TW201933539A - Electrode embedded member - Google Patents

Abstract

An electrode embedded member includes a plate-shaped substrate having a front surface and a back surface and that is made of a ceramic, an inner electrode extending parallel to the front surface of the substrate and that is embedded in the substrate, a connection member extending parallel to the front surface of the substrate and that is disposed so as to overlap the inner electrode, and a terminal connected to the connection member. The electrode embedded member has a predetermined structure including at least one of the following: a first predetermined structure in which a thickness of at least a part of the connection member in a direction perpendicular to the front surface of the substrate is 0.15 mm or smaller; a second predetermined structure in which the connection member includes a cutout portion; and a third predetermined structure in which the connection member is composed of a mesh structure.

Description

Electrode embedded member

The present invention relates to an electrode embedding member in which an internal electrode is embedded in a plate-shaped base material made of ceramic.

In the past, an electrode embedding member in which an internal electrode is embedded in a plate-like base material made of ceramics has been known (for example, see Patent Document 1). In the electrode embedding member, when the substrate is inserted through the insertion hole for connecting the terminal to the internal electrode, the connection member is disposed in advance at a portion where the internal electrode and the terminal are connected so as not to damage the internal electrode. Prevent internal electrode damage.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 5591627

Conventionally, in the electrode embedding member, when the temperature change during use is reversed, cracks occur in the substrate due to the difference in thermal expansion coefficient between the substrate and the connecting member, and thus the insulation of the substrate cannot be secured. Can be.

The present invention has been made in view of the above problems, and an object thereof is to provide an electrode embedding member capable of suppressing defects such as cracks in a substrate.

[1] In order to achieve the above object, the present invention is an electrode embedding member (for example, the electrode embedding member 1 of the embodiment. The same applies hereinafter), and has a surface (for example, the surface 2a of the embodiment. The same applies hereinafter). a back surface (for example, the back surface 2b of the embodiment. The same applies hereinafter), and a plate-shaped base material made of ceramic (for example, the base material 2 of the embodiment. The same applies hereinafter); and extends in parallel with the surface of the base material. And an internal electrode embedded in the substrate (for example, the internal electrode 3 of the embodiment. The same applies hereinafter); a connecting member that extends in parallel with the surface of the substrate and overlaps the internal electrode (for example, the embodiment) The connecting member 4 is the same as the above.) and a terminal (for example, the terminal 5 of the embodiment. The same applies hereinafter) to the connecting member, and the electrode embedding member is characterized by having at least one of the following (1) to (3) (1) a first predetermined structure in which a thickness of at least a part of the connecting member in a direction perpendicular to a surface of the base material is 0.2 mm or less, and (2) the aforementioned connection Member having a notch portion (e.g., the embodiment of the slit 8, 9 and 10 lack apertures. Hereinafter the same) of a second predetermined configuration, (3) The third connecting structure in which the connecting member is composed of a mesh structure.

According to the invention, the volume of the connecting member can be reduced by the predetermined structure of any of the first to third members of the connecting member. Therefore, the stress induced by the difference in physical properties between the connecting member and the ceramic material as the base material is suppressed, and cracks in the insulating layer (the portion of the internal electrode in the substrate to the surface of the substrate) of the substrate can be suppressed. And other bad conditions.

[2] In the present invention, the predetermined structure includes at least the first predetermined structure, and the first predetermined structure is preferably 0.2 mm or less in total thickness of the connecting member in a direction perpendicular to a surface of the base material. According to this configuration, since the connection member can suppress the generation of internal stress as a whole, it is possible to further suppress the defects such as cracks.

[3] In the present invention, the predetermined structure includes at least the second predetermined structure, and the notch portion preferably avoids a central region where the terminal of the connection member is connected (for example, the central region 6 of the embodiment. Similarly, the slit is extended from the central portion side of the connecting member toward the outer edge of the connecting member (for example, the outer edge 7 of the embodiment. The same applies hereinafter) to the radial slit (for example, the slit 8 of the embodiment) The same as the following.). According to this configuration, since the connecting member is easily deformed by the slit, the occurrence of internal stress can be suppressed, so that problems such as cracks can be suppressed.

[4] In the present invention, the predetermined structure includes at least the second predetermined structure, and the notch portion preferably has a hole that penetrates the connection member from a central region where the terminal of the connection member is connected (for example, The missing holes 9 and 10 of the embodiment are the same as the following.). according to According to this configuration, since the connecting member is easily deformed by the lack of holes, the occurrence of internal stress can be suppressed, so that problems such as cracks can be suppressed.

[5] In the present invention, the predetermined structure includes at least the second predetermined structure, and the notch portion preferably avoids a central region in which the terminal of the connection member is connected, and reaches the connection member from the central portion side. The outer edge. According to this configuration, since the connecting member is easily deformed by the lack of holes, the occurrence of internal stress can be suppressed, so that problems such as cracks can be suppressed.

[6] In the present invention, the predetermined structure includes at least the third predetermined structure, and the connecting member is preferably configured by stacking a plurality of mesh structures. According to this configuration, since the connecting member belonging to the mesh structure is easily deformed, the occurrence of internal stress can be suppressed, so that problems such as cracks can be further suppressed. Further, by stacking a plurality of sheets, even if it is a screen structure, the connecting member can have an appropriate strength.

[7] Further, in the present invention, the predetermined structure is preferably provided with rotational symmetry when viewed from a direction perpendicular to a surface of the substrate. According to this configuration, since the connecting member is provided with rotational symmetry, the internal stress released when the internal stress is released can be suppressed and the internal stress of the connecting member can be suppressed as compared with the case where the rotational symmetry is not provided. Disperse appropriately to suppress the occurrence of cracks in the insulating layer on the surface side of the substrate.

1‧‧‧electrode embedded components

2‧‧‧Substrate

2a‧‧‧ surface

2b‧‧‧back

3‧‧‧Internal electrodes

4‧‧‧Connecting components

5‧‧‧terminal

5a‧‧‧ cushioning members

6‧‧‧Central Area

7‧‧‧ outer edge

8‧‧‧Slit (notch)

9‧‧‧No holes (3rd embodiment)

10‧‧‧No holes (4th embodiment)

11‧‧‧ protrusion

Fig. 1 is an explanatory view schematically showing an electrode embedding member according to the first embodiment.

Fig. 2 is an explanatory view showing a connecting member of the first embodiment.

Fig. 3 is an explanatory view showing a connecting member of a second embodiment.

Fig. 4 is an explanatory view showing a connecting member of a third embodiment.

Fig. 5 is an explanatory view showing a connecting member of a fourth embodiment.

Fig. 6 is an explanatory view schematically showing a connecting member of a fifth embodiment.

[Formation of the Invention] [First Embodiment]

As shown in Fig. 1, the electrode embedding member 1 of the first embodiment includes a disk-shaped base material 2 having a surface 2a and a back surface 2b and made of alumina (Al ₂ O ₃ ) or aluminum nitride (AlN). And a ceramic such as carbon nitride (SiC), tantalum nitride (Si ₃ N ₄ ), zirconium oxide (ZrO ₂ ), or barium titanate (BaTiO ₃ ); the internal electrode 3 is parallel to the surface 2a of the substrate 2 The base material 2 is embedded in a strip shape and embedded in the base material 2; and the connecting member 4 is formed in a disk shape in parallel with the surface 2a of the base material 2, and is disposed to overlap the internal electrode 3. The rod-shaped terminal 5 is joined to the connecting member 4 by brazing or the like.

The internal electrode 3 and the connecting member 4 are made of tungsten, molybdenum or an alloy containing the main component thereof. The terminal 5 is made of nickel, titanium, copper or an alloy containing the main component thereof.

As shown in FIG. 2, the connection member 4 has a disk shape, and the total thickness in the direction perpendicular to the surface of the base material 2 is set to 0.2 mm or less. In the first embodiment, the entire thickness in the direction perpendicular to the surface of the base material 2 of the connecting member 4 is set to 0.2 mm or less, which corresponds to the present invention. The first established structure. Further, the connecting member 4 may be such that the influence of thermal expansion can be resolved to some extent by deformation, and if it is deformable to absorb thermal expansion, only a part of the connecting member 4 may be set to a thickness in a direction perpendicular to the surface of the substrate 2. 0.2mm or less.

According to the electrode-embedded member 1 of the first embodiment, since the thickness of the electrode-embedded member 1 is larger than 0.2 mm in the direction perpendicular to the surface of the substrate 2, the volume of the connecting member 4 can be reduced. In the case of a thinner case, the stress induced by the difference in physical properties between the metal connecting member 4 and the ceramic material belonging to the base material can be suppressed, and the insulating layer can be suppressed (from the internal electrode 3 of the substrate 2 to the surface of the substrate 2) A defect such as a crack in part 2a).

[Examples and comparisons] [Example 1]

Next, as an example of the first embodiment, Examples 1-1 to 1-6 (hereinafter referred to as Example 1) were compared with Comparative Example 1-1 to Comparative Example 1-3. In the first embodiment, an electrode embedding member 1 belonging to a wafer holding device in which an internal electrode 3 made of a metal is embedded and made of aluminum nitride to which cerium oxide is added is manufactured from a substrate.

Next, a method of manufacturing the electrode embedding member 1 of the first embodiment will be described. First, an insulating layer is formed. A powder mixture composed of 97% by mass of aluminum nitride powder and 3% by mass of cerium oxide powder was obtained, which was filled in a mold to perform uniaxial pressing treatment. Thereby, a first layer having a diameter of 340 mm and a thickness of 5 mm was formed.

Next, the internal electrode 3 is provided. On the first layer, a molybdenum foil (thickness: 0.1 mm) having a diameter of 290 mm as the internal electrode 3 was placed. On the internal electrode 3, a disk-shaped connecting member 4 made of tungsten and having a diameter of 6 mm was placed. The connecting member 4 is provided at 20 places on one substrate 2. When the connection member 4 is connected to the internal electrode 3, a conductive member such as a tungsten paste is applied to a portion of the internal electrode 3 to which the connection member 4 is superposed.

Then, the second layer is formed. The ceramic powder is filled in such a manner as to cover the internal electrode 3 and the connecting member 4 on the first layer to perform uniaxial pressing treatment to form a second layer molded body.

Next, the heater electrode is set. In order to heat the electrode embedding member 1 itself as a wafer holding device, a heating resistor composed of a molybdenum mesh (wire diameter: 0.1 mm, mesh: 50 mesh) forming a predetermined pattern is disposed, and is connected to a predetermined heater. A connection member for the heater terminal (tungsten grain, diameter 10 mm, thickness 0.5 mm) was placed at the position of the terminal.

Thereafter, a molded body before firing is formed. The ceramic electrode is filled with a ceramic powder and subjected to uniaxial pressing treatment to form a third layer.

Next, a baking step is performed. In the firing step, the layered body having the third layer was laminated at a pressure of 10 MPa, and calcined at a firing temperature of 1800 ° C for 2 hours, thereby obtaining a ceramic sintered body having a diameter of 340 mm and a thickness of 20 mm.

Next, the processing steps after baking are performed. In the processing step after the firing, the outer surface of the ceramic sintered body was ground and polished to form a wafer mounting surface (surface 2a) having a thickness of 0.3 mm and a surface roughness Ra of 0.4 μm.

Next, the terminal 5 is connected. From the ceramic matrix after firing The back surface 2b is pierced (diameter: 5.2 mm) so that the position of each connection member 4 reaches the connection member 4, and the cylindrical insertion hole 2c which reaches the connection member 4 from the back surface 2b is formed. On the connecting member 4 defining the insertion hole 2c, a buffer member 5a made of Kovar alloy having a diameter of 5 mm and a thickness of 2 mm was placed through a hard solder material to which Ti as an active metal was added to Au-Ni. Then, a cylindrical nickel power supply terminal 5 having a diameter of 5 mm and a length of 200 mm was placed on the buffer member 5a by a hard solder material in which Ti as an active metal was added to Au-Ni. Then, the electrode embedding member 1 was completed by brazing at 1050 ° C using a vacuum furnace.

The thickness of the connecting member 4 is 0.08 mm in the embodiment 1-1, 0.10 mm in the embodiment 1-2, 0.13 mm in the embodiment 1-3, and 0.15 mm in the embodiment 1-4. It was 0.18 mm in Examples 1-5 and 0.20 mm in Examples 1-6.

As an evaluation method, the electrode-embedded member 1 thus obtained was repeatedly subjected to a heat cycle of heating to 700 ° C for 30 times and then cooling to 100 ° C. The number of cracks on the surface 2a side of the base material 2 directly above the terminal 5 was calculated, and one of the 20 members of the connecting member 4 was evaluated as appropriate, and one or more cracks were evaluated as inappropriate.

As a result, it was found that the number of generated portions was zero until Examples 1-1 to 6 and the reliability was high.

[Comparative Example]

In Comparative Example 1-1 and Comparative Example 1-2, the thickness of the entire connecting member was set to a disk shape, and the thickness was 0.3 mm or 0.5 mm. Example 1 was made under the same conditions.

As a result, in Comparative Example 1-1 and Comparative Example 1-2, one or four cracks occurred, and the thickness was 0.3 mm or more, and the reliability was low, which was not appropriate.

In Comparative Example 1-3 in which the connecting member was not used, since there was no connecting member, it was easy to pierce the internal electrode when the terminal hole was pierced, which was a problem before the evaluation, and the yield was lowered.

In addition, the numerical values such as the diameter of the first embodiment are exemplified, and the present invention is not limited thereto, and the effects of the present invention can be obtained even if other numerical values are set.

[Second Embodiment]

The electrode embedding member 1 of the second embodiment is configured in the same manner as the first embodiment except for the connection member 4. As shown in Fig. 3, in the connecting member 4 of the second embodiment, the central portion 6 of the connection terminal 5 is avoided, and eight slits 8 extending radially from the central portion 6 side toward the outer edge 7 of the connecting member 4 are formed. (notch portions) are provided at equal intervals in the circumferential direction. The slit 8 reaches the outer edge 7. The connecting member 4 is provided with eight slits 8 at equal intervals in the circumferential direction, and has rotational symmetry when viewed from a direction perpendicular to the surface of the substrate 2.

According to the electrode embedding member 1 of the second embodiment, since the volume of the connecting member 4 can be reduced as compared with the configuration in which the slit 8 is not provided, the metal connecting member 4 and the ceramic material belonging to the base material have physical properties. The stress induced by the difference can be suppressed, and cracks of the insulating layer (from the internal electrode 3 in the substrate 2 to the portion of the surface 2a of the substrate 2) can be suppressed. Good situation.

Moreover, since the connecting member 4 is easily deformed when the base material 2 is fired, the internal stress of the connecting member 4 can be alleviated. Further, since the ceramic of the substrate 2 enters the slit 8 of the connecting member 4, the adhesion between the connecting member 4 and the substrate 2 is improved, and the strength reliability in the vicinity of the connecting member 4 is improved. In the second embodiment, the slit 8 corresponds to the second predetermined structure of the present invention.

Further, since the connecting member 4 is provided with rotational symmetry, it is provided that, for example, the slit 8 is not equally spaced and does not have rotational symmetry, it is possible to suppress occurrence of a repetitive portion in the release of internal stress, and internal stress can be obtained. The insulating layer is appropriately dispersed to suppress the occurrence of cracks on the surface side of the substrate.

Further, in the second embodiment, the slit 8 has been described as reaching the outer edge 7 of the connecting member 4. However, the slit of the present invention is not limited thereto, and for example, the slit may not reach the outside of the connecting member 4. The edge is formed by being spaced from the outer edge.

In addition, the thickness of at least a part of the connection member 4 of the second embodiment in the direction perpendicular to the surface of the base material 2 may be 0.2 mm or less, and may include any of the first predetermined structure and the second predetermined structure. The method constitutes a connecting member.

Further, although the suppression force of the internal stress is lowered, even if the slit 8 is disposed so as not to have rotational symmetry when viewed from a direction perpendicular to the surface of the substrate 2, the internal stress can be suppressed more than the conventional structure. It is possible to exert the effects of the present invention in suppressing defects such as cracks.

[Example 2]

In the second embodiment of the second embodiment, the slit 8 is radially formed by the laser beam processing in the connecting member 4 by a length of 2 mm and a width of 0.1 mm, and the other portions are the same as those in the first embodiment. According to the second embodiment, the same evaluation as in the first embodiment was carried out, and it was confirmed that cracks did not occur, and the reliability was high.

Further, it is considered that a part of the ceramic base material enters the slit 8, and the adhesion between the ceramic base material 2 and the connecting member 4 is increased, and the strength reliability in the vicinity of the connecting member 4 is improved.

In addition, the numerical values of the length of the slit 8 of the second embodiment are exemplified, and the present invention is not limited thereto, and the effects of the present invention can be obtained even if other numerical values are set.

[Third embodiment]

The electrode embedding member 1 of the third embodiment has the same configuration as that of the first embodiment except for the connection member 4. As shown in FIG. 4, in the connection member 4 of the third embodiment, the fan-shaped six cutout holes 9 penetrating the connection member 4 from the central region 6 of the connection terminal 5 are provided at equal intervals in the circumferential direction. The fan-shaped cutout holes 9 are bored from the outer edge 7 of the connecting member 4 with a space therebetween. The connecting member 4 is provided with six louvers 9 at equal intervals in the circumferential direction, and has rotational symmetry when viewed from a direction perpendicular to the surface of the substrate 2.

According to the electrode embedding member 1 of the third embodiment, since the volume of the connecting member 4 can be reduced as compared with the case where the missing hole 9 is not provided, the difference between the physical properties of the metal connecting member 4 and the ceramic material belonging to the base material can be obtained. The induced stress is suppressed, and problems such as cracks in the insulating layer (from the internal electrode 3 of the substrate 2 to the portion of the surface 2a of the substrate 2) can be suppressed.

Moreover, since the connecting member 4 is easily deformed when the base material 2 is fired, the internal stress of the connecting member 4 can be alleviated. Further, since the ceramic of the substrate 2 enters the hole 9 of the connecting member 4, the adhesion between the connecting member 4 and the substrate 2 is improved, and the strength reliability in the vicinity of the connecting member 4 is improved. In the third embodiment, the missing hole 9 corresponds to the second predetermined structure of the present invention.

Further, since the connecting member 4 has rotational symmetry, for example, the missing holes 9 are not provided at equal intervals in the circumferential direction, or the size or shape of each of the missing holes 9 is different, and the surface of the substrate 2 is not provided. In comparison with the case of the rotational symmetry in the vertical direction, it is possible to suppress the occurrence of a repetitive portion in the release of the internal stress of the connecting member 4, and the internal stress can be appropriately suppressed.

In addition, in the third embodiment, the configuration in which the cutout hole 9 is formed in a fan shape and six are formed will be described. However, the cutout hole 9 of the present invention is not limited thereto, and may be, for example, a through-connection member. It may also be a shape other than a fan, such as a circular shape or a polygonal shape. Further, the number of the missing holes is not limited to six, and may be one, or may be plural, for example, 2 to 5 or 7 or more.

In addition, even if the connection member 4 does not have rotational symmetry, the hole-free hole 9 can suppress the internal stress more than the conventional structure, and can exhibit the problem of suppressing cracks and the like. The effect of the effect.

[Example 3]

In the third embodiment of the third embodiment, the connection member 4 is formed with the hole 9 by laser processing (the diameter (inner diameter) of the side of the radially inner side of the sector shape is 1 mm, and the diameter of the side of the radial outer side of the sector shape. (outer diameter) 2.4 mm, the gap between the notch holes 9 in the circumferential direction is 0.4 mm). According to the third embodiment, the same evaluation as in the first embodiment was carried out, and it was confirmed that cracks did not occur and the reliability was high.

Further, it is considered that the ceramic base material enters the defective hole 9, and the adhesion between the ceramic base material 2 and the connecting member 4 is increased, and the strength reliability in the vicinity of the connecting member 4 is improved.

Since the connecting member 4 is easily deformed when the ceramic is fired, it is considered that the strength reliability in the vicinity of the connecting member 4 of the electrode-embedded member 1 can be improved by alleviating the internal stress of the connecting member 4.

In addition, the numerical values of the diameter and the like in the third embodiment are exemplified, and the present invention is not limited thereto, and the effects of the present invention can be obtained even if other numerical values are set.

[Fourth embodiment]

The electrode embedding member 1 of the fourth embodiment has the same configuration as that of the first embodiment except for the connection member 4. As shown in Fig. 5, in the connecting member 4 of the fourth embodiment, eight triangular cutouts 10 that penetrate the connecting member 4 from the central region 6 of the connecting terminal 5 are provided at intervals in the circumferential direction. The missing hole 10 reaches the outer edge 7 of the connecting member 4.

According to the electrode embedding member 1 of the fourth embodiment, The volume of the connecting member 4 can be reduced as compared with the case where the hole 10 is not provided. Therefore, the stress induced by the difference in physical properties between the metal connecting member 4 and the ceramic material belonging to the base material can be suppressed, and the setting can be suppressed. A problem such as cracks in the insulating layer of the material 2 (the portion from the internal electrode 3 in the substrate 2 to the surface 2a of the substrate 2).

Further, when the base material 2 is fired, the connecting member 4 is easily deformed to the extent that the hole 10 is provided, so that the internal stress of the connecting member 4 can be alleviated. Furthermore, the ceramic of the substrate 2 enters the notch 10 of the connecting member 4. Further, since the missing hole 10 reaches the outer edge 7 of the connecting member 4, the length of the substantial outer edge of the connecting member 4 becomes long. Therefore, the adhesion between the connecting member 4 and the substrate 2 is increased, and the strength reliability in the vicinity of the connecting member 4 is improved. In the fourth embodiment, the missing hole 10 corresponds to the second predetermined structure of the present invention.

Since the connecting member 4 has rotational symmetry, for example, in comparison with the case where the missing holes 10 are not equally spaced in the circumferential direction, or the size or shape of each of the missing holes 10 does not have rotational symmetry, It is possible to suppress the occurrence of a repetitive portion in the discharge release of the internal stress of the connecting member 4, and the internal stress can be appropriately dispersed to suppress the occurrence of the crack toward the insulating layer on the surface side of the substrate.

In addition, even if the connection member 4 does not have rotational symmetry, the hole 10 can suppress the internal stress more than the conventional structure, and can exhibit the problem of suppressing cracks and the like. The effect of the effect.

[Example 4]

In the fourth embodiment of the fourth embodiment, eight connection holes 10 are provided in the connecting member 4 at a distance of 45° in the circumferential direction by laser processing. The projection 11 formed between the circumferential directions of the cutout holes 10 has a front end angle of 90°, and the distance from the center of the connecting member 4 to the front end of the projection 11 is 4 mm (that is, the connection member 4 is Set by the method of diameter 8mm).

Further, the numerical values such as the angles of the fourth embodiment are exemplified, and the present invention is not limited thereto, and the effects of the present invention can be obtained even if other numerical values are set.

[Fifth Embodiment]

The electrode embedding member 1 of the fifth embodiment is the same as that of the first embodiment except for the connection member 4. As shown in Fig. 6, the connecting member 4 of the fifth embodiment is a single mesh structure formed by meshing a metal wire or a metal fiber or the like, or a plurality of mesh structures are stacked. It consists of a laminate.

According to the electrode embedding member 1 of the fifth embodiment, the volume of the connecting member 4 can be reduced as compared with the case where the connecting member 4 is a non-screen structure, and therefore the metal connecting member 4 and the ceramic material as the base material are used. The stress induced by the difference is suppressed, and problems such as cracks in the insulating layer (the portion from the internal electrode 3 of the substrate 2 to the surface 2a of the substrate 2) of the substrate 2 can be suppressed.

Further, since the connecting member 4 belonging to the mesh structure at the time of firing of the base material 2 is easily deformed, the internal stress of the connecting member 4 can be alleviated. Furthermore, since the ceramic of the substrate 2 enters the mesh structure of the connecting member 4 Since the gap between the bodies is increased, the adhesion between the connecting member 4 and the substrate 2 is improved, and the strength reliability in the vicinity of the terminal 5 is improved. In the fifth embodiment, the laminated body of the mesh structure of the connecting member 4 corresponds to the third predetermined structure of the present invention.

[Example 5]

In the fifth to fifth embodiments (the fifth embodiment of the fifth embodiment), the mesh structure made of molybdenum was cut into a circular shape having a diameter of 6 mm to form the connecting member 4. The other configuration is the same as that of the first embodiment. Example 5-1 was set to a wire diameter of 0.03 mm, a flat woven mesh size (number of lead wires per 1 inch) 150, and Example 5-2 was set to a wire diameter of 0.05 mm, a plain woven mesh. Dimensions (number of lead bars per 1 inch) 100; Example 5-3 is set to a wire diameter of 0.10 mm, a flat woven mesh size (number of leads per 1 inch) 50; Example 5-4 is set The wire diameter is 0.15 mm, and the size of the flat woven mesh (the number of leads per 1 inch) is 40.

As a result of measurement by the same evaluation method as in Example 1, it was confirmed that the number of occurrences of cracks in any of Examples 5-1 to 5-4 was zero, and the reliability was high. This is considered to be because the connecting member 4 composed of the mesh structure is deformed during firing of the ceramic, and the internal stress is alleviated.

Further, it is considered that the ceramic as the material of the base material 2 invades the mesh of the mesh structure, the adhesion between the base material 2 and the connecting member 4 is improved, and the strength reliability in the vicinity of the connecting member 4 is improved.

[Example 6]

In the embodiment 6-1 to the embodiment 6-3 of the fifth embodiment (hereinafter referred to as the embodiment 6), the connecting member 4 is formed into a three-layer structure in which three mesh structures are laminated. The other configuration is the same as that of the first embodiment.

Example 6-1 was set to have a wire diameter of 0.03 mm, a flat woven mesh size (number of lead wires per 1 inch) 150, and Example 6-2 was set to a wire diameter of 0.05 mm, and a plain woven mesh size (per The number of lead wires of 1 inch was 100); Example 6-3 was set to have a wire diameter of 0.10 mm and a flat woven mesh size (number of lead wires per 1 inch) 50.

In the same manner as in the sixth embodiment, the results of the measurement by the same evaluation method as in the first embodiment were confirmed to be zero in the number of crack occurrences in any of the examples 6-1 to 6-3, and the reliability was high. This is considered to be because the connecting member 4 composed of the mesh structure is deformed when the ceramic is fired, and the internal stress is alleviated.

Further, it is considered that the ceramic as the material of the base material 2 invades the mesh of the mesh structure, the adhesion between the base material 2 and the connecting member 4 is improved, and the strength reliability in the vicinity of the connecting member 4 is improved.

In addition, in the sixth embodiment, since the mesh structure is formed into a three-layer structure, the connection member 4 can be pierced during the processing of the terminal insertion hole 2c, and the possibility of damage to the internal electrode 3 can be reduced.

Further, when a plurality of mesh structures are laminated, the electrical characteristics of the connecting member 4 can be improved by applying a tungsten paste to the laminated interface.

Further, the numerical values of the wire diameter, the mesh size, and the number of stacked mesh structures in the fifth embodiment are exemplified, and the present invention is not limited thereto, and the effect of the present invention can be obtained even if other numerical values are set. effect.

Claims (7)

An electrode embedding member comprising: a plate-shaped base material having a front surface and a back surface and being made of ceramic; an internal electrode extending parallel to a surface of the base material and embedded in the base material; and a connecting member and the base material The surface extends in parallel and is disposed to overlap with the internal electrode; and the terminal is connected to the connecting member, and the electrode embedding member is characterized by having a predetermined configuration of at least one of the following (1) to (3): 1) a first predetermined structure in which at least a part of the connecting member in a direction perpendicular to a surface of the base material has a thickness of 0.2 mm or less, (2) the connecting member has a second predetermined structure of a notch portion, and (3) the aforementioned The connecting member is a third predetermined structure composed of a mesh structure. The electrode-embedded member according to claim 1, wherein the predetermined structure includes at least the first predetermined structure, and the total thickness of the connecting member in a direction perpendicular to a surface of the substrate of the first predetermined structure is 0.2 mm or less. The electrode embedding member according to claim 1 or 2, wherein the predetermined structure includes at least the second predetermined structure, and the notch portion avoids a central region where the terminal of the connecting member is connected, and is located from a central region side of the connecting member A slit that extends radially toward the outer edge of the connecting member. In the electrode embedding member according to claim 1 or 2, the predetermined structure includes at least the second predetermined structure, and the notch portion penetrates a hole in the connecting member through a central region where the terminal of the connecting member is connected. The electrode embedding member according to claim 1 or 2, wherein the predetermined structure includes at least the second predetermined structure, and the notch portion avoids a central region in which the terminal connection of the connecting member is connected, and the connection is reached from the central region side The outer edge of the component. The electrode embedding member according to claim 1 or 2, wherein the predetermined structure includes at least the third predetermined structure, and the connecting member is formed by stacking a plurality of mesh structures. The electrode embedding member according to claim 1 or 2, wherein the predetermined structure has rotational symmetry when viewed from a direction perpendicular to a surface of the substrate.