[go: up one dir, main page]

TW201932810A - Device and method for rapidly measuring run-out and vibration of main shaft and tool of machine tool to place the main shaft or the tool in the machine between the laser transmitting-receiving module and the reflective module at the processing speed - Google Patents

Device and method for rapidly measuring run-out and vibration of main shaft and tool of machine tool to place the main shaft or the tool in the machine between the laser transmitting-receiving module and the reflective module at the processing speed Download PDF

Info

Publication number
TW201932810A
TW201932810A TW107101867A TW107101867A TW201932810A TW 201932810 A TW201932810 A TW 201932810A TW 107101867 A TW107101867 A TW 107101867A TW 107101867 A TW107101867 A TW 107101867A TW 201932810 A TW201932810 A TW 201932810A
Authority
TW
Taiwan
Prior art keywords
tool
laser
module
spindle
position sensor
Prior art date
Application number
TW107101867A
Other languages
Chinese (zh)
Other versions
TWI644088B (en
Inventor
劉建宏
劉承育
Original Assignee
國立中興大學
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 國立中興大學 filed Critical 國立中興大學
Priority to TW107101867A priority Critical patent/TWI644088B/en
Application granted granted Critical
Publication of TWI644088B publication Critical patent/TWI644088B/en
Publication of TW201932810A publication Critical patent/TW201932810A/en

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Machine Tool Sensing Apparatuses (AREA)

Abstract

The present invention provides a device and method for rapidly measuring run-out and vibration of a main shaft and a tool of a machine tool, wherein a laser transmitting-receiving module comprises a laser element, a beam splitter, a wave plate, and a two-quadrant light position sensor. The beam splitter is disposed between the wave plate and the laser element, the two-quadrant light position sensor is disposed on one side of the beam splitter, and a reflective module is assembled with a mirror. The reflective module and the laser transmitting-receiving module are disposed on the same line, so that the main shaft or the tool in the machine is placed between the laser transmitting-receiving module and the reflective module at the processing speed, thereby obtaining the variation of the differential energy generated by the two-quadrant light position sensor. In this way, the run-out value of the main shaft in the machine and the high-frequency vibration of the tool are measured.

Description

工具機主軸與刀具偏擺與震動快速量測裝置與方法 Tool machine spindle and tool yaw and vibration rapid measuring device and method

本發明係有關於一種工具機軸量測裝置,尤指一種以遮蔽雷射光束產生的差動能量量測工具機主軸與刀具偏擺與震動快速量測裝置與方法,本發明具有低成本、方便組裝、準確度高及加工轉速狀態直接量測之明顯功效。 The invention relates to a tool machine shaft measuring device, in particular to a differential energy measuring machine tool spindle and a tool yaw and vibration rapid measuring device and method for shielding a laser beam, the invention has the advantages of low cost and convenience. The assembly, high accuracy and direct measurement of the processing speed state have obvious effects.

按,目前習知的刀具線上量測裝置可量測最大轉速約3000rpm,此轉速下的量測主軸偏擺狀況無法符合實際加工時的條件狀況,此外市售的刀具線上量測裝置需讀取工具機的座標當作判斷位移的依據因此對於主軸線上的旋轉精度並無法量測,這些都是目前產品的存在問題,將導致主軸轉速無法跟實際加工轉速一樣條件下量測,低轉速量測下3000rpm不符合加工狀態時的刀具情形,此轉速遠小於真正加工時的轉速6000rpm以上,無法線上即時偵測高轉速下主軸旋轉精度,因此無法量測主軸目前精度與壽命狀況,又於量測時需要停機安裝感測頭與透鏡組,並只能在減速狀態進行量測,會因為量測效率低而降低其產能,再者,該感測頭與透鏡組的組裝位置固定,該主軸與工作平台的高度亦固定,因此要適用每一機種就要配合進行調整,無法組裝於不干擾加工作業之位置,並在欲量測主軸時要拆下刀具與加工物件,導致其適用性降低及耗時費力,再者,由於超音波加工技術將廣泛應用於航太產業加工與手機陶瓷背殼加工製造,因此未來將是市場爆發點,而目前對於超音波加工精度的保持技 術中,皆需要於超音波加工之刀具經過一段時間後再以儀器量測刀具的高頻振動量之衰減,即非線上即時量測,無法馬上調整以保持加工製程參數之穩定,使其加工品質降低,上述皆為本創作所欲改解決之技術問題點。 According to the conventional tool-line measuring device, the maximum speed can be measured at about 3000 rpm. The measured spindle yaw condition at this speed cannot meet the actual processing conditions, and the commercially available tool-line measuring device needs to be read. The coordinates of the machine tool are used as the basis for judging the displacement. Therefore, the accuracy of the rotation on the spindle line cannot be measured. These are the existing problems of the product, which will cause the spindle speed to be measured under the same conditions as the actual machining speed. The lower 3000 rpm does not meet the tool condition in the machining state. This speed is much less than the actual machining speed of 6000 rpm or more. It is impossible to detect the spindle rotation accuracy at high speed on the line immediately, so the current accuracy and life condition of the spindle cannot be measured. When the sensor head and the lens group need to be stopped, the measurement can only be performed in the deceleration state, and the productivity is reduced because of the low measurement efficiency. Furthermore, the assembly position of the sensor head and the lens group is fixed, and the spindle is fixed. The height of the working platform is also fixed, so it is necessary to adjust it to suit each model, and it cannot be assembled without disturbing the processing operation. The tool and the workpiece are removed when the spindle is to be measured, resulting in reduced applicability and time-consuming and labor-intensive. Furthermore, the ultrasonic processing technology will be widely used in the processing of aerospace industry and the manufacture of mobile ceramic back shells. Therefore, the future will be a market explosion point, and the current maintenance technology for ultrasonic machining accuracy During the operation, the ultrasonic machining tool needs to measure the high-frequency vibration of the tool after a period of time, that is, the non-line real-time measurement, can not be adjusted immediately to maintain the stability of the processing parameters, so that the processing quality Reducing, all of the above are the technical problems that the creative office wants to solve.

有鑑於此,本發明人於多年從事相關產品之製造開發與設計經驗,針對上述之目標,詳加設計與審慎評估後,終得一確具實用性之本發明。 In view of this, the inventors have been engaged in the manufacturing development and design experience of related products for many years, and after detailed design and careful evaluation of the above objectives, the present invention has finally become practical.

本發明所欲解決之技術問題在於針對現有技術存在的上述缺失,提供一種工具機主軸與刀具偏擺與震動快速量測裝置。 The technical problem to be solved by the present invention is to provide a tool machine spindle and a tool yaw and vibration rapid measuring device in view of the above-mentioned shortcomings existing in the prior art.

一雷射發射接收模組包括有一雷射元件、一分光鏡、一波片及一兩象限光位置感測器,該分光鏡設置於該波片與雷射元件之間,又該雷射元件朝向該分光鏡發射有一雷射光束,而該雷射光束穿過該分光鏡與該波片形成有一直線延伸的第一光束,另該兩象限光位置感測器設置於該分光鏡一側,且該兩象限光位置感測器由一分隔線間隔有一第一能量接收區與一第二能量接收區,一反射模組裝設有一反射鏡,且該反射模組與該雷射發射接收模組設置於同一直線上,並於該波片與該反射鏡之間形成有一可變距離的量測區段,讓該第一光束投射至該反射鏡而由入射方向反射至該波片與分光鏡,並以該分光鏡分光該第一光束形成有一第二光束,又該第二光束投射於該兩象限光位置感測器之第一能量接收區與第二能量接收區的等比例位置。 A laser transmitting and receiving module includes a laser element, a beam splitter, a wave plate and a two-quadrant light position sensor. The beam splitter is disposed between the wave plate and the laser element, and the laser element is further disposed. A laser beam is emitted toward the beam splitter, and the laser beam passes through the beam splitter to form a first light beam extending linearly with the wave plate, and the two quadrant light position sensors are disposed on one side of the beam splitter. The two-quadrant optical position sensor is separated by a first energy receiving area and a second energy receiving area by a dividing line, a reflection mode is assembled with a mirror, and the reflection module and the laser emitting receiving mode The groups are disposed on the same line, and a measuring section with a variable distance is formed between the wave plate and the mirror, and the first beam is projected to the mirror and reflected by the incident direction to the wave plate and the beam splitting Mirroring, and splitting the first beam with the beam splitter to form a second beam, and the second beam is projected to an equal position of the first energy receiving region and the second energy receiving region of the two-quadrant optical position sensor.

其中,該兩象限光位置感測器傾斜裝設於該雷射發射接收模組,令該分隔線與該第一光束之間的投影形成有一銳角(係介於三十度至六 十度的夾角)。 The two-quadrant position sensor is obliquely mounted on the laser emission receiving module, so that the projection between the separation line and the first beam forms an acute angle (between thirty degrees and six Ten degrees of angle).

其中,該雷射發射接收模組與該反射模組皆固定於一座體上,二該座體讓雷射元件、分光鏡、波片、兩象限光位置感測器及反射鏡皆等高度,使該第一光束與第二光束皆位於該分光鏡、波片、兩象限光位置感測器及反射鏡的中央處。 The laser emitting and receiving module and the reflective module are both fixed on a body, and the base body allows the laser element, the beam splitter, the wave plate, the two-quadrant light position sensor and the mirror to be equal in height. The first beam and the second beam are both located at the center of the beam splitter, the wave plate, the two-quadrant light position sensor, and the mirror.

其中,該雷射發射接收模組與該反射模組之座體處皆蓋合有一殼體,二該殼體穿設有一提供該第一光束通過的穿孔,且該殼體於一側開設有一相通穿孔之通孔,而該通孔接通氣流能形成穿孔處的正壓微氣牆,藉此防止切削液及切屑物入侵形成干擾。 Wherein, the laser emitting and receiving module and the base of the reflective module are covered with a casing, and the casing is provided with a through hole for providing the first light beam, and the casing is opened on one side. The perforated through hole is communicated, and the through hole is connected to the airflow to form a positive pressure micro gas wall at the perforation, thereby preventing the intrusion of the cutting fluid and the cutting object to form interference.

其中,該雷射發射接收模組處另裝設有一輔助雷射模組,該輔助雷射模組內部裝設有一第二雷射元件、一第二分光鏡、一第二波片及一四象限光位置感測器,且該第二分光鏡設於第二雷射元件與第二波片之間,又該四象限光位置感測器設於第二分光鏡一側,又該主軸上裝設有一第二反光鏡,並透過該第二反光鏡反射該輔助雷射模組所發射的第三光束。 The auxiliary laser module is further provided with an auxiliary laser module, and the auxiliary laser module is internally provided with a second laser component, a second beam splitter, a second wave plate and a fourth a quadrant light position sensor, wherein the second beam splitter is disposed between the second laser element and the second wave plate, and the four-quadrant light position sensor is disposed on a side of the second beam splitter, and the spindle is further disposed on the spindle A second mirror is mounted, and the third beam emitted by the auxiliary laser module is reflected by the second mirror.

本發明所欲解決之技術問題在於針對現有技術存在的上述缺失,提供一種工具機主軸與刀具偏擺與震動快速量測方法。 The technical problem to be solved by the present invention is to provide a tool spindle and tool yaw and vibration rapid measurement method for the above-mentioned shortcomings existing in the prior art.

將雷射發射接收模組裝設於該主軸或刀具對應的工作平台,該雷射發射接收模組內部裝設有一雷射元件、一分光鏡、一波片及一兩象限光位置感測器,且該分光鏡設於雷射元件與波片之間,又該兩象限光位置感測器設於分光鏡一側,且該兩象限光位置感測器形成有一第一能量接收區與第二能量接收區;將反射模組裝設於該工作平台並與該雷射發射接收模組形成同一直線,該反射模組內部裝設有一反射鏡,且該反射鏡 正對該波片形成有一量測區段;該雷射元件產生一雷射光束穿過該分光鏡與該波片,並由該波片轉換雷射光束為第一光束,且該第一光束射入反射鏡並沿射入方向反射回該波片與分光鏡;反射後之第一光束由分光鏡朝該兩象限光位置感測器方向形成有第二光束,該第二光束投射於該第一能量接收區產生一第一能量值,且該第二光束投射於該第二能量接收區產生一第二能量值;e.該主軸或刀具以加工轉速狀態位移進入該量測區段,並以主軸或刀具周緣對第一光束形成部分阻擋,讓第二光束投射至該兩象限光位置感測器而形成第一能量值與第二能量值的數值變化;透過第一能量值相減第二能量值取得差動能量,而該主軸的偏擺與刀具的高頻震動會讓差動能量形成有變化值。 The laser transmitting and receiving module is assembled on the working platform corresponding to the spindle or the tool, and the laser emitting receiving module is internally provided with a laser component, a beam splitter, a wave plate and a two-quadrant light position sensor. And the beam splitter is disposed between the laser component and the wave plate, and the two-quadrant light position sensor is disposed on a side of the beam splitter, and the two-quadrant light position sensor is formed with a first energy receiving region and a first a second energy receiving area; the reflective mode is assembled on the working platform and forms a same line with the laser emitting and receiving module, the reflecting module is internally provided with a mirror, and the reflecting mirror Forming a measurement section on the wave plate; the laser element generates a laser beam passing through the beam splitter and the wave plate, and the laser beam is converted into a first beam by the wave plate, and the first beam is Injecting into the mirror and reflecting back to the wave plate and the beam splitter in the incident direction; the reflected first light beam is formed by the beam splitter toward the two-quadrant light position sensor with a second light beam, and the second light beam is projected thereon The first energy receiving region generates a first energy value, and the second light beam is projected into the second energy receiving region to generate a second energy value; e. the spindle or the tool is displaced into the measuring segment at a processing speed state, And blocking the first beam forming portion by the spindle or the tool circumference, and causing the second beam to be projected to the two-quadrant light position sensor to form a numerical change of the first energy value and the second energy value; subtracting the first energy value by the first energy value The second energy value takes the differential energy, and the yaw of the spindle and the high frequency vibration of the tool cause the differential energy to form a varying value.

其中更包括有以下步驟:g.該雷射發射接收模組處另裝設有一朝向該主軸發射第三光束之輔助雷射模組,該輔助雷射模組內部裝設有一第二雷射元件、一第二分光鏡、一第二波片及一四象限光位置感測器,且該第二分光鏡設於第二雷射元件與第二波片之間,又該四象限光位置感測器設於第二分光鏡一側;h.將主軸組裝有一第二反射鏡,並以該第二反射鏡正對該輔助雷射模組之第三光束,使該第三光束反射由該第二分光鏡折射至該四象限光位置感測器,藉此測得主軸於工作轉速下的軸向偏擺路徑;i.比對該兩象現光位置感測器與四象限光位置感測器所測得的偏擺值,進一步計算該偏擺值達到誤差校正之目的。 The method further includes the following steps: g. The laser transmitting and receiving module is further provided with an auxiliary laser module for emitting a third light beam toward the main shaft, and the auxiliary laser module is internally provided with a second laser element a second beam splitter, a second wave plate and a four-quadrant light position sensor, wherein the second beam splitter is disposed between the second laser element and the second wave plate, and the four-quadrant light position sense The detector is disposed on a side of the second beam splitter; h. the spindle is assembled with a second mirror, and the third beam is directed to the third beam of the auxiliary laser module, and the third beam is reflected by the second mirror The second beam splitter is refracted to the four-quadrant light position sensor, thereby measuring the axial yaw path of the spindle at the working speed; i. comparing the two-image light position sensor and the four-quadrant light position sense The yaw value measured by the detector further calculates the yaw value to achieve the purpose of error correction.

其中,該兩象限光位置感測器由一分隔線間隔該第一能量接收區與該第二能量接收區,又該兩象限光位置感測器呈傾斜狀裝設於該雷 射發射接收模組,而該分隔線與該第一光束之間的投影形成有一銳角(係介於三十度至六十度的夾角)。 The two-quadrant optical position sensor is separated from the first energy receiving area and the second energy receiving area by a dividing line, and the two-quadrant light position sensor is installed on the ridge in a slanting manner. The emission receiving module is formed, and the projection between the dividing line and the first beam forms an acute angle (between 30 degrees and 60 degrees).

其中,該雷射發射接收模組與反射模組於符合設置於同一平面與同一直線的條件下,能裝設於工作平台的任意位置並相對形成不同的量測區段,又該雷射發射接收模組以雷射元件與兩象限光位置感測器連結電源,且該反射模組為未接電結構,進而提高該雷射發射接收模組與反射模組組裝於工作平台上之變化性。 Wherein, the laser transmitting and receiving module and the reflecting module can be installed at any position of the working platform and form different measuring sections under the condition that the same plane and the same straight line are disposed, and the laser emitting The receiving module is connected to the power source by the laser component and the two-quadrant optical position sensor, and the reflective module is an unpowered structure, thereby improving the variability of assembling the laser transmitting and receiving module and the reflective module on the working platform. .

其中,該雷射發射接收模組與該反射模組皆固定於一座體上,且該雷射發射接收模組與該反射模組之座體處皆蓋合有一殼體,二該殼體穿設有一提供該第一光束通過的穿孔,且該殼體於一側開設有一相通穿孔之通孔,而該通孔接通氣流能形成穿孔處的正壓微氣牆。 The laser emitting and receiving module and the reflecting module are both fixed on the body, and the housing of the laser emitting and receiving module and the reflecting module are covered with a casing, and the casing is worn by the casing. A through hole for providing the first light beam is provided, and the casing has a through hole penetrating through the hole on one side, and the through hole is connected to the airflow to form a positive pressure micro gas wall at the through hole.

本發明的第一主要目的在於,該雷射發射接收模組裝設於該主軸或刀具對應的工作平台,且該雷射發射接收模組之分光鏡設於雷射元件與波片之間,而該兩象限光位置感測器設於分光鏡一側,並於分光鏡與兩象限光位置感測器之間形成有第二光束,又該反射模組裝設於該工作平台並與該雷射發射接收模組形成同一直線,該反射模組內部裝設有一反射鏡,且該反射鏡正對該波片形成有一第一光束,該機上主軸以加工轉速(6000rpm以上)對第一光束形成部分阻擋,獲得該第二光束射入兩象限光位置感測器產生差動能量的變化值,俾以能於未減速或停機狀態判斷主軸之偏擺量。 A first main object of the present invention is that the laser emitting and receiving die is assembled on a working platform corresponding to the spindle or the tool, and the beam splitter of the laser emitting and receiving module is disposed between the laser component and the wave plate. The two-quadrant optical position sensor is disposed on a side of the beam splitter, and a second light beam is formed between the beam splitter and the two-quadrant light position sensor, and the reflective mold is assembled on the working platform and The laser emitting and receiving module forms a straight line, the reflecting module is internally provided with a mirror, and the mirror is formed with a first light beam to the wave plate, and the upper spindle of the machine is processed at a rotating speed (6000 rpm or more). The beam forming portion is blocked, and the second beam is incident on the two-quadrant light position sensor to generate a change value of the differential energy, so that the yaw amount of the main shaft can be judged without being decelerated or stopped.

本發明的第二主要目的在於,該雷射發射接收模組與反射模組於符合設置於同一平面與同一直線的條件下,能裝設於工作平台的任意 位置並相對形成不同的量測區段,藉此配合工具機款式自由組裝於最理想的量測位置,又該雷射發射接收模組以雷射元件與兩象限光位置感測器連結電源,且該反射模組為未接電結構,藉此能簡化配線需求,進而提高該雷射發射接收模組與反射模組組裝於工作平台上之變化性。 A second main object of the present invention is that the laser emitting and receiving module and the reflecting module can be mounted on the working platform under the conditions of being disposed on the same plane and the same straight line. Positioning and forming different measuring sections relative to each other, thereby being freely assembled to the optimal measuring position in cooperation with the tool machine model, and the laser transmitting and receiving module is connected to the power source by the laser element and the two-quadrant light position sensor. Moreover, the reflective module is an unpowered structure, thereby simplifying the wiring requirement, thereby improving the variability of assembling the laser transmitting and receiving module and the reflective module on the working platform.

本發明的第三主要目的在於,該兩象限光位置感測器由一分隔線間隔該第一能量接收區與該第二能量接收區其分隔線為一個約20~30μm的間隙,又該兩象限光位置感測器呈傾斜狀裝設於該雷射發射接收模組,而該分隔線與該第一光束之間的投影形成有一銳角(係介於三十度至六十度的夾角),讓主軸或刀具阻擋第一光束之遮蔽邊緣不會完全重疊該分隔線,藉此克服量測時所產生的無反應區域,俾以提高其量測的準確度。 A third main object of the present invention is that the two-quadrant optical position sensor is separated by a dividing line, and the dividing line between the first energy receiving area and the second energy receiving area is a gap of about 20~30 μm, and the two The quadrant light position sensor is obliquely mounted on the laser emitting and receiving module, and the projection between the dividing line and the first light beam forms an acute angle (between 30 degrees and 60 degrees) The main axis or the tool blocks the shadow edge of the first beam from completely overlapping the separation line, thereby overcoming the non-reactive area generated during the measurement, so as to improve the accuracy of the measurement.

本發明的第四主要目的在於,該殼體穿設有一提供該第一光束通過的穿孔,且該殼體於一側開設有一相通穿孔之通孔,而該通孔接通氣流能形成穿孔處的正壓微氣牆,藉此防止切削液及切屑物入侵形成干擾,俾以提高其耐用度。 A fourth main object of the present invention is that the housing is provided with a through hole for providing the first light beam, and the housing has a through hole penetrating through the hole on one side, and the through hole is connected to the airflow to form a through hole. The positive pressure micro-gas wall, in order to prevent the intrusion of cutting fluid and cuttings to form interference, so as to improve its durability.

本發明的第五主要目的在於,該雷射發射接收模組處另裝設有一朝向該主軸發射第三光束之輔助雷射模組,將主軸組裝有一第二反射鏡,並以該第二反射鏡正對該輔助雷射模組之第三光束,使該第三光束反射由該輔助雷射模組之該四象限光位置感測器接收,藉此測得主軸於工作轉速下的軸向偏擺路徑,比對該兩象現光位置感測器與四象限光位置感測器所測得的偏擺值,進一步計算該偏擺值達到誤差校正之目的,並增加該雷射發射接收模組與該反射模組所無法測得的偏擺方向。 A fifth main object of the present invention is that the laser emitting and receiving module is further provided with an auxiliary laser module for emitting a third beam toward the main shaft, and the main shaft is assembled with a second mirror and the second reflection is The third beam of the auxiliary laser module is reflected by the mirror, and the third beam is reflected by the four-quadrant position sensor of the auxiliary laser module, thereby measuring the axial direction of the spindle at the working speed. The yaw path is further calculated by the yaw value measured by the two-image light position sensor and the four-quadrant light position sensor, and the yaw value is further calculated for error correction, and the laser emission receiving is increased. The yaw direction that the module and the reflection module cannot measure.

本發明的第六主要目的在於,該刀具能由上至下的部分遮蔽 該第一光束,此時該超音波加工之刀具將會以高頻震動頻率改變遮蔽第一光束的範圍,讓該兩象限光位置感測器所測得的第一能量值相減第二能量值取得差動能量,就能精準的量測該超音波加工之刀具的高頻震動量,對於超音波加工精度的保持技術中需要量測的儀器可以偵測超音波加工之刀具經過一段時間後的高頻振動量之衰減,並可馬上調整以保持加工製程參數之穩定。 A sixth main object of the present invention is that the tool can be shielded from top to bottom The first beam, at this time, the ultrasonic machining tool will change the range of the first beam by the high frequency vibration frequency, and the first energy value measured by the two-quadrant position sensor is subtracted by the second energy The value of the differential energy can accurately measure the high-frequency vibration of the ultrasonic machining tool. For the ultrasonic machining accuracy maintenance technology, the instrument that needs to be measured can detect the ultrasonic machining tool after a period of time. The attenuation of the high-frequency vibration amount can be adjusted immediately to maintain the stability of the processing parameters.

其他目的、優點和本發明的新穎特性將從以下詳細的描述與相關的附圖更加顯明。 Other objects, advantages and novel features of the invention will be apparent from the description and appended claims.

〔本創作〕 [this creation]

10‧‧‧雷射發射接收模組 10‧‧‧Laser transmitting and receiving module

11‧‧‧雷射元件 11‧‧‧Laser components

111‧‧‧雷射光束 111‧‧‧Laser beam

112‧‧‧第一光束 112‧‧‧First beam

113‧‧‧第二光束 113‧‧‧second beam

12‧‧‧分光鏡 12‧‧‧beam splitter

13‧‧‧波片 13‧‧‧ Wave Plate

14‧‧‧兩象限光位置感測器 14‧‧‧Two-quadrant light position sensor

141‧‧‧分隔線 141‧‧‧ separate line

142‧‧‧第一能量接收區 142‧‧‧First energy receiving area

143‧‧‧第二能量接收區 143‧‧‧second energy receiving area

(15)(22)‧‧‧座體 (15) (22) ‧ ‧ ‧ body

(16)(23)‧‧‧殼體 (16) (23) ‧‧‧Shell

(161)(231)‧‧‧穿孔 (161) (231) ‧ ‧ perforation

(162)(232)‧‧‧通孔 (162) (232) ‧‧‧ Through Hole

20‧‧‧反射模組 20‧‧‧Reflective Module

21‧‧‧反射鏡 21‧‧‧Mirror

30‧‧‧主軸 30‧‧‧ Spindle

301‧‧‧刀具 301‧‧‧Tools

31‧‧‧第二反光鏡 31‧‧‧Second mirror

θ 1‧‧‧夾角 θ 1‧‧‧ angle

D1‧‧‧量測區段 D1‧‧‧Measurement section

40‧‧‧輔助雷射模組 40‧‧‧Auxiliary Laser Module

401‧‧‧第三光束 401‧‧‧ Third beam

41‧‧‧第二雷射元件 41‧‧‧Second laser element

42‧‧‧第二分光鏡 42‧‧‧Second beam splitter

43‧‧‧第二波片 43‧‧‧second wave plate

44‧‧‧四象限光位置感測器 44‧‧‧ Four-quadrant light position sensor

第1圖係本發明之立體圖。 Figure 1 is a perspective view of the present invention.

第2圖係本發明之示意圖。 Figure 2 is a schematic representation of the invention.

第3圖係本發明之使用狀態示意圖(一)。 Fig. 3 is a schematic view showing the state of use of the present invention (1).

第4圖係本發明之使用狀態示意圖(二)。 Fig. 4 is a schematic view showing the state of use of the present invention (2).

第5圖係本發明於最大能量變化值之示意圖。 Figure 5 is a graphical representation of the maximum energy change values of the present invention.

第6圖係本發明於最小能量變化值之示意圖。 Figure 6 is a graphical representation of the minimum energy change values of the present invention.

第7圖係本發明再一實施例之示意圖。 Figure 7 is a schematic view of still another embodiment of the present invention.

第8圖係本發明之再一實施例最大能量變化值之示意圖。 Figure 8 is a schematic diagram showing the maximum energy change value of still another embodiment of the present invention.

第9圖係本發明之再一實施例最小能量變化值之示意圖。 Figure 9 is a schematic diagram showing the minimum energy change value of still another embodiment of the present invention.

第10圖係本發明之微氣牆結構示意圖。 Figure 10 is a schematic view showing the structure of the micro gas wall of the present invention.

第11圖係本發明之另一使用狀態示意圖。 Figure 11 is a schematic view showing another state of use of the present invention.

第12圖係本發明之再一使用狀態示意圖。 Figure 12 is a schematic view showing still another state of use of the present invention.

第13圖係本發明另一實施例之立體圖。 Figure 13 is a perspective view of another embodiment of the present invention.

第14圖係本發明另一實施例之使用狀態示意圖。 Figure 14 is a schematic view showing the state of use of another embodiment of the present invention.

第15圖係本發明另一實施例之第三光束投射示意圖。 Figure 15 is a schematic view showing a third beam projection of another embodiment of the present invention.

第16圖係本發明另一實施例之四象限位置感測器示意圖。 Figure 16 is a schematic view of a four-quadrant position sensor of another embodiment of the present invention.

為使 貴審查委員對本發明之目的、特徵及功效能夠有更進一步之瞭解與認識,以下茲請配合【圖式簡單說明】詳述如後:先請由第1、2、3圖與第11圖所示觀之,一種工具機主軸與刀具偏擺與震動快速量測裝置與方法,其包括有:一雷射發射接收模組10與一反射模組20,一雷射發射接收模組10包括有一雷射元件11、一分光鏡12、一波片13及一兩象限光位置感測器14,該雷射元件11可為半導體雷射,該分光鏡12設置於該波片13與雷射元件11之間,又該雷射元件11朝向該分光鏡12發射有一雷射光束111,而該雷射光束111穿過該分光鏡12與該波片13形成有一直線延伸的第一光束112,另該兩象限光位置感測器14設置於該分光鏡12一側,且該兩象限光位置感測器14由一分隔線141間隔有一第一能量接收區142與一第二能量接收區143,而該兩象限光位置感測器14傾斜裝設於該雷射發射接收模組10,令該分隔線141與該第一光束112之間的投影形成有一銳角(係介於三十度至六十度的夾角θ 1),一反射模組20裝設有一反射鏡21,該反射鏡21可為球面反射鏡、平面反射鏡或凸凹複合反射鏡,且該反射模組20與該雷射發射接收模組10設置於同一直線上,並於該波片13與該反射鏡21之間形成有一可變距離的量測區段D1,讓該第一光束112投射至該反射鏡21而由入射方向反射至該波片 13與分光鏡12,並以該分光鏡12分光該第一光束112形成有一第二光束113,又該第二光束113投射於該兩象限光位置感測器14之第一能量接收區142與第二能量接收區143的等比例位置(如第5圖所示),使該兩象限光位置感測器14產生的差動能量為零,再配合第10圖所示,該雷射發射接收模組10與該反射模組20皆固定於一座體(15)(22)上,二該座體(15)(22)讓雷射元件11、分光鏡12、波片13、兩象限光位置感測器14及反射鏡21皆等高度,使該第一光束112與第二光束113皆位於該分光鏡12、波片13、兩象限光位置感測器14及反射鏡21的中央處,該雷射發射接收模組10與該反射模組20之座體(15)(22)處皆蓋合有一殼體(16)(23),二該殼體(16)(23)穿設有一提供該第一光束112通過的穿孔(161)(231),且該殼體(16)(23)於一側開設有一相通穿孔(161)(231)之通孔(162)(232),而該通孔(162)(232)接通氣流能形成穿孔(161)(231)處的正壓微氣牆,藉此防止切削液及切屑物入侵形成干擾,當進行主軸30偏擺量測或刀具高頻震動量測時,該機上主軸30或刀具301以加工轉速(6000rpm以上)置入該量測區段D1而對第一光束112形成部分阻擋,獲得該第二光束113射入第一能量接收區142與第二能量接收區143產生差動能量的變化值(係介於最大值與最小值之間的一變動值或二最大值之間的一變動值),俾以快速量測機上主軸30之偏擺量與刀具301之高頻震動量。 In order to enable your review committee to have a better understanding and understanding of the purpose, features and effects of the present invention, please refer to the following [simplified description of the drawings] as follows: First, please refer to the first, second, third and eleventh As shown in the figure, a machine tool spindle and tool yaw and vibration rapid measuring device and method, comprising: a laser transmitting and receiving module 10 and a reflecting module 20, a laser transmitting and receiving module 10 A laser element 11, a beam splitter 12, a wave plate 13 and a two-quadrant light position sensor 14 are included. The laser element 11 can be a semiconductor laser, and the beam splitter 12 is disposed on the wave plate 13 and the thunder. Between the elements 11 , the laser element 11 emits a laser beam 111 toward the beam splitter 12 , and the laser beam 111 passes through the beam splitter 12 and the wave plate 13 forms a first beam 112 extending in a straight line. The two-quad position optical position sensor 14 is disposed on the side of the beam splitter 12, and the two-quadrant light position sensor 14 is separated by a dividing line 141 with a first energy receiving area 142 and a second energy receiving area. 143, and the two-quadrant light position sensor 14 is obliquely mounted on the laser hair The receiving module 10 is configured to form an acute angle (the angle θ 1 between 30 degrees and 60 degrees) of the projection between the dividing line 141 and the first light beam 112, and a reflective module 20 is provided with a mirror 21, the mirror 21 can be a spherical mirror, a plane mirror or a convex-concave composite mirror, and the reflection module 20 and the laser emission receiving module 10 are disposed on the same line, and the wave plate 13 and the A variable distance measuring section D1 is formed between the mirrors 21, and the first light beam 112 is projected to the mirror 21 to be reflected from the incident direction to the wave plate. 13 and the beam splitter 12, and the first beam 112 is split by the beam splitter 12 to form a second beam 113. The second beam 113 is projected onto the first energy receiving region 142 of the two-quadrant position sensor 14 and The proportional position of the second energy receiving area 143 (as shown in FIG. 5) causes the differential energy generated by the two-quadrant light position sensor 14 to be zero, and in conjunction with FIG. 10, the laser emission receiving The module 10 and the reflection module 20 are both fixed on the body (15) (22), and the base (15) (22) allows the laser element 11, the beam splitter 12, the wave plate 13, and the two quadrant positions. The sensor 14 and the mirror 21 are both at the same height, so that the first beam 112 and the second beam 113 are located at the center of the beam splitter 12, the wave plate 13, the two-quadrant light position sensor 14 and the mirror 21. The housing (15) (22) of the laser transmitting and receiving module 10 and the reflector (20) of the reflective module 20 are covered with a casing (16) (23), and the casing (16) (23) is provided with a casing Providing a through hole (161) (231) through which the first light beam 112 passes, and the housing (16) (23) has a through hole (162) (232) communicating with the through hole (161) (231) on one side, and The through hole (162) (232) is connected to the airflow to form a perforation ( 161) Positive pressure micro-gas wall at (231), to prevent the formation of interference caused by cutting fluid and cuttings. When the spindle 30 yaw measurement or tool high-frequency vibration measurement is performed, the upper spindle 30 or the cutter 301 The first light beam 112 is partially blocked by being placed in the measurement section D1 at a processing speed (6000 rpm or more), and the second light beam 113 is incident on the first energy receiving area 142 and the second energy receiving area 143 to generate differential energy. The variation value (a variation value between the maximum value and the minimum value or a variation value between the two maximum values), and the yaw amount of the spindle 30 on the fast measuring machine and the high frequency vibration of the cutter 301 the amount.

續請由第1圖連續至第12圖所示觀之,本創作之工具機主軸與刀具偏擺與震動快速量測方法,係為工具機主軸30或刀具301於加工轉速時的動態量測,藉此判斷該主軸30的偏擺量與或刀具301的高頻震動量,其量測方法包括: a.將雷射發射接收模組10裝設於該主軸30或刀具301對應的工作平台31,該雷射發射接收模組10內部裝設有一雷射元件11、一分光鏡12、一波片13及一兩象限光位置感測器14,且該分光鏡12設於雷射元件11與波片13之間,又該兩象限光位置感測器14設於分光鏡12一側,且該兩象限光位置感測器14形成有一第一能量接收區142與第二能量接收區143;b.將反射模組20裝設於該工作平台31並與該雷射發射接收模組10形成同一直線,該反射模組20內部裝設有一反射鏡21,且該反射鏡21正對該波片13形成有一量測區段D1,該雷射發射接收模組10與該反射模組20以模組化構成微型結構,有利於其安裝與校正,並能大幅減少對主軸30或刀具301的加工干涉;c.該雷射元件11產生一雷射光束111穿過該分光鏡12與該波片13,並由該波片13轉換雷射光束111為第一光束112,且該第一光束112射入反射鏡21並沿射入方向反射回該波片13與分光鏡12;d.反射後之第一光束112由分光鏡12朝該兩象限光位置感測器14方向形成有第二光束113,該第二光束113投射於該第一能量接收區142產生一第一能量值,且該第二光束113投射於該第二能量接收區143產生一第二能量值,於待量測狀態下的第一能量值等於該第二能量值,即第一能量值相減該第二能量值為零時,該雷射發射接收模組10與該反射模組20校正至同一平面與同一直線位置;e.該主軸30或刀具301以加工轉速狀態位移進入該量測區段D1,並以主軸30或刀具301周緣對第一光束112形成部分阻擋,讓第二光束113投射至該兩象限光位置感測器14而形成第一能量值與第二能量值的數值變化;以 及f.透過第一能量值相減第二能量值取得差動能量,而該主軸30的偏擺與該刀具301的高頻震動會讓差動能量形成有變化值(係介於最大值與最小值之間的一變動值或二最大值之間的一變動值),即能於未減速或停機狀態判斷主軸30之偏擺量與刀具301之高頻震動量,而該差動能量訊號是透過電腦的分析軟體進行分析與判斷,此部分與本案較無關聯,且無技術上之難度,在此不詳加敘述其內容。 Continued from the first figure to the 12th figure, the tool spindle and the tool yaw and vibration rapid measurement method are the dynamic measurement of the machine tool spindle 30 or the tool 301 at the processing speed. Thereby, the yaw amount of the main shaft 30 and the high-frequency vibration amount of the cutter 301 are judged, and the measuring methods thereof include: The laser transmitting and receiving module 10 is mounted on the working platform 31 corresponding to the main shaft 30 or the tool 301. The laser emitting and receiving module 10 is internally provided with a laser element 11, a beam splitter 12, and a wave plate. 13 and one or two quadrant light position sensors 14 , and the beam splitter 12 is disposed between the laser element 11 and the wave plate 13 , and the two quadrant light position sensors 14 are disposed on the side of the beam splitter 12 , and the The two-quadrant light position sensor 14 is formed with a first energy receiving area 142 and a second energy receiving area 143; b. The reflective module 20 is mounted on the working platform 31 and forms the same with the laser emitting and receiving module 10 A reflecting mirror 21 is disposed inside the reflecting module 20, and the measuring mirror 21 is formed with a measuring section D1, and the laser emitting receiving module 10 and the reflecting module 20 are molded. The assembly constitutes a microstructure, which facilitates its installation and correction, and can greatly reduce the processing interference of the spindle 30 or the tool 301; c. The laser element 11 generates a laser beam 111 through the beam splitter 12 and the wave plate 13, and the laser beam 111 is converted into the first light beam 112 by the wave plate 13, and the first light beam 112 is incident on the mirror 21 Reflected in the incident direction back to the wave plate 13 and the beam splitter 12; d. The reflected first light beam 112 is formed by the beam splitter 12 toward the two-quadrant light position sensor 14 with a second light beam 113, the second light beam A first energy value is generated in the first energy receiving region 142, and the second energy beam is projected on the second energy receiving region 143 to generate a second energy value, and the first energy value in the state to be measured. Equal to the second energy value, that is, when the first energy value is subtracted from the second energy value, the laser emission receiving module 10 and the reflection module 20 are corrected to the same plane and the same linear position; e. 30 or the tool 301 is displaced into the measuring section D1 at the machining speed state, and partially blocks the first light beam 112 by the circumference of the spindle 30 or the cutter 301, and the second light beam 113 is projected to the two-quadrant light position sensor 14 . And forming a numerical change of the first energy value and the second energy value; And f. obtaining the differential energy by subtracting the second energy value from the first energy value, and the yaw of the main shaft 30 and the high frequency vibration of the tool 301 cause the differential energy to have a change value (between the maximum value and A variation value between the minimum values or a variation value between the two maximum values), that is, the yaw amount of the main shaft 30 and the high-frequency vibration amount of the cutter 301 can be determined without the deceleration or the stop state, and the differential energy signal is It is analyzed and judged through the computer's analysis software. This part has nothing to do with the case, and there is no technical difficulty. The content is not detailed here.

再請由第3、4、5、6圖所示觀之,該兩象限光位置感測器14由一分隔線141間隔該第一能量接收區142與該第二能量接收區143其分隔線141為一個約20~30μm的間隙,又該兩象限光位置感測器14呈傾斜狀裝設於該雷射發射接收模組10,而該分隔線141與該第一光束112之間的投影形成有一銳角(係介於三十度至六十度的夾角θ 1),讓主軸30阻擋第一光束112之遮蔽邊緣不會完全重疊該分隔線141,藉此克服量測時所產生的無反應區域,俾以提高其量測的準確度,又該兩象限光位置感測器14之取樣頻率為250kHz,於主軸30加工轉速12000rpm的每轉能取樣1250點,藉此動態分析主軸30偏擺量,不需將主軸30減速或停止旋轉,進而有效節省量測時間與提高產能,又該雷射發射接收模組10與反射模組20於符合設置於同一平面與同一直線的條件下,能裝設於工作平台31的任意位置並相對形成不同的量測區段D1,又如第7、8、9圖所示為本創作再一實施例,由於超音波加工技術將廣泛應用於航太產業加工與手機陶瓷背殼加工製造,因此未來將是市場爆發點,如同量測主軸偏擺量一樣架設該雷射發射模組10與該反射模組20,讓該刀具301能由上至下的部分遮蔽該第一光束 112,此時該超音波加工之刀具301將會以高頻震動頻率改變遮蔽第一光束112的範圍,讓該兩象限光位置感測器14所測得的第一能量值相減第二能量值取得差動能量,就能精準的量測該超音波加工之刀具301的高頻震動量,對於超音波加工精度的保持技術中需要量測的儀器可以偵測超音波加工之刀具301經過一段時間後的高頻振動量之衰減,並可馬上調整以保持加工製程參數之穩定,而本創作之應用更能發展可線上量測超音波高頻之刀具301振動量的量測儀器並可延伸應用於刀具301刀長、刀尖與刀具301磨耗檢測,如第11、12圖所示,該雷射發射接收模組10與反射模組20之間的第一光束112能平行該主軸30的前後位移或左右位移,且該量測區段D1能大至該工作平台31的邊長間距或小至僅能讓主軸30通過的間距,藉此配合工具機款式自由組裝於最理想的量測位置,又該雷射發射接收模組10以雷射元件11與兩象限光位置感測器14連結電源,且該反射模組20為未接電結構,藉此能簡化配線需求,讓該雷射發射接收模組10與反射模組20具有更多的量測位置可選擇,具有簡便組裝與快速量測之功效,進而提高該雷射發射接收模組10與反射模組20組裝於工作平台31上之變化性。 Further, as shown in FIGS. 3, 4, 5, and 6, the two-quadrant light position sensor 14 is separated by a dividing line 141 to separate the first energy receiving region 142 from the second energy receiving region 143. 141 is a gap of about 20~30 μm, and the two-quad position optical position sensor 14 is obliquely mounted on the laser emitting and receiving module 10, and the projection between the dividing line 141 and the first beam 112 An acute angle (the angle θ 1 between thirty degrees and sixty degrees) is formed, so that the main axis 30 blocks the shadow edge of the first light beam 112 from completely overlapping the separation line 141, thereby overcoming the occurrence of the measurement. The reaction area is increased to improve the accuracy of the measurement, and the sampling frequency of the two-quadrant light position sensor 14 is 250 kHz, and 1250 points per revolution of the spindle 30 processing speed of 12000 rpm can be sampled, thereby dynamically analyzing the spindle 30 bias. The swinging amount does not need to slow down or stop the spindle 30, thereby effectively saving measurement time and increasing productivity, and the laser transmitting and receiving module 10 and the reflection module 20 are arranged under the same plane and the same straight line. Can be installed at any position of the working platform 31 and relatively different The measurement section D1, as shown in Figures 7, 8, and 9, is another embodiment of the creation. Since the ultrasonic processing technology will be widely applied to the processing of the aerospace industry and the processing of the mobile ceramic back shell, the future will be It is a market explosion point, and the laser emitting module 10 and the reflection module 20 are erected like the measuring spindle yaw amount, so that the tool 301 can shield the first beam from the top to the bottom. 112. At this time, the ultrasonic machining tool 301 will change the range of the first light beam 112 by the high frequency vibration frequency, and the first energy value measured by the two-quadrant light position sensor 14 is subtracted by the second energy. When the value obtains the differential energy, the high-frequency vibration amount of the ultrasonic machining tool 301 can be accurately measured. For the ultrasonic machining precision maintenance technology, the measuring instrument can detect the ultrasonic machining tool 301 after a period of time. The attenuation of the high-frequency vibration after the time can be adjusted immediately to maintain the stability of the processing parameters, and the application of the creation can further develop a measuring instrument capable of measuring the vibration amount of the ultrasonic 301 of the ultrasonic wave on the line and can be extended. Applied to tool 301 tool length, tool tip and tool 301 wear detection, as shown in Figures 11 and 12, the first beam 112 between the laser transmitting and receiving module 10 and the reflecting module 20 can be parallel to the spindle 30. The front-rear displacement or the left-right displacement, and the measuring section D1 can be as large as the side length of the working platform 31 or as small as the spacing through which the main shaft 30 can pass, thereby being freely assembled with the machine tool to optimally measure. Location, the mine The transmitting and receiving module 10 is connected to the power source by the laser element 11 and the two-quadrant position sensor 14 , and the reflection module 20 is an unpowered structure, thereby simplifying the wiring requirement, and the laser transmitting and receiving module 10 is provided. The measurement module 20 has more measurement positions, and has the functions of simple assembly and rapid measurement, thereby improving the variability of assembling the laser emission receiving module 10 and the reflection module 20 on the working platform 31.

本創作另一實施例,再請由第13圖連續至第16圖所示觀之,該雷射發射接收模組10處另裝設有一輔助雷射模組40,該輔助雷射模組40內部裝設有一第二雷射元件41、一第二分光鏡42、一第二波片43及一四象限光位置感測器44,且該第二分光鏡42設於第二雷射元件41與第二波片43之間,又該四象限光位置感測器44設於第二分光鏡42一側,又該主軸30上裝設有一第二反光鏡31,將該第二反射鏡31正對該輔助雷射模組40之第三光束401,並透過該第二反光鏡31反射該輔助雷射模組40 所發射的第三光束401,使該第三光束401反射由該第二分光鏡42折射至該四象限光位置感測器44,透過四象限光位置感測器44的四個等分能量區取得對應的差動能量,就能測得該主軸30如同投影於工作平台31的偏擺路徑,藉此測得主軸30於工作轉速下的軸向偏擺路徑,再比對該兩象現光位置感測器14與四象限光位置感測器44所測得的偏擺值,進一步計算該偏擺值達到誤差校正之目的,並增加該雷射發射接收模組10與該反射模組20所無法測得的偏擺方向。 Another embodiment of the present invention is further illustrated in FIG. 13 to FIG. 16. The laser transmitting and receiving module 10 is additionally provided with an auxiliary laser module 40, and the auxiliary laser module 40 is further disposed. A second laser element 41, a second beam splitter 42, a second wave plate 43 and a four-quadrant light position sensor 44 are disposed, and the second beam splitter 42 is disposed on the second laser element 41. The four-quadrant position sensor 44 is disposed on the side of the second beam splitter 42 and the second mirror 31 is mounted on the spindle 30. The second mirror 31 is mounted on the spindle 30. The auxiliary laser module 40 is reflected by the third light beam 401 of the auxiliary laser module 40 and transmitted through the second mirror 31 The emitted third light beam 401 causes the third light beam 401 to be reflected by the second beam splitter 42 to the four-quadrant light position sensor 44, and the four equal energy regions of the four-quadrant light position sensor 44 are transmitted. By obtaining the corresponding differential energy, the spindle 30 can be measured as the yaw path projected on the working platform 31, thereby measuring the axial yaw path of the spindle 30 at the working speed, and comparing the two images. The yaw value measured by the position sensor 14 and the four-quadrant light position sensor 44 further calculates the yaw value for error correction, and adds the laser emission receiving module 10 and the reflection module 20 Undetectable yaw direction.

綜上所述,本發明確實已達突破性之結構設計,而具有改良之發明內容,同時又能夠達到產業上之利用性與進步性,且本發明未見於任何刊物,亦具新穎性,當符合專利法相關法條之規定,爰依法提出發明專利申請,懇請 鈞局審查委員授予合法專利權,至為感禱。 In summary, the present invention has indeed achieved a breakthrough structural design, and has improved invention content, and at the same time, can achieve industrial utilization and progress, and the present invention is not found in any publication, but also novel, when In accordance with the provisions of the relevant laws and regulations of the Patent Law, the application for invention patents is filed according to law, and the examination authority of the bureau is required to grant legal patent rights.

唯以上所述者,僅為本發明之一較佳實施例而已,當不能以之限定本發明實施之範圍;即大凡依本發明申請專利範圍所作之均等變化與修飾,皆應仍屬本發明專利涵蓋之範圍內。 The above is only a preferred embodiment of the present invention, and the scope of the present invention is not limited thereto; that is, the equivalent variations and modifications made by the scope of the present invention should still belong to the present invention. Within the scope of the patent.

Claims (10)

一種工具機主軸與刀具偏擺與震動快速量測裝置,其包括有:一雷射發射接收模組,該雷射發射接收模組包括有一雷射元件、一分光鏡、一波片及一兩象限光位置感測器,該分光鏡設置於該波片與雷射元件之間,又該雷射元件朝向該分光鏡發射有一雷射光束,而該雷射光束穿過該分光鏡與該波片形成有一直線延伸的第一光束,另該兩象限光位置感測器設置於該分光鏡一側,且該兩象限光位置感測器由一分隔線間隔有一第一能量接收區與一第二能量接收區;以及一反射模組,該反射模組裝設有一反射鏡,且該反射模組與該雷射發射接收模組設置於同一直線上,並於該波片與該反射鏡之間形成有一可變距離的量測區段,讓該第一光束投射至該反射鏡而由入射方向反射至該波片與分光鏡,並以該分光鏡分光該第一光束形成有一第二光束,又該第二光束投射於該兩象限光位置感測器之第一能量接收區與第二能量接收區的等比例位置,使該兩象限光位置感測器產生的差動能量為零,藉此讓機上主軸或刀具以加工轉速置入該量測區段而對第一光束形成部分阻擋,獲得該第二光束射入第一能量接收區與第二能量接收區產生差動能量的變化值,俾以快速量測機上主軸或刀具之偏擺量。 The utility model relates to a tool machine main shaft and a tool yaw and vibration rapid measuring device, which comprises: a laser transmitting and receiving module, the laser transmitting and receiving module comprises a laser element, a beam splitter, a wave plate and one or two a quadrant light position sensor, the beam splitter being disposed between the wave plate and the laser element, wherein the laser element emits a laser beam toward the beam splitter, and the laser beam passes through the beam splitter and the wave The sheet is formed with a first light beam extending in a straight line, and the two quadrant light position sensors are disposed on one side of the beam splitter, and the two quadrant light position sensors are separated by a first line and have a first energy receiving area and a first a second energy receiving region; and a reflective module, the reflective module is assembled with a mirror, and the reflective module is disposed on the same line as the laser emitting and receiving module, and the wave plate and the mirror are Forming a variable distance measuring section, the first beam is projected to the mirror and reflected from the incident direction to the wave plate and the beam splitter, and the first beam is split by the beam splitter to form a second beam And the second beam cast The proportional position of the first energy receiving area and the second energy receiving area of the two-quadrant optical position sensor is such that the differential energy generated by the two-quadrant optical position sensor is zero, thereby allowing the on-board spindle or The tool is inserted into the measuring section at a processing speed to block the first beam forming portion, and obtains a variation value of the differential energy generated by the second beam entering the first energy receiving region and the second energy receiving region, The amount of deflection of the spindle or tool on the machine. 根據申請專利範圍第1項所述之工具機主軸與刀具偏擺與震動快速量測裝置,其中,該兩象限光位置感測器傾斜裝設於該雷射發射接收模組,令該分隔線與該第一光束之間的投影形成有一銳角。 The tool spindle and the tool yaw and vibration rapid measuring device according to the first aspect of the patent application, wherein the two-quadrant light position sensor is obliquely mounted on the laser transmitting and receiving module, so that the dividing line The projection between the first beam forms an acute angle. 根據申請專利範圍第1項所述之工具機主軸與刀具偏擺與震動快速量測裝置,其中,該雷射發射接收模組與該反射模組皆固定於一座體上,二 該座體讓雷射元件、分光鏡、波片、兩象限光位置感測器及反射鏡皆等高度,使該第一光束與第二光束皆位於該分光鏡、波片、兩象限光位置感測器及反射鏡的中央處。 According to the scope of claim 1, the spindle and the tool yaw and vibration rapid measuring device, wherein the laser emitting receiving module and the reflecting module are fixed on the body, The body allows the laser element, the beam splitter, the wave plate, the two-quadrant position sensor and the mirror to have the same height, so that the first beam and the second beam are located at the beam splitter, the wave plate and the two-quadrant light position. At the center of the sensor and mirror. 根據申請專利範圍第3項所述之工具機主軸與刀具偏擺與震動快速量測裝置,其中,該雷射發射接收模組與該反射模組之座體處皆蓋合有一殼體,二該殼體穿設有一提供該第一光束通過的穿孔,且該殼體於一側開設有一相通穿孔之通孔,而該通孔接通氣流能形成穿孔處的正壓微氣牆,藉此防止切削液及切屑物入侵形成干擾。 According to the third aspect of the patent application, the tool spindle and the tool yaw and vibration rapid measuring device, wherein the laser transmitting and receiving module and the reflector body are covered with a casing, The housing is provided with a through hole for providing the first light beam, and the housing has a through hole penetrating through the hole on one side, and the through hole is connected to the airflow to form a positive pressure micro gas wall at the perforation. Prevent the intrusion of cutting fluid and cuttings to form interference. 根據申請專利範圍第1項所述之工具機主軸與刀具偏擺與震動快速量測裝置,其中,該雷射發射接收模組處另裝設有一輔助雷射模組,該輔助雷射模組內部裝設有一第二雷射元件、一第二分光鏡、一第二波片及一四象限光位置感測器,且該第二分光鏡設於第二雷射元件與第二波片之間,又該四象限光位置感測器設於第二分光鏡一側,又該主軸上裝設有一第二反光鏡,並透過該第二反光鏡反射該輔助雷射模組所發射的第三光束。 According to the scope of claim 1, the spindle and the tool yaw and vibration rapid measuring device, wherein the laser transmitting and receiving module is additionally provided with an auxiliary laser module, the auxiliary laser module a second laser element, a second beam splitter, a second wave plate and a four-quadrant light position sensor are disposed therein, and the second beam splitter is disposed on the second laser element and the second wave plate And the four-quadrant position sensor is disposed on a side of the second beam splitter, and the second spindle is mounted on the spindle, and the second mirror is reflected by the second mirror to reflect the emitted by the auxiliary laser module. Three beams. 一種工具機主軸與刀具偏擺與震動快速量測方法,係為工具機主軸或刀具於加工轉速時的動態量測,藉此判斷該主軸的偏擺量與刀具之高頻震動量,其量測方法包括:a.將雷射發射接收模組裝設於該主軸或刀具對應的工作平台,該雷射發射接收模組內部裝設有一雷射元件、一分光鏡、一波片及一兩象限光位置感測器,且該分光鏡設於雷射元件與波片之間,又該兩象限光位置感測器設於分光鏡一側,且該兩象限光位置感測器形成有一第一能量接收 區與第二能量接收區;b.將反射模組裝設於該工作平台並與該雷射發射接收模組形成同一直線,該反射模組內部裝設有一反射鏡,且該反射鏡正對該波片形成有一量測區段;c.該雷射元件產生一雷射光束穿過該分光鏡與該波片,並由該波片轉換雷射光束為第一光束,且該第一光束射入反射鏡並沿射入方向反射回該波片與分光鏡;d.反射後之第一光束由分光鏡朝該兩象限光位置感測器方向形成有第二光束,該第二光束投射於該第一能量接收區產生一第一能量值,且該第二光束投射於該第二能量接收區產生一第二能量值;e.該主軸或刀具以加工轉速狀態位移進入該量測區段,並以主軸或刀具周緣對第一光束形成部分阻擋,讓第二光束投射至該兩象限光位置感測器而形成第一能量值與第二能量值的數值變化;以及f.透過第一能量值相減第二能量值取得差動能量,而該主軸的偏擺與刀具的高頻震動量會讓差動能量形成有變化值,即能於未減速或停機狀態判斷主軸之偏擺量與刀具之高頻震動量。 A tool machine spindle and tool yaw and vibration rapid measurement method is a dynamic measurement of a machine tool spindle or a tool at a processing speed, thereby determining the yaw amount of the spindle and the high frequency vibration amount of the tool, the amount thereof The measuring method comprises: a. assembling the laser transmitting receiving die to the working platform corresponding to the spindle or the tool, the laser emitting receiving module is internally provided with a laser component, a beam splitter, a wave plate and one or two a quadrant light position sensor, wherein the beam splitter is disposed between the laser element and the wave plate, and the two-quadrant light position sensor is disposed on a side of the beam splitter, and the two-quadrant light position sensor forms a first Energy reception And a second energy receiving area; b. the reflective mold is assembled on the working platform and forms a same line with the laser emitting and receiving module, the reflecting module is internally provided with a mirror, and the mirror is directly opposite The wave plate is formed with a measuring section; c. the laser beam generates a laser beam passing through the beam splitter and the wave plate, and the wave beam is converted into a first beam by the wave plate, and the first beam is Injecting into the mirror and reflecting back to the wave plate and the beam splitter in the incident direction; d. the reflected first light beam is formed by the beam splitter toward the two-quadrant light position sensor, and the second light beam is projected Generating a first energy value in the first energy receiving region, and the second light beam is projected into the second energy receiving region to generate a second energy value; e. the spindle or the tool is displaced into the measuring region at a processing speed state Segmenting, and partially blocking the first beam by the spindle or the tool circumference, causing the second beam to be projected to the two-quadrant light position sensor to form a numerical change of the first energy value and the second energy value; and f. An energy value is subtracted from the second energy value to obtain differential energy The amount, and the yaw of the spindle and the high-frequency vibration of the tool will cause the differential energy to have a change value, that is, the yaw amount of the spindle and the high-frequency vibration of the tool can be judged without deceleration or stop. 根據申請專利範圍第6項所述之工具機主軸與刀具偏擺與震動快速量測方法,其中更包括有以下步驟:g.該雷射發射接收模組處另裝設有一朝向該主軸發射第三光束之輔助雷射模組,該輔助雷射模組內部裝設有一第二雷射元件、一第二分光鏡、一第二波片及一四象限光位置感測器,且該第二分光鏡設於第二雷射元件與第二波片之間,又該四象限光位置感測器設於第二分光鏡一側;h.將主軸組裝有一第二反射鏡,並以該第 二反射鏡正對該輔助雷射模組之第三光束,使該第三光束反射由該第二分光鏡折射至該四象限光位置感測器,藉此測得主軸於工作轉速下的軸向偏擺路徑;i.比對該兩象現光位置感測器與四象限光位置感測器所測得的偏擺值,進一步計算該偏擺值達到誤差校正之目的。 According to the sixth aspect of the patent application scope, the tool spindle and the tool yaw and vibration rapid measurement method further include the following steps: g. the laser transmitting and receiving module is additionally provided with a heading toward the spindle. a three-beam auxiliary laser module, the auxiliary laser module is internally provided with a second laser component, a second beam splitter, a second wave plate and a four-quadrant light position sensor, and the second The beam splitter is disposed between the second laser element and the second wave plate, and the four-quadrant light position sensor is disposed on a side of the second beam splitter; h. the spindle is assembled with a second mirror, and the The second mirror is opposite to the third beam of the auxiliary laser module, and the third beam is reflected by the second beam splitter to the four-quadrant light position sensor, thereby measuring the axis of the spindle at the working speed To the yaw path; i. The yaw value measured by the two-image light position sensor and the four-quadrant light position sensor is further calculated to achieve the purpose of error correction. 根據申請專利範圍第6項所述之工具機主軸與刀具偏擺與震動快速量測方法,其中,該兩象限光位置感測器由一分隔線間隔該第一能量接收區與該第二能量接收區,又該兩象限光位置感測器呈傾斜狀裝設於該雷射發射接收模組,而該分隔線與該第一光束之間的投影形成有一銳角。 The tool spindle and tool yaw and vibration rapid measurement method according to claim 6, wherein the two-quadrant light position sensor is separated by the first energy receiving region and the second energy by a dividing line In the receiving area, the two-quadrant light position sensor is obliquely mounted on the laser emitting and receiving module, and the projection between the dividing line and the first light beam forms an acute angle. 根據申請專利範圍第6項所述之工具機主軸與刀具偏擺與震動快速量測方法,其中,該雷射發射接收模組與反射模組於符合設置於同一平面與同一直線的條件下,能裝設於工作平台的任意位置並相對形成不同的量測區段,又該雷射發射接收模組以雷射元件與兩象限光位置感測器連結電源,且該反射模組為未接電結構,進而提高該雷射發射接收模組與反射模組組裝於工作平台上之變化性。 According to the sixth aspect of the patent application scope, the tool spindle and the tool yaw and the vibration rapid measurement method, wherein the laser emission receiving module and the reflection module are arranged under the same plane and the same straight line, The laser transmitting and receiving module can be connected to the power source by the laser element and the two-quadrant light position sensor, and the reflective module is not connected. The electrical structure further improves the variability of the laser emitting and receiving module and the reflective module assembled on the working platform. 根據申請專利範圍第6項所述之工具機主軸與刀具偏擺與震動快速量測方法,其中,該雷射發射接收模組與該反射模組皆固定於一座體上,且該雷射發射接收模組與該反射模組之座體處皆蓋合有一殼體,二該殼體穿設有一提供該第一光束通過的穿孔,且該殼體於一側開設有一相通穿孔之通孔,而該通孔接通氣流能形成穿孔處的正壓微氣牆。 According to the sixth aspect of the patent application, the tool spindle and the tool yaw and vibration rapid measurement method, wherein the laser emission receiving module and the reflection module are both fixed on a body, and the laser emission The receiving module and the base of the reflective module are respectively covered with a casing, and the casing is provided with a through hole for providing the first light beam, and the casing has a through hole penetrating through the hole. The through hole is connected to the airflow to form a positive pressure micro gas wall at the perforation.
TW107101867A 2018-01-18 2018-01-18 Tool machine spindle and tool yaw and vibration rapid measuring device and method TWI644088B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW107101867A TWI644088B (en) 2018-01-18 2018-01-18 Tool machine spindle and tool yaw and vibration rapid measuring device and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW107101867A TWI644088B (en) 2018-01-18 2018-01-18 Tool machine spindle and tool yaw and vibration rapid measuring device and method

Publications (2)

Publication Number Publication Date
TWI644088B TWI644088B (en) 2018-12-11
TW201932810A true TW201932810A (en) 2019-08-16

Family

ID=65432024

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107101867A TWI644088B (en) 2018-01-18 2018-01-18 Tool machine spindle and tool yaw and vibration rapid measuring device and method

Country Status (1)

Country Link
TW (1) TWI644088B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI817138B (en) * 2020-06-18 2023-10-01 日商日立製作所股份有限公司 Machine status monitoring device and method

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI690693B (en) * 2018-12-25 2020-04-11 施俊名 Method of measuring ultrasonic vibration of a rotating object during processing and ultrasonic vibration measurement module
TWI694606B (en) * 2019-08-15 2020-05-21 國立臺北科技大學 Surface light generating device
CN114800038B (en) * 2021-01-29 2024-04-05 雷应科技股份有限公司 Tool detector
CN115302313B (en) * 2022-08-10 2024-12-06 嘉兴量创科技有限公司 A dynamic balancing test device with tool quick installation detection function

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4966460A (en) * 1987-10-28 1990-10-30 The Ingersoll Milling Machine Company Laser gauging of rotary cutting tools
TW517150B (en) * 2001-07-02 2003-01-11 Wenyuh Jywe A method to measure the spindle error by using a laser diode and a quadrant sensor
TW201129772A (en) * 2010-02-26 2011-09-01 Jian-Hong Liu Measurement system for knife tip and diameter of miniature knife tool
CN101799318B (en) * 2010-03-22 2011-11-09 电子科技大学 Laser homodyne vibration detection optical system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI817138B (en) * 2020-06-18 2023-10-01 日商日立製作所股份有限公司 Machine status monitoring device and method

Also Published As

Publication number Publication date
TWI644088B (en) 2018-12-11

Similar Documents

Publication Publication Date Title
TWI644088B (en) Tool machine spindle and tool yaw and vibration rapid measuring device and method
TWI632344B (en) An optical detecting apparatus for detecting a degree of freedom error of a shaft and a method thereof (2)
CN103433810B (en) Complicated curve surface normal vector on-machine detection device and method
US10712147B2 (en) Measurement system and method of manufacturing shaft with hole
JP6464216B2 (en) Non-contact type inner diameter measuring device
Ding et al. Evaluation and compensation of laser-based on-machine measurement for inclined and curved profiles
Kuschmierz et al. Optical, in situ, three-dimensional, absolute shape measurements in CNC metal working lathes
CN106425691A (en) Laser interference principle-based precise main shaft rotation precision detecting device and method
US20040125378A1 (en) Measurement device for non-contact detection of oscillations of an object
CN112566747A (en) Laser processing system and method for processing a workpiece using a laser beam
CN101701804B (en) collimated light beam detection device
CN211696271U (en) Device for measuring surface appearance of inner wall of cylindrical part based on non-diffraction light beams
KR102807714B1 (en) Laser interferometer system and method
WO2019169512A1 (en) Deviation and vibration quick measuring device and method for toolroom machine spindle and tool
CN206788358U (en) Laser scanning measurement instrument
CN118424701A (en) A machine tool spindle state detection device based on laser vibration measurement
JPS6255502A (en) Method of measuring shape of matter by three-dimensional measuring machine
CN103278475A (en) Measuring device and method of transparent medium refractive index
CN116046137A (en) Motor vibration measuring device and method based on optical interferometry
TWM545243U (en) Optical rotation axis multi-freedom degree error inspection device
JP4670700B2 (en) 3D shape measuring device
JPS62115315A (en) Laser displacement gauge
Hockaday Quantifying optical tip-timing probe error with laboratory apparatus
CN204359340U (en) With the measuring instrument of laser designator
CN207982932U (en) A kind of optical fiber tool setting device