TW201935007A - Probe for high frequency test including a high elastic core, a high conductive layer and an anti-oxidation layer - Google Patents
Probe for high frequency test including a high elastic core, a high conductive layer and an anti-oxidation layer Download PDFInfo
- Publication number
- TW201935007A TW201935007A TW107104191A TW107104191A TW201935007A TW 201935007 A TW201935007 A TW 201935007A TW 107104191 A TW107104191 A TW 107104191A TW 107104191 A TW107104191 A TW 107104191A TW 201935007 A TW201935007 A TW 201935007A
- Authority
- TW
- Taiwan
- Prior art keywords
- probe
- layer
- elastic core
- conductive layer
- oxidation
- Prior art date
Links
- 239000000523 sample Substances 0.000 title claims abstract description 56
- 230000003064 anti-oxidating effect Effects 0.000 title claims abstract description 27
- 238000012360 testing method Methods 0.000 title claims abstract description 19
- 239000000463 material Substances 0.000 claims description 8
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- -1 polytetrafluoroethylene Polymers 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical group [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000003963 antioxidant agent Substances 0.000 claims 1
- 230000003078 antioxidant effect Effects 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract description 6
- 230000003647 oxidation Effects 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 abstract description 3
- 238000001514 detection method Methods 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000004891 communication Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000010295 mobile communication Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- WLTSUBTXQJEURO-UHFFFAOYSA-N thorium tungsten Chemical compound [W].[Th] WLTSUBTXQJEURO-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
Abstract
Description
本發明是有關於一種運用於高頻測試之探針,尤指探針為可透過高彈性線芯及高導通層來同時具有高彈力及高導電度之特性,且可利用抗氧化層來防止高導通層發生氧化而影響導通速率,該探針便可藉由高彈性線芯、高導通層及抗氧化層來達到具高傳輸效率之效果。 The invention relates to a probe used for high-frequency testing, in particular, the probe is capable of transmitting high elasticity and high conductivity through a highly elastic core and a high-conductivity layer, and can be prevented by an anti-oxidation layer. Oxidation of the high-conductivity layer affects the conduction rate. The probe can achieve high transmission efficiency through a highly elastic core, a high-conductivity layer, and an anti-oxidation layer.
按,目前電路板上係由複數配線來構成之配線圖案(pattern),其必須向電路板所搭載之IC、半導體或電阻器等電子部件傳遞正確的電子信號,以往,針對未安裝半導體或電子部件等印刷電路板、柔性(flexible)基板、多層配線基板、液晶屏(LCD panel)或等離子顯示屏(plasma display panel)等所使用之形成配線圖案的電路配線基板,或半導體晶片等基板上所形成之配線圖案來作為檢測對象,以檢測配線圖案上所設置之複數檢測點間的電阻值,用以判斷出其電氣特性之良否。 According to the current, a circuit board is a wiring pattern composed of a plurality of wirings, which must transmit correct electronic signals to electronic components such as ICs, semiconductors, or resistors mounted on the circuit board. In the past, semiconductors or electronics were not installed. Components such as printed circuit boards, flexible substrates, multilayer wiring substrates, circuit wiring substrates used to form wiring patterns used in liquid crystal panels (LCD panels) or plasma display panels, or semiconductor substrates. The formed wiring pattern is used as a detection object, and the resistance value between a plurality of detection points provided on the wiring pattern is detected to determine whether the electrical characteristics are good or not.
再者,現今為了檢測電路板上之配線圖案是否按設計完成,便提出了實際應用於各種電路板之檢測裝置,其一般檢測裝置是利用複數彈簧針頭(Pogo pin)來與待測物上的複數檢測點進行電性接觸,以進行檢測電氣特性之作業,然而,目前第五代行動通訊系統( 5th generation wireless systems;簡稱5G)時代來臨,該5G所定義的通訊頻段至少為28GHz,其5G通訊頻段為4G最大通訊頻段(2.6GHz)的10多倍,所以各項產業皆朝著能符合5G所定義的通訊頻段來進行產品設計與製造。 In addition, in order to detect whether the wiring pattern on the circuit board is completed as designed, a detection device that is actually applied to various circuit boards is proposed. The general detection device uses a plurality of pogo pins to communicate with the object under test. A plurality of detection points are electrically contacted for the purpose of detecting electrical characteristics. However, the current fifth generation mobile communication system ( The era of 5th generation wireless systems (5G for short) is coming. The communication band defined by 5G is at least 28GHz, and its 5G communication band is more than 10 times the 4G maximum communication band (2.6GHz). Therefore, all industries are moving towards 5G. Product design and manufacturing based on the defined communication frequency band.
但是,因為5G頻段大幅多於4G頻段,所以當複數彈簧針頭檢測應用於5G的待測物上時,即必須下壓更多的力量,以產生更多變形量,才能夠檢測5G頻段電氣特性,而進行檢測作業時,其因複數彈簧針頭需頻繁地觸壓待測物上的複數檢測點,又因為下壓力量增大,會使彈簧針頭或檢測點上產生刮痕或壓痕,而這些刮痕或壓痕會影響彈簧針頭導電性,以影響電訊傳輸的品質,且下壓力量增大,亦可能會使彈簧針頭或檢測點損毀,以致於產生產品的使用壽命降低之問題。 However, because the 5G frequency band is significantly more than the 4G frequency band, when multiple pogo pin detection is applied to a 5G test object, it must press down more force to generate more deformation to detect the electrical characteristics of the 5G frequency band. In the detection operation, the multiple spring needles frequently touch the multiple detection points on the object to be tested, and because the amount of downforce is increased, scratches or indentations may occur on the spring needles or detection points, and These scratches or indentations will affect the electrical conductivity of the pogo pin, affect the quality of telecommunication transmission, and increase the amount of downforce, it may also damage the pogo pin or detection point, resulting in a problem that the service life of the product is reduced.
是以,要如何設法解決上述習用之缺失與不便,即為從事此行業之相關業者所亟欲研究改善之方向所在。 Therefore, how to solve the above-mentioned shortcomings and inconveniences is the direction that the relevant industry players in this industry are eager to study and improve.
故,發明人有鑑於上述缺失,乃搜集相關資料,經由多方評估及考量,並以從事於此行業累積之多年經驗,經由不斷試作及修改,始設計出此種運用於高頻測試之探針的發明專利者。 Therefore, the inventor, in view of the above-mentioned shortcomings, collected relevant information, evaluated and considered from various parties, and based on years of experience accumulated in this industry, and continued to make trials and modifications, he began to design such probes for high-frequency testing. Inventor.
本發明之主要目的乃在於該探針所具之高彈性線芯外部為環繞包覆有高導通層,而高導通層外部環繞包覆有抗氧化層,即可藉由高彈性線芯、高導通層及抗氧化層來複合而成一探針,其探針為可透過高彈性線芯及高導通層來同時具有高彈力及高導電度之特性,且可利用抗氧化層來防止高導通層發生氧化而影響導通速率,以使此探針具有高傳輸效率 之功效,進而達到可供檢測需符合高頻率的待測物之目的。 The main purpose of the present invention is that the outer portion of the highly elastic core of the probe is surrounded by a high-conductivity layer, and the outer portion of the high-conductivity layer is surrounded by an anti-oxidation layer. The conductive layer and the anti-oxidation layer are combined to form a probe. The probe can pass through the highly elastic core and the high-conducting layer to have the characteristics of high elasticity and high conductivity at the same time, and the anti-oxidation layer can be used to prevent the high-conducting layer. Oxidation affects the conduction rate, so that this probe has high transmission efficiency The efficacy of the device can be used to detect the test object that needs to meet the high frequency.
本發明之次要目的乃在於該探針之高彈性線芯為可減少高彈性線芯本身或待測物上的金屬接點因受壓而產生刮傷、損壞等情形,藉以避免影響高彈性線芯與金屬接點間的導電性,進而達到提升高彈性線芯使用壽命之目的。 The secondary purpose of the present invention is that the highly elastic core of the probe can reduce the occurrence of scratches and damages due to compression of the highly elastic core or the metal contacts on the object to be tested, so as to avoid affecting the high elasticity. The electrical conductivity between the core and the metal contacts further improves the service life of the highly elastic core.
本發明之另一目的乃在於該探針為可於抗氧化層外部環繞披覆有絕緣層,便可利用絕緣層來防止複數探針於進行檢測作業時,其複數探針之間因相互接觸而發生短路之情況,以避免複數探針受損、毀壞,進而達到提升檢測作業穩定性之目的。 Another object of the present invention is that the probe can be covered with an insulating layer on the outside of the anti-oxidation layer. The insulating layer can be used to prevent multiple probes from contacting each other during the detection operation. In the case of a short circuit, the plurality of probes are prevented from being damaged or destroyed, thereby achieving the purpose of improving the stability of the detection operation.
1‧‧‧探針 1‧‧‧ Probe
11‧‧‧高彈性線芯 11‧‧‧High elastic core
12‧‧‧高導通層 12‧‧‧High conduction layer
13‧‧‧抗氧化層 13‧‧‧anti-oxidation layer
14‧‧‧絕緣層 14‧‧‧ Insulation
第一圖 係為本發明之前視剖面圖。 The first figure is a sectional view of the present invention.
第二圖 係為本發明之側視剖面圖。 The second figure is a side sectional view of the present invention.
為達成上述目的及功效,本發明所採用之技術手段及其構造,茲繪圖就本發明之較佳實施例詳加說明其特徵與功能如下,俾利完全瞭解。 In order to achieve the above-mentioned objects and effects, the technical means and structure adopted by the present invention, the following is a detailed description of the features and functions of the preferred embodiment of the present invention.
請參閱第一、二圖所示,係為本發明之前視剖面圖及側視剖面圖,由圖中可清楚看出,本發明之探針1係應用於高頻測試作業中,並包括高彈性線芯11、高導通層12及抗氧化層13,其中:該高彈性線芯11的材料可為鎢鋼或錸鎢等具高彈性之材料,而較佳為鎢鋼,其鎢鋼不僅具有高彈性,亦具有高耐磨之特性,以可 達到經久使用之效果。 Please refer to the first and second figures, which are the front sectional view and the side sectional view of the present invention. It can be clearly seen from the figure that the probe 1 of the present invention is used in high-frequency test operations and includes The elastic core 11, the high-conductivity layer 12, and the anti-oxidation layer 13, among which the material of the high-elastic core 11 may be tungsten steel or thorium tungsten and other highly elastic materials, and preferably tungsten steel. The tungsten steel is not only It has high elasticity and high abrasion resistance. To achieve the effect of long-term use.
該高導通層12為環繞包覆於高彈性線芯11外部,其高彈性線芯11的材料可為銀、銅或金等高導電度材質製成,而較佳為銀製成,其銀金屬為具有最佳的導電度。 The high-conductivity layer 12 is wrapped around the outside of the highly-elastic core 11. The material of the highly-elastic core 11 may be made of a highly conductive material such as silver, copper, or gold, and is preferably made of silver. For best electrical conductivity.
該抗氧化層13為環繞包覆於高導通層12外部,其抗氧化層13可以防止高導通層12發生氧化作用,且該抗氧化層13的材料較佳為金,其因金同時具有高抗氧化及高導電能力,而該探針1便可藉由高彈性線芯11、高導通層12及抗氧化層13來複合形成出一同軸探針1。 The anti-oxidation layer 13 is wrapped around the high-conductivity layer 12. The anti-oxidation layer 13 can prevent the high-conductivity layer 12 from oxidizing. The material of the anti-oxidation layer 13 is preferably gold. Anti-oxidation and high conductivity, and the probe 1 can be combined to form a coaxial probe 1 through a highly elastic wire core 11, a high-conductivity layer 12, and an anti-oxidation layer 13.
上述探針1之抗氧化層13外部為可環繞披覆有絕緣層14,其絕緣層14可為氟系樹脂、聚氨基甲酸酯(Polyurethane)、聚酯纖維、聚亞醯胺(Polyimide)或聚四氟乙烯(Polytetrafluoroethene)等絕緣材料,而較佳為聚四氟乙烯。 The outside of the anti-oxidation layer 13 of the above-mentioned probe 1 is surrounded by an insulating layer 14, and the insulating layer 14 may be a fluororesin, polyurethane, polyester fiber, or polyimide. Or an insulating material such as polytetrafluoroethene, and polytetrafluoroethylene is preferred.
本發明於實際使用時,係可應用於第五代行動通訊系統(5th generation wireless systems;簡稱5G)檢測裝置之探針座(圖中未示出)上,以供檢測應用於第五代行動通訊系統上的電子零件、設備等待測物(圖中未示出)電氣特性是否符合第五代行動通訊系統的高頻率需求,其檢測裝置之探針座中為可插設有複數探針1,當探針座執行檢測作業而使複數探針1接觸於待測物上的複數金屬接點時,其因各探針1為由高彈性線芯11、高導通層12及抗 氧化層13複合而成,即可透過高彈性線芯11所具之高彈力的特性,來增加探針1與金屬接點間的接合性,藉以提升傳導效率及接合穩定性,且高彈力之特性亦可減少高彈性線芯11或待測物上的金屬接點因受壓而產生刮傷、損壞等情形,又因高彈性線芯11外部包覆有高導通層12,所以便可利用高導通層12來使傳導速率可符合第五代行動通訊系統的高頻率需求,進而可藉由複數探針1來確實完成檢測應用於第五代行動通訊系統上的待測物之作業。 In practice, the present invention is applicable to a probe holder (not shown in the figure) of a 5th generation wireless systems (5G) detection device for detection and application to a 5th generation mobile system. Whether the electrical characteristics of the electronic parts and equipment on the communication system waiting to be measured (not shown) meet the high-frequency requirements of the fifth generation mobile communication system, a plurality of probes can be inserted into the probe holder of the detection device 1 When the probe holder performs a detection operation and the plurality of probes 1 contact the plurality of metal contacts on the object to be measured, it is because each probe 1 is composed of a highly elastic wire core 11, a high-conductivity layer 12 and a resistance The oxide layer 13 is compounded, and the high elasticity characteristic of the highly elastic core 11 can be used to increase the bonding between the probe 1 and the metal contact, thereby improving the conduction efficiency and the bonding stability. The characteristics can also reduce the occurrence of scratches and damages to the highly elastic core 11 or the metal contacts on the object under test due to pressure, and because the highly elastic core 11 is covered with a high-conductivity layer 12 on the outside, it can be used. The high-conductivity layer 12 enables the conduction rate to meet the high-frequency requirements of the fifth-generation mobile communication system, and then the plurality of probes 1 can be used to reliably complete the operation of detecting the object to be tested applied to the fifth-generation mobile communication system.
上述探針1之抗氧化層13外部為可環繞披覆有絕緣層14,即可利用絕緣層14來防止複數探針1於進行檢測作業時,其相鄰探針1之間相互接觸而發生短路之情況,且若絕緣層14為由聚四氟乙烯製成時,即可透過聚四氟乙烯製成之絕緣層14來進一步具有阻隔電磁訊號之功能,以可有效防止複數探針1於高頻傳輸的過程中所產生之電磁波、靜電或雜訊等,以防止發生複數構件間相互干擾之情形,藉此確保整體訊號傳輸的穩定性與可靠度,進而達到穩定使用及不易毀損之效果。 The outside of the anti-oxidation layer 13 of the above-mentioned probe 1 can be surrounded by an insulating layer 14 so that the insulating layer 14 can be used to prevent the multiple probes 1 from contacting each other during the detection operation. In the case of a short circuit, and if the insulating layer 14 is made of polytetrafluoroethylene, it can further have the function of blocking electromagnetic signals through the insulating layer 14 made of polytetrafluoroethylene to effectively prevent the plurality of probes 1 in Electromagnetic waves, static electricity, or noise generated during high-frequency transmission to prevent mutual interference between multiple components, thereby ensuring the stability and reliability of the overall signal transmission, and thus achieving the effects of stable use and non-destructibility .
本發明為具有下列之優點: The invention has the following advantages:
(一)該探針1為由高彈性線芯11、高導通層12及抗氧化層13組成,即可透過高彈性線芯11及高導通層12來同時具有高彈力及高導電度之特性,且可利用抗氧化層13來防止高導通層12發生氧化而影響導通速率,以可藉由高彈性線芯11、高導通層12及抗氧化層13來使此探針1具有高傳輸效率之功效,進而可供檢測需符合高頻率的待測物。 (1) The probe 1 is composed of a highly elastic core 11, a high-conductivity layer 12, and an anti-oxidation layer 13, and can pass through the high-elastic core 11 and the high-conductivity layer 12 to have characteristics of high elasticity and high conductivity at the same time. In addition, the anti-oxidation layer 13 can be used to prevent the high-conductivity layer 12 from oxidizing and affecting the conduction rate, so that the probe 1 can have high transmission efficiency through the high-elastic core 11, the high-conductivity layer 12, and the anti-oxidation layer 13. The efficacy of the device can be used to detect the test object that needs to meet the high frequency.
(二)該探針1之高彈性線芯11為可利用高彈性之特性 ,來減少高彈性線芯11或待測物上的金屬接點因受壓而產生刮傷、損壞等情形,藉以避免影響高彈性線芯11與金屬接點間的導電性,進而達到提升高彈性線芯11使用壽命之效用。 (2) The high-elasticity wire core 11 of the probe 1 is capable of utilizing high-elasticity To reduce the occurrence of scratches and damages to the metal contacts on the high-elastic core 11 or the object under test due to pressure, so as to avoid affecting the electrical conductivity between the high-elastic core 11 and the metal contacts, thereby achieving a high level of improvement. The useful life of the elastic core 11.
(三)該探針1為可利用環繞披覆之絕緣層14來防止複數探針1於進行檢測作業時,其複數探針1之間因相互接觸而發生短路之情況,以避免複數探針1受損、毀壞,進而達到提升檢測作業穩定性之效果。 (3) The probe 1 can be covered with an insulating layer 14 to prevent a plurality of probes 1 from being short-circuited due to contact with each other when a plurality of probes 1 are performing a detection operation, so as to avoid a plurality of probes 1 1 Damaged and destroyed, thereby achieving the effect of improving the stability of the inspection operation.
上述詳細說明為針對本發明一種較佳之可行實施例說明而已,惟該實施例並非用以限定本發明之申請專利範圍,凡其它未脫離本發明所揭示之技藝精神下所完成之均等變化與修飾變更,均應包含於本發明所涵蓋之專利範圍中。 The above detailed description is only a description of a preferred feasible embodiment of the present invention, but this embodiment is not intended to limit the scope of patent application of the present invention, and any other equivalent changes and modifications made without departing from the spirit of the technology disclosed by the present invention Changes should be included in the scope of patents covered by the present invention.
綜上所述,本發明上述運用於高頻測試之探針於實際應用、實施時,為確實能達到其功效及目的,故本發明誠為一實用性優異之研發,為符合發明專利之申請要件,爰依法提出申請,盼 審委早日賜准本案,以保障發明人之辛苦研發、創設,倘若 鈞局審委有任何稽疑,請不吝來函指示,發明人定當竭力配合,實感德便。 In summary, the above-mentioned probes for high-frequency testing are practically applied and implemented in order to achieve their efficacy and purpose. Therefore, the present invention is a research and development with excellent practicality, in order to comply with the application for invention patents In order to protect the inventor's hard research and development and creation, I hope that the trial committee will grant the case as soon as possible. If there is any suspicion in the jury of the Bureau, please follow the instructions of the letter, and the inventor will cooperate as hard as possible.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107104191A TWI669510B (en) | 2018-02-06 | 2018-02-06 | Probe for high frequency testing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107104191A TWI669510B (en) | 2018-02-06 | 2018-02-06 | Probe for high frequency testing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI669510B TWI669510B (en) | 2019-08-21 |
| TW201935007A true TW201935007A (en) | 2019-09-01 |
Family
ID=68316696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107104191A TWI669510B (en) | 2018-02-06 | 2018-02-06 | Probe for high frequency testing |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI669510B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI855403B (en) * | 2022-10-24 | 2024-09-11 | 洛克半導體材料股份有限公司 | Test probe and probe card |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002186627A (en) * | 2000-10-11 | 2002-07-02 | Olympus Optical Co Ltd | Ultrasonic manipulation device |
| TWI482973B (en) * | 2009-04-03 | 2015-05-01 | Nhk Spring Co Ltd | Wire material for spring, contact probe, and probe unit |
| JP5385930B2 (en) * | 2011-02-22 | 2014-01-08 | 富士フイルム株式会社 | Ultrasonic surgical device |
| US9797927B2 (en) * | 2015-01-23 | 2017-10-24 | Keysight Technologies, Inc. | Browser probe |
| TWM539623U (en) * | 2016-11-22 | 2017-04-11 | 旺矽科技股份有限公司 | Probe card |
-
2018
- 2018-02-06 TW TW107104191A patent/TWI669510B/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI855403B (en) * | 2022-10-24 | 2024-09-11 | 洛克半導體材料股份有限公司 | Test probe and probe card |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI669510B (en) | 2019-08-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4116523A (en) | High frequency probe | |
| KR101718865B1 (en) | Test Socket | |
| KR101186915B1 (en) | Contact structure for inspection | |
| WO2003093840A1 (en) | Connector for measuring electric resistance, apparatus and method for measuring electric resistance of circuit board | |
| CN107247163A (en) | A kind of integrated circuit component test jack and test platform | |
| KR102661984B1 (en) | Data signal transmission connector | |
| KR20100020793A (en) | Test socket for high-frequency semiconductor ic test | |
| TW201825920A (en) | Vertical ultra-low leakage current probe card for dc parameter test | |
| TWI669510B (en) | Probe for high frequency testing | |
| CN118330276A (en) | Socket apparatus for testing semiconductor device | |
| TWI383159B (en) | Electrical connection defect detection device | |
| US20120217977A1 (en) | Test apparatus for pci-e signals | |
| CN102116817B (en) | Electrical connection defect detection device | |
| KR20190125842A (en) | Anisotropic conductive sheet | |
| CN103808992A (en) | probe card structure with low power consumption | |
| TWM574692U (en) | Probe holder and test interface device | |
| TWM642096U (en) | Test carrier structure for electrical test | |
| KR101999834B1 (en) | Test Apparatus | |
| KR20150004537U (en) | Contact sheet and flexible printed circuit board | |
| US12144106B2 (en) | Electronic device | |
| TWI814357B (en) | Electronic device | |
| CN116963376A (en) | Electronic device | |
| JP2007298498A (en) | Method for reducing flaw when testing smd type passive element and test system | |
| CN210328131U (en) | Circuit board and electronic equipment | |
| CN217639370U (en) | Radio frequency electronic product testing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |