TW201923158A - Surface treatment device - Google Patents
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- TW201923158A TW201923158A TW107136459A TW107136459A TW201923158A TW 201923158 A TW201923158 A TW 201923158A TW 107136459 A TW107136459 A TW 107136459A TW 107136459 A TW107136459 A TW 107136459A TW 201923158 A TW201923158 A TW 201923158A
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- 238000004381 surface treatment Methods 0.000 title claims abstract description 25
- 230000007246 mechanism Effects 0.000 claims abstract description 18
- 239000007921 spray Substances 0.000 claims abstract description 3
- 238000012545 processing Methods 0.000 claims description 117
- 230000032258 transport Effects 0.000 claims description 22
- 238000012546 transfer Methods 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 15
- 239000012530 fluid Substances 0.000 abstract description 5
- 238000007747 plating Methods 0.000 description 43
- 238000011144 upstream manufacturing Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 230000005684 electric field Effects 0.000 description 10
- 238000009713 electroplating Methods 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000001052 transient effect Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000011143 downstream manufacturing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
本發明是關於將工件間歇搬運之表面處理裝置等。The present invention relates to a surface treatment device and the like for intermittently transferring workpieces.
在專利文獻1揭示一種電鍍裝置,是在收容有電鍍液之電鍍槽內將工件間歇搬運,於各停止位置於陽極和工件(陰極)間供應電流而將工件進行電鍍。在該裝置是採用循環式間歇搬運裝置(鏈輪及鏈條)來將工件間歇搬運,該循環式間歇搬運裝置是在電鍍槽、和配置於該電鍍槽的上游及/或下游之其他的前處理槽及/或後處理槽讓工件間歇搬運。Patent Literature 1 discloses a plating apparatus that intermittently transports workpieces in an electroplating tank that contains a plating solution, and supplies current between anode and workpiece (cathode) at each stop position to plate the workpiece. In this device, a circular intermittent conveying device (sprocket and chain) is used to intermittently convey the workpiece. The circular intermittent conveying device is used in the plating tank and other pretreatments arranged upstream and / or downstream of the plating tank. Tanks and / or post-processing tanks allow intermittent workpiece handling.
特別是在該電鍍裝置,是在電鍍槽內之各停止處位置將供應給工件的電流量累積,藉由控制裝置,當該累積值到達工件所需電流量時將昇降裝置驅動,讓用於支承搬運工件之懸吊具(hanger)移動到電鍍槽的上方,並解除對工件的通電。如此,例如可將流向多樣少量的工件之電流量個別地調整,而能對各工件個別地調整鍍膜厚。
[先前技術文獻]
[專利文獻]Especially in this electroplating device, the amount of current supplied to the workpiece is accumulated at each stop position in the electroplating tank. With the control device, when the accumulated value reaches the amount of current required by the workpiece, the lifting device is driven and used for A hanger supporting and carrying the workpiece is moved above the plating tank, and the power to the workpiece is released. In this way, for example, the amount of current flowing to a variety of small workpieces can be individually adjusted, and the thickness of the plating film can be individually adjusted for each workpiece.
[Prior technical literature]
[Patent Literature]
[專利文獻1] 日本特許第2727250號公報[Patent Document 1] Japanese Patent No. 2727250
[發明所欲解決之問題][Problems to be solved by the invention]
作為電解電鍍裝置,將朝向工件噴出電鍍液之噴管固定配置於電鍍槽內是已知的。專利文獻1的電鍍裝置,並未使用噴管,並沒有認識到在間歇搬運的電鍍槽內配置噴管時的問題。As an electrolytic plating device, it is known to fix a nozzle which discharges a plating solution toward a workpiece in a plating bath. The plating apparatus of Patent Document 1 does not use a nozzle, and does not recognize a problem when the nozzle is arranged in a plating tank that is intermittently transported.
專利文獻1的電鍍裝置是使用:在電鍍槽及其他處理槽讓工件間歇搬運之循環式間歇搬運裝置(鏈輪及鏈條)、以及讓各個工件的治具(懸吊具)個別地昇降之昇降機構,因此裝置變得大型化。此外,不管是間歇搬運還是連續搬運,處理量(throughput)都會受電鍍槽之全長的影響,因此必須準備電鍍槽的全長不同之各種電鍍裝置的陣容(line-up)。此時,必須將包含循環式間歇搬運裝置的裝置整體重新設計。The electroplating device of Patent Document 1 uses a circulating intermittent conveying device (sprocket and chain) for intermittently conveying workpieces in an electroplating tank and other processing tanks, and a lifting device for lifting and lowering a jig (suspender) of each workpiece individually. Mechanism, so the device becomes larger. In addition, the throughput is affected by the entire length of the plating tank whether it is intermittent or continuous. Therefore, it is necessary to prepare a line-up of various plating apparatuses having different lengths of the plating tank. In this case, it is necessary to redesign the entire device including the circulating intermittent conveying device.
本發明之至少一態樣,其目的是為了提供一種間歇搬運式的表面處理裝置,縱使併用朝向在處理槽內間歇停止而被處理的工件噴出處理液之噴管,仍可確保被處理的工件之面內均一性。It is an object of at least one aspect of the present invention to provide an intermittent conveyance type surface treatment device, which can ensure the workpiece to be processed even if a nozzle for spraying a processing liquid toward a workpiece being intermittently stopped in a processing tank is used in combination In-plane uniformity.
本發明之其他的至少一態樣,其目的是為了提供一種間歇搬運式的表面處理裝置,讓具有共同的構造之處理槽單元連結,可橫跨處理槽的全長進行流向工件的電流控制及間歇搬運。
[解決問題之技術手段]It is an object of another aspect of the present invention to provide an intermittent-conveying surface treatment device that connects processing tank units having a common structure and can perform current control and intermittent current flow to a workpiece across the entire length of the processing tank. Moving.
[Technical means to solve the problem]
(1)本發明的一態樣,是關於一種表面處理裝置,其係具有:處理槽、至少一個陽極、至少1根陰極軌道、間歇搬運裝置、複數個噴管、及移動機構,
前述處理槽,是用於收容處理液,
前述至少一個陽極,是配置於前述處理槽內,
前述間歇搬運裝置,是將複數個治具以前述處理槽內的複數個停止位置作為起點及/或終點而間歇地搬運,前述複數個治具是將浸漬於前述處理液之複數個工件各個以垂下的方式保持,且與前述至少1根陰極軌道接觸而將前述複數個工件設定為陰極,
前述複數個噴管,在前述處理槽內,俯視下在停止於前述複數個停止位置各個之工件和前述至少一個陽極之間配置至少一個,且用於對前述工件噴出前述處理液,
前述移動機構,是讓前述複數個噴管各個相對於間歇停止之相對應的工件進行掃描移動。(1) An aspect of the present invention relates to a surface treatment device having a treatment tank, at least one anode, at least one cathode track, an intermittent transfer device, a plurality of nozzles, and a moving mechanism.
The processing tank is used to store a processing liquid,
The at least one anode is disposed in the processing tank.
The intermittent conveying device intermittently transports a plurality of jigs with a plurality of stop positions in the processing tank as a starting point and / or an end point. The plurality of jigs each compress a plurality of workpieces immersed in the processing liquid to The plurality of workpieces are set as cathodes while being held in a hanging manner and in contact with the at least one cathode rail,
The plurality of nozzles are arranged in the processing tank in plan view between at least one workpiece stopped at each of the plurality of stopped positions and the at least one anode, and are used to spray the processing liquid onto the workpiece,
The moving mechanism is configured to scan and move each of the plurality of nozzles with respect to a workpiece corresponding to an intermittent stop.
依據本發明的一態樣,相對於間歇停止的工件,能讓與工件的停止位置對應而設置至少一個的噴管進行掃描移動。如此,俯視下成為位於工件和陽極之間的噴管之影子而使陽極-陰極間的電場受干擾的區域,會隨著噴管的掃描移動而移動。因此,電場受噴管干擾的區域不是固定的,而使被處理之工件的面內均一性提高。According to one aspect of the present invention, it is possible to scan and move at least one nozzle provided corresponding to the stop position of the workpiece with respect to the intermittently stopped workpiece. In this way, the area that becomes the shadow of the nozzle located between the workpiece and the anode in plan view and disturbs the electric field between the anode and the cathode moves with the scanning movement of the nozzle. Therefore, the area where the electric field is disturbed by the nozzle is not fixed, and the in-plane uniformity of the workpiece to be processed is improved.
(2)在本發明的一態樣(1)可構成為,前述移動機構,是以與在前述複數個停止位置停止之前述複數個工件各個之至少水平寬度對應的長度範圍進行至少一次循環掃描的方式,讓前述複數個噴管移動。如此,使被處理之工件的面內均一性提高。較佳為,讓噴管從初期位置進行至少一次循環掃描後再返回初期位置。這是因為,使噴管的影子在工件面內變得大致均一化。(2) In one aspect of the present invention (1), the moving mechanism may be configured to scan at least once in a length range corresponding to at least a horizontal width of each of the plurality of workpieces stopped at the plurality of stop positions. Way, let the aforementioned plurality of nozzles move. In this way, the uniformity of the workpiece to be processed is improved. Preferably, the nozzle is scanned at least once from the initial position and then returned to the initial position. This is because the shadow of the nozzle becomes substantially uniform within the workpiece surface.
(3)在本發明之一態樣(1)或(2)可構成為,前述複數個噴管係包含:配置於與在前述複數個停止位置停止之前述複數個工件各個相對向的各位置之至少2個噴管,前述至少2個噴管,係在垂直方向之不同位置含有前述處理液之複數個噴出口。藉由讓前述至少2根噴管對於工件進行掃描移動,處理液未直接噴射的偏差變少,而使被處理的工件之面內均一性提高。(3) In one aspect of the present invention (1) or (2), the plurality of nozzles may include a plurality of nozzles arranged at positions opposite to each of the plurality of workpieces stopped at the plurality of stop positions. The at least two nozzles and the at least two nozzles each include a plurality of nozzles of the processing liquid at different positions in the vertical direction. By allowing the at least two nozzles to scan and move the workpiece, the deviation in which the processing liquid is not directly sprayed is reduced, and the in-plane uniformity of the processed workpiece is improved.
(4)在本發明之一態樣(1)~(3)可構成為,前述處理槽係包含互相連結的複數個分割處理槽,相鄰的2個分割處理槽是透過讓前述複數個工件通過的開口來連通,前述一個陽極、前述至少1根陰極軌道、前述至少一個噴管、前述間歇搬運裝置及前述移動機構,是在前述複數個分割處理槽各個分別配置,設置於前述複數個分割處理槽各個之前述至少一個陽極和前述至少1根陰極軌道是連接於至少一個整流器。如此,不須進行裝置全體的重新設計,調整分割處理槽的數量即可輕易地構成為具有符合使用者要求的長度的處理槽之間歇搬運式表面處理裝置。(4) In one aspect of the present invention (1) to (3), the processing tank may include a plurality of divided processing tanks connected to each other, and the adjacent two divided processing tanks may be configured by letting the plurality of workpieces The one opening, the at least one cathode track, the at least one nozzle, the intermittent conveying device, and the moving mechanism are respectively communicated through the openings, and are respectively disposed in the plurality of division processing tanks, and are disposed in the plurality of divisions. The aforementioned at least one anode and the aforementioned at least one cathode track of each of the processing tanks are connected to at least one rectifier. In this way, it is not necessary to redesign the entire device, and it can be easily constituted as an intermittent conveyance type surface treatment device having a treatment tank with a length that meets the requirements of the user by adjusting the number of divided processing tanks.
(5)本發明的其他態樣是關於一種表面處理裝置,其係由複數個處理單元連結而成的表面處理裝置,
前述複數個處理單元各個係具有:分割處理槽、至少一個陽極、至少1根陰極軌道、間歇搬運裝置、及至少一個整流器,
前述分割處理槽,是用於收容處理液,
前述至少一個陽極,是配置於前述分割處理槽內,
前述間歇搬運裝置,是將複數個治具以前述分割處理槽內的複數個停止位置作為起點及/或終點而間歇地搬運,前述複數個治具是將浸漬於前述處理液之複數個工件分別保持,且與前述至少1根陰極軌道接觸而將前述複數個工件設定為陰極,
前述至少一個整流器,是連接於前述至少一個陽極和前述至少1根陰極軌道,
相鄰的2個分割處理槽,是透過讓前述複數個工件通過的開口來連通。(5) Another aspect of the present invention relates to a surface treatment device, which is a surface treatment device connected by a plurality of processing units.
Each of the plurality of processing units has: a divided processing tank, at least one anode, at least one cathode track, an intermittent transfer device, and at least one rectifier,
The division processing tank is used to store a processing liquid,
The at least one anode is disposed in the division processing tank.
The intermittent conveying device intermittently conveys a plurality of jigs with a plurality of stop positions in the divided processing tank as a starting point and / or an end point. The plurality of jigs respectively immerse a plurality of workpieces immersed in the processing liquid. Hold, and contact the at least one cathode rail to set the plurality of workpieces as cathodes,
The at least one rectifier is connected to the at least one anode and the at least one cathode track.
Two adjacent divided processing tanks communicate with each other through an opening through which the plurality of workpieces pass.
依據本發明的其他態樣,複數個處理單元各個是分別獨立地具有:分割處理槽、一個陽極、至少1根陰極軌道、間歇搬運裝置及至少一個整流器。因此,不須進行裝置全體的重新設計,調整處理單元的數量即可輕易地構成為具有符合使用者要求的長度的處理槽之間歇搬運式表面處理裝置。According to other aspects of the present invention, each of the plurality of processing units has a separate processing tank, an anode, at least one cathode track, an intermittent transfer device, and at least one rectifier. Therefore, it is not necessary to redesign the entire device, and it can be easily configured as an intermittent conveyance type surface treatment device having a treatment tank with a length that meets the user's requirements by adjusting the number of processing units.
(6)在本發明的其他態樣(5)可構成為,前述間歇搬運裝置係包含:具備複數個推動片且被進退驅動的推動器,前述推動器,當前進時由前述複數個推動片推動前述複數個治具之複數個被推動片而讓前述複數個工件前進,當後退時使前述複數個推動片和前述複數個被推動片的卡合解除而返回初期位置。如此,藉由推動器,使複數個治具在分割處理槽內或相鄰的分割處理槽間同時地移動一步而被間歇搬運。(6) In another aspect of the present invention (5), the intermittent conveying device may include a pusher provided with a plurality of pushers and driven forward and backward, and the pusher may be driven by the plurality of pushers in advance. The plurality of pushed pieces of the plurality of jigs are pushed to advance the plurality of workpieces, and when retreating, the engagement between the plurality of pushed pieces and the plurality of pushed pieces is released and returned to the initial position. In this way, a plurality of jigs are simultaneously moved by one step in the divided processing tank or between adjacent divided processing tanks by the pusher to be intermittently transported.
(7)在本發明的其他態樣(5)可構成為,前述間歇搬運裝置係包含:具備複數個推動片而被進退驅動及昇降驅動之推動器,前述複數個推動片係包含:藉由前述推動器的昇降動作之一方來配置設置於前述複數個治具的複數個被推動片之凹部,藉由前述推動器的昇降動作之另一方而使前述複數個被推動片從前述凹部脫離,前述推動器,當前進時由前述複數個推動片推動前述複數個被推動片而讓前述複數個工件前進,且當前進停止時讓前述複數個工件停止,當前述複數個被推動片從前述凹部脫離之後退時返回初期位置。如此,藉由推動器,使複數個治具在分割處理槽內或相鄰的分割處理槽間同時地移動一步而被間歇搬運。特別是,藉由凹部和被推動片的卡合,可讓複數個治具停止於既定的位置,而能進行更高速的間歇搬運。(7) In another aspect of the present invention (5), the intermittent conveyance device may include a pusher provided with a plurality of pushers and driven forward and backward and lifted and driven, and the plurality of pushers may include: One of the upward and downward movements of the pusher is configured to arrange the recessed portions of the plurality of pushed pieces that are provided on the plurality of jigs, and the plurality of pushed pieces are separated from the concave portion by the other of the upward and downward movements of the pusher. In the pusher, the plurality of pushed pieces are pushed by the plurality of pushing pieces to advance the plurality of workpieces when the forward advancement is made, and the plurality of workpieces are stopped when the forward movement is stopped, and the plurality of pushed pieces are stopped from the recess when the forward movement is stopped. Return to the initial position when you retreat. In this way, a plurality of jigs are simultaneously moved by one step in the divided processing tank or between adjacent divided processing tanks by the pusher to be intermittently transported. In particular, by engaging the recessed portion with the pushed piece, a plurality of jigs can be stopped at a predetermined position, and intermittent conveyance at a higher speed can be performed.
(8)在本發明的一態樣(4)及其他態樣(5)~(7)可構成為,前述至少一個整流器係包含:與前述複數個停止位置的數量一致之複數個整流器,前述至少1根陰極軌道係包含:與分別停止於前述複數個停止位置之前述複數個治具分別接觸且被電氣絕緣之複數個導電部,前述複數個導電部分別連接於前述複數個整流器各個。如此,複數個工件的陰極側被絕緣且分別連接於複數個整流器各個,因此可將流過複數個工件之電流個別地控制。(8) In one aspect (4) and other aspects (5) to (7) of the present invention, the at least one rectifier may include: a plurality of rectifiers consistent with the number of the plurality of stop positions, the foregoing At least one cathode track system includes: a plurality of conductive portions which are in contact with and electrically insulated from the plurality of jigs stopped at the plurality of stop positions, respectively, and the plurality of conductive portions are connected to each of the plurality of rectifiers. In this way, since the cathode sides of the plurality of workpieces are insulated and connected to each of the plurality of rectifiers, the current flowing through the plurality of workpieces can be individually controlled.
(9)在本發明之其他態樣(8)可構成為,前述至少一個陽極係包含:與前述複數個停止位置的數量一致之複數個陽極,前述複數個陽極分別連接於前述複數個整流器各個。如此,關於複數個工件各個,因為陰極及陽極被絕緣,對每個工件可完全個別地供電。(9) In another aspect of the present invention (8), the at least one anode system may include a plurality of anodes consistent with the number of the plurality of stop positions, and the plurality of anodes are respectively connected to each of the plurality of rectifiers. . As described above, since each of the plurality of workpieces is insulated, the cathode and the anode can be individually and individually powered.
以下,針對本發明的較佳實施形態詳細地說明。又以下所說明之本實施形態,並不是用於對申請專利範圍所記載之本發明的內容做不當地限定,本實施形態所說明的構成全體,作為本發明的解決手段不一定是必須的。Hereinafter, preferred embodiments of the present invention will be described in detail. In addition, this embodiment described below is not intended to improperly limit the content of the present invention described in the scope of patent application, and the entire structure described in this embodiment is not necessarily necessary as a means of solving the present invention.
1. 複數個處理單元
圖1係本實施形態之間歇搬運式的電鍍裝置(廣義來說,表面處理裝置)之剖面圖。圖1中,該電鍍裝置1中,用於將電路基板等的工件2電鍍之電鍍處理部是將複數個處理單元3-1~3-n(n為2以上的整數)連結而構成。複數個處理單元3-1~3-n可具有實質相同的構造。在複數個處理單元3-1~3-n各個,可讓至少一個、圖1為例如4個工件2間歇停止。圖1顯示最大尺寸的工件2,電鍍裝置1具有可處理該最大尺寸以下的工件2之通用性。1. A plurality of processing units FIG. 1 is a cross-sectional view of a batch-type plating apparatus (broadly speaking, a surface treatment apparatus) according to this embodiment. In FIG. 1, in the plating apparatus 1, a plating processing unit for plating a workpiece 2 such as a circuit board is configured by connecting a plurality of processing units 3-1 to 3-n (n is an integer of 2 or more). The plurality of processing units 3-1 to 3-n may have substantially the same structure. In each of the plurality of processing units 3-1 to 3-n, at least one of them can be stopped intermittently, as shown in FIG. FIG. 1 shows a workpiece 2 of the largest size, and the electroplating device 1 has the versatility to process the workpiece 2 below the largest size.
工件2,是藉由後述的間歇搬運裝置,從現在的停止位置朝向下一個停止位置沿A方向依序被間歇搬運。在本實施形態,一個工件2是在各處理單元內停止於例如4處。亦可在最上游之處理單元3-1之上游側連結搬入單元4,搬入單元4是藉由往B方向的下降移動而將工件2搬入。當處理單元3-1內的工件2被間歇搬運時,搬入單元4內的工件2也被間歇搬運而移動到處理單元3-1。亦可在最下游的處理單元3-n之下游側連結搬出單元5,搬出單元5是讓從處理單元3-n水平移動的工件2往C方向上昇而將其搬出。在處理單元3-n內的工件2被間歇搬運之前,搬出單元5內的工件2被往上方搬出。但將搬入單元4及/或搬出單元5省略亦可。在此情況,是在處理單元3-1之最上游停止位置讓工件2下降,讓處理單元3-n之最下游停止位置的工件2上昇而被搬出。The workpiece 2 is intermittently transported in order from the current stop position to the next stop position in the direction A by an intermittent conveyance device described later. In this embodiment, one workpiece 2 is stopped at, for example, four places in each processing unit. The carry-in unit 4 may be connected upstream of the processing unit 3-1 on the most upstream side. The carry-in unit 4 may carry in the workpiece 2 by moving downward in the B direction. When the workpiece 2 in the processing unit 3-1 is intermittently transferred, the workpiece 2 in the loading unit 4 is also intermittently transferred and moved to the processing unit 3-1. The unloading unit 5 may be connected to the downstream side of the most downstream processing unit 3-n. The unloading unit 5 raises the workpiece 2 horizontally moved from the processing unit 3-n to the C direction and unloads it. Before the workpiece 2 in the processing unit 3-n is intermittently transferred, the workpiece 2 in the unloading unit 5 is unloaded upward. However, the carrying-in unit 4 and / or the carrying-out unit 5 may be omitted. In this case, the workpiece 2 is lowered at the most upstream stop position of the processing unit 3-1, and the workpiece 2 at the most downstream stop position of the processing unit 3-n is raised and carried out.
圖2係具有與處理單元3-2~3-n共同的構造之處理單元3-1的俯視圖。處理單元3-1具有:用於收容電鍍液(廣義來說,處理液)之分割處理槽6。工件2浸漬於分割處理槽6內的電鍍液。分割處理槽6是在上方開口之大致箱體,在上游側及下游側的間隔壁分別設有開口6A,6B,藉此在相鄰的單元(處理單元、搬入單元或搬出單元)間容許工件2的水平移動。FIG. 2 is a plan view of a processing unit 3-1 having a structure common to the processing units 3-2 to 3-n. The processing unit 3-1 includes a divided processing tank 6 for containing a plating solution (broadly speaking, a processing solution). The work 2 is immersed in a plating solution in the division processing tank 6. The divided processing tank 6 is a roughly box body opened at the upper side, and openings 6A and 6B are provided on the partition walls on the upstream side and the downstream side, respectively, thereby allowing workpieces between adjacent units (processing unit, carry-in unit, or carry-out unit). 2 horizontal movement.
在本實施形態,在位於處理單元3-1內的複數、例如4個停止位置的工件2之表面及背面的至少一側設有至少一個陽極20。在本實施形態是設有:與位於各停止位置之各一個工件2之表面相對向之陽極20A、及與工件2的背面相對向之陽極20B。陽極20(20A,20B)各個可包含:互相導通之複數個分割陽極。在本實施形態,是分割成上游側的分割陽極20A1(20B1)和下游側的分割陽極20A2(20B2)。陽極20亦可包含分割成3個以上之分割陽極,因為互相導通而可視為一個陽極。In this embodiment, at least one anode 20 is provided on at least one of the front surface and the back surface of a plurality of workpieces 3-1 in the processing unit 3-1, for example, at four stop positions. In this embodiment, an anode 20A facing the surface of each work 2 located at each stop position and an anode 20B facing the back surface of the work 2 are provided. Each of the anodes 20 (20A, 20B) may include: a plurality of divided anodes which are conductive with each other. In this embodiment, it is divided into an upstream divided anode 20A1 (20B1) and a downstream divided anode 20A2 (20B2). The anode 20 may also include three or more divided anodes, which can be regarded as one anode because of mutual conduction.
圖3係顯示配置於處理單元3-1之陽極20A1,20A2(20B1,20B2)和工件2的位置關係之前視圖。如圖3所示般,工件2是藉由搬運治具30保持。如圖2及圖3所示般,陽極20(20A,20B)各個配置成,正對著位於4個停止位置之工件2。要點在於,如圖2所示般,只要能在設定成陰極之工件2和陽極20之間形成均一的電場即可。陽極20的形狀沒有特別的限制,圖2及圖3所示的陽極的輪廓雖呈矩形,但俯視下的輪廓呈圓形亦可。陽極是不溶性陽極或可溶性陽極皆可。FIG. 3 is a front view showing the positional relationship between the anodes 20A1, 20A2 (20B1, 20B2) and the workpiece 2 disposed in the processing unit 3-1. As shown in FIG. 3, the workpiece 2 is held by a transfer jig 30. As shown in FIG. 2 and FIG. 3, the anodes 20 (20A, 20B) are each arranged so as to face the workpiece 2 located at the four stop positions. The point is that, as shown in FIG. 2, a uniform electric field may be formed between the workpiece 2 set as a cathode and the anode 20. The shape of the anode 20 is not particularly limited. Although the outline of the anode shown in FIGS. 2 and 3 is rectangular, the outline in plan view may be circular. The anode may be either an insoluble anode or a soluble anode.
在本實施形態可具有:將一個處理單元3-1區劃成4個槽室11-1~11-4之遮蔽板23。在各槽室11-1~11-4內,於俯視下之工件2的兩側配置陽極20(20A1,20A2,20B1,20B2)。遮蔽板23是用於遮蔽在相鄰的槽室間之電場(圖2之箭頭所示之陽極-陰極間的電場)的影響。在遮蔽板23形成有:讓工件2通過之開口23A。This embodiment may include a shielding plate 23 that divides one processing unit 3-1 into four tank chambers 11-1 to 11-4. In each of the chambers 11-1 to 11-4, anodes 20 (20A1, 20A2, 20B1, 20B2) are arranged on both sides of the workpiece 2 in a plan view. The shielding plate 23 is used to shield the influence of the electric field (the electric field between the anode and the cathode shown by the arrow in FIG. 2) between the adjacent cells. The shielding plate 23 is formed with an opening 23A through which the workpiece 2 passes.
2. 搬運治具
圖4顯示搬運治具30的一例。該搬運治具30係具有:水平臂部300、垂直臂部310、工件保持部320、被導引部330、被供電部340、被推動片350。水平臂部300是沿著與間歇搬運方向A正交之方向B延伸。垂直臂部310是藉由水平臂部300以垂下的方式保持。工件保持部320固定於垂直臂部310。工件保持部320係包含:上部框架321、藉由上部框架321例如可昇降地支承之下部框架322。在上部框架321設置:用於夾持工件2的上部之複數個夾持器323。在下部框架322設置:用於夾持工件2的下部之複數個夾持器324。利用下部的夾持器324,對工件2賦予向下的張力。但當工件2較厚的情況,或從工件2的下部不供電的情況,可將下部框架322及夾持器324省略。2. Carrying Jig FIG. 4 shows an example of a carrying jig 30. The transport jig 30 includes a horizontal arm portion 300, a vertical arm portion 310, a work holding portion 320, a guided portion 330, a powered portion 340, and a pushed piece 350. The horizontal arm portion 300 extends in a direction B orthogonal to the intermittent conveying direction A. The vertical arm portion 310 is held down by the horizontal arm portion 300. The work holding portion 320 is fixed to the vertical arm portion 310. The work holding unit 320 includes an upper frame 321 and a lower frame 322 supported by the upper frame 321 so as to be movable up and down, for example. The upper frame 321 is provided with a plurality of holders 323 for holding the upper portion of the work 2. The lower frame 322 is provided with a plurality of holders 324 for holding the lower portion of the workpiece 2. The lower gripper 324 applies downward tension to the work 2. However, when the workpiece 2 is thick or when no power is supplied from the lower portion of the workpiece 2, the lower frame 322 and the holder 324 may be omitted.
被導引部330,是藉由沿著處理單元3-2~3-n配置而在例如以每個處理單元3-2~3-n為單位而被分割的導軌(未圖示)導引,且是用於將搬運治具30進行直線導引。被導引部330可包含:與導軌的頂面轉動接觸之滾子331、及與導軌的兩側面轉動接觸之滾子332(圖4中,僅圖示出與一側面轉動接觸之滾子)。The guided portion 330 is guided by a guide (not shown) that is divided along each of the processing units 3-2 to 3-n by being arranged along the processing units 3-2 to 3-n. , And is used to linearly guide the carrying jig 30. The guided portion 330 may include a roller 331 in rotational contact with the top surface of the guide rail, and rollers 332 in rotational contact with both sides of the guide rail (in FIG. 4, only the rollers in rotational contact with one side are shown) .
被供電部340,是與圖5及圖6所說明之陰極軌道接觸,透過搬運治具30的水平臂部300、垂直臂部310、工件保持部320而將工件2設定成陰極。被供電部340係包含:藉由沿著間歇搬運方向A延伸之支承臂341的上游側和下游側支承之2個接觸子342,343。接觸子342,343,是透過平行連桿機構而藉由支承臂341支承,且以壓接於陰極軌道的方式被彈簧蓄勢。2個接觸子342,343是與夾持器323,324之至少一方電氣連接,藉此將工件2設定成陰極。The powered portion 340 is in contact with the cathode rail described with reference to FIGS. 5 and 6, and sets the workpiece 2 as a cathode through the horizontal arm portion 300, the vertical arm portion 310, and the workpiece holding portion 320 of the conveyance jig 30. The powered portion 340 includes two contacts 342 and 343 supported by the upstream and downstream sides of the support arm 341 extending along the intermittent conveying direction A. The contacts 342 and 343 are supported by a support arm 341 through a parallel link mechanism, and are charged by a spring so as to be crimped to the cathode track. The two contacts 342 and 343 are electrically connected to at least one of the holders 323 and 324 to set the workpiece 2 as a cathode.
被推動片350,是固定於例如垂直臂部310,在工件保持部320之正上方位置將被推動片350垂直地配置。被推動片350是藉由後述的間歇搬運裝置從圖示C方向推動,而對搬運治具30傳遞間歇搬運力。在圖4所示的搬運治具30設有:使用於連續搬運時之被卡合部360,而讓搬運治具30可兼用於間歇搬運及連續搬運。The pushed piece 350 is fixed to, for example, the vertical arm portion 310, and the pushed piece 350 is vertically arranged at a position directly above the workpiece holding portion 320. The pushed piece 350 is pushed from the direction C shown in the figure by an intermittent conveying device described later, and transmits the intermittent conveying force to the conveying jig 30. The conveyance jig 30 shown in FIG. 4 is provided with an engaged portion 360 for continuous conveyance, and the conveyance jig 30 can be used for both intermittent conveyance and continuous conveyance.
3. 陰極軌道及整流器
如圖5所示般,各處理單元3-1~3-n(圖5僅圖示出2個處理單元)係具有至少1根陰極軌道40。陰極軌道40亦可與搬運方向A平行地將複數根並列配置。在此情況,複數根陰極軌道40可連接於相同的整流器,亦可連接於不同的整流器,而對每個供電部位將電流值獨立地控制。在本實施形態是設置1根陰極軌道40。1根陰極軌道40較佳為具有:以每個處理單元3-1~3-n為單位而被分割之複數根分割陰極軌道40-1~40-n(圖5僅圖示出2個分割陰極軌道40-1,40-2),且連結成在搬運方向A呈連續。如圖5及圖6(A)所示般,分割陰極軌道40-1~40-n各個,在絕緣軌道41上隔著間隔(非導電部)42而在讓工件2停止之各槽室分別設置一個導電部43,即合計設有4個導電部43。4個導電部43各個,是在各處理單元3-1~3-n之4處的停止位置,與將工件2保持而停止後之圖4所示的搬運治具30之被供電部340(2個接觸子342,343)電氣導通。又在圖5顯示在各處理單元3-1~3-n所收容之電鍍液的液面L,工件2浸漬於電鍍液中。又如圖6(B)所示般,在陰極軌道40之寬度方向的兩端設有間隔壁44,44,藉此可在導電部43上保持非油性的導電性流體(例如水)45。如此般,透過導電性流體45可更確實地保證被供電部340(2個接觸子342,343)和導電部43的電氣接觸。但因為水的導電性比金屬製之導電部43的導電性低得多,相鄰的導電部43,43間的絕緣性被維持住。此外,如圖6(B)所示般,用於將導電部43固定在絕緣軌道41上之螺栓46,可配置在隔著被供電部340之行進路線的兩側。藉此,不須在導電部34設置螺栓的埋頭孔,可排除形成電阻的主要原因。3. Cathode track and rectifier As shown in FIG. 5, each processing unit 3-1 to 3-n (only two processing units are shown in FIG. 5) has at least one cathode track 40. The cathode rails 40 may be arranged in parallel in parallel to the conveyance direction A. In this case, the plurality of cathode rails 40 can be connected to the same rectifier or different rectifiers, and the current value can be controlled independently for each power supply part. In this embodiment, one cathode track 40 is provided. One cathode track 40 is preferably provided with a plurality of divided cathode tracks 40-1 to 40 divided by each processing unit 3-1 to 3-n. -n (only two divided cathode rails 40-1 and 40-2 are shown in FIG. 5), and are connected to be continuous in the conveying direction A. As shown in FIG. 5 and FIG. 6 (A), each of the cathode rails 40-1 to 40-n is divided, and each of the tank chambers for stopping the workpiece 2 is separated from each other by a gap (non-conductive portion) 42 on the insulating rail 41. One conductive part 43 is provided, that is, a total of four conductive parts 43 are provided. Each of the four conductive parts 43 is a stop position at four of each processing unit 3-1 to 3-n, and after holding the workpiece 2 to stop The powered part 340 (two contacts 342, 343) of the carrying jig 30 shown in FIG. 4 is electrically conductive. FIG. 5 also shows a liquid surface L of the plating solution contained in each of the processing units 3-1 to 3-n, and the workpiece 2 is immersed in the plating solution. As shown in FIG. 6 (B), partition walls 44 and 44 are provided at both ends in the width direction of the cathode rail 40, so that a non-oily conductive fluid (for example, water) 45 can be held on the conductive portion 43. In this way, the electrical contact between the power-supplying portion 340 (two contacts 342 and 343) and the conductive portion 43 can be more reliably ensured through the conductive fluid 45. However, since the conductivity of water is much lower than that of the conductive portion 43 made of metal, the insulation between adjacent conductive portions 43 and 43 is maintained. In addition, as shown in FIG. 6 (B), the bolts 46 for fixing the conductive portion 43 to the insulating rail 41 may be disposed on both sides of the travel route across the powered portion 340. Thereby, it is not necessary to provide a countersunk hole of a bolt in the conductive portion 34, and the main cause of resistance formation can be eliminated.
各處理單元3-1~3-n,是在讓工件2停止的各槽室分別設有一個整流器50,即合計具有4個整流器50(圖5僅圖示出一個整流器50)。4個整流器50之各一個正端子51,是與配置於各槽室之陽極20(20A1,20A2,20B1,20B2)連接。4個整流器50之各一個負端子52,是與分割陰極軌道40-1~40-n之對應於各一個槽室之導電部43連接。Each of the processing units 3-1 to 3-n is provided with a rectifier 50 in each of the chambers for stopping the workpiece 2, that is, a total of four rectifiers 50 (only one rectifier 50 is shown in FIG. 5). One positive terminal 51 of each of the four rectifiers 50 is connected to an anode 20 (20A1, 20A2, 20B1, 20B2) arranged in each tank. One negative terminal 52 of each of the four rectifiers 50 is connected to the conductive portion 43 corresponding to each of the compartments of the divided cathode rails 40-1 to 40-n.
4. 工件停止時的電流控制
在各處理單元3-1~3-n之4處的停止位置(槽室)流過4個工件2之電流,是藉由在每個槽室分別設置一個之整流器50各個獨立地控制。而且,在槽室間是讓陰極彼此絕緣且陽極彼此絕緣,因此是讓每個工件2絕緣分離,而能利用各整流器50將工件2個別地進行供電控制。此外,在槽室間是藉由遮蔽板23將電場分離,因此可將槽室間的影響排除,而能保證每個工件2之個別供電。如此,能使工件2的電鍍品質提高。4. Current control when the workpiece is stopped 4 currents of 2 workpieces flow through the stopping positions (slot chambers) at 4 places of each processing unit 3-1 ~ 3-n. The rectifiers 50 are each independently controlled. In addition, since the cathodes are insulated from each other and the anodes are insulated from each other between the chambers, each work 2 is insulated and separated, and the work 2 can be individually controlled for power supply by each rectifier 50. In addition, since the electric field is separated between the chambers by the shielding plate 23, the influence between the chambers can be eliminated, and the individual power supply of each workpiece 2 can be guaranteed. In this way, the plating quality of the workpiece 2 can be improved.
本實施形態的間歇搬運方式,與習知之連續搬運方式進行比對的結果,習知之被連續搬運的工件(陰極)和被固定的陽極之位置關係不斷改變,反而本實施形態之停止的工件(陰極)2是可正對著陽極20。如此般,在工件2停止中,陰極和陽極的位置關係成為一定,各工件成為同一電鍍條件,因此可期待電鍍品質的提高。特別是如果工件2停止的話,接觸電阻的變動就不會發生,因此可進行精密的電流控制。此外,在連續搬運所使用之很長的陰極軌道途中設有固定螺栓用的埋頭孔等,因此陰極軌道的電阻值會因場所而有不同,無法成為均一的電阻。因此,依工件之連續搬運中的位置,流過工件的電流會有不同,間歇搬運則可解決這樣的問題。再者,本實施形態也不像連續搬運那樣,電鍍品質並不會受工件的連續搬運速度之不良影響。As a result of the comparison between the intermittent conveyance method of this embodiment and the conventional continuous conveyance method, the positional relationship between the workpiece (cathode) being continuously conveyed and the fixed anode is known to change continuously. Instead, the stopped workpiece ( The cathode) 2 is directly opposite the anode 20. In this way, when the workpiece 2 is stopped, the positional relationship between the cathode and the anode becomes constant, and the workpieces are under the same plating conditions. Therefore, the improvement in the plating quality can be expected. In particular, if the workpiece 2 is stopped, fluctuations in the contact resistance do not occur, so precise current control can be performed. In addition, since a long cathode track used for continuous transportation is provided with countersunk holes for fixing bolts and the like, the resistance value of the cathode track varies depending on the location, and cannot be a uniform resistance. Therefore, depending on the position of the workpiece during continuous transportation, the current flowing through the workpiece will be different, and intermittent transportation can solve this problem. Moreover, this embodiment is not like continuous conveyance, and the plating quality is not adversely affected by the continuous conveyance speed of the workpiece.
然而,不一定要實施上述般的完全個別供電來將工件2間歇搬運。亦即,在各處理單元3-1~3-n之4個槽室11-1~11-4,可將陰極及陽極之一方或雙方設定為共用(共用陰極及/或共用陽極)。However, it is not necessary to implement the above-mentioned completely separate power supply to intermittently transport the workpiece 2. That is, in the four tank chambers 11-1 to 11-4 of each processing unit 3-1 to 3-n, one or both of the cathode and the anode can be set to be shared (shared cathode and / or shared anode).
5. 工件之間歇搬運中的電流控制
連工件2在槽室間被間歇搬運的期間,也藉由整流器50對工件2供給電流。在此,在間歇搬運中,圖4所示之搬運治具30的2個接觸子342,343之至少一方是與陰極軌道上的導電部43接觸。亦即,縱使搬運上游側的接觸子342在間隔42的位置與絕緣軌道41接觸,搬運下游側的接觸子343仍與導電部43接觸。同樣的,縱使搬運下游側的接觸子343在間隔42的位置與絕緣軌道41接觸,搬運上游側的接觸子342仍與相鄰的槽室之導電部43接觸。在這些過程,搬運下游側的接觸子343是與例如槽室11-1的導電部43接觸,搬運上游側的接觸子342是與槽室11-2的導電部43接觸。在此情況,是從與槽室11-1及槽室11-2對應之2個整流器50對工件2供給電流。圖7係顯示在槽室間移動的過程之狀態(轉乘狀態)之示意圖。在圖7中,將圖4所示之搬運治具30的被供電部340示意地顯示,被供電部340是與上游側槽室的導電部43及下游側槽室的導電部43接觸。在此,若維持工件2停止時之整流器50的輸出而將工件2間歇搬運,會有在與2個整流器50連接之轉乘中的工件2過渡地讓2倍電流流過的疑慮。特別是間歇搬運速度越慢,過渡電流的影響越大。5. Current control during intermittent transfer of workpieces While the workpiece 2 is intermittently transferred between the chambers, current is also supplied to the workpiece 2 through the rectifier 50. Here, in the intermittent conveyance, at least one of the two contacts 342 and 343 of the conveyance jig 30 shown in FIG. 4 is in contact with the conductive portion 43 on the cathode track. That is, even if the contactor 342 on the upstream side of the conveyance contacts the insulated rail 41 at the position of the interval 42, the contactor 343 on the downstream side of the conveyance contacts the conductive portion 43. Similarly, even if the contactor 343 on the downstream side of the conveyance is in contact with the insulating rail 41 at the interval 42, the contactor 342 on the upstream side of the conveyance is still in contact with the conductive portion 43 of the adjacent tank. In these processes, the contactor 343 on the downstream side is in contact with, for example, the conductive portion 43 of the tank chamber 11-1, and the contactor 342 on the upstream side is in contact with the conductive portion 43 of the tank chamber 11-2. In this case, the current is supplied to the workpiece 2 from two rectifiers 50 corresponding to the tank chamber 11-1 and the tank chamber 11-2. FIG. 7 is a schematic diagram showing a state (transfer state) of a process of moving between tank chambers. In FIG. 7, the powered portion 340 of the transport jig 30 shown in FIG. 4 is schematically shown, and the powered portion 340 is in contact with the conductive portion 43 of the upstream tank and the conductive portion 43 of the downstream tank. Here, if the workpiece 2 is intermittently transported while maintaining the output of the rectifier 50 when the workpiece 2 is stopped, there is a concern that the workpiece 2 during the transfer connected to the two rectifiers 50 may cause a double current to flow transiently. In particular, the slower the intermittent transfer speed, the greater the effect of the transient current.
在本實施形態,在工件2之間歇搬運中是採用以下2種電流控制之任一種。當間歇搬運速度較慢的情況,為了將上述的過渡電流減低或防止,是讓工件2停止時之整流器50的輸出(例如100%)漸減(例如漸減到50%)後漸增(回到100%)。當間歇搬運速度較快的情況,因為過渡電流流過的期間極短而可忽視。如此,在此情況,不控制成在工件2停止時和工件2的間歇搬運時使整流器50的輸出不同亦可。例如,當假定工件200的搬運方向的寬度為800mm,間歇搬運速度為12m/min,圖7之示意顯示的被供電部430之搬運方向的寬度為60mm時,間歇搬運時間成為5sec,被供電部430為了在槽室間轉乘導電部43所需的時間(可讓過渡電流流過的時間)僅0.3sec。In the present embodiment, in the intermittent conveyance of the workpiece 2, either of the following two types of current control is used. When the intermittent conveying speed is slow, in order to reduce or prevent the above-mentioned transient current, the output of the rectifier 50 (for example, 100%) when the workpiece 2 is stopped is gradually reduced (for example, gradually reduced to 50%) and then increased (returned to 100) %). When the intermittent conveying speed is fast, it can be ignored because the period during which the transient current flows is extremely short. As such, in this case, it is not necessary to control the output of the rectifier 50 to be different when the workpiece 2 is stopped and when the workpiece 2 is intermittently conveyed. For example, when the width in the conveying direction of the workpiece 200 is 800 mm, and the intermittent conveying speed is 12 m / min, and the width in the conveying direction of the power-supplying section 430 shown in FIG. 7 is 60 mm, the intermittent conveying time becomes 5 sec. The time required for 430 to transfer the conductive portion 43 between the chambers (the time during which a transient current can flow) is only 0.3 sec.
6. 噴管的移動掃描
在各處理單元3-1~3-n之4個槽室11-1~11-4,如圖8所示般,俯視下在位於停止位置之工件2的各面(表面及背面)和陽極20之間,可進一步設置至少1根噴管60。因為噴管60會將形成於工件(陰極)2和陽極20間的電場遮蔽,當設有複數個噴管60的情況,其數量是越少越好。噴管60是如圖9所示般,具有噴出電鍍液之複數個噴出口60A。圖9所示之噴管60的噴出口60A,其垂直方向節距P可比習知的連續搬運式所採用之節距(例如7.5mm)更小,可設定成噴出口60A的外徑以上且5mm以下。這是因為可將每單位時間之電鍍液供給量增多。此外,為了對小尺寸的晶片、精密的圖案均等地供給電鍍液,節距P是越小越好。又在圖9中,工件2之表背面側的噴管60雖是隔著工件2對置,但設置於非對向位置亦可。如果對置的話,可解決工件2因液壓而變形的問題,當非對向配置時,要對工件2的貫通孔供給電鍍液變容易。縱使是連續搬運方式也設有噴管,其數量在一處理單元多達十幾根。6. Nozzle movement scans in the four tank chambers 11-1 ~ 11-4 of each processing unit 3-1 ~ 3-n, as shown in Fig. 8, each side of the workpiece 2 located at the stop position in a plan view. (Front and back) and the anode 20, at least one nozzle 60 may be further provided. Because the nozzles 60 shield the electric field formed between the workpiece (cathode) 2 and the anode 20, when a plurality of nozzles 60 are provided, the smaller the number, the better. As shown in FIG. 9, the nozzle 60 has a plurality of nozzles 60A for discharging a plating solution. The discharge port 60A of the nozzle 60 shown in FIG. 9 can have a vertical pitch P that is smaller than the pitch (for example, 7.5 mm) used in the conventional continuous conveying type, and can be set to be larger than the outer diameter of the discharge port 60A and 5mm or less. This is because the supply amount of the plating solution per unit time can be increased. In addition, in order to uniformly supply the plating solution to small-sized wafers and precise patterns, the smaller the pitch P, the better. In FIG. 9, although the nozzles 60 on the front and back sides of the work 2 are opposed to each other with the work 2 interposed therebetween, the nozzles 60 may be provided at non-opposing positions. If they face each other, the problem of deformation of the workpiece 2 due to the hydraulic pressure can be solved. When the workpiece 2 is not disposed in the opposite direction, it is easy to supply the plating solution to the through holes of the workpiece 2. Even though the continuous conveying method is also provided with nozzles, the number is as many as a dozen in a processing unit.
在工件的連續搬運方式多數根噴管雖是固定的,在採用間歇搬運方式之本實施形態,在各處理單元3-1~3-n之4個槽室11-1~11-4,讓至少1根噴管60沿著例如圖8的箭頭A1方向及A2方向(皆與間歇搬運方向A平行)進行水平掃描移動。藉此,如圖9所示般,可對工件2全面均一地噴出電鍍液。此外,噴管60的移動速度,可設定成比連續搬運方式之工件2的移動速度(例如0.8m/min)更快。如此,可將每單位時間之電鍍液供給量增多。又在連續搬運方式,當將工件速度加快時,處理槽的全長會變長而使裝置變得大型化,但在本實施形態般的間歇搬運,不會使裝置變得大型化。In the continuous conveying method of the workpiece, although most of the nozzles are fixed, in this embodiment adopting the intermittent conveying method, in the four tank chambers 11-1 to 11-4 of each processing unit 3-1 to 3-n, let At least one nozzle 60 performs a horizontal scanning movement along, for example, an arrow A1 direction and an A2 direction (both parallel to the intermittent conveyance direction A) in FIG. 8. As a result, as shown in FIG. 9, the plating solution can be sprayed uniformly across the workpiece 2. In addition, the moving speed of the nozzle 60 can be set faster than the moving speed (for example, 0.8 m / min) of the workpiece 2 in the continuous conveyance method. In this way, the supply amount of the plating solution per unit time can be increased. In the continuous conveying method, when the speed of the workpiece is increased, the total length of the processing tank becomes longer and the apparatus becomes larger. However, the intermittent conveyance as in this embodiment does not increase the apparatus.
噴管60的往復移動機構雖圖示省略,可採用公知之讓其往復直線運動的機構(例如用可逆馬達驅動之齒輪-齒條機構、活塞-曲柄機構等)。該往復移動機構,能以與在各槽室停止之工件2的至少水平寬度對應的長度範圍進行至少一次循環掃描的方式,讓2根噴管60移動。如此,使被處理之工件2的面內均一性提高。又較佳為,讓噴管60從初期位置進行至少一次循環掃描後再返回初期位置。這是因為,使噴管60的影子在工件面內大致均一化。可在裝置運轉中讓噴管60的往復掃描移動連續進行,亦可在工件2的間歇搬運中將噴管60的往復掃描移動停止。Although the reciprocating mechanism of the nozzle 60 is not shown in the figure, a known mechanism that reciprocates linearly (for example, a rack-and-pinion mechanism driven by a reversible motor, a piston-crank mechanism, etc.) may be used. The reciprocating mechanism can move the two nozzles 60 at least once in a cycle scan in a length range corresponding to at least the horizontal width of the workpiece 2 stopped in each tank chamber. In this way, the in-plane uniformity of the workpiece 2 to be processed is improved. It is also preferable that the nozzle 60 be scanned at least once from the initial position and then returned to the initial position. This is because the shadow of the nozzle 60 is made substantially uniform within the workpiece surface. The reciprocating scanning movement of the nozzle 60 may be continuously performed during the operation of the apparatus, or the reciprocating scanning movement of the nozzle 60 may be stopped during the intermittent conveyance of the workpiece 2.
依據本實施形態,對於間歇停止的工件2,對應於工件2的停止位置可讓至少一根、例如2根噴管60相對於工件2進行掃描移動。如此,俯視下成為位於工件2和陽極20間之噴管60的影子而使陽極-陰極間之電場受干擾的區域,會隨著噴管60的移動而移動。因此,電場受噴管60干擾的區域不是固定的,而使被處理之工件2的面內均一性提高。又噴管60之掃描移動方向並不限定於水平方向。例如將噴管60水平地配置而沿著垂直方向掃描移動亦可,掃描移動方向可為水平、垂直等的任一方向。According to the present embodiment, at least one, for example, two nozzles 60 can be scanned and moved with respect to the workpiece 2 according to the stop position of the workpiece 2 with respect to the workpiece 2 that is intermittently stopped. In this way, the area that becomes the shadow of the nozzle 60 located between the workpiece 2 and the anode 20 and interferes with the electric field between the anode and the cathode in plan view moves as the nozzle 60 moves. Therefore, the area where the electric field is disturbed by the nozzle 60 is not fixed, and the in-plane uniformity of the workpiece 2 to be processed is improved. The scanning movement direction of the nozzle 60 is not limited to the horizontal direction. For example, the nozzles 60 may be horizontally arranged to scan and move in the vertical direction, and the scanning movement direction may be any of horizontal and vertical directions.
噴管60,可利用公知的構造,將分割處理槽內之噴出口60A附近的電鍍液捲入後噴出。如此,可將陽極20附近之金屬離子豐富的電鍍液朝向工件2噴出,而使處理量提高。The nozzle 60 may have a well-known structure and wind up the plating solution in the vicinity of the nozzle 60A in the divided processing tank and discharge the plating solution. In this way, a plating solution rich in metal ions in the vicinity of the anode 20 can be sprayed toward the workpiece 2 and the throughput can be increased.
又噴管60之掃描移動,可廣泛運用於間歇搬運方式的表面處理裝置,並不限定於上述實施形態般的構造,亦即不限定於複數個處理單元的連結構造、陰極分割構造、陽極分割構造、具備利用後述推動器的間歇搬運機構之構造等。The scanning movement of the nozzle 60 can be widely applied to the surface treatment device of the intermittent conveyance method, and is not limited to the structure of the above embodiment, that is, it is not limited to the connection structure of a plurality of processing units, the cathode division structure, and the anode division Structure, structure including an intermittent conveyance mechanism using a pusher described later, and the like.
7. 每個處理單元之間歇搬運裝置
在本實施形態,較佳為在各處理單元3-1~3-n設置間歇搬運裝置。這是因為,縱使處理單元的數量n改變,也不須進行間歇搬運裝置的重新設計。如果不要求其方便,可使用像專利文獻1那樣的循環式間歇搬運裝置,亦可使用在各處理單元3-1~3-n共用之一個間歇搬運裝置。又以下所說明之間歇搬運裝置,並不限定於將複數個處理單元連結來形成電鍍槽者。7. Intermittent conveying device of each processing unit In this embodiment, it is preferable to provide an intermittent conveying device at each of the processing units 3-1 to 3-n. This is because even if the number n of processing units is changed, it is not necessary to redesign the intermittent conveying device. If the convenience is not required, a cyclic intermittent conveying device such as Patent Document 1 may be used, or a single intermittent conveying device shared by each processing unit 3-1 to 3-n may be used. The intermittent conveyance device described below is not limited to those in which a plurality of processing units are connected to form a plating tank.
作為設置於各處理單元3-1~3-n之間歇搬運裝置,可採用圖10或圖11所示者。圖10所示的間歇搬運裝置,是由可朝向與間歇搬運方向A平行的正逆方向A1,A2藉由例如氣缸等進行進退驅動之推動器70所構成。推動器70是在4處具有推動片71。4個推動片71可推動4個搬運治具30之被推動片350(參照圖4)。4個推動片71,朝向圖10中的順時針方向D被旋轉蓄勢。As the intermittent conveying device provided in each of the processing units 3-1 to 3-n, one shown in FIG. 10 or FIG. 11 can be used. The intermittent conveyance device shown in FIG. 10 is constituted by a pusher 70 that can advance and retreat in forward and reverse directions A1 and A2 parallel to the intermittent conveyance direction A by, for example, an air cylinder. The pusher 70 has push pieces 71 at four positions. The four push pieces 71 can push the pushed pieces 350 of the four carrying jigs 30 (see FIG. 4). The four push pieces 71 are rotated toward the clockwise direction D in FIG. 10 to accumulate potential.
推動器70,當朝方向A1前進時,4個推動片71將4個搬運治具30的被推動片350推動而將4個工件2間歇搬運。推動器70,當朝方向A2後退時,若推動片71與被推動片350接觸,推動片71反抗朝箭頭D方向的蓄勢力而朝向與箭頭D相反的方向旋轉,不受被推動片350的阻礙而返回初期位置。如此,位於各處理單元3-1~3-n內之4個工件2,是藉由推動器70同時移動一步(one step)而被間歇搬運。藉此,處理單元內之最上游位置以外的3個工件2,是在同一處理單元內移動一步,位於同一或前段的處理單元內之最上游位置之工件2,則移動到其後段的處理單元內之最下游位置。如此,由4個搬運治具30所保持之4個工件2,以處理單元內之4個停止位置為起點及/或終點而被間歇地搬運。When the pusher 70 advances in the direction A1, the four pushing pieces 71 push the pushed pieces 350 of the four transport jigs 30 to intermittently transfer the four workpieces 2. When the pusher 70 retreats in the direction A2, if the push piece 71 contacts the pushed piece 350, the push piece 71 rotates in a direction opposite to the arrow D against the stored force in the direction of the arrow D, and is not affected by the pushed piece 350. Obstacles and return to the initial position. In this way, the four workpieces 2 located in each of the processing units 3-1 to 3-n are intermittently conveyed by the one-step movement of the pusher 70 at the same time. As a result, the three workpieces 2 other than the most upstream position in the processing unit are moved one step in the same processing unit, and the workpieces 2 located at the most upstream position in the same or previous processing unit are moved to the processing unit in the subsequent The most downstream location within. In this way, the four workpieces 2 held by the four transfer jigs 30 are intermittently transferred with the four stop positions in the processing unit as the starting point and / or the ending point.
圖10所示的間歇搬運裝置,因為僅將搬運治具30推動,並無法控制搬運治具30的停止位置。該間歇搬運裝置可使用於:間歇搬運速度較慢,推動器70所致的推動停止後不會發生使搬運治具30繼續前進的慣性力的情況。或是,在搬運治具30之導引用的滾子331,332的至少一個設置由本案申請人提出之國際專利申請案PCT/JP2018/020119所載的制動機構的情況,也能採用該間歇搬運裝置。Since the intermittent conveyance device shown in FIG. 10 only pushes the conveyance jig 30, it cannot control the stop position of the conveyance jig 30. This intermittent conveying device can be used for a case where the intermittent conveying speed is slow, and the inertia force that causes the conveying jig 30 to continue to move after the pushing by the pusher 70 stops. Alternatively, in the case where at least one of the rollers 331, 332 cited in the guide 30 of the conveyance jig is provided with the braking mechanism contained in the international patent application PCT / JP2018 / 020119 filed by the applicant of the present case, the intermittent conveyance device can also be adopted.
圖11(A)(B)所示之間歇搬運裝置係包含:具備4個推動片73而被進退驅動(A1,A2方向的驅動)及昇降驅動(箭頭E方向的驅動)之推動器72。4個推動片73係包含:供搬運治具30的被推動片350嵌合之例如朝上開口的凹部73A。如圖11(A)所示般,當推動器72上昇時,在4個凹部73A嵌合搬運治具30的被推動片350。然後,如圖11(B)所示般,當讓推動器72朝A1方向前進時,4個搬運治具30同時移動一步而被間歇搬運。此外,當推動器72的前進結束時,利用凹部73A來無歧異地決定被推動片350的停止位置。然後,使推動器72下降,進一步後退而返回初期位置。特別是藉由凹部73A和被推動片350的卡合,可讓複數個搬運治具30停止於既定的位置,而能進行更高速的間歇搬運。The intermittent conveyance device shown in FIGS. 11 (A) and (B) includes a pusher 72 that includes four push pieces 73 and is driven forward and backward (drive in the directions of A1 and A2) and lift drive (drive in the direction of the arrow E). The four pushing pieces 73 include, for example, a recessed portion 73A in which the pushed piece 350 of the conveyance jig 30 is fitted and is opened upward. As shown in FIG. 11 (A), when the pusher 72 is raised, the pushed piece 350 of the transport jig 30 is fitted into the four recessed portions 73A. Then, as shown in FIG. 11 (B), when the pusher 72 is advanced in the direction of A1, the four transport jigs 30 are moved simultaneously by one step and intermittently transported. Further, when the advancement of the pusher 72 is ended, the recessed portion 73A is used to determine the stop position of the pushed piece 350 without distinction. Then, the pusher 72 is lowered, further retracted, and returned to the initial position. In particular, by engaging the recessed portion 73A and the pushed piece 350, the plurality of transport jigs 30 can be stopped at a predetermined position, and intermittent transport can be performed at a higher speed.
又雖如上述般針對本實施形態做詳細地說明,但所屬技術領域具有通常知識者應可輕易地理解到,在實質上不脫離本發明的新事項及效果的範圍內存在有許多的變形。因此,這樣的變形例全都包含於本發明的範圍。例如,說明書或圖式中至少出現一次之與更廣義或同義的不同用語一起記載之用語,在說明書或圖式之任何部分都能置換成該不同的用語。又本實施形態及變形例之所有的組合都包含於本發明的範圍。Although the present embodiment has been described in detail as described above, those skilled in the art can easily understand that there are many variations within the scope of not substantially departing from the new matters and effects of the present invention. Therefore, all such modifications are included in the scope of the present invention. For example, a term that appears together with a different broader or synonymous different term that appears at least once in the description or the drawing can be replaced with the different term in any part of the description or the drawing. All combinations of the embodiment and the modifications are included in the scope of the present invention.
圖12顯示,將圖8所示之搬運治具30當中的工件保持部320變更為工件保持部320A的變形例。在圖12,在用圍繞工件2的陰影線表示之四角框區域設置虛擬被處理部80。虛擬被處理部80是和工件2一起被實施表面處理(電鍍)的區域。虛擬被處理部80是與圖12所示的供電部81連接。該供電部81是與圖4所示的被供電部340電氣連接,藉此將虛擬被處理部80與工件2同樣地設定為陰極。FIG. 12 shows a modified example in which the workpiece holding portion 320 in the transfer jig 30 shown in FIG. 8 is changed to a workpiece holding portion 320A. In FIG. 12, a virtual to-be-processed portion 80 is provided in a square frame area indicated by a hatched line surrounding the workpiece 2. The virtual to-be-processed portion 80 is a region to be surface-treated (plated) together with the workpiece 2. The virtual processed part 80 is connected to the power supply part 81 shown in FIG. 12. This power supply unit 81 is electrically connected to the power supply unit 340 shown in FIG. 4, and thereby sets the virtual processing unit 80 as a cathode in the same manner as the workpiece 2.
工件2的周緣是位於虛擬被處理部80的內側,因此工件2的周緣不會成為邊緣。如此,在工件2的周緣不會產生電場集中,所謂狗骨頭(dog bone)的厚膜部並不會發生。只要將虛擬被處理部80的電阻設定成與工件2面內的電阻實質相同,就能使工件2的面內均一性提高。又電鍍裝置1,是在電鍍處理部的後工序具有剝離槽,電鍍後,將搬運治具30投入剝離槽而使鍍膜剝離。這時形成於虛擬被處理部80之鍍膜也被剝離,因此可將搬運治具30反覆再使用。Since the peripheral edge of the workpiece 2 is located inside the virtual processed portion 80, the peripheral edge of the workpiece 2 does not become an edge. In this way, no electric field concentration occurs at the periphery of the workpiece 2 and a so-called thick film portion of a dog bone does not occur. As long as the resistance of the dummy to-be-processed part 80 is set to be substantially the same as the resistance in the plane of the workpiece 2, the in-plane uniformity of the workpiece 2 can be improved. Further, the plating apparatus 1 has a peeling groove in a subsequent step of the plating processing section. After the plating, the transfer jig 30 is put into the peeling groove to peel the plating film. At this time, the plating film formed on the dummy to-be-processed portion 80 is also peeled off, and therefore the transport jig 30 can be reused.
圖13顯示,在圖8所示的搬運治具30當中之被供電部340附加陰極軌道40的清掃功能之變形例之搬運治具30A。在圖13,支承臂341除了支承接觸子342,343以外,還支承與陰極軌道40接觸而清掃陰極軌道40之至少一個軌道清掃部344。圖13所示的軌道清掃部344係包含:研磨陰極軌道40的導電部43而將堆積層(例如導電部上的氧化皮膜等)除去之作為研磨材的例如刮刀344A、及將研磨粉和垃圾掃出之刷子344B的至少一方或雙方。刷子344B可設置於刮刀344A之下游側。藉由與接觸子342,344同樣的構造,將清掃部344(344A,344B)壓接於陰極軌道40。FIG. 13 shows a transport jig 30A in a modified example in which the cleaning function of the cathode rail 40 is added to the power-supply portion 340 of the transport jig 30 shown in FIG. 8. In FIG. 13, in addition to the contactors 342 and 343, the support arm 341 supports at least one rail cleaning portion 344 that contacts the cathode rail 40 and cleans the cathode rail 40. The track cleaning unit 344 shown in FIG. 13 includes, for example, a scraper 344A that grinds the conductive portion 43 of the cathode track 40 and removes a stacked layer (such as an oxide film on the conductive portion) as an abrasive, and grinds powder and garbage At least one or both of the brushes 344B swept out. The brush 344B may be provided on the downstream side of the scraper 344A. With the same structure as the contacts 342, 344, the cleaning portion 344 (344A, 344B) is crimped to the cathode rail 40.
採用圖13所示之具有清掃部344的搬運治具30A,作為在電鍍裝置1循環使用之多數個搬運治具之至少一個,可一邊讓電鍍裝置1運轉一邊清掃陰極軌道40,而防止通電不良。如此,可抑制陰極軌道40之導電部43的電阻值變高等的異常,可減少以往以每週一次的頻率實施之保養頻率。By using the transport jig 30A having a cleaning unit 344 shown in FIG. 13 as at least one of the plurality of transport jigs that are circulated in the plating apparatus 1, the cathode track 40 can be cleaned while the plating apparatus 1 is running, thereby preventing a defective current . In this way, abnormalities such as an increase in the resistance value of the conductive portion 43 of the cathode rail 40 can be suppressed, and the maintenance frequency that has been performed conventionally at a frequency of once a week can be reduced.
又圖13所示的搬運治具39A,並不限定於上述間歇搬運式的表面處理裝置,在具有將導電部34連續地設置之陰極軌道之連續搬運式的表面處理裝置也能使用。Also, the transport jig 39A shown in FIG. 13 is not limited to the above-mentioned intermittent transport type surface treatment apparatus, and can also be used in a continuous transport type surface treatment apparatus having a cathode track in which the conductive portion 34 is continuously provided.
1‧‧‧表面處理裝置1‧‧‧ surface treatment device
2‧‧‧工件 2‧‧‧ Workpiece
3-1~3-n‧‧‧處理槽(分割處理槽) 3-1 ~ 3-n‧‧‧ processing tank (divided processing tank)
20(20A1,20A2,20B1,20B2)‧‧‧陽極 20 (20A1,20A2,20B1,20B2) ‧‧‧Anode
30,30A‧‧‧搬運治具 30,30A‧‧‧Handling fixture
40,40-1,40-2‧‧‧陰極軌道(分割陰極軌道) 40, 40-1, 40-2‧‧‧ cathode track (split cathode track)
41‧‧‧絕緣軌道 41‧‧‧ insulated track
42‧‧‧間隔(非導電部) 42‧‧‧space (non-conductive part)
43‧‧‧導電部 43‧‧‧Conducting part
50‧‧‧整流器 50‧‧‧ Rectifier
51‧‧‧正端子 51‧‧‧Positive terminal
52‧‧‧負端子 52‧‧‧Negative terminal
60‧‧‧噴管 60‧‧‧ Nozzle
60A‧‧‧噴出口 60A‧‧‧Spout
70,72‧‧‧推動器(間歇搬運裝置) 70, 72‧‧‧ Pusher (Intermittent Handling Device)
71,73‧‧‧推動片 71,73‧‧‧Push
73A‧‧‧凹部 73A‧‧‧Concave
圖1係本發明的實施形態之間歇搬運方式的電鍍裝置之電鍍處理部的概略剖面圖。FIG. 1 is a schematic cross-sectional view of an electroplating treatment section of an electroplating apparatus of a batch conveying system according to an embodiment of the present invention.
圖2係圖1所示的電鍍裝置之一個處理單元的概略俯視圖。 FIG. 2 is a schematic plan view of one processing unit of the plating apparatus shown in FIG. 1.
圖3係顯示在一個處理單元內停止的工件和陽極之位置關係。 Figure 3 shows the positional relationship between the workpiece and the anode stopped in a processing unit.
圖4係搬運工件的搬運治具之立體圖。 FIG. 4 is a perspective view of a transport jig for transporting a workpiece.
圖5係顯示陽極、陰極軌道上的導電部及整流器的連接之示意圖。 FIG. 5 is a schematic diagram showing the connection of the conductive part and the rectifier on the anode and cathode tracks.
圖6(A)(B)係陰極軌道的前視圖及剖面圖。 Figure 6 (A) (B) is a front view and a sectional view of a cathode track.
圖7係搬運治具的被供電部在槽室間轉乘陰極軌道之導電部的狀態之示意圖。 FIG. 7 is a schematic diagram of a state in which a powered part of a transport jig is transferred between conductive parts of a cathode track between tank chambers.
圖8係顯示在槽室內往復水平掃描移動之噴管的俯視圖。 FIG. 8 is a plan view showing a nozzle that reciprocates horizontally in a tank chamber.
圖9係顯示噴管的噴出口之排列節距。 Fig. 9 shows the arrangement pitch of the nozzles of the nozzle.
圖10係顯示配置於各處理單元之間歇搬運裝置的一例。 FIG. 10 shows an example of an intermittent conveyance device arranged in each processing unit.
圖11(A)(B)係顯示配置於各處理單元之間歇搬運裝置的另一例。 11 (A) and 11 (B) are diagrams showing another example of an intermittent conveyance device arranged in each processing unit.
圖12係顯示適用於間歇搬運方式之搬運治具的變形例。 FIG. 12 shows a modified example of a transfer jig suitable for an intermittent transfer method.
圖13係顯示附加陰極軌道的清掃功能之搬運治具的變形例。 FIG. 13 shows a modified example of a transport jig with a cleaning function of a cathode track.
Claims (9)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
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| JP2017203866 | 2017-10-20 | ||
| JP2017-203866 | 2017-10-20 |
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| KR (1) | KR20200073239A (en) |
| CN (1) | CN111247272A (en) |
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| CN110424032A (en) * | 2019-09-10 | 2019-11-08 | 江苏师范大学 | A kind of jet stream electric deposition device and its method for principal axis of pressing machine reparation |
| JP7380338B2 (en) * | 2020-03-06 | 2023-11-15 | 住友金属鉱山株式会社 | Plating equipment and plating method |
| PH12023550742A1 (en) * | 2020-09-16 | 2023-12-04 | Almex Tech Inc | Surface treatment device |
| KR102743066B1 (en) * | 2024-02-05 | 2024-12-16 | (주)티피에스일렉콤 | Vertical continuous plating device capable of controlling plating deviation according to thickness difference of the plated object |
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| JP2727250B2 (en) * | 1990-03-14 | 1998-03-11 | 株式会社中央製作所 | Power supply control device in plating equipment |
| JPH0684560B2 (en) * | 1992-09-04 | 1994-10-26 | 木田精工株式会社 | High-speed homogeneous plating equipment for electronic parts |
| JP2001073196A (en) * | 1999-08-31 | 2001-03-21 | Ngk Spark Plug Co Ltd | Plating device and plating method using the same |
| JP4326099B2 (en) * | 2000-01-25 | 2009-09-02 | 木田精工株式会社 | Power supply device for surface treatment |
| JP2003147595A (en) * | 2001-11-13 | 2003-05-21 | Aoyama Seisakusho Co Ltd | Feeding contact device using liquid metal |
| JP2004190081A (en) * | 2002-12-10 | 2004-07-08 | Komatsu Lite Seisakusho:Kk | Treatment unit used for continuous plating device |
| JP4805141B2 (en) * | 2003-03-11 | 2011-11-02 | 株式会社荏原製作所 | Electroplating equipment |
| JP2005200727A (en) * | 2004-01-16 | 2005-07-28 | Toyota Motor Corp | Manufacturing method of semiconductor device |
| DE102012012990B4 (en) * | 2011-06-30 | 2014-09-04 | Almex Pe Inc. | Surface treatment system and workpiece support support |
| JP5795514B2 (en) * | 2011-09-29 | 2015-10-14 | アルメックスPe株式会社 | Continuous plating equipment |
| CN202954124U (en) * | 2012-12-10 | 2013-05-29 | 中物院成都科学技术发展中心 | Electrochemical deposition equipment for horizontal workpiece |
| JP6041927B2 (en) * | 2015-05-07 | 2016-12-14 | アルメックスPe株式会社 | Surface treatment equipment |
| CN205917341U (en) * | 2016-07-28 | 2017-02-01 | 江苏博敏电子有限公司 | Electroplate even plating bath |
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2018
- 2018-10-10 CN CN201880067802.0A patent/CN111247272A/en active Pending
- 2018-10-10 KR KR1020207013112A patent/KR20200073239A/en not_active Withdrawn
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2020
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| CN111247272A (en) | 2020-06-05 |
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| JPWO2019078063A1 (en) | 2020-07-27 |
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