TW201947254A - Proximity sensor module with two emitters - Google Patents

Abstract

A proximity sensor module with two emitters, including a circuit substrate, a package housing, an light emitter and a sensing component. The light emitter includes a first emitter and a second emitter, which both are disposed on the circuit substrate. The sensing component includes a sensor, and the sensor is disposed on the circuit substrate. The light emitter and the sensing component are isolated from each other by the package housing, and one of the first emitter and the second emitter is closer to the sensing component than the other. In this way, the proximity sensor module with two emitters provides a larger proximity sensing range, improves sensing capability for low reflectance materials, and reduces probability of miscarriage.

Description

   Proximity induction module with dual transmitters   

The invention relates to a proximity induction module, in particular to a proximity induction module with dual transmitters.

Most existing mobile devices have a proximity sensor in the display screen to detect the user's face, ears, or hair, and to temporarily close the display screen when a short-range object is detected, on the one hand, to save power, On the one hand, it also prevents the user's face and ears from touching the screen by mistake, which affects the ongoing call.

Based on appearance factors, the openings for proximity sensors on mobile devices need to be made smaller and smaller to meet market demand. However, if the opening of the proximity sensor is reduced, the transmission efficiency of the transmitter signal inside the proximity sensor will be sacrificed, and the phenomenon that the signal is not successfully transmitted but is reflected by the mobile device and causes crosstalk effects will also increase.

In addition, the existing mobile devices mostly use a glass panel with a coating on the surface as a display screen, and the coating can be selected with different color coatings or functional coatings as required. However, the coated glass panel has higher light transmittance and reflectivity than the ordinary uncoated glass panel or opaque panel, thus causing a stronger crosstalk effect, which will make the proximity sensor The measured signal-to-noise ratio is reduced, and it cannot effectively sense nearby objects.

The technical problem to be solved by the present invention is to provide a proximity sensor with dual transmitters in response to the shortcomings of the prior art, in which the transmitter component and the sensor component are arranged in a packaging structure to be isolated from each other, and one of the transmitters is relatively The other transmitter is close to the sensor, so that the proximity sensor with dual transmitters can still detect objects at a short distance in an environment with a high crosstalk effect.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a proximity sensor module with dual transmitters, which includes: a circuit substrate, a package housing, a transmitter assembly, and a sensor. Components. The package housing is disposed on the circuit substrate. The package housing includes a first package structure, a second package structure, a first partition structure, a second partition structure, and the first package structure. A first containing space defined by cooperating with the first separating structure, a second containing space formed by the first separating structure and the second separating structure together, and the second separating structure A third accommodating space defined by cooperating with the second packaging structure. The transmitter assembly includes a first transmitter and a second transmitter. The first transmitter and the second transmitter are disposed on the circuit substrate and are respectively located in the first accommodation space and the second transmitter. The second accommodation space is described. The sensing component is located in the third accommodating space and disposed on the circuit substrate. The sensing component includes a sensor, a first driver electrically connected to the sensor, and an electrical device. A second driver electrically connected to the sensor, wherein the first driver is electrically connected to the first transmitter through the circuit substrate, and the second driver is electrically connected to the first driver through the circuit substrate Connected to the second transmitter. The first driver is used to drive the first transmitter to emit a first signal, the first signal is reflected by a long-distance DUT to form a first reflected signal, and the second driver is used to drive The second transmitter sends out a second signal, and the second signal is reflected by a short-distance test object to form a second reflection signal. The sensor is configured to receive the first reflection signal and receive the second reflection signal. Said second reflected signal.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a proximity sensor module with dual transmitters, which includes a circuit substrate, a package housing, a transmitter component, and a sensing component. . The package housing includes a first package structure, a second package structure, a partition structure, a first accommodating space defined by the first package structure and the partition structure cooperating with each other. A second accommodating space defined by the partition structure and the second packaging structure cooperating with each other. The transmitter assembly includes a first transmitter and a second transmitter. The first transmitter and the second transmitter are disposed on the circuit substrate and are respectively located in the first accommodation space and the second transmitter. The second accommodating space, wherein the first emitter is closer to the partition structure than the second emitter. The sensing component is located in the second accommodating space and disposed on the circuit substrate. The sensing component includes a sensor, a first driver electrically connected to the sensor, and an electrical device. A second driver electrically connected to the sensor, wherein the first driver is electrically connected to the first transmitter through the circuit substrate, and the second driver is electrically connected to the first driver through the circuit substrate Connected to the second transmitter. The first driver is used to drive the first transmitter to emit a first signal, the first signal is reflected by a long-distance DUT to form a first reflected signal, and the second driver is used to drive The second transmitter sends out a second signal, and the second signal is reflected by a short-distance test object to form a second reflection signal. The sensor is configured to receive the first reflection signal and receive the second reflection signal. Said second reflected signal.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a proximity sensor module with dual transmitters, which includes a circuit substrate, a package housing, a transmitter component, and a sensor. Components. The transmitter assembly includes a first transmitter and a second transmitter, and the first transmitter and the second transmitter are disposed on the circuit substrate. The sensing component includes a sensor, and the sensor is disposed on the circuit substrate. The transmitter component and the sensing component are isolated from each other by the package housing, and one of the first transmitter and the second transmitter is closer to the sensing component than the other one.

One of the beneficial effects of the present invention is that the proximity sensing module with dual sensors provided by the present invention can be isolated from each other by "the transmitter component and the sensing component through the package housing" And the technical solution of "one of the first transmitter and the second transmitter is closer to the sensor than the other", so that the first signal is formed by being reflected by a long distance object to be measured A first reflection signal, the second signal is reflected by a short-distance object to form a second reflection signal, and the sensor is configured to receive the first reflection signal and the second reflection signal.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description, and are not intended to limit the present invention.

P‧‧‧mobile device

M‧‧‧ Panel

Z‧‧‧ Proximity Sensor Module

1‧‧‧circuit board

2‧‧‧ Encapsulated Housing

21‧‧‧first package structure

22‧‧‧Second package structure

23‧‧‧ divider structure

231‧‧‧first partition structure

232‧‧‧Second partition structure

S1‧‧‧First accommodation space

S2‧‧‧Second accommodation space

S3‧‧‧Third accommodation space

3‧‧‧ launcher components

31‧‧‧ the first launcher

L1‧‧‧First Signal

θ1, θ2‧‧‧‧ first signal transmission range

R1‧‧‧First reflected signal

32‧‧‧ second launcher

L2‧‧‧Second Signal

φ1, φ2‧‧‧Second signal transmission range

R2‧‧‧Second reflected signal

4‧‧‧ Photosensitive components

41‧‧‧Sensor

42‧‧‧First Drive

43‧‧‧Second Drive

d1, d2, d3‧‧‧ distance

5‧‧‧ Optical Isolator

6‧‧‧Side light spacer

7‧‧‧first lens

8‧‧‧Second lens

9‧‧‧ light path correction element

1 is a schematic cross-sectional view of a mobile device using a proximity sensor module with dual transmitters in a first embodiment of the present invention; FIG. 2 is a mobile device using a proximity sensor module with dual transmitters in a second embodiment of the present invention And FIG. 3 is a schematic diagram of a signal-to-noise ratio of a proximity sensor module with dual transmitters in operation according to a second embodiment of the present invention.

The following is a description of the implementation of the "proximity sensing module with dual transmitters" disclosed by the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention may be implemented or applied through other different specific embodiments, and various details in this specification may also be based on different viewpoints and applications, and various modifications and changes may be made without departing from the spirit of the present invention. In addition, the drawings of the present invention are merely a schematic illustration, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

    [First embodiment]    

Please refer to FIG. 1. FIG. 1 is a schematic cross-sectional view of a mobile device P using a proximity sensor module Z with dual sensors according to a first embodiment of the present invention. The proximity sensor module Z is disposed on a panel M of the mobile device P. The inside and the proximity sensing module Z include: a circuit substrate 1, a package housing 2, a transmitter component 3, and a sensing component 4. In this embodiment, the panel M of the mobile device P using the proximity sensing module Z of the present invention is a glass panel with a surface coating, but the present invention is not limited thereto.

Further, the package housing 2 is disposed on the circuit substrate 1, and the package housing 2 includes a first package structure 21, a second package structure 22, a first partition structure 231, a second partition structure 232, A first accommodating space S1 defined by the first packaging structure 21 and the first partition structure 231 cooperating with each other, a second accommodating space S2 defined by the first partition structure 231 and the second partition structure 232 cooperating with each other And a third accommodating space S3 defined by the second partition structure 232 and the second packaging structure 22 cooperating with each other.

As shown in FIG. 1, the transmitter assembly 3 includes a first transmitter 31 and a second transmitter 32. The first transmitter 31 and the second transmitter 32 are disposed on the circuit substrate 1 and are respectively located in the first accommodation space. S1 and the second accommodation space S2. Further, the sensing component 4 is located in the third accommodation space S3 and is disposed on the circuit substrate 1. The sensing component 4 includes a sensor 41, a first driver 42 electrically connected to the sensor 41, and a The second driver 43 is electrically connected to the sensor 41, wherein the first driver 42 is electrically connected to the first transmitter 31 through the circuit substrate 1, and the second driver 43 is electrically connected to the second driver through the circuit substrate 1. Transmitter 32.

Furthermore, the first driver 42 is used to drive the first transmitter 31 to emit a first signal L1. The first signal L1 is reflected by a long-distance object to be tested to form a first reflected signal R1. The second driver 43 is used to drive the second transmitter 32 to send a second signal L2. The second signal L2 is reflected by a short-distance object to form a second reflected signal R2, and the sensor 41 is used to Receive the first reflected signal R1 and the second reflected signal R2.

Specifically, in this embodiment, the proximity sensor module Z further includes a light shielding member 5, and the light shielding member 5 is disposed on the first separation structure 232 to limit the first signal transmission range of the first transmitter 31. θ1. In addition, the first emitter 31 and the second emitter 32 may be different types of optical emitters. In this embodiment, the first emitter 31 is a vertical-cavity surface-emitting laser (VCSEL) The second emitter 32 is an infrared light emitting diode.

With the above structure, the first transmitter 31 is farther away from the sensor 41 than the second transmitter 32, and the light shielding member 5 blocks the first signal L1 emitted by the first transmitter 31 from being reflected by the panel M to the sensor 41. The sensor 41 is driven by the first driver 42 to drive the first transmitter 31 to transmit the first signal L1 to the object under test at a long distance, and receive the first reflection signal R1 reflected by the object under test at a long distance, and the sensor 41 is transmitted via The second driver 43 drives the second transmitter 32 to transmit the second signal L2 to the object under test at a short distance, and receives the second reflection signal R2 reflected by the object under test at a short distance, and the crosstalk signal generated by the panel reflecting the second signal L2. Accordingly, in the proximity sensor Z of the present invention, the first transmitter 31 is used to sense a long-distance test object, and the second transmitter 32 is used to sense a short-distance test object.

Further, with the above structure, the first emitter 31 of this embodiment may be a surface-emitting laser, so that the first signal L1 has sufficient energy to transmit to the object to be measured at a long distance, and the second emitter 32 is selected. Infrared light-emitting diode, because the light of the second emitter 32 is used to measure the object to be measured at a short distance, and it does not need to be distant. Therefore, using an infrared light-emitting diode can not only save energy, but also achieve measurement purposes. . Therefore, the proximity sensing module Z of the present invention has the advantage that the type of the sensor can be freely selected. More specifically, the present invention is not limited to the above. The first transmitter 31 may be a transmitter that emits a strong photon beam energy, so that the sensor 41 reaches a stronger first reflected signal R1, and the second transmitter 32 However, a transmitter that emits a weak photon beam energy can save power without affecting the measurement of nearby objects.

Furthermore, in this embodiment, the first driver 42 and the second driver 43 respectively drive the first transmitter 31 and the second transmitter 32 at different times, so as to obtain the long-range near-order sensing data respectively. And close proximity data. Specifically, when the first transmitter 31 is on, the second transmitter 32 is off, and when the first transmitter 31 is off, the second transmitter is on. The first transmitter 31 and The second transmitter 32 transmits a signal in the on state, and does not transmit a signal in the off state. However, the present invention is not limited to the above.

As shown in FIG. 1, the proximity sensing module Z of the present invention further includes a side optical isolator 6 to prevent the first signal L1 emitted by the first transmitter 31 from being transmitted between the panel M and the proximity sensing module. Go out and cause light leakage. However, the present invention is not limited to this. Furthermore, when the distance between the panel M and the proximity sensor module Z is small, it is not necessary to provide a side light isolator 6, and when the distance between the panel M and the proximity sensor module Z is large, the side light isolator 6 is provided to leak light. It can prevent external light from entering between the panel M and the proximity sensor module Z, thereby further reducing the crosstalk phenomenon. In addition, both the light isolator 5 and the side light isolator 6 are made of an opaque material, and are preferably a stretchable material.

As shown in FIG. 1, the proximity sensing module Z of the present invention further includes a first lens 7 and a second lens 8. As shown in the figure, the first lens 7 is located in the first accommodation space S1 and is disposed on the circuit substrate 1, and the first lens 7 covers the first emitter 31. The second lens 8 is located in the second accommodating space S2 and is disposed on the circuit substrate 1, and the second lens 8 covers the second emitter 32. By setting the first lens 7 and the second lens 8, the light emitting directions of the first emitter 31 and the second emitter 32 can be better controlled, the generation of crosstalk light is reduced, and a better proximity sensing effect is obtained. .

In summary, the proximity sensor module Z of the first embodiment is configured with two transmitters, namely a first transmitter 31 and a second transmitter 32, and the second transmitter 32 is set as the proximity sensor 41 and the first transmitter 31 is located far away from the sensor 41 and uses the first separation structure 231 located between the first transmitter 31 and the second transmitter 32, so that the chance of the crosstalk light received by the sensor 41 is greatly reduced. With the above structure, the proximity sensor module Z according to the first embodiment of the present invention enables the first transmitter 31 to be used to sense most of the long-distance test objects, and the second transmitter 32 is used to sense most of the near objects. Away from the object to be measured, and the sensor 41 receives the first reflection signal R1 and the second reflection signal R2 generated by the reflection of the panel M, thereby improving the sensing range of the proximity sensing module Z, reducing the probability of misjudgment, and Has a small package volume. In addition, due to the division of labor between the first transmitter 31 and the second transmitter 32, the first transmitter 31 and the second transmitter 32 can select a suitable transmitter type according to their functions.

    [Second embodiment]    

Please refer to FIG. 2, the second embodiment of the present invention is substantially the same as the first embodiment, and the same is not repeated here. One difference between the second embodiment and the first embodiment is that in the second embodiment, the first transmitter 31 and the second transmitter 32 are in the same accommodating space in the package housing. In detail, the package housing 1 of the proximity sensor module Z of the second embodiment includes a first package structure 21, a second package structure 22, a separation structure 23, and the first package structure 21 and the separation structure 23 are mutually connected. A first accommodating space S1 defined in cooperation with the first accommodating space S2 defined by the partition structure 23 and the second packaging structure 22 cooperating with each other. The first transmitter 31 and the second transmitter 32 are disposed on the circuit substrate 1 and located in the first accommodation space S1, and the sensing component 4 is disposed on the circuit substrate 1 and located in the second accommodation space S2.

Further, the second embodiment of the present invention is different from the first embodiment in that, in the first embodiment, the first transmitter 31 is farther from the sensing component 4 than the second transmitter 32, and in this embodiment, In this case, the first transmitter 31 is closer to the sensing component 4 than the second transmitter 32.

In detail, in this embodiment, since the first emitter 31 is closer to the partition structure 23 than the second emitter 32, and the partition structure 23 and the optical isolator 5 jointly block the light emitted from the first emitter 31 and being blocked by the panel M The reflected light, therefore, the sensor 41 can receive the crosstalk light from the second transmitter 32, and the probability that the first signal L2 emitted by the first transmitter 31 becomes a crosstalk light is relatively small. In this embodiment, the first transmitter 31 is used to sense a distant nearby object through the above structure, and the second transmitter 32 is used to sense a near proximity object.

Furthermore, in this embodiment, the proximity sensing module Z further includes a light path correction element 9. As shown in FIG. 2, in this embodiment, the light path correction element 9 is a lens that covers the first emitter 31 and the second emitter 32, wherein the first emitter 31 and the second emitter 32 are respectively located at Both sides of the main axis of the light path correction element 9.

Further, as shown in FIG. 2, the first signal transmission range θ2 of the first transmitter 31 can be adjusted in a direction away from the sensing component 4 by adjusting the light path correction element 9, and the second transmitter 32 The second signal transmission range φ2 is shifted in a direction approaching the sensing component 4 through the adjustment of the light path correction element. It should be noted that the present invention is not limited to the implementation manner of the light path correction element described above. In other embodiments, the light path correction element 9 may be an element or a structure other than a lens.

Through the setting of the light path correction element 9, the first signal transmission range θ2 of the first transmitter 31 deviates from the sensing component 4 and reduces the crosstalk light received by the sensing component 4 from the first transmitter 31, and the second transmitter 32 The second signal transmission range φ2 is biased toward the sensing component 4 to increase the crosstalk effect generated by the sensor 41 receiving the light from the second transmitter 32. Thereby, the first transmitter 31 is used to sense a close-up object at a long distance, the second transmitter 32 is used to sense a close-up object at a short distance, and the first transmitter 31 and the second transmitter 32 may not be provided in comparison. A better division of labor when the light path correction element 9 is used.

Furthermore, it can be known from the differences between the first embodiment and the second embodiment and the effects that can be achieved together that the present invention does not limit whether the first transmitter 31 and the second transmitter 32 are in the same accommodation space. As long as the transmitter component 3 and the sensing component 4 are isolated from each other by the package housing 2, and one of the first transmitter 31 and the second transmitter 32 is closer to the sensing component 4 than the other, it is within the scope of the present invention. .

Please refer to FIG. 3, which shows a schematic diagram of a signal-to-noise ratio of a proximity sensor module Z with dual transmitters in operation according to a second embodiment of the present invention. As shown in the figure, since the first transmitter 31 is used to sense the object under test at a long distance and the second transmitter 32 is used to sense the object under test at a short distance, when the distance between the adjacent panel M is closest, the second transmitter 32 is more The first transmitter 31 has a higher signal-to-noise ratio, and as the sensing distance increases, the signal-to-noise ratio of the second transmitter 32 decreases, and the signal-to-noise ratio of the first transmitter increases, in a farther proximity sensing range The first transmitter 31 has a higher signal-to-noise ratio.

Further, referring to FIG. 3, the sensor 41 may have a threshold value close to the threshold value and a threshold value far from the threshold value. For example, when the approach thresholds of the sensor 41 are 4dB and the distance thresholds are 3dB, respectively, and an object to be measured approaches the panel M from far to near, the object to be measured will be d1 and d2 at a distance from the panel M, respectively. When the first signal L1 and the second signal L2 emitted by the first transmitter 31 and the second transmitter 32 are reflected, the proximity threshold of the sensor 41 is triggered, and the mobile device P can determine that there is an object based on the proximity threshold being triggered. It is quite close to the panel M, which in turn causes the panel M to sleep. When the DUT keeps approaching the panel M and the distance from the panel M is d3, the signal-to-noise ratio of the DUT reflecting the first transmitter 31 is reduced to 3 dB, so the threshold of the sensor 41 is far from the threshold Triggered, but because the signal-to-noise ratio of the reflected signal from the second transmitter 32 is higher than 3 dB at this time, the mobile device P will not judge that the article has moved away from the panel M and restart the screen. Therefore, the proximity sensing module Z of the present invention can increase the sensing range of proximity sensing, improve the sensing capability for low-reflection substances (such as hair), and reduce the probability of misjudgment.

In summary, the present invention isolates the transmitter component 3 and the sensing component 4 in the package housing 2 by a partition structure 23, and the first transmitter 31 and the second transmitter 32 are arranged to be closer to the partition structure 23 A farther away from the separation structure 23, so that the first signal transmission range θ1 of the first transmitter 31 closer to the separation structure 23 is limited, the first transmitter 31 has a lower probability of generating crosstalk light, and the second transmitter 32 produces The probability of cross-talking light is greater, so that the first transmitter 31 is used to sense near objects at a longer distance, and the second transmitter 32 is used to sense near objects at a shorter distance. Therefore, the present invention does not need to separately package the transmitter component 3 and the sensing component 4. The proximity sensor module Z can have a smaller packaging volume, lower cost, and the first transmitter 31 and the second transmitter can be freely selected. Of 32 types. In addition, by using two transmitters to separately sense the close-distance and long-distance proximity objects, the proximity-sensing module Z of the present invention can have a larger proximity-sensing range, improve the sensing capability for low-reflectivity substances, and reduce Misjudgment probability.

    [Advantageous Effects of the Embodiment]    

One of the beneficial effects of the present invention is that the proximity sensing module with dual sensors provided by the present invention can be isolated from each other by the "transmitter component 3 and the sensing component 4 through the package housing 2" and "the first One of the transmitter 31 and the second transmitter 32 is closer to the sensing element 4 ″ than the other, so that the first signal is reflected by a long-distance object to form a first reflected signal, and the second The signal is reflected by a short-distance object to form a second reflection signal, and the sensor is configured to receive the first reflection signal and the second reflection signal.

Thereby, by using two transmitters to respectively sense the close-distance and long-distance proximity objects, the proximity-sensing module Z of the present invention can have a larger proximity-sensing range, improve the sensing capability for substances with low reflectivity, and reduce Small false positives. In addition, the present invention does not need to separately package the transmitter component 3 and the sensing component 4. The proximity sensor module Z can have a smaller packaging volume, lower cost, and the first transmitter 31 and the second transmitter can be freely selected. 32 species.

The content disclosed above is only the preferred and feasible embodiment of the present invention, and therefore does not limit the scope of patent application of the present invention. Therefore, any equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. Within the scope of the patent.

Claims (10)

    A proximity sensor module with dual transmitters includes: a circuit substrate; and a packaging housing, the packaging housing is disposed on the circuit substrate, and the packaging housing includes a first packaging structure, a first Two packaging structures, a first separating structure, a second separating structure, a first accommodating space defined by the first packaging structure and the first separating structure cooperating with each other, and the first separating structure A second accommodating space defined by cooperating with the second separation structure and a third accommodating space defined by cooperating with the second separation structure and the second packaging structure; Transmitter assembly, the transmitter assembly includes a first transmitter and a second transmitter, the first transmitter and the second transmitter are disposed on the circuit substrate and are respectively located in the first accommodation A space and the second accommodating space; and a sensing component, which is disposed on the circuit substrate and is located in the third accommodating space, the sensing component includes a sensor , An electrical connection A first driver of the sensor and a second driver electrically connected to the sensor, wherein the first driver is electrically connected to the first transmitter through the circuit substrate, and the second driver The driver is electrically connected to the second transmitter through the circuit substrate; wherein the first driver is used to drive the first transmitter to emit a first signal, and the first signal is received by a long distance A first reflection signal is formed by the measurement object, and the second driver is used to drive the second transmitter to send a second signal, and the second signal is reflected by a short distance measurement object to form a first reflection signal. Two reflected signals, and the sensor is configured to receive the first reflected signal and the second reflected signal.         The proximity sensing module according to claim 1, wherein the sensor receives the first reflection signal and the second reflection signal at different periods, respectively.         The proximity sensing module according to claim 1, further comprising: a light shielding member, the light shielding member is disposed on the first partition structure to limit the first signal emission of the first transmitter. range.         The proximity sensor module according to claim 1, wherein the first transmitter and the second transmitter are different types of optical transmitters.         The proximity induction module according to claim 4, wherein the first transmitter is a surface-emitting laser.         A proximity sensor module with dual transmitters includes: a circuit substrate; and a package housing. The package housing includes a first package structure, a second package structure, a partition structure, and the first package structure. A first accommodation space defined by the packaging structure and the partition structure cooperating with each other, a second accommodation space defined by the partition structure and the second packaging structure cooperating with each other; a transmitter component, The transmitter assembly includes a first transmitter and a second transmitter, the first transmitter and the second transmitter are disposed on the circuit substrate and located in the first accommodation space, wherein The first transmitter is closer to the separation structure than the second transmitter; and a sensing component is disposed on the circuit substrate and located in the second accommodation space, so that The sensing component includes a sensor, a first driver electrically connected to the sensor, and a second driver electrically connected to the sensor, wherein the first driver passes the circuit The substrates are electrically connected The first transmitter and the second driver are electrically connected to the second transmitter through the circuit substrate; wherein the first driver is used to drive the first transmitter to emit a first signal The first signal is reflected by a long-distance test object to form a first reflected signal. The second driver is used to drive the second transmitter to send a second signal. The second signal passes through a A second reflection signal is formed by the object to be measured at a short distance, and the sensor is configured to receive the first reflection signal and receive the second reflection signal.         The proximity sensing module according to claim 6, wherein the sensor receives the first reflection signal and the second reflection signal at different periods.         The proximity sensing module according to claim 6, further comprising: a light shielding member, the light shielding member is disposed on the partition structure to limit a first signal transmission range of the first transmitter.         The proximity sensing module according to claim 6, further comprising: an optical path correction element, the optical path correction element, the optical path correction element is located in the first accommodation space, wherein the first A first signal transmission range of a transmitter is adjusted to be away from the sensing component by adjustment of the light path correction element, and a second signal transmission range of the second transmitter is corrected by the light path The adjustment of the element is offset in a direction approaching the sensing component.         A proximity induction module with dual transmitters includes: a circuit substrate; a package housing; a transmitter assembly, the transmitter assembly includes a first transmitter and a second transmitter, the first The transmitter and the second transmitter are disposed on the circuit substrate; and a sensing component, the sensing component includes a sensor, and the sensor is disposed on the circuit substrate; The transmitter component and the sensing component are isolated from each other by the package housing, and one of the first transmitter and the second transmitter is closer to the sensing component than the other one.