓獲得具有所期望之厚度之金屬板之步驟的圖。 圖7係表示將藉由軋壓所獲得之金屬板退火之步驟之圖。 圖8係表示具備捲繞於軸構件之金屬板之捲繞體之立體圖。 圖9係捲繞體之剖視圖。 圖10A係表示收容於容器之捲繞體之立體圖。 圖10B係沿著圖10A之XB-XB線之剖視圖。 圖11係表示測定產生於金屬板之翹曲之方法之圖。 圖12係表示自箭頭XII之方向觀察圖11之金屬板之情形時的圖。 圖13係用以整體地說明蒸鍍罩之製造方法之一例之模式圖。 圖14係表示於金屬板上設置抗蝕膜之步驟之圖。 圖15係表示將抗蝕膜圖案化之步驟之圖。 圖16係表示第1面蝕刻步驟之圖。 圖17係表示第2面蝕刻步驟之圖。 圖18係表示蒸鍍罩之檢查步驟之一例之圖。 圖19係表示自箭頭XIX之方向觀察圖18之蒸鍍罩之情形時的圖。 圖20係表示捲繞體之一變化例之剖視圖。 圖21係表示實施例中之金屬板之翹曲之評估結果的圖。 圖22係表示於與軸構件之軸向平行且通過軸構件之軸線之平面切斷之情形時之捲繞體之一例的剖視圖。 圖23係表示於與軸構件之軸向平行且通過軸構件之軸線之平面切斷之情形時之捲繞體之一例的剖視圖。 圖24係表示於與軸構件之軸向平行且通過軸構件之軸線之平面切斷之情形時之捲繞體之一例的剖視圖。 圖25係表示沿著圖24之Α-A線切斷之情形時之捲繞體之一例的剖視圖。 圖26係表示沿著圖24之Α-A線切斷之情形時之捲繞體之一例的剖視圖。 圖27係表示捆包體之一變化例之剖視圖。 圖28係表示捆包體之一變化例之剖視圖。 圖29係表示捆包體之一變化例之剖視圖。 圖30係表示捆包體之一變化例之剖視圖。FIG. 1 is a view showing a vapor deposition apparatus provided with a vapor deposition hood apparatus of an embodiment. 2 is a cross-sectional view showing an organic EL display device manufactured using the vapor deposition cover device shown in FIG. 1. Fig. 3 is a plan view showing a vapor deposition hood apparatus of an embodiment. 4 is a partial plan view showing the effective area of the vapor deposition mask shown in FIG. 3. FIG. 5 is a cross-sectional view taken along line V-V of FIG. 4. FIG. 6 is a diagram showing a step of rolling a base material to obtain a metal plate having a desired thickness. FIG. 7 is a diagram showing the steps of annealing the metal plate obtained by rolling. FIG. 8 is a perspective view showing a wound body provided with a metal plate wound around a shaft member. 9 is a cross-sectional view of the winding body. FIG. 10A is a perspective view showing a wound body accommodated in a container. FIG. 10B is a cross-sectional view taken along line XB-XB of FIG. 10A. Fig. 11 is a diagram showing a method of measuring warpage caused by a metal plate. FIG. 12 is a view showing the metal plate of FIG. 11 viewed from the direction of arrow XII. FIG. 13 is a schematic diagram for explaining one example of a method of manufacturing a vapor deposition mask as a whole. 14 is a diagram showing the steps of providing a resist film on a metal plate. FIG. 15 is a diagram showing the steps of patterning the resist film. FIG. 16 is a diagram showing the first surface etching step. FIG. 17 is a diagram showing a second surface etching step. FIG. 18 is a diagram showing an example of the inspection procedure of the vapor deposition mask. FIG. 19 is a view when the vapor deposition cover of FIG. 18 is viewed from the direction of arrow XIX. 20 is a cross-sectional view showing a modified example of the winding body. 21 is a graph showing the evaluation results of the warpage of the metal plate in the examples. 22 is a cross-sectional view showing an example of a wound body when it is parallel to the axial direction of the shaft member and cut by a plane passing through the axis of the shaft member. 23 is a cross-sectional view showing an example of a wound body when it is parallel to the axial direction of the shaft member and cut by a plane passing through the axis of the shaft member. 24 is a cross-sectional view showing an example of a wound body when it is parallel to the axial direction of the shaft member and cut by a plane passing through the axis of the shaft member. FIG. 25 is a cross-sectional view showing an example of the wound body when cut along the line A-A of FIG. 24. FIG. 26 is a cross-sectional view showing an example of the wound body when cut along the line A-A of FIG. 24. Fig. 27 is a cross-sectional view showing a modified example of the packing body. Fig. 28 is a cross-sectional view showing a modified example of the packing body. Fig. 29 is a cross-sectional view showing a modified example of the packing body. Fig. 30 is a cross-sectional view showing a modified example of the packing body.

50‧‧‧捲繞體 50‧‧‧wound body

51‧‧‧金屬板 51‧‧‧Metal plate

52‧‧‧軸構件 52‧‧‧Shaft member

F2‧‧‧寬度方向 F2‧‧‧Width direction

W1‧‧‧與金屬板51之長度方向F1正交之寬度方向F2上之金屬板51之尺寸 W1‧‧‧Dimension of the metal plate 51 in the width direction F2 orthogonal to the longitudinal direction F1 of the metal plate 51

W2‧‧‧寬度方向F2上之軸構件52之尺寸 W2‧‧‧Dimension of shaft member 52 in width direction F2

Claims (20)

一種捲繞體,其係用以製造蒸鍍罩之金屬板之捲繞體,且具備: 軸構件,其具有150 mm以上且550 mm以下之外徑;及 上述金屬板,其捲繞於上述軸構件,且具有50 μm以下之厚度。A winding body, which is a winding body for manufacturing a metal plate of a vapor deposition cover, and is provided with: Shaft member with an outer diameter of 150 mm or more and 550 mm or less; and The metal plate is wound around the shaft member and has a thickness of 50 μm or less. 如請求項1之捲繞體,其中上述金屬板具有含有30質量%以上且54質量%以下之鎳之鐵合金。The wound body according to claim 1, wherein the metal plate has an iron alloy containing 30% by mass or more and 54% by mass or less of nickel. 如請求項1或2之捲繞體,其中上述軸構件之外徑為300 mm以下, 上述金屬板之厚度為30 μm以下。If the winding body of claim 1 or 2, wherein the outer diameter of the shaft member is 300 mm or less, The thickness of the metal plate is 30 μm or less. 如請求項3之捲繞體,其中上述捲繞體之重量為70 kg以下。The winding body according to claim 3, wherein the weight of the above winding body is 70 kg or less. 如請求項3或4之捲繞體,其中上述軸構件包含酚系樹脂。The wound body according to claim 3 or 4, wherein the shaft member contains a phenol resin. 如請求項3至5中任一項之捲繞體,其中上述軸構件係具有100 mm以上之內徑之中空狀構件。The wound body according to any one of claims 3 to 5, wherein the shaft member is a hollow member having an inner diameter of 100 mm or more. 如請求項6之捲繞體,其中上述軸構件之外徑與內徑之差為5 mm以上。The wound body according to claim 6, wherein the difference between the outer diameter and the inner diameter of the shaft member is 5 mm or more. 如請求項1或2之捲繞體,其中上述軸構件之外徑為300 mm以上且550 mm以下, 上述金屬板之厚度為50 μm以下。If the winding body of claim 1 or 2, wherein the outer diameter of the shaft member is 300 mm or more and 550 mm or less, The thickness of the metal plate is 50 μm or less. 如請求項8之捲繞體,其中上述捲繞體之重量為100 kg以下。The winding body according to claim 8, wherein the weight of the above winding body is 100 kg or less. 一種捆包體,其具備: 金屬板之捲繞體,其係用以製造蒸鍍罩;及 容器,其收容上述捲繞體;且 上述捲繞體具備: 軸構件,其具有150 mm以上且550 mm以下之外徑;及 上述金屬板,其捲繞於上述軸構件,且具有50 μm以下之厚度。A packing body with: A rolled body of a metal plate, which is used to manufacture a vapor deposition cover; and A container which houses the above-mentioned winding body; and The above winding body has: Shaft member with an outer diameter of 150 mm or more and 550 mm or less; and The metal plate is wound around the shaft member and has a thickness of 50 μm or less. 如請求項10之捆包體,其中上述容器具備支持上述軸構件之側部, 上述側部以上述捲繞體之上述金屬板位於較上述側部之下端更靠上方之方式支持上述軸構件。The packaging body according to claim 10, wherein the container has a side portion supporting the shaft member, The side portion supports the shaft member such that the metal plate of the wound body is located above the lower end of the side portion. 如請求項11之捆包體,其中上述容器具備: 下部,其位於上述捲繞體之下方;及 上述側部,其以上述捲繞體之上述金屬板不與上述下部相接之方式支持上述軸構件。As in the packaged body of claim 11, the above-mentioned container has: The lower part, which is below the above-mentioned winding body; and The side portion supports the shaft member so that the metal plate of the wound body does not contact the lower portion. 如請求項12之捆包體,其中上述容器具備自上方覆蓋上述捲繞體之上部。The packaging body according to claim 12, wherein the container includes an upper portion covering the winding body from above. 如請求項10至13中任一項之捆包體,其具備位於上述容器之內部之脫氧劑或乾燥劑。The packaging body according to any one of claims 10 to 13, which includes a deoxidizer or a desiccant located inside the container. 一種捆包方法,其具備: 準備步驟,其係準備用以製造蒸鍍罩之金屬板之捲繞體;及 收容步驟,其係將上述捲繞體收容於容器;且 上述捲繞體具備: 軸構件,其具有150 mm以上且550 mm以下之外徑;及 上述金屬板,其捲繞於上述軸構件,且具有50 μm以下之厚度。A packing method, which has: Preparation step, which is to prepare the winding body of the metal plate for manufacturing the vapor deposition cover; and An accommodating step, which is to accommodate the winding body in a container; and The above winding body has: Shaft member with an outer diameter of 150 mm or more and 550 mm or less; and The metal plate is wound around the shaft member and has a thickness of 50 μm or less. 如請求項15之捆包方法,其中上述容器具備支持上述軸構件之側部, 上述側部以上述捲繞體之上述金屬板位於較上述側部之下端更靠上方之方式支持上述軸構件。The packing method according to claim 15, wherein the container has a side portion supporting the shaft member, The side portion supports the shaft member such that the metal plate of the wound body is located above the lower end of the side portion. 如請求項16之捆包方法,其中上述容器具備: 下部,其位於上述捲繞體之下方; 上述側部,其以上述捲繞體之上述金屬板不與上述下部相接之方式支持上述軸構件;及 上部,其自上方覆蓋上述捲繞體。According to the packing method of claim 16, the above container is provided with: The lower part, which is located below the winding body; The side portion, which supports the shaft member so that the metal plate of the winding body does not contact the lower portion; and The upper part covers the winding body from above. 一種保管方法,其係保管用以製造蒸鍍罩之金屬板之捲繞體者,且 以捲繞於軸構件之上述金屬板中位於最靠上述軸構件側之部分之內徑成為150 mm以上且550 mm以下之方式保管上述捲繞體。A storage method which stores the winding body of the metal plate used for manufacturing the vapor deposition cover, and The wound body is stored so that the inner diameter of the portion of the metal plate wound on the shaft member that is closest to the shaft member side is 150 mm or more and 550 mm or less. 一種蒸鍍罩之製造方法,其係製造形成有複數個貫通孔之蒸鍍罩之方法,且具備: 自金屬板之捲繞體將上述金屬板捲出之步驟;及 加工步驟,其係對上述金屬板進行蝕刻而於上述金屬板形成上述貫通孔;且 上述捲繞體具備: 軸構件,其具有150 mm以上且550 mm以下之外徑;及 上述金屬板,其捲繞於上述軸構件,且具有50 μm以下之厚度。A method for manufacturing a vapor deposition cover, which is a method for manufacturing a vapor deposition cover formed with a plurality of through holes, and has: The step of rolling out the above metal plate from the winding body of the metal plate; and A processing step of etching the metal plate to form the through hole in the metal plate; and The above winding body has: Shaft member with an outer diameter of 150 mm or more and 550 mm or less; and The metal plate is wound around the shaft member and has a thickness of 50 μm or less. 一種金屬板,其係捲繞於具有150 mm以上且550 mm以下之外徑之軸構件且用以製造蒸鍍罩者,且 具有50 μm以下之厚度。A metal plate which is wound on a shaft member having an outer diameter of 150 mm or more and 550 mm or less and used to manufacture a vapor deposition mask, and It has a thickness below 50 μm.
TW108119941A 2018-06-08 2019-06-10 Winding body of metal plate, packing body provided with winding body, packaging method of winding body, storage method of winding body, manufacturing method of vapor deposition cover using metal plate of winding body, and metal plate TWI782212B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-110608 2018-06-08
JP2018110608 2018-06-08

Publications (2)

Publication Number Publication Date
TW202000948A true TW202000948A (en) 2020-01-01
TWI782212B TWI782212B (en) 2022-11-01

Family

ID=68769195

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108119941A TWI782212B (en) 2018-06-08 2019-06-10 Winding body of metal plate, packing body provided with winding body, packaging method of winding body, storage method of winding body, manufacturing method of vapor deposition cover using metal plate of winding body, and metal plate

Country Status (4)

Country Link
JP (1) JP7317816B2 (en)
CN (2) CN110578119A (en)
TW (1) TWI782212B (en)
WO (1) WO2019235647A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI782212B (en) * 2018-06-08 2022-11-01 日商大日本印刷股份有限公司 Winding body of metal plate, packing body provided with winding body, packaging method of winding body, storage method of winding body, manufacturing method of vapor deposition cover using metal plate of winding body, and metal plate
TWI785762B (en) * 2021-08-26 2022-12-01 達運精密工業股份有限公司 Method of fabricating metal mask and metal mask
CN114850246B (en) * 2022-04-24 2022-11-29 广东嘉元科技股份有限公司 End-type electrothermal electrolytic copper foil anti-warping device and working method thereof

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005255225A (en) 2004-03-12 2005-09-22 Dainippon Printing Co Ltd Tape roll package and manufacturing method thereof
JP2008305492A (en) * 2007-06-07 2008-12-18 Dainippon Printing Co Ltd Method for manufacturing suspension substrate
JP2009137658A (en) * 2007-12-03 2009-06-25 Sumitomo Bakelite Co Ltd Method for continuously manufacturing laminated sheet
JP2015172252A (en) * 2009-11-24 2015-10-01 住友電気工業株式会社 magnesium alloy coil material
JP2012106747A (en) * 2010-11-15 2012-06-07 Asahi Glass Co Ltd Packaging container of roll-shaped article
JP5382257B1 (en) * 2013-01-10 2014-01-08 大日本印刷株式会社 Metal plate, method for producing metal plate, and method for producing vapor deposition mask using metal plate
JP5455099B1 (en) 2013-09-13 2014-03-26 大日本印刷株式会社 Metal plate, metal plate manufacturing method, and mask manufacturing method using metal plate
JP5516816B1 (en) * 2013-10-15 2014-06-11 大日本印刷株式会社 Metal plate, method for producing metal plate, and method for producing vapor deposition mask using metal plate
JP2016030648A (en) * 2014-07-30 2016-03-07 シーアイ化成株式会社 Packing box for rolls
CN106715586A (en) 2014-08-29 2017-05-24 东丽株式会社 Winding core and winding core manufacturing method
CN107849682B (en) * 2016-04-14 2019-04-19 凸版印刷株式会社 Substrate for vapor deposition mask, manufacturing method of substrate for vapor deposition mask, and manufacturing method of vapor deposition mask
TWI782212B (en) * 2018-06-08 2022-11-01 日商大日本印刷股份有限公司 Winding body of metal plate, packing body provided with winding body, packaging method of winding body, storage method of winding body, manufacturing method of vapor deposition cover using metal plate of winding body, and metal plate

Also Published As

Publication number Publication date
JPWO2019235647A1 (en) 2021-07-15
CN210765478U (en) 2020-06-16
JP7317816B2 (en) 2023-07-31
TWI782212B (en) 2022-11-01
WO2019235647A1 (en) 2019-12-12
CN110578119A (en) 2019-12-17

Similar Documents

Publication Publication Date Title
JP6896801B2 (en) Metal plate for manufacturing vapor deposition mask, inspection method of metal plate, manufacturing method of metal plate, vapor deposition mask, vapor deposition mask device and manufacturing method of vapor deposition mask
CN104838037B (en) Metal plate, method of manufacturing metal plate, and method of manufacturing evaporation mask using metal plate
JP7228138B2 (en) Evaporation mask package and evaporation mask packing method
TWI782212B (en) Winding body of metal plate, packing body provided with winding body, packaging method of winding body, storage method of winding body, manufacturing method of vapor deposition cover using metal plate of winding body, and metal plate
JP7628514B2 (en) DEPOSITION MASK PACKAGE AND PACKAGING DEVICE FOR DEPOSITION MASK
JP7478359B2 (en) Metal plate for manufacturing a deposition mask, method for manufacturing a metal plate, deposition mask, method for manufacturing a deposition mask, and deposition mask device including a deposition mask