TW201935758A - Antenna structure and wireless communication device with same - Google Patents
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Abstract
Description
本發明涉及一種天線結構及具有該天線結構之無線通訊裝置。The invention relates to an antenna structure and a wireless communication device having the antenna structure.
隨著無線通訊技術之進步,行動電話、個人數位助理等電子裝置不斷朝向功能多樣化、輕薄化、以及資料傳輸更快、更有效率等趨勢發展。然而其相對可容納天線之空間亦就越來越小,且隨著長期演進(Long Term Evolution,LTE)技術之不斷發展,天線之頻寬不斷增加。因此,如何於有限之空間內設計出具有較寬頻寬之天線,是天線設計面臨之一項重要課題。With the advancement of wireless communication technology, electronic devices such as mobile phones and personal digital assistants have continued to develop toward diversified functions, thinner and lighter, and faster and more efficient data transmission. However, the space that can accommodate antennas is getting smaller and smaller, and with the continuous development of Long Term Evolution (LTE) technology, the bandwidth of antennas is constantly increasing. Therefore, how to design an antenna with a wide bandwidth in a limited space is an important issue for antenna design.
有鑑於此,有必要提供一種天線結構及具有該天線結構之無線通訊裝置。In view of this, it is necessary to provide an antenna structure and a wireless communication device having the antenna structure.
一種天線結構,包括邊框、第一饋入部、第二饋入部以及第一接地部,所述邊框上開設有第一斷點及第二斷點,所述第一斷點及所述第二斷點均貫通且隔斷所述邊框,所述第一斷點與所述第二斷點共同自所述邊框劃分出第一輻射部,所述第一饋入部之一端電連接至所述第一輻射部,並將所述第一輻射部劃分為第一諧振段及第二諧振段,所述第二饋入部電連接至所述第二諧振段靠近所述第一斷點之端部,所述第一接地部電連接至所述第一諧振段靠近所述第二斷點之端部,當電流自所述第一饋入部饋入後,電流流過所述第一諧振段並藉由所述第一接地部接地,以激發出第一工作模態及第二工作模態以產生第一輻射頻段及第二輻射頻段之輻射訊號,當電流自所述第一饋入部饋入後,電流流過所述第二諧振段並藉由所述第二饋入部接地,以激發出第三工作模態以產生第三輻射頻段之輻射訊號,當電流自所述第二饋入部饋入後,電流流過所述第二諧振段及所述第一諧振段,並藉由所述第一接地部接地,進而激發出第四工作模態以產生第四輻射頻段之輻射訊號。An antenna structure includes a frame, a first feeding portion, a second feeding portion, and a first ground portion. The frame is provided with a first breakpoint and a second breakpoint, and the first breakpoint and the second breakpoint All the points penetrate and cut off the frame, the first breakpoint and the second breakpoint jointly divide a first radiating portion from the frame, and one end of the first feeding portion is electrically connected to the first radiating portion. And the first radiating portion is divided into a first resonance section and a second resonance section, and the second feeding section is electrically connected to an end portion of the second resonance section near the first breakpoint, the The first grounding portion is electrically connected to an end of the first resonance section near the second breakpoint. When a current is fed from the first feeding section, a current flows through the first resonance section and passes through the first resonance section. The first grounding part is grounded to excite the first working mode and the second working mode to generate radiation signals in the first radiation frequency band and the second radiation frequency band. When the current is fed from the first feeding part, the current Flowing through the second resonance section and grounded through the second feed-in to excite the third work State to generate a radiation signal in a third radiation band. When a current is fed from the second feeding section, a current flows through the second resonance section and the first resonance section and passes through the first ground section. Grounding, which in turn excites the fourth working mode to generate a radiation signal in the fourth radiation band.
一種無線通訊裝置,包括上述所述之天線結構。A wireless communication device includes the antenna structure described above.
上述天線結構及具有該天線結構之無線通訊裝置藉由設置所述邊框,且利用所述邊框上之第一斷點及第二斷點自所述邊框劃分出天線結構,如此可有效實現寬頻設計。The antenna structure and the wireless communication device having the antenna structure are provided with the frame, and the first breakpoint and the second breakpoint on the frame are used to divide the antenna structure from the frame, so that a broadband design can be effectively implemented .
下面將結合本發明實施例中之附圖,對本發明實施例中之技術方案進行清楚、完整地描述,顯然,所描述之實施例僅僅是本發明一部分實施例,而不是全部之實施例。基於本發明中之實施例,所屬領域具有通常知識者於沒有做出創造性勞動前提下所獲得之所有其他實施例,均屬於本發明保護之範圍。In the following, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those with ordinary knowledge in the art without any creative labor belong to the protection scope of the present invention.
需要說明的是,當一個元件被稱為“電連接”另一個元件,它可直接於另一個元件上或者亦可存在居中之元件。當一個元件被認為是“電連接”另一個元件,它可是接觸連接,例如,可是導線連接之方式,亦可是非接觸式連接,例如,可是非接觸式耦合之方式。It should be noted that when an element is called "electrically connected" to another element, it may be directly on the other element or there may be a centered element. When an element is considered to be "electrically connected" to another element, it can be a contact connection, for example, a wire connection method, or a non-contact connection method, for example, a non-contact coupling method.
除非另有定義,本文所使用之所有之技術與科學術語與屬於所屬領域具有通常知識者通常理解之含義相同。本文中於本發明之說明書中所使用之術語僅是為描述具體之實施例之目不是旨在於限制本發明。本文所使用之術語“及/或”包括一個或多個相關之所列項目的任意之與所有之組合。Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.
下面結合附圖,對本發明之一些實施方式作詳細說明。於不衝突之情況下,下述之實施例及實施例中之特徵可相互組合。Hereinafter, some embodiments of the present invention will be described in detail with reference to the drawings. In the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.
請參閱圖1,本發明較佳實施方式提供一種天線結構100,其可應用於行動電話、個人數位助理等無線通訊裝置200中,用以發射、接收無線電波以傳遞、交換無線訊號。Referring to FIG. 1, a preferred embodiment of the present invention provides an antenna structure 100 that can be applied to wireless communication devices 200 such as mobile phones and personal digital assistants to transmit and receive radio waves to transmit and exchange wireless signals.
該無線通訊裝置200還包括基板21。該基板21可採用環氧樹脂玻璃纖維(FR4)等介電材質製成。所述基板21上設置有第一饋入點211、第二饋入點212以及第三饋入點214。所述第一饋入點211、第二饋入點212以及第三饋入點214間隔設置於所述基板21上,用以為所述天線結構100饋入電流。The wireless communication device 200 further includes a substrate 21. The substrate 21 can be made of a dielectric material such as epoxy glass fiber (FR4). The substrate 21 is provided with a first feeding point 211, a second feeding point 212, and a third feeding point 214. The first feeding point 211, the second feeding point 212, and the third feeding point 214 are disposed on the substrate 21 at intervals to feed current to the antenna structure 100.
於本實施例中,所述基板21上還設置有至少三個電子元件,即第一電子元件217、第二電子元件218以及第三電子元件219。所述第一電子元件217、第二電子元件218以及第三電子元件219均設置於所述基板21之同一側,且均位於所述第二饋入點212與所述第三饋入點214之間。於本實施例中,所述第一電子元件217為一音訊介面模組,其設置於所述第一饋入點211與所述第三饋入點214之間,且靠近所述第三饋入點214設置。所述第二電子元件218為一前置攝像頭模組,其設置於所述第一饋入點211與所述第二饋入點212之間。所述第三電子元件219為揚聲器模組,其位於所述第一電子元件217與所述第二電子元件218之間。所述第三電子元件219設置於所述第一饋入點211與所述第三饋入點214之間,且靠近所述第一饋入點211設置。In this embodiment, the substrate 21 is further provided with at least three electronic components, namely a first electronic component 217, a second electronic component 218, and a third electronic component 219. The first electronic component 217, the second electronic component 218, and the third electronic component 219 are all disposed on the same side of the substrate 21, and are all located at the second feeding point 212 and the third feeding point 214 between. In this embodiment, the first electronic component 217 is an audio interface module, which is disposed between the first feeding point 211 and the third feeding point 214 and is close to the third feeding point. The entry point 214 is set. The second electronic component 218 is a front camera module, which is disposed between the first feeding point 211 and the second feeding point 212. The third electronic component 219 is a speaker module, which is located between the first electronic component 217 and the second electronic component 218. The third electronic component 219 is disposed between the first feeding point 211 and the third feeding point 214 and is disposed near the first feeding point 211.
請一併參閱圖2,所述天線結構100至少包括殼體11、第一饋入部12、第二饋入部13、第一接地部14、第三饋入部15、第四饋入部16及第二接地部17。Please also refer to FIG. 2. The antenna structure 100 includes at least a housing 11, a first feeding portion 12, a second feeding portion 13, a first grounding portion 14, a third feeding portion 15, a fourth feeding portion 16, and a second feeding portion.地 部 17。 The ground portion 17.
所述殼體11可為所述無線通訊裝置200之外殼。所述殼體11至少包括邊框112。於本實施例中,所述邊框112由金屬材料製成。所述邊框112大致呈環狀結構。所述殼體11還可包括背板(圖未示)。所述背板蓋設於所述邊框112上,且與所述邊框112共同圍成一容置空間114。所述容置空間114用以容置所述無線通訊裝置200之基板21、處理單元等電子元件或電路模組於其內。The casing 11 may be a casing of the wireless communication device 200. The casing 11 includes at least a frame 112. In this embodiment, the frame 112 is made of a metal material. The frame 112 is substantially ring-shaped. The casing 11 may further include a back plate (not shown). The back cover is disposed on the frame 112, and forms a containing space 114 together with the frame 112. The accommodating space 114 is used for accommodating electronic components or circuit modules such as a substrate 21 and a processing unit of the wireless communication device 200.
所述邊框112至少包括末端部115、第一側部116以及第二側部117。於本實施例中,所述末端部115為所述無線通訊裝置200之頂端。所述第一側部116與所述第二側部117相對設置,兩者分別設置於所述末端部115之兩端,優選垂直設置。The frame 112 includes at least a tip portion 115, a first side portion 116, and a second side portion 117. In this embodiment, the end portion 115 is a top end of the wireless communication device 200. The first side portion 116 and the second side portion 117 are disposed opposite to each other, and the two are disposed at both ends of the end portion 115 respectively, and are preferably disposed vertically.
所述邊框112上開設有第一斷點118及第二斷點119。於本實施例中,所述第一斷點118開設於所述末端部115靠近所述第一側部116之位置。所述第二斷點119開設於所述末端部115靠近所述第二側部117之位置。所述第一斷點118及所述第二斷點119均貫通且隔斷所述邊框112。所述第一斷點118及所述第二斷點119共同將所述邊框112劃分為間隔設置之第一輻射部E1、第二輻射部E2以及第三輻射部E3。其中,所述第一斷點118與所述第二斷點119之間之所述邊框112形成所述第一輻射部E1。所述第一斷點118遠離所述第一輻射部E1及所述第二斷點119一側之所述邊框112形成所述第二輻射部E2。所述第二斷點119遠離所述第一輻射部E1及所述第一斷點118一側之所述邊框112形成所述第三輻射部E3。於本實施例中,所述第二輻射部E2及第三輻射部E3均接地。A first breakpoint 118 and a second breakpoint 119 are defined on the frame 112. In this embodiment, the first breakpoint 118 is located at a position of the end portion 115 near the first side portion 116. The second break point 119 is formed at a position of the end portion 115 near the second side portion 117. The first breakpoint 118 and the second breakpoint 119 both penetrate and block the frame 112. The first breakpoint 118 and the second breakpoint 119 collectively divide the frame 112 into a first radiating portion E1, a second radiating portion E2, and a third radiating portion E3 which are arranged at intervals. Wherein, the frame 112 between the first breakpoint 118 and the second breakpoint 119 forms the first radiation portion E1. The first breakpoint 118 is far from the first radiation portion E1 and the frame 112 on the side of the second breakpoint 119 forms the second radiation portion E2. The second breakpoint 119 is far from the first radiation portion E1 and the frame 112 on the side of the first breakpoint 118 forms the third radiation portion E3. In this embodiment, the second radiating portion E2 and the third radiating portion E3 are both grounded.
可理解,所述第一輻射部E1上還開設有開口120。所述開口120與所述第一電子元件217相對應,以使得所述第一電子元件217從所述開口120部分露出。如此,使用者可將一音訊元件(例如耳機)藉由所述開口120插入,進而與所述第一電子元件217建立電性連接。It can be understood that the first radiation portion E1 is further provided with an opening 120. The opening 120 corresponds to the first electronic component 217, so that the first electronic component 217 is partially exposed from the opening 120. In this way, the user can insert an audio component (such as a headset) through the opening 120 to establish an electrical connection with the first electronic component 217.
可理解,於本實施例中,所述第一斷點118及所述第二斷點119內均填充有絕緣材料,例如塑膠、橡膠、玻璃、木材、陶瓷等,但不以此為限。It can be understood that, in this embodiment, the first breakpoint 118 and the second breakpoint 119 are both filled with an insulating material, such as plastic, rubber, glass, wood, ceramic, etc., but not limited thereto.
所述第一饋入部12設置於所述殼體11內部,且位於所述第二電子元件218及所述第三電子元件219之間。所述第一饋入部12之一端電連接至所述第一輻射部E1,另一端藉由匹配元件121電連接至所述第一饋入點211,進而為所述第一輻射部E1饋入電流訊號。於本實施例中,所述匹配元件121一為零歐姆電阻,亦就是短路。當然,於其他實施例中,所述匹配元件121不局限於上述所述之零歐姆電阻,其還可為電容、電感或其組合。The first feeding portion 12 is disposed inside the casing 11 and is located between the second electronic component 218 and the third electronic component 219. One end of the first feeding portion 12 is electrically connected to the first radiating portion E1, and the other end is electrically connected to the first feeding point 211 through a matching element 121, so as to feed the first radiating portion E1. Current signal. In this embodiment, the matching element 121 is a zero-ohm resistor, that is, short-circuited. Of course, in other embodiments, the matching element 121 is not limited to the zero-ohm resistance described above, and may also be a capacitor, an inductor, or a combination thereof.
於本實施例中,所述第一饋入部12進一步將所述第一輻射部E1劃分為第一諧振段E11及第二諧振段E12。其中,所述第一饋入部12與所述第二斷點119之間之所述邊框112形成所述第一諧振段E11。所述第一饋入部12與所述第一斷點118之間之所述邊框112形成所述第二諧振段E12。於本實施例中,所述第一饋入部12並非電連接至所述第一輻射部E1之中間位置,因此所述第一諧振段E11之長度大於所述第二諧振段E12之長度。In this embodiment, the first feeding section 12 further divides the first radiating section E1 into a first resonance section E11 and a second resonance section E12. Wherein, the frame 112 between the first feeding portion 12 and the second break point 119 forms the first resonance section E11. The frame 112 between the first feeding portion 12 and the first break point 118 forms the second resonance section E12. In this embodiment, the first feeding portion 12 is not electrically connected to the middle position of the first radiating portion E1, so the length of the first resonance section E11 is greater than the length of the second resonance section E12.
所述第二饋入部13設置於所述殼體11內部,且設置於所述第二電子元件218與所述第一側部116之間。所述第二饋入部13之一端藉由匹配元件131電連接至近距離無線通訊技術(Near Field Communication,NFC)晶片132,並藉由所述NFC晶片132接地。所述第二饋入部13之另一端電連接至所述第二諧振段E12靠近所述第一斷點118之端部。於本實施例中,所述匹配元件131為一電感,其電感值為39nH。當然,於其他實施例中,所述匹配元件131不局限於上述所述之電感,其還可為電容、其他之匹配元件或其組合。The second feeding portion 13 is disposed inside the casing 11 and is disposed between the second electronic component 218 and the first side portion 116. One end of the second feeding portion 13 is electrically connected to a Near Field Communication (NFC) chip 132 through a matching element 131, and is grounded through the NFC chip 132. The other end of the second feeding portion 13 is electrically connected to an end of the second resonance section E12 near the first breakpoint 118. In this embodiment, the matching element 131 is an inductor, and its inductance value is 39 nH. Of course, in other embodiments, the matching element 131 is not limited to the inductor described above, and may also be a capacitor, other matching elements, or a combination thereof.
所述第一接地部14設置於所述殼體11內部,且位於所述第一電子元件217與所述第二側部117之間。所述第一接地部14之一端藉由接地元件141接地,另一端電連接至所述第一諧振段E11靠近所述第二斷點119之端部,用以為所述第一輻射部E1提供接地。於本實施例中,所述接地元件141為一電感,其電感值為5.6nH。當然,於其他實施例中,所述接地元件141不局限於上述所述之電感,其還可為電容、其他之匹配元件或其組合。The first ground portion 14 is disposed inside the casing 11 and is located between the first electronic component 217 and the second side portion 117. One end of the first grounding portion 14 is grounded through a grounding element 141, and the other end is electrically connected to an end of the first resonance section E11 near the second breakpoint 119 for providing the first radiation portion E1. Ground. In this embodiment, the ground element 141 is an inductor, and its inductance value is 5.6 nH. Of course, in other embodiments, the ground element 141 is not limited to the above-mentioned inductor, and may also be a capacitor, other matching elements, or a combination thereof.
於本實施例中,所述第三饋入部15設置於所述殼體11內部。所述第三饋入部15之一端藉由匹配元件151電連接至所述第二饋入點212,另一端電連接至所述第二輻射部E2,以為所述第二輻射部E2饋入電流訊號。於本實施例中,所述匹配元件151為一電容,其電容值為1.2pF。當然,可理解,於其他實施例中,所述匹配元件151不局限於上述所述之電容,其還可為電感、其他之匹配元件或其組合。In this embodiment, the third feeding portion 15 is disposed inside the casing 11. One end of the third feeding portion 15 is electrically connected to the second feeding point 212 through a matching element 151, and the other end is electrically connected to the second radiating portion E2 to feed current to the second radiating portion E2. Signal. In this embodiment, the matching element 151 is a capacitor, and its capacitance value is 1.2 pF. Of course, it can be understood that, in other embodiments, the matching element 151 is not limited to the capacitor described above, and may also be an inductor, other matching elements, or a combination thereof.
所述第四饋入部16設置於所述殼體11內部。所述第四饋入部16之一端電連接至所述第三輻射部E3靠近所述第二斷點119之端部,另一端藉由匹配電路161電連接至所述第三饋入點214,以為所述第三輻射部E3饋入電流訊號。於本實施例中,所述匹配電路161包括第一匹配單元163及第二匹配單元165。所述第一匹配單元163之一端電連接至所述第三饋入點214,另一端電連接至所述第四饋入部16及所述第二匹配單元165之一端。所述第二匹配單元165之另一端接地。於本實施例中,所述第一匹配單元163為一電容,其電容值為0.8pF。所述第二匹配單元165為一電感,其電感值為6.2nH。當然,於其他實施例中,所述第一匹配單元163以及第二匹配單元165不局限於上述所述之電容及電感,其還可為其他之匹配元件或其組合。The fourth feeding portion 16 is disposed inside the casing 11. One end of the fourth feeding portion 16 is electrically connected to an end of the third radiating portion E3 near the second break point 119, and the other end is electrically connected to the third feeding point 214 through a matching circuit 161. It is thought that the third radiation part E3 is fed with a current signal. In this embodiment, the matching circuit 161 includes a first matching unit 163 and a second matching unit 165. One end of the first matching unit 163 is electrically connected to the third feeding point 214, and the other end is electrically connected to one of the fourth feeding portion 16 and the second matching unit 165. The other end of the second matching unit 165 is grounded. In this embodiment, the first matching unit 163 is a capacitor, and its capacitance value is 0.8 pF. The second matching unit 165 is an inductor with an inductance value of 6.2 nH. Of course, in other embodiments, the first matching unit 163 and the second matching unit 165 are not limited to the capacitors and inductors described above, and may be other matching components or a combination thereof.
所述第二接地部17設置於所述殼體11內部,且與所述第四饋入部16間隔設置。所述第二接地部17之一端電連接至所述第三輻射部E3,另一端接地,進而為所述第三輻射部E3提供接地。The second grounding portion 17 is disposed inside the casing 11 and is spaced from the fourth feeding portion 16. One end of the second grounding portion 17 is electrically connected to the third radiating portion E3, and the other end is grounded, thereby providing grounding for the third radiating portion E3.
可理解,請一併參閱圖3,當電流自所述第一饋入部12饋入後,電流將依次流過所述第一諧振段E11及第一接地部14,並藉由所述接地元件141接地(參路徑P1)。如此,所述第一饋入部12、第一諧振段E11及所述第一接地部14共同構成回路(loop)天線,進而激發第一工作模態及第二工作模態以產生第一輻射頻段及第二輻射頻段之輻射訊號。另外,當電流自所述第一饋入部12饋入後,所述電流還將流過所述第二諧振段E12、第二饋入部13以及所述NFC晶片132,並藉由所述NFC晶片132接地(參路徑P2)。如此,所述第一饋入部12、第二諧振段E12及所述第二饋入部13共同構成另一回路天線,以激發第三工作模態以產生第三輻射頻段之輻射訊號。Understandably, please refer to FIG. 3 as well. After the current is fed from the first feeding portion 12, the current will flow through the first resonance section E11 and the first grounding portion 14 in sequence, and through the grounding element 141 Ground (see path P1). In this way, the first feed-in portion 12, the first resonance section E11, and the first ground portion 14 together form a loop antenna, thereby exciting the first working mode and the second working mode to generate a first radiation frequency band. And radiation signals in the second radiation band. In addition, when a current is fed from the first feeding section 12, the current will also flow through the second resonance section E12, the second feeding section 13, and the NFC chip 132, and through the NFC chip 132 ground (see path P2). In this way, the first feeding section 12, the second resonance section E12, and the second feeding section 13 together constitute another loop antenna to excite a third working mode to generate a radiation signal in a third radiation frequency band.
當電流自所述第二饋入部13饋入後,電流將依次流過所述第二諧振段E12、第一諧振段E11及第一接地部14,並藉由所述接地元件141接地(參路徑P3)。如此,所述第二饋入部13、第一輻射部E1及所述第一接地部14共同構成回路天線,進而激發第四工作模態以產生第四輻射頻段之輻射訊號。After the current is fed from the second feeding section 13, the current will flow through the second resonance section E12, the first resonance section E11, and the first grounding section 14 in order, and grounded through the grounding element 141 (see Path P3). In this way, the second feeding portion 13, the first radiating portion E1, and the first grounding portion 14 together constitute a loop antenna, and then a fourth working mode is excited to generate a radiation signal in a fourth radiation frequency band.
當所述第三饋入部15饋入電流時,所述電流藉由所述第三饋入部15饋入所述第二輻射部E2,並接地(參路徑P4)。如此,所述第三饋入部15與所述第二輻射部E2共同構成回路天線,進而激發第五工作模態以產生第五輻射頻段之輻射訊號。When the third feeding portion 15 feeds a current, the current is fed into the second radiating portion E2 through the third feeding portion 15 and is grounded (see path P4). In this way, the third feeding portion 15 and the second radiating portion E2 together form a loop antenna, and then excite a fifth working mode to generate a radiation signal in a fifth radiating frequency band.
當所述第四饋入部16饋入電流時,所述電流藉由所述第四饋入部16饋入所述第三輻射部E3,並藉由所述第二接地部17接地(參路徑P5)。如此,所述第四饋入部16、所述第三輻射部E3及所述第二接地部17共同構成回路天線,進而激發第六工作模態以產生第六輻射頻段之輻射訊號。When the fourth feeding portion 16 feeds a current, the current is fed into the third radiating portion E3 through the fourth feeding portion 16, and is grounded through the second grounding portion 17 (see path P5 ). In this way, the fourth feeding portion 16, the third radiating portion E3, and the second grounding portion 17 collectively constitute a loop antenna, and further excite a sixth working mode to generate a radiation signal in a sixth radiation frequency band.
於本實施例中,所述第一工作模態為長期演進技術升級版(LTE-Advanced,LTE-A)低頻模態。所述第二工作模態及第三工作模態均為LTE-A中頻模態。所述第四工作模態為NFC模態。所述第五工作模態包括GPS模態、WIFI 2.4/5GHz模態以及LTE-A高頻模態。所述第六工作模態包括WIFI 2.4/5GHz模態。所述第一輻射頻段之頻率為699-960 MHz。所述第二輻射頻段之頻率為所述第一輻射頻段之倍頻。所述第二輻射頻段及第三輻射頻段之頻率為1805-2170 MHz。所述第四輻射頻段之頻率為13.56 MHz。所述第五輻射頻段之頻率包括1575-1605 MHz、2412-2485 MHz、5125-5825 MHz以及2300-2690 MHz。所述第六輻射頻段之頻率包括2412-2485 MHz及5125-5825 MHz。In this embodiment, the first working mode is a low-frequency mode of an LTE-Advanced (LTE-Advanced). The second working mode and the third working mode are both LTE-A intermediate frequency modes. The fourth working mode is an NFC mode. The fifth working mode includes a GPS mode, a WIFI 2.4 / 5GHz mode, and an LTE-A high-frequency mode. The sixth working mode includes a WIFI 2.4 / 5GHz mode. The frequency of the first radiation band is 699-960 MHz. The frequency of the second radiation frequency band is a multiple of the first radiation frequency band. The frequencies of the second radiation frequency band and the third radiation frequency band are 1805-2170 MHz. The frequency of the fourth radiation band is 13.56 MHz. The frequency of the fifth radiation band includes 1575-1605 MHz, 2412-2485 MHz, 5125-5825 MHz, and 2300-2690 MHz. The frequency of the sixth radiation band includes 2412-2485 MHz and 5125-5825 MHz.
顯然,於本實施例中,所述第一饋入部12、第二饋入部13、第一輻射部E1以及第一接地部14共同構成第一天線。所述第三饋入部15與所述第二輻射部E2構成第二天線。所述第四饋入部16、第三輻射部E3以及所述第二接地部17構成第三天線。其中所述第一天線為分集(diversity)天線及NFC天線。所述第二天線為分集(diversity)天線、全球定位系統(Global Positioning System,GPS)天線及WIFI 2.4/5GHz天線。所述第三天線為WIFI 2.4/5GHz天線。其中,所述第一天線中,所述第一饋入部12、第二饋入部13、第一輻射部E1以及所述第一接地部14構成分集(diversity)天線。所述第二饋入部13、第一輻射部E1以及所述第一接地部14構成NFC天線。當所述第一天線工作於第三輻射頻段時,所述第一天線藉由所述第二饋入部13接地。當所述第一天線工作於第四輻射頻段時,所述第一天線藉由所述第二饋入部13饋入電流訊號。亦就是說,所述第二饋入部13可同時作為分集(diversity)天線之地以及所述NFC天線之訊號饋入點。Obviously, in this embodiment, the first feeding portion 12, the second feeding portion 13, the first radiating portion E1, and the first ground portion 14 collectively constitute a first antenna. The third feeding portion 15 and the second radiating portion E2 constitute a second antenna. The fourth feeding portion 16, the third radiating portion E3, and the second ground portion 17 constitute a third antenna. The first antenna is a diversity antenna and an NFC antenna. The second antenna is a diversity antenna, a Global Positioning System (GPS) antenna, and a WIFI 2.4 / 5GHz antenna. The third antenna is a WIFI 2.4 / 5GHz antenna. Among the first antennas, the first feeding portion 12, the second feeding portion 13, the first radiating portion E1, and the first grounding portion 14 constitute a diversity antenna. The second feeding portion 13, the first radiating portion E1, and the first ground portion 14 constitute an NFC antenna. When the first antenna operates in the third radiation frequency band, the first antenna is grounded through the second feeding portion 13. When the first antenna operates in a fourth radiation frequency band, the first antenna feeds a current signal through the second feeding portion 13. That is to say, the second feed-in portion 13 can serve as a diversity antenna site and a signal feed-in point of the NFC antenna at the same time.
圖4為所述天線結構100中第一天線之S參數(散射參數)曲線圖。圖5為所述天線結構100中第一天線之增益效率曲線圖。圖6為所述天線結構100中第二天線之S參數(散射參數)曲線圖。圖7為所述天線結構100中第二天線之增益效率曲線圖。圖8為所述天線結構100中第三天線之S參數(散射參數)曲線圖。圖9為所述天線結構100中第三天線之增益效率曲線圖。FIG. 4 is a graph of S-parameters (scattering parameters) of a first antenna in the antenna structure 100. FIG. 5 is a graph of gain efficiency of the first antenna in the antenna structure 100. FIG. 6 is a graph of S-parameters (scattering parameters) of a second antenna in the antenna structure 100. FIG. 7 is a graph of gain efficiency of the second antenna in the antenna structure 100. FIG. 8 is a graph of an S parameter (scattering parameter) of a third antenna in the antenna structure 100. FIG. 9 is a graph of gain efficiency of a third antenna in the antenna structure 100.
顯然,從圖4至圖9可知,所述天線結構100之工作頻率可涵蓋至699-960 MHz、1710-2690 MHz、1575-1605 MHz以及5125-5825 MHz,即涵蓋至LTE-A 低、中、高頻頻段、GPS頻段、NFC頻段、WIFI 2.4/5GHz頻段,頻率範圍較廣,且當所述天線結構100工作于上述頻段時,其工作頻率均可滿足天線工作設計要求,並具有較佳之輻射效率。Obviously, from FIG. 4 to FIG. 9, the operating frequency of the antenna structure 100 can cover 699-960 MHz, 1710-2690 MHz, 1575-1605 MHz, and 5125-5825 MHz, that is, LTE-A low, medium , High frequency band, GPS frequency band, NFC frequency band, WIFI 2.4 / 5GHz frequency band, the frequency range is wide, and when the antenna structure 100 works in the above frequency band, its operating frequency can meet the antenna working design requirements, and has better Radiation efficiency.
如前面實施例所述,所述天線結構100藉由設置所述第一斷點118以及第二斷點119,以自所述邊框112劃分出第一輻射部E1及第二輻射部E2。所述天線結構100還設置有第一饋入部12、第二饋入部13、第一接地部14及第三饋入部15,進而使得所述第一饋入部12之電流饋入至所述第一輻射部E1之第一諧振段E11,藉由所述第一接地部14接地,以激發第一工作模態以產生低頻頻段之輻射訊號,並激發第二工作模態以產生第一中頻頻段之輻射訊號。所述第一饋入部12之電流還饋入至所述第一輻射部E1之第二諧振段E12,並藉由所述第二饋入部13接地,以激發第三工作模態以產生第二中頻頻段之輻射訊號。所述第三饋入部15之電流饋入至所述第二輻射部E2,進而使得所述第二輻射部E2可產生高頻頻段之輻射訊號。因此無線通訊裝置200可使用長期演進技術升級版(LTE-Advanced)之載波聚合(CA,Carrier Aggregation)技術同時於多個不同頻段接收或發送無線訊號以增加傳輸頻寬。As described in the previous embodiment, the antenna structure 100 defines the first radiating portion E1 and the second radiating portion E2 from the frame 112 by setting the first breakpoint 118 and the second breakpoint 119. The antenna structure 100 is further provided with a first feeding portion 12, a second feeding portion 13, a first grounding portion 14, and a third feeding portion 15, so that the current of the first feeding portion 12 is fed into the first feeding portion 12. The first resonance section E11 of the radiating section E1 is grounded through the first grounding section 14 to excite a first working mode to generate a radiation signal in a low frequency band and excite a second working mode to generate a first intermediate frequency band Radiation signal. The current of the first feeding section 12 is also fed to the second resonance section E12 of the first radiating section E1 and is grounded through the second feeding section 13 to excite a third working mode to generate a second Radiation signals in the intermediate frequency band. The current of the third feeding portion 15 is fed to the second radiating portion E2, so that the second radiating portion E2 can generate a radiation signal in a high frequency band. Therefore, the wireless communication device 200 can use LTE-Advanced Carrier Aggregation (CA) technology to simultaneously receive or send wireless signals in multiple different frequency bands to increase the transmission bandwidth.
再者,於本實施例中,由於所述第二天線及第三天線均可產生或接收WIFI 2.4/5GHz之輻射訊號,進而使得所述天線結構100可實現WIFI MIMO (Multi-input Multi-output)功能。即本案之天線結構100可完整之達到4G LTE手機所需涵蓋LTE/GSM/UMTS、GPS 1575MHz、Wi-Fi MIMO 2.4/5GHz、NFC 13.56 MHz頻帶之接收與發射功能,包含700/850/900/1800/1900/2100/2300/2500 MHz及GPS 1575MHz、Wi-Fi 2.4/5GHz、NFC 13.56MHz等頻帶之接收與發射功能,並且同時具有3CA功能以及Wi-Fi MIMO功能。Furthermore, in this embodiment, since the second antenna and the third antenna can both generate or receive WIFI 2.4 / 5GHz radiation signals, the antenna structure 100 can implement WIFI MIMO (Multi-input Multi- output) function. That is, the antenna structure 100 in this case can completely achieve the receiving and transmitting functions required for 4G LTE mobile phones covering LTE / GSM / UMTS, GPS 1575MHz, Wi-Fi MIMO 2.4 / 5GHz, and NFC 13.56 MHz bands, including 700/850/900 / 1800/1900/2100/2300/2500 MHz, GPS 1575MHz, Wi-Fi 2.4 / 5GHz, NFC 13.56MHz and other frequency band receiving and transmitting functions, and also has 3CA function and Wi-Fi MIMO function.
以上所述,僅為本發明的較佳實施例,並非是對本發明作任何形式上的限定。另外,本領域技術人員還可在本發明精神內做其它變化,當然,這些依據本發明精神所做的變化,都應包含在本發明所要求保護的範圍之內。The above descriptions are merely preferred embodiments of the present invention, and are not intended to limit the present invention in any form. In addition, those skilled in the art can also make other changes within the spirit of the present invention. Of course, these changes made in accordance with the spirit of the present invention should be included in the scope of the present invention.
100‧‧‧天線結構 100‧‧‧ Antenna Structure
11‧‧‧殼體 11‧‧‧shell
112‧‧‧邊框 112‧‧‧border
114‧‧‧容置空間 114‧‧‧accommodation space
115‧‧‧末端部 115‧‧‧ tip
116‧‧‧第一側部 116‧‧‧First side
117‧‧‧第二側部 117‧‧‧ second side
118‧‧‧第一斷點 118‧‧‧ the first breakpoint
119‧‧‧第二斷點 119‧‧‧ Second breakpoint
120‧‧‧開口 120‧‧‧ opening
12‧‧‧第一饋入部 12‧‧‧First Feeding Department
13‧‧‧第二饋入部 13‧‧‧Second Feeding Department
14‧‧‧第一接地部 14‧‧‧ the first ground
15‧‧‧第三饋入部 15‧‧‧Third Feeding Department
16‧‧‧第四饋入部 16‧‧‧Fourth Feeding Department
17‧‧‧第二接地部 17‧‧‧ second ground
E1‧‧‧第一輻射部 E1‧‧‧First Radiation Department
E11‧‧‧第一諧振段 E11‧‧‧The first resonance section
E12‧‧‧第二諧振段 E12‧‧‧Second resonance section
E2‧‧‧第二輻射部 E2‧‧‧Second Radiation Department
E3‧‧‧第三輻射部 E3‧‧‧Third Radiation Department
121、131、151‧‧‧匹配元件 121, 131, 151‧‧‧ matching components
132‧‧‧NFC晶片 132‧‧‧NFC chip
141‧‧‧接地元件 141‧‧‧ grounding element
161‧‧‧匹配電路 161‧‧‧ matching circuit
163‧‧‧第一匹配單元 163‧‧‧first matching unit
165‧‧‧第二匹配單元 165‧‧‧Second matching unit
200‧‧‧無線通訊裝置 200‧‧‧Wireless communication device
21‧‧‧基板 21‧‧‧ substrate
211‧‧‧第一饋入點 211‧‧‧First feed point
212‧‧‧第二饋入點 212‧‧‧Second Feed Point
214‧‧‧第三饋入點 214‧‧‧Third feed point
217‧‧‧第一電子元件 217‧‧‧The first electronic component
218‧‧‧第二電子元件 218‧‧‧Second electronic component
219‧‧‧第三電子元件 219‧‧‧Third electronic component
圖1為本發明較佳實施例之天線結構應用至無線通訊裝置之示意圖。 圖2為圖1所示天線結構之電路圖。 圖3為圖2所示天線結構之電流走向示意圖。 圖4為圖1所示天線結構中第一天線之S參數(散射參數)曲線圖。 圖5為圖1所示天線結構中第一天線之增益效率圖。 圖6為圖1所示天線結構中第二天線之S參數(散射參數)曲線圖。 圖7為圖1所示天線結構中第三天線之增益效率圖。 圖8為圖1所示天線結構中第三天線之S參數(散射參數)曲線圖。 圖9為圖1所示天線結構中第三天線之增益效率圖。FIG. 1 is a schematic diagram of applying an antenna structure to a wireless communication device according to a preferred embodiment of the present invention. FIG. 2 is a circuit diagram of the antenna structure shown in FIG. 1. FIG. 3 is a schematic diagram of a current trend of the antenna structure shown in FIG. 2. FIG. 4 is a graph of S parameters (scattering parameters) of the first antenna in the antenna structure shown in FIG. 1. FIG. 5 is a gain efficiency diagram of the first antenna in the antenna structure shown in FIG. 1. FIG. 6 is a graph of S parameters (scattering parameters) of the second antenna in the antenna structure shown in FIG. 1. FIG. 7 is a gain efficiency diagram of the third antenna in the antenna structure shown in FIG. 1. FIG. 8 is a graph of S parameters (scattering parameters) of a third antenna in the antenna structure shown in FIG. 1. FIG. 9 is a gain efficiency diagram of the third antenna in the antenna structure shown in FIG. 1.
無no
Claims (12)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107104843A TWI668910B (en) | 2018-02-09 | 2018-02-09 | Antenna structure and wireless communication device with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107104843A TWI668910B (en) | 2018-02-09 | 2018-02-09 | Antenna structure and wireless communication device with same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI668910B TWI668910B (en) | 2019-08-11 |
| TW201935758A true TW201935758A (en) | 2019-09-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107104843A TWI668910B (en) | 2018-02-09 | 2018-02-09 | Antenna structure and wireless communication device with same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI668910B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113517556B (en) * | 2020-04-10 | 2024-09-17 | 深圳富泰宏精密工业有限公司 | Antenna structure and electronic equipment with same |
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2018
- 2018-02-09 TW TW107104843A patent/TWI668910B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI668910B (en) | 2019-08-11 |
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