TW201938732A - Adhesive tape for semiconductor protection which is capable of appropriately filling an uneven surface and has a small amount of solvent - Google Patents

Abstract

The present invention provides an adhesive tape for semiconductor protection, which is capable of appropriately filling an uneven surface and has a small amount of solvent. The adhesive tape for semiconductor protection of the present invention includes: a substrate; an adhesive layer disposed on at least one side of the substrate; and an intermediate layer disposed between the substrate and the adhesive layer. The adhesive layer includes an active energy ray-curable adhesive containing a (meth) acrylic polymer. The thickness of the adhesive layer is 1 [mu]m to 50 [mu]m. The intermediate layer includes a UV-polymerized (meth) acrylic polymer. The thickness of the intermediate layer is 50 [mu]m to 1000 [mu]m. Moreover, the substrate includes thermal plastic resin.

Description

Adhesive tape for semiconductor protection

The invention relates to an adhesive tape for semiconductor protection.

Previously, when processing a semiconductor wafer, in the back grinding step of grinding the back of the semiconductor wafer to a desired thickness, an adhesive tape (back grinding) was used to secure the semiconductor wafer or protect the surface opposite to the grinding surface. Tape) (for example, Patent Document 1). Generally, the back-grinding tape includes a substrate and an adhesive layer. This type of back-grinding tape is used by attaching the adhesive layer side to the surface of the semiconductor wafer (the surface opposite to the grinding surface of the wafer) and peeling off after grinding the back surface of the semiconductor wafer.

As such a semiconductor wafer, a semiconductor wafer having bumps as electrodes on its surface is known. For the backside grinding tape used for such semiconductor wafers, it is also required to be able to perform well on the basis of the previous requirements for wafers that have moderate rigidity and can prevent the backside grinding step from cracking, and achieve backside grinding with good thickness accuracy. Covers the bump surface to prevent moisture intrusion during back grinding. As a method of filling the unevenness caused by the bumps and covering the bump surface well, a method of increasing the thickness of the adhesive layer can be mentioned. However, if the adhesive layer of the back grinding belt previously formed is thickened, the influence of the residual solvent in the adhesive layer becomes large, which causes problems in the health of the operator who handles the back grinding belt.
[Prior technical literature]
[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2011-151163

[Problems to be solved by the invention]

An object of the present invention is to provide an adhesive tape for semiconductor protection capable of satisfactorily burying uneven surfaces and having a small solvent content.
[Technical means to solve the problem]

The adhesive tape for semiconductor protection of the present invention includes a substrate, an adhesive layer disposed on at least one side of the substrate, and an intermediate layer disposed between the substrate and the adhesive layer. The adhesive layer includes: (Meth) acrylic polymer active energy ray hardening type adhesive, the thickness of the adhesive layer is 1 μm to 50 μm, the intermediate layer contains UV polymerized (meth) acrylic polymer, and the thickness of the intermediate layer It is 50 μm to 1000 μm.
In one embodiment, when the adhesive tape for semiconductor protection is left in air at 150 ° C for 1 hour, the first organic solvent, the second organic solvent, or the third organic solvent derived from the organic solvent prevention rule of the Labor Safety and Health Law. The total outgassing of organic solvents is below 25 ppm.
In one embodiment, when the load value is measured by thermomechanical analysis (TMA) and the penetration depth is set to 20% of the adhesive layer, and a 0.5 mm diameter probe is pressed into the adhesive layer, the measurement is started from the measurement start. The amount of change in load (μN / (mm ² · second)) after 1 second to 300 seconds is 1900 (μN / (mm ² · second)) or less.
In one embodiment, the substrate includes a thermoplastic resin.
In one embodiment, the substrate includes a polyester resin.
[Effect of the invention]

According to the present invention, it is possible to provide an adhesive tape for semiconductor protection capable of satisfactorily burying uneven surfaces and having a small solvent content.

A. Overview of an adhesive tape for semiconductor protection <br/> FIG. 1 is a schematic cross-sectional view of an adhesive tape for semiconductor protection according to an embodiment of the present invention. The semiconductor protection adhesive tape 100 according to this embodiment includes a substrate 10, an adhesive layer 30 disposed on at least one side of the substrate 10, and an intermediate layer 20 disposed between the substrate 10 and the adhesive layer 30. Although not shown, the adhesive tape for semiconductor protection of the present invention can protect the adhesive surface, and a release liner is provided on the outer side of the adhesive layer during the period until use.

The intermediate layer included in the adhesive tape for semiconductor protection of the present invention contains a UV polymerized (meth) acrylic polymer. In the present specification, "UV polymerized (meth) acrylic polymer" means that a monomer composition containing a (meth) acrylic monomer and a photopolymerization initiator without using a solvent is polymerized by irradiation with ultraviolet rays. And the polymer obtained. In the adhesive tape for semiconductor protection of the present invention, an uneven layer can be well buried by having an adhesive layer and an intermediate layer as layers having flexibility, and on the other hand, a portion of the layer having flexibility is The intermediate layer containing a UV polymerized (meth) acrylic polymer has the advantages of less solvent content and less outgassing. Furthermore, by making the intermediate layer containing a UV polymerized (meth) acrylic polymer, it is possible to form the intermediate layer having a thickness in a single layer (that is, it is not necessary to perform overcoating when a thick layer is formed by solution coating). ). As a result, an adhesive tape for semiconductor protection with very little warpage can be obtained.

When the adhesive tape for semiconductor protection of the present invention is left in the air at 150 ° C for 1 hour, the first organic solvent, the second organic solvent, or the third organic solvent derived from the organic solvent prevention rule of the Labor Safety and Health Law. The total amount of outgassing is preferably 25 ppm or less. As described above, by including an intermediate layer including a UV polymerized (meth) acrylic polymer, it is possible to obtain such an adhesive tape having a small outgassing amount. The total amount of outgassing is preferably 20 ppm or less, and more preferably 15 ppm or less. The lower the total amount of outgassing, the better, and the lower limit is, for example, 0.5 ppm (preferably 0.1 ppm, more preferably 0 ppm).

Specific examples of the first organic solvent include chloroform, carbon tetrachloride, 1,2-dichloroethane, 1,2-dichloroethylene, and 1,1,2,2-tetrachloroethane. , Trichloroethane, carbon disulfide, etc. Specific examples of the second organic solvent include acetone, isobutanol, isopropanol, isoamyl alcohol, ethanol, ethylene glycol monoethyl ether, ethylene glycol monoethyl ether acetate, and ethylene glycol mono-n-butyl alcohol. Butyl ether, ethylene glycol monomethyl ether, o-dichlorobenzene, xylene, cresol, chlorobenzene, isobutyl acetate, isopropyl acetate, isoamyl acetate, ethyl acetate, n-butyl acetate, n-acetate Propyl ester, n-pentyl acetate, methyl acetate, cyclohexanol, cyclohexanone, 1,4-dioxane, dichloromethane, N, N-dimethylformamide, styrene, tetrachloroethylene, Tetrahydrofuran, 1,1,1-trichloroethane, toluene, n-hexane, 1-butanol, 2-butanol, methanol, methyl isobutyl ketone, methyl ethyl ketone, methyl cyclohexanol, methyl Cyclohexanone, methyl-n-butanone, and the like. Specific examples of the third organic solvent include gasoline, coal tar naphtha (including solvent naphtha), petroleum ether, petroleum naphtha, petroleum volatile oil, turpentine, and mineral spirits. In one embodiment, when the adhesive tape for semiconductor protection is left in the air at 150 ° C for 1 hour, the total amount of the amount of gas released from ethyl acetate and the amount of gas released from toluene is within the above range (that is, 25 ppm or less, It is preferably 20 ppm or less, and more preferably 15 ppm or less).

The initial adhesive force at 23 ° C when the adhesive tape for semiconductor protection of the present invention is bonded to a stainless steel plate is preferably 0.4 N / 20 mm or more, and more preferably 0.5 N / 20 mm or more. When the adhesive tape for semiconductor protection is bonded to a stainless steel plate, the upper limit of the initial adhesive force at 23 ° C. is, for example, 35 N / 20 mm. The adhesive force was measured in accordance with JIS Z 0237: 2000. Specifically, an adhesive tape for semiconductor protection was bonded to a stainless steel plate (arithmetic average surface roughness Ra: 50 ± 25 nm) by turning a 2 kg roller back and forth once, and then left at 23 ° C for 30 minutes, and then The peeling angle was 180 °, and the peeling speed (tensile speed) was 300 mm / minute, and the adhesive tape for semiconductor protection was peeled and measured. In addition, as described later, the adhesive layer included in the adhesive tape for semiconductor protection of the present invention contains an active energy ray-curable adhesive, and its adhesive force can be changed by irradiation with active energy rays. In this specification, "Initial adhesion" refers to the adhesion before the irradiation of active energy rays.

In one embodiment, the adhesive force of the adhesive tape for semiconductor protection of the present invention can be changed by irradiation with active energy rays. Adhere the adhesive tape for semiconductor protection to a stainless steel plate and irradiate ultraviolet rays with a cumulative light amount of 500 mJ / cm ² to 1500 mJ / cm ² (preferably 1000 mJ / cm ² ) (using a high-pressure mercury lamp with a wavelength of 365 nm as the center) The adhesive force at 23 ° C is preferably 0.07 N / 20 mm to 0.5 N / 20 mm, and more preferably 0.08 N / 20 mm to 0.3 N / 20 mm. Within this range, an adhesive tape for semiconductor protection having excellent peelability after a specific step (for example, a back grinding step) can be obtained.

The thickness of the adhesive tape for semiconductor protection is preferably 10 μm to 700 μm, more preferably 50 μm to 600 μm, and even more preferably 100 μm to 500 μm.

B. Intermediate layer As described above, the intermediate layer contains a UV polymerized (meth) acrylic polymer. Typically, a UV-polymerized (meth) acrylic polymer includes a structural unit derived from an alkyl (meth) acrylate.

In one embodiment, the intermediate layer is formed by UV-irradiating the intermediate layer-forming composition containing one or two or more (meth) acrylic acid alkyl esters. The composition for forming an intermediate layer does not contain a solvent.

Specific examples of the (meth) acrylic acid alkyl ester include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, N-butyl (meth) acrylate, isobutyl (meth) acrylate, second butyl (meth) acrylate, amyl (meth) acrylate, isoamyl (meth) acrylate, (meth) acrylic acid Hexyl ester, heptyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, nonyl (meth) acrylate, (formyl) (Isyl) isononyl acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, (formyl) Tridecyl acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, cetyl (meth) acrylate, heptadecyl (meth) acrylate C1-20 alkyl (meth) acrylates, such as octadecyl (meth) acrylate, undecyl (meth) acrylate, eicosyl (meth) acrylate, and the like.

The aforementioned UV-polymerized (meth) acrylic polymer may contain other monomers capable of copolymerizing with the above-mentioned (meth) acrylic acid alkyl ester for the purpose of modification such as cohesion, heat resistance, and crosslinkability. Corresponding structural unit. Examples of such monomers include carboxyl-containing monomers such as acrylic acid and methacrylic acid; acid anhydride monomers such as maleic anhydride and itaconic anhydride; hydroxyethyl (meth) acrylate and hydroxypropyl (meth) acrylate. Hydroxyl-containing monomers; sulfonic acid group-containing monomers such as styrene sulfonic acid, allyl sulfonic acid; (meth) acrylamide, N, N-dimethyl (meth) acrylamide, acrylamide Nitrogen-containing monomers such as phospholine; aminoalkyl (meth) acrylate monomers such as amino (meth) acrylate; alkoxy (meth) acrylates such as methoxyethyl (meth) acrylate Alkyl ester-based monomers; N-cyclohexylmaleimide, N-isopropylmaleimide, and other maleimide-based monomers; N-methylitaconimine, N-ethyl Itaconimine-based monomers such as kimonoconimide; succinimine-based imine monomers; vinyl monomers such as vinyl acetate, vinyl propionate, N-vinylpyrrolidone, methylvinylpyrrolidone ; Cyanoacrylate monomers such as acrylonitrile and methacrylonitrile; epoxy-containing acrylic monomers such as glycidyl (meth) acrylate; polyethylene glycol (meth) acrylate, (meth) C Glycol acrylate monomers such as polypropylene glycol esters; tetrahydrofurfuryl (meth) acrylate, fluoro (meth) acrylate, silicone (meth) acrylate, etc. have heterocycles, halogen atoms, and silicon atoms Acrylic monomers such as olefin; olefin monomers such as isoprene, butadiene, isobutylene; vinyl ether monomers such as vinyl ether. These monomer components can be used individually or in combination of 2 or more types. The content ratio of the structural unit derived from the other monomer is 100 parts by weight of the acrylic polymer, preferably 1 to 30 parts by weight, and more preferably 3 to 25 parts by weight.

The composition for forming an intermediate layer may contain an active energy ray-reactive compound (monomer or oligomer). Examples of the active energy ray-reactive compound include a photoreactive monomer having a functional group containing a polymerizable carbon-carbon multiple bond such as an acryl group, a methacryl group, a vinyl group, an allyl group, or an ethynyl group, or Oligomer. If a polyfunctional monomer such as a polyfunctional acrylate having two or more functional groups is used, a high-molecular-weight UV-polymerized (meth) acrylic acid can be obtained by bonding with the alkyl (meth) acrylate. polymer. Specific examples of the photoreactive monomer include trimethylolpropane tri (meth) acrylate, tetramethylolmethane tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, and pentaerythritol. Tetra (meth) acrylate, dipentaerythritol monohydroxy penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexane Esters of (meth) acrylic acid and polyols such as glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, etc .; polyfunctional urethane (meth) acrylate; epoxy (Meth) acrylate; oligoester (meth) acrylate and the like. In addition, methacrylfluorenyl isocyanate, 2-methacryloxyethyl isocyanate (2-isocyanatoethyl methacrylate), m-isopropenyl-α, α-dimethyl Monomers such as benzyl isocyanate. Specific examples of the photoreactive oligomer include dimers to pentamers of the monomers, and the like.

In addition, as the active energy ray-reactive compound, a monomer such as epoxidized butadiene, glycidyl methacrylate, acrylamide, and vinyl siloxane; or an oligomer containing the monomer can be used.

Further, as the active energy ray-reactive compound, a mixture of an organic salt such as an onium salt and a compound having a plurality of heterocycles in the molecule can be used. The mixture is irradiated with active energy rays (such as ultraviolet rays and electron beams) to decompose the organic salt to generate ions, which becomes the starting species and initiates a ring-opening reaction of the heterocyclic ring, thereby forming a three-dimensional network structure. Examples of the organic salts include iodonium salts, sulfonium salts, antimony salts, sulfonium salts, and borate salts. Examples of the heterocyclic ring in the compound having a plurality of heterocyclic rings in the molecule include ethylene oxide, oxetane, oxetane, episulfide, and aziridine.

When the composition for forming an intermediate layer contains an active energy ray reactive compound, the content ratio of the active energy ray reactive compound is preferably from 0.1 to 100 parts by weight, more preferably from 100 parts by weight of the base polymer. 0.1 to 50 parts by weight, and more preferably 0.1 to 10 parts by weight.

The composition for forming an intermediate layer may contain a photopolymerization initiator. As the photopolymerization initiator, any appropriate photopolymerization initiator can be used. For example, the product names "Irgacure184", "Irgacure651", "Irgacure369", "Irgacure379ex", "Irgacure819", "Irgacure OXE2", "Irgacure127") made by BASF, and "ESACURE one", "ESACURE one", "Products" "ESACURE 1001m"; trade names "ADEKA OPTOMER N-1414", "ADEKA OPTOMER N-1606", "ADEKA OPTOMER N-1717", etc. manufactured by Asahi Denka Kogyo. The content ratio of the photopolymerization initiator is preferably 0.1 to 20 parts by weight, and more preferably 2 to 10 parts by weight based on 100 parts by weight of the polymer constituents in the composition for forming an intermediate layer.

In one embodiment, the composition for forming an intermediate layer contains a crosslinking agent. Examples of the crosslinking agent include an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, an oxazoline-based crosslinking agent, an aziridine-based crosslinking agent, a melamine-based crosslinking agent, and a peroxide-based crosslinking agent. , Urea-based crosslinking agent, metal alkoxide-based crosslinking agent, metal chelate-based crosslinking agent, metal salt-based crosslinking agent, carbodiimide-based crosslinking agent, amine-based crosslinking agent, and the like.

When the composition for intermediate layer formation contains a crosslinking agent, the content ratio of the crosslinking agent is 100 parts by weight, preferably 0.5 to 10 parts by weight, relative to 100 parts by weight of the polymer constituents in the composition for forming the intermediate layer. , More preferably 1 to 8 parts by weight. Within such a range, an adhesive layer can be formed in which the elastic modulus is appropriately adjusted.

The composition for forming an intermediate layer may further contain any appropriate additive as needed. Examples of the additive include an active energy ray polymerization accelerator, a radical trapping agent, a tackifier, a plasticizer (such as a trimellitate-based plasticizer, a pyromellitic-based plasticizer, etc.), and a pigment , Dyes, fillers, antioxidants, conductive materials, antistatic agents, ultraviolet absorbers, light stabilizers, peel modifiers, softeners, surfactants, flame retardants, antioxidants, etc. The composition for forming an intermediate layer does not contain a solvent.

The weight average molecular weight of the UV polymerized (meth) acrylic polymer is preferably 300,000 to 15 million, and more preferably 500,000 to 1.5 million. The weight average molecular weight can be measured by GPC (solvent: THF).

The glass transition temperature of the UV polymerized (meth) acrylic polymer is preferably -50 ° C to 30 ° C, and more preferably -40 ° C to 20 ° C. If it is this range, the adhesive sheet which is excellent in heat resistance and can be used suitably for a heating process can be obtained.

The thickness of the intermediate layer is 50 μm to 1000 μm. By forming the intermediate layer having such a thickness, an adhesive tape for semiconductor protection capable of satisfactorily filling the uneven surface can be obtained. The thickness of the intermediate layer is preferably 100 μm to 900 μm, more preferably 150 μm to 800 μm, still more preferably 200 μm to 700 μm, and particularly preferably 250 μm to 600 μm.

The elastic modulus of the intermediate layer is preferably 0.07 MPa to 0.70 MPa, more preferably 0.075 MPa to 0.60 MPa, and even more preferably 0.08 MPa to 0.50 MPa. If it is this range, the adhesive tape for semiconductor protection which can bury the uneven surface favorably can be obtained.

In this specification, the elastic modulus refers to the elastic modulus measured by the nanoindentation method at room temperature (23 ° C). The elastic modulus measured by the nanoindentation method can be measured under the following conditions.
(Measuring device and measuring conditions)
Device: Tribo Indenter by Hysitron Inc.
Use indenter: Berkovich (triangular pyramid type)
Measurement method: single indentation indentation depth setting: 2500 nm
Pressing speed: 2000 nm / second Measurement atmosphere: Sample size in air: 1 cm × 1 cm

When the middle layer is left in the air at 50 ° C for 1 hour, the total amount of outgassing of the first organic solvent, the second organic solvent, or the third organic solvent derived from the Organic Solvent Prevention Rules of the Labor Safety and Health Law is better. It is 25 ppm or less, more preferably 20 ppm or less, still more preferably 15 ppm or less, still more preferably 10 ppm or less, particularly preferably 5 ppm or less, and most preferably 1 ppm or less. The lower the total amount of outgassing, the better, and the lower limit is, for example, 0.5 ppm (preferably 0.1 ppm, more preferably 0 ppm). In one embodiment, when the intermediate layer is left in the air at 150 ° C. for 1 hour, the total amount of the amount of gas released from ethyl acetate and the amount of gas released from toluene is preferably within the above range.

C. Adhesive layer <br/> The adhesive layer includes an active energy ray-curable adhesive containing a (meth) acrylic polymer. Typically, the active energy ray-curable adhesive further includes a crosslinking agent and a photopolymerization initiator. The adhesive force and rigidity of the adhesive layer containing the active energy ray-curable adhesive can be changed by irradiation with the active energy ray. Examples of the active energy rays include gamma rays, ultraviolet rays, visible rays, infrared rays (hot rays), radio waves, alpha rays, beta rays, electron beams, plasma flow, ionizing radiation, and particle beams. In one embodiment, the irradiation of the active energy ray is an ultraviolet ray (using a high-pressure mercury lamp with a wavelength of 365 nm as the center) with a cumulative light amount of 500 mJ / cm ² to 1500 mJ / cm ² (preferably 1000 mJ / cm ² ). .

The (meth) acrylic polymer contained in the active energy ray-curable adhesive is typically an acrylic polymer formed by using one or two or more kinds of (meth) acrylic acid alkyl esters as monomer components ( Homopolymer or copolymer). Specific examples of the alkyl (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, ( N-butyl methacrylate, isobutyl (meth) acrylate, second butyl (meth) acrylate, amyl (meth) acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate Ester, heptyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, nonyl (meth) acrylate, (meth) ) Isononyl acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, (methyl) Tridecyl acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, cetyl (meth) acrylate, heptadecyl (meth) acrylate C1-20 alkyl (meth) acrylates, such as esters, octadecyl (meth) acrylate, undecyl (meth) acrylate, and eicosyl (meth) acrylate.

The (meth) acrylic polymer contained in the active energy ray-curable adhesive may contain cohesive force, heat resistance, and cross-linking properties for the purpose of modification. Corresponding structural units of other monomers copolymerized with alkyl esters. Examples of such monomers include carboxyl-containing monomers such as acrylic acid and methacrylic acid; acid anhydride monomers such as maleic anhydride and itaconic anhydride; hydroxyethyl (meth) acrylate and hydroxypropyl (meth) acrylate And other hydroxyl-containing monomers; sulfonic acid-containing monomers such as styrene sulfonic acid and allyl sulfonic acid; (meth) acrylamide, N, N-dimethyl (meth) acrylamide, acrylamide Nitrogen-containing monomers such as morpholine; aminoalkyl (meth) acrylate monomers such as aminoethyl (meth) acrylate; alkoxy (meth) acrylates such as methoxyethyl (meth) acrylate Alkyl alkyl ester-based monomers; N-cyclohexylmaleimide, N-isopropylmaleimide, and other maleimide monomers; N-methylitaconimine, N- Itaconic imine monomers such as ethyl itaconic imine; succinimine imine monomers; vinyl monomers such as vinyl acetate, vinyl propionate, N-vinyl pyrrolidone, methyl vinyl pyrrolidone, etc. Body; cyanoacrylate monomers such as acrylonitrile and methacrylonitrile; epoxy-containing acrylic monomers such as glycidyl (meth) acrylate; polyethylene glycol (meth) acrylate, (meth) ) Glycol acrylate monomers such as polypropylene glycol acrylate; tetrahydrofurfuryl (meth) acrylate, fluoro (meth) acrylate, silicone (meth) acrylate, etc. have heterocycles, halogen atoms, silicon Atom-based acrylate monomers; olefin-based monomers such as isoprene, butadiene, and isobutylene; vinyl ether-based monomers such as vinyl ether. These monomer components can be used individually or in combination of 2 or more types. In one embodiment, the (meth) acrylic polymer contained in the active energy ray-curable adhesive contains, as a structural unit corresponding to other monomer components copolymerizable with the alkyl (meth) acrylate, a structural unit including A structural unit derived from a carboxyl group-containing monomer (especially preferably acrylic acid or methacrylic acid) or a hydroxyl group-containing monomer (particularly preferably hydroxyethyl (meth) acrylate). The content ratio of the structural unit derived from a carboxyl group-containing monomer is preferably 0.5 to 20 parts by weight, and more preferably 1 to 10 parts by weight based on 100 parts by weight of the acrylic polymer. The content ratio of the structural unit derived from a hydroxyl group-containing monomer is preferably 0.5 to 20 parts by weight, and more preferably 1 to 15 parts by weight based on 100 parts by weight of the acrylic polymer.

The active energy ray-curable adhesive may contain the active energy ray-reactive compound (monomer or oligomer) described in item B above.

The weight average molecular weight of the (meth) acrylic polymer contained in the active energy ray-curable adhesive is preferably 300,000 to 2 million, and more preferably 500,000 to 1.5 million. The weight average molecular weight can be measured by GPC (solvent: THF).

The glass transition temperature of the (meth) acrylic polymer contained in the active energy ray-curable adhesive is preferably -50 ° C to 30 ° C, and more preferably -40 ° C to 20 ° C. If it is this range, the adhesive sheet which is excellent in heat resistance and can be used suitably for a heating process can be obtained.

The active energy ray-curable adhesive may include a photopolymerization initiator. As the photopolymerization initiator, any appropriate photopolymerization initiator can be used. For example, the photopolymerization initiators listed in the above item B can be used. The content ratio of the photopolymerization initiator is preferably 1 to 20 parts by weight, and more preferably 2 to 10 parts by weight relative to 100 parts by weight of the base polymer in the adhesive.

It is preferable that the said adhesive layer contains a crosslinking agent. Examples of the crosslinking agent include an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, an oxazoline-based crosslinking agent, an aziridine-based crosslinking agent, a melamine-based crosslinking agent, and a peroxide-based crosslinking agent. , Urea-based crosslinking agent, metal alkoxide-based crosslinking agent, metal chelate-based crosslinking agent, metal salt-based crosslinking agent, carbodiimide-based crosslinking agent, amine-based crosslinking agent, and the like.

The content of the crosslinking agent is preferably 0.5 to 10 parts by weight, and more preferably 1 to 8 parts by weight, based on 100 parts by weight of the base polymer of the adhesive. Within such a range, an adhesive layer can be formed in which the elastic modulus is appropriately adjusted.

In one embodiment, an isocyanate-based crosslinking agent is preferably used. An isocyanate-based crosslinking agent is preferable in that it can react with various functional groups. Specific examples of the isocyanate-based crosslinking agent include the compounds described in the above item B.

The active energy ray-curable adhesive may further include any appropriate additives as needed. Examples of the additive include an active energy ray polymerization accelerator, a radical trapping agent, a tackifier, a plasticizer (such as a trimellitate-based plasticizer, a pyromellitic-based plasticizer, etc.), and a pigment , Dyes, fillers, antioxidants, conductive materials, antistatic agents, ultraviolet absorbers, light stabilizers, peel modifiers, softeners, surfactants, flame retardants, antioxidants, etc.

The thickness of the adhesive layer is 1 μm to 50 μm, preferably 1 μm to 40 μm, further preferably 3 μm to 30 μm, particularly preferably 3 μm to 25 μm, and most preferably 5 μm to 20 μm. Within this range, an adhesive tape having a better adhesive force as the adhesive tape used in the back grinding step can be obtained. In the present invention, by providing the intermediate layer, even if the thickness of the adhesive layer is reduced, an adhesive tape capable of well filling the uneven surface can be obtained. In addition, in the present invention, since the adhesive layer is thin, an adhesive tape with less solvent content and less outgassing can be obtained.

In one embodiment, when the load value is measured using thermomechanical analysis (TMA) and the penetration depth is set to 20% of the adhesive layer, and a 0.5 mm diameter probe is pressed into the adhesive layer, 1 second from the measurement start The amount of change in load (μN / (mm ² · second)) after the next 300 seconds is 1900 (μN / (mm ² · second)) or less. The amount of change in the load can be determined by ｛(load value after 300 seconds from measurement start (μN / mm ² ))-(load value after 1 second from measurement start (μN / mm ² ))｝ / 299 ( Seconds). The load value was measured in an environment of 23 ° C. In addition, the rigidity of the adhesive layer can be changed by active energy ray irradiation, and the load value is a load value before active energy ray irradiation.

When the amount of change in the load is 1900 (μN / (mm ² · s) or less), the adhesive layer has excellent ease, and the unevenness of the adhesive tape provided with the adhesive layer is excellent, and it can be buried well. Bump on the sticky surface. In particular, the adhesive tape provided with this adhesive layer is advantageous in the point which can maintain favorable uneven | corrugated followability over time. The change amount of the load is preferably 1500 (μN / (mm ² · s)) or less, more preferably 1000 (μN / (mm ² · s)) or less, and further preferably 500 (μN / (mm ² · s) )) Or less, particularly preferably 100 (μN / (mm ² · s)) or less. The lower limit of the change amount of the load is, for example, 10 (μN / (mm ² · s)).

The elastic modulus (before active energy ray irradiation) of the adhesive layer is preferably 0.07 MPa to 0.70 MPa, more preferably 0.075 MPa to 0.60 MPa, still more preferably 0.08 MPa to 0.50 MPa, and particularly preferably 0.1 MPa or more. And it does not reach 0.7 MPa. Within such a range, an adhesive tape having a preferable adhesive force as an adhesive tape used for the back surface grinding step can be obtained.

The elastic modulus after the active energy ray irradiation of the adhesive layer is preferably 1 MPa or more, more preferably 5 MPa or more, and even more preferably 10 MPa or more. If it is this range, the adhesive tape for semiconductor protection which is excellent in peelability after a specific process (for example, a back surface grinding process) can be obtained. The upper limit of the elastic modulus after the active energy ray irradiation of the adhesive layer is preferably 1,000 MPa or less, more preferably 500 MPa or less, and still more preferably 400 MPa or less.

D. Substrate <br/> The above substrate may contain any appropriate resin. In one embodiment, the substrate includes a thermoplastic resin. Examples of the resin include low-density polyethylene, linear polyethylene, medium-density polyethylene, high-density polyethylene, ultra-low-density polyethylene, random copolymer polypropylene, block copolymer polypropylene, and homopolymerization. Polyolefins such as propylene, polybutene, and polymethylpentene, ethylene-vinyl acetate copolymers, ionomer resins, ethylene- (meth) acrylic copolymers, ethylene- (meth) acrylates (random, (Alternative) copolymers, ethylene-butene copolymers, ethylene-hexene copolymers, polyurethane resins, polyester resins such as polyethylene naphthalate, polyimide resins, polyethers Ketones, polystyrene resins, polyvinyl chloride, polyvinylidene chloride, fluorine resins, silicon resins, cellulose resins, etc. Among these, a polyester resin is preferred.

The glass transition temperature of the resin constituting the substrate is preferably 60 ° C to 500 ° C, and more preferably 100 ° C to 500 ° C. If it is this range, the adhesive sheet which is excellent in heat resistance and can be used suitably for a heating process can be obtained. In addition, the "glass transition temperature" refers to the conditions in the DMA method (tensile method) at a temperature increase rate of 5 ° C / min, a sample width of 5 mm, a distance between chucks of 20 mm, and a frequency of 10 Hz. The temperature confirmed below shows the peak of the loss tangent (tanδ).

The thickness of the substrate is preferably 50 μm to 300 μm, more preferably 80 μm to 250 μm, and still more preferably 100 μm to 200 μm.

The elastic modulus of the substrate is preferably 300 MPa to 6000 MPa, and more preferably 400 to 5000 MPa. If it is such a range, the adhesive tape for semiconductor protection which can follow the unevenness | corrugation of a bonding surface moderately can be obtained.

In order to improve the adhesion to the adjacent layer, retention, etc., the surface of the substrate may be subjected to any surface treatment. Examples of the surface treatment include chemical treatment, physical treatment, and coating treatment such as chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, and ionizing radiation treatment.

E. semiconductor protection protective adhesive tape may be manufactured by any suitable method of semiconductor <br/> method of producing the adhesive tape. The adhesive tape for semiconductor protection can be formed, for example, after applying the composition for forming an intermediate layer on the substrate, irradiating the coating layer with ultraviolet rays to form an intermediate layer, and coating the intermediate layer with the active energy ray hardening type. Formed by an adhesive.

As a coating method for the composition for forming the intermediate layer, bar coater coating, air knife coating, gravure coating, gravure reverse coating, reverse roll coating, lip coating, die coating, dip coating, and offset printing can be used. , Flexographic printing, screen printing and other methods.

The cumulative light amount of ultraviolet rays irradiated to the composition for forming an intermediate layer is preferably 1000 mW / cm ² to 5000 mW / cm ² , and more preferably 2000 mW / cm ² to 4000 mW / cm ² .

As the application method of the active energy ray-curable adhesive, the above-mentioned application method exemplified as the application method of the composition for forming an intermediate layer can be adopted. In addition, a method of forming an adhesive layer on a release liner separately and bonding the adhesive layer to a substrate may be adopted.

F. Use of adhesive tape for semiconductor protection <br/> The adhesive tape for semiconductor protection of the present invention can be used to form an electromagnetic wave shield when an electromagnetic wave shield is provided on an electronic part having an uneven surface (for example, an electronic part having a bump). It is suitable for masking the uneven surface (bump forming surface) of a body.

In one embodiment, the adhesive tape for semiconductor protection of the present invention can be used to mask the surface of a bump having a height of 50 μm or more (for example, 50 μm to 300 μm). Usually, a plurality of bumps are provided on the surface. The arrangement interval of the bumps (the distance from the center of the bumps to the center of the adjacent bumps) is, for example, 100 μm to 500 μm. In addition, in one embodiment, a plan view shape of the bump is circular, and a diameter thereof is 100 μm to 300 μm. When the adhesive tape for semiconductor protection of the present invention is used, the surface having bumps as described above can be well masked. In addition, the adhesive tape for semiconductor protection of the present invention can be peeled from the surface without residue.
Examples

Hereinafter, the present invention will be specifically described by examples, but the present invention is not limited to these examples. The test and evaluation methods in the examples are shown below. In addition, "part" and "%" are based on weight when there is no special record.

(1) Outgassing amount The semiconductor protective adhesive tape was cut to a size of 5 cm ² and used as an evaluation sample. The evaluation sample was sealed in a 20 mL headspace vial under shading conditions. The headspace vial containing the evaluation sample was heated at 150 ° C for 1 hour using a headspace sampler (HSS). Thereafter, the amount of ethyl acetate and the amount of toluene were measured with respect to 1 mL of the gas phase by gas chromatography (GC).
＜ HSS conditions ＞
Device: Agilent Technologies, 7697A
Heating temperature: 150 ° C
Heating time: 1 hour Sample loop temperature: 160 ° C
Conveying pipeline temperature: 200 ° C
Pressing time: 0.1 minutes Injection time: 0.50 minutes <GC conditions>
Device: Agilent Technologies, 7890B
Column: HP-1 (0.250 mm × 30 m, df = 1.0 μm)
Column temperature: 40 ° C (3 minutes) → 10 ° C / minute → 120 ° C → 20 ° C / minute → 300 ° C (10 minutes)
Column flow: 1 mL / min (He)
Column pressure: constant flow mode (81 kPa)
Note inlet temperature: 250 ℃
Injection volume: 1 mL
Injection method: split ratio (20: 1)
Detector: FID
Detector temperature: 250 ° C

(2) Thermomechanical analysis (TMA)
The thermomechanical analysis (TMA) of the adhesive layer was performed under the following conditions, and the amount of change in load (μN / (mm ² · s)) from 1 second to 300 seconds after the measurement was measured was measured.
Device: SII Nano Technology, TMA / SS7100
Measurement mode: Compression expansion probe diameter: 0.5 mm (Compression expansion method)
Temperature program: 23 ° C constant measurement atmosphere: N ₂ (flow rate 200 ml / min)
Press-in amount: thickness of adhesive layer × 20%

(3) The bump-filling device uses a DR-3000II (manufactured by Nitto Seiki Co., Ltd.), and an 8-inch wafer with bumps with a pitch of 400 μm is attached to the semiconductor protection adhesive tape. (Adhesion conditions: speed 10 mm / sec, adhesion temperature: 23 ° C, adhesion pressure: 0.45 MPa, roller hardness: 80 degrees). After sticking, the burial property of the bump was confirmed with a microscope. Generally, bubbles are generated around the bumps by surrounding the bumps. If the bubble is not connected to the bubbles of adjacent bumps, it is regarded as qualified (marked as ○ in the table). (Indicated as x in the table).

(4) The warpage after grinding uses DR-3000III, the semiconductor protection adhesive tape is stuck on the 8-inch silicon mirror wafer. The sticking conditions are the same as the bump burial evaluation. A wafer grinder DFG-8560 (manufactured by DISCO) was used to grind the wafer with the adhesive tape attached to a thickness of 200 μm. After grinding, use a ruler / steel ruler to measure the warpage of the wafer (for the lower surface of the wafer when the wafer is placed on a horizontal surface, the difference between the maximum and minimum distances from the horizontal plane).

[Example 1]
(Preparation of composition a for intermediate layer formation)
90 parts by weight of 2-ethylhexyl acrylate (2EHA), 10 parts by weight of acrylic acid (AA), 0.05 parts by weight of a photopolymerization initiator (trade name: Irgacure184, manufactured by BASF) and a photopolymerization initiator (trade name) : Irgacure651, manufactured by BASF Corporation) 0.05 parts by weight and 0.10 parts by weight of dipentaerythritol hexaacrylate (trade name: KAYARAD DPHA, manufactured by Nippon Kayaku Co., Ltd.) were put into a flask, and thoroughly stirred to obtain a composition for forming an intermediate layer a (acrylic polymer slurry).
(Preparation of active energy ray hardening adhesive a)
Preparation of 100 parts by weight of acrylic polymer including 2-ethylhexyl acrylate (2-EHA) / propenyl morpholine / hydroxyethyl acrylate (HEA) = 75/25/10 (weight ratio), polyisocyanate 2 parts by weight of a compound (trade name "CORONATE L", manufactured by Tosoh Corporation), 7 parts by weight of a photopolymerization initiator (trade name "Irgacure651", manufactured by BASF) and an active energy ray-curable adhesive a of toluene .
(Production of adhesive tape for semiconductor protection)
A 75 μm-thick polyester film (trade name: Lumirror ES10 # 75, manufactured by Toray Co., Ltd.) having a peeling treatment on one side with silicone was coated with the composition a for forming an intermediate layer to form a coating layer. . The above-mentioned coating layer is irradiated with ultraviolet rays in an environment blocked from oxygen. At this time, a high-pressure mercury lamp (manufactured by Toshiba Lighting & Technology Corporation) was used to irradiate ultraviolet rays with an illuminance of 100 mW / cm ² (measured using TOPCON UVR-T1 with a maximum sensitivity of about 350 nm) until the light amount reached 3000 mW / cm ² so far. As described above, a laminated body A including a substrate and an intermediate layer a having a thickness of 300 μm was obtained.
On the other hand, the active energy ray-curable adhesive a was applied to the silicone-treated surface of a polyester-based release film (trade name "Diafoil MRF", manufactured by Mitsubishi Resins Co., Ltd.) having a thickness of 38 μm, and the temperature was 140 ° C. Heating for 120 seconds to form an adhesive layer a having a thickness of 10 μm.
The adhesive layer a was transferred to the intermediate layer a side of the laminated body A to obtain an intermediate layer (300 μm) containing a substrate (75 μm) / a UV polymerized (meth) acrylic polymer / containing an active energy ray A semiconductor protection adhesive tape having a thickness of an adhesive layer (10 μm) of a hardening type adhesive of 385 μm.
Table 1 shows the results obtained by subjecting the obtained adhesive tape for semiconductor protection to the above evaluation.

[Example 2]
(Preparation of composition b for intermediate layer formation)
A composition b for forming an intermediate layer was obtained in the same manner as in Example 1 except that dipentaerythritol hexaacrylate was not prepared.
(Production of adhesive tape for semiconductor protection)
Except having used the composition b for intermediate layer formation instead of the composition a for intermediate layer formation, it carried out similarly to Example 1, and obtained the adhesive tape for semiconductor protection.
The results obtained by applying the obtained adhesive tape for semiconductor protection to the above evaluation are shown in Table 1.

[Comparative Example 1]
(Preparation of composition c for forming an intermediate layer)
100 parts by weight of an acrylic polymer including ethyl acrylate (EA) / butyl acrylate (BA) / acrylic acid (AA) = 50/50/5 (mass ratio) and a UV oligomer (trade name "ARONIX M321") ", Manufactured by Toa Synthesis Co., Ltd.) 15 parts by weight, photopolymerization initiator (trade name" Irgacure651 ", manufactured by BASF), 1 part by weight, crosslinker (trade name" TETRAD C ", Mitsubishi Gas Chemical Co., Ltd.) (Manufactured) 0.05 parts by weight of toluene and intermediate layer-forming composition c.
(Preparation of active energy ray hardening adhesive c)
Preparation of 100 parts by weight of an acrylic polymer including ethyl acrylate (EA) / butyl acrylate (BA) / 2-hydroxyethyl acrylate (HEA) = 50/50/20 (weight ratio), UV oligomer ( Trade name "ARONIX M321", manufactured by Toa Synthesis Co., Ltd., 15 parts by weight, photopolymerization initiator (trade name "Irgacure 651", manufactured by BASF), 1 part by weight, polyisocyanate compound (trade name "CORONATE L", Tosoh Co., Ltd.) 0.07 parts by weight and toluene active energy ray-curable adhesive c.
(Making of adhesive tape)
The composition c for forming an intermediate layer was applied to a PET film (trade name "Lumirror S105", manufactured by Toray Co., Ltd.) having a thickness of 50 μm, and then heated at 120 ° C for 120 seconds to form an intermediate having a thickness of 60 μm. Layer c1.
Next, the intermediate layer c1 was transferred to an embossed surface of an EVA film (trade name "FANCLAIR NRW135", manufactured by Gunze Co., Ltd.) with a thickness of 135 μm to obtain a laminated body C1 (EVA substrate (135 μm)) with a thickness of 195 μm. / Intermediate layer c1 (60 μm)).
Further, another intermediate layer c1 ′ (thickness 60 μm) was formed on other PET films by the same method as above, and this intermediate layer c1 ′ was transferred onto the intermediate layer c1 of the laminated body C1 to obtain a substrate (135 μm) / interlayer c (120 μm) is a laminated body C2 having a thickness of 255 μm.
On the other hand, the above-mentioned active energy ray-curable adhesive c was coated on a PET film (trade name "Lumirror S105", manufactured by Toray Co., Ltd.) having a thickness of 50 μm, and heated at 120 ° C for 120 seconds to form a thickness. 30 μm adhesive layer c.
The adhesive layer c was transferred to the intermediate layer c side of the laminated body C1 to obtain an adhesive tape having a thickness of 285 μm including the substrate (135 μm) / intermediate layer c (120 μm) / adhesive layer (30 μm).
The results obtained by applying the obtained adhesive tape to the above evaluation are shown in Table 1.

[Comparative Example 2]
(Preparation of composition d for intermediate layer formation)
A composition d for forming an intermediate layer was obtained in the same manner as in Comparative Example 1 except that the blending amount of the cross-linking agent (trade name "TETRAD C", manufactured by Mitsubishi Gas Chemical Co., Ltd.) was 0.2 parts by weight.
(Making of adhesive tape)
An adhesive tape was obtained in the same manner as in Comparative Example 1 except that the intermediate layer-forming composition d was used instead of the intermediate layer-forming composition c.
The results obtained by applying the obtained adhesive tape to the above evaluation are shown in Table 1.

[Comparative Example 3]
(Formation of the middle layer)
EVA resin pellets (trade name "EV150", manufactured by DuPont-Mitsui Polychemicals Co., Ltd.) were dissolved in toluene at a concentration of 20% by weight to prepare a composition e for forming an intermediate layer.
Next, the composition e for forming an intermediate layer was coated on a PET film (trade name "Lumirror ES10", manufactured by Toray Industries, Ltd.) with a thickness of 100 µm, and dried at 120 ° C for 2 minutes to obtain a laminate E1 ( PET substrate (100 μm) / interlayer e1 (200 μm)).
Furthermore, the composition e for forming an intermediate layer was applied to the intermediate layer e1 of the multilayer body E1 and dried to obtain a multilayer body E2 (PET substrate (100 μm) / intermediate layer e2 (300 μm)).
Furthermore, the composition e for forming an intermediate layer was applied to the intermediate layer e2 of the multilayer body E2 and dried to obtain a multilayer body E3 (PET substrate (100 μm) / intermediate layer e (400 μm)).
(Formation of adhesive layer)
Preparation of 100 parts by weight of an acrylic polymer including butyl acrylate (BA) / 2-hydroxyethyl acrylate (HEA) / acrylonitrile (AN) / acrylic acid (AA) = 90/2/5/3 (weight ratio) 1.75 parts by weight of polyisocyanate compound (trade name "CORONATE L", manufactured by Tosoh Corporation), cross-linking agent (trade name "TETRAD C", manufactured by Mitsubishi Gas Chemical Co., Ltd.) 0.8 parts by weight and active energy of toluene Wire hardening adhesive e.
This active energy ray hardening adhesive e was applied to a PET film (trade name "Lumirror S105", manufactured by Toray Co., Ltd.) having a thickness of 50 μm, and then heated at 120 ° C for 120 seconds to form a thickness of 10 μm. Adhesive layer e.
(Making of adhesive tape)
The adhesive layer e was transferred onto the intermediate layer e of the above-mentioned multilayer body E3 to obtain a thickness of 510 μm including the substrate (100 μm) / intermediate layer e (400 μm) / adhesive layer e (10 μm)). band.
The results obtained by applying the obtained adhesive tape to the above evaluation are shown in Table 1.

[Comparative Example 4]
(Preparation of composition f for intermediate layer formation)
100 parts by weight of an acrylic polymer including ethyl acrylate (EA) / butyl acrylate (BA) / acrylic acid (AA) = 50/50/5 (mass ratio) and a photopolymerization initiator (trade name "Irgacure 651 ", manufactured by BASF Corporation) 3 parts by weight, 1 part by weight of a polyisocyanate compound (trade name" CORONATE L ", manufactured by Tosoh Corporation) and toluene-containing intermediate layer-forming composition f.
(Preparation of active energy ray hardening adhesive f)
Preparation of 100 parts by weight of acrylic polymer including 2-ethylhexyl acrylate (2-EHA) / propenyl morpholine / hydroxyethyl acrylate (HEA) = 75/25/10 (weight ratio), polyisocyanate 5 parts by weight of a compound (trade name "CORONATE L", manufactured by Tosoh Corporation), 3 parts by weight of a photopolymerization initiator (trade name "Irgacure 651", manufactured by BASF) and an active energy ray-curable adhesive of toluene f.
(Making of adhesive tape)
The intermediate layer-forming composition f was applied to a 50 μm-thick PET film (trade name “Lumirror S105”, manufactured by Toray Corporation), and then heated at 120 ° C. for 120 seconds to obtain a laminate F1 (PET substrate (50 μm) / intermediate layer f1 (75 μm)).
Further, the intermediate layer-forming composition f was applied to the intermediate layer f1 of the multilayer body F1 and dried to obtain a multilayer body F2 (PET substrate (50 μm) / intermediate layer f (150 μm)).
On the other hand, a 50 μm-thick PET film (trade name “Lumirror S105”, manufactured by Toray Co., Ltd.) was coated with the active energy ray-curable adhesive f, and heated at 120 ° C. for 120 seconds to form a thickness. 5 μm adhesive layer f.
The adhesive layer f was transferred to the intermediate layer f side of the multilayer body F2 to obtain an adhesive tape having a thickness of 205 μm including the substrate (50 μm) / intermediate layer f (150 μm) / adhesive layer f (5 μm). .
The results obtained by applying the obtained adhesive tape to the above evaluation are shown in Table 1.

[Table 1]
[Industrial availability]

The adhesive tape for semiconductor protection of this invention can be used suitably for semiconductor protection (for example, protection of a bump surface) in a vacuum step (for example, the vacuum step in semiconductor manufacturing).

10‧‧‧ Substrate

20‧‧‧ middle layer

30‧‧‧ Adhesive layer

100‧‧‧ Adhesive tape for semiconductor protection

FIG. 1 is a schematic sectional view of an adhesive tape for semiconductor protection according to an embodiment of the present invention.

Claims (7)

An adhesive tape for semiconductor protection includes a substrate, an adhesive layer disposed on at least one side of the substrate, and an intermediate layer disposed between the substrate and the adhesive layer, The adhesive layer includes an active energy ray-curable adhesive containing a (meth) acrylic polymer, The thickness of the adhesive layer is 1 μm to 50 μm. The intermediate layer contains a UV polymerized (meth) acrylic polymer, The thickness of the intermediate layer is 50 μm to 1000 μm. For example, when the adhesive tape for semiconductor protection of claim 1 is left in the air at 150 ° C for 1 hour, the first organic solvent, the second organic solvent, or the third organic solvent derived from the organic solvent prevention rule of the Labor Safety and Health Law. The total outgas of these organic solvents is less than 25 ppm. For example, the adhesive tape for semiconductor protection of claim 1 or 2, wherein the thermomechanical analysis (TMA) is used and the pressing depth is set to 20% of the above adhesive layer, and a 0.5 mm diameter probe is pressed into the adhesive layer, When measuring the load value, the amount of change in load (μN / (mm ² · second)) from 1 second to 300 seconds from the start of measurement is 1900 μN / (mm ² · second) or less. The adhesive tape for semiconductor protection according to claim 1 or 2, wherein the substrate comprises a thermoplastic resin. The adhesive tape for semiconductor protection according to claim 3, wherein the substrate comprises a thermoplastic resin. The adhesive tape for semiconductor protection according to claim 1 or 2, wherein the substrate comprises a polyester resin. The adhesive tape for semiconductor protection according to claim 3, wherein the substrate comprises a polyester resin.