TW201939654A - Equipment front end module (EFEM) which is easy to make an inert gas flow vertically in a conveyance chamber and difficult for dust to fly off - Google Patents
Equipment front end module (EFEM) which is easy to make an inert gas flow vertically in a conveyance chamber and difficult for dust to fly off Download PDFInfo
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Abstract
本發明係一種設備前端模組(EFEM),其課題為在搬送室內,成為容易垂直地流動非活性氣體,而作為不易揚起塵埃。 解決手段為EFEM係包含:構成搬送室於內部之框體(2),和在框體(2)內,為了構成FFU設置室(42)於搬送室的上方之支持板(37),和為了供給氮於FFU設置室(42)之供給管(47),和呈各被覆形成於支持板(37)之連通口(37a)地加以配置之3個風扇。供給管(47)係具有在FFU設置室(42)內加以分散配置之3個供給口(47a)。The present invention relates to an equipment front-end module (EFEM). The object of the invention is to make it easy to flow inert gas vertically in the conveying room, and to make it difficult to raise dust. The solution for the EFEM system includes: a frame body (2) constituting the inside of the transfer room, and a support plate (37) above the transfer room in the frame (2) to constitute the FFU, and A supply pipe (47) for supplying nitrogen to the FFU installation chamber (42), and three fans arranged to cover the communication port (37a) of the support plate (37). The supply pipe (47) has three supply ports (47a) which are dispersedly arranged in the FFU installation chamber (42).
Description
本發明係有關供給非活性氣體於閉鎖的搬送室,可置換為非活性氣體環境之EFEM(Equipment Front End Module)。The present invention relates to an EFEM (Equipment Front End Module) that supplies inert gas to a closed transfer room and can be replaced with an inert gas environment.
對於專利文獻1係對於包含:載置收容有晶圓(半導體基板)之FOUP(Front-Opening Unified Pod)的裝載埠,和由連接裝載埠於設置在前面壁的開口者而加以閉鎖,形成有進行晶圓的搬送之搬送室的框體;在對於晶圓施以特定處理之處理裝置與FOUP之間進行晶圓的授受之EFEM加以記載。In Patent Document 1, a loading port including a FOUP (Front-Opening Unified Pod) on which a wafer (semiconductor substrate) is housed, and a port connected to the opening provided on the front wall by the loading port are locked and formed, The frame of the transfer room where wafers are transferred; and the EFEM that records wafers between the processing equipment that applies a specific process to the wafers and the FOUP.
以往,對於在晶圓上所製造之半導體電路之搬送室內的氧或水分等的影響係為少,但近年,伴隨著半導體電路之更細微化,此等的影響則明顯化。因此,記載於專利文獻1之EFEM係以非活性氣體的氮填充搬送室內地加以構成。具體而言,EFEM係具有:以為了在框體的內部使氮循環之搬送室與氣體返還路徑所構成之循環流路,和供給氮於氣體返還路徑的上部空間之氣體供給手段,和配置於氣體返還路徑之上部空間,將非活性氣體送出於搬送室的複數之風扇,和自氣體返還路徑之下部,排出氮之氣體排出手段。氮係因應循環流路內的氧濃度等之變動而加以適宜供給及排出。經由此,可將搬送室內保持為氮環境氣者。 [先前技術文獻] [專利文獻]In the past, the influence on oxygen, moisture, and the like in the transport chamber of a semiconductor circuit manufactured on a wafer has been small, but in recent years, these effects have become more pronounced as the semiconductor circuits have become more refined. Therefore, the EFEM described in Patent Document 1 is configured by filling a transfer chamber with inert gas nitrogen. Specifically, EFEM has a circulation flow path formed by a transfer chamber and a gas return path for circulating nitrogen inside the housing, and a gas supply means for supplying nitrogen to the upper space of the gas return path, and is disposed in The upper space of the gas return path is a plurality of fans for sending inert gas out of the transfer chamber, and a gas exhaust means for discharging nitrogen from the lower part of the gas return path. Nitrogen is appropriately supplied and discharged in accordance with changes in the oxygen concentration in the circulation flow path. As a result, the transport room can be maintained as a nitrogen atmosphere. [Prior Art Literature] [Patent Literature]
[專利文獻1] 日本特開2015-146349號公報[Patent Document 1] Japanese Patent Laid-Open No. 2015-146349
[發明欲解決之課題][Questions to be Solved by the Invention]
但在記載於上述專利文獻1之EFEM中,係氣體供給手段連接於氣體返還路徑之上部空間,自其連接處,即1處之供給口加以供給非活性氣體之故,而在上部空間內,風扇的吸入側之壓力則於各風扇產生不均,對於自各風扇至搬送室的供給量產生不均。也就是,自複數的風扇之排列方向的一方側,加以供給非活性氣體的情況,對於一方的風扇係雖供給有充份量的非活性氣體,但對於另一方側的風扇之非活性氣體的供給量則比較於一方而變少。也就是在上部空間內,一方的風扇之吸入側的壓力則變為較另一方的風扇為大,而對於自各風扇至搬送室的非活性氣體的供給量產生不均。其結果,對於在搬送室的非活性氣體的氣流產生混亂,產生有容易揚起灰塵之問題。However, in the EFEM described in the aforementioned Patent Document 1, the gas supply means is connected to the upper space of the gas return path, and inactive gas is supplied from the connection point, that is, the supply port at one place, and in the upper space, The pressure on the suction side of the fan causes unevenness in each fan, and unevenness in the supply amount from each fan to the transfer chamber. That is, when an inert gas is supplied from one side of a plurality of fans in the arrangement direction, a sufficient amount of inert gas is supplied to one fan, but an inactive gas is supplied to the other fan. The amount is smaller than one. That is, in the upper space, the pressure on the suction side of one fan becomes larger than that of the other fan, and the supply amount of inert gas from each fan to the transfer chamber is uneven. As a result, the flow of the inert gas in the transfer chamber is disturbed, and there is a problem that dust is liable to be raised.
因此,在本發明之目的係提供:容易將非活性氣體垂直地流入至搬送室內,而可不易揚起灰塵之EFEM者。 [為了解決課題之手段]Therefore, an object of the present invention is to provide an EFEM that can easily flow inert gas vertically into a transfer chamber, and can easily raise dust. [Means for solving problems]
本發明之EFEM係具備:由連接裝載埠於設置在隔壁之開口者而加以閉鎖,將為了搬送基板之搬送室構成於內部的框體,和配置於前述搬送室內,進行前述基板之搬送的基板搬送裝置,和設置於前述框體內,為了構成上部空間於前述搬送室的上方之間隔構件,和為了供給非活性氣體於前述上部空間之非活性氣體之非活性氣體供給手段,和形成於前述間隔構件,使前述搬送室與前述上部空間連通之複數的連通口,和呈各被覆前述連通口地加以配置,藉由前述連通口而為了傳送前述上部空間的非活性氣體於前述搬送室的複數之送風器,和設置於前述搬送室的下部,吸引前述搬送室內之非活性氣體的氣體吸引口,和使自前述氣體吸引口所吸引之非活性氣體,返還至前述上部空間的氣體返還路徑,和為了排出前述搬送室內的氣體之氣體排出手段。並且,前述非活性氣體供給手段係具有:在前述上部空間內,加以分散配置,為了供給非活性氣體的複數之供給口。The EFEM of the present invention is provided with a substrate which is connected to a loading port at an opening provided in a neighboring wall and is locked, and a housing for conveying a substrate is formed inside the housing, and a substrate disposed in the conveying chamber and carrying the substrate is transferred. A conveying device, and a spacer member provided in the casing to form an upper space above the conveying chamber, an inert gas supply means for supplying an inert gas to the upper space, and an inert gas supply means, and formed in the space A plurality of communication openings that connect the transfer chamber and the upper space, and are arranged so as to cover the communication openings, and transmit the inactive gas in the upper space to the plurality of transfer chambers through the communication openings. A blower, and a gas suction port provided in a lower portion of the transfer chamber to attract the inert gas in the transfer chamber, and a gas return path for returning the inert gas attracted from the gas suction port to the upper space, and A gas exhausting means for exhausting the gas in the transfer chamber. The inert gas supply means includes a plurality of supply ports for dispersing the inert gas in the upper space to supply the inert gas.
當經由此時,成為可將自非活性氣體供給手段供給至上部空間的非活性氣體,自複數的供給口分散進行供給者。因此,成為可遍佈全體均勻供給非活性氣體於上部空間,而在上部空間之複數的送風器之吸入側的壓力不均變小。隨之,對於自各送風器至搬送室的非活性氣體之供給量,不易產生不均。其結果,在搬送室內,成為容易垂直地流動非活性氣體,而不易揚起塵埃。At this time, it becomes an inactive gas that can be supplied from the inactive gas supply means to the upper space, and is supplied from a plurality of supply ports. Therefore, the inert gas can be uniformly supplied to the upper space throughout the entirety, and the pressure unevenness on the suction side of the plurality of blowers in the upper space becomes small. Accordingly, unevenness in the supply amount of inert gas from each blower to the transfer chamber is unlikely to occur. As a result, it becomes easy to flow inert gas vertically in the transfer chamber, and it is difficult to raise dust.
在本發明中,前述供給口係在為了間隔前述上部空間與外部空間的前述框體之隔壁及前述間隔構件之任一中,呈朝向至前述供給口之距離最近的範圍,供給非活性氣體地加以構成者為佳。經由此,自供給口所供給之非活性氣體則接觸於間隔構件及隔壁之任一,其勢力則變弱之同時,沿著間隔構件及隔壁之任一而流動非活性氣體。因此,自氣體返還路徑流動至送風器的上部空間內之氣流則成為不易混亂,在上部空間的複數之送風器的吸入側之壓力不均則變更小。隨之,更抑制自各送風器至搬送室的非活性氣體之供給量不均。In the present invention, the supply port is provided between any one of the partition wall of the frame and the partition member for separating the upper space and the external space, and is provided in a range where the distance to the supply port is the shortest. It is better to make up. As a result, the inert gas supplied from the supply port is in contact with either the partition member or the partition wall, while its influence is weakened, the inert gas flows along either the partition member or the partition wall. Therefore, the airflow flowing from the gas return path into the upper space of the blower is less likely to be disturbed, and the pressure unevenness on the suction side of the plurality of blowers in the upper space is less changed. Accordingly, uneven supply of inert gas from each blower to the transfer chamber is further suppressed.
另外,本發明中,前述氣體吸引口係加以複數設置於前述搬送室的下部,而前述氣體返還路徑係具有:自各複數的前述氣體吸引口朝向於上方而延伸存在的複數之第1流路,和與前述複數之第1流路連接之第2流路,更具有為了將前述第2流路內的氣體送出於前述上部空間的送出口者為佳。經由此,來自搬送室的氣體則藉由複數之第1流路,暫時流動於第2流路之後,流動至上部空間。如此,由暫時將來自複數之第1流路的氣體流動至第2流路者,成為可吸收在複數之第1流路間的氣體之流通量不均者。因此,較自各第1流路,直接送出氣體於上部空間時,來自送出口之氣體的送出量則為安定,更抑制自各送風器至搬送室之非活性氣體的供給量不均。In addition, in the present invention, the gas suction ports are provided in a plurality at a lower portion of the transfer chamber, and the gas return path includes a plurality of first flow paths extending upward from each of the gas suction ports, The second flow path connected to the plurality of first flow paths preferably has a delivery port for sending the gas in the second flow path to the upper space. As a result, the gas from the transfer chamber temporarily flows through the second flow path through the plurality of first flow paths, and then flows into the upper space. In this way, the person who temporarily flows the gas from the plurality of first flow paths to the second flow path becomes the one who can absorb the uneven flow of the gas between the plurality of first flow paths. Therefore, when the gas is directly sent to the upper space from each of the first flow paths, the amount of gas sent from the outlet is stable, and the uneven supply of inactive gas from each blower to the transfer chamber is more suppressed.
另外,在本發明中,前述第2流路係沿著前述複數之第1流路的排列方向而延伸存在,而前述送出口係在該排列方向中,各配置於鄰接之2個前述第1流路間者為佳。經由此,自送出口至上部空間的氣體之送出量則更安定,更一層抑制自各送風器至搬送室的非活性氣體之供給量不均。In addition, in the present invention, the second flow path extends along the arrangement direction of the plurality of first flow paths, and the sending-out ports are arranged in the arrangement direction, each of which is adjacent to the two first passages. Those between the flow paths are better. As a result, the amount of gas sent from the outlet to the upper space is more stable, and the uneven supply of inactive gas from each blower to the transfer chamber is further suppressed.
另外,在本發明中,前述送出口係在與前述複數之送風器的排列方向交叉之交叉方向中,在與前述供給口之間,配置於夾持前述送風器的位置者為佳。經由此,自氣體返還路徑流動至送風器的上部空間內之氣流則變為不易混亂,更一層抑制自各送風器至搬送室的非活性氣體之供給量不均。Moreover, in this invention, it is preferable that the said sending-out port is arrange | positioned at the position which pinches | interposes the said blower among the crossing direction which intersects with the arrangement direction of the said plurality of blowers. As a result, the airflow flowing from the gas return path to the upper space of the blower becomes less prone to chaos, and the uneven supply of inactive gas from each blower to the transfer chamber is further suppressed.
另外,本發明之EFEM係在其他的觀點中,具備:由連接裝載埠於設置在隔壁之開口者而加以閉鎖,將為了搬送基板之搬送室構成於內部的框體,和設置於前述框體內,為了構成上部空間於前述搬送室的上方之間隔構件,形成於前述間隔構件,使前述搬送室與前述上部空間連通之複數的連通口,和設置於前述連通口,為了傳送前述上部空間的氣體於前述搬送室的複數之送風器,和設置於前述搬送室的下部,吸引該搬送室內之氣體的複數之氣體吸引口,和使自各前述氣體吸引口所吸引之氣體,返還至前述上部空間的氣體返還路徑。並且,前述氣體返還路徑係具備:自前述複數之氣體吸引口延伸存在之複數的第1流路,和連接於前述複數之第1流路而自前述第1流路,流入前述氣體之同時,將前述氣體送出至前述上部空間的第2流路。In addition, the EFEM of the present invention is, in another aspect, provided with a lock connected to a loading port at an opening provided in a neighboring wall, a housing configured to transfer a substrate for transferring a substrate, and a housing provided in the housing. In order to form a partition member having an upper space above the transfer chamber, a plurality of communication ports are formed on the partition member to communicate the transfer chamber and the upper space, and are provided in the communication port to transfer gas in the upper space. A plurality of air blowers in the transfer chamber, and a plurality of gas suction ports provided in the lower portion of the transfer chamber to attract the gas in the transfer chamber, and the gas sucked from each of the gas suction ports are returned to the upper space. Gas return path. The gas return path includes a plurality of first flow paths extending from the plurality of gas suction ports, and a plurality of first flow paths connected to the plurality of first flow paths to flow into the gas from the first flow path. The gas is sent to the second flow path in the upper space.
當經由此時,來自搬送室的氣體則藉由複數之第1流路,暫時流動於第2流路之後,流動至上部空間。如此,由暫時將來自複數之第1流路的氣體流動至第2流路者,成為可吸收在複數之第1流路間的氣體之流量不均者。因此,較自各第1流路,直接送出氣體於上部空間時,來自送出口之氣體的送出量則為安定,抑制自各送風器至搬送室之氣體的供給量不均。At this time, the gas from the transfer chamber temporarily flows through the second flow path through the plurality of first flow paths, and then flows into the upper space. In this way, the person who temporarily flows the gas from the plurality of first flow paths to the second flow path becomes the person who can absorb the uneven flow of the gas between the plurality of first flow paths. Therefore, when the gas is directly sent to the upper space from each of the first flow paths, the amount of gas sent from the outlet is stable, which suppresses uneven supply of gas from each blower to the transfer chamber.
另外,在本發明中,前述第2流路係延伸存在於與前述第1流路的延伸存在方向交叉之方向,而流動在前述氣體返還路徑的前述氣體係在自前述第1流路流動在前述第2流路時,變更其氣流的方向,且對於在自前述第2流路流入至前述上部空間時,亦變更該氣流的方向者為佳。經由此,在第2流路中,可作為緩和在第1流路的延伸存在方向的氣體的流動者。隨之,與自第1流路至上部空間,未變更氣流的方向而氣體直接流入至上部空間之情況作比較,可作為不易混亂上部空間內的氣流者。In the present invention, the second flow path system extends in a direction that intersects with the extending direction of the first flow path, and the gas system flowing in the gas return path flows from the first flow path in When the second flow path is used, the direction of the air flow is changed, and when the second flow path flows into the upper space, the direction of the air flow is also changed. As a result, in the second flow path, it is possible to serve as a flower that relaxes the gas in the direction in which the first flow path extends. Accordingly, compared with the case where the gas flows directly into the upper space without changing the direction of the air flow from the first flow path to the upper space, it can be used as a person who does not easily disturb the air flow in the upper space.
另外,在本發明中,具有:固定位置之基台部,和配置於前述基台部之上方,搬送前述基板之搬送部,更具備配置於前述搬送室內之基板搬送裝置,對於前述搬送室係配置有設置物於較經由前述搬送部而搬送基板之搬送範圍為下方,前述氣體吸引口係自垂直方向而視時,配置於未與前述基台部及前述設置物之任一重疊之位置亦可。 [發明效果]In addition, the present invention includes a base portion at a fixed position, and a transfer portion arranged above the base portion to transfer the substrate, and further includes a substrate transfer device arranged in the transfer chamber. The installation object is arranged below the transportation range of the substrate to be transported through the transportation unit. When the gas suction port is viewed from a vertical direction, it is also disposed at a position that does not overlap with any of the base portion and the installation object. can. [Inventive effect]
當經由本發明之EFEM時,成為可遍佈全體均勻供給非活性氣體於上部空間,而在上部空間之複數的送風器之吸入側的壓力不均變小。隨之,對於自各送風器至搬送室的非活性氣體之供給量,不易產生不均。其結果,在搬送室內,成為容易垂直地流動非活性氣體,而不易揚起塵埃。When passing through the EFEM of the present invention, the inert gas can be uniformly supplied to the upper space throughout the entirety, and the pressure unevenness on the suction side of the plurality of blowers in the upper space becomes small. Accordingly, unevenness in the supply amount of inert gas from each blower to the transfer chamber is unlikely to occur. As a result, it becomes easy to flow inert gas vertically in the transfer chamber, and it is difficult to raise dust.
以下,對於有關本發明之一實施形態的EFEM1,參照圖1~圖8同時,於以下加以說明。然而,說明的方便上,將圖1所示之方向作為前後左右方向。即,在本實施形態中,將排列有EFEM(Equipment Front End Module)1與基板處理裝置6之方向作為前後方向,而將EFEM1側作為前方,將基板處理裝置6側作為後方。另外,將與前後方向正交,排列複數之裝載埠4之方向作為左右方向。另外,與前後方向及左右方向的雙方正交之方向作為上下方向。Hereinafter, an EFEM 1 according to an embodiment of the present invention will be described below with reference to FIGS. 1 to 8. However, for convenience of explanation, the direction shown in FIG. 1 is taken as the front-back, left-right, and left-right directions. That is, in this embodiment, the direction in which the EFEM (Equipment Front End Module) 1 and the substrate processing apparatus 6 are arranged is taken as the front-back direction, the EFEM 1 side is taken as the front, and the substrate processing apparatus 6 is taken as the rear. In addition, a direction in which a plurality of loading ports 4 are orthogonal to the front-rear direction is arranged as the left-right direction. In addition, a direction orthogonal to both the front-rear direction and the left-right direction is taken as the vertical direction.
(EFEM及周邊的概略構成) 首先,對於EFEM1及其周邊的概略構成,使用圖1及圖2而加以說明。圖1係顯示有關本實施形態之EFEM1及其周邊的概略構成之平面圖。圖2係顯示EFEM1之電性構成的圖。如圖1所示,EFEM1係包括:框體2,和搬送機器手臂3(基板搬送裝置),和3個裝載埠4,和控制裝置5。對於EFEM1之後方係配置有對於晶圓W(基板)施以特定處裡之基板處理裝置6。EFEM1係經由配置於框體2內之搬送機器手臂3,在載置於裝載埠4之FOUP(Front-Opening Unified Pod)100與基板處理裝置6之間,進行晶圓W的授受。FOUP100係排列複數之晶圓W於上下方向而可收容之容器,而設置有開閉可能的蓋101於後端部(在前後方向之框體2側的端部)。FOUP100係例如,經由公知的OHT(天頂行走式無人搬送車:未圖示)而進行搬送。在OHT與裝載埠4之間,進行FOUP100之授受。(Schematic configuration of EFEM and its surroundings) First, the schematic configuration of EFEM1 and its surroundings will be described with reference to FIGS. 1 and 2. FIG. 1 is a plan view showing a schematic configuration of the EFEM 1 and its surroundings in this embodiment. FIG. 2 is a diagram showing the electrical configuration of EFEM1. As shown in FIG. 1, the EFEM1 system includes a frame body 2, a transfer robot arm 3 (substrate transfer device), three loading ports 4, and a control device 5. Subsequent to EFEM1, a substrate processing apparatus 6 for arranging a wafer W (substrate) in a specific place is arranged. The EFEM1 transmits and receives wafers W between a FOUP (Front-Opening Unified Pod) 100 and a substrate processing apparatus 6 placed in a loading port 4 through a transfer robot arm 3 disposed in a housing 2. The FOUP 100 is a container that can accommodate a plurality of wafers W in an up-down direction, and a lid 101 that can be opened and closed is provided at a rear end portion (an end portion on the frame 2 side in the front-rear direction). The FOUP100 is transported, for example, via a known OHT (Zenith walking unmanned transport vehicle: not shown). FOUP100 is granted between OHT and loading port 4.
框體2係為了連接3個裝載埠4與基板處理裝置6之構成。對於框體2之內部係形成有對於外部空間而言作為略密閉,為了將晶圓W未暴露於外氣而進行搬送的搬送室41。當EFEM1稼動時,搬送室41係以氮而加以填充。然而,在本實施形態中,搬送室41係以氮加以填充,但如為非活性氣體,亦可維持氮以外的構成(例如,氬等)。框體2係在呈氮循環在包含搬送室41之內部空間地加以構成(對於詳細係後述之)。另外,對於框體2之後端部係安裝有開閉可能的門2a,而搬送室41係隔著門2a而與基板處理裝置6連接。The housing 2 is configured to connect the three loading ports 4 and the substrate processing apparatus 6. The inside of the housing 2 is formed with a transfer chamber 41 that is slightly sealed from the outside space and is transferred so that the wafer W is not exposed to outside air. When the EFEM 1 is moved, the transfer chamber 41 is filled with nitrogen. However, in this embodiment, the transfer chamber 41 is filled with nitrogen, but if it is an inert gas, a structure other than nitrogen (for example, argon) may be maintained. The housing 2 is configured in a nitrogen cycle in an internal space including the transfer chamber 41 (the details will be described later). A door 2 a that can be opened and closed is attached to the rear end of the housing 2, and the transfer chamber 41 is connected to the substrate processing apparatus 6 with the door 2 a interposed therebetween.
搬送機器手臂3係配置於搬送室41內,進行晶圓W的搬送。搬送機器手臂3係具有:固定位置之基台部90(參照圖3),和配置於基台部90之上方,保持晶圓W而進行搬送的手臂機構70(搬送部,參照圖3),和機器手臂控制部11(參照圖2)。搬送機器手臂3係主要進行取出FOUP100內之晶圓W而交付至基板處理裝置6之動作,或接受經由基板處理裝置6所處理之晶圓W而返回至FOUP100之動作。The transfer robot arm 3 is arranged in the transfer chamber 41 and transfers the wafer W. The transfer robot arm 3 includes a base portion 90 (refer to FIG. 3) in a fixed position, and an arm mechanism 70 (transfer portion, see FIG. 3) disposed above the base portion 90 and holding the wafer W for transfer. And robot control unit 11 (see FIG. 2). The transfer robot arm 3 mainly performs an operation of taking out the wafer W in the FOUP 100 and delivering it to the substrate processing apparatus 6, or receiving a wafer W processed by the substrate processing apparatus 6 and returning to the FOUP 100.
裝載埠4係為了載置FOUP100(參照圖7)之構成。複數之裝載埠4係如圖1及圖5所示,沿著框體2之前側的隔壁33,排列配置於左右方向。各裝載埠4係各閉鎖在位於後端的空間51(參照圖7),形成於框體2之隔壁33的3個開口33a1(參照圖4)。經由此,於框體2內,搬送室41則構成為略密閉空間。另外,裝載埠4係可置換FOUP100內之環境氣為氮。對於裝載埠4之後端部係設置有後述之開閉機構54之一部分的門4a。門4a係經由門驅動機構55(開閉機構54之一部分)而加以開閉。門4a係可解除FOUP100的蓋101的鎖,且可保持蓋101地加以構成。在門4a保持解除鎖的蓋101之狀態,由門驅動機構55則開啟門4a者,開啟蓋101。經由此,FOUP100內之晶圓W則成為可經由搬送機器手臂3而取出。另外,成為可經由搬送機器手臂3而將晶圓W收納於FOUP100內。The loading port 4 is configured to mount a FOUP100 (see FIG. 7). As shown in FIG. 1 and FIG. 5, the plurality of loading ports 4 are arranged in the left-right direction along the partition wall 33 on the front side of the housing 2. Each loading port 4 is closed in a space 51 (see FIG. 7) located at the rear end, and three openings 33 a 1 (see FIG. 4) formed in the partition wall 33 of the housing 2. As a result, the transport chamber 41 is configured as a slightly closed space in the housing 2. In addition, loading port 4 can replace the ambient gas in FOUP100 with nitrogen. The rear end of the loading port 4 is provided with a door 4a which is a part of an opening and closing mechanism 54 described later. The door 4a is opened and closed via a door driving mechanism 55 (a part of the opening and closing mechanism 54). The door 4 a is configured to unlock the cover 101 of the FOUP 100 and to hold the cover 101. When the door 4a is kept in the unlocked state of the cover 101, the door driving mechanism 55 opens the door 4a to open the cover 101. As a result, the wafer W in the FOUP 100 can be taken out through the transfer robot arm 3. In addition, it becomes possible to store the wafer W in the FOUP 100 via the transfer robot arm 3.
如圖2所示,控制裝置5係與搬送機器手臂3之機器手臂控制部11,裝載埠4之裝載埠控制部12,基板處理裝置6之控制部(未圖示)加以電性連接,而進行與此等之控制部的通信。另外,控制裝置5係與設置於框體2內之氧濃度計85,壓力計86,濕度計87等加以電性連接,將此等之計測機器的計測結果進行收訊,把握有關框體2內之環境氣的資訊。另外,控制裝置5係與供給閥112及排出閥113(後述)加以電性連接,而由調節此等閥的開度者,適宜調節框體2內之氮環境氣。As shown in FIG. 2, the control device 5 is electrically connected to the robot arm control unit 11 of the transfer robot arm 3, the loading port control unit 12 of the loading port 4, and the control unit (not shown) of the substrate processing apparatus 6, and Communication with these control units is performed. In addition, the control device 5 is electrically connected to an oxygen concentration meter 85, a pressure gauge 86, a hygrometer 87, and the like installed in the casing 2, and receives the measurement results of these measuring devices to grasp the relevant casing 2 Information about the atmosphere inside. In addition, the control device 5 is electrically connected to a supply valve 112 and a discharge valve 113 (to be described later), and by adjusting the opening degree of these valves, it is appropriate to adjust the nitrogen ambient gas in the housing 2.
如圖1所示,基板處理裝置6係例如,具有加載互鎖真空室6a,和處理室6b。加載互鎖真空室6a係隔著框體2的門2a而與搬送室41加以連接,為了暫時使晶圓W待機的室。處理室6b係隔著門6c而與加載互鎖真空室6a加以連接。在處理室6b中,經由未圖示之處理機構,對於晶圓W施以特定的處理。As shown in FIG. 1, the substrate processing apparatus 6 includes, for example, a load-locking vacuum chamber 6 a and a processing chamber 6 b. The load-locking vacuum chamber 6a is a chamber which is connected to the transfer chamber 41 via the door 2a of the housing 2 to temporarily wait for the wafer W. The processing chamber 6b is connected to the load interlocking vacuum chamber 6a via a door 6c. In the processing chamber 6b, a specific process is performed on the wafer W via a processing mechanism (not shown).
(框體及其內部的構成) 接著,對於框體2及其內部的構成,使用圖3~圖6加以說明。圖3係自前方而視框體2時之正面圖。圖4係沿著圖3所示之IV-IV線的剖面圖。圖5係沿著圖3所示之V-V線的剖面圖。圖6係沿著圖3所示之VI-VI線的剖面圖。然而,在圖3及圖6中係省略隔壁的圖示。另外,在圖5中,省略搬送機器手臂3等之圖示,對於裝載埠4係以2點鎖鏈線而顯示。(Frame body and its internal structure) Next, the frame body 2 and its internal structure will be described using FIGS. 3 to 6. FIG. 3 is a front view when the frame 2 is viewed from the front. FIG. 4 is a cross-sectional view taken along the line IV-IV shown in FIG. 3. Fig. 5 is a sectional view taken along the line V-V shown in Fig. 3. FIG. 6 is a sectional view taken along the line VI-VI shown in FIG. 3. However, the illustration of the partition wall is omitted in FIGS. 3 and 6. In addition, in FIG. 5, illustrations of the transfer robot arm 3 and the like are omitted, and the loading port 4 is shown by a two-point chain link.
框體2係作為全體,具有略長方體形狀。如圖3~圖5所示,框體2係具有:柱21~26,和連結管27,和隔壁31~36。於延伸於上下方向的柱21~26,安裝有隔壁31~36,而框體2之內部空間(搬送室41及FFU設置室42)則對於外部空間而言略密閉地加以構成。The frame 2 has a slightly rectangular parallelepiped shape as a whole. As shown in FIGS. 3 to 5, the frame body 2 has columns 21 to 26, a connecting pipe 27, and partition walls 31 to 36. Partition walls 31 to 36 are attached to the columns 21 to 26 extending in the up-and-down direction, and the internal space of the housing 2 (the transfer room 41 and the FFU installation room 42) is configured to be slightly closed to the external space.
更具體而言,如圖4所示,在框體2之前端部中,柱21~24則自左方朝向右方相互隔離之同時依序加以配置。也就是,4支的柱21~24係沿著左右方向而加以排列。另外,柱21~24係如圖3所示,呈沿著上下方向地加以立設。柱21,24係由配置於下側的第1部分21b,24b,和配置於上側的第2部分21c,24c而加以構成。第1部分21b,24b係立設於隔壁31上,其上端則連接於連結管27。另外,柱22,23亦立設於隔壁31上,其上端則連接於連結管27。此等第1部分21b,24b及柱22,23係其上下方向的長度則成為略相同長度。第2部分21c,24c係在連結管27上,立設於沿著上下方向與第1部分21b,24b重疊之位置。對於框體2之後端部的左右兩側係2支的柱25,26則沿著上下方向加以立設配置。連結管27係延伸存在於左右方向(4支的柱21~24之排列方向),與4支的柱21~24相互加以連接。More specifically, as shown in FIG. 4, in the front end portion of the frame body 2, the columns 21 to 24 are sequentially arranged while being isolated from each other from the left to the right. That is, four columns 21 to 24 are arranged in the left-right direction. The columns 21 to 24 are erected in a vertical direction as shown in FIG. 3. The pillars 21 and 24 are constituted by first portions 21b and 24b arranged on the lower side and second portions 21c and 24c arranged on the upper side. The first portions 21b and 24b are erected on the partition wall 31, and the upper ends thereof are connected to the connecting pipe 27. In addition, the columns 22 and 23 are also erected on the partition wall 31, and the upper ends thereof are connected to the connecting pipe 27. The lengths of the first portions 21b, 24b and the columns 22, 23 in the vertical direction are almost the same. The second portions 21c and 24c are connected to the connecting pipe 27 and are erected at positions overlapping the first portions 21b and 24b in the up-down direction. Two columns 25 and 26 are attached to the left and right sides of the rear end of the frame body 2 in the up-and-down direction. The connecting pipe 27 extends in the left-right direction (the arrangement direction of the four columns 21 to 24), and is connected to the four columns 21 to 24.
如圖3所示,於框體2之底部配置有隔壁31,而於天頂部配置有隔壁32。如圖4所示,各於前端部配置有隔壁33,而於後端部配置有隔壁34,於左端部配置有隔壁35,於右端部配置有隔壁36。對於隔壁33係形成有前述之3個開口33a1。此等3個開口33a1係在左右方向中,配置於4個柱21~24間,而經由裝載埠4之基底51而加以閉鎖。對於框體2之右端部係設置有配置有後述之定位器84的載置部83(參照圖3)。定位器84及載置部83亦收容於框體2之內側(參照圖4)。As shown in FIG. 3, a partition wall 31 is disposed at the bottom of the frame 2, and a partition wall 32 is disposed at the top of the sky. As shown in FIG. 4, a partition wall 33 is disposed at each of the front end portions, a partition wall 34 is disposed at the rear end portion, a partition wall 35 is disposed at the left end portion, and a partition wall 36 is disposed at the right end portion. The partition wall 33 is formed with the aforementioned three openings 33a1. These three openings 33a1 are arranged between the four pillars 21 to 24 in the left-right direction, and are closed by the base 51 of the loading port 4. The right end portion of the housing 2 is provided with a mounting portion 83 (see FIG. 3) in which a positioner 84 to be described later is disposed. The positioner 84 and the mounting portion 83 are also housed inside the housing 2 (see FIG. 4).
如圖5所示,在框體2內之上側部分,對於連結管27之後端側係配置有延伸於水平方向之支持板37(間隔構件)。經由此,框體2之內部係分為前述之搬送室41,和形成於搬送室41之上方之FFU設置室42。也就是,經由支持板37,在框體2之內部空間中,於搬送室41之上方,構成有作為上部空間的FFU設置室42。As shown in FIG. 5, a support plate 37 (spacer member) extending in the horizontal direction is arranged on the upper end portion of the housing 2 at the rear end side of the connecting tube 27. As a result, the interior of the housing 2 is divided into the aforementioned transfer chamber 41 and the FFU installation chamber 42 formed above the transfer chamber 41. That is, an FFU installation chamber 42 as an upper space is formed in the internal space of the housing 2 above the transfer chamber 41 via the support plate 37.
對於FFU設置室42內係配置有後述之3個FFU(風扇過濾單元)44。在支持板37之前後方向的中央部,對向於與FFU44上下方向之位置,係形成有使搬送室41與FFU設置室42連通之3個連通口37a。此等3個連通口37a係如圖6所示,沿著左右方向加以排列配置。另外,3個連通口37a係在左右方向中,配置於4支的柱21~24間。然而,框體2之隔壁33~36係分為搬送室41用之下部壁與FFU設置室42用之上部壁(例如,參照在圖5之前端部的隔壁33a,33b及後端部之隔壁34a,34b)。各FFU44係在後述之搬送範圍200之氣流速度則呈成為期望的值而預先決定旋轉數。作為在搬送範圍200之氣流速度係不足1m/s,理想係0.1m/s~0.7m/s,而更理想係0.2m/s~0.6m/s,因應目標的值而決定各FFU之旋轉數。Three FFUs (fan filter units) 44 described later are arranged in the FFU installation room 42. In the central portion of the support plate 37 in the front-rear direction, three communication ports 37 a are formed so as to communicate with the FFU 44 in the up-and-down direction to communicate the transfer chamber 41 and the FFU installation chamber 42. These three communication ports 37a are arranged in the left-right direction as shown in FIG. In addition, the three communication ports 37a are arranged in the left-right direction between four columns 21 to 24. However, the partition walls 33 to 36 of the housing 2 are divided into a lower wall for the transfer chamber 41 and an upper wall for the FFU installation chamber 42 (for example, refer to the partition walls 33a, 33b at the ends before FIG. 5 and the partition at the rear ends). 34a, 34b). The airflow speed of each FFU44 system in a conveying range 200 described later takes a desired value, and the number of rotations is determined in advance. As the air velocity in the conveying range 200 is less than 1m / s, ideally 0.1m / s ~ 0.7m / s, and more preferably 0.2m / s ~ 0.6m / s, the rotation of each FFU is determined according to the target value. number.
接著,對於框體2之內部的構成加以說明。具體而言,對於為了在框體2內使氮循環之構成及其周邊構成,以及配置於搬送室41內之機器等加以說明。Next, the internal structure of the housing 2 will be described. Specifically, a configuration for circulating nitrogen in the housing 2 and its peripheral configuration, and equipment and the like arranged in the transfer chamber 41 will be described.
對於為了在框體2內使氮循環之構成及其周邊構成,使用圖3~圖6加以說明。如圖5所示,對於框體2之內部係形成有為了使氮循環之循環路徑40。循環路徑40係經由搬送室41,和FFU設置室42,和返還路徑43(氣體返還路徑)而加以構成。在循環路徑40中,自FFU設置室42,將清淨的氮通過各連通口37a而送出於下方,到達至搬送室41之下端部之後,成為通過返還路徑43而上升,呈返回於FFU設置室42(參照圖5之箭頭)。以下,詳細說明。The structure for circulating nitrogen in the housing 2 and the surrounding structure will be described with reference to FIGS. 3 to 6. As shown in FIG. 5, a circulation path 40 for circulating nitrogen is formed in the interior of the housing 2. The circulation path 40 is configured via a transfer chamber 41, an FFU installation chamber 42, and a return path 43 (gas return path). In the circulation path 40, clean nitrogen is sent from the FFU installation chamber 42 through the communication ports 37a, and reaches the lower end of the transfer chamber 41, then rises through the return path 43, and returns to the FFU installation chamber. 42 (see arrow in FIG. 5). The details are described below.
對於FFU設置室42係如圖5及圖6所示,設置有配置於支持板37上之3個FFU44,和配置於FFU44上之3個化學過濾器45。各FFU44係如圖5所示,具有風扇44a(送風器)與過濾器44b,作為呈被覆連通口37a而加以配置於支持板37上。FFU44係如由圖6中箭頭所示,經由風扇44a而將FFU設置室42內的氮,自FFU44之周圍吸入送出於下方之同時,經由過濾器44b而除去含於氮之灰塵(未圖示)。化學過濾器45係例如,為了除去自基板處理裝置6帶入於循環路徑40內之活性氣體等之構成。經由FFU44及化學過濾器45所清淨化的氮係自FFU設置室42,藉由形成於支持板37之連通口37a而送出於搬送室41。送出於搬送室41的氮係形成層流,流動於下方。As shown in FIGS. 5 and 6, the FFU installation chamber 42 is provided with three FFU 44 disposed on the support plate 37 and three chemical filters 45 disposed on the FFU 44. As shown in FIG. 5, each FFU 44 is provided with a fan 44 a (air blower) and a filter 44 b, and is disposed on the support plate 37 as a covering communication port 37 a. As indicated by the arrow in FIG. 6, the FFU 44 sucks nitrogen from the FFU installation chamber 42 through the fan 44 a and sends the nitrogen from below the FFU 44 while removing the nitrogen-containing dust (not shown) through the filter 44 b. ). The chemical filter 45 is configured, for example, to remove an active gas or the like introduced into the circulation path 40 from the substrate processing apparatus 6. The nitrogen system purified by the FFU 44 and the chemical filter 45 is sent from the FFU installation chamber 42 through the communication port 37 a formed in the support plate 37 to the transfer chamber 41. The nitrogen system sent out from the transfer chamber 41 forms a laminar flow and flows downward.
返還路徑43係形成於配置於框體2之前端部的柱21~24(在圖5中係柱23)及連結管27。柱21,24之第1部分21b,24b、柱22,23、及連結管27之內部係成為中空,而各形成有相互可流通氮的空間21a~24a,27a(參照圖4)。柱21,24之第1部分21b,24b係如圖4所示,左右方向的寬度則成為較柱22,23為大。也就是,空間21a,24a(第1流路)之平面尺寸(即、第1部分21b,24b之開口面積)則成為較空間22a,23a(柱22,23之開口面積)為大。另外,空間21a~24a(第1流路)係延伸存在於上下方向而加以形成,均自柱21~24的下端延伸存在至連結管27之位置。The return path 43 is formed by the columns 21 to 24 (the column 23 in FIG. 5) and the connecting pipe 27 arranged at the front end of the housing 2. The insides of the first portions 21b, 24b of the columns 21, 24, the columns 22, 23, and the connecting pipe 27 are hollow, and spaces 21a to 24a, 27a each forming a space through which nitrogen can flow are formed (see FIG. 4). The first portions 21b, 24b of the pillars 21, 24 are shown in FIG. 4, and the width in the left-right direction is larger than that of the pillars 22, 23. That is, the planar dimensions of the spaces 21a, 24a (the first flow paths) (that is, the opening areas of the first portions 21b, 24b) are larger than those of the spaces 22a, 23a (the opening areas of the columns 22, 23). In addition, the spaces 21a to 24a (first flow paths) are formed by extending in the up-down direction, and all extend from the lower ends of the columns 21 to 24 to the position of the connecting pipe 27.
連結管27係加以配置於框體2之前端部。連結管27之空間27a(第2流路)係延伸存在於左右方向。另外,對於連結管27之下面係如圖5及圖6所示,形成有為了使空間21a~24a與空間27a相互連通之連通口27b~27e。另外,對於連結管27之上面係如圖6所示,形成有朝向FFU設置室42(即,朝向上方)開口之3個送出口27f~27h。此等3個送出口27f~27h係在左右方向中,配置於4支柱21~24間,而相互於左右方向具有長尺之矩形平面形狀。另外,3個送出口27f~27h係配置於框體2之前端部。如此,連結管27係使自4個空間21a~24a流入的氮一旦合流之後,可自3個送出口27f~27h送出至FFU設置室42地加以構成。氮在自空間21a~24a流動於空間27a時,其氣流的方向則自上方變更為左右方向,且自空間27a,藉由送出口27f~27h而流入至FFU設置室42時,其氣流的方向則自左右方向而變更為上方。經由如此之空間21a~24a,27a而構成返還路徑43。另外,3個送出口27f~27h係配置於與FFU44沿著前後方向而重疊之位置。也就是,各對應連接於前後方向之送出口27f~27h與FFU44。並且,3個送出口27f~27h係長尺地形成於左右方向,具有比較大的開口面積。因此,自各送出口27f~27h送出至FFU設置室42之氣體的流動則變為緩和,而3個FFU44之吸入側(上方側)之壓力不均則變小。然而,自送出口27f~27h送出至FFU設置室42之氣體係如圖5所示,通過隔壁33與FFU44之間而流動於上方。The connecting pipe 27 is arranged at the front end of the frame body 2. The space 27a (second flow path) of the connection pipe 27 extends in the left-right direction. In addition, as shown in FIG. 5 and FIG. 6, the lower surface of the connection pipe 27 is formed with communication ports 27 b to 27 e for communicating the spaces 21 a to 24 a and the space 27 a with each other. In addition, as shown in FIG. 6, the upper surface of the connecting pipe 27 is formed with three delivery ports 27f to 27h that open toward the FFU installation chamber 42 (that is, upward). These three delivery ports 27f to 27h are arranged in the left-right direction between the four pillars 21 to 24, and have long rectangular flat shapes with respect to each other in the left-right direction. In addition, the three delivery ports 27f to 27h are arranged at the front end portion of the housing 2. In this way, the connecting pipe 27 is configured such that once the nitrogen flowing in from the four spaces 21a to 24a merges, the connecting pipe 27 can be sent to the FFU installation chamber 42 from the three sending ports 27f to 27h. When nitrogen flows from space 21a to 24a to space 27a, the direction of the airflow is changed from above to left and right, and from space 27a, it flows into the FFU installation chamber 42 through the outlets 27f to 27h. Then change from the left and right direction to the top. The return path 43 is constituted through such spaces 21a to 24a and 27a. The three delivery ports 27f to 27h are arranged at positions overlapping the FFU44 in the front-back direction. That is, each of the sending-out ports 27f to 27h and FFU44 connected to the front-rear direction is corresponding. In addition, the three delivery ports 27f to 27h are formed in the left-right direction with a long rule, and have a relatively large opening area. Therefore, the flow of the gas sent from each of the outlets 27f to 27h to the FFU installation chamber 42 becomes gentle, and the pressure unevenness on the suction side (upper side) of the three FFU 44 becomes smaller. However, as shown in FIG. 5, the gas system sent from the delivery outlets 27f to 27h to the FFU installation chamber 42 flows upward between the partition wall 33 and the FFU 44.
對於返還路徑43,參照圖5之同時更具體地加以說明。然而,對於圖5係顯示柱23,但對於其他的柱21,24之第1部分21b,24b及柱22亦為相同。對於柱23之下端部,係安裝有為了容易使搬送室41內的氮流入至返還路徑43(空間23a)之導入導管28。導入導管28係亦同樣地安裝於其他的柱21,22,24。然而,柱21,24係較柱23寬度寬地形成於左右方向之故,在所安裝之導入導管28中,亦寬度寬地加以形成,但除此以外係為同樣的構成。對於導入導管28係形成有開口28a,到達至搬送室41之下端部的氮則成為可流入至返還路徑43。也就是,開口28a係將搬送室41內的氮吸引至返還路徑43之氣體吸引口。另外,開口28a係朝向下方而加以構成。因此,成為可將自上方到達至隔壁31的氣體,未混亂來自上方之氣體的流動而平順地吸入者。更且,成為可將由開口28a吸入的氣體,對於上方未改變氣流方向而流動者。The return path 43 will be described more specifically with reference to FIG. 5. However, the column 23 is shown in FIG. 5, but the same is applied to the first portions 21 b and 24 b and the columns 22 of the other columns 21 and 24. An introduction duct 28 is installed at the lower end portion of the column 23 so that nitrogen in the transfer chamber 41 can easily flow into the return path 43 (space 23a). The introduction duct 28 is similarly attached to the other columns 21, 22, and 24. However, since the columns 21 and 24 are formed wider in the left-right direction than the columns 23, the width of the columns 21 and 24 is also formed in the introduction duct 28 attached thereto, but otherwise they have the same configuration. An opening 28 a is formed in the introduction duct 28, and nitrogen reaching the lower end portion of the transfer chamber 41 is allowed to flow into the return path 43. That is, the opening 28 a is a gas suction port that sucks nitrogen in the transfer chamber 41 to the return path 43. The opening 28a is configured to face downward. Therefore, it is possible to smoothly inhale the gas reaching from the upper side to the partition wall 31 without disturbing the flow of the gas from the upper side. Furthermore, it becomes a person who can inhale the gas inhaled through the opening 28a, and does not change the direction of a gas flow with respect to the upper side.
對於導入導管28之上部,係形成有越朝向下方越擴散於後方之擴大部28b。在導入導管28內,對於擴大部28b的下方係配置有風扇46。風扇46係經由未圖示之馬達而加以驅動,將到達至搬送室41之下端部的氮,吸入於返還路徑43(在圖5中係空間23a)而送出至上方,將氮返回至FFU設置室42。返回至FFU設置室42的氮係自化學過濾器45之上面吸入至FFU44側,經由此等FFU44或化學過濾器45而加以清淨化,再次藉由連通口37a而送出至搬送室41。由以上作為,氮則成為可循環在循環路徑40內。The upper portion of the introduction duct 28 is formed with an enlarged portion 28 b that diffuses to the rear as it goes downward. A fan 46 is disposed in the introduction duct 28 below the enlarged portion 28b. The fan 46 is driven by a motor (not shown), and the nitrogen reaching the lower end of the transfer chamber 41 is sucked into the return path 43 (system space 23a in FIG. 5) and sent upward, and returns the nitrogen to the FFU setting. Room 42. The nitrogen system returned to the FFU installation chamber 42 is sucked from the upper surface of the chemical filter 45 to the FFU 44 side, cleaned through the FFU 44 or the chemical filter 45, and sent out to the transfer chamber 41 through the communication port 37a again. From the above, nitrogen can be circulated in the circulation path 40.
另外,如圖3所示,對於FFU設置室42之後端上部(即,框體2之後端部),係配置有為了供給氮於FFU設置室42(循環路徑40)內之供給管47。供給管47係與連接於氮的供給源111之外部配管48加以連接。對於外部配管48之途中部位,係設置有可變更氮的每單位時間之供給量的供給閥112。經由此等供給管47,外部配管48,供給閥112及供給源111而加以構成非活性氣體供給手段。然而,非活性氣體供給線則設置於工場等之情況,係如連接該供給線與供給管47即可。因此,非活性氣體供給手段係僅自供給管47而加以構成亦可。In addition, as shown in FIG. 3, a supply pipe 47 is provided at the upper rear end of the FFU installation chamber 42 (that is, the rear end of the housing 2) to supply nitrogen in the FFU installation chamber 42 (circulation path 40). The supply pipe 47 is connected to an external pipe 48 connected to a nitrogen supply source 111. A supply valve 112 capable of changing the supply amount of nitrogen per unit time is provided in the middle of the external piping 48. The inactive gas supply means is configured by the supply pipe 47, the external pipe 48, the supply valve 112, and the supply source 111 through these. However, in the case where the inert gas supply line is installed in a factory or the like, the supply line and the supply pipe 47 may be connected. Therefore, the inert gas supply means may be configured only from the supply pipe 47.
供給管47係如圖3及圖6所示,沿著左右方向而延伸存在,而形成有3個供給口47a。3個供給口47a係沿著左右方向而相互隔離加以配置,而自供給管47供給氮於FFU設置室42內。此等3個供給口47a係如圖5及圖6所示,形成於供給管47之下端,而呈與支持板37之供給管47朝向對向於上下方向的範圍37b(即,至支持板37之供給口47a的距離為最近的範圍),加以供給氮地加以構成。另外,3個供給口47a係在左右方向,配置於與FFU44之中心相同之位置關係。經由此,3個供給口47a係在前後方向中,配置於在送出口27f~27h之間夾持風扇44a之位置。As shown in FIGS. 3 and 6, the supply pipe 47 extends in the left-right direction, and three supply ports 47 a are formed. The three supply ports 47 a are arranged to be separated from each other along the left-right direction, and nitrogen is supplied from the supply pipe 47 into the FFU installation chamber 42. These three supply ports 47a are formed at the lower end of the supply pipe 47 as shown in Figs. 5 and 6, and are in a range 37b (that is, to the support plate) facing the up and down direction of the supply pipe 47 of the support plate 37. The distance of the supply port 47a of 37 is the closest range), and it is configured to supply nitrogen. The three supply ports 47a are arranged in the same positional relationship with the center of the FFU 44 in the left-right direction. As a result, the three supply ports 47a are arranged in the front-rear direction at a position where the fan 44a is sandwiched between the delivery ports 27f to 27h.
當自如此之供給管47之3個供給口47a供給氮於FFU設置室42時,3個供給口47a則在FFU設置室42內加以分散配置之故,氮則平均供給至FFU設置室42全體。例如,自連接於框體2之右端部的外部配管48之1個供給口,直接供給氮於FFU設置室42內之情況,FFU設置室42之右方部分的壓力則上升。即,配置於最右方之FFU44之吸入側的壓力則成為較其他2個FFU44為大。如此,當於FFU44之吸入側的壓力產生大的不均時,對於自3個FFU44至搬送室41之氮的供給量容易產生不均。但在本實施形態中,係自相互隔離而配置於左右方向之3個供給口47a供給氮之故,3個FFU44之吸入側的壓力不均則變小。隨之,自3個FFU44至搬送室41之氮的供給量則安定,送出至搬送室41的氮則形成層流,流動至下方。When nitrogen is supplied from the three supply ports 47a of the supply pipe 47 to the FFU installation chamber 42, the three supply ports 47a are dispersedly arranged in the FFU installation chamber 42, and the nitrogen is evenly supplied to the entire FFU installation chamber 42. . For example, in a case where nitrogen is directly supplied into the FFU installation chamber 42 from one supply port of the external piping 48 connected to the right end of the housing 2, the pressure in the right portion of the FFU installation chamber 42 increases. That is, the pressure on the suction side of the FFU44 disposed on the far right side is greater than that of the other two FFU44. As described above, when a large unevenness occurs in the pressure on the suction side of the FFU 44, unevenness in the supply amount of nitrogen from the three FFUs 44 to the transfer chamber 41 is likely to occur. However, in this embodiment, because the nitrogen is supplied from three supply ports 47a which are arranged in the left-right direction and are isolated from each other, the pressure unevenness on the suction side of the three FFUs 44 becomes smaller. Accordingly, the supply amount of nitrogen from the three FFUs 44 to the transfer chamber 41 is stable, and the nitrogen sent to the transfer chamber 41 forms a laminar flow and flows downward.
另外,如圖5所示,對於裝載埠4之下端係連接有為了排出循環路徑40內的氣體的排出管49。然而,裝載埠4係如後述,收容有門驅動機構55之收容室60則藉由形成於基底51之縫隙51b而連通著(參照圖7)。並且,排出管49則連接於收容室60。排出管49係例如,連結於未圖示之排氣埠,而對於其途中部位係設置有可變更循環路徑40內之氣體的每單位時間之排出量的排出閥113。經由此等排出管49及排出閥113而加以構成氣體排出手段。As shown in FIG. 5, an exhaust pipe 49 for exhausting the gas in the circulation path 40 is connected to the lower end of the loading port 4. However, the loading port 4 is described later, and the storage chamber 60 in which the door driving mechanism 55 is stored is communicated through a slit 51b formed in the base 51 (see FIG. 7). The discharge pipe 49 is connected to the storage chamber 60. The exhaust pipe 49 is, for example, connected to an exhaust port (not shown), and an exhaust valve 113 is provided in the middle of the exhaust pipe to change the discharge amount per unit time of the gas in the circulation path 40. The exhaust pipe 49 and the exhaust valve 113 are configured as a gas exhausting means.
供給閥112及排出閥113係與控制裝置5電性連接(參照圖2)。經由此,成為可適宜供給及排出氮於循環路徑40之情況。例如,始動EFEM1時(例如,包含維護EFEM1之後開始始動時等),循環路徑40內之氧濃度上升之情況,自供給源111,藉由外部配管48及供給管47而將氮供給至循環路徑40,由藉由排出管49而排出循環路徑40及收容室60內之氣體(氣體:包含氮及氧等)者,可降低氧濃度。也就是,可將循環路徑40及收容室60內置換為氮環境氣者。然而,當使EFEM1稼動時,循環路徑40內的氧濃度上升之情況,亦由一時性地多供給氮於循環路徑40,藉由排出管49而與氮同時排出氧者,可降低氧濃度。例如,在使氮循環之形式的EFEM1中,係抑制自循環路徑40至外部之氮的漏出同時,為了確實地抑制自外部至循環路徑40之大氣的侵入,必須將循環路徑40內的壓力,較外部的壓力為稍微高地進行保持。具體而言係1Pa(G)~3000Pa(G)之範圍內,而理想為3Pa(G)~500Pa(G)、更理想為5Pa(G)~ 100Pa(G)。因此,控制裝置5係當循環路徑40內之壓力則自特定的範圍脫離時,由變更排出閥113的開度者而變更氮的排出流量,壓力則呈成為特定之目標壓力地進行調節。如此,依據氧濃度而調節氮的供給流量,再由依據壓力而調節氮的排出流量者,加以抑制氧濃度及壓力。在本實施形態中,呈成為10Pa(G)之差壓進行調整。The supply valve 112 and the discharge valve 113 are electrically connected to the control device 5 (see FIG. 2). This makes it possible to appropriately supply and discharge nitrogen into the circulation path 40. For example, when the EFEM1 is started (for example, when the EFEM1 is started after maintenance is started, etc.), the oxygen concentration in the circulation path 40 is increased. From the supply source 111, nitrogen is supplied to the circulation path through the external pipe 48 and the supply pipe 47. 40. By exhausting the gas (gas: containing nitrogen, oxygen, etc.) in the circulation path 40 and the storage chamber 60 through the exhaust pipe 49, the oxygen concentration can be reduced. That is, the inside of the circulation path 40 and the storage chamber 60 can be replaced with a nitrogen atmosphere. However, when the EFEM1 is moved, the oxygen concentration in the circulation path 40 rises, and more nitrogen is temporarily supplied to the circulation path 40. Those who discharge oxygen simultaneously with nitrogen through the discharge pipe 49 can reduce the oxygen concentration. For example, in EFEM1 in the form of a nitrogen cycle, the leakage of nitrogen from the circulation path 40 to the outside is suppressed, and in order to reliably suppress the invasion of the atmosphere from the outside to the circulation path 40, the pressure in the circulation path 40 must be reduced. The external pressure is maintained slightly higher. Specifically, it is in a range of 1 Pa (G) to 3000 Pa (G), and is preferably 3 Pa (G) to 500 Pa (G), and more preferably 5 Pa (G) to 100 Pa (G). Therefore, when the pressure in the circulation path 40 deviates from a specific range, the control device 5 adjusts the nitrogen discharge flow rate by changing the opening degree of the discharge valve 113, and the pressure is adjusted to a specific target pressure. In this way, the supply flow rate of nitrogen is adjusted according to the oxygen concentration, and the discharge flow rate of nitrogen is adjusted according to the pressure to suppress the oxygen concentration and pressure. In this embodiment, the pressure is adjusted to a differential pressure of 10 Pa (G).
接著,對於配置於搬送室41內的機器等,使用圖3及圖4而加以說明。如圖3及圖4所示,對於搬送室41內係配置有上述之搬送機器手臂3,和控制部收容箱81,和計測機器收容箱82,和定位器84。控制部收容箱81係例如,設置於搬送機器手臂3之基台部90(參照圖3)的左方,設置於較經由手臂機構70(參照圖3)而搬送晶圓W之搬送範圍200為下方。對於控制部收容箱81係收容有上述之機器手臂控制部11或裝載埠控制部12。計測機器收容箱82係例如,配置於基台部90之右方,配置於較手臂機構70之搬送範圍200為下方。對於計測機器收容箱82係成為可收容有上述之氧濃度計85,壓力計86,濕度計87等之計測機器(參照圖2)。控制部收容箱81及計測機器收容箱82則相當於本發明之設置物。上述之導入導管28(參照圖4)係配置於基台部90,控制部收容箱81,及計測機器收容箱82之前方。也就是,開口28a係自上下方向(垂直方向)而視時,配置於基台部90,控制部收容箱81,及計測機器收容箱82之任一均未重疊之位置(參照圖4,圖5)。Next, the equipment etc. arrange | positioned in the conveyance room 41 are demonstrated using FIG.3 and FIG.4. As shown in FIGS. 3 and 4, the above-mentioned transfer robot arm 3, a control unit storage box 81, a measurement equipment storage box 82, and a positioner 84 are arranged in the transfer room 41. The control unit storage box 81 is, for example, provided on the left side of the base portion 90 (see FIG. 3) of the transfer robot arm 3, and is provided in a transfer range 200 that is larger than the transfer range of the wafer W through the arm mechanism 70 (see FIG. 3). Below. The control unit storage box 81 stores the robot arm control unit 11 or the loading port control unit 12 described above. The measuring device storage box 82 is, for example, disposed on the right side of the base portion 90 and disposed below the transfer range 200 of the arm mechanism 70. The measuring device storage box 82 is a measuring device that can store the above-mentioned oxygen concentration meter 85, pressure gauge 86, hygrometer 87, and the like (see FIG. 2). The control unit storage box 81 and the measuring equipment storage box 82 correspond to the installation objects of the present invention. The above-mentioned introduction duct 28 (refer to FIG. 4) is disposed in front of the base portion 90, the control portion storage box 81, and the measurement equipment storage box 82. That is, the opening 28a is disposed at a position where none of the base portion 90, the control portion storage box 81, and the measurement equipment storage box 82 overlaps when viewed from the up-down direction (vertical direction) (see FIG. 4, FIG. 5).
定位器84係為了檢出保持於搬送機器手臂3之手臂機構70(參照圖3)之晶圓W的保持位置,自目標保持位置偏移多少之構成。例如,在經由上述之OHT(未圖示)所搬送之FOUP100(參照圖1)之內部中,晶圓W則有微妙移動之虞。因此,搬送機器手臂3係將自FOUP100取出之處理前的晶圓W,暫時載置於定位器84。定位器84係計測晶圓W經由搬送機器手臂3而保持在自目標保持位置偏移多少之位置,將計測結果送訊至機器手臂控制部11。機器手臂控制部11係依據上述計測結果,補正經由手臂機構70之保持位置,控制手臂機構70而使晶圓W保持在目標保持位置,搬送至基板處理裝置6之加載互鎖真空室6a。經由此,可正常地進行經由基板處理裝置6之晶圓W的處理。The positioner 84 is configured to detect how much the wafer W held by the arm mechanism 70 (see FIG. 3) of the transfer robot arm 3 is shifted from the target holding position. For example, in the inside of the FOUP 100 (refer to FIG. 1) transported via the above-mentioned OHT (not shown), the wafer W may move delicately. Therefore, the transfer robot arm 3 temporarily loads the wafer W before processing taken out from the FOUP 100 and places it on the positioner 84. The positioner 84 measures the position where the wafer W is shifted from the target holding position via the transfer robot arm 3 and sends the measurement result to the robot arm control unit 11. The robot arm control section 11 corrects the holding position of the arm mechanism 70 based on the above measurement results, controls the arm mechanism 70 to keep the wafer W at the target holding position, and transfers the wafer W to the load-locking vacuum chamber 6 a of the substrate processing apparatus 6. As a result, the processing of the wafer W through the substrate processing apparatus 6 can be performed normally.
(裝載埠之構成) 接著,對於裝載埠之構成,參照圖7及圖8之同時,於以下加以說明。圖7係顯示關閉門之狀態的裝載埠之側剖面圖。圖8係顯示開啟門之狀態的裝載埠之側剖面圖。然而,圖7及圖8係在拆除位置於載置台53之下方的外部蓋體4b(參照圖5)之狀態所描繪。(Configuration of Loading Port) Next, the configuration of the loading port will be described below with reference to FIGS. 7 and 8. Fig. 7 is a side sectional view of the loading port showing a state in which the door is closed. FIG. 8 is a side sectional view of the loading port showing a state where the door is opened. However, FIGS. 7 and 8 are depicted in the state of the external cover 4b (refer to FIG. 5) below the mounting table 53 in the removal position.
如圖7所示,裝載埠4係具有:沿著上下方向而立設之板狀的基底51,和自此基底51之上下方向的中央部分朝向前方而突出加以形成之水平基部52。對於水平基部52之上部係設置有為了載置FOUP100之載置台53。載置台53係在載置FOUP100之狀態,成為可經由載置台驅動部(未圖示)而移動於前後方向者。As shown in FIG. 7, the loading port 4 has a plate-shaped base 51 standing up and down, and a horizontal base 52 formed by protruding from a central portion of the base 51 in the up-down direction toward the front. A mounting table 53 for mounting the FOUP 100 is provided above the horizontal base 52. The mounting table 53 is a state in which the FOUP 100 is mounted, and is capable of being moved in the front-rear direction via a mounting table driving section (not shown).
基底51係構成自外部空間隔離搬送室41的隔壁33之一部分。基底51係自前方而視,具有於上下方向長尺之略矩形平面形狀。另外,基底51係於與所載置之FOUP100可對向於前後方向的位置,形成有窗部51a。另外,基底51係在上下方向中,於較水平基部52為下方位置,形成有延伸存在於後述之支持框體56可移動之上下方向的縫隙51b。縫隙51b係支持框體56則在貫通基底51之狀態,僅形成於可移動於上下之範圍,而左右方向的開口寬度則變小。因此,收容室60之灰塵則不易自縫隙51b侵入至搬送室41。The base 51 constitutes a part of the partition wall 33 which isolates the transfer chamber 41 from the external space. The base 51 is viewed from the front, and has a substantially rectangular planar shape with a length in the up-down direction. In addition, the base 51 is formed at a position facing the front-back direction with the placed FOUP 100, and a window portion 51a is formed. In addition, the base 51 is formed in the up and down direction, and the horizontal base portion 52 is a lower position, and a slit 51 b extending in the up and down direction of the support frame 56 that can be described later is formed. The slit 51b supporting frame 56 is formed in a state where it can move up and down while penetrating the base 51, and the width of the opening in the left-right direction is reduced. Therefore, it is difficult for the dust in the storage room 60 to enter the transfer room 41 from the slit 51b.
裝載埠4係具有可開閉FOUP100的蓋101之開閉機構54。開閉機構54係具有:可閉鎖窗部51a的門4a,和為了使門4a驅動的門驅動機構55。門4a係可閉鎖窗部51a地加以構成。另外,門4a係可解除FOUP100的蓋101的鎖,且可保持蓋101地加以構成。門驅動機構55係包含:為了支持門4a之支持框體56,和藉由滑件支持手段57而將支持框體56可移動於前後方向之可動部件58,和將此可動部件58,對於基底51而言可移動於上下方向地支持之滑軌59。The loading port 4 is an opening / closing mechanism 54 having a cover 101 capable of opening and closing the FOUP 100. The opening / closing mechanism 54 includes a door 4a capable of closing the window portion 51a, and a door driving mechanism 55 for driving the door 4a. The door 4a is configured to lock the window portion 51a. The door 4a is configured to unlock the cover 101 of the FOUP 100 and to hold the cover 101. The door driving mechanism 55 includes a support frame 56 for supporting the door 4a, and a movable member 58 that can move the support frame 56 in the front-rear direction by the slider support means 57. For 51, the slide rail 59 supported in the up-down direction can be moved.
支持框體56係支持門4a之後部下方的構成,而在朝向下方而延伸存在之後,通過設置於基底51之縫隙51b而朝向基底51之前方突出之略彎曲狀的板狀構件。並且,為了支持此支持框體56之滑件支持手段57,可動部件58及滑軌59係設置於基底51之前方。即,為了使門4a移動之驅動處則在框體2之外側,收容於設置於水平基部52之下方的收容室60。收容室60係由水平基部52,和自水平基部52朝向下方而延伸存在之略箱狀的蓋體61與基底51而加以圍繞所構成,作為略密閉狀態。The support frame 56 is a structure that supports the lower portion of the rear portion of the door 4a, and after extending downward, it is a slightly curved plate-like member that protrudes toward the front of the base 51 through the slit 51b provided in the base 51. In addition, in order to support the slider support means 57 of the support frame 56, the movable member 58 and the slide rail 59 are disposed in front of the base 51. That is, the driving place for moving the door 4a is outside the housing 2 and is accommodated in the accommodation chamber 60 provided below the horizontal base 52. The storage room 60 is formed by being surrounded by a horizontal base 52 and a slightly box-shaped cover 61 and a base 51 that extend downward from the horizontal base 52 and is in a slightly sealed state.
對於蓋體61之底壁61a係連接有上述之排出管49。也就是,連接收容室60與排出管49。在本實施形態中,在3個裝載埠4之任一中,均連接收容室60與排出管49。經由此,成為可藉由收容室60而自排出管49排出循環路徑40的氣體者。在自排出管49排出氣體時,存在於收容室60內的灰塵亦可與氣體同時進行排出者。另外,在收容室60內,對於底壁61a上係設置有與排出管49對向之風扇62。由如此,設置風扇62於收容室60內者,抑制灰塵之揚起同時,容易自收容室60排出氣體於排出管49者。假設,設置將搬送室41內的氣體,朝向收容室60而送出的風扇之情況,容易對於搬送室41內的氣流產生混亂,而容易揚起搬送室41內的灰塵,但在本實施形態中,於收容室60內配置有風扇62之故,可抑制揚起搬送室41內的灰塵之情況。The above-mentioned discharge pipe 49 is connected to the bottom wall 61a of the lid body 61. That is, the storage chamber 60 and the discharge pipe 49 are connected. In this embodiment, the storage chamber 60 and the discharge pipe 49 are connected to any of the three loading ports 4. As a result, it becomes possible to discharge the gas in the circulation path 40 from the discharge pipe 49 through the storage chamber 60. When the gas is discharged from the discharge pipe 49, the dust existing in the storage chamber 60 may be discharged simultaneously with the gas. In addition, a fan 62 facing the exhaust pipe 49 is provided on the bottom wall 61 a in the storage chamber 60. In this way, those who install the fan 62 in the storage chamber 60 can easily discharge the gas from the storage chamber 60 to the discharge pipe 49 while suppressing the rise of dust. Suppose that a fan is provided to send the gas in the transfer chamber 41 toward the storage chamber 60, and it is easy to disturb the air flow in the transfer chamber 41 and to easily raise the dust in the transfer chamber 41. However, in this embodiment, Because the fan 62 is arranged in the storage room 60, it is possible to suppress the situation where the dust in the transfer room 41 is raised.
接著,對於FOUP100的蓋101及門4a之開閉動作,於以下加以說明。首先,如圖7所示,在自基底51隔離之狀態,使載置台53朝向後方來移動,使載置於載置台53上之FOUP100,與蓋101和門4a接觸。此時,以開閉機構54的門4a,解除FOUP100的蓋101的鎖,且使蓋101保持。Next, the operation of opening and closing the cover 101 and the door 4a of the FOUP 100 will be described below. First, as shown in FIG. 7, in a state of being isolated from the base 51, the mounting table 53 is moved backward, and the FOUP 100 placed on the mounting table 53 is brought into contact with the cover 101 and the door 4 a. At this time, the door 4 a of the opening / closing mechanism 54 unlocks the cover 101 of the FOUP 100 and holds the cover 101.
接著,如圖8所示,使支持框體56朝向後方來移動。經由此,門4a及蓋101則移動於後方。由如此作為,FOUP100的蓋101開啟之同時,門4a則開啟,框體2之搬送室41與FOUP100則連通。Next, as shown in FIG. 8, the support frame 56 is moved backward. As a result, the door 4a and the cover 101 are moved to the rear. As a result, while the cover 101 of the FOUP 100 is opened, the door 4a is opened, and the transfer chamber 41 of the frame 2 and the FOUP 100 are communicated.
接著,如圖8所示,使支持框體56朝向下方來移動。經由此,門4a及蓋101則移動於下方。由如此作為,FOUP100則作為搬出入口而大開放,在FOUP100與EFEM1之間,可進行晶圓W之移動者。然而,關閉蓋101及門4a之情況係如進行與上述相反的動作即可。另外,裝載埠4之一連串的動作係經由裝載埠控制部12而加以控制。Next, as shown in FIG. 8, the support frame 56 is moved downward. As a result, the door 4a and the cover 101 move downward. As a result, the FOUP100 is widely opened as a loading and unloading entrance. Between FOUP100 and EFEM1, a wafer W can be moved. However, in the case of closing the cover 101 and the door 4a, the operation opposite to the above may be performed. A series of operations of the loading port 4 are controlled by the loading port control unit 12.
如以上所述,當經由本實施形態之EFEM1時,3個供給口47a則在FFU設置室42內加以分散配置之故,可平均地供給氮於FFU設置室42全體者。因此,在FFU設置室42之3個FFU44的風扇44a(送風器)之吸入側的壓力不均則變小。隨之,自各風扇44a至搬送室41之氮的供給量則安定,在搬送室41內,容易垂直地流動氮(氮則形成層流),成為不易揚起塵埃。As described above, when the EFEM 1 of this embodiment is adopted, the three supply ports 47a are dispersedly arranged in the FFU installation chamber 42, so that nitrogen can be evenly supplied to the entire FFU installation chamber 42. Therefore, the pressure unevenness on the suction side of the fans 44a (air blowers) of the three FFUs 44 in the FFU installation chamber 42 is reduced. Accordingly, the amount of nitrogen supplied from each fan 44a to the transfer chamber 41 is stabilized. In the transfer chamber 41, nitrogen tends to flow vertically (nitrogen forms a laminar flow), making it difficult to raise dust.
另外,排出管49則與各裝載埠4之收容室60加以連接,對於循環路徑40之外部的氣體排出則藉由複數之排出管49及複數的收容室60而加以進行。因此,與僅設置1個排出管49之情況作比較,可平均地排出在搬送室41內流動於下方之氣體者。經由此,在搬送室41對於氮所形成之層流的影響則變小。另外,在搬送室41中氮所形成之層流係至少形成在晶圓W之搬送範圍200及其上方即可。In addition, the exhaust pipe 49 is connected to the storage chambers 60 of each loading port 4, and the gas outside the circulation path 40 is exhausted by a plurality of discharge pipes 49 and a plurality of storage chambers 60. Therefore, as compared with the case where only one discharge pipe 49 is provided, the gas flowing downward in the transfer chamber 41 can be evenly discharged. As a result, the influence on the laminar flow formed by nitrogen in the transfer chamber 41 becomes smaller. In addition, the laminar flow formed by nitrogen in the transfer chamber 41 may be formed at least in the transfer range 200 of the wafer W and above.
另外,對於搬送室41係於較搬送範圍200為下方配置有控制部收容箱81及計測機器收容箱82(設置物),開口28a係自垂直方向而視時,設置於未與基台部90及設置物之任一重疊之位置亦可。In addition, the transfer room 41 is provided below the transfer range 200 with a control unit storage box 81 and a measuring device storage box 82 (an installation). When the opening 28 a is viewed from the vertical direction, the transfer room 41 is installed in a position not connected to the base portion 90. And any overlapping position of the installation is possible.
然而,本申請發明者係經由層流可視化之實驗,在搬送機器手臂3之上方,控制部收容箱81之上方,及計測機器收容箱82之上方的三處(參照圖3的點201、202、203)中,測定氣流速度,確認層流的形成狀態。在本實施形態中,在搬送範圍之氣流速度則呈成為0.3m/s而預先決定各FFU之旋轉數。其結果,確認到經由氣體衝突於搬送機器手臂3等,對於搬送範圍200之氣體的逆流係未有引起者。另外,即使使來自供給源111(參照圖3)之氮的供給量或風扇46(參照圖5)的旋轉數變化,亦確認到在上述之三處之間,氣體的流量差則成為不足30%者。也就是,即使設置設置物於搬送範圍200內,至少在搬送範圍200及其上方中,確認到形成有安定的層流者。However, the inventor of the present application conducted three experiments on the visualization of laminar flow, above the transfer robot arm 3, above the control unit storage box 81, and above the measurement machine storage box 82 (refer to points 201 and 202 in FIG. 3). 203), the airflow velocity was measured to confirm the formation state of laminar flow. In this embodiment, the air velocity in the conveying range is 0.3 m / s, and the number of rotations of each FFU is determined in advance. As a result, it was confirmed that there was no cause of backflow of the gas in the transfer range 200 through the gas collision with the transfer robot arm 3 and the like. In addition, even when the amount of nitrogen supplied from the supply source 111 (see FIG. 3) or the number of rotations of the fan 46 (see FIG. 5) was changed, it was confirmed that the difference in the flow rate of the gas between the three places was less than 30. %By. That is, even if the installation object is set in the conveyance range 200, at least in the conveyance range 200 and above, it is confirmed that a stable laminar flow is formed.
另外,供給口47a係呈朝向至支持板37之供給口47a的距離為最近之範圍37b而供給氮地加以構成。經由此,自供給口47a所供給的氮則首先接觸於支持板37之範圍37b,其態勢變弱之同時,沿著支持板37而流動。因此,自送出口27f~27h流動於FFU44之FFU設置室42內的氣流則不易混亂,在FFU設置室42之FFU44的吸入側之壓力不均則變小。隨之,加以抑制自各FFU44之風扇44a至搬送室41之氮的供給量的不均。In addition, the supply port 47a is configured to supply nitrogen so that the distance to the supply port 47a of the support plate 37 is the closest range 37b. As a result, the nitrogen supplied from the supply port 47a first contacts the range 37b of the support plate 37, and its state becomes weak while flowing along the support plate 37. Therefore, the air flow flowing from the outlets 27f to 27h in the FFU installation chamber 42 of the FFU 44 is not easily disturbed, and the pressure unevenness on the suction side of the FFU 44 in the FFU installation chamber 42 is reduced. Accordingly, variations in the amount of nitrogen supplied from the fan 44a of each FFU 44 to the transfer chamber 41 are suppressed.
作為變形例,供給口47a係呈朝向框體2之天頂部的隔壁32或後端部之隔壁34而供給氮地加以構成亦可。在此中,亦與前述同樣地,自供給口47a所供給的氮之氣勢變弱而流動,更抑制自各FFU44之風扇44a至搬送室41之氮的供給量之不均。As a modification, the supply port 47a may be configured to supply nitrogen toward the partition wall 32 or the partition wall 34 at the rear end portion of the casing 2 toward the ceiling. Here, too, as described above, the potential of the nitrogen supplied from the supply port 47 a becomes weak and flows, and the unevenness in the amount of nitrogen supplied from the fan 44 a of each FFU 44 to the transfer chamber 41 is further suppressed.
返還路徑43則由具有與4個空間21a~24a(第1流路)加以連接之空間27a(第2流路),於具有空間27a之連結管27,形成有送出口27f~27h者,來自搬送室41之氣體則藉由4個空間21a~24a,暫時流動於空間27a之後而流動至FFU設置室42。更詳細係如圖6所示,來自空間21a之空氣則通過空間27a而朝向於送出口27f,來自空間22a之空氣則通過空間27a而朝向於左右的送出口27f,27g,來自空間23a的空氣則通過空間27a而朝向於左右之送出口27g,27h,來自空間24a之空氣則通過空間27a而朝向於送出口27h流動。由如此,將來自4個空間21a~24a的氣體,暫時流動於空間27a者,呈為可吸收在4個空間21a~24a間之氣體的流通量不均者。在本實施形態中,空間21a,24a之開口面積則成為較空間22a,23a為大,而空間21a,24a則氣體的流通量變多,但在空間27a合流來自各空間21a~24a之氣體,自各送出口27f~27h送出至FFU設置室42。因此,較自各空間21a~24a直接送出氣體至FFU設置室42時,來自送出口27f~27h之氣體的送出量則為安定,亦加以抑制各風扇44a之吸入側的壓力不均,更抑制自各風扇44a至搬送室41之氮的供給量不均。The return path 43 is composed of a space 27a (second flow path) connected to the four spaces 21a to 24a (the first flow path), and a connection pipe 27 having the space 27a formed with a delivery port 27f to 27h. The gas in the transfer chamber 41 flows through the four spaces 21a to 24a, temporarily flows behind the space 27a, and then flows to the FFU installation chamber 42. As shown in more detail in FIG. 6, the air from space 21a passes through space 27a and faces the outlet 27f, and the air from space 22a passes through space 27a and faces the left and right outlets 27f and 27g. The air from space 23a Then, the space 27a is directed toward the left and right outlets 27g, 27h, and the air from the space 24a flows through the space 27a toward the outlet 27h. For this reason, those who temporarily flow the gas from the four spaces 21a to 24a to the space 27a are those who can absorb the uneven flow of the gas between the four spaces 21a to 24a. In this embodiment, the opening areas of the spaces 21a and 24a are larger than those of the spaces 22a and 23a, and the spaces 21a and 24a have a larger gas flow. However, the gases from the spaces 21a to 24a merge in the space 27a. The outlets 27f to 27h are sent to the FFU installation room 42. Therefore, compared with when the gas is directly sent from the spaces 21a to 24a to the FFU installation chamber 42, the amount of gas sent from the outlets 27f to 27h is stable, and the uneven pressure on the suction side of each fan 44a is also suppressed, and the pressure The amount of nitrogen supplied from the fan 44a to the transfer chamber 41 is uneven.
各送出口27f~27h係在左右方向中,各配置於鄰接之2個空間21a~24a間之故,即使對於來自鄰接之2個空間21a~24a之氣體的流通量有不均,來自送出口27f~ 27h之氣體的送出量則更為安定。因此,更一層加以抑制自風扇44a至搬送室41之氮的供給量不均。Each of the outlets 27f to 27h is arranged in the left and right directions between the two adjacent spaces 21a to 24a. Even if there is uneven flow of gas from the two adjacent spaces 21a to 24a, the outlets are from the outlet. 27f ~ 27h gas delivery is more stable. Therefore, unevenness in the amount of nitrogen supplied from the fan 44 a to the transfer chamber 41 is further reduced.
另外,各送出口27f~27h係在前後方向中,配置於在與供給口47a之間夾持風扇44a之位置。經由此,自返還路徑43流動至風扇44a之FFU設置室42內的氣流則不易混亂,更一層加以抑制自各風扇44a至搬送室41之氮的供給量不均。In addition, each of the sending-out ports 27f to 27h is located in the front-rear direction and is disposed at a position where the fan 44a is sandwiched between the sending-out port and the supplying port 47a. As a result, the airflow flowing from the return path 43 to the FFU installation chamber 42 of the fan 44a is not easily disturbed, and the uneven supply of nitrogen from each fan 44a to the transfer chamber 41 is suppressed.
以上,以對於本發明之最佳的實施形態加以說明過,但本發明並非限定於上述之實施形態者,只要在記載於申請專利範圍之範圍內,可作種種之變更者。在前述之實施形態中,形成於供給管47之3個供給口47a則在FFU設置室42中,加以分散配置,但於供給管47,2或4以上的供給口47a則在FFU設置室42中,加以分散配置亦可。另外,取代於供給管47,將多孔質管(例如,多孔石等)則配置於FFU設置室42亦可。在此,亦可將多孔質管的複數之供給口,加以分散配置於FFU設置室42,可得到與前述實施形態同樣的效果者。As mentioned above, although the best embodiment of this invention was demonstrated, this invention is not limited to the said embodiment, As long as it is described in the range of the patent application, various changes are possible. In the foregoing embodiment, the three supply ports 47a formed in the supply pipe 47 are dispersedly arranged in the FFU installation chamber 42, but the supply ports 47a, 2 or 4 or more in the supply pipe 47 are installed in the FFU installation chamber 42 It is also possible to disperse them. Alternatively, instead of the supply pipe 47, a porous pipe (for example, porous stone) may be arranged in the FFU installation chamber 42. Here, a plurality of supply ports of the porous tube may be dispersedly arranged in the FFU installation chamber 42, and the same effect as that of the above embodiment can be obtained.
另外,複數的供給口47a係配置於各FFU設置室42亦可。也就是,配置於框體2之前端部側亦可。另外,作為氣體吸引口之開口28a係配置於較搬送室41之下部為上方亦可。另外,返還路徑43係僅由作為第1流路之空間21a~24a而加以構成,而自各空間21a~24a直接送出氣體於FFU設置室42亦可。此情況,作為第1流路的空間為1~3或5以上亦可。另外,返還路徑43則具有作為第2流路之空間27a的情況,作為第1流路之空間則為2,3或5以上亦可。In addition, a plurality of supply ports 47a may be arranged in each FFU installation chamber 42. That is, it may be arranged on the front end side of the housing 2. The opening 28 a as the gas suction port may be disposed above the lower portion of the transfer chamber 41. In addition, the return path 43 is constituted only by the spaces 21a to 24a as the first flow path, and the gas may be directly sent from the spaces 21a to 24a to the FFU installation chamber 42. In this case, the space for the first flow path may be 1 to 3 or 5 or more. The return path 43 may have a space 27a as the second flow path, and the space as the first flow path may be 2, 3, or 5 or more.
另外,各送出口27f~27h則在左右方向中,未配置於鄰接之2個空間21a~24a間亦可。風扇44a(FFU44)係設置2或4以上亦可。此情況,連通口37a亦如與風扇44a作對應而形成於支持板37即可。In addition, each of the outlets 27f to 27h may not be arranged between the two adjacent spaces 21a to 24a in the left-right direction. The fan 44a (FFU44) may be provided by 2 or 4 or more. In this case, the communication port 37a may be formed in the support plate 37 in correspondence with the fan 44a.
另外,取代送出口27f~27h,而例如,作為將形成有多數的孔之穿孔金屬板(未圖示),設置於連結管27之上面全體等,改變氣體的流動亦可。In addition, instead of the outlets 27f to 27h, for example, a perforated metal plate (not shown) in which a large number of holes are formed may be provided on the entire upper surface of the connection pipe 27, etc., and the flow of the gas may be changed.
另外,形成於柱21~24及連結管27內部之空間21a~24a,27a則作成返還路徑43之構成,但並不限定於此。即,返還路徑43係經由其他的構件而形成亦可。In addition, the spaces 21a to 24a and 27a formed in the columns 21 to 24 and the connecting pipe 27 are configured as the return path 43, but they are not limited to this. That is, the return path 43 may be formed via another member.
1‧‧‧EFEM1‧‧‧EFEM
2‧‧‧框體2‧‧‧ frame
3‧‧‧搬送機器手臂(基板搬送裝置)3‧‧‧ transfer robot arm (substrate transfer device)
4‧‧‧裝載埠4‧‧‧ loading port
21a~24a‧‧‧空間(第1流路)21a ~ 24a‧‧‧space (first flow path)
27a‧‧‧空間(第2流路)27a‧‧‧space (second flow path)
27f~27h‧‧‧送出口27f ~ 27h‧‧‧Export
28a‧‧‧開口(氣體吸引口)28a‧‧‧opening (gas suction port)
33‧‧‧隔壁33‧‧‧ next door
33a1‧‧‧開口33a1‧‧‧ opening
37‧‧‧支持板37‧‧‧ support board
37a‧‧‧連通口37a‧‧‧Connect
37b‧‧‧範圍37b‧‧‧range
41‧‧‧搬送室41‧‧‧Transportation Room
42‧‧‧FFU設置室(上部空間)42‧‧‧FFU installation room (upper space)
43‧‧‧返還路徑(氣體返還路徑)43‧‧‧Return route (gas return route)
44a‧‧‧風扇(送風器)44a‧‧‧fan (air blower)
47‧‧‧供給管(非活性氣體供給手段)47‧‧‧ supply pipe (inactive gas supply means)
47a‧‧‧供給口47a‧‧‧ supply port
49‧‧‧排出管(氣體排出手段)49‧‧‧Exhaust pipe (gas exhaust means)
W‧‧‧晶圓(基板)W‧‧‧ Wafer (substrate)
圖1係顯示有關本發明之第一實施形態的EFEM及其周邊的概略構成的平面圖。 圖2係顯示圖1所示之EFEM之電性構成的圖。 圖3係自前方而視圖1所示之框體時之正面圖。 圖4係沿著圖3所示之IV-IV線的剖面圖。 圖5係沿著圖3所示之V-V線的剖面圖。 圖6係沿著圖3所示之VI-VI線的剖面圖。 圖7係顯示關閉門之狀態的裝載埠之側剖面圖。 圖8係顯示開啟門之狀態的裝載埠之側剖面圖。FIG. 1 is a plan view showing a schematic configuration of an EFEM and its surroundings according to a first embodiment of the present invention. FIG. 2 is a diagram showing the electrical configuration of the EFEM shown in FIG. 1. FIG. 3 is a front view when the frame shown in FIG. 1 is viewed from the front. FIG. 4 is a cross-sectional view taken along line IV-IV shown in FIG. 3. FIG. 5 is a cross-sectional view taken along the line V-V shown in FIG. 3. FIG. 6 is a sectional view taken along the line VI-VI shown in FIG. 3. FIG. 7 is a side sectional view of the loading port showing a state where the door is closed. FIG. 8 is a side sectional view of the loading port showing a state where the door is opened.
Claims (8)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018048470A JP7140960B2 (en) | 2018-03-15 | 2018-03-15 | EFEM |
| JP2018-048470 | 2018-03-15 |
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| Publication Number | Publication Date |
|---|---|
| TW201939654A true TW201939654A (en) | 2019-10-01 |
| TWI799449B TWI799449B (en) | 2023-04-21 |
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| TW107133738A TWI799449B (en) | 2018-03-15 | 2018-09-26 | Equipment Front-End Module (EFEM) |
| TW112110392A TWI821138B (en) | 2018-03-15 | 2018-09-26 | Equipment front-end module (EFEM) |
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| Application Number | Title | Priority Date | Filing Date |
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| TW112110392A TWI821138B (en) | 2018-03-15 | 2018-09-26 | Equipment front-end module (EFEM) |
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| JP (2) | JP7140960B2 (en) |
| KR (2) | KR102652346B1 (en) |
| CN (2) | CN110277338B (en) |
| TW (2) | TWI799449B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113436984A (en) * | 2020-03-23 | 2021-09-24 | 台湾积体电路制造股份有限公司 | Equipment interface system for semiconductor processing machine |
| TWI744834B (en) * | 2020-03-23 | 2021-11-01 | 台灣積體電路製造股份有限公司 | Factory interface system for semiconductor process tool |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113161272B (en) * | 2020-01-22 | 2025-02-28 | 迅得机械(东莞)有限公司 | Wafer Cassette Transfer Device |
| JP7795068B2 (en) * | 2021-04-28 | 2026-01-07 | シンフォニアテクノロジー株式会社 | EFEM |
| JP2023039295A (en) * | 2021-09-08 | 2023-03-20 | シンフォニアテクノロジー株式会社 | Efem |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5047863A (en) * | 1990-05-24 | 1991-09-10 | Polaroid Corporation | Defect correction apparatus for solid state imaging devices including inoperative pixel detection |
| JPH0441673A (en) * | 1990-06-06 | 1992-02-12 | Fujitsu Ltd | Vacuum device and leaking method therefor |
| JPH0462345A (en) * | 1990-06-29 | 1992-02-27 | Hitachi Ltd | Intake duct system in clean room |
| JP2600237Y2 (en) * | 1993-03-11 | 1999-10-04 | 日新電機株式会社 | Air lock room |
| JPH10318576A (en) * | 1997-05-21 | 1998-12-04 | Taisei Corp | Return air equipment and manufacturing equipment in which it is integrated |
| JP4552362B2 (en) * | 2000-06-14 | 2010-09-29 | シンフォニアテクノロジー株式会社 | Wafer transfer device |
| JP3300952B1 (en) * | 2001-03-27 | 2002-07-08 | 株式会社武藤電機 | Blow nozzle |
| JP3880343B2 (en) * | 2001-08-01 | 2007-02-14 | 株式会社ルネサステクノロジ | Load port, substrate processing apparatus, and atmosphere replacement method |
| US20090053021A1 (en) * | 2005-03-29 | 2009-02-26 | Norichika Yamagishi | Semiconductor manufacturing apparatus |
| JP4744175B2 (en) * | 2005-03-31 | 2011-08-10 | 東京エレクトロン株式会社 | Substrate processing equipment |
| JP4715383B2 (en) * | 2005-08-11 | 2011-07-06 | 村田機械株式会社 | Transport cart |
| JP5925474B2 (en) * | 2011-12-06 | 2016-05-25 | 株式会社日立ハイテクマニファクチャ&サービス | Wafer processing equipment |
| JP2014038888A (en) * | 2012-08-10 | 2014-02-27 | Hitachi High-Tech Control Systems Corp | Mini-environment device, and inner atmosphere replacement method of the same |
| JP6024980B2 (en) * | 2012-10-31 | 2016-11-16 | Tdk株式会社 | Load port unit and EFEM system |
| JP6403431B2 (en) * | 2013-06-28 | 2018-10-10 | 株式会社Kokusai Electric | Substrate processing apparatus, flow rate monitoring method, semiconductor device manufacturing method, and flow rate monitoring program |
| JP2015115517A (en) * | 2013-12-13 | 2015-06-22 | シンフォニアテクノロジー株式会社 | Wafer transport device and efem |
| JP6349750B2 (en) * | 2014-01-31 | 2018-07-04 | シンフォニアテクノロジー株式会社 | EFEM |
| JP6511858B2 (en) * | 2015-02-27 | 2019-05-15 | シンフォニアテクノロジー株式会社 | Transfer room |
| KR102413271B1 (en) * | 2015-11-02 | 2022-06-28 | 삼성전자주식회사 | Apparatus for transferring substrate |
| JP6555091B2 (en) * | 2015-11-10 | 2019-08-07 | シンフォニアテクノロジー株式会社 | Robot transfer device |
| JP6679906B2 (en) * | 2015-12-11 | 2020-04-15 | Tdk株式会社 | EFEM |
| JP6501076B2 (en) * | 2016-03-07 | 2019-04-17 | トヨタ自動車株式会社 | Air purification system |
| JP6674869B2 (en) * | 2016-08-30 | 2020-04-01 | 株式会社日立ハイテクマニファクチャ&サービス | Wafer transfer device |
-
2018
- 2018-03-15 JP JP2018048470A patent/JP7140960B2/en active Active
- 2018-09-26 TW TW107133738A patent/TWI799449B/en active
- 2018-09-26 TW TW112110392A patent/TWI821138B/en active
-
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- 2019-02-25 CN CN201910137404.8A patent/CN110277338B/en active Active
- 2019-02-25 CN CN202410172505.XA patent/CN118073256A/en active Pending
- 2019-02-26 KR KR1020190022296A patent/KR102652346B1/en active Active
-
2022
- 2022-08-23 JP JP2022132184A patent/JP7417023B2/en active Active
-
2024
- 2024-03-25 KR KR1020240040343A patent/KR102885184B1/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113436984A (en) * | 2020-03-23 | 2021-09-24 | 台湾积体电路制造股份有限公司 | Equipment interface system for semiconductor processing machine |
| TWI744834B (en) * | 2020-03-23 | 2021-11-01 | 台灣積體電路製造股份有限公司 | Factory interface system for semiconductor process tool |
| CN113436984B (en) * | 2020-03-23 | 2024-12-06 | 台湾积体电路制造股份有限公司 | Equipment interface system for semiconductor process tools |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240041902A (en) | 2024-04-01 |
| CN110277338A (en) | 2019-09-24 |
| JP7417023B2 (en) | 2024-01-18 |
| TWI821138B (en) | 2023-11-01 |
| CN110277338B (en) | 2024-02-27 |
| JP2022162003A (en) | 2022-10-21 |
| KR102885184B1 (en) | 2025-11-17 |
| CN118073256A (en) | 2024-05-24 |
| TW202331911A (en) | 2023-08-01 |
| TWI799449B (en) | 2023-04-21 |
| JP2019161120A (en) | 2019-09-19 |
| JP7140960B2 (en) | 2022-09-22 |
| KR20190109246A (en) | 2019-09-25 |
| KR102652346B1 (en) | 2024-03-29 |
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