TW202009439A - Communication-type thermal conduction device and manufacturing method thereof - Google Patents

Abstract

A communication-type thermal conduction device includes a vapor chamber and a heat pipe. The vapor chamber includes a heat conduction chamber and at least one first composite wick. The heat conduction chamber has a recess part. The first composite wick stacks on inner section of the heat conduction chamber. The heat pipe includes a pipe and at least one second composite wick. The pipe stacks on the recess part of the heat conduction chamber. The at least one second composite wick stack on inner section of the pipe. The first composite wick and the at least one second composite wick are combined by a metallic bonding.

Description

Connected heat transfer device and manufacturing method thereof

The invention relates to a heat transfer device, in particular to a communication type heat transfer device which can allow the capillary structure of the temperature equalizing plate and the heat pipe to be connected and communicated with each other.

Regarding the heat transfer, in order to dissipate the heat generated by the heating element, the existing heat transfer devices all use a heat conduction plate and a heat pipe to transfer heat, and use a heat sink (such as fins and fans) to dissipate heat. The general description is as follows: The plate is in contact with the heating element, and the heat pipe is connected between the heat conducting plate and the heat sink to transfer the heat generated by the heating element to the heat conducting plate first, and then the heat conducting plate transfers the heat to the heat sink via the heat pipe to dissipate the heat.

However, in the existing heat transfer device, the heat conduction plate and the heat pipe operate independently, and the capillary structure of the heat conduction plate is not connected to the capillary structure of the heat pipe. As a result, the heat conduction plate or the heat pipe is only the heat conduction plate and the heat pipe. Heat transfer, rather than integral heat transfer, in other words, the heat dissipation effect has not been fully exerted, and the return speed of the liquid working fluid is difficult to effectively increase.

The invention is to provide a connected heat transfer device and a manufacturing method thereof, so that the capillary structure of the heat pipe and the capillary structure of the temperature equalizing plate can communicate with each other, so as to achieve the purpose of integrated heat transfer, and the temperature equalizing plate and the heat pipe should be fully utilized. Some cooling effect.

The connected heat transfer device disclosed in an embodiment of the present invention includes a temperature equalizing plate and a heat pipe. The temperature equalizing plate includes a thermally conductive cavity and at least a first capillary structure. The heat conduction cavity has a bridging recess on the side. At least one first capillary structure is stacked in the heat conduction cavity. The heat pipe includes a pipe body and at least a second capillary structure. The tube body is stacked on the bridging concave portion of the heat conduction cavity. At least one second capillary structure is stacked in the tube body. At least one first capillary structure is connected to at least one second capillary structure by metal bonding.

The connected heat transfer device disclosed in an embodiment of the present invention includes a temperature equalizing plate, a heat pipe, and a bonding layer. The temperature equalizing plate includes a thermally conductive cavity and at least a first capillary structure. The side of the heat conduction cavity has a bridging recess, and at least one first capillary structure is stacked in the heat conduction cavity. The heat pipe includes a pipe body and at least a second capillary structure. The tube body is stacked on the bridging concave portion of the heat conduction cavity. At least one second capillary structure is stacked in the tube body. The bonding layer has a porous structure. The bonding layer joins at least one first capillary structure and at least one second capillary structure.

The manufacturing method of the connected heat transfer device disclosed in another embodiment of the present invention includes providing a temperature equalizing plate having a first capillary structure. A heat pipe with a second capillary structure is stacked on the temperature equalizing plate. Covering a metal powder on at least part of the first capillary structure and at least part of the second capillary structure. A sintering process is performed to consolidate the metal powder into a bonding layer, and respectively connect the first capillary structure and the second capillary structure by metal bonding.

A method for manufacturing a connected heat transfer device disclosed in another embodiment of the present invention includes providing a temperature equalizing plate having a first capillary structure. A heat pipe with a second capillary structure is stacked on the temperature equalizing plate. Covering a metal powder on at least part of the first capillary structure and at least part of the second capillary structure. A sintering process is performed to consolidate the metal powder into a bonding layer with a porous structure to connect the first capillary structure and the second capillary structure.

According to the connected heat transfer device and its manufacturing method of the above embodiment, compared with the situation where the first capillary structure simply abuts against the second capillary structure, since the first and second capillary structures that simply oppose each other are not substantially connected together Because the adhesion force to the second capillary structure is greater than gravity, the first capillary structure and the second capillary structure operate independently, causing the fluid to be adsorbed inside the second capillary structure and causing transmission delay. In this embodiment, the first capillary structure and the second capillary structure are connected by means of metal bonding, which improves the defect that the first and second capillary structures simply abut without substantial connection, so the first capillary structure and The fluid transfer speed between the second capillary structures further improves the heat dissipation efficiency of the connected heat transfer device and the return speed of the liquid working fluid.

The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principles of the present invention, and provide a further explanation of the scope of the patent application of the present invention.

Please refer to Figure 1 to Figure 5. FIG. 1 is a schematic perspective view of a connected heat transfer device according to a first embodiment of the invention. FIG. 2 is an exploded schematic view of FIG. 1. FIG. FIG. 3 is a perspective schematic view of the base, the first capillary structure, the heat pipe and the bonding layer of FIG. 1. 4 is a schematic cross-sectional view of FIG. 1. 5 is a schematic perspective view of the heat pipe of FIG. 2.

The connected heat transfer device 10a of this embodiment includes a temperature equalizing plate 100a, a heat pipe 200a, and a working fluid (not shown) flowing between the temperature equalizing plate 100a and the heat pipe 200a.

The temperature equalizing plate 100a includes a thermally conductive cavity 110a and a first capillary structure 120a. The thermal conductive cavity 110a includes a base 111a and a cover 112a. The base 111a has a base 1111a, a surrounding portion 1112a, and a bridging recess 1113a. The surrounding portion 1112a is connected around the base portion 1111a, so that the base portion 1111a and the surrounding portion 1112a surround a concave space S1. The bridge recess 1113a is located in the surrounding portion 1112a. The bridging recess 1113a is a portion of the surrounding portion 1112a that is recessed downward. The bridging recess 1113a has a bearing surface 1114a. The cover plate 112a is mounted on the surrounding portion 1112a of the base 111a and a chamber S2 is formed between the base 111a and the cover plate 112a. The chamber S2 is used to contain working fluid (not shown). In this embodiment, the base 111a and the cover 112a have a combined structure, but not limited thereto. In other embodiments, the base 111a and the cover 112a may also be an integrally formed structure.

The first capillary structure 120a is stacked on a side of the base 111a where the base portion 1111a faces the cover plate 112a. The first capillary structure 120a is, for example, a ceramic sintered body, but it is not limited thereto. In other embodiments, the first capillary structure may also be selected from the group consisting of micro grooves, metal mesh, powder sintered body and ceramic sintered body. For example, the first capillary structure may be a composite of a ceramic powder sintered body and micro grooves. In addition, in this embodiment, the temperature equalizing plate 100a includes another first capillary structure 130a. The first capillary structure 130a is stacked on the side of the cover plate 112a facing the base 111a, but it is not limited to this. In other embodiments, the temperature equalizing plate may not have the first capillary structure 130a, that is, The warm plate only has the first capillary structure 120a stacked on the base.

The cover plate 112a has a punching recess 1121a corresponding to the bridging recess 1113a of the base 111a. The punching recess 1121a is formed by a punching process, for example, and is used to fix the heat pipe 200a to the heat-conducting cavity 110a.

The heat pipe 200a includes a pipe body 210a and a second capillary structure 220a. The tube body 210a is a flat tube-shaped hollow tube, and has an annular inner wall surface 211a. In addition, the tube body 210a has an open end 212a and a closed end 213a opposite to each other. The opening end 212a of the tube body 210a has an opening 214a and a side edge 215a surrounding the opening 214a.

The second capillary structure 220a is formed on the annular inner wall surface 211a of the tube body 210a in a circumferential manner. One end of the second capillary structure 220a is connected to the closed end 213a, and the other end is aligned with the side edge 215a. More specifically, the length of the second capillary structure 220a is, for example, the length of the tube body 210a.

The second capillary structure 220a in this embodiment is, for example, a powder sintered body, but it is not limited thereto. In other embodiments, the second capillary structure may also be selected from the group consisting of micro grooves, metal mesh, powder sintered body and ceramic sintered body. For example, the second capillary structure 220a may be a composite of powder sintered body and metal mesh.

The open end 212a of the heat pipe 200a is stacked on the bearing surface 1114a of the bridging recess 1113a, and the heat pipe 200a is sandwiched between the punching portion 1121a and the bridging recess 1113a. The second capillary structures 220a are respectively connected to the first capillary structures 120a by metal bonding. In detail, the connected heat transfer device 10a further includes two bonding layers 310a and 320a. The materials of the bonding layers 310a and 320a are powders of gold, silver, copper or iron. The bonding layers 310a and 320a are formed into a porous structure by sintering or other methods, and one side of the bonding layer 310a is connected to the metal bonding The first capillary structure 120a and the other side of the bonding layer 310a are connected to the second capillary structure 220a by metal bonding. One side of the bonding layer 320a is connected to the first capillary structure 130a by metal bonding, and the other side of the bonding layer 320a is connected to the second capillary structure 220a by metal bonding. That is, in this embodiment, the first capillary structures 120a, 130a are separated from the second capillary structure 220a, but the first capillary structures 120a, 130a are metal bonded to the second capillary structure 220a through the bonding layers 310a, 320a, respectively. Way to connect. Take the following capillary structure 120a as an example. After joining the bonding layer 310a, the first capillary structure 120a, the second capillary structure 220a, and the bonding layer 310a are side by side, which is suitable for the thinned temperature equalizing plate 100a and the flat tube Shaped heat pipe 200a

In addition, the base 111a further has a plurality of support structures 1115a. The support structure 1115a is, for example, a support column and protrudes from the base 1111a of the base 111a. The first capillary structure 120a, 130a each has a plurality of perforations 121a, 131a. The first capillary structures 120a, 130a are located in the chamber S2, and the support structures 1115a respectively penetrate the perforations 121a, 131a and support the cover plate 112a, so as to prevent the temperature equalizing plate 100a from being deformed during vacuuming.

Compared to the case where the first capillary structure and the second capillary structure are operated independently, since the first capillary structure 120a and the second capillary structure 220a of this embodiment are connected by a metal bond through the bonding layer 310a, so The first capillary structure 120a and the second capillary structure 220a are integrated heat transfer and can increase the speed of transferring fluid from the second capillary structure 220a to the first capillary structure 120a, thereby improving the heat dissipation efficiency and liquid operation of the connected heat transfer device 10a The return flow rate of the fluid.

In addition, the manufacturing method of the connected heat transfer device 10a of this embodiment includes providing a temperature equalizing plate 100a having a first capillary structure 120a. Next, the heat pipe 200a having the second capillary structure 220a is stacked on the bridging recess 1113a of the temperature equalizing plate 100a. Metal powder (not shown) is covered on at least part of the first capillary structure 120a and at least part of the second capillary structure 220a. Next, a sintering process is performed to make the metal powder form the bonding layer 310a and connect the first capillary structure 120a and the second capillary structure 220a by metal bonding.

In this embodiment, the number of the bridging recesses 1113a and the heat pipe 200a is single, but not limited to this. In other embodiments, the number of the bridging recesses and the heat pipe may be multiple.

In this embodiment, the second capillary structure 220a of the heat pipe 200a is connected to the first capillary structures 120a, 130a by metal bonding, but it is not limited to this. In other embodiments, the heat pipe The second capillary structure may be connected to the first capillary structure 120a only by metal bonding.

Please refer to Figures 6-12. 6 is a schematic perspective view of a heat pipe according to a second embodiment of the invention. 7 is a schematic perspective view of a heat pipe according to a third embodiment of the invention. 8 is a schematic perspective view of a heat pipe according to a fourth embodiment of the invention. 9 is a schematic perspective view of a heat pipe according to a fifth embodiment of the invention. 10 is a schematic perspective view of a heat pipe according to a sixth embodiment of the invention. 11 is a schematic perspective view of a heat pipe according to a seventh embodiment of the invention. 12 is a schematic perspective view of a heat pipe according to an eighth embodiment of the present invention.

The embodiments shown in FIGS. 6 to 12 are similar to the foregoing first example, and the heat pipes with differences will be described below.

As shown in FIG. 6, the heat pipe 200b includes a pipe body 210b and a second capillary structure 220b. The tube body 210b has an annular inner wall surface 211b and opposite open end 212b and closed end 213b. The opening end 212b of the tube body 210b has an opening 214b and a side edge 215b surrounding the opening 214b. The second capillary structure 220b is formed on the annular inner wall surface 211b of the tube body 210b in a circumferential manner. One end of the second capillary structure 220b is separated from the closed end 213b, and the other end is aligned with the side edge 215b of the tube body 210b. More specifically, the length of the second capillary structure 220b is, for example, half the length of the tube body 210b.

As shown in FIG. 7, the heat pipe 200c includes a pipe body 210c and a second capillary structure 220c. The tube body 210c has an annular inner wall surface 211c and an opposite open end 212c and a closed end 213c. The open end 212c of the tube 210c has an opening 214c and a side edge 215c surrounding the opening 214c. The second capillary structure 220c is formed on the annular inner wall surface 211c of the tube body 210c in a circumferential manner. One end of the second capillary structure 220c is connected to the closed end 213c, and the other end has a protruding section 221c, and the protruding section 221c protrudes from the side edge 215c of the tube body 210c. More specifically, the length of the second capillary structure 220c is slightly longer than the length of the tube body 210c, for example.

As shown in FIG. 8, the heat pipe 200d includes a pipe body 210d and a second capillary structure 220d. The tube body 210d has an annular inner wall surface 211d and an open end 212d and a closed end 213d opposite to it. The open end 212d of the tube body 210d has an opening 214d and a side edge 215d surrounding the opening 214d. The second capillary structure 220d is formed in a circular manner on the annular inner wall surface 211d of the tube body 210d. One end of the second capillary structure 220d is separated from the closed end 213d, and the other end has a protruding section 221d, and the protruding section 221d protrudes from the side edge 215d of the tube body 210d. More specifically, the length of the second capillary structure 220d is, for example, slightly longer than half the length of the tube body 210d.

As shown in FIG. 9, each heat pipe 200e includes a pipe body 210e and a second capillary structure 220e. The tube body 210e has an annular inner wall surface 211e and opposite open end 212e and closed end 213e. The open end 212e of the tube 210e has an opening 214e and a side edge 215e surrounding the opening 214e. The second capillary structure 220e is stacked on one side of the annular inner wall surface 211e. One end of the second capillary structure 220e is connected to the closed end 213e, and the other end has a protruding section 221e, and the protruding section 221e protrudes from the side edge 215e of the tube body 210e. More specifically, the length of the second capillary structure 220e is slightly longer than the length of the tube body 210e, for example.

As shown in FIG. 10, each heat pipe 200f includes a pipe body 210f and a second capillary structure 220f. The tube body 210f has an annular inner wall surface 211f and an open end 212f and a closed end 213f opposite to it. The opening end 212f of the tube body 210f has an opening 214f and a side edge 215f surrounding the opening 214f. The second capillary structure 220f is stacked on one side of the annular inner wall surface 211f. One end of the second capillary structure 220f is separated from the closed end 213f, and the other end has a protruding section 221f, and the protruding section 221f protrudes from the side edge 215f of the tube body 210f. More specifically, the length of the second capillary structure 220f is, for example, slightly longer than half the length of the tube body 210f.

As shown in FIG. 11, the heat pipe 200g includes a pipe body 210g and a second capillary structure 220g. The tube body 210g has an annular inner wall surface 211g, an opposite open end 212g and a closed end 213g. The open end 212g of the tube body 210g has an opening 214g and a side edge 215g surrounding the opening 214g. The second capillary structure 220g is stacked on one side of the annular inner wall surface 211g. One end of the second capillary structure 220g is connected to the closed end 213g, and the other end is aligned with the side edge 215g. More specifically, the length of the second capillary structure 220g is, for example, the length of the tube body 210g. In addition, the tube body 210g further has a gap 216g. The notch 216g is recessed inwardly from the side edge 215g and communicates with the opening 214g. The notch 216g is used for laying metal powder. Or, if the first capillary structure has a bridging convex portion, it can also facilitate the overlapping of the bridging convex portion.

As shown in FIG. 12, the heat pipe 200h includes a pipe body 210h and a second capillary structure 220h. The tube body 210h has a ring-shaped inner wall surface 211h, an opposite open end 212h and a closed end 213h. The open end 212h of the tube body 210h has an opening 214h and a side edge 215h surrounding the opening 214h. The second capillary structure 220h is stacked on one side of the annular inner wall surface 211h. One end of the second capillary structure 220h is separated from the closed end 213h, and the other end is cut flush with the side edge 215h. More specifically, the length of the second capillary structure 220h is, for example, half the length of the tube body 210h. In addition, the tube body 210h further has a gap 216h. The notch 216h is recessed inwardly from the side edge 215h and communicates with the opening 214h. The notch 216h is used for laying metal powder.

In FIGS. 6 to 8, the ring-shaped second capillary structure is only connected to the first capillary structure provided on the base by metal bonding, but it is not limited to this. In other embodiments, the ring-shaped second capillary structure may also be connected to the first capillary structure provided on the base and the cover plate by metal bonding.

The heat pipe in FIGS. 9 to 12 only has a single second capillary structure, but it is not limited to this. In other embodiments, the heat pipe may also have two second capillary structures, which are respectively arranged on the base and the cover plate. The first capillary structure is connected by metal bonding.

Please refer to Figure 13 to Figure 16. 13 is a schematic perspective view of a heat pipe according to a ninth embodiment of the present invention. 14 is a schematic perspective view of a heat pipe according to a tenth embodiment of the present invention. 15 is a schematic perspective view of a heat pipe according to an eleventh embodiment of the present invention. 16 is a schematic perspective view of a heat pipe according to a twelfth embodiment of the present invention.

The embodiments shown in FIGS. 13 to 16 are similar to the first example described above, and the heat pipes with differences will be described below.

As shown in FIG. 13, the heat pipe 200i includes a pipe body 210i and a second capillary structure 220i. The tube body 210i has an open end 212i and a closed end 213i opposite to each other. The open end 212i of the tube body 210i has a side edge 215i. The second capillary structure 220i is disposed in the tube body 210i and is a micro groove. In addition, one end of the second capillary structure 220i is connected to the closed end 213i, and the other end is aligned with the side edge 215i of the tube body 210i. More specifically, the length of the second capillary structure 220i is, for example, the length of the tube body 210i.

As shown in FIG. 14, the heat pipe 200j includes a pipe body 210j and a second capillary structure 220j. The tube body 210j has an open end 212j and a closed end 213j opposite to each other. The open end 212j of the tube body 210j has a side edge 215j. The second capillary structure 220j is disposed in the tube body 210j and is, for example, a micro groove. In addition, one end of the second capillary structure 220j is separated from the closed end 213j, and the other end is cut flush with the side edge 215j of the tube body 210j. More specifically, the length of the second capillary structure 220j is, for example, half the length of the tube body 210j.

As shown in FIG. 15, the heat pipe 200k includes a pipe body 210k and two second capillary structures 220k. The tube 210k has an open end 212k and a closed end 213k. The open end 212k of the tube 210k has a side edge 215k. The two second capillary structures 220k are disposed in the tube body 210k and separated from each other. The two second capillary structures 220k are, for example, micro grooves. In addition, one end of the two second capillary structures 220k is connected to the closed end 213k, and the other end is aligned with the side edge 215k of the tube body 210k. More specifically, the length of the second capillary structure 220k is, for example, the length of the tube body 210k.

As shown in FIG. 16, the heat pipe 200m includes a pipe body 210m and two second capillary structures 220m. The tube body 210m has an open end 212m and a closed end 213m. The open end 212m of the tube body 210m has a side edge 215m. Two second capillary structures 220m are disposed in the tube body 210m and are separated from each other. The two second capillary structures 220m are, for example, micro grooves. In addition, one end of the two second capillary structures 220m is separated from the closed end 213m, and the other end is cut flush with the side edge 215m of the tube body 210m. More specifically, the length of the second capillary structure 220m is, for example, half the length of the tube body 210m.

The above-mentioned second capillary structure is exemplified by a single metal mesh, powder sintered body, ceramic sintered body or micro groove, but it is not limited thereto. Please refer to FIGS. 17 and 18. FIG. 17 is a schematic perspective view of a heat pipe according to a thirteenth embodiment of the present invention. 18 is a schematic cross-sectional view of FIG. 17.

The heat pipe 200n includes a pipe body 210n and a second capillary structure 220n. The tube body 210n has an open end 212n and a closed end 213n opposite to each other. The open end 212n of the tube body 210n has a side edge 215n. The two second capillary structures 220n are both disposed in the tube body 210n.

In this embodiment, the two second capillary structures 220n are compound capillary structures. In detail, each second capillary structure 220n includes a first layer 2201n and a second layer 2202n. The first layer 2201n is formed inside the tube 210n, and the second layer 2202n is stacked on the first layer 2201n. The first layer 2201n of the second capillary structure 220n is, for example, a micro groove, and one end of the first layer 2201n is connected to the closed end 213n, and the other end is aligned with the side edge 215n of the tube body 210n. The second layer 2202n of the second capillary structure 220n is, for example, a metal mesh, a powder sintered body or a ceramic sintered body, and one end of the second layer 2202n is separated from the closed end 213n and the other end is cut flush with the side edge 215n of the tube body 210n, but Not limited to this, one end of the second layer may also be connected to the closed end, and the other end is cut flush with the side edge of the pipe body.

Please refer to FIG. 19, which is a schematic cross-sectional view of the heat pipe of FIG. 17 joined to a temperature equalizing plate.

The heat pipe 200n is stacked on the bridging recess 1113n of the base 111n, and the second layer 2202n of these second capillary structures 220n is connected to the first capillary structure 120n by metal bonding through the bonding layer 300n.

Please refer to FIG. 20, which is a schematic cross-sectional view of a heat pipe according to a fourteenth embodiment of the present invention joined to a temperature equalizing plate. According to the embodiment of FIG. 17, in this embodiment, the first capillary structure 120o of the temperature equalizing plate 100o is also a composite capillary structure. In detail, each first capillary structure 120o includes a first layer 1201o and a second layer 1202o. The first layer 1201o is formed inside the base 111o, and the second layer 1202o is stacked on the first layer 1201o. The first layer 1201o of the first capillary structure 120o is, for example, a micro trench or a metal mesh, and the second layer 1202n of the first capillary structure 120o is, for example, a metal mesh, a powder sintered body, or a ceramic sintered body. Therefore, the tube body 210o of the heat pipe 200o is stacked on the bridging recess 1113o of the base 111o, and the first layer 2201o and the second layer 2202o of these second capillary structures 220o are connected to the first capillary structure 120o through the bonding layer 300o The second layer 1202o is connected by metal bonding.

Please refer to Figures 21-22. 21 is an exploded schematic view of a connected heat transfer device according to a fifteenth embodiment of the present invention. 22 is a schematic cross-sectional view of the phase assembly of the connected heat transfer device of FIG. 21.

In the connected heat transfer device 10p of this embodiment, the thermally conductive cavity 110p also includes a base 111p and a cover plate 112p, and the base 111p has a bridging recess 1113p.

The first capillary structure 120p is stacked on the side of the base 111p close to the cover plate 112p, and the first capillary structure 130p is stacked on the side of the cover plate 112p close to the base 111p. The first capillary structures 120p and 130p each have a bridging convex portion 122p and 132p.

The heat pipe 200p also includes a pipe body 210p and a second capillary structure 220p. The second capillary structure 220p is stacked in the tube body 210p, and the bridging convex portions 122p and 132p of the first capillary structure 120p and 130p are located in the tube body 210p and stacked on the second capillary structure 220p, so that the first capillary structure 120p and 130p are directly connected to the second capillary structure 220p.

In addition, the connected heat transfer device 10p further includes two bonding layers 310p and 320p. The materials of the bonding layers 310p and 320p are powders of gold, silver, copper or iron. The bonding layers 310p and 320p are formed into a porous structure by sintering or other methods, and one side of the bonding layer 310p is connected to the metal bonding The first capillary structure 120p and the other side of the bonding layer 310p are connected to the second capillary structure 220p by metal bonding. One side of the bonding layer 320p is connected to the first capillary structure 130p by metal bonding, and the other side of the bonding layer 320p is connected to the second capillary structure 220p by metal bonding.

In addition, in other embodiments, it can be changed that the first capillary structure does not have a bridging convex portion, and the second capillary structure has a convex section. The protruding section protrudes from the side edge of the opening end of the tube body and is stacked on the first capillary structure.

According to the connected heat transfer device and its manufacturing method of the above embodiment, compared with the situation where the first capillary structure simply abuts against the second capillary structure, since the first and second capillary structures that simply oppose each other are not substantially connected together Because the adhesion force to the second capillary structure is greater than gravity, the first capillary structure and the second capillary structure operate independently, causing the fluid to be adsorbed inside the second capillary structure and causing transmission delay. In this embodiment, the first capillary structure and the second capillary structure are connected by means of metal bonding, which improves the defect that the first and second capillary structures simply abut without substantial connection, so the first capillary structure and The fluid transfer speed between the second capillary structures further improves the heat dissipation efficiency of the connected heat transfer device and the return speed of the liquid working fluid.

Although the present invention is disclosed as above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar arts can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of patent protection for inventions shall be subject to the scope defined in the patent application scope attached to this specification.

10a, 10p ‧‧‧ connected heat transfer device 100a ‧‧‧ temperature equalizing plate 110a, 110p ‧‧‧ heat conduction cavity 111a, 111n, 111o, 111p ‧ ‧ ‧ base 1111a ‧ ‧ base 1112a ‧ ‧ ‧ surrounding part 1113a , 1113p ‧‧‧ bridge recess 1114a ‧‧‧ bearing surface 1115a ‧‧‧ support structure 112a, 112n, 112o, 112p ‧ ‧ ‧ cover plate 1121a ‧ ‧ ‧ stamping recess 120a, 130a, 120n, 130n, 120o, 130o, 120p, 130p‧‧‧First capillary structure 1201o‧‧‧ First layer 1202o‧‧‧Second layer 121a, 131a‧‧‧Perforation 122p, 132p‧‧‧Bridge convex part 200a, 200b, 200c, 200d, 200e , 200f, 200g, 200h, 200i, 200j, 200k, 200m, 200n, 200o ‧‧‧ heat pipe 210a, 210b, 210c, 210d, 210e, 210f, 210g, 210h, 210i, 210j, 210k, 210m, 210n, 210o‧ ‧‧Tube body 211a, 211b, 211c, 211d, 211e, 211f, 211g, 211h , 212o‧‧‧Open ends 213a, 213b, 213c, 213d, 213e, 213f, 213g, 213h, 213i, 213j, 213k, 213m, 213n , 214h, 214o ‧‧‧ openings 215a, 215b, 215c, 215d, 215e, 215f, 215g, 215h, 215i, 215j, 215k, 215m, 215n, 215o ‧‧‧ side edge 216g, 216h , 220c, 220d, 220e, 220f, 220g, 220h, 220i, 220j, 220k, 220m, 220n, 220o‧‧‧second capillary structure 2201n, 2201o‧‧‧first layer 2202n, 2202o‧‧‧second layer 221c , 221d, 221e, 221f protruding sections 310a, 320a, 310n, 310o ‧‧‧ junction layer S1S2‧‧‧‧ chamber

FIG. 1 is a schematic perspective view of a connected heat transfer device according to a first embodiment of the invention. FIG. 2 is an exploded schematic view of FIG. 1. FIG. FIG. 3 is a perspective schematic view of the base, the first capillary structure, the heat pipe and the bonding layer of FIG. 1. 4 is a schematic cross-sectional view of FIG. 1. 5 is a schematic perspective view of the heat pipe of FIG. 2. 6 is a schematic perspective view of a heat pipe according to a second embodiment of the invention. 7 is a schematic perspective view of a heat pipe according to a third embodiment of the invention. 8 is a schematic perspective view of a heat pipe according to a fourth embodiment of the invention. 9 is a schematic perspective view of a heat pipe according to a fifth embodiment of the invention. 10 is a schematic perspective view of a heat pipe according to a sixth embodiment of the invention. 11 is a schematic perspective view of a heat pipe according to a seventh embodiment of the invention. 12 is a schematic perspective view of a heat pipe according to an eighth embodiment of the present invention. 13 is a schematic perspective view of a heat pipe according to a ninth embodiment of the present invention. 14 is a schematic perspective view of a heat pipe according to a tenth embodiment of the present invention. 15 is a schematic perspective view of a heat pipe according to an eleventh embodiment of the present invention. 16 is a schematic perspective view of a heat pipe according to a twelfth embodiment of the present invention. 17 is a schematic perspective view of a heat pipe according to a thirteenth embodiment of the present invention. 18 is a schematic cross-sectional view of FIG. 17. 19 is a schematic cross-sectional view of the heat pipe of FIG. 17 joined to a temperature equalizing plate. 20 is a schematic cross-sectional view of a heat pipe bonded to a temperature equalizing plate according to a fourteenth embodiment of the present invention. 21 is an exploded schematic view of a connected heat transfer device according to a fifteenth embodiment of the present invention. 22 is a schematic cross-sectional view of the phase assembly of the connected heat transfer device of FIG. 21.

111a‧‧‧Base

112a‧‧‧cover

120a, 130a‧‧‧‧Capillary structure

200a‧‧‧heat pipe

210a‧‧‧tube

220a‧‧‧Second capillary structure

211a‧‧‧Annular inner wall surface

212a‧‧‧Open end

214a‧‧‧ opening

215a‧‧‧Side edge

221a‧‧‧protruding section

300a‧‧‧Joint layer

S‧‧‧Chamber

Claims (32)

A connected heat transfer device, including: a temperature-equalizing plate, including a thermally conductive cavity and at least a first capillary structure, a side of the thermally conductive cavity has a bridging recess, the at least one first capillary structure is stacked on The heat conduction cavity; and a heat pipe, including a tube body and at least one second capillary structure, the tube body is stacked on the bridging recess of the heat conduction cavity, the at least one second capillary structure is stacked on the tube body ; Wherein, the at least one first capillary structure is connected to the at least one second capillary structure by metal bonding. The connected heat transfer device as described in item 1 of the patent application scope further includes a bonding layer, one side of the bonding layer is connected to the first capillary structure by metal bonding, and the other side of the bonding layer It is connected to the second capillary structure by metal bonding. The connected heat transfer device as described in item 2 of the patent application, wherein the material of the bonding layer is a powder of gold, silver, copper or iron. The connected heat transfer device as described in item 2 of the patent application scope, wherein the first capillary structure has a bridging convex portion, the bridging convex portion is located in the tube body and stacked on the second capillary structure. The connected heat transfer device as described in item 2 of the patent application range, wherein the first capillary structure is selected from the group consisting of micro grooves, metal mesh, powder sintered body and ceramic sintered body. The connected heat transfer device as described in item 5 of the patent application scope, wherein the second capillary structure is selected from the group consisting of a metal mesh, a powder sintered body, and a ceramic sintered body. The connected heat transfer device as described in item 6 of the patent application scope, wherein an open end of the tube body has an opening and a side edge surrounding the opening, and the second capillary structure is aligned with the side edge. The connected heat transfer device as described in item 7 of the patent application scope, wherein the tube body has a notch which is recessed inwardly from the side edge and communicates with the opening. The connected heat transfer device as described in item 7 of the patent application scope, wherein the tube body has a closed end, the closed end is opposite to the open end, and the second capillary structure is connected to the closed end. The connected heat transfer device as described in item 7 of the patent application scope, wherein the tube body has a closed end, the closed end is opposite to the open end, and the second capillary structure is separated from the closed end. The connected heat transfer device of claim 9 or 10, wherein the tube body has an annular inner wall surface, and the at least one second capillary structure is formed on the annular inner wall surface of the tube body in a circumferential manner. The connected heat transfer device of claim 9 or 10, wherein the tube body has an annular inner wall surface, the number of the at least one second capillary structure is two, and the two second capillary structures are stacked on the The annular inner wall surface of the tube body, and the two second capillary structures are separated. The connected heat transfer device as described in item 6 of the patent application scope, wherein one end of the tube body has an opening and a side edge surrounding the opening, the at least one second capillary structure has a protruding section, the convex The protruding section protrudes from the side edge of the tube body. The connected heat transfer device as described in item 13 of the patent application scope, wherein the tube body has a closed end, the closed end is opposite to the open end, and the second capillary structure is connected to the closed end. The connected heat transfer device as described in item 13 of the patent application range, wherein the tube body has a closed end, the closed end is opposite to the open end, and the second capillary structure is separated from the closed end. The connected heat transfer device of claim 14 or 15, wherein the tube body has an annular inner wall surface, and the second capillary structure is formed on the annular inner wall surface of the tube body in a circumferential manner. The connected heat transfer device of claim 14 or 15, wherein the tube body has an annular inner wall surface, the number of the at least one second capillary structure is two, and the two second capillary structures are stacked on the The annular inner wall surface of the tube body, and the two second capillary structures are separated. The connected heat transfer device as described in item 5 of the patent application scope, wherein the second capillary structure is selected from the group consisting of a metal mesh, a powder sintered body and a ceramic sintered body, and micro grooves. The connected heat transfer device of claim 18, wherein an open end of the tube body has an opening and a side edge surrounding the opening, and the second capillary structure is aligned with the side edge. The connected heat transfer device as described in item 19 of the patent application range, wherein the tube body has a notch which is recessed inward from the side edge and communicates with the opening. The connected heat transfer device as described in Item 19 of the patent application range, wherein the tube body has a closed end, the closed end is opposite to the open end, and the second capillary structure is connected to the closed end. The connected heat transfer device of claim 19, wherein the tube body has a closed end, the closed end is opposite to the open end, and the second capillary structure is separated from the closed end. The connected heat transfer device of claim 21 or 22, wherein the tube body has an annular inner wall surface, and the at least one second capillary structure is formed on the annular inner wall surface of the tube body in a circumferential manner. The connected heat transfer device of claim 21 or 22, wherein the tube body has an annular inner wall surface, the number of the at least one second capillary structure is two, and the two second capillary structures are stacked on the The annular inner wall surface of the tube body, and the two second capillary structures are separated. The connected heat transfer device as described in item 1 of the patent application range, wherein the thermally conductive cavity includes a base and a cover plate, the base has a base and a surrounding portion, the surrounding portion is connected around the base, and the The bridging recess is located in the surrounding portion, and the cover plate is mounted on the surrounding portion of the base to form a cavity between the base and the cover plate. The connected heat transfer device as described in item 25 of the patent application range, wherein the cover plate has a punching recess, and the heat pipe is sandwiched between the punching recess and the bridging recess. The connected heat transfer device of claim 25, wherein the first capillary structure is stacked on a side of the base facing the cover plate. The connected heat transfer device as described in item 25 of the patent application scope, wherein the number of the first capillary structures is two, and the two first capillary structures are stacked on one side of the base facing the cover plate and the cover The board faces one side of the base. The connected heat transfer device as described in item 2 of the patent application scope, wherein the second capillary structure has a protruding section, the protruding section protrudes from the side edge of the open end of the tube body and is stacked on the first capillary structure. A connected heat transfer device, including: a temperature-equalizing plate, including a thermally conductive cavity and at least a first capillary structure, a side of the thermally conductive cavity has a bridging recess, the at least one first capillary structure is stacked on The heat conduction cavity; and a heat pipe, including a tube body and at least one second capillary structure, the tube body is stacked on the bridging recess of the heat conduction cavity, the at least one second capillary structure is stacked on the tube body A bonding layer with a porous structure, the bonding layer joins the at least one first capillary structure and the at least one second capillary structure. A manufacturing method of a connected heat transfer device, comprising: providing a temperature equalizing plate with a first capillary structure; stacking a heat pipe with a second capillary structure on the temperature equalizing plate; covering a metal powder on at least part of the A first capillary structure and at least a portion of the second capillary structure; and performing a sintering process to consolidate the metal powder into a bonding layer, respectively connecting the first capillary structure and the second capillary structure by metal bonding . A manufacturing method of a connected heat transfer device, comprising: providing a temperature equalizing plate with a first capillary structure; stacking a heat pipe with a second capillary structure on the temperature equalizing plate; covering a metal powder on at least part of the A first capillary structure and at least a portion of the second capillary structure; and performing a sintering process to consolidate the metal powder into a porous structure bonding layer to connect the first capillary structure and the second capillary structure.

Images