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TW201939689A - 接合體之製造方法、臨時固定構件及積層體 - Google Patents

接合體之製造方法、臨時固定構件及積層體 Download PDF

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Publication number
TW201939689A
TW201939689A TW108105850A TW108105850A TW201939689A TW 201939689 A TW201939689 A TW 201939689A TW 108105850 A TW108105850 A TW 108105850A TW 108105850 A TW108105850 A TW 108105850A TW 201939689 A TW201939689 A TW 201939689A
Authority
TW
Taiwan
Prior art keywords
semiconductor element
temporary fixing
fixing member
anisotropic conductive
conductive member
Prior art date
Application number
TW108105850A
Other languages
English (en)
Chinese (zh)
Inventor
齋江俊之
山下広祐
堀田吉則
殿原浩二
黒岡俊次
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW201939689A publication Critical patent/TW201939689A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H10W72/019—
    • H10W72/941—
    • H10W72/963—
    • H10W72/967—
    • H10W80/211—
    • H10W80/312—
    • H10W80/327—

Landscapes

  • Wire Bonding (AREA)
TW108105850A 2018-02-23 2019-02-21 接合體之製造方法、臨時固定構件及積層體 TW201939689A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018030979 2018-02-23
JP2018-030979 2018-02-23
JP2018-082193 2018-04-23
JP2018082193 2018-04-23

Publications (1)

Publication Number Publication Date
TW201939689A true TW201939689A (zh) 2019-10-01

Family

ID=67688316

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108105850A TW201939689A (zh) 2018-02-23 2019-02-21 接合體之製造方法、臨時固定構件及積層體

Country Status (4)

Country Link
JP (1) JPWO2019163575A1 (ja)
CN (1) CN111615745A (ja)
TW (1) TW201939689A (ja)
WO (1) WO2019163575A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025109886A1 (ja) * 2023-11-20 2025-05-30 富士フイルム株式会社 接合体の製造方法
JP7649400B1 (ja) * 2024-03-28 2025-03-19 富士フイルム株式会社 異方導電性部材及び接合体
KR20250168187A (ko) * 2024-03-28 2025-12-02 후지필름 가부시키가이샤 이방 도전성 부재 및 접합체

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2854782B2 (ja) * 1993-05-12 1999-02-03 株式会社日立製作所 電子部品の固定方法、回路基板の製造方法及び回路基板
JP5110163B2 (ja) * 2008-07-17 2012-12-26 株式会社村田製作所 部品内蔵モジュールの製造方法
WO2014136241A1 (ja) * 2013-03-07 2014-09-12 東北マイクロテック株式会社 積層体及びその製造方法
JP2016035832A (ja) * 2014-08-01 2016-03-17 旭硝子株式会社 電子デバイスの製造方法、ガラス積層体の製造方法
JP6042956B1 (ja) * 2015-09-30 2016-12-14 オリジン電気株式会社 半田付け製品の製造方法

Also Published As

Publication number Publication date
WO2019163575A1 (ja) 2019-08-29
JPWO2019163575A1 (ja) 2021-01-14
CN111615745A (zh) 2020-09-01

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