TW202008620A - Lighting structure and manufacturing method thereof - Google Patents

Abstract

The present disclosure discloses a lighting structure, which includes a substrate, a lighting unit disposed on the substrate, an annular wall, a first connecting layer adhering a bottom surface of the annular wall to the substrate, and a compound. A lighting chip of the lighting unit has a light emitting surface and a surrounding lateral surface connected to the light emitting surface. The lighting chip is arranged inside of the annular wall. The bottom surface of the annular wall, the first connecting layer, and the substrate jointly define a gap. The compound is arranged inside of the annular wall, and includes a reinforcing portion filled in the gap. The reinforcing portion connects the bottom surface of the annular wall, the first connecting layer, and the substrate. In addition, the present disclosure also discloses a manufacturing method of a lighting structure.

Description

Light emitting structure and manufacturing method thereof

The invention relates to a light-emitting structure and a manufacturing method thereof.

The existing light-emitting structure includes a substrate, a retaining wall disposed on the substrate, a light-emitting unit disposed on the substrate and located in the retaining wall, and an encapsulant filled in the retaining wall. However, the adhesion of the existing light-emitting structure between the retaining wall and the substrate is adhered by a single adhesive layer, and the adhesive layer often suffers from insufficient adhesion, which leads to defects in the existing light-emitting structure.

Therefore, the inventor believes that the above-mentioned defects can be improved, but dedicated research and cooperation with the application of scientific principles, finally came up with a reasonable design and effectively improve the above problems of the present invention.

The object of the present invention is to provide a light emitting structure and a manufacturing method thereof, which can effectively improve the problems that may be caused by the existing light emitting structure.

The invention discloses a light-emitting structure, which comprises a substrate, a light-emitting unit arranged on the substrate, a ring-shaped wall body, a first bonding layer for bonding the bottom surface of the ring-shaped wall body to the substrate, and a colloid. The light-emitting chip of the light-emitting unit has a light-emitting surface and an annular side surface adjacent to the light-emitting surface. The light-emitting chip is located inside the annular wall. A gap is formed around the bottom surface of the annular wall, the first bonding layer, and the base. The colloid is located in the annular wall and includes a reinforcement portion filled in the gap, so that the reinforcement portion joins the bottom surface of the annular wall, the first bonding layer, and the base.

The embodiment of the invention also discloses a manufacturing method for forming the above-mentioned light-emitting structure.

In summary, in the light-emitting structure and the manufacturing method disclosed in the embodiments of the present invention, the bottom surface of the annular wall and the first surface of the base are joined to the above-mentioned first joint layer and reinforcing portion connected to each other, so that The ring-shaped wall body can be firmly fixed on the substrate, thereby effectively reducing the probability of defects in the light-emitting structure.

In order to understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, not to make any protection to the scope of the present invention. limit.

100‧‧‧Lighting structure

1‧‧‧ base

11‧‧‧ First surface

12‧‧‧Second surface

2‧‧‧Lighting unit

21‧‧‧Carrier

22‧‧‧Light emitting chip

221‧‧‧Luminous surface

222‧‧‧ring side

23‧‧‧side lens

3‧‧‧Circular wall

31‧‧‧Bottom

311‧‧‧Inner fixed area

312‧‧‧External fixed area

32‧‧‧Inside

33‧‧‧Outside

34‧‧‧Top

4‧‧‧First joint layer

5‧‧‧Colloid

51‧‧‧Enhancement Department

5a‧‧‧liquid glue

6‧‧‧Transparent cover

7‧‧‧Second joint layer

8‧‧‧Annular rib

9‧‧‧Reflective layer

W‧‧‧Width direction

H‧‧‧ Height direction

S‧‧‧accommodation space

G‧‧‧Gap

W31, W311, Wa‧‧‧Width

T23, T23a‧‧‧thickness

H51, H8‧‧‧ height

FIG. 1A is a schematic top view of a light-emitting structure according to Embodiment 1 of the present invention (omitting the light-transmitting cover plate, the second bonding layer, and the glue).

FIG. 1B is a schematic diagram of a light emitting structure according to Embodiment 1 of the present invention.

FIG. 2 is a partially enlarged schematic diagram of FIG. 1B.

FIG. 3 is a schematic diagram (1) of preparation steps of a method for manufacturing a light-emitting structure according to Embodiment 1 of the present invention.

4 is a schematic diagram (2) of the preparation steps of the method for manufacturing the light emitting structure according to the first embodiment of the present invention.

FIG. 5 is a schematic diagram of filling steps of a method for manufacturing a light emitting structure according to Embodiment 1 of the present invention.

FIG. 6 is a schematic diagram of curing steps of the method for manufacturing a light emitting structure according to Embodiment 1 of the present invention.

7 is a schematic diagram of the bonding steps of the method for manufacturing the light emitting structure according to the first embodiment of the present invention.

FIG. 8 is a schematic diagram of a light emitting structure according to Embodiment 2 of the present invention.

9 is a partially enlarged schematic diagram of FIG. 8.

FIG. 10 is a schematic diagram of a light emitting structure according to Embodiment 3 of the present invention.

FIG. 11 is a schematic diagram of a light emitting structure according to Embodiment 4 of the present invention.

Please refer to FIGS. 1A to 11, which are embodiments of the present invention. It should be noted that this embodiment corresponds to the relevant quantities and appearances mentioned in the drawings, and is only used to specifically illustrate the embodiments of the present invention. In order to understand the content of the present invention, it is not used to limit the protection scope of the present invention.

[Example 1]

As shown in FIGS. 1A to 7, it is Embodiment 1 of the present invention. This embodiment discloses a light-emitting structure 100 and a method for manufacturing the same, and the light-emitting structure 100 particularly refers to an ultraviolet light-emitting structure (or ultraviolet light-emitting diode packaging structure), but the present invention is not limited thereto. It should be noted that, in order to facilitate understanding of this embodiment, the light-emitting structure 100 will be introduced first, and then the manufacturing method of the light-emitting structure 100 will be described, but the light-emitting structure 100 of this embodiment is not limited to this manufacturing method. production.

The light-emitting structure 100 includes a base 1, a light-emitting unit 2 disposed on the base 1, a ring-shaped wall 3 located outside the light-emitting unit 2, and a first connecting the ring-shaped wall 3 and the base 1 The bonding layer 4, a compound 5 filled in the ring-shaped wall 3, a light-transmitting cover plate 6 located above the light-emitting unit 2 and the ring-shaped wall 3, and bonding the ring-shaped wall 3 and the light-transmitting A second bonding layer 7 of the cover plate 6.

The substrate 1 is plate-shaped in this embodiment, and is described by a ceramic carrier board including circuit design (for example, the material of the ceramic carrier board includes aluminum oxide or aluminum nitride), but the present invention does not Limited by this. The substrate 1 has a first surface 11 (such as the top surface of the substrate 1 in FIG. 1B) and a second surface 12 (such as the bottom surface of the substrate 1 in FIG. 1B) on opposite sides. Furthermore, the substrate 1 of this embodiment defines a height direction H substantially perpendicular to the first surface 11 and a width direction W substantially parallel to the first surface 11.

The light-emitting unit 2 is disposed on the first surface 11 of the substrate 1, and the connection between the light-emitting unit 2 and the substrate 1 can be adjusted and changed according to design requirements. In this embodiment, the light-emitting unit 2 includes a carrier 21 mounted on the first surface 11 of the substrate 1, a light-emitting chip 22 mounted on the carrier 21, and the carrier A lens 23 on one side of the body 21 and surrounding the light emitting wafer 22.

The light-emitting chip 22 has a light-emitting surface 221 and a ring-shaped side surface 222 adjacent to the light-emitting surface 221, the light-emitting chip 22 is fixed to the carrier 21, and the light-emitting surface 221 is located away from the light-emitting chip of the carrier 21 22 side (eg, the top side of the light-emitting chip 22 in FIG. 1B). The carrier 21 forms an electrical connection with the substrate 1 through a wire-bonding process, and electrically connects the light-emitting chip 22 to the substrate 1. The side lens 23 is disposed on the carrier 21, and the ring side surface 222 of the light emitting chip 22 is covered by the side lens 23 (complete). Furthermore, each metal wire formed in the above wire bonding process is preferably partially buried in the side lens 23, and the side lens 23 of this embodiment does not cover the light emitting surface 221 of the light emitting chip 22 described above.

Further, the light-emitting chip 22 can be further defined as an ultraviolet light-emitting chip or a UV LED chip (UV LED chip), and the light-emitting chip 22 is preferably used to emit a wavelength between 190 nanometers (nm ) To 420 nm ultraviolet light, but the invention is not limited thereto.

In addition, in other embodiments not shown in the present invention, the light-emitting unit 2 can be directly fixed on the substrate 1 by flip-chip wafer, thereby omitting the carrier 21 and the wire-bonding process; or, The light-emitting unit 2 may also omit the carrier 21, the side lens 23, and the wire-bonding process at the same time.

The material of the ring-shaped wall 3 may be metal (such as aluminum) or polymer, and the height of the ring-shaped wall 3 is preferably not less than the height of the light-emitting unit 2. The bottom surface 31 of the annular wall 3 is fixed to the first surface 11 of the base 1 with the first bonding layer 4 described above, so that the inner side 32 of the annular wall 3 and the first surface 11 of the base 1 An accommodating space S is formed around it, and the light-emitting unit 2 is located in the accommodating space S.

Wherein, the outer side 33 of the ring-shaped wall 3 preferably does not protrude beyond the edge of the above-mentioned base 1, that is to say, the outer side 33 of the ring-shaped wall 3 is aligned with the edge of the above-mentioned base 1, or Compared to the above, the edge of the substrate 1 shrinks by a distance, but the invention is not limited thereto.

Furthermore, the bottom surface 31 of the annular wall 3, the (inner edge of) the first bonding layer 4 and the first surface 11 (such as the portion of the first surface 11 facing the bottom surface 31 in FIG. 2) A gap G (eg, FIG. 3) is formed together, and the gap G communicates with the accommodation space S.

In more detail, the bottom surface 31 of the annular wall 3 includes an inner fixing area 311 and an outer fixing area 312 located outside the inner fixing area 311. In the width direction W, the width W311 of the inner fixing area 311 accounts for 10% to 70% (preferably 15% to 50%) of the width W31 of the bottom surface 31 of the annular wall 3. The first bonding layer 4 has a ring shape, and at least part of the outer fixing region 312 is bonded to the first bonding layer 4, and the outer fixing region 312 of this embodiment is preferably completely bonded to the first bonding layer 4 , But not limited to this.

The colloid 5 is located in the accommodating space S to cover the carrier 21 (that is, the carrier 21 is embedded in the colloid 5). Wherein, the colloid 5 includes a reinforced portion 51 filled in the gap G (eg, FIG. 3 ), so that the reinforced portion 51 is joined to the bottom surface 31 of the annular wall 3 and the first bonding layer 4 (Inner edge), and the first surface 11 of the substrate 1 (e.g., the portion of the first surface 11 facing the bottom surface 31 in FIG. 2).

Thereby, the bottom surface 31 of the ring-shaped wall 3 and the first surface 11 of the base 1 are bonded to the above-mentioned first bonding layer 4 and the reinforced portion 51, so that the ring-shaped wall 3 can be firmly fixed to the base 1. Further, the probability of defects in the light emitting structure 100 is effectively reduced.

Further, at least 80% of the inner fixing area 311 is joined to the reinforcing portion 51, and the inner fixing area 311 of this embodiment is completely joined to the strengthening portion 51, but the present invention is not limited thereto. Furthermore, in the height direction H, the height H51 of the reinforcing portion 51 may be between 10 microns (μm) and 100 microns (the height H51 is preferably 20 microns to 60 microns). If the height H51 of the reinforced portion 51 exceeds the above range, and the annular wall 3 and the base 1 are subjected to an external force, they are more likely to peel off.

In addition, the top surface of the colloid 5 in this embodiment is substantially concave and curved, and the top edge of the colloid 5 is connected to the top edge of the carrier 21, but the specific structure of the colloid 5 of the present invention is not limited Here. In addition, in other embodiments not shown in the present invention, the colloid 5 may also be formed by molding so that the top surface of the colloid 5 is flat; or, the colloid 5 may be dispensed twice It is constructed (that is, the top surface of the colloid 5 shown in FIG. 6 is dispensed once) so that the top surface of the colloid 5 formed by two-time dispensing can be flat.

In this embodiment, the light-transmitting cover plate 6 is a flat transparent glass, but the invention is not limited thereto. The transparent cover 6 is fixed to the top surface 34 of the annular wall 3 with the second bonding layer 7, and the accommodating space S can be formed by the transparent cover 6 and the second bonding layer 7 Sealed, but the invention is not limited to this. For example, in other embodiments not shown in the present invention, the second bonding layer 7 may also be disposed at the four corners of the top surface 34 of the ring-shaped wall 3, according to which the light-transmitting cover 6 is bonded Since the above-mentioned accommodating space S is constituted, the accommodating space S can communicate with the external space. Wherein, the edge of the light-transmitting cover 6 is preferably not protruded from the outer side 33 of the annular wall 3, that is to say, the edge of the light-transmitting cover 6 is aligned with the outer side of the annular wall 3 33, or the inner side 33 of the annular wall 3 shrinks by a distance, but the invention is not limited thereto.

The above is the introduction of the light emitting structure 100 of this embodiment. The following describes the manufacturing method of the light emitting structure 100 of this embodiment, but the light emitting structure 100 of this embodiment is not limited to this manufacturing method. Wherein, the manufacturing method of the light emitting structure 100 includes a preparation step, a filling step, a curing step, and a bonding step. However, when implementing the manufacturing method of the light emitting structure 100, the present invention does not use the contents of the above steps and The order is limited.

As shown in FIGS. 3 and 4, the above preparation steps are carried out: the light-emitting unit 2 is installed on the first surface 11 of the substrate 1, and the bottom surface 31 of the ring-shaped wall 3 is fixed to the first surface with the first bonding layer 4 The first surface 11 of the substrate 1 is located outside the light-emitting unit 2 (that is, the light-emitting unit 2 is located in the space surrounded by the annular wall 3). Wherein, the bottom surface 31 of the annular wall 3, the (inner edge of) the first bonding layer 4 and the first surface 11 (such as the portion of the first surface 11 facing the bottom surface 31 in FIG. 3) surround the gap G .

Further, as for the light-emitting unit 2 disclosed in this embodiment, a carrier 21 carrying a light-emitting chip 22 (such as an ultraviolet light-emitting chip) is mounted on the first surface 11 of the substrate 1, and then A side lens 23 is formed on the carrier 21 and the periphery of the light emitting chip 22 after vacuuming and baking the surrounding environment, and the ring side surface 222 of the light emitting chip 22 is preferably used by the side The lens 23 is completely covered, but the present invention is not limited to this.

Furthermore, the bottom surface 31 of the annular wall 3 includes an inner fixing area 311 and an outer fixing area 312 outside the inner fixing area 311. At least part (eg, complete) of the outer fixing region 312 is bonded to the first bonding layer 4. In the width direction W, the width W311 of the inner fixing area 311 accounts for 10% to 70% (preferably 15% to 50%) of the width W31 of the bottom surface 31 of the annular wall 3.

As shown in FIG. 5, the above filling step is carried out: a liquid compound 5a is filled into the annular wall 3, and then a vacuum operation is performed on the surrounding environment to gradually form a vacuum environment, so that the The liquid glue 5a is filled in the gap G (eg, FIG. 6).

Further, the filling step in this embodiment is through vacuuming operation, so that the liquid glue 5a is easier to fill into the above-mentioned narrow gap G, and the specific implementation of the above vacuuming operation can be based on the design requirements or the gap G The specific shape is adjusted and changed. Furthermore, the gap between the substrate 1 and the carrier 21 can also be filled with the liquid glue 5a, so that no bubbles exist between the substrate 1 and the carrier 21.

As shown in FIG. 6, the above curing step is carried out: curing the liquid glue 5a into a colloid 5 so that the carrier 21 of this embodiment is embedded in the colloid 5. The portion of the colloid 5 filled in the gap G is defined as the reinforced portion 51, and the reinforced portion 51 joins the bottom surface 31 of the annular wall 3, the first bonding layer 4, and the first surface 11 of the base 1 . Wherein, at least 80% (preferably 100%) of the inner fixing region 311 is joined to the reinforcing portion 51, and in the height direction H, the height H51 of the reinforcing portion 51 is preferably between 10 Micrometer (μm) ~ 100 microns, but the present invention is not limited to the above.

It should be noted that in the process of curing the liquid glue 5a into the colloid 5, the liquid glue 5a may be cured in a vacuum environment, or the liquid glue 5a may be cured in a non-vacuum environment. The present invention is here No restrictions.

As shown in FIG. 7 and FIG. 1B, the above bonding step is achieved: the light-transmitting cover 6 is fixed to the top surface 34 of the annular wall 3 with the second bonding layer 7, so that the inside of the annular wall 3 The space is closed, so the above steps can also be called sealing steps. In addition, in other embodiments not shown in the present invention, the second bonding layer 7 may also include a plurality of blocks distributed at intervals on the top surface 34 of the ring-shaped wall 3, in particular, may be located at four corners, respectively. In order to make the space in the annular wall 3 communicate with the outside in a semi-closed shape. In this embodiment, the transparent cover 6 is a flat transparent glass, but the invention is not limited to this.

It should be noted that in the light-emitting structure 100 manufactured according to the above steps, the probability of the ring-shaped wall 3 falling off the substrate 1 can be greatly reduced, thereby effectively improving the manufacturing yield of the light-emitting structure 100 of this embodiment.

[Example 2]

Please refer to FIG. 8 and FIG. 9, which is the second embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, so the details of the two embodiments will not be repeated, and this embodiment is compared to the implementation. The difference between Example 1 is mainly that the light emitting structure 100 of this embodiment further includes an annular rib 8 disposed on the first surface 11 of the substrate 1.

Specifically, the annular rib 8 is embedded in the colloid 5 and is adjacent to the reinforcing portion 51, and the annular rib 8 is spaced from the reinforcing portion 51 by a channel width Wa. Wherein, the width of the flow channel Wa is preferably not less than the distance between the bottom surface 31 of the annular wall 3 and the first surface 11 of the base 1 (that is, the height of the reinforcing portion 51), so that the colloid 5 The difficulty of filling through the above-mentioned flow path width Wa is lower than the difficulty of filling the gel 5 into the gap G.

Further, in the height direction H, the height H8 of the annular rib 8 is preferably greater than the height H51 of the reinforcing portion 51, so that the annular rib 8 can effectively shield the light (eg, light emitting chip 22 emitted ultraviolet rays), thereby preventing the above-mentioned light rays from irradiating the first bonding layer 4 through the strengthening portion 51, thereby improving the life of the first bonding layer 4.

[Embodiment 3]

Please refer to FIG. 10, which is the third embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, so the details of the two embodiments are not repeated, and this embodiment is compared to the first embodiment. The main difference is that the light emitting structure 100 of this embodiment further includes a reflective layer 9.

Specifically, the reflective layer 9 is provided adjacent to the light-transmitting cover plate 6 at the second bonding layer 7 (eg, the outer side of the bottom surface of the light-transmitting cover plate 6 in FIG. 10 ), and the reflective layer 9 Preferably, the light emitted by the light-emitting chip 22 is along a path that travels toward the second bonding layer 7 through the light-transmitting cover plate 6, but the present invention is not limited to this.

[Embodiment 4]

Please refer to FIG. 11, which is the fourth embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, so the details of the two embodiments will not be repeated, and this embodiment is compared with the first embodiment. The main difference is that part of the side lens 23 in the light emitting structure 100 of this embodiment is further covered by the colloid 5.

Specifically, in the height direction H, the thickness T23a of the side lens 23 covering the colloid 5 is not greater than 50% of the thickness T23 of the side lens 23, so as to avoid the colloid 5 affecting the light emission of the side lens 23 effect.

[Technical Effect of the Invention]

In summary, in the light-emitting structure and the manufacturing method disclosed in the present invention, the bottom surface of the annular wall and the first surface of the base are joined to the first joint layer and the reinforced portion connected to each other, so that the The ring-shaped wall body can be firmly fixed on the substrate, thereby effectively reducing the probability of defects in the light-emitting structure.

Furthermore, the light-emitting structure can further enhance the effect of fixing the annular wall on the base through the detailed structural design of the reinforcement part. For example, the width of the inner fixing area accounts for 10% to 70% (preferably 15% to 50%) of the width of the bottom surface of the annular wall, and at least 80% of the inner fixing area is joined to the reinforcement portion; The height of the reinforced portion is between 10 microns (μm) and 100 microns.

In addition, the light-emitting structure disclosed in the present invention can further include an annular rib provided on the first surface of the substrate, and shield the light (such as ultraviolet rays emitted by the light-emitting chip) by the annular rib, thereby avoiding the light The first bonding layer is irradiated along the strengthened portion to increase the life of the first bonding layer.

The above are only the preferred and feasible embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any changes and modifications made within the scope of the patent of the present invention shall fall within the scope of protection of the claims of the present invention.

100‧‧‧Lighting structure

1‧‧‧ base

11‧‧‧ First surface

12‧‧‧Second surface

2‧‧‧Lighting unit

21‧‧‧Carrier

22‧‧‧Light emitting chip

221‧‧‧Luminous surface

222‧‧‧ring side

23‧‧‧side lens

3‧‧‧Circular wall

31‧‧‧Bottom

311‧‧‧Inner fixed area

312‧‧‧External fixed area

32‧‧‧Inside

33‧‧‧Outside

34‧‧‧Top

4‧‧‧First joint layer

5‧‧‧Colloid

51‧‧‧Enhancement Department

6‧‧‧Transparent cover

7‧‧‧Second joint layer

W‧‧‧Width direction

H‧‧‧ Height direction

S‧‧‧accommodation space

Claims (18)

A light emitting structure includes: a substrate having a first surface and a second surface on opposite sides; a light emitting unit disposed on the first surface of the substrate, the light emitting unit including a light emitting chip; Wherein, the light-emitting chip has a light-emitting surface and a ring-shaped side surface adjacent to the light-emitting surface; a ring-shaped wall body and a first bonding layer, and the bottom surface of the ring-shaped wall body is fixed to the bottom by the first bonding layer On the first surface of the base, an inner side of the annular wall forms an accommodating space with the first surface, and the light-emitting chip is located in the accommodating space; wherein, the The bottom surface, the first bonding layer, and the first surface surround and form a gap, and the gap communicates with the accommodating space; and a compound is located in the accommodating space, and the The colloid includes a reinforcement portion filled in the gap, so that the reinforcement portion joins the bottom surface of the annular wall, the first bonding layer, and the first surface of the base. The light emitting structure according to claim 1, wherein the light emitting unit comprises: a carrier, which is mounted on the first surface, and the light emitting chip is mounted on the carrier, and the carrier is buried Placed in the colloid; and a side lens, which is arranged on the carrier, and the ring side surface of the light emitting chip is covered by the side lens. The light emitting structure according to claim 2, wherein part of the side lens is covered by the colloid, the substrate defines a height direction perpendicular to the first surface, and in the height direction, covers the The thickness of the side lens portion of the colloid is not greater than 50% of the thickness of the side lens. The light emitting structure according to claim 1, wherein the bottom bread of the ring-shaped wall body includes an inner fixing area and an outer fixing area located outside the inner fixing area; wherein, the base is defined with the parallel A width direction of the first surface, and in the width direction, the width of the inner fixing area accounts for 10% to 70% of the width of the bottom surface of the annular wall, and at least 80% of the inner fixing area % Is bonded to the reinforced portion, and at least part of the outer fixing region is bonded to the first bonding layer. The light emitting structure according to claim 4, wherein, in the width direction, the width of the inner fixing area is further limited to account for 15% to 50% of the width of the bottom surface of the annular wall. The light emitting structure according to claim 1, wherein the substrate defines a height direction perpendicular to the first surface, and in the height direction, the height of the reinforcing portion is between 10 micrometers (μm)~ 100 microns. The light emitting structure according to claim 1, further comprising an annular rib disposed on the first surface, the annular rib is embedded in the colloid and adjacent to the reinforcing portion, and the annular rib A channel width is spaced from the reinforced portion. The light emitting structure according to claim 7, wherein the width of the flow channel is not less than the distance between the bottom surface of the annular wall and the first surface of the substrate. The light emitting structure according to claim 7, wherein the substrate defines a height direction perpendicular to the first surface, and in the height direction, the height of the annular rib is greater than the height of the reinforcing portion. The light-emitting structure according to any one of claims 1 to 9, further comprising a light-transmitting cover plate and a second bonding layer, and the light-transmitting cover plate is fixed to the light-emitting cover with the second bonding layer The top surface of the ring wall. The light-emitting structure according to claim 10, wherein a reflective layer is further formed on the light-transmissive cover plate portion adjacent to the second bonding layer, and the reflective layer is located along the light emitted by the light-emitting chip The light-transmitting cover plate travels on a path toward the second bonding layer. A method for manufacturing a light-emitting structure includes: performing a preparatory step: installing a light-emitting unit on a first surface of a substrate, and fixing the bottom surface of a ring-shaped wall body with a first bonding layer on the substrate The first surface is located outside the light-emitting unit; wherein the bottom surface of the annular wall, the first bonding layer, and the first surface surround a gap; a filling step is performed: Filling a liquid compound into the annular wall, and then performing a vacuum operation on the surrounding environment to gradually form a vacuum environment, so that the liquid glue is filled in the gap; and a curing step is implemented : Curing the liquid glue into a colloid; wherein the colloid part filled in the gap is defined as a reinforced part, and the reinforced part joins the bottom surface of the annular wall body and the first joint A layer and the first surface of the substrate. The method for manufacturing a light-emitting structure according to claim 12, wherein in the preparation step, a carrier carrying a light-emitting chip is mounted on the first surface, and then on the carrier and the light is emitted After the glue is dispensed on the periphery of the wafer, and a side lens is formed by evacuating and baking the surrounding environment; wherein, a ring of side surfaces of the light-emitting wafer is covered by the side lens; The body is embedded in the colloid. The method for manufacturing a light emitting structure according to claim 13, wherein part of the side lens is covered by the colloid, the substrate defines a height direction perpendicular to the first surface, and in the height direction The thickness of the side lens portion covering the colloid is not greater than 50% of the thickness of the side lens. The method for manufacturing a light-emitting structure according to claim 12, wherein the bottom bread of the ring-shaped wall body includes an inner fixing area and an outer fixing area located outside the inner fixing area; wherein, the base defines Parallel to a width direction of the first surface, and in the width direction, the width of the inner fixed area accounts for 10% to 70% of the width of the bottom surface of the annular wall, and the width of the inner fixed area At least 80% is bonded to the reinforcing portion, and at least a portion of the external fixing region is bonded to the first bonding layer. The method for manufacturing a light emitting structure according to claim 15, wherein, in the width direction, the width of the inner fixing area is further limited to account for 15% to 50% of the width of the bottom surface of the annular wall. The method for manufacturing a light emitting structure according to claim 12, wherein the substrate defines a height direction perpendicular to the first surface, and in the height direction, the height of the reinforcing portion is between 10 microns ( μm)~100 microns. The method for manufacturing a light emitting structure according to any one of claims 12 to 17, further fixing a light-transmitting cover plate to the top surface of the annular wall with a second bonding layer.

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