TW201940439A - Molten glass stirring chamber - Google Patents
Molten glass stirring chamber Download PDFInfo
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- TW201940439A TW201940439A TW108102705A TW108102705A TW201940439A TW 201940439 A TW201940439 A TW 201940439A TW 108102705 A TW108102705 A TW 108102705A TW 108102705 A TW108102705 A TW 108102705A TW 201940439 A TW201940439 A TW 201940439A
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- molten glass
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- 238000003756 stirring Methods 0.000 title claims abstract description 88
- 239000006060 molten glass Substances 0.000 title claims abstract description 70
- 239000000919 ceramic Substances 0.000 claims abstract description 61
- 239000010410 layer Substances 0.000 claims description 134
- 239000011521 glass Substances 0.000 claims description 25
- 229910000510 noble metal Inorganic materials 0.000 claims description 24
- 239000011256 inorganic filler Substances 0.000 claims description 21
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 21
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 18
- 239000010970 precious metal Substances 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 9
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 9
- 239000011247 coating layer Substances 0.000 claims description 9
- 239000000377 silicon dioxide Substances 0.000 claims description 9
- 235000012239 silicon dioxide Nutrition 0.000 claims description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 5
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 5
- FZFYOUJTOSBFPQ-UHFFFAOYSA-M dipotassium;hydroxide Chemical compound [OH-].[K+].[K+] FZFYOUJTOSBFPQ-UHFFFAOYSA-M 0.000 claims description 5
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims description 5
- 239000004568 cement Substances 0.000 claims description 3
- 230000000717 retained effect Effects 0.000 claims 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 43
- 229910052697 platinum Inorganic materials 0.000 description 21
- 238000005352 clarification Methods 0.000 description 18
- 238000005253 cladding Methods 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 16
- 239000000523 sample Substances 0.000 description 14
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 238000002844 melting Methods 0.000 description 11
- 230000008018 melting Effects 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 229910001260 Pt alloy Inorganic materials 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 239000001307 helium Substances 0.000 description 9
- 229910052734 helium Inorganic materials 0.000 description 9
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 229910010293 ceramic material Inorganic materials 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- 239000010948 rhodium Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 238000007665 sagging Methods 0.000 description 6
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 5
- 229910010272 inorganic material Inorganic materials 0.000 description 5
- 239000000395 magnesium oxide Substances 0.000 description 5
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 5
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 229910052762 osmium Inorganic materials 0.000 description 5
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 5
- 229910052707 ruthenium Inorganic materials 0.000 description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 239000011147 inorganic material Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052741 iridium Inorganic materials 0.000 description 3
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229910052703 rhodium Inorganic materials 0.000 description 3
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000002612 dispersion medium Substances 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052735 hafnium Inorganic materials 0.000 description 2
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 2
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- PXXKQOPKNFECSZ-UHFFFAOYSA-N platinum rhodium Chemical compound [Rh].[Pt] PXXKQOPKNFECSZ-UHFFFAOYSA-N 0.000 description 2
- HWLDNSXPUQTBOD-UHFFFAOYSA-N platinum-iridium alloy Chemical compound [Ir].[Pt] HWLDNSXPUQTBOD-UHFFFAOYSA-N 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000006479 redox reaction Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910000629 Rh alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- UBAZGMLMVVQSCD-UHFFFAOYSA-N carbon dioxide;molecular oxygen Chemical compound O=O.O=C=O UBAZGMLMVVQSCD-UHFFFAOYSA-N 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000003280 down draw process Methods 0.000 description 1
- 239000006025 fining agent Substances 0.000 description 1
- 239000005329 float glass Substances 0.000 description 1
- 238000007499 fusion processing Methods 0.000 description 1
- 239000006112 glass ceramic composition Substances 0.000 description 1
- 238000007496 glass forming Methods 0.000 description 1
- 238000005816 glass manufacturing process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003283 slot draw process Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B5/00—Melting in furnaces; Furnaces so far as specially adapted for glass manufacture
- C03B5/16—Special features of the melting process; Auxiliary means specially adapted for glass-melting furnaces
- C03B5/167—Means for preventing damage to equipment, e.g. by molten glass, hot gases, batches
- C03B5/1672—Use of materials therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B5/00—Melting in furnaces; Furnaces so far as specially adapted for glass manufacture
- C03B5/16—Special features of the melting process; Auxiliary means specially adapted for glass-melting furnaces
- C03B5/18—Stirring devices; Homogenisation
- C03B5/183—Stirring devices; Homogenisation using thermal means, e.g. for creating convection currents
- C03B5/185—Electric means
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B5/00—Melting in furnaces; Furnaces so far as specially adapted for glass manufacture
- C03B5/16—Special features of the melting process; Auxiliary means specially adapted for glass-melting furnaces
- C03B5/18—Stirring devices; Homogenisation
- C03B5/187—Stirring devices; Homogenisation with moving elements
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B5/00—Melting in furnaces; Furnaces so far as specially adapted for glass manufacture
- C03B5/16—Special features of the melting process; Auxiliary means specially adapted for glass-melting furnaces
- C03B5/18—Stirring devices; Homogenisation
- C03B5/187—Stirring devices; Homogenisation with moving elements
- C03B5/1875—Stirring devices; Homogenisation with moving elements of the screw or pump-action type
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B5/00—Melting in furnaces; Furnaces so far as specially adapted for glass manufacture
- C03B5/16—Special features of the melting process; Auxiliary means specially adapted for glass-melting furnaces
- C03B5/235—Heating the glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B5/00—Melting in furnaces; Furnaces so far as specially adapted for glass manufacture
- C03B5/16—Special features of the melting process; Auxiliary means specially adapted for glass-melting furnaces
- C03B5/42—Details of construction of furnace walls, e.g. to prevent corrosion; Use of materials for furnace walls
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
- C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/20—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing titanium compounds; containing zirconium compounds
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2214/00—Nature of the non-vitreous component
- C03C2214/20—Glass-ceramics matrix
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Ceramic Engineering (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Glass Compositions (AREA)
- Paper (AREA)
- Constitution Of High-Frequency Heating (AREA)
Abstract
Description
本申請案依照專利法主張韓國專利申請案第10-2018-0011606號之優先權權益,該韓國專利申請案是在2018年1月30日提出申請,本文仰賴該韓國專利申請案之內容且該韓國專利申請案以其全文併入本文作為參考。This application claims the priority right of Korean Patent Application No. 10-2018-0011606 in accordance with the Patent Law. The Korean patent application was filed on January 30, 2018. This article relies on the content of the Korean patent application and the The Korean patent application is incorporated herein by reference in its entirety.
本案揭露內容關於熔融玻璃攪拌腔室,該攪拌腔室能夠減少由熔融玻璃形成的玻璃片中的缺陷。The present disclosure is about a molten glass stirring chamber, which can reduce defects in a glass sheet formed of molten glass.
一種用於製造平坦玻璃片的設備,包括用於攪拌熔融玻璃的攪拌設備。An apparatus for manufacturing a flat glass sheet includes a stirring apparatus for stirring molten glass.
該攪拌設備包括:攪拌容器,組裝成容置熔融玻璃;覆蓋件,組裝成覆蓋該攪拌容器;以及攪拌葉片,位在該攪拌容器中。隨著時間過去,配置在該覆蓋件內側的基於鉑的熱源與氣氛中的氧反應。氧化的鉑會非期望地以鉑沉澱物的形式併入玻璃中,因此導致玻璃片中有缺陷。The stirring device includes: a stirring container assembled to contain molten glass; a cover member assembled to cover the stirring container; and a stirring blade positioned in the stirring container. Over time, the platinum-based heat source disposed inside the cover reacts with oxygen in the atmosphere. Oxidized platinum is undesirably incorporated into the glass as platinum precipitates, thus causing defects in the glass sheet.
本案揭露內容提供了一種能夠減少從覆蓋件發生的缺陷的熔融玻璃攪拌腔室。The disclosure of this case provides a molten glass stirring chamber capable of reducing defects occurring from a cover.
根據一或多個實施例,一種攪拌腔室可包括:攪拌容器,組裝成接收熔融玻璃;覆蓋件,定位在該攪拌容器上;以及攪拌器,穿過該覆蓋件且組裝成攪拌該熔融玻璃,其中該覆蓋件包括覆蓋件主體以及無機陶瓷層,該無機陶瓷層覆蓋該覆蓋件主體之表面,該覆蓋件主體是多孔的。According to one or more embodiments, a stirring chamber may include: a stirring container assembled to receive molten glass; a cover positioned on the stirring container; and a stirrer passing through the cover and assembled to stir the molten glass The cover includes a cover main body and an inorganic ceramic layer, the inorganic ceramic layer covers a surface of the cover main body, and the cover main body is porous.
該無機陶瓷層可包括玻璃層。玻璃層可包括約80重量%至約90重量%的二氧化矽(SiO2 )、約1重量%至約3重量%的氧化硼(B2 O3 )、約2重量%至約5重量%的氧化鋁(Al2 O3 )、約1重量%至約3重量%的氧化鈉(Na2 O)、約2重量%至約4重量%的氧化鉀(K2 O)、約2重量%至約6重量%的氧化鋅(ZnO)、以及約0.1重量%至約2重量%的氧化鋯(ZrO2 )。The inorganic ceramic layer may include a glass layer. The glass layer may include about 80% to about 90% by weight of silicon dioxide (SiO 2 ), about 1% to about 3% by weight boron oxide (B 2 O 3 ), and about 2% to about 5% by weight Aluminum oxide (Al 2 O 3 ), about 1% to about 3% by weight sodium oxide (Na 2 O), about 2% to about 4% by weight potassium oxide (K 2 O), about 2% by weight To about 6% by weight of zinc oxide (ZnO), and about 0.1 to about 2% by weight of zirconia (ZrO 2 ).
覆蓋件主體可包括凹槽和配置在凹槽內的熱源。該熱源可以保留在由無機填料包圍的凹槽中。該無機陶瓷層可以覆蓋至少該覆蓋件主體的頂表面和底表面,以及該無機填料的暴露部分。該無機填料可以是水泥。The cover body may include a groove and a heat source disposed within the groove. The heat source may remain in the groove surrounded by the inorganic filler. The inorganic ceramic layer may cover at least a top surface and a bottom surface of the cover body, and an exposed portion of the inorganic filler. The inorganic filler may be cement.
該覆蓋件可進一步包括貴金屬包覆層,該貴金屬包覆層覆蓋至少該覆蓋件主體的頂表面和底表面,該貴金屬包覆層設置在該無機陶瓷層上。該覆蓋件可進一步包括耐火氧化物層,該耐火氧化物層覆蓋該貴金屬包覆層的面向該攪拌容器之內部的表面。The cover may further include a noble metal coating layer covering at least a top surface and a bottom surface of the cover body, and the noble metal coating layer is disposed on the inorganic ceramic layer. The cover may further include a refractory oxide layer covering the surface of the precious metal coating layer facing the inside of the stirring container.
該覆蓋件可以具有中心孔,該攪拌器穿過該中心孔,並且該覆蓋件可沿著邊界區域分成第一主體和第二主體,其中該第一主體包括在縱向上沿該邊界區域水平突出的片部分。該片部分可至少部分重疊該第二主體。該片部分可設置在該第一主體的面向該攪拌容器之內部的下部上。The cover may have a central hole through which the agitator passes, and the cover may be divided into a first body and a second body along a boundary region, wherein the first body includes horizontally protruding along the boundary region in a longitudinal direction. The piece section. The sheet portion may at least partially overlap the second body. The sheet portion may be disposed on a lower portion of the first body facing the inside of the stirring container.
根據一或多個實施例,一種攪拌腔室可包括:攪拌容器,組裝成接收熔融玻璃;覆蓋件,在該攪拌容器上;以及攪拌器,穿過覆蓋件且組裝成攪拌該熔融玻璃,其中該覆蓋件包括覆蓋件主體,該覆蓋件主體具有中心孔,而該攪拌器穿過該中心孔,該覆蓋件主體是多孔的,其中該覆蓋件主體包括沿著邊界區域的第一主體和第二主體,且其中該第一主體包括在縱向上沿邊界區域水平突出的片部分。According to one or more embodiments, a stirring chamber may include: a stirring container assembled to receive molten glass; a cover on the stirring container; and a stirrer passing through the cover and assembled to stir the molten glass, wherein The cover includes a cover body having a center hole and the agitator passes through the center hole. The cover body is porous, wherein the cover body includes a first body and a first body along a boundary region. Two main bodies, and wherein the first main body includes a sheet portion that protrudes horizontally along a boundary region in a longitudinal direction.
該片部分可至少部分重疊該第二主體。該第一主體和第二主體中的每一者的表面可由無機陶瓷層所覆蓋。該第一主體的下部包括貴金屬包覆層,並且該片部分附接到該貴金屬包覆層的表面。The sheet portion may at least partially overlap the second body. The surface of each of the first body and the second body may be covered by an inorganic ceramic layer. A lower portion of the first body includes a precious metal coating, and the sheet is partially attached to a surface of the precious metal coating.
根據一或多個實施例,一種攪拌腔室可包括:攪拌容器,組裝成接收熔融玻璃;覆蓋件,在該攪拌容器上;及攪拌器,穿過該覆蓋件且組裝成攪拌該熔融玻璃,其中該覆蓋件包括貴金屬包覆層,該貴金屬包覆層至少在該覆蓋件的下表面上,其中面向該熔融玻璃的該貴金屬包覆層的表面由耐火氧化物層所覆蓋,該耐火氧化物層包括:約3重量%至約5重量%的CaO、約0.2重量%至約1重量%的SiO2 、約0.2重量%至約1重量%的Al2 O3 、約0.5重量%至約3.5重量%的HfO2 、和餘量的ZrO2 。According to one or more embodiments, a stirring chamber may include: a stirring container assembled to receive molten glass; a cover on the stirring container; and a stirrer passing through the cover and assembled to stir the molten glass, Wherein the cover includes a noble metal coating, the noble metal coating is at least on the lower surface of the cover, wherein the surface of the noble metal coating facing the molten glass is covered by a refractory oxide layer, the refractory oxide layer comprising: from about 3% to about 5 wt% of CaO, from about 0.2% to about 1 wt% of SiO 2, from about 0.2% to about 1 wt% of Al 2 O 3, from about 0.5 wt% to about 3.5 HfO 2 by weight and the balance of ZrO 2 .
該耐火氧化物層可進一步包含約0.01重量%至約0.3重量%的Fe2 O3 和約0.01重量%至約0.9重量%的MgO。The refractory oxide layer may further include about 0.01% by weight to about 0.3% by weight of Fe 2 O 3 and about 0.01% by weight to about 0.9% by weight of MgO.
該耐火氧化物層的厚度可為約2密耳至約8密耳。The refractory oxide layer may have a thickness of about 2 mils to about 8 mils.
該覆蓋件可包括具有中心孔的覆蓋件主體,該攪拌器主體穿過該中心孔,其中該覆蓋件沿著邊界區域分成第一主體和第二主體,該邊界區域延伸穿過該中心孔,其中該第一主體和第二主體之各者的表面由無機陶瓷層覆蓋,並且水平突出跨越該邊界區域的片部分設置在該第一主體上。The cover may include a cover body having a central hole through which the agitator body is divided, wherein the cover is divided into a first body and a second body along a boundary area, the boundary area extending through the center hole, The surface of each of the first body and the second body is covered by an inorganic ceramic layer, and a sheet portion protruding horizontally across the boundary region is disposed on the first body.
現在將參考所附圖式於下文更全面地描述示範性實施例;然而,可以用不同的形式體現申請專利範圍,並且不應該將申請專利範圍解釋為限於本文提出的實施例。毋寧是提供這些實施例使得本案揭露內容徹底且完整,並且會向發明所屬技術領域中具有通常知識者充分傳達示範性實施方式。Exemplary embodiments will now be described more fully hereinafter with reference to the accompanying drawings; however, the patent application scope may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that the disclosure of this case is thorough and complete, and will fully convey the exemplary implementation to those with ordinary knowledge in the technical field to which the invention belongs.
在該等圖式中,為了清楚說明,可誇張化層和區域的尺寸。也應理解,當層或元件被稱為在另一層或元件「上」時,該層或元件可直接在另一層或元件上,或者也可以存在居中的層。另外,也應理解,當層被稱為在兩個層「之間」時,該層能夠是兩層之間的唯一層,或者也可以存在一或多個居中層。相同的元件符號在全文中表示相同的元件。In the drawings, the dimensions of the layers and regions may be exaggerated for clarity. It will also be understood that when a layer or element is referred to as being "on" another layer or element, it can be directly on the other layer or element, or intervening layers may also be present. In addition, it should also be understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present. The same element symbol indicates the same element throughout.
如本文所使用的,術語「及/或」(或是和/或)包括一或多個相關所列項目的任何和所有組合。例如,術語「或」並非排他性,且可理解為具有與「及/或」相同的含義。當在一列元件前有諸如「至少一者」之類的表達方式時,該表達方式是修飾整列的元件而不修飾該列的各個元件。As used herein, the term "and / or" (or and / or) includes any and all combinations of one or more of the associated listed items. For example, the term "or" is not exclusive and can be understood to have the same meaning as "and / or". When there is an expression such as "at least one" in front of a list of elements, the expression is to modify the entire list of elements without modifying the individual elements of the list.
儘管諸如「第一」、「第二」等之術語可用於描述各種部件,但這些部件不應限於上述術語。上述術語僅用於將一個部件與另一個部件區隔開。例如,下文論述的第一部件可以被稱為第二部件,並且類似地,在不偏離本案揭露內容的教示下,第二部件可以被稱為第一部件。Although terms such as "first", "second", etc. may be used to describe various components, these components should not be limited to the above terms. The above terms are only used to distinguish one component from another. For example, the first component discussed below may be referred to as the second component, and similarly, the second component may be referred to as the first component without departing from the teachings of the disclosure of the present case.
本文使用的術語是為了僅描述特定實施例,而不希望這些術語構成限制。除非在上下文中有明顯不同的含義,否則以單數形式使用的表達涵蓋了複數形式的表達。應當理解,當在本說明書中使用時,例如「包括」及/或「包含」之術語指定所述特徵、整體、步驟、操作、元件、部件、及/或上述之群組的存在,但不排除存在或添加一或多個其他的特徵、整體、步驟、操作、元件、部件、及/或上述之群組。The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. An expression used in the singular encompasses the expression in the plural, unless it has a clearly different meaning in the context. It should be understood that when used in this specification, terms such as "including" and / or "including" designate the existence of stated features, integers, steps, operations, elements, components, and / or groups described above, but not Exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or groups of the foregoing.
除非另外界定,否則本文使用的所有術語(包括技術性及科學性的術語)具有如本申請案所屬之領域中具有通常知識者所通常理解的含義相同的含義。將進一步理解,諸如在常用辭典中定義的那些術語應當解釋為具有與他們在相關領域的上下文中的含義一致的含義,並且不應理解為理想化或過於正式的語感,除非在本文中明顯如此界定。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted to have meanings consistent with their meaning in the context of the relevant field, and should not be interpreted as idealized or overly formal, unless it is clearly so Define.
除非本文另有指定或上下文明顯有所牴觸,否則本文所述的所有方法的操作可以以任何合適的順序執行。該等實施例不限於所描述的操作順序。例如,兩個連續描述的製程可以實質上同時執行或者以與所描述之順序相反的順序執行。The operations of all methods described herein can be performed in any suitable order unless otherwise specified herein or otherwise clearly contradicted by context. The embodiments are not limited to the described sequence of operations. For example, two successively described processes may be performed substantially simultaneously or in a reverse order to the described order.
就此而言,可以預期由於例如製造技術及/或公差導致的繪示形狀的差異。因此,不應將實施例詮釋為限於本文所說明的區域的特定形狀,而是包括例如由製造導致的形狀偏差。In this regard, differences in the illustrated shapes due to, for example, manufacturing techniques and / or tolerances can be expected. Therefore, the embodiments should not be construed as being limited to the specific shape of the regions described herein, but include, for example, shape deviations caused by manufacturing.
圖1是根據各種實施例的示範性玻璃製造設備1的圖。FIG. 1 is a diagram of an exemplary glass manufacturing apparatus 1 according to various embodiments.
參考圖1,玻璃製造設備1可包括熔融容器100、澄清容器200、熔融玻璃攪拌腔室300、遞送容器500、和形成設備700。根據一些實施例,玻璃製造設備1可製造片型玻璃,然而在另外的實施例中,玻璃製造設備可製造各種其他玻璃製品,包括玻璃棒、玻璃管、玻璃容器、和玻璃封套。Referring to FIG. 1, the glass manufacturing apparatus 1 may include a melting container 100, a clarification container 200, a molten glass stirring chamber 300, a delivery container 500, and a forming apparatus 700. According to some embodiments, the glass manufacturing apparatus 1 may manufacture sheet glass, however, in other embodiments, the glass manufacturing apparatus may manufacture various other glass articles, including glass rods, glass tubes, glass containers, and glass envelopes.
熔融容器100、澄清容器200、熔融玻璃攪拌腔室300、遞送容器500和形成設備700可以是串聯的玻璃製造製程站。製造玻璃產品的預定製程在這些站進行。根據一些實施例,由玻璃製造設備執行的製造製程可以包括向下曳引製程、狹槽曳引熔合形成製程(包括雙熔合製程)、浮式玻璃形成製程和輥軋製程。The melting container 100, the clarification container 200, the molten glass stirring chamber 300, the delivery container 500, and the forming apparatus 700 may be glass manufacturing process stations connected in series. The predetermined processes for manufacturing glass products are performed at these stations. According to some embodiments, the manufacturing process performed by the glass manufacturing equipment may include a down-draw process, a slot-draw fusion forming process (including a double fusion process), a float glass forming process, and a rolling process.
根據一些實施例,熔融容器100、澄清容器200、熔融玻璃攪拌腔室300、遞送容器500和形成設備700中的各者可包括含鉑金屬,例如鉑或鉑-銠、鉑-銥、及上述材料之組合。根據一些實施例,熔融容器100、澄清容器200、熔融玻璃攪拌腔室300、遞送容器500和形成設備700中的每一個可包括鈀、錸、釕、及鋨,以及其他金屬。根據一些實施例,形成設備700可包括陶瓷材料或玻璃陶瓷材料。According to some embodiments, each of the melting vessel 100, the clarification vessel 200, the molten glass stirring chamber 300, the delivery vessel 500, and the forming apparatus 700 may include a platinum-containing metal such as platinum or platinum-rhodium, platinum-iridium, and the above A combination of materials. According to some embodiments, each of the melting vessel 100, the clarification vessel 200, the molten glass stirring chamber 300, the delivery vessel 500, and the forming apparatus 700 may include palladium, osmium, ruthenium, and osmium, and other metals. According to some embodiments, the forming apparatus 700 may include a ceramic material or a glass-ceramic material.
熔融容器100接收來自儲存容器10的批料11。批料11是透過批次遞送設備13插入熔融容器100中,批次遞送設備13是由驅動裝置15提供動力。可將選擇性控制器17組裝成操作驅動裝置15以將期望量的批料11引入熔融容器100中,如箭號a1所指。根據一些實施例,玻璃液高探針19可用於測量豎管21中的熔融玻璃MG的液高並且透過通訊線路23將測量到的熔融玻璃MG的液高傳輸到控制器17。The melting vessel 100 receives a batch 11 from a storage vessel 10. The batch 11 is inserted into the melting container 100 through a batch delivery device 13, which is powered by a driving device 15. The selective controller 17 may be assembled to operate the driving device 15 to introduce a desired amount of the batch 11 into the melting vessel 100, as indicated by arrow a1. According to some embodiments, the glass liquid height probe 19 may be used to measure the liquid height of the molten glass MG in the standpipe 21 and transmit the measured liquid height of the molten glass MG to the controller 17 through the communication line 23.
根據一些實施例,澄清容器200藉由第一導管150連接到熔融容器100。第一導管150包括熔融玻璃MG流過的通道。下文描述的第二導管250和第三導管350也提供熔融玻璃MG流過的通道。第一導管150可包括具導電性且可在高溫條件下使用的材料。根據一些實施例,第一導管可包括含鉑金屬,例如鉑、鉑-銠、鉑-銥、或上述材料之組合。根據一些實施例,第一導管至第三導管可包括金屬,例如鉬、鈀、錸、鉭、鈦、鎢、釕、鋨、鋯、或上述金屬之合金,及/或二氧化鋯。According to some embodiments, the clarification vessel 200 is connected to the melting vessel 100 by a first conduit 150. The first duct 150 includes a passage through which the molten glass MG flows. The second duct 250 and the third duct 350 described below also provide a passage through which the molten glass MG flows. The first conduit 150 may include a material that is conductive and can be used under high temperature conditions. According to some embodiments, the first catheter may include a platinum-containing metal, such as platinum, platinum-rhodium, platinum-iridium, or a combination of the foregoing materials. According to some embodiments, the first to third conduits may include a metal, such as molybdenum, palladium, hafnium, tantalum, titanium, tungsten, ruthenium, hafnium, zirconium, or an alloy of the above metals, and / or zirconium dioxide.
澄清容器200用作精煉(refining)管。澄清容器200位於熔融容器100的下游。澄清容器200接收來自熔融容器100的熔融玻璃MG。根據一些實施例,可在澄清容器200中執行高溫製程以將氣泡(即,氣態內含物(inclusion))從熔融玻璃MG移除。根據一些實施例,澄清容器200組裝成在熔融玻璃MG通過澄清容器200的同時藉由加熱熔融玻璃MG而從熔融玻璃MG中移除氣泡。根據一些實施例,當在澄清容器200中加熱熔融玻璃MG時,熔融玻璃MG中所含的澄清劑可引發氧化還原反應,從而造成氧及其它氣體從熔融玻璃MG中移除。詳言之,熔融玻璃MG中所含的氣泡可包括氧、二氧化碳、及/或二氧化硫,且可與在澄清劑的還原反應中生成的氧結合,因此,氣泡的體積可能增加。生長的氣泡可能會朝向澄清容器200中的熔融玻璃MG的自由表面漂浮,從而與熔融玻璃MG分離。氣泡可透過澄清容器200的上部的氣相空間排出到澄清容器200的外部。The clarification container 200 functions as a refining tube. The clarification vessel 200 is located downstream of the melting vessel 100. The clarification container 200 receives the molten glass MG from the melting container 100. According to some embodiments, a high temperature process may be performed in the clarification container 200 to remove air bubbles (ie, gaseous inclusions) from the molten glass MG. According to some embodiments, the clarification container 200 is assembled to remove bubbles from the molten glass MG by heating the molten glass MG while the molten glass MG passes through the clarification container 200. According to some embodiments, when the molten glass MG is heated in the clarification container 200, the clarifier contained in the molten glass MG may initiate a redox reaction, thereby causing oxygen and other gases to be removed from the molten glass MG. Specifically, the bubbles contained in the molten glass MG may include oxygen, carbon dioxide, and / or sulfur dioxide, and may be combined with oxygen generated in the reduction reaction of the fining agent, and thus the volume of the bubbles may increase. The growing bubbles may float toward the free surface of the molten glass MG in the clarification container 200, thereby being separated from the molten glass MG. The air bubbles can be discharged to the outside of the clarification container 200 through the gas phase space in the upper part of the clarification container 200.
根據一些實施例,熔融玻璃攪拌腔室300位於澄清容器200的下游。熔融玻璃攪拌腔室300可使從澄清容器200供應的熔融玻璃MG均質化(homogenize)。可在熔融玻璃攪拌腔室300中設置攪拌器310,以相對於熔融玻璃攪拌腔室300旋轉,而使熔融玻璃MG在熔融玻璃攪拌腔室300中流動及混合。攪拌器310可攪拌熔融玻璃MG,以使熔融玻璃MG在離開攪拌腔室300之前均質化。According to some embodiments, the molten glass stirring chamber 300 is located downstream of the clarification vessel 200. The molten glass stirring chamber 300 can homogenize the molten glass MG supplied from the clarification container 200. A stirrer 310 may be provided in the molten glass stirring chamber 300 to rotate relative to the molten glass stirring chamber 300 so that the molten glass MG flows and mixes in the molten glass stirring chamber 300. The stirrer 310 may stir the molten glass MG to homogenize the molten glass MG before leaving the stirring chamber 300.
遞送容器500可位於熔融玻璃攪拌腔室300的下游。遞送容器500藉由第三導管350連接到熔融玻璃攪拌腔室300。出口導管600連接到遞送容器500。熔融玻璃MG經過出口導管600轉移到形成設備700的入口650。The delivery container 500 may be located downstream of the molten glass stirring chamber 300. The delivery container 500 is connected to the molten glass stirring chamber 300 by a third conduit 350. The outlet conduit 600 is connected to a delivery container 500. The molten glass MG is transferred through the outlet duct 600 to the inlet 650 of the forming apparatus 700.
形成設備700接收來自遞送容器500的熔融玻璃MG。形成設備700可將熔融玻璃MG形成為片型玻璃產品,然而在進一步的實施例中,形成設備可以將熔融玻璃形成為其他形狀的物體,例如桿、管、封套等。舉例而言,形成設備700可包括熔合曳引機器,用於將熔融玻璃MG形成為連續的玻璃帶。流進形成設備700的熔融玻璃MG可在形成設備700中溢流。溢流的熔融玻璃MG透過重力以及適當排列的輥(諸如邊緣輥750及拉引輥800)之組合以向下的方向移動,而形成熔融玻璃帶。The forming apparatus 700 receives the molten glass MG from the delivery container 500. The forming apparatus 700 may form the molten glass MG into a sheet-type glass product, however, in a further embodiment, the forming apparatus may form the molten glass into other shapes of objects, such as rods, tubes, envelopes, and the like. For example, the forming apparatus 700 may include a fusion traction machine for forming the molten glass MG into a continuous glass ribbon. The molten glass MG flowing into the forming apparatus 700 may overflow in the forming apparatus 700. The overflowing molten glass MG is moved in a downward direction by a combination of gravity and appropriately arranged rolls such as an edge roll 750 and a drawing roll 800 to form a molten glass ribbon.
圖2是根據一實施例的熔融玻璃攪拌腔室300的透視圖。FIG. 2 is a perspective view of a molten glass stirring chamber 300 according to an embodiment.
參考圖2,熔融玻璃攪拌腔室300可包括:攪拌容器320,組裝成在攪拌容器320中容納熔融玻璃MG;覆蓋件330,配置在攪拌容器320上;及攪拌器310,貫穿覆蓋件330並組裝成攪拌熔融玻璃MG。Referring to FIG. 2, the molten glass stirring chamber 300 may include: a stirring container 320 assembled to receive the molten glass MG in the stirring container 320; a cover 330 disposed on the stirring container 320; and a stirrer 310 penetrating the cover 330 and Assembled into a stirred molten glass MG.
攪拌容器320可連接到第二導管250和第三導管350。如上文所述,熔融玻璃MG透過第二導管250引入攪拌容器320中,且透過第三導管350從攪拌容器320排出。The stirring vessel 320 may be connected to the second and third ducts 250 and 350. As described above, the molten glass MG is introduced into the stirring container 320 through the second conduit 250 and is discharged from the stirring container 320 through the third conduit 350.
攪拌器310可包括攪拌桿314和附接到攪拌桿314的多個葉片312。The agitator 310 may include a stirring rod 314 and a plurality of blades 312 attached to the stirring rod 314.
覆蓋件330組裝成覆蓋攪拌容器320之開口。攪拌桿314所穿過的中心孔338可設置在覆蓋件330的中心。可以在覆蓋件330內側設置熱源332。The cover 330 is assembled to cover the opening of the stirring container 320. A center hole 338 through which the stirring rod 314 passes may be provided in the center of the cover 330. A heat source 332 may be provided inside the cover 330.
覆蓋件330可包括兩個主體,第一主體330a和第二主體330b。第一主體330a和第二主體330b可以彼此分離,在第一主體330a與第二主體330b之間配置有邊界區域並且邊界區域與中心孔338交叉。儘管圖2說明其中覆蓋件330被分成兩個主體的範例,但在另一實施例中,覆蓋件330可分成三個或更多個主體。The cover 330 may include two bodies, a first body 330a and a second body 330b. The first body 330a and the second body 330b may be separated from each other, and a boundary area is disposed between the first body 330a and the second body 330b and the boundary area intersects the center hole 338. Although FIG. 2 illustrates an example in which the cover 330 is divided into two bodies, in another embodiment, the cover 330 may be divided into three or more bodies.
第一主體330a和第二主體330b可各自包括覆蓋件主體334和嵌入該主體中的熱源332。The first body 330a and the second body 330b may each include a cover body 334 and a heat source 332 embedded in the body.
熱源332包括鉑或鉑合金,並且當向熱源332供應電力時可生成熱。詳言之,熱源332可包括純鉑或鉑合金。鉑合金可以是鉑與下述金屬中之至少一者的合金:銠(Rh)、銥(Ir)、釕(Ru)、鈀(Pd)、和鋨(Os)。The heat source 332 includes platinum or a platinum alloy, and heat may be generated when power is supplied to the heat source 332. In detail, the heat source 332 may include pure platinum or a platinum alloy. The platinum alloy may be an alloy of platinum and at least one of the following metals: rhodium (Rh), iridium (Ir), ruthenium (Ru), palladium (Pd), and osmium (Os).
覆蓋件主體334可包括耐火材料。在一些實施例中,覆蓋件主體334可包括多孔材料。例如,覆蓋件主體334可包括諸如Crystallite HF339(可購自BUCHER Emhart Glass)或AN485(可購自Saint Gobain)的材料。The cover body 334 may include a refractory material. In some embodiments, the cover body 334 may include a porous material. For example, the cover body 334 may include materials such as Crystallite HF339 (available from BUCHER Emhart Glass) or AN485 (available from Saint Gobain).
圖3是根據一實施例的覆蓋件330的第一主體330a的透視圖,且圖4說明沿圖3的線IV-IV'截取的截面。儘管下文描述聚焦在第一主體330a上,但是發明所屬技術領域中具有通常知識者將理解,該描述可同樣應用於第二主體330b,或者在其中覆蓋件330分成三個或更多個主體的實施例中的額外主體。FIG. 3 is a perspective view of the first body 330a of the cover 330 according to an embodiment, and FIG. 4 illustrates a cross section taken along a line IV-IV 'of FIG. Although the following description focuses on the first body 330a, those having ordinary knowledge in the technical field to which the invention pertains will understand that the description can be equally applied to the second body 330b, or the cover 330 is divided into three or more Extra subjects in the examples.
參考圖3和圖4,覆蓋件主體334可以設置有凹槽334R,凹槽334R組裝成容納熱源332。凹槽334R可在圖4的視線方向延伸,或者可在另一個方向上延伸,諸如覆蓋件主體334的周向或徑向。熱源332可以容納在凹槽334R中。Referring to FIGS. 3 and 4, the cover body 334 may be provided with a groove 334R, which is assembled to receive the heat source 332. The groove 334R may extend in the line of sight direction of FIG. 4, or may extend in another direction, such as the circumferential or radial direction of the cover body 334. The heat source 332 may be received in the groove 334R.
熱源332可以嵌入並固定在由無機填料334f圍繞的凹槽334R中。無機填料334f可例如為水泥。The heat source 332 may be embedded and fixed in the groove 334R surrounded by the inorganic filler 334f. The inorganic filler 334f may be, for example, cement.
如圖4中所說明,無機填料334f可至少部分地從覆蓋件主體334暴露。在一些實施例中,無機填料334f之表面可以與覆蓋件主體334的表面共面。As illustrated in FIG. 4, the inorganic filler 334 f may be at least partially exposed from the cover body 334. In some embodiments, the surface of the inorganic filler 334f may be coplanar with the surface of the cover body 334.
覆蓋件主體334的表面可覆蓋有無機陶瓷層336。在一個實施例中,如本文所用的無機陶瓷層336是金屬和非金屬元素之間的無機化合物,對該化合物而言,原子間鍵結是完全離子性(或主要離子性),且無機陶瓷層所包括的材料具有結晶、部分結晶、或非結晶(即玻璃)的結構。在一些實施例中,無機陶瓷層336可以是包括二氧化矽作為主要成分的玻璃層。例如,無機陶瓷層336可包括約80重量%至約90重量%的二氧化矽(SiO2 )、約1重量%至約3重量%的氧化硼(B2 O3 )、約2重量%至約5重量%的氧化鋁(Al2 O3 )、約1重量%至約3重量%的氧化鈉(Na2 O)、約2重量%至約4重量%的氧化鉀(K2 O)、約2重量%至約6重量%的氧化鋅(ZnO)和約0.1重量%至約2重量%的氧化鋯(ZrO2 )。The surface of the cover body 334 may be covered with an inorganic ceramic layer 336. In one embodiment, the inorganic ceramic layer 336 as used herein is an inorganic compound between a metal and a non-metal element, for which the interatomic bond is completely ionic (or mainly ionic), and the inorganic ceramic The material included in the layer has a crystalline, partially crystalline, or non-crystalline (ie, glass) structure. In some embodiments, the inorganic ceramic layer 336 may be a glass layer including silicon dioxide as a main component. For example, the inorganic ceramic layer 336 may include about 80% to about 90% by weight of silicon dioxide (SiO 2 ), about 1% to about 3% by weight boron oxide (B 2 O 3 ), and about 2% by weight to about 5 wt.% alumina (Al 2 O 3),% by weight to about 3% by weight of sodium oxide of about 1 (Na 2 O), from about 2 wt.% to about 4 wt% of potassium oxide (K 2 O), About 2% to about 6% by weight of zinc oxide (ZnO) and about 0.1% to about 2% by weight of zirconia (ZrO 2 ).
在一些實施例中,無機陶瓷層336可以覆蓋覆蓋件主體334的上表面。在一些實施例中,無機陶瓷層336可以覆蓋覆蓋件主體334的下表面。在一些實施例中,無機陶瓷層336可以覆蓋無機填料334f的暴露表面。In some embodiments, the inorganic ceramic layer 336 may cover the upper surface of the cover body 334. In some embodiments, the inorganic ceramic layer 336 may cover the lower surface of the cover body 334. In some embodiments, the inorganic ceramic layer 336 may cover the exposed surface of the inorganic filler 334f.
期望防止或減少氧與在熱源332中所包含的鉑接觸,因為若非如此鉑可能會由於在高溫下與氧接觸而氧化且以氣態PtO2 損失。不期望的是,這種氣態PtO2 可能會在非期望的位置作為冷凝物沉積,包括作為攪拌腔室300內的熔融玻璃MG中的內含物。無機陶瓷層336可防止或減少在熱源332中所包括鉑與氧的接觸。It is desirable to prevent or reduce oxygen from coming into contact with the platinum contained in the heat source 332, because otherwise platinum may be oxidized due to contact with oxygen at high temperatures and lost in gaseous PtO 2 . Undesirably, such gaseous PtO 2 may be deposited as a condensate at undesired locations, including as an inclusion in the molten glass MG in the stirring chamber 300. The inorganic ceramic layer 336 may prevent or reduce the contact of platinum and oxygen included in the heat source 332.
無機陶瓷層336的厚度可以在約1mm至約5mm的範圍內。如果無機陶瓷層336的厚度太大,則可能由於層336的剝離而產生顆粒。另一方面,如果無機陶瓷層336的厚度太小,則防止在熱源332中包括的鉑氧化的效果可能不充分。The thickness of the inorganic ceramic layer 336 may be in a range of about 1 mm to about 5 mm. If the thickness of the inorganic ceramic layer 336 is too large, particles may be generated due to the peeling of the layer 336. On the other hand, if the thickness of the inorganic ceramic layer 336 is too small, the effect of preventing the oxidation of platinum included in the heat source 332 may be insufficient.
另一方面,當覆蓋件主體334為多孔時,覆蓋件主體334和無機陶瓷層336之間的界面可能是模糊的。換言之,無機陶瓷層336可能會在與多孔覆蓋件主體334接觸的區域中部分地滲透到覆蓋件主體334的孔隙中。On the other hand, when the cover body 334 is porous, the interface between the cover body 334 and the inorganic ceramic layer 336 may be blurred. In other words, the inorganic ceramic layer 336 may partially penetrate into the pores of the cover body 334 in a region in contact with the porous cover body 334.
圖5是一圖表,概念式說明相對於沿圖4的線V-V'切割的截面界定覆蓋件主體334和無機陶瓷層336之間之界面的方法。在圖5中,橫軸表示沿圖4中的線V-V'的位置,而縱軸表示構成無機陶瓷層336的材料和構成覆蓋件主體334的材料的質量分數。參考圖5,可有這樣的區段:其中覆蓋件主體334和無機陶瓷層336的質量分數圍繞界面IF逐漸變化,在該界面處,覆蓋件主體334與無機陶瓷層336接觸。覆蓋件主體334和無機陶瓷層336的質量分數分別為約0.5之處的虛擬(virtual)界面可界定為覆蓋件主體334和無機陶瓷層336之間的界面。FIG. 5 is a diagram conceptually illustrating a method of defining an interface between the cover body 334 and the inorganic ceramic layer 336 with respect to a cross section cut along a line VT ′ of FIG. 4. In FIG. 5, the horizontal axis represents a position along a line VT ′ in FIG. 4, and the vertical axis represents a mass fraction of a material constituting the inorganic ceramic layer 336 and a material constituting the cover body 334. Referring to FIG. 5, there may be a section in which the mass fraction of the cover body 334 and the inorganic ceramic layer 336 gradually changes around the interface IF, at which the cover body 334 is in contact with the inorganic ceramic layer 336. A virtual interface where the masses of the cover body 334 and the inorganic ceramic layer 336 are about 0.5, respectively, may be defined as the interface between the cover body 334 and the inorganic ceramic layer 336.
圖6是根據另一實施例的第一主體330a’的側剖視圖。圖6的第一主體330a’與圖4的第一主體330a不同之處在於,無機陶瓷層336a僅形成在覆蓋件主體334的下表面上。因此,在下文中,將主要描述這些差異,並且將省略多餘的描述。FIG. 6 is a side sectional view of a first body 330a 'according to another embodiment. The first body 330a 'of FIG. 6 is different from the first body 330a of FIG. 4 in that the inorganic ceramic layer 336a is formed only on the lower surface of the cover body 334. Therefore, in the following, these differences will be mainly described, and redundant descriptions will be omitted.
參考圖6,無機陶瓷層336a並非形成在覆蓋件主體334的整個表面上。在一些實施例中,無機陶瓷層336a可以僅塗佈覆蓋件主體334的上面設有熱源332的表面。在一些實施例中,無機陶瓷層336a可以覆蓋無機填料334f的暴露表面。在一些實施例中,無機陶瓷層336a可以覆蓋覆蓋件主體334之表面,該表面實質上與無機填料334f的暴露表面共面。在一些實施例中,無機陶瓷層336a可不覆蓋覆蓋件主體334的與無機填料334f的暴露表面不共面的表面。Referring to FIG. 6, the inorganic ceramic layer 336 a is not formed on the entire surface of the cover body 334. In some embodiments, the inorganic ceramic layer 336a may coat only the surface of the cover body 334 on which the heat source 332 is provided. In some embodiments, the inorganic ceramic layer 336a may cover the exposed surface of the inorganic filler 334f. In some embodiments, the inorganic ceramic layer 336a may cover the surface of the cover body 334, which is substantially coplanar with the exposed surface of the inorganic filler 334f. In some embodiments, the inorganic ceramic layer 336a may not cover a surface of the cover body 334 that is not coplanar with the exposed surface of the inorganic filler 334f.
由於氧對熱源332中的鉑進行氧化的最短途徑是來自無機填料334f所在之側上的表面,所以即使無機陶瓷層336a僅形成在一個表面(也就是,僅凹槽334R形成之表面上),也可類似地獲得如圖4中防止鉑氧化及損失的效果。再者,圖6的實施例中的第一主體330a'比起圖4之實施例使用更少量的無機陶瓷層336a,因此第一主體330a’相對地更具成本效益並且易於製造。此外,由於第一主體330a’在重量上可以比圖4的第一主體330a輕(由於較少量的無機陶瓷層336所致),因此在操作溫度下覆蓋件330的弛垂可能不太會發生。Since the shortest way for oxygen to oxidize platinum in the heat source 332 is from the surface on the side where the inorganic filler 334f is located, even if the inorganic ceramic layer 336a is formed on only one surface (that is, only the surface on which the groove 334R is formed) The effect of preventing platinum oxidation and loss as shown in FIG. 4 can also be obtained similarly. Furthermore, the first body 330a 'in the embodiment of Fig. 6 uses a smaller amount of the inorganic ceramic layer 336a than the embodiment of Fig. 4, so the first body 330a' is relatively more cost-effective and easier to manufacture. In addition, since the first body 330a 'may be lighter in weight than the first body 330a of FIG. 4 (due to a smaller amount of the inorganic ceramic layer 336), the sagging of the cover 330 may be less likely at the operating temperature. occur.
圖7A至圖7C是側剖視圖,根據實施例依序說明製造第一主體330a和330a’的方法。7A to 7C are side sectional views sequentially explaining a method of manufacturing the first bodies 330a and 330a 'according to the embodiment.
參考圖7A,凹槽334R形成在覆蓋件主體334的下表面上。凹槽334R可具有足以在凹槽334R中容納熱源332(參見圖7B)的尺寸。Referring to FIG. 7A, a groove 334R is formed on a lower surface of the cover body 334. The groove 334R may have a size sufficient to receive the heat source 332 (see FIG. 7B) in the groove 334R.
參考圖7B,熱源332可配置在凹槽334R中,並且凹槽334R的內表面與熱源332之間的空間可以填有無機填料334f。由於上文已詳細描述了無機填料334f的材料,因此省略該材料的進一步詳細描述。Referring to FIG. 7B, the heat source 332 may be disposed in the groove 334R, and a space between the inner surface of the groove 334R and the heat source 332 may be filled with an inorganic filler 334f. Since the material of the inorganic filler 334f has been described in detail above, further detailed description of the material is omitted.
參考圖7C,在覆蓋件主體334和無機填料334f的表面上形成無機陶瓷材料層336p。無機陶瓷材料層336p可以是例如漿料層,其中無機陶瓷材料分散在分散介質中。在一些實施例中,無機陶瓷材料層336p可包括混合物,其中固體粉末與分散介質以重量比約1:2至約2:1混合,該分散介質諸如水,該固體粉末包括:約80重量%至約90重量%的二氧化矽(SiO2 )、約1重量%至約3重量%的氧化硼(B2 O3 )、約2重量%至約5重量%的氧化鋁(Al2 O3 )、約1重量%至約3重量%的氧化鈉(Na2 O)、約2重量%至約4重量%的氧化鉀(K2 O)、約2重量%至約6重量%的氧化鋅(ZnO)和約0.1重量%至約2重量%的氧化鋯(ZrO2 )。Referring to FIG. 7C, an inorganic ceramic material layer 336p is formed on the surfaces of the cover body 334 and the inorganic filler 334f. The inorganic ceramic material layer 336p may be, for example, a slurry layer in which the inorganic ceramic material is dispersed in a dispersion medium. In some embodiments, the inorganic ceramic material layer 336p may include a mixture in which a solid powder is mixed with a dispersion medium such as water at a weight ratio of about 1: 2 to about 2: 1, the solid powder includes: about 80% by weight To about 90% by weight of silicon dioxide (SiO 2 ), about 1% to about 3% by weight of boron oxide (B 2 O 3 ), and about 2% to about 5% by weight of alumina (Al 2 O 3 ), About 1% to about 3% by weight of sodium oxide (Na 2 O), about 2% to about 4% by weight of potassium oxide (K 2 O), and about 2% to about 6% by weight of zinc oxide (ZnO) and about 0.1% to about 2% by weight of zirconia (ZrO 2 ).
無機陶瓷材料層336p可透過刷塗、噴塗、浸泡塗佈、或旋轉塗佈形成,但是本案揭露內容的實施例不限於此。The inorganic ceramic material layer 336p may be formed by brush coating, spray coating, dip coating, or spin coating, but the embodiments disclosed in this case are not limited thereto.
隨後,將無機陶瓷材料層336p在約800℃至約2000℃的溫度下退火約10秒至約60分鐘,以形成無機陶瓷層336a,並且可獲得圖4所說明的第一主體330a。Subsequently, the inorganic ceramic material layer 336 p is annealed at a temperature of about 800 ° C. to about 2000 ° C. for about 10 seconds to about 60 minutes to form an inorganic ceramic layer 336 a, and a first body 330 a illustrated in FIG. 4 can be obtained.
圖6中所說明的第一主體330a’可透過與參考圖7A至圖7C所描述的方法相同的方法製造,差異處在於,無機陶瓷材料層336p僅形成在圖7中的覆蓋件主體334的下表面上。The first body 330a 'illustrated in FIG. 6 may be manufactured by the same method as described with reference to FIGS. 7A to 7C, except that the inorganic ceramic material layer 336p is formed only on the cover body 334 in FIG. On the lower surface.
圖8是根據另一實施例的第一主體330a”的側剖視圖。圖8的第一主體330a”與圖4的第一主體330a的不同處在於,第一主體330”進一步包括貴金屬包覆層333及耐火氧化物層337,耐火氧化物層在貴金屬包覆層333的一個表面上。因此,在下文中,將主要描述這種差異,並且省略多餘的描述。8 is a side sectional view of a first body 330a "according to another embodiment. The first body 330a" of Fig. 8 is different from the first body 330a of Fig. 4 in that the first body 330 "further includes a noble metal coating 333 and refractory oxide layer 337, the refractory oxide layer is on one surface of the noble metal cladding layer 333. Therefore, in the following, this difference will be mainly described, and redundant description will be omitted.
貴金屬包覆層333可至少在貴金屬包覆層333的上表面333US或下表面333LS上形成。貴金屬定義為耐腐蝕和氧化的金屬,例如鉑(Pt)、金(Au)、釕(Ru)、銠(Rh)、鈀(Pd)、銀(Ag)、鋨(Os)、銥(Ir)、銅(Cu)、和錸(Re)。在一些實施例中,貴金屬包覆層333可形成在覆蓋件主體334的上表面和下表面上。在一些實施例中,貴金屬包覆層333也可以形成在中心孔338的內表面上(對應於圖8的側壁部分SW)。The noble metal cladding layer 333 may be formed on at least the upper surface 333US or the lower surface 333LS of the noble metal cladding layer 333. Precious metals are defined as metals that are resistant to corrosion and oxidation, such as platinum (Pt), gold (Au), ruthenium (Ru), rhodium (Rh), palladium (Pd), silver (Ag), osmium (Os), iridium (Ir) , Copper (Cu), and rhenium (Re). In some embodiments, a noble metal cladding layer 333 may be formed on the upper and lower surfaces of the cover body 334. In some embodiments, the noble metal cladding layer 333 may also be formed on the inner surface of the center hole 338 (corresponding to the side wall portion SW of FIG. 8).
貴金屬包覆層333可包括例如鉑或鉑合金。例如,鉑合金可以是鉑與下述之金屬中的至少一者的合金:銠(Rh)、銥(Ir)、釕(Ru)、鈀(Pd)、和鋨(Os)。The noble metal cladding layer 333 may include, for example, platinum or a platinum alloy. For example, the platinum alloy may be an alloy of platinum and at least one of the following metals: rhodium (Rh), iridium (Ir), ruthenium (Ru), palladium (Pd), and osmium (Os).
耐火氧化物層337可以設置在貴金屬包覆層333的下表面333LS上。耐火氧化物層337由高度耐熱的氧化物材料製成。下表面333LS可以是面向攪拌容器320的表面。耐火氧化物層337覆蓋暴露至高溫的鉑或鉑合金,以減小暴露區域的面積,從而減少鉑的氧化還原反應以及所造成的在覆蓋件與攪拌容器之內表面上反應產物冷凝的可能性,在該內表面處,反應產物可能掉落至熔融玻璃MG中。這使得能夠減少由這種內含物引起的產品缺陷。The refractory oxide layer 337 may be disposed on the lower surface 333LS of the noble metal cladding layer 333. The refractory oxide layer 337 is made of a highly heat-resistant oxide material. The lower surface 333LS may be a surface facing the stirring container 320. The refractory oxide layer 337 covers platinum or platinum alloy exposed to high temperature to reduce the area of the exposed area, thereby reducing the redox reaction of platinum and the possibility of condensation of reaction products on the inner surface of the cover and the stirring container At this inner surface, reaction products may fall into the molten glass MG. This makes it possible to reduce product defects caused by such inclusions.
耐火氧化物層337的厚度可在約1密耳(= 0.001英吋)至約10密耳的範圍內。在一些實施例中,耐火氧化物層337的厚度可以在約2密耳(= 0.002英吋)至約8密耳的範圍內。The thickness of the refractory oxide layer 337 may range from about 1 mil (= 0.001 inches) to about 10 mils. In some embodiments, the thickness of the refractory oxide layer 337 may be in a range of about 2 mils (= 0.002 inches) to about 8 mils.
上面有耐火氧化物層337形成的貴金屬包覆層333的下表面333LS可經粗糙化。在一些實施例中,當藉由BS EN ISO 4287:2000標準測量時,貴金屬包覆層333的下表面333LS的粗糙度Ra可以在約0.1μm至約50μm的範圍內。這裡,Ra是算術平均粗糙度,是粗糙度分佈曲線的算術平均差。如果粗糙度Ra太大,則在形成耐火氧化物層337之後的平坦度可能不充分。如果粗糙度Ra太小,則耐火氧化物層337和貴金屬包覆層333之間的黏著可能不充分。The lower surface 333LS of the noble metal cladding layer 333 formed with the refractory oxide layer 337 thereon may be roughened. In some embodiments, when measured by the BS EN ISO 4287: 2000 standard, the roughness Ra of the lower surface 333LS of the precious metal cladding layer 333 may be in a range of about 0.1 μm to about 50 μm. Here, Ra is an arithmetic mean roughness, and is an arithmetic mean difference of a roughness distribution curve. If the roughness Ra is too large, the flatness after the refractory oxide layer 337 is formed may be insufficient. If the roughness Ra is too small, adhesion between the refractory oxide layer 337 and the precious metal cladding layer 333 may be insufficient.
圖9A及圖9B是透視圖,顯示根據一個實施例的在第一主體330a的表面上形成耐火氧化物層337的方法。9A and 9B are perspective views illustrating a method of forming a refractory oxide layer 337 on a surface of a first body 330a according to an embodiment.
參考圖9A,第一主體330a的外表面可覆蓋有無機陶瓷層336。貴金屬包覆層333可以設置在第一主體330a的上表面和下表面上。此外,貴金屬包覆層333也可至少部分地設置在第一主體330a的側壁SW上。Referring to FIG. 9A, an outer surface of the first body 330 a may be covered with an inorganic ceramic layer 336. The noble metal cladding layer 333 may be provided on the upper and lower surfaces of the first body 330a. In addition, the noble metal cladding layer 333 may be at least partially provided on the sidewall SW of the first body 330a.
隨後,可粗糙化貴金屬包覆層333的下表面333LS。在圖9A中,為了方便理解,將第一主體330a上下倒轉,使得下表面333LS面朝上。粗糙化可以透過例如噴砂進行,但不限於此。於是,可獲得粗糙化的下表面333SB。Subsequently, the lower surface 333LS of the noble metal cladding layer 333 may be roughened. In FIG. 9A, for easy understanding, the first body 330 a is turned upside down so that the lower surface 333LS faces upward. The roughening may be performed by, for example, sand blasting, but is not limited thereto. Thus, a roughened lower surface 333SB can be obtained.
參考圖9B,耐火氧化物層337形成於貴金屬包覆層333的粗糙化下表面333SB上。Referring to FIG. 9B, a refractory oxide layer 337 is formed on the roughened lower surface 333SB of the noble metal cladding layer 333.
耐火氧化物層337可為包括氧化鋯(ZrO2 )以作為主要成分的材料層。在一些實施例中,耐火氧化物層337可包括:約3重量%至約5重量%的氧化鈣(CaO)、約0.2重量%至約1重量%的二氧化矽(SiO2 )、約0.2重量%至約1重量%的氧化鋁(Al2 O3 )、及約0.5重量%至約3.5重量%的氧化鉿(HfO2 ),其餘為氧化鋯(ZrO2 )和不可避免的雜質。耐火氧化物層337可進一步包括約0.01重量%至約0.3重量%的氧化鐵(Fe2 O3 )和約0.01重量%至約0.9重量%的氧化鎂(MgO)。The refractory oxide layer 337 may be a material layer including zirconia (ZrO 2 ) as a main component. In some embodiments, the refractory 337 may include an oxide layer: wt% to about 1% to about 5% by weight to about 3% by weight of calcium oxide (CaO), from about 0.2 weight silicon dioxide (SiO 2), about 0.2 Alumina (Al 2 O 3 ) by weight% to about 1% by weight, hafnium oxide (HfO 2 ) from about 0.5% to about 3.5% by weight, and the rest are zirconia (ZrO 2 ) and inevitable impurities. The refractory oxide layer 337 may further include about 0.01% to about 0.3% by weight of iron oxide (Fe 2 O 3 ) and about 0.01% to about 0.9% by weight of magnesium oxide (MgO).
在一些實施例中,耐火氧化物層337可包括:約1重量%至約2重量%的氧化鉿(HfO2 )、約2.5重量%至約4.5重量%的氧化鈣(CaO)、約0.2重量%至約1.0重量%的二氧化矽(SiO2 )、約0.3重量%至約1.2重量%的氧化鋁(Al2 O3 )、約0.01重量%至約0.2重量%的氧化鐵(Fe2 O3 )、約0.05重量%至約0.2重量%的二氧化鈦(TiO2 )、和約0.01重量%至約0.1重量%的氧化鎂(MgO),其餘為氧化鋯(ZrO2 )和不可避免的雜質。In some embodiments, the refractory oxide layer 337 may include: about 1% to about 2% by weight hafnium oxide (HfO 2 ), about 2.5% to about 4.5% by weight calcium oxide (CaO), and about 0.2% by weight. % To about 1.0% by weight of silicon dioxide (SiO 2 ), about 0.3% to about 1.2% by weight of alumina (Al 2 O 3 ), and about 0.01% to about 0.2% by weight of iron oxide (Fe 2 O 3 ), about 0.05% by weight to about 0.2% by weight of titanium dioxide (TiO 2 ), and about 0.01% by weight to about 0.1% by weight of magnesium oxide (MgO), and the rest are zirconia (ZrO 2 ) and inevitable impurities.
在一些實施例中,耐火氧化物層337可藉由以電漿熔融源粉末並噴塗熔融的源粉末而形成。圖9B說明下表面333SB暴露的一部分,以顯示耐火氧化物層337能夠形成在下表面333SB上。然而,在其他實施例中,耐火氧化物層337可以形成在粗糙化的下表面333SB之整體上。In some embodiments, the refractory oxide layer 337 may be formed by melting the source powder with a plasma and spraying the molten source powder. FIG. 9B illustrates an exposed portion of the lower surface 333SB to show that the refractory oxide layer 337 can be formed on the lower surface 333SB. However, in other embodiments, the refractory oxide layer 337 may be formed on the entirety of the roughened lower surface 333SB.
圖10說明根據一實施例的覆蓋件330的第一主體331a。第一主體331a可連同第二主體331b一起構成覆蓋件330。FIG. 10 illustrates a first body 331a of a cover 330 according to an embodiment. The first body 331a may constitute the cover 330 together with the second body 331b.
參考圖10,沿著第一主體331a和第二主體331b之間的邊界區域BD突出的片部分339可設置在耐火氧化物層337下方。Referring to FIG. 10, a sheet portion 339 protruding along a boundary region BD between the first body 331 a and the second body 331 b may be disposed under the refractory oxide layer 337.
儘管片部分339附接第一主體331a的下表面,但片部分339的突出部分可至少部分地與第二主體331b重疊。換言之,片部分339可以實質上完全覆蓋除了中心孔338之外的邊界區域BD。在一些實施例中,片部分339從第一主體331a朝第二主體331b突出的寬度G1可大於第一主體331a和第二主體331b之間的間隙G2。Although the sheet portion 339 is attached to the lower surface of the first body 331a, the protruding portion of the sheet portion 339 may at least partially overlap the second body 331b. In other words, the sheet portion 339 may substantially completely cover the boundary region BD other than the center hole 338. In some embodiments, the width G1 of the sheet portion 339 protruding from the first body 331a toward the second body 331b may be larger than the gap G2 between the first body 331a and the second body 331b.
片部分339可包括金屬或無機材料。在一些實施例中,片部分339可包括金屬,諸如鉑或鉑合金。在一些實施例中,片部分339可包括基於二氧化矽的無機材料、基於氧化鋯的無機材料、或是基於氧化鋁的無機材料。在一些實施例中,片部分339可包括鉑和銠的合金。The sheet portion 339 may include a metal or an inorganic material. In some embodiments, the sheet portion 339 may include a metal, such as platinum or a platinum alloy. In some embodiments, the sheet portion 339 may include a silicon dioxide-based inorganic material, a zirconia-based inorganic material, or an alumina-based inorganic material. In some embodiments, the sheet portion 339 may include an alloy of platinum and rhodium.
圖11A和11B是根據其他實施例的覆蓋件的第一主體331a’和331a”的截面視圖。11A and 11B are cross-sectional views of first bodies 331a 'and 331a "of a cover according to other embodiments.
參考圖11A,片部分339可以直接附接至無機陶瓷層336的表面。圖11A的第一主體331a’可與圖10之實施例中的第一主體331a實質上相同,差異處在於省略耐火氧化物層337和貴金屬包覆層333。Referring to FIG. 11A, the sheet portion 339 may be directly attached to the surface of the inorganic ceramic layer 336. The first body 331a 'of FIG. 11A may be substantially the same as the first body 331a in the embodiment of FIG. 10, except that the refractory oxide layer 337 and the noble metal cladding layer 333 are omitted.
參考圖11B,片部分339可以直接附接至貴金屬包覆層333的表面。圖11B的第一主體331a”可與圖10的實施例中的第一主體331a實質上相同,差異處在於省略耐火氧化物層337。Referring to FIG. 11B, the sheet portion 339 may be directly attached to the surface of the precious metal cladding layer 333. The first body 331 a ″ in FIG. 11B may be substantially the same as the first body 331 a in the embodiment of FIG. 10, except that the refractory oxide layer 337 is omitted.
在下文中,將參考具體範例和比較例更詳細地描述本案揭露內容的組成和效果。然而,這些範例僅旨在闡明本案揭露內容,而非旨在限制本案揭露內容的範疇。In the following, the composition and effects of the disclosure in this case will be described in more detail with reference to specific examples and comparative examples. However, these examples are only intended to clarify the disclosure in this case, not to limit the scope of the disclosure in this case.
圖12是說明根據一實施例的用於測試無機陶瓷層的性能的氦氣洩漏測試設備的圖。FIG. 12 is a diagram illustrating a helium gas leak test apparatus for testing the performance of an inorganic ceramic layer according to an embodiment.
參考圖12,腔室51在一側上包括開口54,並且樣品SA固定在腔室51的開口54中。打開入口閥52以在樣品SA和腔室51之間沒有發生洩漏的狀態下,在預定壓力下供應氦氣(He),並且出口閥53關閉。Referring to FIG. 12, the chamber 51 includes an opening 54 on one side, and the sample SA is fixed in the opening 54 of the chamber 51. The inlet valve 52 is opened so that helium (He) is supplied at a predetermined pressure in a state where no leakage occurs between the sample SA and the chamber 51, and the outlet valve 53 is closed.
如果有較多的氣體所能通過樣品SA的路徑,則通過氦感測器43偵測到的氦洩漏量將增加。相反地,如果有較少的氣體所能通過樣品SA的路徑,則通過氦感測器43偵測到的氦洩漏量將減少。If more gas can pass through the path of the sample SA, the amount of helium leakage detected by the helium sensor 43 will increase. Conversely, if there are fewer gas paths that can pass through the sample SA, the amount of helium leak detected by the helium sensor 43 will decrease.
在多孔AN485(可從Saint Gobain獲得)樣品上將無機陶瓷層形成達約3mm之厚度,無機陶瓷層包括:約85.05重量%的二氧化矽(SiO2 )、約2.25重量%的氧化硼(B2 O3 )、約3.25重量%的氧化鋁(Al2 O3 )、約1.7重量%的氧化鈉(Na2 O)、約2.5重量%的氧化鉀(K2 O)、約4.1重量%的氧化鋅(ZnO)、及約1.15重量%的氧化鋯(ZrO2 )。An inorganic ceramic layer was formed to a thickness of about 3 mm on a porous AN485 (available from Saint Gobain) sample. The inorganic ceramic layer includes: about 85.05% by weight of silicon dioxide (SiO 2 ) and about 2.25% by weight of boron oxide (B 2 O 3 ), about 3.25% by weight of alumina (Al 2 O 3 ), about 1.7% by weight of sodium oxide (Na 2 O), about 2.5% by weight of potassium oxide (K 2 O), and about 4.1% by weight Zinc oxide (ZnO) and about 1.15% by weight of zirconia (ZrO 2 ).
將具有無機陶瓷層的樣品(範例1)和不含無機陶瓷層的樣品(比較例1)固定在腔室的開口處,並在上面執行氦氣洩漏測試。A sample with an inorganic ceramic layer (Example 1) and a sample without an inorganic ceramic layer (Comparative Example 1) were fixed at the opening of the chamber, and a helium leak test was performed thereon.
結果,發現當形成無機陶瓷層時,氣體的洩漏減少到小於沒有無機陶瓷層時的洩漏的1/4,如圖13所說明。因此,可見無機陶瓷層可防止熱源所含的鉑被氧化。As a result, it was found that when the inorganic ceramic layer was formed, the leakage of gas was reduced to less than 1/4 of the leakage when there was no inorganic ceramic layer, as illustrated in FIG. 13. Therefore, it can be seen that the inorganic ceramic layer can prevent the platinum contained in the heat source from being oxidized.
圖14A和14B是範例2和3及比較例2和3的弛垂比較測試用的樣品的分解透視圖。14A and 14B are exploded perspective views of samples for the comparative relaxation test of Examples 2 and 3 and Comparative Examples 2 and 3. FIG.
在條形體樣品61的表面上形成縱向凹槽61r,在凹槽61r中形成熱源(圖中未示)和無機填料63,然後在上面形成無機陶瓷層67(範例2)。除了將凹槽61r的延伸方向改成垂直於縱向的方向之外,以與範例2中相同的方式製造樣品。製造比較例2和3的樣品,該等樣品與範例2和3的樣品實質上相同,差異處在於並未形成無機陶瓷層67,以進行比較。A longitudinal groove 61r is formed on the surface of the strip-shaped body sample 61, a heat source (not shown) and an inorganic filler 63 are formed in the groove 61r, and then an inorganic ceramic layer 67 is formed thereon (Example 2). A sample was manufactured in the same manner as in Example 2 except that the extending direction of the groove 61r was changed to a direction perpendicular to the longitudinal direction. The samples of Comparative Examples 2 and 3 were manufactured, and these samples were substantially the same as the samples of Examples 2 and 3 except that the inorganic ceramic layer 67 was not formed for comparison.
將這些樣品支撐在以預定間隔彼此隔開的兩個支撐件69上,然後在1,500℃下放置3天。然後,測量兩個支撐件69之間的中心處的弛垂長度,以獲得圖15中所示的結果。弛垂長度是原始高度和於1,500℃加熱3天後之高度之間的中心處的高度差。These samples were supported on two supports 69 spaced apart from each other at a predetermined interval, and then left at 1,500 ° C for 3 days. Then, the sag length at the center between the two supports 69 was measured to obtain the result shown in FIG. 15. The sag length is the height difference at the center between the original height and the height after heating at 1,500 ° C for 3 days.
參考圖15,可看出無論凹槽的延伸方向如何,無機陶瓷層67也有助於減少樣品的弛垂。範例2的弛垂長度小於比較例2的弛垂長度的三分之一。範例3的弛垂長度為約比較例3的弛垂長度的一半。Referring to FIG. 15, it can be seen that the inorganic ceramic layer 67 also helps to reduce sagging of the sample regardless of the extending direction of the groove. The sagging length of Example 2 is less than one third of the sagging length of Comparative Example 2. The sagging length of Example 3 is about half of the sagging length of Comparative Example 3.
儘管已經參考本案揭露內容之實施例具體顯示及描述了本案揭露內容,但是應當理解,在不背離所附之請求項的精神和範疇的情況下,可以在形式和細節上進行各種改變。Although the present disclosure has been specifically shown and described with reference to the embodiments of the disclosure, it should be understood that various changes can be made in form and detail without departing from the spirit and scope of the appended claims.
10‧‧‧儲存容器10‧‧‧Storage Container
11‧‧‧批料 11‧‧‧ batch
15‧‧‧驅動裝置 15‧‧‧Drive
17‧‧‧控制器 17‧‧‧controller
19‧‧‧玻璃液高探針 19‧‧‧ glass liquid height probe
21‧‧‧豎管 21‧‧‧Standpipe
23‧‧‧通訊線路 23‧‧‧communication line
43‧‧‧氦感測器 43‧‧‧helium sensor
51‧‧‧腔室 51‧‧‧ chamber
52‧‧‧入口閥 52‧‧‧Inlet valve
53‧‧‧出口閥 53‧‧‧outlet valve
54‧‧‧開口 54‧‧‧ opening
61‧‧‧樣品 61‧‧‧sample
61r‧‧‧凹槽 61r‧‧‧groove
63‧‧‧無機填料 63‧‧‧ inorganic filler
67‧‧‧無機陶瓷層 67‧‧‧Inorganic ceramic layer
69‧‧‧支撐件 69‧‧‧ support
100‧‧‧熔融容器 100‧‧‧melt container
150‧‧‧第一導管 150‧‧‧ the first catheter
200‧‧‧澄清容器 200‧‧‧clarification container
250‧‧‧第二導管 250‧‧‧Second catheter
300‧‧‧熔融玻璃攪拌腔室 300‧‧‧ molten glass stirring chamber
310‧‧‧攪拌器 310‧‧‧ Stirrer
312‧‧‧葉片 312‧‧‧blade
314‧‧‧攪拌桿 314‧‧‧Stirring rod
320‧‧‧攪拌容器 320‧‧‧ stirred container
330‧‧‧覆蓋件 330‧‧‧ Cover
330a、330a’、330a”‧‧‧第一主體 330a, 330a ’, 330a" ‧‧‧ the first subject
330b‧‧‧第二主體 330b‧‧‧Second Subject
331a、331a’、331a”‧‧‧第一主體 331a, 331a ’, 331a" ‧‧‧ the first subject
331b‧‧‧第二主體 331b‧‧‧Second Subject
332‧‧‧熱源 332‧‧‧heat source
333‧‧‧貴金屬包覆層 333‧‧‧Precious metal coating
333US‧‧‧上表面 333US‧‧‧ Top surface
333LS‧‧‧下表面 333LS‧‧‧Lower surface
333SB‧‧‧粗糙化的下表面 333SB‧‧‧Roughened lower surface
334‧‧‧覆蓋件主體 334‧‧‧cover body
334R‧‧‧凹槽 334R‧‧‧Groove
334f‧‧‧無機填料 334f‧‧‧Inorganic filler
336、336a、336p‧‧‧無機陶瓷層 336, 336a, 336p‧‧‧‧Inorganic ceramic layer
337‧‧‧耐火氧化物層 337‧‧‧ Refractory oxide layer
338‧‧‧中心孔 338‧‧‧Center hole
339‧‧‧片部分 339‧‧‧ film section
350‧‧‧第三導管 350‧‧‧ third conduit
500‧‧‧遞送容器 500‧‧‧ delivery container
600‧‧‧出口導管 600‧‧‧ Outlet Conduit
650‧‧‧入口 650‧‧‧ entrance
700‧‧‧形成容器 700‧‧‧ forming container
750‧‧‧邊緣輥 750‧‧‧Edge roller
G1‧‧‧寬度 G1‧‧‧Width
G2‧‧‧間隙 G2‧‧‧ Clearance
IF‧‧‧界面 IF‧‧‧ interface
MG‧‧‧熔融玻璃 MG‧‧‧ Molten Glass
SA‧‧‧樣品 SA‧‧‧ Sample
SW‧‧‧側壁部分 SW‧‧‧Side wall part
由以下詳細敘述並結合所附圖式,將會更清楚地理解本案揭露內容的實施例,其中:The embodiments disclosed in this case will be more clearly understood from the following detailed descriptions and the accompanying drawings, in which:
圖1是根據本案揭露內容之實施例的玻璃製造設備的圖;FIG. 1 is a diagram of a glass manufacturing apparatus according to an embodiment of the disclosure;
圖2是根據本案揭露內容之實施例的熔融玻璃攪拌腔室的透視圖;2 is a perspective view of a molten glass stirring chamber according to an embodiment of the disclosure;
圖3是根據本案揭露內容之實施例的覆蓋件的第一主體的透視圖;3 is a perspective view of a first body of a cover according to an embodiment of the present disclosure;
圖4示出了沿圖3的線IV-VI’截取的截面;FIG. 4 shows a section taken along line IV-VI 'of FIG. 3;
圖5是一圖表,該圖表概念式顯示相對於沿圖4之線V-V’截取的截面的界定覆蓋件主體和無機陶瓷層之間的界面的方法;5 is a diagram conceptually showing a method of defining an interface between a cover body and an inorganic ceramic layer with respect to a cross section taken along a line V-V 'of FIG. 4;
圖6是根據本案揭露內容的另一實施例的覆蓋件的第一主體的側剖視圖;6 is a side cross-sectional view of a first body of a cover according to another embodiment of the disclosure;
圖7A至圖7C是側剖視圖,依序顯示根據本案揭露內容的實施例的製造覆蓋件之第一主體的方法;7A to 7C are side sectional views sequentially showing a method of manufacturing a first body of a cover according to an embodiment of the content disclosed in this case;
圖8是根據本案揭露內容的另一實施例的覆蓋件的第一主體的側剖視圖;8 is a side cross-sectional view of a first body of a cover according to another embodiment of the disclosure;
圖9A和9B是透視圖,顯示根據本案揭露內容的實施例的在覆蓋件的第一主體之表面上形成耐火氧化物層的方法;9A and 9B are perspective views showing a method of forming a refractory oxide layer on a surface of a first body of a cover according to an embodiment of the present disclosure;
圖10示出了根據本案揭露內容的實施例的覆蓋件的第一主體;FIG. 10 illustrates a first body of a cover according to an embodiment of the disclosure;
圖11A和11B是根據本案揭露內容的其他實施例的覆蓋件的第一主體的剖視圖;11A and 11B are cross-sectional views of a first body of a cover according to other embodiments of the present disclosure;
圖12是概念圖,顯示根據本案揭露內容的實施例的用於測試無機陶瓷層的性能的測試設備;FIG. 12 is a conceptual diagram showing a test device for testing the performance of an inorganic ceramic layer according to an embodiment of the present disclosure;
圖13是圖表,顯示對範例1和比較例1執行氦氣洩漏測試的結果;13 is a graph showing the results of performing a helium leak test on Example 1 and Comparative Example 1;
圖14A和14B是範例2及3與比較例2及3的弛垂比較測試的樣品的分解透視圖;及14A and 14B are exploded perspective views of samples of the relaxation comparison test of Examples 2 and 3 and Comparative Examples 2 and 3; and
圖15是圖表,顯示對範例2及3與比較例2及3執行弛垂比較測試的結果。FIG. 15 is a graph showing the results of performing a relaxation comparison test on Examples 2 and 3 and Comparative Examples 2 and 3. FIG.
國內寄存資訊 (請依寄存機構、日期、號碼順序註記)
無Domestic storage information (please note in order of storage organization, date, and number)
no
國外寄存資訊 (請依寄存國家、機構、日期、號碼順序註記)
無Information on foreign deposits (please note according to the order of the country, institution, date, and number)
no
Claims (20)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180011606A KR102386231B1 (en) | 2018-01-30 | 2018-01-30 | Molten glass stirring chamber |
| KR10-2018-0011606 | 2018-01-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201940439A true TW201940439A (en) | 2019-10-16 |
| TWI791744B TWI791744B (en) | 2023-02-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108102705A TWI791744B (en) | 2018-01-30 | 2019-01-24 | Molten glass stirring chamber |
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| EP (1) | EP3746410A4 (en) |
| JP (1) | JP7267303B2 (en) |
| KR (1) | KR102386231B1 (en) |
| CN (1) | CN111770898B (en) |
| TW (1) | TWI791744B (en) |
| WO (1) | WO2019151747A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US7338714B2 (en) * | 2000-11-30 | 2008-03-04 | Schott Ag | Coated metal element used for producing glass |
| DE102007023497B4 (en) * | 2007-05-18 | 2010-08-05 | Schott Ag | Method and device for the production of glasses, glass ceramics or ceramics and their use |
| US20100080078A1 (en) * | 2008-09-29 | 2010-04-01 | Martin Herbert Goller | Method and apparatus for homogenizing a glass melt |
| US20100126225A1 (en) * | 2008-11-25 | 2010-05-27 | Josh Ding | Method for homogenizing a glass melt |
| DE102009000785B4 (en) * | 2009-02-11 | 2015-04-02 | Schott Ag | Method and device for producing glass |
| TWI471280B (en) * | 2009-11-30 | 2015-02-01 | Corning Inc | Method and apparatus for reducing condensate related defects in a glass manufacturing process |
| US8650910B2 (en) * | 2010-08-23 | 2014-02-18 | Corning Incorporated | Apparatus for homogenizing a glass melt |
| JP2014009137A (en) * | 2012-06-29 | 2014-01-20 | Avanstrate Inc | Glass substrate manufacturing method, and glass substrate manufacturing device |
| US9062772B2 (en) * | 2012-10-29 | 2015-06-23 | Corning Incorporated | Stir chambers for stirring molten glass and high-temperature sealing articles for the same |
| CN203382635U (en) | 2013-07-02 | 2014-01-08 | 郑州旭飞光电科技有限公司 | Heat-insulation device for glass channel stirring barrel |
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| CN111770898B (en) | 2022-08-02 |
| WO2019151747A1 (en) | 2019-08-08 |
| EP3746410A4 (en) | 2021-12-22 |
| KR102386231B1 (en) | 2022-04-14 |
| KR20190092161A (en) | 2019-08-07 |
| TWI791744B (en) | 2023-02-11 |
| CN111770898A (en) | 2020-10-13 |
| EP3746410A1 (en) | 2020-12-09 |
| JP2021512041A (en) | 2021-05-13 |
| JP7267303B2 (en) | 2023-05-01 |
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